KR100886957B1 - Wafer bonding module and method of wafer bonding using the same - Google Patents

Abstract

A wafer bonding module and a method thereof are provided to prevent twist of two wafers and crack on wafers to be bonded. A wafer bonding module comprises a substrate supporting stand(110), a spacer(120), an aligning supporter(130), and a pusher(140), and includes a transferring unit and a control unit. The spacer and the aligning supporter supports two wafers(10, 20). After removing the spacer, the aligning supporter is removed. A generation of scratch on the wafers is prevented in bonding two wafers.

Description

Substrate Bonding Module and Substrate Bonding Method Using The Same {WAFER BONDING MODULE AND METHOD OF WAFER BONDING USING THE SAME}

The present invention relates to a substrate bonding module and a substrate bonding method using the same, and more particularly, to a substrate bonding module capable of preventing a scratch from occurring in a process of stacking and bonding two substrates, and using the same. It relates to a substrate bonding method.

In the semiconductor manufacturing process, there is a substrate bonding process in which two substrates are laminated and bonded.

The substrate bonding process is performed by pressing the substrate by a pusher for two sheets stacked with the clamps interposed therebetween. In general, in the substrate bonding process, the clamp is sequentially removed while pressing the upper substrate, so that the surface of the substrate may be scratched or the edges of the substrate may be caused by the friction between the clamp and the substrate positioned between the two sheets. there is a problem.

An object of the present invention is to provide a substrate bonding module and a substrate bonding method using the same that can prevent the scratch (Scratch) is generated on the substrate in the process of laminating and bonding two substrates.

The substrate bonding module of the present invention for achieving the above technical problem is a substrate support on which the first substrate is mounted; A spacer positioned between the second substrate stacked and bonded on the first substrate; An alignment supporter in close contact with side surfaces of the first substrate and the second substrate; And a pusher for pressing the second substrate to closely contact the first substrate, wherein the alignment supporter includes the first substrate and the first substrate in a state where the spacer is removed between the first substrate and the second substrate. It characterized in that it is formed to support the two substrates spaced apart from each other.

In addition, at least two spacers and an alignment supporter may be formed, respectively, and the spacers and the alignment supporters may be formed along the circumferential direction of the first substrate.

In addition, the spacer is a support portion formed so that the diameter of the cross section perpendicular to the axial direction in the end direction is gradually reduced; And a support body coupled to an opposite side to the end of the support in a block shape to which the transport means is coupled. In this case, the support portion may be formed of a multi-cornered horn including a conical or square pyramid, a pentagonal pyramid, and a hexagonal pyramid.

In addition, the spacer may further include a support protrusion formed to protrude upward in the rear region of the support body and a coupling groove formed at the rear of the support body to couple the transfer means.

In addition, the alignment supporter may be in close contact with the side of the first substrate and the second substrate; And it is formed in a block shape, it may be formed to include an adhesion part body coupled to the opposite side of the contact portion and the transfer means is coupled.

In addition, the contact portion may be formed in a column shape having a triangular or quadrangular shape of a horizontal cross section, and may be formed to have an arc shape in which an end portion protrudes in the direction of the substrate. Alternatively, the close contact portion may be formed in a column shape having a triangular or quadrangular shape of a horizontal cross section, and an end portion may have an arc shape concave in the opposite direction of the substrate, and the arc formed at the end portion may have a radius corresponding to the radius of the substrate. Can be.

In this case, the height of the contact portion may be formed higher than the stack height of the first substrate, the spacer and the second substrate.

On the other hand, the alignment supporter may further include a close contact protrusion formed to protrude upward in the rear region of the close contact body and a coupling groove formed on the back of the close contact body to couple the transfer means.

On the other hand, the pusher may be formed to press the upper surface of the second substrate at a position adjacent to any one of the alignment supporter with respect to the center of the second substrate.

On the other hand, the substrate bonding method of the present invention using the substrate bonding module comprises a substrate and spacer stacking step of sequentially stacking the first substrate, the spacer and the second substrate; An alignment supporter adhesion step of transferring an alignment supporter to closely contact side surfaces of the first substrate and the second substrate; A spacer removing step of removing and removing the spacer inserted between the first substrate and the second substrate in an outer direction of the first substrate; And a substrate bonding step of pushing the upper surface of the second substrate to bond the second substrate and the first substrate to be in close contact with each other.

The stacking of the substrate and the spacer may include transferring the first substrate to a substrate mounting part, transferring the spacer to an upper surface of the first substrate, and transferring the second substrate to an upper portion of the spacer. Can be made.

