KR100902357B1 - Led package and the method for producing the same - Google Patents

Abstract

The present invention provides an electrical connection from the outside, the metal housing and the metal housing having a lead having a bonding portion protruding upwards, a hole into which the bonding portion is inserted, a light emitting diode accommodating space and a heat dissipation portion formed under the light emitting diode accommodating space. It provides a light emitting diode package comprising an insulating member for insulating the hole and the lead pin.

The present invention also includes a first step of manufacturing the metal housing and the lead frame, a second step of plating the metal housing and the lead frame, respectively, and a third step of bonding the metal housing and the lead frame to the insulating member. Provided are a method of manufacturing a light emitting diode package. In this way, the metal housing and lead frame are plated, respectively, and then the metal housing and the lead frame are combined, thereby eliminating the process of electrically connecting and removing the wire for wet plating the metal housing and the lead frame. Therefore, manufacturing time can be shortened and manufacturing cost can be reduced.

Light Emitting Diode, Heat Dissipation, Reflection, Insulation, Melting

Description

Light emitting diode package and manufacturing method thereof {LED PACKAGE AND THE METHOD FOR PRODUCING THE SAME}

The present invention relates to a light emitting diode package and a manufacturing method, and more particularly to a method for manufacturing a light emitting diode package for cooling the heat generated from the light emitting diode to the outside of the light emitting diode package.

In general, a light emitting diode (LED) generates light using an electric field emission phenomenon generated by applying a voltage to a semiconductor. Recently, a light emitting diode (LED) is used as a backlight unit of a liquid crystal display (LCD). It is widely used. Here, the light emitting diode is an all-light conversion semiconductor device having a structure in which a p-type semiconductor crystal and an n-type semiconductor crystal are bonded to each other, and are used as various display light source devices because of the property of converting an electrical signal into light. In addition, the light emitting diode is a compound semiconductor formed by combining Group III (Al, Ga, In) and Group V (As, P, N, Sb) elements on the periodic table. The wavelength of light varies depending on the material. In addition, the light efficiency of the light emitting diode is determined by the reflective structure of the package, and the reliability is determined by the ability of heat dissipation from the lead frame structure including the package.

Here, the structure of the light emitting diode and the light emitting diode package is disclosed in Korean Patent Application Publication No. 10-2004-98191 (light emitting diode and its package structure and manufacturing method) or Korean Utility Model Publication No. 20-370479 (structure of light emitting diode) As disclosed, a reflector is mounted on an upper end of the base layer, a light emitting diode is installed on an upper end of the reflector, and wires are connected to both ends of the light emitting diode and extend outwardly to be connected to an external electrode. It is common to consist of a lens overlaid on top.

That is, the conventional LED package generally includes a light reflecting structure capable of reflecting the light emitted from the LED in order to increase the amount of light emitted from the LED in the main body accommodating the LED. To this end, the body of a conventional LED package is plated with a material having a high light reflectance such as silver. However, this plating process was performed after the body of the light emitting diode and the lead frame were joined and sealed. Therefore, when the wet plating method is used, the main body and the lead frame insulated from each other are electrically connected and then plated, and after the plating process, the electrical connection has to be removed, thereby increasing the process time and increasing the cost. In addition, in the case of using a dry plating method such as sputtering, there may be a case where the plating of the lead hole and the main body is electrically connected to the place where the minute holes or the grooves are not made completely or by plating. In addition, since the main body and the lead frame should be plated with the same material, the lead frame to provide electrical connection to the light emitting diode has a problem that the main body should also be plated only by the electrically conductive material, since the plating material is limited to the electrically conductive material.

In addition, the conventional LED package has a limited structure capable of effectively dissipating heat generated from the light emitting diode composed of the semiconductor, thereby causing damage and malfunction of other components due to heat generation of the LED. In addition, in the case of the light emitting diode applied to the liquid crystal display, a problem occurs that the components of the liquid crystal display are damaged due to the heat generation of the light emitting diode.

