KR100884742B1 - Planar lightwave circuitPLC Package using metal-coated optical fiber and method of packaging the same PLC - Google Patents

Abstract

The present invention relates to a flat panel optical circuit package and a flat panel of which an optical fiber is connected to a flat optical circuit through a V-groove, and the flat optical circuit connected to the optical fiber can maintain stability against physical and external environmental changes such as pulling or bending of the optical fiber. Provided is a packaging method of an optical circuit. The planar optical circuit package includes a planar optical wave circuit (PLC) coupled to an optical device case; An optical fiber connected to a flat plate optical circuit and coated with a metal part; And a structure coupled to the optical device case and fixing a metal coated portion of the optical fiber. The flat panel optical circuit package and the flat panel optical circuit packaging method of the present invention can use a flat optical circuit having a short V-groove by fixing a metal coating portion of the optical fiber to the optical fiber fixing structure, and short V-groove Nevertheless, the optical characteristics can be stably maintained while minimizing optical loss or polarization dependence against external physical environment changes such as pulling and bending of optical fibers.

Flat panel optical circuit (PLC), metal-coated fiber, metal ferrule, ceramic ferrule

Description

Planar lightwave circuit (PLC) Package using metal-coated optical fiber and method of packaging the same PLC}

1A and 1B are a plan view and a cross-sectional view of a flat plate optical circuit package in which optical fibers are connected to a conventional V-groove flat plate optical circuit.

2A and 2B are plan and cross-sectional views of a planar optical circuit package in which optical fibers are connected through a fiber array to a conventional planar optical circuit.

3A and 3B are a cross-sectional view and a plan view of a flat panel optical circuit package using a metal coated optical fiber according to a first embodiment of the present invention.

4A and 4B are a cross-sectional view and a plan view of a flat plate optical circuit package using a metal coated optical fiber according to a second embodiment of the present invention.

5A-5C are general optical fiber cross sections, metal coated optical fiber cross sections used in FIG. 3 and metal coated optical fiber cross sections used in FIG. 4.

6A through 6D are cross-sectional views illustrating a method of packaging a flat panel optical circuit using a metal-coated optical fiber according to a third embodiment of the present invention.

<Description of main parts in the drawing>

110,210: Optical element case 120,220: Flat optical circuit

130,230: V-groove 140,240: optical fiber fixing structure

150,250: bonding cover 160,260: soldering material

170,270 plastic stub 180,280 optical fiber

285,340: Ferrule 310: Optical fiber core

320: optical fiber clad 330: metal coating layer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device package, and more particularly, to a flat plate optical circuit package in which an optical fiber is connected to a planar optical wave circuit (PLC) and a packaging method of the flat optical circuit.

At present, optical communication devices are getting faster and improved due to the expansion of the Internet and increasing demands of information users, and the reliability problem of optical devices is always a big concern for users. However, there is still a problem that the price of the optical communication device is higher than the electronic device.

In more detail, the optical communication devices widely used up to now are still being packaged by the method using free space optics. The method using the free-space optical system is to increase the optical coupling efficiency by using a micro lens for the optical coupling between the optical fiber and the optical device, and this method uses an active optical alignment method, so manufacturing cost And disadvantages of having a rise in time.

The optical packaging method using the free-space optical system has an advantage that it is advantageous to manufacture an optical device because many technologies have been accumulated for a long time, but it takes a lot of manufacturing time with the disadvantage that the overall size of the device after packaging can be increased. There is a problem that many optical components are needed. In particular, due to these problems, the method using the free-space optical system eventually leads to an increase in the product price, thereby obstructing the popularization of optical communication devices.

On the other hand, there is a method using a flat panel optical circuit (PLC), there is a method of directly connecting the optical fiber to the flat optical circuit using the V-groove and a method of connecting the optical fiber to the flat optical circuit using the optical fiber array.

1A and 1B are a plan view and a cross-sectional view of a flat plate optical circuit package in which optical fibers are connected to a conventional V-groove flat plate optical circuit.

1A and 1B, the conventional flat panel optical circuit package includes a flat panel optical circuit 30 having a V-groove 31 formed on the optical device case 40, and the V-groove. The optical fiber 42 is connected to 31. On the other hand, a plastic stub 41 for fixing the optical fiber 42 to the optical element case 40 and a coupling cover 32 for facilitating the connection of the optical fiber 42 in the V-groove 31 are provided. Formed.