In addition, the spacer removing step may be performed by removing the spacer while the alignment supporter supports side surfaces of the first substrate and the second substrate.

In addition, the substrate bonding step may be configured to press the upper surface of the second substrate in a position in which the pusher is oriented in the alignment supporter direction with respect to the center of the second substrate.

Meanwhile, the substrate bonding method of the present invention may be formed by further including an alignment supporter removing step. The alignment supporter removing step may be performed after the spacer removing step, and before the substrate bonding step is performed. Can be progressed.

In this case, in the removing of the alignment supporter, the alignment supporter is transferred in an outer direction to contact the first substrate and the second substrate.

The substrate bonding module of the present invention has an effect of preventing scratches or cracks from occurring on the surface of the substrate during bonding by laminating two substrates.

In addition, the present invention has an effect that the two substrates to be bonded are bonded without being twisted.

Hereinafter, the substrate bonding module of the present invention and the substrate bonding method using the same will be described in detail with reference to the accompanying drawings.

First, a substrate bonding module according to an embodiment of the present invention will be described. In the following description of the embodiments, the same components will use the same reference numerals, and overlapping descriptions will not be possible.

1 is a perspective view of a substrate bonding module according to an embodiment of the present invention. FIG. 2 is a plan view of the substrate bonding module shown in FIG. 1. 3 is a side view of the substrate bonding module shown in FIG. 1. FIG. 4 is a perspective view of an I-I line of the substrate bonding module illustrated in FIG. 1 in a cut state. FIG. 5 is an enlarged partial perspective view of a portion of the substrate bonding module illustrated in FIG. 4. FIG. 6 is a perspective view of the first spacer shown in FIG. 5. FIG. 7 is a perspective view illustrating a state in which line II-II of the substrate bonding module illustrated in FIG. 1 is cut away. FIG. FIG. 8 is an enlarged partial perspective view of a portion of the substrate bonding module illustrated in FIG. 7. FIG. 9 is a perspective view of the first alignment supporter shown in FIG. 5.

1 to 9, a substrate bonding module according to an embodiment of the present invention is formed to include a substrate support 110, a spacer 120, an alignment supporter 130, and a pusher 140. In addition, the substrate bonding module according to an embodiment of the present invention is a transfer means (not shown) for moving each of the spacer 120, the alignment supporter 130 and the pusher 140 and the control means for controlling the transfer means ( It may be formed to further include.

Meanwhile, in the present embodiment, the first substrate 10 and the second substrate 20 are shown in a disc shape, but the first substrate 10 and the second substrate 20 are partially cut to show the direction of the single crystal. It can be formed into a shape. In addition, in the present embodiment, the first substrate 10 and the second substrate 20 have a diameter of 300 mm and a thickness of 8 mm.

In the substrate bonding module, the spacer 120 and the alignment supporter 130 support the two substrates 10 and 20 so as to be spaced apart from each other in the vertical direction, and then the alignment supporter 130 is removed. ) Is sequentially removed to bond the two substrates to prevent scratches on the surface of the substrate.

The substrate pedestal 110 is formed to include a substrate seating portion 111 and the bottom coupling portion 112.

The substrate mounting portion 111 is formed in a flat plate shape so that the first substrate 10 is seated. In addition, the substrate seating part 111 is formed in a shape corresponding to the area of the first substrate 10 and is formed to have an area larger than that of the first substrate 10.

The bottom coupling part 112 is formed to have a predetermined width along the circumferential direction in the outer region of the substrate seating part 111. The bottom coupling part 112 is bolted to a frame or support (not shown) of the substrate bonding module to support the substrate support 110. Accordingly, the bottom coupling portion 112 may be formed with a bolt coupling hole 112a for bolt coupling in a frame or support (not shown).

The spacer 120 is formed to include a first spacer 121, a second spacer 122, and a third spacer 123. In this case, the first spacer 121, the second spacer 122, and the third spacer 123 are inserted between the first substrate 10 and the second substrate 20, so that the first substrate 10 and the second substrate 20 are inserted. The substrate 20 is supported to be spaced apart from each other in the vertical direction. That is, the spacer 120 supports the first substrate 10 and the second substrate 20 to have a predetermined stacking height.

Meanwhile, although the spacer 120 in the present embodiment has been described with respect to three spacers, the spacer 120 is preferably formed by including at least two spacers. Therefore, the spacer 120 may be formed to include a larger number of spacers when the thickness of the substrate is small or the diameter of the substrate is large and needs to be supported at more points.