Accordingly, conventionally, Korean Patent Application Publication No. 10-2004-33434 (a manufacturing method for adding a heat dissipation structure outside the light emitting diode) has a structure capable of dissipating heat generated by the light emitting diode. Here, the manufacturing method of adding a heat dissipation structure to the outside of the light emitting diode, the heat sink is installed on the top of the base, the light emitting diode is installed on the top of the heat sink, the heat generated from the light emitting diode is transferred to the heat sink. The heat transmitted to the heat sink is discharged to the outside through some heat sinks exposed to the outside of the light emitting diode package, which is relatively small in area where the heat sink is exposed to the outside of the light emitting diode package. As the close contact with the upper end of the base, the heat dissipation is made only through a portion of the upper surface of the heat sink, there is a problem that does not sufficiently release the heat generated by the light emitting diode. In addition, in the case of a liquid crystal display where relatively bright light, that is, high luminous efficiency is required, the brightness of the liquid crystal display may be limited due to the high temperature heat generated from the light emitting diode, or the light emitting diode may be applied to the liquid crystal display. There was no problem.

An object of the present invention is to provide a package for a light emitting diode that can emit heat generated by the light emitting diode through a simple structure.

In addition, an object of the present invention is to provide a package for a light emitting diode that can be plated with a material having a high reflectance of the inside of the metal housing on which the light emitting diode is mounted to reflect the light in the ultraviolet region and emit to the outside.

In addition, an object of the present invention is to provide a method of manufacturing a package for a light emitting diode that can be plated, respectively, without electrically connecting the metal housing and the lead frame.

In addition, an object of the present invention is to provide a package for a light emitting diode and a method of manufacturing the same that can plate the metal housing and lead frame with different materials.

Another object of the present invention is to provide a light emitting diode package having a metal housing plated with a material capable of reflecting light in the ultraviolet wavelength region and a method of manufacturing the same.

The present invention provides an electrical connection from the outside, the metal housing and the metal housing having a lead having a bonding portion protruding upwards, a hole into which the bonding portion is inserted, a light emitting diode accommodating space and a heat dissipation portion formed under the light emitting diode accommodating space. It provides a light emitting diode package comprising an insulating member for insulating the hole and the lead pin. With this configuration, the heat generated by the light emitting diode can be discharged through the metal housing, and the lead is inserted into the metal housing while being insulated from the insulating member to provide a simple and easy assembly structure of the light emitting diode. Can be.

In another aspect, the present invention provides a package for a light emitting diode, further comprising a plurality of heat dissipation fins protruding from the heat dissipation unit. Through this configuration, it is possible to further improve the heat dissipation efficiency of the LED package.

In another aspect of the present invention, a plurality of heat dissipation fins provide a package for a light emitting diode, characterized in that protruding in the horizontal direction from the side of the heat dissipation portion.

In another aspect of the present invention, there is provided a package for a light emitting diode, wherein the lead and the metal housing are plated with one of silver and gold, respectively. Through this configuration, when wire-bonding the bonding portion of the light emitting diode and the lead, the electrical conductivity can be improved. In addition, by increasing the reflectance of the metal housing, it is possible to increase the efficiency of the light emitted from the light emitting diode is emitted to the outside of the package for the light emitting diode.

In another aspect of the present invention, a metal housing provides a light emitting diode package, characterized in that the plated by a material capable of reflecting light in the ultraviolet wavelength range. Through this configuration, the metal housing reflects light in the ultraviolet wavelength region, so that the package for the light emitting diode and the light emitting unit using the same may emit light in the ultraviolet region to the outside.

In another aspect of the present invention, there is provided a package for a light emitting diode, characterized in that the metal housing is plated with aluminum.

In another aspect, the present invention provides a light emitting diode package, characterized in that the insulating member is made of any one selected from the group consisting of glass and an insulating polymer having a lower melting temperature than aluminum. Through this configuration, even after plating the metal housing and the lead, respectively, even when the metal housing, the lead and the insulating member are assembled and heated to seal by melting of the insulating member, the plating material of the metal housing and the lead is not melted and the insulating member is not melted. Can only be melted.

In addition, the present invention is a plurality of leads having a lead pin protruding upwards, a support portion for supporting the lead and a lead frame having a metal housing receiving hole, seated in the metal housing receiving hole, the light emitting diode receiving space, light emitting diode receiving space A light emitting diode comprising a plurality of metal housings having a lead pin insertion hole through which the lead pins are inserted and a heat dissipation portion extended to the outside of the light emitting diode receiving space, and an insulating member for insulating the lead frame and the metal housing. Provides a package for Through this configuration, it is possible to provide a light emitting diode package having excellent heat dissipation effect and having a simple structure, which is easy to manufacture and assemble.