Such a conventional flat plate optical circuit package has stability in accordance with the physical environment after packaging according to the length of the v-groove 31 formed in the flat plate optical circuit 30 in the connection between the flat plate optical circuit 30 and the optical fiber 42. There is this changing problem. That is, it is advantageous to reduce the size of the optical device in order to reduce the manufacturing cost of the optical device, and accordingly it is advantageous to make the length of the V-groove made in the flat optical circuit smaller. However, a flat plate optical circuit package having a small V-groove and a flat plate optical circuit package assembled with optical fibers are a problem in pulling or bending an optical fiber, such as optical loss or polarization dependant loss. The problem of changing the characteristics of the optical device may appear.

In order to solve this problem, there is a method of increasing the length of the v-groove 42 to increase the adhesion surface between the optical fiber 42 and the flat panel optical circuit 30, but this increases the length of the optical device, which is produced accordingly It causes the disadvantage of lowering the production cost efficiency of the optical device.

2A and 2B are plan and cross-sectional views of a planar optical circuit package in which an optical fiber is connected through a fiber array to a conventional V-grooved planar optical circuit.

Referring to FIGS. 2A and 2B, the flat panel optical circuit package has a flat panel optical circuit 50 coupled to the optical device case 60, similar to FIG. 1A or 1B, and the optical fiber 62 is connected to the flat panel optical circuit 50. Connected. However, the optical fiber 62 is not connected to the flat panel optical circuit 50 through the V-groove, but through the optical fiber array 63. Here, the plastic stub 62 for fixing the optical fiber 62 to the optical element case is formed, and the coupling cover 51 is formed at the connection portion of the optical fiber array 63.

The method using the optical fiber array is a method of manufacturing the optical fiber array 63 and connecting it with the optical waveguide of the flat optical circuit 50, this method of the flat optical circuit 50 is connected to the optical fiber array 63 The cross-sectional area of the optical waveguide portion should be similar to the cross-sectional area of the optical fiber array 63 to facilitate the connection therebetween, and to secure physical stability after the connection. Therefore, after fabricating the flat plate optical circuit 50, the bonding cover 51 formed of a material such as glass or silicon (Si) on the upper portion of the portion that is connected to the optical fiber array 63 and bonded with the optical fiber array In order to improve the optical connection efficiency, the optical waveguide cross section must be polished precisely. However, this method also has a problem in that the overall size of the optical device after packaging is increased, and manufacturing time and unit cost are increased.

Therefore, the technical problem to be achieved by the present invention is that the optical fiber is connected to the flat optical circuit through the V-groove, and the optical fiber and the flat optical circuit connected to the optical fiber can maintain stability against physical and external environmental changes such as pulling or bending of the optical fiber. The present invention provides a flat panel optical circuit package and a packaging method of the flat panel optical circuit.

In order to achieve the above technical problem, the present invention is a planar optical circuit (PLC) coupled to the optical device case; An optical fiber connected to the flat optical circuit and coated with a metal part; And a structure coupled to the optical device case and fixing a metal coated portion of the optical fiber.

In the present invention, the metal may be gold, and the metal coating portion of the optical fiber may be formed around a ferrule of ceramic or metal surrounding the optical fiber. The metal coated portion of the optical fiber may be fixed to the structure through soldering (soldering).

On the other hand, the structure may be coupled to the optical device case through a conductive epoxy, the structure is preferably formed of a metal coated portion of the optical fiber and easy soldering material. The structure has a height such that the height of the optical fiber connected to the flat panel optical circuit is kept constant, and is preferably formed in an appropriate size in consideration of the metal coating part of the optical device case and the optical fiber coupled thereto.

In accordance with another aspect of the present invention, a flat panel optical circuit (PLC) is coupled to an optical device case. Coupling a structure for fixing a portion of the metal-coated optical fiber to the optical device case; Connecting the optical fiber to the plate optical circuit; And fixing the optical fiber to the structure.

In the present invention, the flat panel optical circuit and the structure may be coupled to the optical device case through a conductive epoxy, it is preferable to combine to maintain a horizontal with the optical device case. The metal coating portion of the optical fiber may be formed around a ferrule of a ceramic or metal surrounding the optical fiber, and the optical fiber may be fixed to the structure by soldering.