In addition, the first spacer 121, the second spacer 122, and the third spacer 123 are spaced apart from each other at regular intervals and are formed to balance the second substrate 20. Preferably, the first spacer 121, the second spacer 122, and the third spacer 123 are formed to be spaced apart at intervals of 120 degrees along the circumferential direction of the first substrate 10.

The first spacer 121 is formed to include a first support part 121a and a first support part body 121b. In addition, the first spacer 121 may further include a first support protrusion 121c and a first coupling groove 121d.

The first support portion 121a is formed in a conical shape in which the diameter of the cross section perpendicular to the axial direction in the end direction is gradually reduced. In addition, the first support part 121a is formed to have a rounded end portion. The first support part 121a is inserted between the first substrate 10 and the second substrate 20 to support the first substrate 10 and the second substrate 20. The first support part 121a is formed in a conical shape to prevent the first support part 121a from being in surface contact with the upper or lower surface of the first substrate 10 and the second substrate 20. That is, the first support part 121a may be in line contact with the upper surface of the first substrate 10 and the lower surface of the second substrate 20, or the edges and lines of the first substrate 10 and the second substrate 20 may be in line contact with each other. It is formed to make contact. Accordingly, when the first support part 121a is removed from the first substrate 10 and the second substrate 20, scratches may occur on the upper or lower surfaces of the first substrate 10 and the second substrate 20. Will be minimized.

Meanwhile, the first support part 121a may be formed of a polygonal horn such as a square pyramid, a pentagonal pyramid, and a hexagonal pyramid, in addition to the cone. In addition, both sides of the first support part 121a may have a vertical surface, and a height between the upper surface and the lower surface may be gradually reduced.

The first support part 121a is made of a polymer resin, and is formed of a solid material such as metal, ceramic, and rubber to prevent the surfaces of the first and second substrates 10 and 20 from being damaged. . However, in the present embodiment, the first support portion 121a is formed of a polymer resin having a predetermined mechanical strength and wear resistance for durability. For example, the first support part 121a may be formed of a PEEK material.

The first support body 121b is formed in a block shape and is coupled to an opposite side to an end of the first support 121a. The first support body 121b may be integrally formed with the first support 121a. The first support body 121b is coupled to a separate transfer means to allow the first spacer 121 to be transferred in the center direction of the first substrate 10. The conveying means may be formed including means such as a linear motor and a ball screw (not shown) or a pneumatic cylinder (not shown).

The first support protrusion 121c protrudes upward from the rear region of the first support body 121b to which the transfer means is coupled. The first support protrusion 121c increases the volume of the first support body 121b so that the transfer means can be firmly coupled.

The first coupling groove 121d is formed in the direction of the first support part 121a at the rear surface of the first support part body 121b. The first coupling groove 121d allows the transfer means to be easily coupled by bolting or the like.

The second spacer 122 is formed to include a second support part 122a and a second support part body 122b. In addition, the second spacer 122 may further include a second support protrusion 122c and a second coupling groove 122d.

The second support part 122a and the second support part body 122b of the second spacer 122 correspond to the first support part 121a and the first support part body 121b of the first spacer 121. , Same or similarly formed. In addition, the second support part protrusion 122c and the second coupling groove 122d of the second spacer 122 are components corresponding to the first support part protrusion 121c and the first coupling groove 121d and are the same or Similarly formed.

Therefore, detailed descriptions of the second support part 122a, the second support part body 122b, the second support part protrusion 122c, and the second coupling groove 122d of the second spacer 122 will be omitted.

The third spacer 123 is formed to include a third support 123a and a third support body 123b. In addition, the third spacer 123 may further include a third support protrusion 123c and a third coupling groove 123d.

The third support part 123a and the third support part body 123b of the third spacer 123 are components corresponding to the first support part 121a and the first support part body 121b of the first spacer 121. , Same or similarly formed. In addition, the third support protrusion 123c and the third coupling groove 123d of the third spacer 123 are components corresponding to the first support protrusion 121c and the first coupling groove 121d, and are the same or Similarly formed.

Therefore, detailed descriptions of the third support part 123a, the third support part body 123b, the third support part protrusion 123c, and the third coupling groove 123d of the third spacer 123 will be omitted.

The spacer 120 may have a top surface of the first substrate 10 when the first spacer 121, the second spacer 122, and the third spacer 123 are moved toward the center of the first substrate 10. The lower surface of the second substrate 20 is formed such that the substrate separation distance from the vertical direction is at least 1 mm. Accordingly, the first spacer 121, the second spacer 122, and the third spacer 123 may be formed according to the shapes of the first support part 121a, the second support part 122a, and the third support part 123a, respectively. 1 is formed to be appropriately moved in the direction of the center of the substrate 10. For example, referring to the first spacer 121, when the diameter of the surface corresponding to the bottom surface of the conical shape forming the first support part 121a is large and the side slope becomes steep, the first spacer 121 may be used. It is formed so that the moving distance of is large. On the contrary, when the diameter of the surface corresponding to the bottom surface of the conical shape forming the first support portion 121a is the same and the side slope is relatively small, the movement distance of the first spacer 121 is relatively small. .

