KR100884389B1 - 3 axes hall sensor and manufacturing method of the 3 axes hall sensor - Google Patents

Abstract

The present invention relates to a three-axis Hall sensor and a manufacturing method thereof that can be sensed in the three-axis direction without setting the sensor in the X-axis and Y-axis, the three-axis Hall sensor of the present invention; A derivative formed horizontally on the substrate to induce a geomagnetic field; And at least three Hall sensor chips installed on an upper surface of the derivative on an upper surface of the substrate and installed to have a geomagnetic field sensing direction perpendicular to a direction in which the derivative is formed.

According to the present invention of the configuration, it is possible to manufacture in a much simpler method than the conventional method because the sensing in the three-axis direction can be installed even in the horizontal state without setting the Hall sensor in the X-axis and Y-axis.

Description

3-axis hall sensor and its manufacturing method {3 axes hall sensor and manufacturing method of the 3 axes hall sensor}

1 is an external perspective view of a typical Hall sensor;

2 is a configuration diagram for detection in the X-axis and Y-axis directions of a general hall sensor;

3 is a view for explaining a change in the magnetic flux by the derivative employed in the present invention,

4 and 5 are views for explaining the configuration of the three-axis Hall sensor according to an embodiment of the present invention,

6 is a view showing a simulation result of the magnetic flux of the Hall sensor chip of the three-axis Hall sensor of the present invention,

7 is an output waveform diagram of a Hall sensor chip in the 3-axis Hall sensor of the present invention;

8 is a view for explaining the correlation between the connection type and the rectangular coordinates of the Wei-shaped in the present invention,

9 is a conceptual diagram of a coordinate system of a semiconductor component according to an example of the present disclosure;

10 is a flowchart for explaining a software algorithm for coordinate transformation employed in the description of the present invention;

FIG. 11 is a waveform diagram illustrating conversion of output characteristics of a 3-axis Hall sensor according to an example of the present invention into an output of a rectangular coordinate system.

<Description of Symbols for Major Parts of Drawings>

22: first substrate 24: second substrate

26 substrate 28 derivative

30: Hall sensor chip 32: molding part

The present invention relates to a three-axis Hall sensor and a method of manufacturing the same, and more particularly to a three-axis Hall sensor and its manufacturing method that can be manufactured in simpler than the conventional three-axis Hall sensor using a Hall sensor.

Sensor is a general term for a device that performs a function of converting one physical and chemical amount into another physical and chemical amount, and is widely used for precision measurement, production automation, and automatic control.

Recently, a car navigation device equipped with a GPS (Global Positioning System) receiver and a portable terminal having a navigation function have been equipped with an orientation sensor.

The orientation sensor displays the orientation by measuring the earth's magnetic field, which is one of the micro magnetic fields. The method of measuring orientation by measuring the earth's magnetic field, which is one of the fine magnetic fields, is based on displaying three-axis components of the earth's magnetic field at a position parallel to the earth's surface. The magnetic field detection method used in the micro magnetic field detection sensor is generally classified into a flux gate method, a DC magnetoresistance (MR) effect method, a magneto-impedance (MI) effect method, and a hall effect method. Are classified into branches.

However, the sensor using the flux gate method, as proposed in Japanese Patent Application Laid-Open Nos. 9-43322 and 11-118892, has been described as forming and plating / laminating and forming magnetic materials and copper foil patterning and through-holes for seven limited size substrates. It is difficult to apply to small portable devices such as mobile phones due to complex manufacturing, high power consumption, and miniaturization.

In addition, the sensor using the DC magnetoresistance effect method can be miniaturized, but the output signal is small and requires a lot of amplification, thereby causing problems such as noise.

In addition, the sensor using the magnetic impedance effect method has an output signal that is about 50 to 100 times larger than the DC magnetoresistance effect sensor. However, since a high frequency AC current is used, severe noise and circuit configuration are difficult.

In addition, since the Hall sensor using the Hall effect method uses a direct current, the noise is small, and the manufacturing process also uses a semiconductor process, so production is easy and the size is small, and thus the chip size may be manufactured. The Hall sensor has a low sensitivity, making it difficult to apply to measuring the earth's magnetic field. However, the Hall sensor has been recently developed and applied to measure the earth's magnetic field.

In general, the hall sensor has a directivity (detection direction) of a detection for detecting a magnetic field in a specific direction (that is, a direction incident on the upper part of the hall sensor 10) as illustrated in FIG. It has a characteristic of outputting a weak voltage according to the magnitude. Therefore, in order to detect the X axis of the earth's magnetic field using the hall sensor 10, a process of standing the hall sensor 10 of FIG. 1 at 90 degrees as shown in FIG. 2A is required. At this time, if the hall sensor 10 is set to be out of 90 degrees, it causes an error of the sensor and generates an error of orientation. In addition, it is impossible to maintain 90 degrees accurately in the manufacturing process. And, the Hall sensor 10 made as shown in (b) of FIG. 2 is again divided into the X-axis and the Y-axis should be positioned to be 90 degrees to each other when the angle between the X-axis and the Y-axis deviates from 90 degrees also this orientation error Will result. In addition, it is impossible to maintain an exact 90 degrees in the manufacturing process. Therefore, when these two errors overlap, a considerably large azimuth error is generated, and a correction is also almost impossible, and it has a fatal defect that makes accurate azimuth measurement difficult as an azimuth sensor.

