KR100904082B1 - Light Diffusion Luminaire Using High Power LED Single-sided Light - Google Patents

Light Diffusion Luminaire Using High Power LED Single-sided Light Download PDF

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Publication number
KR100904082B1
KR100904082B1 KR1020080051663A KR20080051663A KR100904082B1 KR 100904082 B1 KR100904082 B1 KR 100904082B1 KR 1020080051663 A KR1020080051663 A KR 1020080051663A KR 20080051663 A KR20080051663 A KR 20080051663A KR 100904082 B1 KR100904082 B1 KR 100904082B1
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South Korea
Prior art keywords
light
led
high power
diffusion
luminaire
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KR1020080051663A
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Korean (ko)
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신현목
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(주)콘포테크
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

본 발명은 고파워 엘이디의 특성을 고려하여 메탈 PCB기판에서 발생되는 발열을 효과적으로 냉각시킴과 아울러 엘이디의 광확산 기능을 갖도록 한 고파워 엘이디의 단일면광을 이용한 광확산 등기구에 관한 것이다.The present invention relates to a light diffusing luminaire using a single surface light of a high power LED to effectively cool the heat generated from the metal PCB substrate in consideration of the characteristics of the high power LED and to have a light diffusing function of the LED.

Description

고파워 엘이디 단일면광을 이용한 광확산 등기구{Diffusion light apparatus using LED lamp}Diffusion light apparatus using LED lamp

본 발명은 고파워 엘이디의 특성을 고려하여 PCB기판에서 발생되는 발열을 효과적으로 냉각시킴과 아울러 엘이디의 광확산 기능을 갖도록 한 고파워 엘이디 단일면광을 이용한 광확산 등기구에 관한 것이다.The present invention relates to a light diffusion luminaire using a high power LED single-sided light to effectively cool the heat generated from the PCB substrate in consideration of the characteristics of the high power LED, and to have a light diffusion function of the LED.

근자에 들어 고파워 엘이디(LED)를 이용한 등기구가 제공되는데, 이는 고파워 엘이디의 특성상 직진성이 뛰어나고 전력소모가 적으며, 충분한 조도를 얻을 수 있어 널리 사용되고 있는 실정이다.In recent years, a luminaire using a high power LED (LED) is provided, which is widely used due to the characteristics of the high power LED having excellent straightness, low power consumption, and sufficient illumination.

이러한 고파워 엘이디는 조도의 직진성이 뛰어난 반면에 빛이 확산되지 않는 단점이 있어, 이를 해결하기 위해 종래에는 등커버에 광확산 필름을 설치하였으나, 이는 필름이 열에 약해 수명이 짧은 단점이 있으며, 그리고 엘이디의 전방에 광확산렌즈를 사용하고 있지만, 이는 고가의 제품으로 가격적인 부담이 있었다.Such a high power LED has a disadvantage in that the light is not diffused while having excellent straightness of illumination, but in order to solve this problem, a light diffusion film is conventionally installed on the back cover, but the film is weak in heat and has a short lifespan. Although LEDs are used in front of the LEDs, they are expensive and expensive.

상기 목적을 달성하기 위한 본 발명의 고파워 엘이디 단일면광을 이용한 광확산 등기구는 내부에 수용공간부가 형성된 몸체와; 이 수용공간부에 설치되며, 메탈 PCB기판에 복수의 엘이디가 직렬 연결되어 단일면광과 같은 빛이 조사되게 유도하는 엘이디모듈과; 상기 메탈 PCB기판의 상부에 도포되며, 파란색 엘이디의 빛이 투과되면서 백색으로 변환하는 노란색 형광층과; 상기 형광층에 적층되며, 조사되는 엘이디의 투과 및 확산을 유도하는 확산층과; 상기 엘이디모듈의 배면에 설치되며, 상기 메탈 PCB기판에서 발생된 발열을 냉각시키는 방열층으로 구성된다.The light diffusion luminaire using the high power LED single-sided light of the present invention for achieving the above object is a body formed with a receiving space therein; An LED module installed in the accommodating space and configured to induce a plurality of LEDs connected in series to the metal PCB to induce light such as a single surface light; A yellow fluorescent layer applied to the upper part of the metal PCB and converting to white while light of blue LED is transmitted; A diffusion layer laminated on the fluorescent layer and inducing transmission and diffusion of the irradiated LED; It is installed on the back of the LED module, and consists of a heat dissipation layer for cooling the heat generated from the metal PCB substrate.

