KR100885548B1 - Testing apparatus of memory module - Google Patents

Abstract

The present invention relates to an apparatus for inspecting a memory module, and more particularly, to inspecting a memory module for electrically inspecting the memory module by electrically connecting a motherboard provided with a pattern surface and a memory module provided with a plurality of contact terminals to each other. An apparatus comprising: an interposer having a plurality of contact pins soldered to a pattern surface of a motherboard, fixedly coupled to an upper side of the motherboard, and provided with an interposer provided with a locking portion, and mounted on an upper side of the interposer, A contactor is provided to allow one-to-one electrical contact between the contact terminal of the memory module and the contact pin of the interposer, and is detached from the interposer when the catching part is caught in a position corresponding to the catching part. Inspection of a memory module including an inspection socket with a locking jaw that is prevented It relates to the device.

Interposers, test sockets, motherboards, memory modules

Description

Testing apparatus of memory module

1 is a test apparatus for a memory module according to the prior art.

2 is a perspective view of the inspection socket of FIG.

Figure 3 is an exploded perspective view of the inspection device of the memory module according to an embodiment of the present invention.

4 is a perspective view of the combination of FIG.

5 is a rear perspective view of the interposer and inspection socket of FIG.

FIG. 6 is a VI-VI cross-sectional view of FIG. 4. FIG.

7 is a cross-sectional view illustrating a state in which a memory module is inserted into the inspection apparatus of FIG. 6.

8 is a cross-sectional view showing a state in which the locking jaw of Figure 6 is released from the locking portion.

FIG. 9 is a VIII-VIII cross-sectional view of FIG. 4. FIG.

10 is an operation diagram of the ejection means of FIG. 9;

<Detailed Description of Drawings>

1 ... Motherboard 10 ... Memory Module

11 ... contact terminal 20 ... interposer

30.Body part 31.Protrusion

32 ... Hanging part 33 ... Contact pin

40 Ejection means 41 Frame part

42.Inset groove 43.Hinge

44 Metal plate 45 Eject lever

50 ... Socket 60 ... Socket body

61 Insert hole 62 Contactor

63 ... pin 64 ... spring

70 ... Latch plate

The present invention relates to an inspection apparatus for a memory module, and more particularly, to an inspection apparatus for a memory module having a short current path between the memory module and the motherboard.

In general, a memory module is a plurality of DRAM memory ICs produced on a board having a predetermined size, and a plurality of memory modules are mounted on a plurality of sockets mounted on a motherboard. Inserted and used. Such a memory module undergoes a plurality of inspection processes of the memory module itself before it is marketed, and this inspection process is performed by checking whether the connection bit between cells in the memory is good or data read / written to the memory. Check if the baud rate reaches the reference value.

The inspection of a general memory module consists of a plurality of test sockets and test boards and a motherboard equipped with the plurality of memory modules. The test on the test board is made by connecting the lowering side of the motherboard and the test board through connectors. Check the memory module inserted in the socket.

1 is a configuration diagram illustrating a connection relationship between a memory module having an inspection socket and a motherboard. As shown, the memory module 101 in which a plurality of memory elements 103 is mounted on a substrate having a printed circuit forms a contact terminal 209 having an electrical pattern for each bit of the memory as the lower end of the substrate. . The contact 207 is fluidly coupled into the test socket 109 and has a predetermined elasticity and makes contact with the contact terminal 209 and the test board 201. In addition, the test socket 109 is coupled onto the test board 201 so that an end portion of the contact 207 has a predetermined elasticity and contacts the printed circuit of the test board 201 to make an electrical connection.

Since the contact 207 of the test socket 109 in contact with the test board 201 should be in contact with the printed circuit of the test board 201 by a predetermined elasticity, the area in contact with the contact 207 and the printed circuit. By increasing the value, the error of the electrical signal is prevented. As shown in FIG. 2, a lever 109a is provided on the left and right sides of the test socket, respectively, in order to remove the tested memory device. When the lever 109a is pushed downward, the inserted memory device may move upward and be separated from the test socket.

Such a test socket is difficult to be mounted on the motherboard because of its large volume, and is connected to the motherboard through a separate connector 203, and the memory module 101 connected to the motherboard through the connector 203 is connected to the motherboard 205. Under control, a predetermined inspection is performed.

The inspection apparatus of the memory module according to the related art has the following problems.