In another aspect of the present invention, the metal housing accommodating hole is larger than the metal housing to provide a light emitting diode package, characterized in that the metal housing and the lead frame do not contact each other.

In another aspect, the present invention provides a package for a light emitting diode, characterized in that the lead frame is plated with any one of silver and gold.

In still another aspect of the present invention, there is provided a package for a light emitting diode, characterized in that the metal housing is plated with any one of silver, gold and aluminum.

In addition, as another aspect of the present invention, the insulating member provides a light emitting diode package, characterized in that made of a material that is melted at a lower temperature than the material for plating the metal housing and lead frame.

In addition, as another aspect of the present invention, the lead is provided with a package for a light emitting diode, characterized in that formed in pairs on both sides of the metal housing receiving hole facing each other. Through this configuration, it is possible to manufacture a light emitting die-off package using one or more light emitting diodes, it is possible to manufacture a package for a white light emitting diode by mounting three RGB light emitting diodes.

The present invention also includes a first step of manufacturing the metal housing and the lead frame, a second step of plating the metal housing and the lead frame, respectively, and a third step of bonding the metal housing and the lead frame to the insulating member. Provided are a method of manufacturing a light emitting diode package. In this way, the metal housing and lead frame are plated, respectively, and then the metal housing and the lead frame are combined, thereby eliminating the process of electrically connecting and removing the wire for wet plating the metal housing and the lead frame. Therefore, manufacturing time can be shortened and manufacturing costs can be reduced.

In another aspect of the present invention, a second step provides a method of manufacturing a package for a light emitting diode, comprising the step of wet plating the metal housing and the lead frame using a plating solution, respectively. The plating solution may be used for wet plating such as gold plating solution or silver plating solution, and any material having high electrical conductivity may be used.

The present invention also provides a method of manufacturing a package for a light emitting diode, characterized in that the second step includes a step of dry plating the lead frame and the metal housing by the sputtering method.

In another aspect, the present invention includes a first step of assembling the metal housing, the insulating member and the lead frame, and a second step of melting the insulating member to seal the metal housing and the lead frame. It provides a method for producing.

In the present invention, the second step is aluminum plating by sputtering using aluminum, and the third step is a first step of assembling the metal housing, the insulating member and the lead frame, and melting the insulating member at a temperature below the aluminum melting point. And a second step of sealing the metal housing and the lead frame.

The present invention also provides a method of manufacturing a package for a light emitting diode, characterized in that it further comprises a fourth step of inserting one or more light emitting diodes in the metal housing and bonding them to the leads.

In another aspect, the present invention provides a method of manufacturing a package for a light emitting diode, characterized in that it further comprises a fifth step of mounting a lens on the upper portion of the metal housing.

The light emitting diode package provided by the present invention is made of a metal housing housing the light emitting diode can be easily emitted to the outside heat generated by the light emitting diode.

In addition, the light emitting diode package provided by the present invention may be plated with a metal having high reflectance on the inside of the housing in which the light emitting diode is accommodated, thereby improving light emission efficiency.

In addition, the light emitting diode package provided by the present invention may be dry plated with a metal capable of reflecting light in an ultraviolet wavelength region such as aluminum to emit more light in the ultraviolet wavelength region.

In addition, the method for manufacturing a light emitting diode package provided by the present invention is plated with a metal housing and lead frame, and then assembled and sealed with an insulating member, so that the metal housing and lead frame are plated with different materials to optimize their characteristics. can do.

In addition, the method for manufacturing a package for a light emitting diode provided by the present invention may be plated and sealed with an insulating member after plating the metal housing and the lead frame, respectively, so that the metal housing and the lead frame may be plated together and then plated integrally. It can be plated finely, and the process of electrically connecting the metal housing and the lead frame can be eliminated even when plating using a wet plating method using a plating solution, thereby reducing manufacturing time and manufacturing cost.