The alignment supporter 130 includes a first alignment supporter 131, a second alignment supporter 132, and a third alignment supporter 133. The first align supporter 131, the second align supporter 132, and the third align supporter 133 are in contact with side surfaces of the first substrate 10 and the second substrate 20 to form a first substrate ( 10 and the second substrate 20 are supported to maintain the state spaced apart from each other in the vertical direction. That is, the alignment supporter 130 is spaced apart from the first substrate 10 and the second substrate while the spacer 120 is removed between the first substrate 10 and the second substrate 20. It is formed to be supported by.

On the other hand, the alignment supporter 130 is preferably formed including at least three alignment supporters. Therefore, the alignment supporter 130 may be formed to include a greater number of alignment supporters in the case where the thickness of the substrate is small or the diameter of the substrate is large and needs to be supported at more points.

In addition, the alignment supporter 130 may be arranged such that the first alignment supporter 131, the second alignment supporter 132, and the third alignment supporter 133 are spaced apart from each other at regular intervals to form a first substrate ( 10) and the second substrate 20 to be balanced. Preferably, the alignment supporter 130 has a first alignment supporter 131, a second alignment supporter 132, and a third alignment supporter 133 having a circumferential direction of the first substrate 10. It is installed spaced apart at intervals.

In addition, the first alignment supporter 131, the second alignment supporter 132, and the third alignment supporter 133 may be the first spacer 121, the second spacer 122, and the third spacer 123, respectively. Is installed in the position adjacent to). Therefore, the alignment supporter 130 supports the first substrate 10 and the second substrate 20 in a state where the first substrate 10 and the second substrate 20 are spaced apart from each other by the spacer 120. Meanwhile, the first alignment supporter 131, the second alignment supporter 132, and the third alignment supporter 133 may include the first spacer 121, the second spacer 122, and the third spacer 123. And may be installed spaced apart from a predetermined angle.

The first alignment supporter 131 is formed to include a first contact portion 131a and a first contact portion body 131b. In addition, the first alignment supporter 131 may further include a first contact portion protrusion 131c and a first alignment supporter coupling groove 131d.

The first contact part 131a is formed in a substantially triangular prism shape, and the end contact part is formed to have an arc shape protruding in the direction of the substrate. The shape of the parallel horizontal cross section is formed by a triangular pillar which is triangular and the plane shape of the end is formed to form an arc. On the other hand, the first contact portion 131a may be formed in the shape of a square pillar having a horizontal cross-sectional shape is a square. On the other hand, the first contact portion 131a may be formed in a straight shape that makes a surface contact in addition to an arc shape where the planar shape of the end is in line contact.

The first contact portion 131a is in direct contact with side surfaces of the first substrate 10 and the second substrate 20 to support the first substrate 10 and the second substrate 20 which are stacked apart from each other. Done. Since the end portion of the first contact portion 131a is formed in an arc shape, the first contact portion 131a is in point contact with the side surfaces of the first substrate 10 and the second substrate 20 in a horizontal direction. In addition, since the first contact portion 131a is in contact with the side surfaces of the first substrate 10 and the second substrate 20, the first contact portion 131a is in line contact in the vertical direction.

In addition, when the first contact portion 131a is formed of an elastic material, the first contact portion 131a has a predetermined width in the horizontal direction while being deformed inward and corresponds to the height of the first substrate 10 or the second substrate in the vertical direction. There is a face contact with one width.

The height of the first contact portion 131a is greater than the stacked height of the first substrate 10 and the second substrate 20 spaced apart from each other by the spacer 120. Therefore, the first contact portion 131a is supported to maintain the first substrate 10 and the second substrate 20 spaced apart from each other. For example, based on a 12-inch substrate, the first contact portion 131a is 1.6 mm, which is twice the thickness of 0.8 mm, which is a general thickness of a 12-inch substrate, and that of the first substrate 10 and the second substrate 20. It is formed higher than the stacking height of 2.6mm by adding 1mm of separation distance. When the height of the first contact portion 131a is too small than the stacking height, the first substrate 10 and the second substrate 20 may not be sufficiently supported. The first contact portion 131a is preferably formed at least 50% higher than the stacking height. On the other hand, the first contact portion 131a is formed smaller than the height of the internal space of the process chamber (not shown) in which the bonding module is mounted.