The present invention has been proposed to solve the above-described problems, and an object thereof is to provide a three-axis hall sensor and a manufacturing method thereof capable of sensing in three axis directions without setting the sensor in the X and Y axes. .

Another object of the present invention is to provide a three-axis Hall sensor and a method of manufacturing the same that can more accurately measure the direction and size of the fine magnetic field.

In order to achieve the above object, a semiconductor component according to an embodiment of the present invention includes a substrate; A derivative formed horizontally on the substrate to induce a geomagnetic field; And at least three Hall sensor chips installed on an upper surface of the derivative on an upper surface of the substrate and installed to have a geomagnetic field sensing direction perpendicular to a direction in which the derivative is formed.

The substrate is formed of an insulating first substrate and a second substrate, and the derivative is patterned on the first substrate, and the second substrate is laminated on the first substrate on which the derivative is patterned. It features.

The derivative is made of any one of a cross shape, a Weiza shape, and a triangular shape.

The at least three Hall sensor chips are spaced apart from each other at equal intervals.

The center of the bottom surface of the at least three Hall sensor chips is opposite to the upper surface of each end of the derivative.

On the other hand, a method of manufacturing a semiconductor component according to an embodiment of the present invention, the first process of forming a derivative to induce an external magnetic field on the first substrate; A second process of forming a base substrate by stacking a second substrate on an upper surface of the first substrate on which the derivative is formed; And a third process of installing at least three Hall sensor chips on the upper surface of the base substrate, and installing the upper portion of the derivative so as to have a geomagnetic field sensing direction perpendicular to the direction of formation of the derivative.

In the first step, the derivative may have any one of a cross shape, a Weiza shape, and a triangular shape.

In the third process, the at least three Hall sensor chips are spaced apart from each other at equal intervals.

In the third process, the center of the bottom surface of the at least three Hall sensor chips is opposite to the upper surface of each end of the derivative.

Before describing an embodiment of the present invention, magnetic induction and magnetic amplification employed in the present invention will first be described.

When the high magnetic permeability magnetic body 20 is placed in a uniform magnetic field as shown in FIG. 3, magnetic induction B is defined as in Equation 1 below.

     B = H + 4πM (Equation 1)

Here, H is the intensity of the purely applied magnetic field, and M is the magnetic moment of the material (magnetic body 20) existing under the applied magnetic field. Therefore, the magnetic induction B under the constant H of the magnetic field is dependent on the magnetic moment of the magnetic body 20, that is, magnetic permeability.

In addition, as shown in FIG. 3, the magnetic field is focused by the magnetic body 20, and as the direction is deformed toward the magnetic body 20, the maximum magnetic flux distortion appears at both ends of the magnetic body 20 and the magnetic flux density also increases. It can be seen that. There is a kind of self-amplification. Herein, the magnetic gain ratio (G _M ) according to the applied magnetic field and the magnetic permeability of the magnetic body 20 may be defined as in Equation 2 below.

G _M = B / B ₀ (Equation 2)

Here, B is magnetic induction induced in the magnetic body 20, B ₀ is magnetic induction in the air.

Therefore, the ratio G _M of magnetic induction becomes a value proportional to the magnetic permeability of the magnetic body 20 and can be said to be the magnitude of magnetic amplification. Magnetic amplification depends on the aspect ratio defined by the position of the magnetic body 20 and the ratio of thickness t to length L.

Assuming that the magnetic body 20 is a flat plate-shaped ellipse in the structure as shown in FIG. 3, the anti-magnetic field coefficient is given by Equation 3 below when a magnetic field is applied in the long axis direction of the ellipse.

(식 3)

(Equation 3)

Where L is the length of the elliptic long axis and t is the thickness of the magnetic body 20. When the anti-magnetic field is expressed as described above, the magnetic induction B _{i in} the magnetic body 20 is expressed as in Equation 4 below.

(식 4)

(Equation 4)

Thus, if the infinitely close to both ends of the magnetic material of the elliptical surface as the magnetic induction B _S can be expressed in B B ≒ _{S i,} wherein the self-amplification (G _M) are shown in the following formula 5.

(식 5)

(Eq. 5)

Therefore, magnetic amplification at both ends of the magnetic material with a constant permeability becomes inversely proportional to the ratio of thickness to length, t / L. Therefore, as the length becomes infinitely longer than the thickness, the magnetic amplification increases.

As described above, the present invention is implemented based on the above-described theory.

(Example)

Hereinafter, a semiconductor component and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the accompanying drawings.

In the following description, a three-axis sensor made of a combination of hall sensors is an example of a three-axis hall sensor described in the detailed description and claims. The protection scope of the present invention extends to a three-axis hall sensor to which the technical idea described below can be applied. Hall sensors are typical of Hall sensors in which a Hall element is formed on a ferrite substrate and ferrite yokes are installed on it to focus the geomagnetic field, thereby amplifying the output. A sensor for measuring the magnetic field in the vertical direction of or a Hall sensor manufactured in a form different from the form suggested in the present invention may be employed.