1 and 2 are views illustrating an example of a metal housing provided in the LED package according to the present invention from different angles. 1 is a perspective view of the metal housing viewed from above, and FIG. 2 is a perspective view of the metal housing viewed from below. The metal housing 100 includes a light emitting diode accommodating space 110 in which a light emitting diode is accommodated, and a heat dissipation part 120 is provided under the light emitting diode accommodating space 110. In detail, the light emitting diode is mounted on the upper portion of the heat dissipation part 120, and the heat dissipation part 120 defines a bottom surface of the light emitting diode accommodating space 110. Meanwhile, the side surface of the light emitting diode receiving space 110 is defined by the side wall 130, and the upper surface is defined by a lens (not shown) coupled to the upper portion of the metal housing 100.

In addition, a bonding part insertion hole 140 is formed under the metal housing 100 so that a portion (bonding part) of a lead (not shown) is inserted to wire-bond with a light emitting diode (not shown). The bonding part insertion hole 140 is formed to be larger than the bonding part so as not to be energized in contact with the bonding part. The bonding portion (not shown) of the lead (not shown) to be described below has a pin shape protruding vertically upward, and the bonding portion insertion hole 140 has a diameter larger than that of the bonding portion (not shown) to correspond thereto. The branch is a cylindrical hole. Since the bonding part (not shown) and the bonding part insertion hole 140 have such a shape, the insulating member (not shown) can be modularized and used in a short pipe shape, so that assembly time is shortened and assembly is easy. There is an advantage.

A lead insertion groove 150 is formed at the bottom of the metal housing 100. The lead insertion groove 150 is formed to be larger than a portion of a lead (not shown) inserted into the lead insertion groove 150 so that the lead (not shown) does not contact the metal housing 100. That is, the lead insertion groove 150 has a higher height and a wider width than the portion into which the lead is inserted.

In addition, the heat dissipation unit 120 is formed with a plurality of heat dissipation fins 122 on the side to further increase the heat exchange efficiency of the heat dissipation unit 120. The heat dissipation fin 122 serves to widen the contact area with the outside air, that is, to widen the heat exchange area to widen the heat exchange efficiency.

On the other hand, the metal housing 100 is formed of copper (Copper: 397W / mK) having a relatively high thermal conductivity. The metal housing 100 is formed of a metal such as copper (Copper: 397W / mk) or aluminum (Aluminum: 230W / mK) and an alloy thereof having higher heat dissipation efficiency than conventional materials such as ceramics. In particular, it is preferable to be formed of copper or a copper alloy that is easy to use industrially and inexpensive and has high thermal conductivity.

The molding of the metal housing 100 mixes a high molecular compound, powder of copper and a copper alloy, and injects this mixture into a mold of a metal housing shape, ie, a mold, and then pressurizes it. The polymer compound contained in the metal injected at high pressure is heated to remove the polymer compound and sinter to form a metal housing. Metal housing 100 molded in this way has a relatively high density while having the properties of metal.

In addition, the metal housing 100 is plated with a material having a high light reflectance so that the light emitted from the light emitting diode is reflected to be emitted to the outside through a lens (not shown). Platinum, gold, silver and aluminum may be used as the material for plating the metal housing 100. Platinum, gold, and silver are materials having high electrical conductivity, so that the plating may be performed by depositing the metal housing 100 in conventional wet plating, that is, plating solution. Meanwhile, platinum, gold, silver, and aluminum may be plated on the metal housing 100 by dry plating such as sputtering. In particular, aluminum can reflect light having a wavelength of 400 nm or less. Therefore, when the metal housing 100 is plated with aluminum, the amount of ultraviolet light emitted through the lens (not shown) may be increased. Therefore, the package for a light emitting diode can be applied to a sterilization apparatus for sterilizing by irradiation with ultraviolet rays. That is, the ultraviolet light emitting diode module can be manufactured.

3 is a diagram illustrating an example of a lead frame included in a package for a light emitting diode according to an embodiment of the present invention. A plurality of metal housings 100 may be coupled to the lead frame 200. The lead frame 200 includes a plurality of metal housing accommodating holes 210, and one metal housing 100 is accommodated in each of the metal housing accommodating holes 210. The metal housing accommodating hole 210 is formed larger than the metal housing 100 such that the metal housing 100 and the lead frame 200 do not directly contact each other.