The first contact portion 131a is formed of a polymer resin having elasticity to prevent side surfaces of the first substrate 10 and the second substrate 20 from being damaged. However, the first contact portion 131a is formed of a polymer resin having a predetermined mechanical strength and wear resistance for durability. For example, the first contact portion 131a may be formed of a PEEK material which is the same material as the spacer 120.

The first contact part body 131b is formed in a block shape and is coupled to an opposite side to an end of the first contact part 131a. The first contact part 131b may be integrally formed with the first contact part 131a. Therefore, the first contact portion 131b may be formed of the same material as the first contact portion 131a.

The first contact body 131b is coupled to a separate transfer means so that the first alignment supporter 131 may be transferred in the center direction of the first substrate 10. The conveying means may be formed including means such as a linear motor and a ball screw (not shown) or a pneumatic cylinder (not shown).

The first contact portion protrusion 131c is formed to protrude upward from the rear region of the first contact portion body 131b to which the transfer means is coupled. The first contact portion protrusion 131c increases the volume of the first contact portion body 131b so that the transfer means can be firmly coupled.

The first alignment supporter coupling groove 131d is formed in the direction of the first adhesion part 131a at the rear surface of the first adhesion part body 131b. The first alignment supporter coupling groove 131d allows the transfer means to be easily coupled by bolting or the like.

The second alignment supporter 132 is formed to include a second contact portion 132a and a second contact portion body 132b. In addition, the second alignment supporter 132 may further include a second contact portion protrusion 132c and a second alignment supporter coupling groove 132d.

The second contact portion 132a and the second contact portion 132b of the second alignment supporter 132 may include a first contact portion 131a and a first contact portion body 131 of the first alignment supporter 131. A component corresponding to 131b) is formed identically or similarly. In addition, the second contact portion protrusion 132c and the second alignment supporter coupling groove 132d of the second alignment supporter 132 may have a first contact portion protrusion 131c of the first alignment supporter 131. It is a component corresponding to the first alignment supporter coupling groove 131d, and is formed identically or similarly. Accordingly, the second contact portion 132a, the second contact portion body 132b, the second contact portion protrusion 132c of the second alignment supporter 132, and the second alignment supporter coupling groove 132d. Detailed description will be omitted.

The third alignment supporter 133 is formed to include a third contact part 133a and a second contact part body 133b. In addition, the third alignment supporter 133 may further include a third contact portion protrusion 133c and a third alignment supporter coupling groove 133d.

The third contact part 133a and the third contact part body 133b of the third alignment supporter 133 may include a first contact part 131a and a first contact part body of the first alignment supporter 131. A component corresponding to 131b) is formed identically or similarly. In addition, the third contact portion protrusion 133c of the third alignment supporter 133 and the third alignment supporter coupling groove 133d may be formed of the first contact portion protrusion 131c of the first alignment supporter 131. It is a component corresponding to the first alignment supporter coupling groove 131d, and is formed identically or similarly. Accordingly, the second contact portion 133a, the third contact portion body 133b, the third contact portion protrusion 132c of the third alignment supporter 133, and the third alignment supporter coupling groove 133d. Detailed description will be omitted.

The pusher 140 is formed to include a pressing block 142 having a predetermined thickness and a shaft 144 connected to the pressing block 142.

The pusher 140 is preferably formed to press the upper surface of the second substrate 20 at a position adjacent to any one of the alignment supporters 121 with respect to the center of the second substrate 20. In addition, the pusher 140 may be formed to change the pressing position of the second substrate.

The pressure block 142 may be formed of a polymer resin material having elasticity and mechanical strength and wearability to prevent damage to the upper surface of the second substrate. For example, the pressure block 142 may be formed of a PEEK material. In addition, the shaft 144 may be formed of a metal material having high corrosion resistance such as stainless steel.

The shaft 144 of the pusher 140 extends outside the process chamber (not shown) of the substrate bonding module and is connected to the transfer means (not shown). The pusher 140 moves the pressing block 142 up and down by the operation of the transfer means. The pusher 140 presses the second substrate 20 while the pressing block 142 moves downward to contact the upper surface of the second substrate 20 so that the second substrate 20 contacts the first substrate 10. Make sure they are in close contact. On the other hand, the conveying means may be formed including a linear motor and a conveying means such as a ball screw or a pneumatic cylinder.