According to an embodiment of the present invention, a flat panel optical circuit package and a flat panel optical circuit packaging method are connected to a V-groove of an optical signal input / output part of a flat panel optical circuit so that the optical fiber is settled, and the optical device is coated with a metal such as gold. By soldering to the optical fiber fixing structure of the case, the flat optical circuit connected to the optical fiber can stably maintain the optical characteristics against physical and external environmental changes such as pulling and bending of the optical fiber.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention; In the following description, when a component is described as being on top of another component, it may be directly on top of another component, and a third component may be interposed therebetween. In addition, in the drawings, the thickness or size of each component is exaggerated for convenience and clarity of description, and parts irrelevant to the description are omitted. Like numbers refer to like elements in the figures. On the other hand, the terms used are used only for the purpose of illustrating the present invention and are not used to limit the scope of the invention described in the meaning or claims.

3A and 3B are a cross-sectional view and a plan view of a flat panel optical circuit package using a metal coated optical fiber according to a first embodiment of the present invention.

3A and 3B, the flat panel optical circuit package includes a flat panel optical circuit 120 and a flat panel optical circuit 120 having a V-groove 130 coupled to the optical device case 110 and the optical device case 110. A portion connected to the V-groove 130 of the metal-coated optical fiber 180, and the optical fiber fixing structure 140 for fixing the optical fiber 180 to the optical device case 110. Meanwhile, as in the related art, the coupling cover 150 and the plastic stub 170 formed of a material such as glass or silicon may be included.

The flat plate optical circuit 120 on the top of the optical device case 110 may be fixed using an adhesive such as a conductive epoxy, wherein the flat plate optical circuit 120 to maintain a good level with the optical device case 110 It is preferable. In addition, a V-groove 130 is formed as an optical fiber connecting portion of the flat panel optical circuit 120, and the optical fiber 180 is seated in the V-groove 130 to be connected to the flat optical circuit 120. do.

Unlike the related art, the optical fiber 180 is metal-coated by a portion such as gold, and the metal-coated portion is fixed to the optical fiber fixing structure 140 by soldering. As the soldering material 160, a general solder, indium, or the like may be used. The optical fiber 180 is connected to the flat optical circuit 120 through the V-groove 130 of the flat optical circuit 120 as described above. That is, the optical fiber 180 is inserted into the V-groove 130 and fixed to the V-groove 130 by using UV (ultraviolet) or thermosetting epoxy and connected to the flat optical circuit 120. UV or thermosetting epoxy is preferably selected from the material that matches the refractive index of the optical waveguide of the optical fiber 180 and the flat optical circuit 130 to minimize the reflection of light generated between the optical fiber 180 and the optical waveguide.

On the other hand, the optical fiber fixing structure 140 can be fixed to the optical device case 110 through the conductive epoxy, like the flat plate optical circuit 120, the metal-coated portion of the optical fiber 180 above the optical fiber fixing structure 140 This is combined through soldering. Therefore, the optical fiber fixing structure 140 is preferably formed by selecting a material that can be well soldered to the metal-coated portion of the optical fiber 180.

The height of the optical fiber fixing structure 140 is manufactured in consideration of the height of the optical fiber 180 connected to the flat plate optical circuit 120. For example, the optical fiber 180 connected to the flat panel optical circuit 120 forms the optical fiber fixing structure 140 at a height that can be leveled on the optical device case 110. In addition, the size of the optical fiber fixing structure 140 is manufactured considering the length of the metal-coated optical fiber and the length of the optical device case. For example, it is manufactured to a size that can be included inside the optical device case 110, it is preferably formed wider than the metal-coated portion of the optical fiber to be bonded. Meanwhile, the optical fiber fixing structure 140 may be manufactured by integrally manufacturing the optical device case 110 and coating a material that is well soldered.

In the flat panel optical circuit package of the present embodiment, a portion of the optical fiber is metal-coated and the portion is fixed to the optical device case 110 through the optical fiber fixing structure 140, so that a short length V-groove structure can be used, It is possible to maintain durability against external physical environment changes such as pulling or bending, ie, minimizing light loss or polarization dependent loss, thereby stably maintaining optical characteristics of the flat panel optical circuit package.

4A and 4B are a cross-sectional view and a plan view of a flat plate optical circuit package using a metal coated optical fiber according to a second embodiment of the present invention.

