KR100897306B1 - Vacuum tooling block for printed circuit board - Google Patents
Vacuum tooling block for printed circuit board Download PDFInfo
- Publication number
- KR100897306B1 KR100897306B1 KR1020070123097A KR20070123097A KR100897306B1 KR 100897306 B1 KR100897306 B1 KR 100897306B1 KR 1020070123097 A KR1020070123097 A KR 1020070123097A KR 20070123097 A KR20070123097 A KR 20070123097A KR 100897306 B1 KR100897306 B1 KR 100897306B1
- Authority
- KR
- South Korea
- Prior art keywords
- block
- vacuum
- circuit board
- printed circuit
- adsorption
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
Abstract
The present invention relates to a vacuum adsorption tooling block for a printed circuit board, wherein a groove having a narrow width around the vacuum hole of the adsorption surface on which the printed circuit board is adsorbed is formed in a direction corresponding to the slot hole of the substrate, whereby the adsorption performance is further increased. A vacuum adsorption tooling block for a printed circuit board which can be improved and has a stable adsorption.
The present invention forms a vacuum chamber in which the inner spaces of the two blocks are sealed while the upper block having the inner space and the lower block are assembled to each other, and the upper surface of the upper block has a printed circuit board adsorbed by vacuum pressure. In the vacuum adsorption tooling block for a printed circuit board formed by arranging the vacuum holes in communication with the vacuum chamber so as to be arranged, the linear row of the printed circuit board adsorbed in position, from the upper surface of the upper block to the periphery of the vacuum hole In the corresponding positions of the slot holes forming the groove, the groove is formed long along the longitudinal direction of the entire slot holes forming the straight line.
Printed Circuit Board, PCB, Vacuum Adsorption, Tooling Block, Epoxy, Grooves
Description
The present invention relates to a vacuum adsorption tooling block for a printed circuit board, and more particularly, to vacuum-adsorb a printed circuit board during an epoxy coating process in which a predetermined pattern of epoxy is applied to a surface of the printed circuit board by using a screen printing technique. The present invention relates to a vacuum adsorption tooling block for a printed circuit board.
Recently developed electronic devices are becoming more multifunctional integrating more functions.
In addition, new functions and devices having various shapes are being developed, and various connection elements for interfacing with these devices are being developed.
Electronic components including such connecting elements are mounted on a printed circuit board (hereinafter referred to as a PCB) of an electronic device to form a print board assembly (PBA). In general, a printed circuit board is integrated. It refers to a thin plate to which various electrical components such as circuits, resistors, or switches are soldered, and electrically connect electronic components.
Printed circuit boards are currently used almost without exception in most electronic devices such as mobile phones, computers, notebooks, displays, etc. In semiconductor devices, a semiconductor chip is mounted and a chip mounting member providing an electrical connection interface with the semiconductor chip and an external device. It is widely used.
Meanwhile, in the process of manufacturing such a printed circuit board, there is an epoxy coating process in which a circuit pattern is formed on one surface of a flexible insulating substrate and then epoxy is regularly applied according to a predetermined pattern using a screen printing technique on the opposite side.
1 is a view illustrating a surface (a) on which a circuit pattern is formed and an opposite surface (b) on which epoxy is applied in a printed circuit board. Referring to FIG. Epoxy 12 is applied to approximately rectangular areas on both the left and right sides of the
That is, in the
As shown, in order to apply the
Basically, the substrate moves vertically upward with the vacuum tooling block in the state of being attached to the upper surface of the vacuum tooling block of the equipment for epoxy application, and closely adheres to the mask of the equipment to which the epoxy is to be applied. The epoxy is applied onto the mask in close contact.
At this time, if the epoxy applied on the mask is scraped in one direction by a tool so as to have a uniform thickness, the epoxy is evenly spread on the mask, and the epoxy is stretched to a certain thickness even in the opening of the mask. The epoxy is applied to a uniform thickness over the application area.