First, since the memory module and the motherboard are spaced apart from each other through the connector, the reliability of the test is hardly guaranteed. In other words, since the memory module and the motherboard are far from each other, the overall current path becomes long, and thus, a time error or a resistance occurs while the current flows, thereby causing a problem in the overall reliability of the test.

In particular, there is a problem that development of an inspection apparatus capable of inspecting a memory module at a high speed is urgent because the inspection environment cannot inspect a rapidly increasing memory module speed.

First, the memory module inserted for inspection moves the levers provided on the left and right sides of the test socket downward to remove the test socket from the test socket. The left and right sides of the socket cannot be provided with a separate electrical element has a problem that the use of space is not efficient.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the memory module to be examined is placed as close as possible to the motherboard to shorten the overall current path, and the lever for properly pulling out the memory module from the test socket is used as a whole. An object of the present invention is to provide an inspection apparatus for a memory module that increases space utilization.

An inspection apparatus of a memory module of the present invention for achieving the above object, the memory module for the electrical inspection of the memory module by electrically connecting the motherboard provided with a pattern surface and the memory module provided with a plurality of contact terminals with each other; An inspection apparatus, comprising: a plurality of contact pins soldered to a pattern surface of a motherboard, fixedly coupled to an upper side of the motherboard, and provided with an interposer provided with a locking portion, and mounted on an upper side of the interposer; A contactor is provided for seating the module, and contacting the contact terminal of the memory module and the contact pin of the interposer with one-to-one electrical contact. It includes an inspection socket having a locking step to prevent the departure.

In the inspection apparatus of the memory module, the interposer includes a body portion extending in one direction, a plurality of contact pins arranged along the longitudinal direction of the body portion, and perpendicular to the longitudinal direction of the body portion at both ends of the body portion. It is preferable that it is installed in the direction and comprises an ejecting means for detaching the memory module from the inspection socket is completed.

In the inspection device of the memory module, the ejecting means, the frame portion is provided with an insertion groove in a direction perpendicular to the longitudinal direction of the body portion, is inserted into the insertion groove is formed long in the longitudinal direction of the insertion groove and one end is It is composed of an eject lever which is hinged to the center portion in the longitudinal direction so as to be movable in the vertical direction, one end of the eject lever is moved downward by the memory module inserted into the test socket, the eject moved downward As one end of the lever moves upward, it is preferable that the memory module in contact with one end of the eject lever moves upward to move away from the test socket.

In the inspection device of the memory module, the locking portion is a pair of locking grooves extending along the longitudinal direction of the interposer and provided on both sides of the interposer, and the locking jaw is a lengthwise direction of the inspection socket so as to correspond to the locking groove. It is preferable that there is a pair of protrusions extending along the length thereof.

In the inspection device of the memory module, the locking jaw extends in the up and down direction of the inspection socket and protrudes from the lower side of the inspection socket to face each other at a lower end of the pair of latch plates located on both sides of the inspection socket. And a pair of upper ends of the pair of latch plates protrude from an upper side of the test socket, and a central portion in the longitudinal direction of each latch plate is moved at a lower end thereof when the gap between the upper ends of the latch plates moves in a direction close to each other. It is preferable that the interval between the locking jaw provided in the coupled to the inspection socket to move in a direction away from each other.

In the inspection apparatus of the memory module, a gold plated metal plate is coupled to the lower end of the interposer, and the metal plate is preferably soldered and fixed to the upper surface of the motherboard.

In the inspection device of the memory module, the lower end of the interposer is provided with a projection protruding from the lower surface, the motherboard has a shape corresponding to the projection, the groove is provided with the projection can be inserted. desirable.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is an exploded perspective view of an inspection apparatus of a memory module according to an embodiment of the present invention, FIG. 4 is a perspective view of FIG. 3, FIG. 5 is a rear perspective view of the interposer and inspection socket of FIG. 4, and FIG. FIG. 4 is a cross-sectional view taken along line VI-VI, and FIG. 7 is a cross-sectional view showing a state in which a memory module is inserted into the inspection device of FIG. 6, and FIG. 8 is a cross-sectional view showing a state where the locking step of FIG. FIG. 9 is a sectional view taken along line VIII-VIII of FIG. 4, and FIG. 10 is an operation diagram of the ejection means of FIG. 9.

