KR100891218B1 - Chip compositions for floors with cloud pattern quality and chips produced using the same - Google Patents
Chip compositions for floors with cloud pattern quality and chips produced using the same Download PDFInfo
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- KR100891218B1 KR100891218B1 KR1020030010068A KR20030010068A KR100891218B1 KR 100891218 B1 KR100891218 B1 KR 100891218B1 KR 1020030010068 A KR1020030010068 A KR 1020030010068A KR 20030010068 A KR20030010068 A KR 20030010068A KR 100891218 B1 KR100891218 B1 KR 100891218B1
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- 239000000203 mixture Substances 0.000 title claims abstract description 13
- 238000009408 flooring Methods 0.000 claims abstract description 12
- 239000000843 powder Substances 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 4
- -1 acryl Chemical group 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000002270 dispersing agent Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- 239000006188 syrup Substances 0.000 claims description 2
- 235000020357 syrup Nutrition 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 238000010298 pulverizing process Methods 0.000 claims 1
- 239000004800 polyvinyl chloride Substances 0.000 description 13
- 229920000915 polyvinyl chloride Polymers 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 8
- 238000003892 spreading Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000005096 rolling process Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000004605 External Lubricant Substances 0.000 description 1
- 239000004610 Internal Lubricant Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/001—Combinations of extrusion moulding with other shaping operations
- B29C48/0022—Combinations of extrusion moulding with other shaping operations combined with cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/12—Esters of monohydric alcohols or phenols
- C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/262—Alkali metal carbonates
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
본 발명은 구름무늬 바닥재에 적용되어 구름무늬 질감을 유도할 수 있는 구름무늬 바닥재용 칩 조성물 및 그를 이용하여 제조된 칩에 관한 것이다.The present invention relates to a chip composition for a cloud pattern flooring that can be applied to a cloud pattern flooring and induce a cloud pattern texture, and a chip manufactured using the same.
구름무늬, 바닥재, 칩Cloud, flooring, chip
Description
도 1은 본 발명의 구름무늬 바닥재용 칩의 제조공정 개략도,1 is a schematic view of the manufacturing process of the chip for the floor pattern cloud of the present invention,
도 2는 본 발명의 구름무늬 바닥재용 칩에 적용되는 아크릴 파우더 제조공정 개략도.Figure 2 is a schematic view of the acrylic powder manufacturing process applied to the chip for the floor pattern of the present invention.
***도면의 주요부분에 대한 부호의 설명****** Explanation of symbols for main parts of drawing ***
1 : 계량기 2 : 슈퍼믹서1: Meter 2: Super Mixer
3 : 공급기 4 : 압출기 3: feeder 4: extruder
5 : 분쇄기 6,6' : 저장 호퍼5:
7 : 칩 혼합기 8 : 선별기7: Chip Mixer 8: Sorter
본 발명은 구름무늬 바닥재에 적용되어 구름무늬 질감을 유도할 수 있는 구름무늬 바닥재용 칩 조성물 및 그를 이용하여 제조된 칩에 관한 것이다.The present invention relates to a chip composition for a cloud pattern flooring that can be applied to a cloud pattern flooring and induce a cloud pattern texture, and a chip manufactured using the same.
바닥재를 제조하는 일반적인 방법중 하나가 칩을 적층하여 활용하는 방법인 데, 크기와 색상이 다양한 칩을 가열 압착한 후 표면처리하는 방법이 일반적이었다.One common method of manufacturing flooring is to stack and utilize chips, which is generally a method of heat-compressing and then surface-treating chips of various sizes and colors.
바닥재 제조에 있어서 칩은 PVC를 기초 소재로 제조하는 것이 일반적이며, 적절한 방법으로 칩을 얇게 산포하고 가열하여 충분히 예열시킨 후, 롤 프레스(Roll Press) 가공을 하여 내구성과 적절한 색상을 부여한 바닥재를 제조한다.In the manufacture of flooring, the chip is generally made of PVC as a base material, and the chip is made by spreading and heating the chip in a suitable manner, and then preheating it sufficiently, followed by a roll press to produce a flooring having durability and appropriate color. do.
그런데, 종래의 기술로 가공된 칩은 크기, 형상, 색상으로만 제한된 표현효과로 장식성을 부여하기 때문에 디자인의 다양성이 부족하여 다른 제조방식에 의해 제조된 제품에 비해 시장에서 수요를 잃어가고 있는 실정이다.However, the chip processed by the conventional technology is limited in size, shape, and color to give a decorative effect only because of the lack of design diversity, the situation is losing the demand in the market compared to products manufactured by other manufacturing methods to be.