When the epoxy coating process is completed, the vacuum adsorption tooling block descends while adsorbing and fixing the substrate to separate the substrate and the mask.
As such, the vacuum adsorption tooling block moves up and down while adsorbing and fixing the substrate during the epoxy coating process, and moves up and down together with the substrate to closely adhere the substrate to the mask. Separate from.
In the vacuum adsorption tooling block for adsorbing and fixing the substrate during the epoxy coating process as described above, a plurality of vacuum holes for sucking air are formed in the adsorption surface to which the substrate is adhered, and the port for vacuum suction means of the equipment is formed on one side of the block. When it is connected to the air intake, a strong vacuum pressure is applied to the vacuum chamber of the block, the surrounding air is strongly sucked into the inside of the block through the vacuum holes connected to the vacuum chamber, the suction surface formed with vacuum holes The substrate is strongly adsorbed.
In addition, the vacuum suction tooling block is moved up and down in a fixed state by a lifting mechanism and a magnet clamp block that moves up and down in the equipment, wherein the vacuum suction tooling block is fixed to the lifting mechanism by magnetic force. To be used.
However, the conventional vacuum suction tooling block has the following problems.
A plurality of vacuum holes are formed in an array on the adsorption surface of the block, and when a vacuum pressure is applied to the inner space of the block, air is sucked through the vacuum holes to adsorb the substrate onto the adsorption surface of the block. When a force is applied to the substrate in the application process or the like, the substrate can be easily moved.
This is because the conventional vacuum adsorption tooling block does not have any structure for strengthening the adsorption force, and because the block has a simple structure in which vacuum holes for adsorption are formed in a predetermined arrangement, the adsorption force on the substrate is insufficient. .
In particular, due to the lack of adsorptive power, the substrate was easily slid laterally in the state of being adsorbed to the block, and thus it is necessary to make the adsorption force stronger, and thus there is an urgent need for improvement.
Accordingly, the present invention has been invented to solve the above problems, by forming a groove having a narrow width around the vacuum hole of the adsorption surface on which the printed circuit board is adsorbed in the direction corresponding to the slot hole of the substrate, adsorption performance The object of the present invention is to provide a vacuum adsorption tooling block for a printed circuit board which can be further improved and stable adsorption is achieved.
In order to achieve the above object, the present invention, the inner space (111, 121) of the two blocks (110, 120) is sealed in the state in which the
In the preferred embodiment, the
In addition, the
In a preferred embodiment, both end portions of the
In addition, the upper surface of the
In addition, in order to mutually assemble the
In addition,
In addition, each of the
In addition, the upper surface of the
As described above, according to the vacuum adsorption tooling block for a printed circuit board according to the present invention, a groove having a narrow width around the vacuum hole of the adsorption surface on which the printed circuit board is adsorbed is formed long in a direction coinciding with the slot hole of the substrate. By doing so, the adsorption performance can be further improved, and there is an effect that stable adsorption is achieved.
In addition, by forming a separate handle groove in the upper block, there is an advantage that the vacuum suction tooling block can be easily removed from the magnet portion of the magnet clamp block.
In addition, by forming a display groove for visually confirming the alignment of the substrate on the upper surface of the upper block, there is an effect of reducing the occurrence of defects.
In addition, by improving the fastening method of the upper block and the lower block to be fastened to the upper block after each bolt is inserted from the bottom side of the lower block, it is possible to form a larger number of vacuum holes on the suction surface of the upper block, It has the effect of improving the adsorption performance.
In addition, when the chamber grooves are further formed with a plurality of vacuum holes connected to the upper surface of the upper block, more stable vacuum adsorption is possible.
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.
The present invention relates to a vacuum adsorption tooling block for a printed circuit board, wherein the surface of the printed circuit board is vacuum-adsorbed to fix the printed circuit board during an epoxy coating process by applying an epoxy of a predetermined pattern to a surface of the printed circuit board. A vacuum suction tooling block for a printed circuit board.