The inspection apparatus of the present invention electrically connects the motherboard 1 provided with a pattern surface (not shown) and the memory module 10 provided with a plurality of contact terminals 11 to each other to perform electrical inspection of the memory module 10. For the purpose, the interposer 20 and the inspection socket 50 is included.

The interposer 20 is fixedly coupled to an upper side of the motherboard 1, and a plurality of contact pins 33 are soldered to the pattern surface of the motherboard 1. The interposer 20 serves as an intermediary between the motherboard 1 and the test socket 50, and the motherboard 1 and the test socket 50 are electrically connected to each other through the interposer 20. . Specifically, the pattern surface of the motherboard 1 and the contactor 62 of the test socket 50 are electrically connected to each other through the contact pins 33 of the interposer 20.

The interposer 20 is composed of a body portion 30, a plurality of contact pins 33, and the ejection means 40.

The body portion 30 extends in one direction, and the plurality of contact pins 33 are fixed. The body portion 30 is provided with a pair of engaging portions 32 along the longitudinal direction on both sides.

In addition, the body portion 30 is provided with a projection 31 protruding to its lower surface, the projection 31 is to be caught in the groove portion (1a) provided on the motherboard (1). The interposer 20 is suppressed from moving horizontally from the motherboard 1 as the protrusion 31 is fitted into the groove 1a.

The contact pin 33 is arranged in plurality along the longitudinal direction of the body portion (30). The contact pin 33 is made of a copper alloy, it is preferable that the surface is gold plated, but any other conductive metal material can be used.

The ejection means 40 is installed at both ends of the body portion 30 in a direction perpendicular to the longitudinal direction of the body portion 30 and for removing the memory module 10 from which the test is completed, from the test socket 50. will be.

The ejection means 40 is composed of a frame portion 41 and the eject lever 45.

The frame portion 41 is an insertion groove 42 in a direction perpendicular to the longitudinal direction of the body portion 30, the hinge 43 is provided at the central portion in the longitudinal direction.

A gold plated metal plate 44 is coupled to the lower end of the frame part 41. The metal plate 44 is bent in a "b" shape and its surface is gold plated. The bent portion of the metal plate 44 is inserted and inserted into the interposer 20, and the flat portion is soldered to the upper surface of the motherboard 1. As the metal plate 44 inserted into the frame part 41 is soldered to the motherboard 1, the frame part 41 is firmly fixed to the motherboard 1.

The eject lever 45 is inserted into the insertion groove 42 and is formed long in the longitudinal direction of the insertion groove 42 and forms a bar shape as a whole. The eject lever 45 has its center portion 70c hinged to the hinge 43 provided in the frame portion 41. Accordingly, the eject lever 45 may be rotatable about the hinge 43, and one end 45a of the eject lever 45 is movable in the vertical direction. Specifically, one end of the eject lever 45 is pushed downward by the memory module 10 when the memory module 10 is inserted into the test socket 50, and together with the eject lever 45. The other end of 45b is rotated about the hinge 43 to move upward. On the other hand, when the inspection of the memory module 10 is completed, when the other end of the eject lever 45 is pushed downward, one end of the eject lever 45 moves upward with respect to the hinge 43. In addition, the memory module 10 is pushed by one end of the eject lever 45 and moved upward to be separated from the test socket 50.

The test socket 50 is detachably coupled to the upper side of the interposer 20 and seats the memory module 10. The test socket 50 is composed of a socket body 60, the latch plate 70.

The socket body 60 extends in one direction and is provided with an insertion hole 61 for accommodating the memory body and a contactor 62 therein. The contactor 62 is for making one-to-one electrical contact between the contact terminal 11 of the memory module 10 and the contact pin 33 of the interposer 20. The contactor 62 may be provided with a pin 63 and a spring 64. Is done.

The pin 63 is provided at a position corresponding to the contact pin 33 of the interposer 20 and is in electrical contact with the contact terminal 11 of the memory module 10 inserted into the test socket 50. do. The pin 63 may be provided in plural in the longitudinal direction of the test socket 50 so that the pair face each other, the upper end of the pin 63 may be in contact with the contact terminal 11 of the memory module 10, and the lower end of the spring 64. Is elastically supported. The pin 63 protrudes into the insertion hole 61 of the test socket 50 when the memory module 10 is not inserted, and the memory module 10 is inserted into the insertion hole of the test socket 50. 61 is pushed by the memory module 10 to move downward.