일반적인 종래의 칩 가공은 칩을 산포 후 롤 프레스시 압연되어 색상은 그대로이나 크기와 형상은 가공방향으로 약간씩 밀리며, 크기와 형상이 약간 변하긴 하나 단조로움을 벗어나는 데에는 한계가 있었다.In general, the conventional chip processing is rolled at the time of roll pressing after spreading the chip, the color is the same but the size and shape is slightly pushed in the processing direction, the size and shape is slightly changed, but there is a limit to escape the monotony.
본 발명은 상기한 바와 같은 종래 칩 가공시의 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 종래의 PVC 칩의 문제점인 가열후 롤 프레스시 압연비만큼 단조롭게 가공방향으로 밀리는 현상 없이, 구름무늬처럼 퍼져나가 자연스러운 질감의 무늬가 연출되어 다양한 질감 표현이 가능한 구름무늬 바닥재용 칩 조성물 및 그를 이용하여 제조된 칩을 제공하는 것이다.The present invention has been made to solve the problems in the conventional chip processing as described above, the object of the present invention is a rolling problem without the phenomenon of being pushed in the processing direction as monotonously as the rolling ratio during the roll press after heating, which is a problem of the conventional PVC chip Spreading like a pattern is a natural texture pattern is directed to provide a chip composition for a cloud pattern flooring material that can express a variety of textures and a chip manufactured using the same.
본 발명의 칩 조성물은 폴리비닐클로라이드(PVC) 수지 100중량부에 대하여 로진 30∼200중량부, 가소제 15∼50중량부, 아크릴파우더 30∼100중량부, 조분 20∼200중량부, 필러 70∼300중량부를 포함하여 이루어진다.The chip composition of the present invention is 30 to 200 parts by weight of rosin, 15 to 50 parts by weight of plasticizer, 30 to 100 parts by weight of acryl powder, 20 to 200 parts by weight of coarse powder, and 70 to 200 parts by weight of polyvinyl chloride (PVC) resin. It comprises 300 parts by weight.
본 발명에서 사용되는 PVC 수지는 중합도가 다른 PVC수지를 혼합하여 사용하는 것이 바람직한데, 예로서 중합도가 700이고, 비닐아세테이트의 함량이 5%인 PVC 스트레이트 수지 50∼70중량부와 중합도가 1,000이고, 비닐아세테이트의 함량이 5%인 PVC 페이스트 수지 30∼50중량부를 혼합하여 사용하는 것이 바람직하다. 상기 PVC 스트레이트 수지는 입자 크기가 50∼250㎛이고, 입자 형태가 공극이 있는 거친 표면을 갖고 있으며, 상기 PVC 페이스트 수지는 입자 크기가 0.1∼수십㎛이고, 입자 형태가 공극이 없는 미세한 구형이다. 이와 같이 서로 다른 PVC수지를 혼합하여 사용하면, 두 원료간의 거동특성이 상반되므로 가공시 상이한 유동특성을 이용하여 와류가 형성되게 하여, 구름무늬처럼 퍼져나가는데 좋은 효과를 유도한다.The PVC resin used in the present invention is preferably used by mixing the PVC resin having a different polymerization degree, for example, the polymerization degree is 700, 50 to 70 parts by weight of the PVC straight resin having a vinyl acetate content of 5% and the polymerization degree is 1,000 It is preferable to use a mixture of 30 to 50 parts by weight of a PVC paste resin having a vinyl acetate content of 5%. The PVC straight resin has a particle size of 50 to 250 μm, the particle shape has a rough surface with voids, and the PVC paste resin has a particle size of 0.1 to several tens of μm, and the particle shape is a fine spherical shape without pores. When different PVC resins are mixed in this way, the behavior characteristics between the two raw materials are opposite, so that vortices are formed using different flow characteristics during processing, thereby inducing a good effect of spreading like a cloud pattern.
본 발명에서 사용되는 로진은 녹는점을 낮추어서 낮은 열량의 범위에서 가공을 용이하게 하며, PVC와 상용성이 용이하여 압연가공시 와류를 형성시켜 구름무늬처럼 퍼지는 효과를 돕는다. 상기 로진은 30∼200중량부를 사용하는 것이 바람직하며, 예로서 천연 또는 가공된 송진 등이 있다.The rosin used in the present invention lowers the melting point to facilitate processing in the range of low calories, and is compatible with PVC to facilitate the effect of spreading like a cloud pattern by forming a vortex during rolling. It is preferable to use 30 to 200 parts by weight of the rosin, and examples thereof include natural or processed rosin.