In particular, the vacuum adsorption tooling block according to the present invention is formed by forming a groove having a narrow width around the vacuum hole of the adsorption surface on which the substrate is adsorbed in a direction consistent with the slot hole of the substrate.
Vacuum adsorption tooling block according to the present invention is composed of the upper block and the lower block, similar to the configuration of the conventional vacuum adsorption tooling block, the vacuum is applied to the interior of the two blocks in the upper block and the lower block assembled state The chamber is formed.
Hereinafter, the structure of the vacuum suction tooling block according to the present invention will be described with reference to the accompanying drawings.
2 is a view showing the structure of the upper block according to the present invention, (a) is a plan view, (b) is a longitudinal cross-sectional view, (c) is a cross-sectional view, (d) is a right side view, (e) is a bottom surface Figure (f) is an illustration of a printed circuit board that is adsorbed on the upper surface of the upper block by the vacuum adsorption tooling block of the present invention.
As shown, the
The vacuum holes 112 have the same configuration as in the prior art, and are formed to be arranged in a predetermined arrangement on the suction surface of the
Looking at the upper surface, that is, the adsorption surface of the
On the other hand, referring to Figure 2 (f), in the present invention is shown a printed
Thus, the upper surface, that is, the suction surface of the
The
That is, a slot hole forming a straight row at a corresponding position of the slot holes 11 forming a straight row of the
Referring to (a) of FIG. 2, the
And, both end portions of the
The conventional vacuum suction tooling block is fixed by the magnetic force of the lifting mechanism and the magnet clamp block installed in the equipment, and in the past, it was not easy to pull off the vacuum suction tooling block attached by magnetic force after use. 114 is provided to allow an operator to easily remove the vacuum adsorption tooling block using a finger.
That is, in the vacuum adsorption tooling block in which the
At this time, the operator inserts the two fingers of both hands into the
In addition,
At this time, if the substrate is not correctly adsorbed on the upper surface of the vacuum suction tooling block, the epoxy may not be applied at the correct position in the epoxy coating process after the mask.
Therefore, in general, the stopper is installed so that the substrate is adsorbed at the stopped position (this position is the exact position where the substrate is adsorbed) on the block. This can happen, conventionally there was no way to confirm this even if the additional movement occurs and the substrate is not in place.
Accordingly, in the vacuum adsorption tooling block according to the present invention, a
As a result, if both ends of the
Referring to FIG. 2A, it can be seen that the
In addition,
However, when forming a fastening hole penetrating the upper block up and down and inserting the bolt from the suction surface side of the upper block, the bolt head portion occupies a large area on the suction surface, so that a vacuum hole is formed in the upper block. The area that can be reduced and the number of vacuum holes must be reduced, so that the overall block adsorption performance is reduced.
Therefore, in the present invention, in order to improve the adsorption performance of the block and increase the number of vacuum holes 112, fastening holes 116 having a predetermined depth are formed on the bottom of each bolted portion of the side and both ends of the
In this case, since the bolt is inserted from the bottom side of the
As described above, in the present invention, the
Meanwhile, FIG. 3 is a view illustrating a structure of a lower block according to the present invention, wherein (a) is a plan view, (b) is a partial cutaway view, (c) is a left side view, (d) is a right side view, ( e) is a bottom view.
Figure 3 (b) shows the front of the lower block, showing a cross-sectional view of a portion cut.
The structure of the
That is, the
In the state in which the upper block and the
In addition, fastening holes 122 through which bolts can penetrate are formed in both ends and side portions of the
As a result, in order to assemble the
Meanwhile, FIG. 4 is a plan view of the substrate adsorbed on the adsorption surface of the vacuum adsorption tooling block in a state where the upper block and the lower block are assembled, and FIG. 5 is a cross-sectional view taken along the line 'A-A' of FIG. to be.
4 and 5 show the application of the epoxy 12 is finished.