따라서, 본 발명은 엘이디가 설치된 메탈 PCB기판에서 발생되는 발열을 효과적으로 냉각시킴과 아울러 엘이디모듈의 전방에 확산층을 적층하여 엘이디 빛의 광확산 기능을 갖도록 한 효과가 있으며, 그리고 고파워 엘이디의 특성상 눈부심을 방지할 수 있는 것이다.Therefore, the present invention effectively cools the heat generated from the metal PCB board on which the LED is installed, and also has an effect of stacking a diffusion layer in front of the LED module to have a light diffusing function of the LED light, and glare due to the characteristics of the high power LED This can be prevented.

이하, 본 발명의 아래 도면에 의거하여 더욱 상세하게 설명하면 다음과 같다.Hereinafter, described in more detail based on the following drawings of the present invention.

도 1은 본 발명에 따른 분해사시도이고, 도 2는 본 발명에 따른 결합된 단면도이다.1 is an exploded perspective view according to the present invention, Figure 2 is a combined cross-sectional view according to the present invention.

도 1 및 도 2에 도시된 바와 같이, 본 발명의 고파워 엘이디 단일면광을 이용한 광확산 등기구는 가로등, 작업등 등의 등커버(10)에 설치되는 몸체(20)가 구비되며, 이 몸체(20)의 내측에 설치되며 전방으로 엘이디(32)의 빛이 조사되도록 유도하는 엘이디모듈(30)이 배치되며, 상기 엘이디(32)의 색상을 바꾸어주는 노란색 형광층(40)이 도포되고, 상기 엘이디(32)의 빛을 투과 확산시키는 확산층(50)이 적층되며, 상기 엘이디모듈(30)의 배면에 부착되며, 상기 엘이디(32)의 냉각을 유도하는 방열층(60)으로 구성된다.1 and 2, the light diffusion light fixture using the high power LED single-sided light of the present invention is provided with a body 20 is installed on the back cover 10, such as street lights, work lights, the body ( 20 is installed inside the LED module 30 is disposed to guide the light of the LED 32 to the front, a yellow fluorescent layer 40 for changing the color of the LED 32 is applied, the A diffusion layer 50 that transmits and diffuses the light of the LED 32 is stacked and attached to the rear surface of the LED module 30, and configured as a heat dissipation layer 60 to induce cooling of the LED 32.

상기 등커버(10)에는 상부에 복수의 고정볼트(11)가 형성된다.The back cover 10 has a plurality of fixing bolts 11 are formed on the top.

상기 몸체(20)는 원 또는 사각형상으로 구비될 수 있으며, 내부에 수용공간부(21)가 관통되고, 상기 고정볼트(11)에 대응되게 체결공(22)이 형성된다.The body 20 may be provided in a circle or quadrangular shape, the receiving space 21 is penetrated therein, the fastening hole 22 is formed to correspond to the fixing bolt (11).

그리고 상기 등커버(10)와 몸체(20)에는 이물질이나 습기 등의 유입을 차단함과 아울러 엘이디(32)의 빛이 투과되도록 하는 유리판이 설치될 수 있는 것이다.In addition, the back cover 10 and the body 20 may be provided with a glass plate to block the inflow of foreign matter or moisture, and also to transmit the light of the LED (32).

상기 엘이디모듈(30)은 몸체(20)의 수용공간부(21)에 설치되는 메탈 PCB기 판(31)과, 이 메탈 PCB기판(31)의 전면에 직렬 연결되는 복수의 엘이디(32)가 설치된다.The LED module 30 has a metal PCB board 31 installed in the receiving space 21 of the body 20, and a plurality of LEDs 32 connected in series to the front surface of the metal PCB board 31 Is installed.