4A and 4B, the flat panel optical circuit package of the present embodiment is similar to the first embodiment, and the optical device case 210, the flat panel optical circuit 220 having the V-groove 230, and a portion of the flat optical circuit package Coated optical fiber 280, and optical fiber fixing structure 140. However, the structure of the metal-coated portion of the optical fiber 280 is different from that of the first embodiment. That is, the optical fiber 280 is surrounded by a ferrule 285 of ceramic or metal, and a metal such as gold is coated outside the ferrule 285.

The ferrule 285 protects the optical fiber 280 when the optical fiber 280 is connected to the flat optical circuit 220, and more stably fixes the optical fiber in the flat optical circuit package. In addition, the PLD 220 and the optical fiber fixing structure 240 are connected to the optical device case 210, and the metal coating portion of the optical fiber 280 is fixed to the optical fiber fixing structure 240 by soldering using the soldering material 260. , The connection of the optical fiber to the plate optical circuit 220 through the V-groove 230, and the material and size of the optical fiber fixing structure are the same as in the first embodiment. In addition, the plastic stub 270 and the bonding cover 250 formed of a material such as glass or silicon may be formed in the flat panel optical circuit package.

In this embodiment, a metal coating is applied to the optical fiber on which the ferrule is formed, and the metal coating portion is fixed to the optical fiber fixing structure 240 so that the flat plate optical circuit package can stably maintain optical characteristics against external physical environment changes.

5A-5C are general optical fiber cross sections, metal coated optical fiber cross sections used in FIG. 3 and metal coated optical fiber cross sections used in FIG. 4.

5A shows a cross section of a typical optical fiber, which includes a core 310 through which light passes and a clad 320 surrounding the core. 5B shows an optical fiber used in the first embodiment, wherein the optical fiber includes a metal coating layer 330 coated with a metal outside the clad 320. The metal coating layer 330 is formed only in the portion that is coupled to the optical fiber fixing structure. Meanwhile, gold, aluminum, and the like, which are easily soldered, may be used as the metal to be coated.

FIG. 5C illustrates an optical fiber according to the second embodiment. Unlike the first embodiment, the optical fiber includes a ferrule 340 formed of a ceramic or a metal outside the clad 320, and the metal coating layer 330 includes the ferrule 340. ) Is formed outside.

6A through 6D are cross-sectional views illustrating a method of packaging a flat panel optical circuit using a metal-coated optical fiber according to a third embodiment of the present invention.

Referring to FIG. 6A, first, a flat plate optical circuit 120 is fixed on an optical device case 110 for packaging an optical device using an adhesive such as a conductive epoxy. At this time, the flat plate optical circuit 120 to maintain the horizontal well with the optical device case (110). At this time, the V-groove 130 is already formed in the flat plate optical circuit 120.

Referring to FIG. 6B, the optical fiber fixing structure 140, which may be well soldered, is fixed to a position where the metal-coated portion of the optical fiber is located on the optical fiber 180 using an adhesive such as a conductive epoxy. As described above, the optical fiber fixing structure 140 selects a metal that is coated with a metal such as gold and a material that can be well soldered, and the height of the optical fiber fixing structure 140 is inserted into the flat optical circuit 120. It is produced considering the height. In addition, the size of the optical fiber fixing structure 140 is manufactured in consideration of the length of the metal-coated portion of the optical fiber 180 and the length of the optical device case. On the other hand, such an optical fiber fixing structure 140 may be manufactured by coating a material that is manufactured together with the case 110 integrally and well soldered.

Referring to FIG. 6C, an optical fiber is inserted into the V-groove 130 of the plate optical circuit 120, and a coupling cover 150 formed of glass or silicon is placed on the plate optical circuit 120 to place the optical fiber ( 180 and the connection of the flat panel optical circuit 120 to facilitate. In more detail, first, the optical fiber 180 is inserted into the V-groove 130 to contact the cross section of the optical fiber 180 to the position where the cross section of the input / output optical waveguide of the flat plate optical circuit 120 exists, and then the coupling cover ( 150, a UV or thermosetting epoxy is inserted therebetween, and then cured to connect the optical fiber 180 to the flat optical circuit.

At this time, the epoxy is well matched to the refractive index of the optical waveguide of the optical fiber 180 and the optical waveguide of the flat optical circuit 120 into the V-groove 130 in the V-groove 130 made in the flat optical circuit 120. It is desirable to minimize reflection of light generated between the optical fiber 180 and the optical waveguide. The epoxy used herein may also use UV or thermoset epoxy.