The spring 64 is provided below the pin 63 and elastically biases the pin 63 to the insertion hole 61 side of the test socket 50. When the memory module 10 is inserted into the insertion hole 61 of the test socket 50, the upper end of the pin 63 is electrically connected to the test terminal of the memory module 10 while being compressed. The spring 64 has an upper side in contact with the pin 63, and a lower side protrudes from the inspection socket 50 to contact the plurality of contact pins 33 of the interposer 20, respectively. Accordingly, the current supplied through the motherboard 1 flows through the paths of the pins 63, the springs 64, the contact pins 33, and the contact terminals 11 of the memory module 10.

The latch plate 70 is located on the side of the socket body 60 and extends in the vertical direction of the socket body 60.

The upper end 70b of the latch plate protrudes from an upper side of the inspection socket, and a pair is provided to face each other. A lower end of the latch plate 70 protrudes toward the lower side of the test socket 50, and a latching jaw 70a provided with a pair to face each other is provided. The locking jaw 70a is provided at a position corresponding to the locking portion 32, and when the locking jaw is caught by the locking portion 32, the inspection socket 50 is prevented from being separated from the interposer 20. It is. The locking jaw (70a) has a shape corresponding to the locking portion 32 of the interposer 20, a pair is provided along the longitudinal direction of the inspection socket (50).

The center portion 70c of the latch plate 70 moves toward each other in the direction in which the distance between the upper ends 70b of the latch plates 70 facing each other is provided at the lower end of the latch plate 70a facing each other. The distance between the two is coupled to the socket body 60 to move in a direction away from each other. The latch plate 70 allows the upper and lower ends to move in different directions about the center portion 70c as if it is a red nipper.

The inspection apparatus of the memory module 10 according to the present embodiment having such a configuration has the following effects.

First, the inspection socket 50 is mounted on the upper side of the interposer 20 fixedly coupled to the motherboard 1. At this time, the interposer 20 is not only soldered to each terminal on the pattern surface of the motherboard 1 is fixedly coupled by a predetermined fixing means. In addition, the gold plated metal plate 44 is soldered and fixed to the upper surface of the motherboard 1 at the lower end of the interposer 20 is firmly fixed to the motherboard (1).

The inspection socket 50 is positioned above the motherboard 1, and the inspection socket 50 is moved downward. While the inspection socket 50 is coupled to the motherboard 1, the locking jaw 70a provided at the inspection socket 50 is coupled to the locking portion 32 of the interposer 20. Specifically, the pair of locking jaws 70a provided on both side surfaces of the interlocker 20 are contacted with the upper side of the interposer 20 and then open to both sides, and the latching jaw 70a of the interposer 20 returns to its original position. do. While the locking jaw 70a is caught by the locking portion 32, the inspection socket 50 is completely mounted on the interposer 20, and is prevented from being separated from the interposer 20.

As the test socket 50 is mounted on the interposer 20, the lower side of the contactor 62 provided in the test socket 50 contacts the upper side of the contact pin 33 of the interposer 20. Specifically, the contact pin 33 of the interposer 20 contacts the spring 64 of the contactor 62.

In this state, when the memory module 10 is inserted through the insertion hole 61 of the test socket 50, the memory module 10 is in contact with the contactor 62 provided in the test socket 50. The contactor 62 includes a pin 63 and a spring 64. The contact terminal 11 of the memory module 10 moves downward through the insertion hole 61 to move the pin 63 downward. Move down. The pin 63 compresses the spring 64 while moving downward by the contact terminal 11. The compressed spring 64 makes contact between the pin 63 and the contact terminal 11 more closely by elastic repulsive force. Accordingly, the contact terminal 11 of the memory module 10, the contactor 62 of the test socket 50, the contact pins 33 of the interposer 20, and the pattern surfaces of the motherboard 1 are electrically connected to each other. do.

In addition, the eject lever 45 of the ejection means 40 provided at both ends of the interposer 20 also moves downward. As shown in FIG. 9, as the memory module 10 is inserted, one end of the eject lever 45 is pushed by the memory module 10 to move downward about the hinge 43.