상기 엘이디(32)는 고파워 발광소자로서 메탈 PCB기판(31)에 직렬 연결구조로 단일 광원구조를 갖는다. 여기서 단일면광 구조는 여러개의 고파워 엘이디(32)가 집중되어 하나의 빛처럼 조사되는 것이다.The LED 32 has a single light source structure in series connection structure to the metal PCB substrate 31 as a high power light emitting device. Here, the single surface light structure is that a plurality of high power LEDs 32 are concentrated and irradiated like a single light.

상기 메탈 PCB기판(31)은 고정볼트(11)에 대응되게 결합공(33)이 형성되고, 내측에 고파워 엘이디(32)를 직렬 연결구조로 이루어지며, 상기 결합공(33)에 고파워 엘이디(32)의 어스 패턴이 연결된다. 이와 같이, 상기 고정볼트(11)에 메탈 PCB기판(31)의 결합공(33)이 체결되면 상기 고파워 엘이디(32)의 어스선(Ground Wire) 기능을 갖는다.The metal PCB substrate 31 has a coupling hole 33 is formed to correspond to the fixing bolt 11, the high power LED 32 is formed in a series connection structure on the inside, high power in the coupling hole 33 The earth pattern of the LED 32 is connected. As such, when the coupling hole 33 of the metal PCB board 31 is fastened to the fixing bolt 11, the fastening bolt 11 has a ground wire function of the high power LED 32.

상기 형광층(40)은 형광제와 에폭시 및 통상적인 경화제 등을 혼합하여 이액형 토출방식으로 균일하게 도포한다. 여기서 에폭시는 내열성 에폭시 및 고내열성 에폭시로 구비되는 것이 바람직하다.The fluorescent layer 40 is uniformly coated by a two-component ejection method by mixing a fluorescent agent, epoxy and a conventional curing agent. The epoxy is preferably provided with a heat resistant epoxy and a high heat resistant epoxy.

이와 같이, 상기 엘이디(32)의 파란색 빛이 노란색의 형광층(40)을 통과하면서 백색으로 빛이 변환된다.As such, while the blue light of the LED 32 passes through the yellow fluorescent layer 40, the light is converted into white.

상기 확산층(50)은 8∼15 중량%의 돌가루와, 5∼15 중량%의 유리가루와, 70∼85중량%의 투명 에폭시와, 0.5∼1 중량%의 경화제로 혼합하여 이액형 도출방식으로 상기 형광층(40)에 적층되게 구비된다.The diffusion layer 50 is mixed with 8 to 15% by weight of stone powder, 5 to 15% by weight of glass powder, 70 to 85% by weight of transparent epoxy, and 0.5 to 1% by weight of a curing agent. It is provided to be stacked on the fluorescent layer 40.

상기 돌가루는 30∼100 마이크론으로 내부가 중공체 결정구조를 갖는다.The stone powder has a hollow crystal structure of 30 to 100 microns inside.

상기 유리가루는 2∼50 나노미터로 수직 결정구조를 갖는다.The glass powder has a vertical crystal structure of 2 to 50 nanometers.

상기 에폭시는 몰드(Mold)용 투명 에폭시로 구비되는 것이 바람직하며, 열경화에 대비해 유동성을 갖는 소프트 방식으로 이루어진다.The epoxy is preferably provided with a transparent epoxy for a mold, and is made in a soft manner having fluidity in preparation for thermosetting.

상기 경화제는 아민류, 폴리아미드 등으로 구비될 수 있다.The curing agent may be provided with amines, polyamides, and the like.

이와 같이, 상기 엘이디(32)의 빛이 확산층(50)을 통과하면서 돌가루와 유리가루의 특성상 광확산 기능을 갖도록 함과 아울러 눈부심을 방지할 수 있는 것이다.As such, while the light of the LED 32 passes through the diffusion layer 50, the light 32 may have a light diffusion function due to the characteristics of the stone powder and the glass powder, and may also prevent glare.

상기 방열층(60)은 전기 및 열전도도가 우수한 금속재질로 만들어질 수 있다. 그리고 상기 방열층(60)은 열전도성이 우수한 에폭시 필름, 열경화성수지, 자외선(UV) 경화성 수지 및 글래스 비드(glass bead)로 제작될 수 있다.The heat dissipation layer 60 may be made of a metal material having excellent electrical and thermal conductivity. The heat dissipation layer 60 may be made of an epoxy film having excellent thermal conductivity, a thermosetting resin, an ultraviolet (UV) curable resin, and glass beads.