본 발명에서 사용되는 아크릴파우더는 열경화성과 열가소성의 중간 물질로서, PVC 가공에 투입시 적정온도에서 분해와 결합이 발생되어 압연가공시 구름무늬처럼 퍼지는 원인을 제공한다. The acrylic powder used in the present invention is an intermediate material of thermosetting and thermoplastic, which causes decomposition and bonding at an appropriate temperature when it is put into PVC processing, thereby providing a cause of spreading like a cloud pattern during rolling.
본 발명의 칩 조성물에 포함되는 상기 아크릴파우더는 PMMA 시럽(Polymethyl methacrylate ; 펠렛형성의 원료에 첨가제를 적정량 투입하여 가열 숙성하여 고점 도 액상화시킨 주원료) 100중량부에 대하여, MMA(Methyl methacrylate) 200∼300중량부(저점도화시켜 액상가공을 용이하게 함), 수산화알루미늄 200∼500중량부(충진제), 분산제 5∼20중량부(점도유지, 침강방지), 경화제 5∼10중량부, 및 중합개시제 1∼5중량부를 포함하여 이루어진다. 아크릴파우더의 제조공정을, 도 2를 참조하여 설명하면 다음과 같다.The acryl powder included in the chip composition of the present invention is MMA (Methyl methacrylate) 200 to 100 parts by weight of PMMA syrup (Polymethyl methacrylate; a main raw material in which a suitable amount of additives are added to a raw material for pellet formation, followed by heat aging and high viscosity liquefaction). 300 parts by weight (low viscosity to facilitate liquid processing), 200 to 500 parts by weight of aluminum hydroxide (filler), 5 to 20 parts by weight of dispersant (viscosity maintenance, sedimentation prevention), 5 to 10 parts by weight of curing agent, and polymerization initiator It comprises 1 to 5 parts by weight. The manufacturing process of the acrylic powder is described with reference to FIG. 2 as follows.
계량기(1)에서 정해진 비율로 계량된 상기 원료를 슈퍼믹서(2)에 순차적으로 투입후 1,000RPM∼1,500RPM으로 15분∼30분 동안 반응시키면 백색의 분말이 제조되며, 선별기(8)를 이용하여 80Mesh 이하의 분말만 선별하여 칩 제조시 사용한다.The raw material measured at the ratio determined by the
상기 아크릴파우더는 PVC수지 100중량부에 대하여 30∼100중량부 사용하는 것이 바람직한데, 투입량이 100중량부를 초과하는 경우에는 흐름이 억제되고, 30중량부 미만인 경우에는 구름무늬 효과가 부족하다.The acrylic powder is preferably used 30 to 100 parts by weight based on 100 parts by weight of the PVC resin, the flow is suppressed when the amount exceeds 100 parts by weight, the cloud effect is insufficient when less than 30 parts by weight.
또한, 본 발명에서 사용되는 조분은 20∼200중량부를 사용하는 것이 바람직하고, 40이나 60Mesh 이하 정도 크기의 탄산칼슘 분말을 사용하는 것이 바람직하며, 가공시 흐름에 장애효과를 유도하여 무늬가 잔잔하게 퍼져나가는데 일조한다.In addition, the coarse powder used in the present invention is preferably used 20 to 200 parts by weight, it is preferable to use a calcium carbonate powder of the size of about 40 or 60 mesh or less, induces an obstacle effect on the flow during processing, the pattern is smooth It helps to spread.
상기 칩 조성물을 구성하는 각 성분들의 함량 범위는 첨가효과를 발휘할 수 있는 범위에서부터 품질저하 및 가공성에 악영향을 미치지 않는 범위까지로 결정된 것이다.The content range of each component constituting the chip composition is determined from a range capable of exhibiting an additive effect to a range that does not adversely affect quality deterioration and processability.
본 발명의 칩 조성물에는 통상의 기타 첨가제들이 포함될 수 있으며, 예로서 안정제 2∼5중량부, 내외부활제 2∼4중량부, 산화방지제 1∼3중량부를 첨가할 수 있다. 이러한 기타 첨가제들의 총량은 5∼12중량부의 범위가 바람직하다. The chip composition of the present invention may include other conventional additives, and for example, 2 to 5 parts by weight of stabilizers, 2 to 4 parts by weight of internal and external lubricants, and 1 to 3 parts by weight of antioxidants may be added. The total amount of these other additives is preferably in the range of 5 to 12 parts by weight.