Referring to FIG. 6D, the metal-coated portion of the optical fiber 180 coated with metal such as gold is fixed on the optical fiber fixing structure 140 formed on the optical device case 110 through soldering. Here, the soldering material 160 may use a general solder or indium.

More specifically, the solder is placed on a metal-coated portion of the fiber and soldered using the iron. When soldering, heating the optical fiber 180 with the iron for too much time may be affected, such as breaking the optical fiber 180 by thermal shock, so it is preferable to perform with the appropriate time and the appropriate temperature. On the other hand, the plastic stub 170 may be formed at the end of the optical device case to support the optical fiber 180, of course.

In the present embodiment, the method of forming the flat panel optical circuit package of the first embodiment has been described, but the flat panel optical circuit package of the second embodiment can also be formed by the same method. That is, the only difference is that the optical fiber 280 includes a ferrule 285 formed of ceramic or metal, and the metal coated portion of the ferrule 285 is fixed on the fixing structure 240. In addition, the process sequence, the method, material, etc. which are used for each process are as having demonstrated in 3rd Example.

 By packaging a flat panel optical circuit in the same manner as in the present embodiment, a short length V-groove structure can be used, and a flat panel optical circuit capable of stably maintaining optical characteristics against external physical environment changes such as pulling or bending of optical fibers. The package can be easily produced.

So far, the present invention has been described with reference to the embodiments shown in the drawings, which are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. will be. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

As described in detail above, the flat plate optical circuit package according to the present invention may use a flat plate optical circuit having a short V-groove by fixing a metal coating portion of the optical fiber to the optical fiber fixing structure, and short V-groove. Nevertheless, the optical characteristics can be stably maintained while minimizing optical loss or polarization dependence on external physical environment changes such as pulling and bending of optical fibers.

In addition, the packaging method of the flat panel optical circuit of the present invention is easy to manufacture, the manufacturing time is relatively short, and short length of the V-groove can be used, it is possible to reduce the size of the optical device as a whole, thereby The production cost can be reduced.

Claims (12)

A planar optical wave circuit (PLC) coupled to the optical device case; An optical fiber connected to the flat optical circuit and coated with a metal part; And Is coupled to the optical device case spaced apart from the plate optical lime, Flat optical circuit package using a metal-coated optical fiber comprising a; optical fiber fixing structure for fixing the metal-coated portion of the optical fiber. According to claim 1, And said metal is gold. Flat plate optical circuit package using a metal-coated optical fiber. According to claim 1, The flat optical circuit has a V-groove (V-groove) is formed, And wherein the optical fiber is connected to the V-groove through UV (ultraviolet) or thermosetting epoxy. According to claim 1, The metal coating portion of the optical fiber is a flat plate optical circuit package using a metal-coated optical fiber, characterized in that formed in the outer periphery (ferrule) of the ceramic or metal surrounding the optical fiber. The method according to claim 1 or 4, The optical fiber is a flat plate optical circuit package using a metal-coated optical fiber, characterized in that the metal-coated portion is fixed by soldering (soldering) to the structure. According to claim 1, The structure is coupled to the optical device case through a conductive epoxy, The structure is a flat plate optical circuit package using a metal-coated optical fiber, characterized in that formed of a metal-coated portion of the optical fiber and easy soldering material. The method of claim 6, The structure has a height such that the height of the optical fiber connected to the planar optical circuit is kept constant, The structure has a size that can be included above the optical device case, a flat plate optical circuit package using a metal-coated optical fiber, characterized in that the size larger than the metal-coated portion of the optical fiber. Coupling a flat panel optical circuit (PLC) to the optical device case; A portion of the optical fiber fixing structure for fixing the metal-coated optical fiber to be spaced apart from the flat optical circuit Coupling to the optical device case; Connecting the optical fiber to the plate optical circuit; And And fixing the optical fiber to the structure. The method of claim 8, And coupling the flat panel optical circuit and the structure to the optical device case through a conductive epoxy, wherein the flat panel optical circuit and the structure are coupled so as to be horizontal with the optical device case. The method of claim 8, The flat optical circuit is formed with a V-groove, And connecting the optical fiber to the V-groove through a UV or thermosetting polymer. The method of claim 8, The metal coating portion of the optical fiber is a flat plate optical circuit packaging method, characterized in that formed around the ferrule (ferrule) of the ceramic or metal surrounding the optical fiber. The method according to claim 8 or 11, wherein And packaging the optical fiber by soldering the structure to the structure.

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