In addition, the lead frame protrudes into the metal housing accommodating hole 210 at both sides of each metal housing accommodating hole 210, and includes a pair of leads 220. The lead 220 may include an insertion part 222 inserted into the lead insertion groove 150 provided on the bottom surface of the metal housing 100 and a bonding part 224 vertically protruding upward from an end of the insertion part 222. Equipped. The bonding part 224 is inserted into the bonding part insertion hole 140 of the metal housing 100. The number of bonding part insertion holes 140 and the bonding part 224 correspond to each other. That is, the number of bonding part insertion holes 140 of the metal housing 100 and the number of leads 220 protruding from both sides of the metal housing accommodating holes 210 of the lead frame 200 are the same. This is related to the number of light emitting diodes (not shown) accommodated in the metal housing 100. When a single light emitting diode (not shown) is accommodated, the number of bonding part insertion holes 140 and the bonding parts 224 is included. Is two and the number of bonding part insertion holes 140 and bonding parts 224 is four when two light emitting diodes are shown. On the other hand, when there are three light emitting diodes (not shown), that is, when using a light emitting diode (not shown) that emits light in three RGB wavelength ranges, the number of bonding part insertion holes 140 and bonding parts 224 is six. , 3 pairs. That is, the number of bonding part insertion holes 140 and the bonding part 224 and the number of light emitting diodes (not shown) may be adjusted to manufacture a light emitting diode package that emits light of various colors.

Since the lead frame 200 serves to provide a battery connection from the outside to the light emitting diode (not shown) accommodated in the metal housing 100, the lead frame 200 is made of a material capable of conducting electricity. In general, the lead frame 200 is made of a metal such as pure copper, a copper alloy, an iron alloy, a nickel-iron alloy, an Invar alloy, a Koba alloy, or a metal group to which the metal belongs. The lead frame 200 is plated with gold, platinum, silver, or the like to increase electrical conductivity. The lead frame 200 may also use any of a wet plating process or a dry plating process. The lead frame 200 is plated through a separate process regardless of the metal housing 100. Therefore, the lead frame 200 may be plated with a material having high electrical conductivity, and the metal housing 100 may be plated with different materials such as plated with a material having high light reflectance.

4 is an exploded perspective view of a package for a light emitting diode according to an embodiment of the present invention. The bonding part 224 of the lead frame 200 and the bonding part insertion hole 140 of the metal housing 100 are coupled to each other, and the insulating member 300 is interposed between the bonding part 224 and the bonding part insertion hole 140. Is combined. The insulating member 300 is formed in a pipe shape, and the bonding part 224 is inserted into the insulating member 300, and then the insulating member 300 is inserted into the bonding part insertion hole 140. After the lead frame 200, the insulating member 300, and the metal housing 100 are assembled, the insulating member 300 is melted to seal the metal housing 100 and the lead frame 200. The metal housing 100 and the lead frame 200 may be fixed by the insulating member 300 without being energized.

The insulating member 300 is made of a material selected from the group consisting of electrically non-conductive glass and insulating polymer, and should be made of a material that is melted at a lower temperature than the material that plated the metal housing 100 and the lead frame 200. . As described above, the lead frame 200 may be plated with a material having high electrical conductivity such as gold (melting point 1063 ° C), platinum (melting point 1773.5 ° C), and silver (melting point 960.5 ° C), and the metal housing 100 may be gold (Melting point 1063 ° C), platinum (melting point 1773.5 ° C), silver (melting point 960.5 ° C), and aluminum (melting point 60 ° C), and may be plated with high reflecting materials. At this time, the melting temperature of the insulating member 300 should be lower than the melting temperature of the material having a lower melting temperature of the plating material of the lead frame 200 and the plating material of the metal housing 100. This is because the metal housing 100 and the lead frame 200 should not be melted during the melting of the insulating member 300. This is because when the plating of the metal housing 100 and the lead frame 200 is melted, the plating may be uneven so that the reflectance characteristics of the metal housing 100 or the electrical conductivity of the lead frame 200 may be degraded.

5 is a view illustrating a backlight unit using a package according to an embodiment of the present invention. The backlight unit includes a metal housing 100, a light emitting diode 400 accommodated in the metal housing 100, a lead 220 providing electrical connection to the light emitting diode 400, a lead 220, and a metal housing 100. ) And the lens 500 capable of concentrating the light emitted from the light emitting diode 400 and the insulating member 300 to prevent contact.

The light emitting diode 400 is a conventional light emitting diode capable of generating light by an electric field emission phenomenon of a semiconductor, and a semiconductor, an electrode, and the like are formed on the upper surface of the sub-mount. The electrode of the light emitting diode 400 is electrically connected to the bonding portion 224 of the lead 220 by wire bonding.