이와 같이, 상기 메탈 PCB 기판(31)의 배면에 부착된 방열층(60)은 고파워 엘이디(32)의 발열을 빠르게 전달하고, 열전달 면적이 넓게 구비되어 상기 고파워 엘이디(32)에서 발생되는 발열을 효과적으로 1차 냉각할 수 있는 것이다.As such, the heat dissipation layer 60 attached to the rear surface of the metal PCB substrate 31 quickly transmits the heat generated by the high power LED 32, and the heat transfer area is provided to be wide and is generated in the high power LED 32. It is possible to effectively cool the heat generation.

그리고 상기 몸체(20)와 등커버(10)에 설치되며, 상기 방열층(60)에 전달된 고파워 엘이디(32)의 발열을 2차 냉각하는 방열판(70)이 구비된다. 상기 방열판(70)은 통상적인 구조로 구체적인 설명은 하지 않는다.The heat sink 70 is installed on the body 20 and the back cover 10 and secondly cools the heat generated by the high power LED 32 transmitted to the heat dissipation layer 60. The heat sink 70 is a conventional structure and will not be described in detail.

본 발명의 고파워 엘이디 단일면광을 이용한 광확산 등기구는 가로등, 작업등 등에 설치되는 구조로서, 이에 한정하지 않고 다양하게 적용될 수 있는 것이다.The light-diffusion luminaire using the high power LED single-sided light of the present invention is a structure installed in a street lamp, a work lamp, etc., which can be variously applied.

상기에서 설명한 바와 같이 본 발명의 목적과 동일한 범위 내에서 다양한 설계 변경을 시도할 수도 있을 것이나, 이러한 설계변경으로 인해 본 발명에서 전혀 예상치 못한 새로운 효과가 나타나지 않는 한, 본 발명의 권리범위를 벗어나지 못 할 것이다.As described above, various design changes may be attempted within the same scope as the object of the present invention, but the design changes do not depart from the scope of the present invention unless the present invention shows no unexpected new effects. something to do.

도 1은 본 발명에 따른 등기구의 분해사시도,1 is an exploded perspective view of a luminaire according to the present invention;

도 2는 본 발명에 따른 등기구의 단면도.2 is a cross-sectional view of a luminaire according to the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

20: 몸체 21: 수용공간부20: body 21: receiving space

22: 체결공 30: 엘이디모듈22: fastener 30: LED module

31: PCB기판 32: 엘이디31: PCB board 32: LED

40: 형광층 50: 확산층40: fluorescent layer 50: diffusion layer

60: 방열층 70: 방열판60: heat sink 70: heat sink

Claims (3)