The substrate bonding module may include a control unit connected to a transfer unit connected to a spacer, an alignment supporter, and a pusher to control an operation of the transfer unit. In this case, the controller may be connected to the main control part of the substrate bonding apparatus in which the substrate bonding module is mounted. In addition, the controller may be implemented together with the main controller of the substrate bonding apparatus.

Meanwhile, the alignment supporter used in the substrate bonding module of the present invention may be formed in another shape in addition to the shape shown in FIG. 1. Hereinafter, an alignment supporter according to another embodiment used in the substrate bonding module of the present invention will be described. In the following description of the alignment supporter according to another embodiment, the same parts as the alignment supporter according to the embodiment of FIGS. 1 to 9 will be omitted by the same reference numerals.

10 is a perspective view of another shape of the alignment supporter used in the substrate bonding module according to the embodiment of the present invention.

The alignment supporter 230 according to another exemplary embodiment of the present invention may refer to FIG. 10, wherein the first alignment supporter 231, the second alignment supporter (not shown), and the third alignment supporter (not shown) are provided. It is formed to include. The first alignment supporter 231 is formed to include a first contact part 231a and a first contact part body 131b. In addition, the first alignment supporter 231 may further include a first contact portion protrusion 131c and a first alignment supporter coupling groove 131d. On the other hand, since the second alignment supporter and the third alignment supporter are formed in the same or similar to the first alignment supporter, detailed description thereof will be omitted below.

The first contact portion 231a is formed in a substantially triangular prism shape, and the end portion 231a1 is formed to have an arc shape in which it is concave. That is, the first contact portion 231a is formed on an upper surface of the first substrate 10. The horizontal cross section parallel to the shape of the triangular pillars are formed. At this time, the first contact portion 231a is formed such that the shape of the horizontal cross section of the end portion 231a1 is concave inwardly. In addition, the end portion 231a1 of the first contact portion 231a may be formed as an arc having the same radius as the radius of the first substrate 10 or the second substrate 20. Accordingly, the first contact portion 231a may be firmly in close contact with the side surfaces of the first substrate 10 and the second substrate 10 in a larger area.

In addition, the first contact portion 231a may be formed in a quadrangular pillar shape having a rectangular cross section. In this case, one surface, which is an end of the first contact portion, may be formed in an arc shape, and a radius of the arc formed at the end may correspond to a radius of the first substrate.

Next, a substrate bonding method using a substrate bonding module according to an embodiment of the present invention will be described.

11 is a flowchart of a substrate bonding method according to an embodiment of the present invention. 12A to 12D are process diagrams schematically showing the steps of the substrate bonding method of FIG. 11. 13A to 13B are diagrams schematically illustrating an alignment supporter removing step of the substrate bonding method of FIG. 11.

In the following description, the spacers 120 (121, 122, 123) and the alignment supporters (130; 131, 132, 133) are not distinguished from the first, second, and third ones regardless of their positions. It demonstrates centering on the state shown in FIG. 12D.

In the substrate bonding method according to an embodiment of the present invention, referring to FIG. 11, the substrate and spacer stacking step S10, the alignment supporter adhesion step S20, the spacer removing step S30, and the substrate bonding step S40 are described. It is formed to include. In addition, the substrate bonding method according to an embodiment of the present invention is further formed by including an alignment supporter removing step (S35).

The substrate and spacer stacking step (S10) is a step of sequentially stacking the first substrate 10, the spacers 121, 122, and the second substrate 20, as shown in FIG. 12A. More specifically, first, the first substrate 10 is transferred to the substrate seating portion 111 of the substrate bonding module to be seated. Next, the spacers 121 and 122 are transferred to and positioned on the upper surface of the first substrate 10. In this case, the spacers 121 and 122 may be transported from the outside of the first substrate 10 to a region where the semiconductor device is not formed. However, the second substrate 20 is then transferred to the upper portion of the spacers 121 and 122 to be seated. The first substrate 10 and the second substrate 20 are stacked such that the surfaces to be bonded face each other.

As shown in FIG. 12B, the alignment supporter closely contacting step S20 is a step in which the alignment supporters 131 and 132 are brought into close contact with the side surfaces of the first substrate 10 and the second substrate 20. . The alignment supporters 131 and 132 adhere to the side surfaces of the first substrate 10 and the second substrate 20 to fix the first substrate 10 and the second substrate 20. In this case, the alignment supporters 131 and 132 may fix the first substrate 10 and the second substrate 20 to be spaced apart by the spacers 121 and 121. In addition, the alignment supporters 131 and 132 are aligned such that positions corresponding to the first substrate 10 and the second substrate 20 face each other. That is, the first substrate 10 and the second substrate 20 are aligned so that the crystal directions coincide with each other.