As such, when the mounting of the memory module 10 is completed, the inspection of the memory module 10 is performed through a predetermined control module 10 (not shown) for the inspection of the memory module 10. When the test is completed, the other end 45b of the eject lever 45 is moved downward to detach the memory module 10 from the test socket 50. Accordingly, the one end 45a of the eject lever 45 moves upward while the memory module 10 that is in contact with the one end 45a of the eject lever 45 also moves upward and is easily detached from the test socket 50. To be possible.

After the memory module 10 is moved upward enough to be easily detached, the test performer easily pulls the memory module 10 from the test socket 50. Since the contactor 62 in the test socket 50 is in frequent contact with the memory module 10, its life is finite and requires replacement. On the other hand, in this embodiment, since the interposer 20 and the inspection socket 50 are coupled by the combination of the locking step 70a and the locking portion 32, the replacement of the inspection socket 50 is It can be made simply by releasing the locking jaw (70a) from the locking portion (32). Specifically, as shown in Figure 8, when the inspection attendant grasps the upper side of the pair of latch plate 70 provided with the locking jaw (70a) by hand to narrow the gap between each other, the black chin jaw provided at the lower end The distance between the engaging jaw (70a) facing away from each other is released from the locking portion (32). When the locking step 70a is released from the locking part 32, the test socket 50 may be lifted upward to easily separate the test socket 50 from the interposer 20. Thereafter, the new inspection socket 50 may be mounted on the interposer 20 again and the inspection may be performed. The assembly method of the interposer 20 and the inspection socket 50 is as described above.

The inspection apparatus of the memory module 10 according to the present embodiment has the following effects.

First, the memory module 10 according to the present embodiment does not use a connector as shown in FIG. 1 for the electrical connection between the test socket 50 and the motherboard 1, and to the motherboard 1. Since the fixed interposer 20 is used, the overall current path can be shortened to improve the reliability of the entire inspection.

In addition, the inspection socket 50 in the present embodiment can be easily mounted on the interposer 20. That is, in this embodiment, by being coupled by the locking jaw (70a) and the locking portion 32, the inspection socket 50 is merely a single operation of inserting the inspection socket 50 into the interposer 20 It can be mounted to the interposer 20. In addition, the separation of the inspection socket 50 is quite easy because it can be made by a simple operation to lift the inspection socket 50 by lifting the upper side of the latch plate 70 is provided with the locking jaw (70a) with both hands. In addition, there is no need for a separate detachable tool can be easily detachable anywhere anytime. In particular, since the detachment is relatively simple, there is no fear of damaging the expensive motherboard 1 during the detachment.

In addition, the test socket 50 according to the present embodiment has the ejector means 40 which separates the memory module 10 from the test socket 50 of the interposer 20 rather than the left and right sides of the interposer 20. It is located in a direction perpendicular to the longitudinal direction (hereinafter referred to as "front and rear direction"), which is preferable in terms of space efficiency. That is, when the ejection means is located on the left and right sides as in the prior art, a separate electrical element may not be mounted on the motherboard on the left and right sides of the portion where the test socket is placed. On the contrary, the present embodiment solves this problem by placing the ejecting means in the front and rear directions without placing the ejecting means on the left and right sides.

In this embodiment, the metal plate 44 soldered to the motherboard 1 is inserted into the lower end of the ejection means 40. Accordingly, the ejection means 40 is firmly fixed to the motherboard 1 so that it is not easily detached from the motherboard 1.

In the present embodiment, the protrusion 31 protruding from the lower surface of the interposer 20 is provided, and the motherboard 1 is provided with a groove 1a corresponding to the protrusion 31. As the protrusion 31 and the groove 1a are coupled, the interposer 20 may not be easily moved in a horizontal direction with respect to the motherboard 1, and thus may be firmly fixed to the motherboard 1. .

Although the present invention has been described in detail through the embodiments, the present invention is not necessarily limited to these embodiments and modifications, and various modifications can be made without departing from the spirit of the present invention.

The inspection apparatus of the memory module according to the present invention as described above has an advantage of improving the reliability of the inspection by making the distance between the inspection socket and the motherboard equipped with the memory module as short as possible.