내부에 수용공간부(21)가 형성된 몸체(20)와; A body 20 having an accommodation space 21 formed therein; 이 수용공간부(21)에 설치되며, 상부에 직렬연결되어 단일면광과 같은 빛이 조사되는 복수의 엘이디(32)와, 상기 몸체(20)에 대응되게 결합되도록 결합공(33)이 형성되고, 이 결합공(33)에 상기 엘이디(32)의 어스패턴을 형성하도록 하는 메탈 PCB기판(31)으로 이루어진 엘이디모듈(30)과; It is installed in the receiving space 21, a plurality of LEDs 32 are connected in series to the top and irradiated with light, such as a single surface light, the coupling hole 33 is formed so as to correspond to the body 20, And, LED module 30 made of a metal PCB substrate 31 to form an earth pattern of the LED 32 in the coupling hole 33; 상기 메탈 PCB기판(31)의 상부에 도포되며, 파란색 엘이디(32)의 빛이 투과되면서 백색으로 변환하는 노란색 형광층(40)과; A yellow fluorescent layer 40 applied to the upper portion of the metal PCB substrate 31 and converted into white while light of the blue LED 32 is transmitted; 상기 형광층(40)에 적층되며, 조사되는 엘이디(32)의 투과 및 확산을 유도하는 확산층(50)과; A diffusion layer 50 stacked on the fluorescent layer 40 and inducing transmission and diffusion of the LED 32 to be irradiated; 상기 엘이디모듈(30)의 배면에 설치되며, 상기 메탈 PCB기판(31)에서 발생된 발열을 냉각시키는 방열층(60)과; A heat dissipation layer (60) installed on a rear surface of the LED module (30) to cool heat generated from the metal PCB board (31); 상기 몸체(20)와 방열부재(60)의 배면에 설치되는 방열판(70)으로 구성된 것을 특징으로 하는 고파워 엘이디 단일면광을 이용한 광확산 등기구.Light diffusion luminaire using a high-power LED single-sided light, characterized in that consisting of a heat sink 70 is installed on the back of the body 20 and the heat dissipation member (60). 제1항에 있어서,The method of claim 1, 상기 확산층(50)은 8∼15 중량%의 돌가루와, 5∼15 중량%의 유리가루와, 70∼85중량%의 에폭시와, 0.5∼1 중량%의 경화제로 이루어진 것을 특징으로 하는 고파워 엘이디 단일면광을 이용한 광확산 등기구.The diffusion layer 50 is composed of 8 to 15% by weight of stone powder, 5 to 15% by weight of glass powder, 70 to 85% by weight of epoxy, and 0.5 to 1% by weight of a hardening agent. Light diffused luminaires using LED single-sided light. 제1항에 있어서,The method of claim 1, 상기 몸체(20)와 방열부재(60)의 배면에는 방열판(70)이 더 포함된 것을 특징으로 하는 고파워 엘이디 단일면광을 이용한 광확산 등기구.The back of the body 20 and the heat dissipation member 60 is a light diffusing luminaire using a high power LED single-sided light, characterized in that the heat sink further comprises 70.
KR1020080051663A 2008-06-02 2008-06-02 Light Diffusion Luminaire Using High Power LED Single-sided Light KR100904082B1 (en)

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KR100915990B1 (en) 2008-11-28 2009-09-10 엘에스 주식회사 Luminaires using high power LED
WO2011007977A2 (en) * 2009-07-16 2011-01-20 (주)강동테크 Led fluorescent lamp
KR101241232B1 (en) * 2010-10-15 2013-03-11 심현섭 Led lamp having reflector
KR101240328B1 (en) * 2010-10-15 2013-03-11 심현섭 Led lamp having reflector
KR20210026380A (en) 2019-08-30 2021-03-10 김범원 Power cassette lighting implement with easy PCB disassembly and assembly
KR102301707B1 (en) 2021-01-19 2021-09-10 김승관 Earthquake-proof lighting implement mounting structure

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KR20030067225A (en) * 2002-02-07 2003-08-14 주식회사 반디부리 The plane lighting display system using LED and light diffusion sheet
KR100712880B1 (en) * 2006-01-05 2007-05-02 루미마이크로 주식회사 White light emitting diodes can reduce color temperature variations
KR100820942B1 (en) * 2007-08-29 2008-04-11 건우조명공업 주식회사 LED lighting

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KR20030067225A (en) * 2002-02-07 2003-08-14 주식회사 반디부리 The plane lighting display system using LED and light diffusion sheet
KR100712880B1 (en) * 2006-01-05 2007-05-02 루미마이크로 주식회사 White light emitting diodes can reduce color temperature variations
KR100820942B1 (en) * 2007-08-29 2008-04-11 건우조명공업 주식회사 LED lighting

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100915990B1 (en) 2008-11-28 2009-09-10 엘에스 주식회사 Luminaires using high power LED
WO2011007977A2 (en) * 2009-07-16 2011-01-20 (주)강동테크 Led fluorescent lamp
WO2011007977A3 (en) * 2009-07-16 2011-04-28 (주)강동테크 Led fluorescent lamp
KR101070440B1 (en) 2009-07-16 2011-10-06 (주) 강동테크 Light Emitting Diode lamp
KR101241232B1 (en) * 2010-10-15 2013-03-11 심현섭 Led lamp having reflector
KR101240328B1 (en) * 2010-10-15 2013-03-11 심현섭 Led lamp having reflector
KR20210026380A (en) 2019-08-30 2021-03-10 김범원 Power cassette lighting implement with easy PCB disassembly and assembly
KR102301707B1 (en) 2021-01-19 2021-09-10 김승관 Earthquake-proof lighting implement mounting structure

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