The lens 500 is mounted on the upper portion of the metal housing 100, and the lens 500 is made of a light transmissive material so that light emitted from the light emitting diode 400 may be transmitted in a hemispherical shape. The lead 220 is connected to the electrode of the light emitting diode 400 by wire bonding, is energized by the light emitting diode 400, and is configured to be connected to an external circuit of the light emitting diode package.

The lead 220 is installed in direct contact with the metal housing 100 so as not to be energized. In particular, the insulation member 300 is disposed between the bonding portion 224 of the lid 220 and the bonding portion insertion hole 140 of the metallic housing 100. ) Is inserted. The bonding part 224 is inserted to penetrate from the lower part of the metal housing 100 to the upper part so that the upper part is wire-bonded with the electrode of the light emitting diode 400.

On the other hand, the inner surface defining the light emitting diode receiving space 110 of the metal housing 100 is plated with a material having high light reflectivity such as gold, silver, platinum and aluminum, so that the light emitted from the light emitting diode 400 is the lens 500 Reflects the light toward the lens 500 to be emitted to the outside through).

6 is a flowchart illustrating a method of manufacturing a light emitting diode according to an embodiment of the present invention. First, the first step S1 includes a step S1a of manufacturing a metal housing and a step S1b of manufacturing a lead frame, respectively. The second step S2 then includes a step S2a of plating the metal housing and a step S2b of plating the lead frame, respectively. The metal housing and lead frame may be plated by any of a dry plating method and a wet plating method, and the metal housing is preferably plated with a material having high light reflectance and the lead frame having a high electrical conductivity. In addition, the third step S3 is a step of bonding the metal housing and the lead frame which have been manufactured and plated, respectively, using an insulating member. At this time, the step (S1a) of manufacturing the metal housing of the first step (S1) and the second step (S2), the step of manufacturing the lead frame (S1b) and the step of plating the metal housing (S2a) and plating the lead frame The steps S2b are independent of each other, and the order between the steps may be any order. That is, only the order between the process of manufacturing a metal housing (S1a) and the process of plating a metal housing (S2a), and the process between the process of manufacturing a lead frame (S1b) and the process of plating a lead frame (S2b) need only be maintained.

When the metal housing and the lead frame are plated, and then bonded using an insulating member, in the case of using the wet plating method, the metal housing and the lead frame are connected and energized as in the prior art, followed by plating and removing the wiring again. Can be eliminated to reduce manufacturing time and manufacturing costs. In addition, when using a dry plating method such as sputtering, it is possible to solve the problem that the plating material is difficult to deposit in the narrow gap between the metal housing and the lead frame as in the prior art.

7 is a flowchart illustrating a method of manufacturing a light emitting diode according to another embodiment of the present invention. First, the first step S1 includes a step S1a of manufacturing a metal housing and a step S1b of manufacturing a lead frame, respectively. The second step S2 then includes a step S2a of plating the metal housing and a step S2b of plating the lead frame, respectively. The third step S3 includes a step S3a of assembling the metal housing insulating member and the lead frame, and a step S3b of melting the insulating member to seal the metal housing and the lead frame. The melting temperature of the insulating member is lower than the melting temperature of the material having the lower melting point among the metal plated and lead frame plated materials. The step (S3b) of melting the insulating member is performed at a temperature lower than the melting temperature of the material having the lower melting point among the materials in which the insulating member is plated with the metal housing and the lead frame. Therefore, the material plating the metal housing and the lead frame does not melt, and thus the plating state of the metal housing and the lead frame may be maintained.

The method may further include a fourth step (S4) of inserting one or more light emitting diodes into the metal housing and electrically bonding the lead, and a fifth step of mounting the lens on the metal housing. The LED package manufactured by the fifth step may manufacture an LED module by cutting between the lead and the support of the lead frame and the lead, and the LED module is connected to an electric circuit and used as a light emitting unit. On the other hand, when three RGB light emitting diodes are inserted into a metal housing to supply electricity, white light is emitted. When white light is emitted in this way, it may be used as a backlight unit of the LED.