Meanwhile, the alignment supporters 131 and 132 support side surfaces of the first substrate 10 and the second substrate 20 at an appropriate pressure so as not to damage the first substrate 10 and the second substrate 20. Done.

As shown in FIG. 12C, the spacer removing step S30 may include spacers 121 and 122 inserted between the first substrate 10 and the second substrate 20 of the first substrate 10. It is a step of removing by moving in the outward direction. That is, the spacer removing step S30 is performed while the alignment supporter 130 removes the spacers 120 while supporting the side surfaces of the first substrate 10 and the second substrate 20. Accordingly, an empty space is formed between the upper surface of the first substrate 10 and the lower surface of the second substrate 20. In addition, the first substrate 10 and the second substrate 20 are spaced apart and supported in the same state as the first stacked state by the alignment supporters 131 and 132.

Meanwhile, since the spacers 121 and 122 are removed in a state in which the first substrate 10 and the second substrate 20 are supported by the alignment supporters 131 and 132, the first substrate 10 and the second substrate are removed. The surface of the (20) will not cause damage such as scratches.

In the substrate bonding step S40, as shown in FIG. 12D, the pusher 140 presses the upper surface of the second substrate 20 to bring the second substrate 20 and the first substrate 10 into close contact with each other. to be.

The pusher 140 presses the second substrate 20 at a position biased to one side from the center of the second substrate 20. That is, the second substrate 20 is not in contact with the upper surface of the first substrate 10 at the same time, but gradually contacts the upper surface of the first substrate 10 from one side. Therefore, a large amount of air is trapped between the first substrate 10 and the second substrate 20.

In addition, since the second substrate 20 is supported by the alignment supporters 132 and 133 (see FIG. 2) located on the opposite side of the pusher 140 when pressed by the pusher 140, the first substrate is supported. The alignment state of (10) is not misaligned.

In addition, in the substrate bonding step S40, the pusher 140 presses the upper surface of the second substrate while finely transferring the alignment supporter 131 adjacent to the pusher 140 in the outer direction of the first substrate 10. Can be done. In this case, the second substrate 20 may be easily lowered without friction with the alignment supporter 130. However, when the alignment supporters 131 and 132 are supported by the pusher 140 so as not to damage the second substrate 20, the alignment supporters 131 and 132 may not be transferred. .

Since the second substrate 20 is pressed by the pusher 140 in a state supported by the alignment supporter 131 to be in close contact with the first substrate 10, the second substrate 20 rapidly drops to the upper surface of the first substrate 10. Is prevented. Therefore, since the impact does not occur when the first substrate 10 and the second substrate 20 are in close contact with each other, damage such as cracks does not occur.

On the other hand, the substrate bonding method according to an embodiment of the present invention may be formed by further including an alignment supporter removing step (S35). The alignment supporter removing step S35 may be performed after the spacer removing step S30 is performed. In addition, the alignment supporter removing step S35 may be performed before the substrate bonding step S40 is performed.

The alignment supporter removing step S35 is performed after the spacer removing step S30 in which the space 120 is removed from the first substrate 10 and the second substrate 20, as shown in FIG. 12C. .

After the spacer 120 illustrated in FIG. 12C is removed, as shown in FIG. 13A, an alignment supporter removing step S35 in which the alignment supporters 131 and 132 are transported in the outward direction may be performed. Then, since the alignment supporters 131 and 132 supporting the side surfaces of the first substrate 10 and the second substrate 20 are removed, the first substrate 10 and the second substrate 20 are in contact with each other. do.

Subsequently, as shown in FIG. 13B, when the substrate bonding step S40 of pressing the first substrate 10 and the second substrate 20 with the pusher 140 is performed, the first substrate 10 and the first substrate 10 may be formed. The two substrates 20 are bonded to each other.

Here, in the alignment supporter removing step S35, when the size, weight, specific gravity, and process variables of the substrates 10 and 20 are taken into consideration, the alignment supporter removal step S35 may be performed when the second substrate 20 is rapidly dropped and adhered to the first substrate 10. If there is no difficulty, it can proceed selectively.

1 is a perspective view of a substrate bonding module according to an embodiment of the present invention.

FIG. 2 is a plan view of the substrate bonding module shown in FIG. 1.

3 is a side view of the substrate bonding module shown in FIG. 1.

FIG. 4 is a perspective view of an I-I line of the substrate bonding module illustrated in FIG. 1 in a cut state.

FIG. 5 is an enlarged partial perspective view of a portion of the substrate bonding module illustrated in FIG. 4.