Claims (7)

delete In the inspection device of the memory module for electrically testing the memory module by electrically connecting the motherboard provided with a pattern surface and the memory module provided with a plurality of contact terminals to each other, An interposer having a plurality of contact pins soldered to a pattern surface of the motherboard, fixedly coupled to an upper side of the motherboard, and provided with a locking portion; A contactor mounted on an upper side of the interposer and configured to seat the memory module and to make one-to-one electrical contact between the contact terminal of the memory module and the contact pin of the interposer; It is provided with a locking step that is prevented from being separated from the interposer when caught in the locking portion, The interposer, A body portion extending in one direction, A plurality of contact pins arranged along the longitudinal direction of the body portion; And an ejector means installed at both ends of the body part in a direction perpendicular to the longitudinal direction of the body part to eject the memory module from which the test is completed, from the test socket. The method of claim 2, The eject means, A frame part having an insertion groove provided in a direction perpendicular to the longitudinal direction of the body part; It is inserted into the insertion groove is formed long in the longitudinal direction of the insertion groove is composed of an eject lever which is hinged to the center portion in the longitudinal direction so that one end is movable in the vertical direction, One end of the eject lever is moved downward by a memory module inserted into the test socket, and one end of the eject lever moved downward is moved upward to move the memory module in contact with one end of the eject lever upward. Inspection device for a memory module, characterized in that separated from the test socket. In the inspection device of the memory module for electrically testing the memory module by electrically connecting the motherboard provided with a pattern surface and the memory module provided with a plurality of contact terminals to each other, An interposer having a plurality of contact pins soldered to a pattern surface of the motherboard, fixedly coupled to an upper side of the motherboard, and provided with a locking portion; A contactor mounted on an upper side of the interposer and configured to seat the memory module and to make one-to-one electrical contact between the contact terminal of the memory module and the contact pin of the interposer; It is provided with a locking step that is prevented from being separated from the interposer when caught in the locking portion, The locking portion is a pair of locking grooves extending in the longitudinal direction of the interposer and provided on both sides of the interposer, The locking jaw is a test module of a memory module, characterized in that a pair of protrusions extending in the longitudinal direction of the test socket so as to correspond to the locking groove. In the inspection device of the memory module for electrically testing the memory module by electrically connecting the motherboard provided with a pattern surface and the memory module provided with a plurality of contact terminals to each other, An interposer having a plurality of contact pins soldered to a pattern surface of the motherboard, fixedly coupled to an upper side of the motherboard, and provided with a locking portion; A contactor mounted on an upper side of the interposer and configured to seat the memory module and to make one-to-one electrical contact between the contact terminal of the memory module and the contact pin of the interposer; It is provided with a locking step that is prevented from being separated from the interposer when caught in the locking portion, The locking jaw is provided to protrude from the lower side of the inspection socket to face each other at the lower end of the pair of latch plate extending in the vertical direction of the inspection socket and located on both sides of the inspection socket, The upper ends of the pair of latch plates protrude from the upper side of the inspection socket, The central portion in the longitudinal direction of each latch plate is coupled to the inspection socket such that the gaps between the upper and lower ends of the latch plates move in a direction away from each other when the gaps between the upper ends of the latch plates move in a direction close to each other. Inspection device for a memory module, characterized in that. In the inspection device of the memory module for electrically testing the memory module by electrically connecting the motherboard provided with a pattern surface and the memory module provided with a plurality of contact terminals to each other, An interposer having a plurality of contact pins soldered to a pattern surface of the motherboard, fixedly coupled to an upper side of the motherboard, and provided with a locking portion; A contactor mounted on an upper side of the interposer and configured to seat the memory module and to make one-to-one electrical contact between the contact terminal of the memory module and the contact pin of the interposer; It is provided with a locking step that is prevented from being separated from the interposer when caught in the locking portion, A gold plated metal plate is coupled to the lower end of the interposer, and the metal plate is soldered to and fixed to the upper surface of the motherboard. In the inspection device of the memory module for electrically testing the memory module by electrically connecting the motherboard provided with a pattern surface and the memory module provided with a plurality of contact terminals to each other, An interposer having a plurality of contact pins soldered to a pattern surface of the motherboard, fixedly coupled to an upper side of the motherboard, and provided with a locking portion; A contactor mounted on an upper side of the interposer and configured to seat the memory module and to make one-to-one electrical contact between the contact terminal of the memory module and the contact pin of the interposer; It is provided with a locking step that is prevented from being separated from the interposer when caught in the locking portion, The lower end of the interposer is provided with a protrusion protruding from the lower surface, The motherboard has a shape corresponding to the protrusion, the inspection device of the memory module, characterized in that the groove is provided that can be inserted into the projection.

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