본 발명의 칩은 상기한 조성물을 이용하여 통상적인 칩 제조공정에 따라 제조될 수 있는데, 칩 제조공정의 예를 도 1을 참조하여 설명하면 다음과 같다.The chip of the present invention may be manufactured according to a conventional chip manufacturing process using the composition described above. An example of the chip manufacturing process will be described below with reference to FIG. 1.
계량기(1)에서 정해진 비율로 계량된 상기 원료를 슈퍼믹서(Super Mixer)(2)에서 순차적으로 투입된 원료가 골고루 섞이도록 1차 혼련하고, 혼련된 원료는 공급기(Feeder)(3)에 의하여 압출기(4)로 공급되어진다.The raw material weighed at the ratio determined by the
압출기로 공급되어진 원료는 하기의 표에 나타낸 조건에 의해서 2차 혼련과 동시에 프리겔링(Pre Gelling)되어 압출기를 빠져 나오게 되며, 이후 분쇄기(Crusher)(5)에서 분쇄된 직경 0.5mm∼8mm 크기의 단색 컬러칩이 호퍼(6)에 저장된다.The raw material supplied to the extruder is pre-gelled at the same time as the second kneading under the conditions shown in the following table to exit the extruder, and then 0.5 mm to 8 mm in diameter crushed in the crusher 5. Monochromatic color chips are stored in the
이렇게 컬러별로 제조된 단색 칩들은 칩 혼합기(7)에서 일정 비율로 혼합되어 선별기(8)에서 선별과정을 거친 후 혼색 칩으로 완성된다.The monochromatic chips manufactured for each color are mixed at a predetermined ratio in the chip mixer 7, and then subjected to the screening process in the
<칩 제조 작업 조건><Chip Manufacturing Work Conditions>
본 발명에 따른 구름무늬 바닥재용 칩은 가열후 롤 프레스시 압연비만큼 단조롭게 가공방향으로 밀리는 현상 없이, 구름무늬처럼 퍼져나가 자연스러운 질감의 무늬가 연출되어 다양한 질감 표현이 가능한 효과를 갖는다. The chip for cloud pattern flooring according to the present invention has the effect of expressing a variety of textures by spreading like a cloud pattern without the phenomenon of being pushed in the processing direction monotonously as the rolling ratio during the roll press after heating.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030010068A KR100891218B1 (en) | 2003-02-18 | 2003-02-18 | Chip compositions for floors with cloud pattern quality and chips produced using the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020030010068A KR100891218B1 (en) | 2003-02-18 | 2003-02-18 | Chip compositions for floors with cloud pattern quality and chips produced using the same |
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| Publication Number | Publication Date |
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| KR20040074691A KR20040074691A (en) | 2004-08-26 |
| KR100891218B1 true KR100891218B1 (en) | 2009-04-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160023306A (en) * | 2014-08-22 | 2016-03-03 | (주)엘지하우시스 | Cushion flooring comprising elastic layer including pearl filler or MMA chip and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990054697A (en) * | 1997-12-26 | 1999-07-15 | 김충세 | Vinyl Flooring with Rosin |
| KR19990085879A (en) * | 1998-05-22 | 1999-12-15 | 추두련 | Special upper layer composition of flooring material and flooring material coated with same |
| KR20000002575U (en) * | 1998-07-08 | 2000-02-07 | 추두련 | Sumac Ocher Flooring |
| KR20010038391A (en) * | 1999-10-25 | 2001-05-15 | 추두련 | Artificial wood having excellent mechanical property and method for preparing the same |
-
2003
- 2003-02-18 KR KR1020030010068A patent/KR100891218B1/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990054697A (en) * | 1997-12-26 | 1999-07-15 | 김충세 | Vinyl Flooring with Rosin |
| KR19990085879A (en) * | 1998-05-22 | 1999-12-15 | 추두련 | Special upper layer composition of flooring material and flooring material coated with same |
| KR20000002575U (en) * | 1998-07-08 | 2000-02-07 | 추두련 | Sumac Ocher Flooring |
| KR20010038391A (en) * | 1999-10-25 | 2001-05-15 | 추두련 | Artificial wood having excellent mechanical property and method for preparing the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160023306A (en) * | 2014-08-22 | 2016-03-03 | (주)엘지하우시스 | Cushion flooring comprising elastic layer including pearl filler or MMA chip and manufacturing method thereof |
| KR102082521B1 (en) * | 2014-08-22 | 2020-02-27 | (주)엘지하우시스 | Cushion flooring comprising elastic layer including pearl filler or MMA chip and manufacturing method thereof |
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| KR20040074691A (en) | 2004-08-26 |
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