FIG. 6 is a perspective view of the first spacer shown in FIG. 5.

FIG. 7 is a perspective view illustrating the II-II line of the substrate bonding module illustrated in FIG. 1 in a cut state.

FIG. 8 is an enlarged partial perspective view of a portion of the substrate bonding module illustrated in FIG. 7.

FIG. 9 is a perspective view of the first alignment supporter shown in FIG. 5.

10 is a perspective view of an alignment support according to another embodiment of the present invention.

11 is a flowchart of a substrate bonding method according to an embodiment of the present invention.

12A to 12D are process diagrams schematically showing the steps of the substrate bonding method of FIG. 11.

13A to 13B are process diagrams schematically illustrating an alignment supporter removing step of the substrate bonding method of FIG. 11.

<Explanation of symbols for the main parts of the drawings>

10: first substrate 20: second substrate

110: substrate support 111: substrate mounting portion

120: spacer

130: Align supporter

140: pusher

Claims (16)

A substrate support on which the first substrate is mounted; A spacer positioned between the second substrate stacked and bonded on the first substrate; An alignment supporter in close contact with side surfaces of the first substrate and the second substrate; And A pusher for pressing the second substrate to closely contact the first substrate, The alignment supporter may be in close contact with the side surfaces of the first substrate and the second substrate; And formed in a block shape, and is coupled to the opposite side of the contact portion and the contact portion body coupled to the transfer means, At least three alignment supporters are disposed along the circumferential direction of the first substrate so that the first substrate and the second substrate are spaced apart from each other while the spacer is removed from between the first substrate and the second substrate. The substrate bonding module of claim 1, wherein the substrate bonding module is formed to be transported in an outer direction of the first substrate and the second substrate before the pusher descends. The method of claim 1, And at least two spacers, and each spacer is disposed in a circumferential direction of the first substrate. The method of claim 2, The spacer A support portion formed such that the diameter of the cross section perpendicular to the axial direction in the end direction is gradually reduced; And Substrate bonding module characterized in that it is formed in a block shape is coupled to the opposite side of the support portion, including a support body to which the transfer means is coupled. The method of claim 3, wherein Wherein the support portion substrate bonding module, characterized in that formed of a multi-cornered horn including a conical or square pyramid, pentagonal pyramid and hexagonal pyramid. The method of claim 3, wherein The spacer is a substrate bonding module characterized in that it further comprises a support protrusion formed to protrude upward in the rear region of the support body and a coupling groove formed on the rear of the support body to combine the transfer means. delete The method of claim 1, The close contact portion is a substrate bonding module, characterized in that the horizontal cross-sectional shape of the triangular or rectangular column shape is formed so that the end is formed in an arc shape protruding in the direction of the substrate. The method of claim 1, The close contact portion is formed in a column shape having a triangular or quadrangular shape of a horizontal cross section, and an end portion is formed in an arc shape concave in the opposite direction of the substrate, The arc formed at the end is substrate bonding module, characterized in that the radius is formed corresponding to the radius of the substrate. The method according to claim 7 or 8, The height of the contact portion is a substrate bonding module, characterized in that higher than the stacking height of the first substrate, the spacer and the second substrate. The method of claim 1, The alignment supporter may further include a bonding part protrusion formed to protrude upward from a rear area of the contact body and a coupling groove formed at a rear surface of the contact body to form a coupling groove to which a transfer means is coupled. module. The method of claim 2, And the pusher is configured to press the upper surface of the second substrate at a position adjacent to one of the alignment supporters with respect to the center of the second substrate. A substrate and spacer stacking step of sequentially stacking a first substrate, a spacer, and a second substrate; An alignment supporter adhesion step of transferring an alignment supporter to closely contact side surfaces of the first substrate and the second substrate; Spacer removal for removing and removing the spacer inserted between the first substrate and the second substrate in the outer direction of the first substrate while the alignment supporter supports the side surfaces of the first substrate and the second substrate. step; An alignment supporter removing step in which the alignment supporter is transferred in an outward direction of the first substrate and the second substrate to contact the first substrate and the second substrate; And And a pusher press-bonding the top surface of the second substrate to bond the second substrate and the first substrate to bond them. The method of claim 12, The substrate and spacer stacking step A substrate bonding method comprising transferring the first substrate to a substrate seating portion, transferring the spacer to an upper surface of the first substrate, and transferring the second substrate to an upper portion of the spacer to seat the substrate; . delete The method of claim 12, And the substrate bonding step is configured to press the upper surface of the second substrate at a position in which the pusher is oriented in the alignment supporter direction with respect to the center of the second substrate. delete

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