1 and 2 are each a view showing an example of a metal housing provided in the package for a light emitting diode according to the present invention from different angles,

3 is a view showing an example of a lead frame included in a package for a light emitting diode according to an embodiment of the present invention;

4 is an exploded perspective view of a package for a light emitting diode according to an embodiment of the present invention;

5 is a view showing a backlight unit using a package according to an embodiment of the present invention;

6 is a flowchart illustrating a method of manufacturing a light emitting diode according to an embodiment of the present invention;

7 is a flowchart illustrating a method of manufacturing a light emitting diode according to another embodiment of the present invention.

Claims (21)

A lead providing an electrical connection from the outside and having a bonding portion projecting upwardly; A metal housing having a hole into which a bonding part is inserted, a side wall on which a lens is mounted, a flat heat dissipation part, and a light emitting diode accommodating space defined by the side wall and the heat dissipation part; And An insulating member for insulating the hole and the bonding portion of the metal housing; package for a light emitting diode comprising a. The method of claim 1, The area of the heat dissipation portion is wider than the area of the light emitting diode accommodating space. The method of claim 1, A package for light emitting diodes further comprising; a plurality of heat dissipation fins protruding from the heat dissipation portion. The method of claim 1, The metal housing is a package for a light emitting diode, characterized in that the groove is inserted in the bottom surface is larger than the size of the lead so that the lead is inserted, and not in contact with the lead. The method of claim 1, The lead and the metal housing are each plated with one of silver and gold, respectively. The method of claim 1, The metal housing is a package for a light emitting diode, characterized in that the plated by a material capable of reflecting light in the visible and ultraviolet wavelength range. The method of claim 6, The metal housing is a package for a light emitting diode, characterized in that the plated with aluminum. The method of claim 7, wherein The insulation member is made of any one selected from the group consisting of glass and an insulating polymer having a melting temperature lower than that of aluminum. A lead frame having a plurality of leads having a bonding portion projecting upwardly, a support portion supporting the leads, and a metal housing receiving hole; It is accommodated in the metal housing accommodating hole, and is equipped with a light emitting diode accommodating space, a bonding part insertion hole through which the light emitting diode accommodating space is inserted, a flat heat dissipating part and a lens formed under the light emitting diode accommodating space, and a heat dissipating part. A plurality of metal housings having sidewalls defining a light emitting diode receiving space; And And an insulating member for insulating the bonding portion of the lead frame and the hole of the metal housing. The method of claim 9, The metal housing accommodating hole is formed larger than the metal housing so that the metal housing and the lead frame do not contact each other. The method of claim 9, The lead frame is a package for a light emitting diode, characterized in that the plated by any one of platinum, silver and gold. The method of claim 9, The metal housing is a package for a light emitting diode, characterized in that the plated by any one of platinum, silver, gold and aluminum. The method of claim 12, The insulating member is a package for a light emitting diode, characterized in that made of a material that is melted at a lower temperature than the material for plating the metal housing and lead frame. The method of claim 9, The lead is a package for a light emitting diode, characterized in that formed in pairs on both sides of the metal housing accommodating holes facing each other. A plurality of leads and leads including a metal housing having a hole into which a bonding portion is inserted, a side wall on which a lens is mounted, a flat heat dissipating portion, and a light emitting diode accommodating space defined by the side wall and the radiating portion, and a bonding portion protruding upwardly; A first step of manufacturing a lead frame each having a support and a metal housing accommodating hole therein for supporting the metal sheet; A second step of plating each of the metal housing and the lead frame; And And a third step of bonding the bonding portion of the metal housing and the hole of the lead frame to the insulating member. The method of claim 15, The second step includes a method of wet plating the metal housing and the lead frame using the plating solution, respectively. The method of claim 15, The second step includes a step of dry plating the lead frame and the metal housing by the sputtering method. The method of claim 15, The third step includes a first step of assembling the metal housing, the insulating member and the lead frame, and a second step of melting the insulating member to seal the metal housing and the lead frame. . The method of claim 15, The second step is aluminum plating by sputtering method using aluminum, The third step includes a first process of assembling the metal housing, the insulation member and the lead frame, and a second process of melting the insulation member at a temperature below the aluminum melting point to seal the metal housing and the lead frame. Method of manufacturing a package for a diode. The method of claim 15, And inserting one or more light emitting diodes into the metal housing and bonding the leads to the leads. 4. The method of claim 20, And a fifth step of mounting a lens on the upper portion of the metal housing.

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