As shown in the drawing, when the
In this state, when a vacuum pressure is applied to the vacuum chamber inside the block, each
In particular, in the block of the present invention, grooves formed to be adjacent to the
In the block of the present invention, the size of the
Here, in the case of designing the groove width so that the slot hole edge protrudes less than 0.2mm, the epoxy applied after the mask is sucked into the groove of the block, the air suction amount during the vacuum suction is reduced, thereby reducing the adsorption performance Will be.
On the other hand, in the case of designing the
6 is a view illustrating an improved structure of the
7 shows the adsorbed
As shown, in the block of the present embodiment, the
Here, when the air is sucked through the vacuum holes 112 and the
Each
In a preferred embodiment, the two
In addition, in the vacuum adsorption tooling block of the present invention, the upper surface of the
1 is a view showing a surface on which a circuit pattern is formed and an opposite surface coated with epoxy on a printed circuit board;
2 is a view showing the structure of an upper block according to the present invention;
3 is a view showing the structure of a lower block according to the present invention;
Figure 4 is a plan view of the substrate adsorbed on the adsorption surface of the vacuum adsorption tooling block in the present invention,
5 is a cross-sectional view taken along the line 'A-A' of FIG. 4,
6 is a view of improving the structure of the vacuum hole as another embodiment of the vacuum suction tooling block according to the present invention;
FIG. 7 is a cross-sectional view taken along the line 'B-B' of FIG. 6.
<Explanation of symbols for the main parts of the drawings>
10
12; Epoxy 110: Upper Block
112: vacuum hole 113: groove
114: handle groove 115: display groove
116: fastening hole 117: chamber groove
120: lower block 122: fastening hole
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070123097A KR100897306B1 (en) | 2007-11-29 | 2007-11-29 | Vacuum tooling block for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070123097A KR100897306B1 (en) | 2007-11-29 | 2007-11-29 | Vacuum tooling block for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR100897306B1 true KR100897306B1 (en) | 2009-05-14 |
Family
ID=40862009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070123097A KR100897306B1 (en) | 2007-11-29 | 2007-11-29 | Vacuum tooling block for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100897306B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107685240A (en) * | 2017-09-29 | 2018-02-13 | 深圳市宇顺电子股份有限公司 | A kind of FPC placement platforms |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000023244A (en) * | 1998-09-18 | 2000-04-25 | 토와 가부시기가이샤 | Arrangement Configured To Support Substrate During Dicing Process, And Apparatus And Method For Cutting Tapeless Substrate Using The Arrangement |
| JP2002243797A (en) | 2001-02-22 | 2002-08-28 | Ando Electric Co Ltd | Device carrier and automatic handler |
| JP2005332910A (en) | 2004-05-19 | 2005-12-02 | Hitachi High-Tech Electronics Engineering Co Ltd | Substrate chuck, and method of manufacturing display panel substrate |
| KR20060016314A (en) * | 2004-08-17 | 2006-02-22 | 삼성전자주식회사 | Chuck table of apparatus for cutting and sorting chip scale package |
-
2007
- 2007-11-29 KR KR1020070123097A patent/KR100897306B1/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000023244A (en) * | 1998-09-18 | 2000-04-25 | 토와 가부시기가이샤 | Arrangement Configured To Support Substrate During Dicing Process, And Apparatus And Method For Cutting Tapeless Substrate Using The Arrangement |
| JP2002243797A (en) | 2001-02-22 | 2002-08-28 | Ando Electric Co Ltd | Device carrier and automatic handler |
| JP2005332910A (en) | 2004-05-19 | 2005-12-02 | Hitachi High-Tech Electronics Engineering Co Ltd | Substrate chuck, and method of manufacturing display panel substrate |
| KR20060016314A (en) * | 2004-08-17 | 2006-02-22 | 삼성전자주식회사 | Chuck table of apparatus for cutting and sorting chip scale package |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107685240A (en) * | 2017-09-29 | 2018-02-13 | 深圳市宇顺电子股份有限公司 | A kind of FPC placement platforms |
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