4 and 5 are views for explaining the configuration of the three-axis Hall sensor according to an embodiment of the present invention, Figure 6 is a view showing the results of the simulation of the magnetic flux of the Hall sensor chip of the three-axis Hall sensor of the present invention to be. In particular, Figure 5 is a cross-sectional view of a portion in Figure 4, for example, it can be understood that the left end portion of the derivative 28 in Figure 4 (a).

The triaxial hall sensor of the present invention includes a substrate 26; A derivative 28 formed horizontally on the substrate 26 and inducing a geomagnetic field; The Hall sensor chip 30 is installed above the derivative 28 on the upper surface of the substrate 26 and is installed horizontally on the geomagnetic field to detect the geomagnetic field induced in the vertical direction by the derivative 28. ); And a molding part 32 formed on an upper surface of the substrate 26 on which the hall sensor chip 30 is installed.

Here, the substrate 26 is composed of a first substrate 22 and a second substrate 24 made of an insulator. In the embodiment of the present invention, a printed circuit board will be used as the substrate 26. However, the printed circuit board is not limited to the printed circuit board.

The derivative 28 is provided between the first substrate 22 and the second substrate 24.

The derivative 28 is a high permeability magnetic material having a magnetic permeability of approximately 1000 or more, and is made of a material selected from a group of metals including amorphous, permalloy, supermalloy, invar, etc. containing Co, Fe, or Ni.

The derivative 28 may have a cross shape as shown in Fig. 4A, a wise shape as shown in Fig. 4B, or may have a triangular shape as shown in Fig. 4C. Of course, the shape of the derivative | guide_body 28 may be shapes other than the shape shown in FIG. 4 (for example, square shape etc.).

For example, when the derivative 28 has a cross shape as shown in FIG. 4A or a Weiza shape as shown in FIG. 4B, the Hall sensor chip is formed on the upper surface of each end portion of the derivative 28. Place (30). On the other hand, if the derivative 28 is a triangular shape as shown in (c) of FIG. 4, the Hall sensor chip 30 is positioned on the upper surface of each corner of the derivative (28). At this time, when determining the position of the Hall sensor chip 30, the upper surface of each end portion (end portion) or the corner of the derivative 28 is located at the bottom center of each Hall sensor chip 30. It is preferable. Because the Hall sensor is a sensor for measuring the density of the magnetic flux passing in the vertical direction of the sensor, the present invention is mainly directed to the measurement of the magnetic flux passing in the horizontal direction of the Hall sensor in the vertical direction of the Hall sensor, the derivative This is because the magnetic flux traveling horizontally is maximized in the vertical direction of the hall sensor when the distal end or corner of (28) is in the center of the hall sensor.

Conventionally, in order to detect the X-axis and the Y-axis, a process in which the Hall sensor must be set at 90 degrees in the plane is required, but the present invention adopts a method of inducing and detecting a geomagnetic field by the derivative 28 as shown in FIG. The process is omitted so that the process and errors required for it are eliminated. In addition, since the process of positioning the sensor which is set at 90 degrees in the plane again as the orthogonal X-axis and the Y-axis like the conventional Hall sensor is omitted, the error of the output according to the process error can be minimized, and the process is also simple and bulky. The production becomes quite easy.

Three or four Hall sensor chips 30 are installed above the derivative 28. For example, if the derivative 28 has a cross shape, four Hall sensor chips 30 are provided on the upper surface of each end portion (end portion) of the derivative 28, and the derivative 28 has a Weiza shape or If it is triangular shape, three Hall sensor chips 30 are provided in the upper end of each end part (end part) or each edge of the derivative | guide_body 28. As shown in FIG.

Methods of manufacturing the semiconductor component of the present invention configured as described above may be various, one of which will be described as follows.

First, the derivative 28 is pressed onto the first substrate 22 made of an insulator at about 5 to 100 kg / cm 2 using a hot press of about 100 to 300 ° C., and then pressed for about 30 minutes to 3 hours. do.

Thereafter, the derivative 28 on the first substrate 22 thus compressed is patterned into a desired shape (eg, a cross shape, a Weiza shape, a triangular shape, etc.) through etching.

Then, the second substrate 24 made of an insulator and the copper foil (not shown) were pressurized at about 5 to 100 Kg / cm 2 using a hot press of about 100 to 300 ° C. in sequence, and then, at about 30 minutes to 3 hours. Squeeze for about an hour. The copper foil (not shown) on the second substrate 24 forms a circuit through etching and drill, and finishes the production of the substrate 26 by Ni plating and Au plating.

The Hall sensor chip 30 is positioned on the finished substrate 26. For example, if the derivatives 28 formed in the substrate 26 are cross-shaped as shown in Fig. 4A or Wei-shaped as shown in Fig. 4B, each end portion (end) of the derivative 28 is formed. The center of the bottom surface of the Hall sensor chip 30 is positioned to face the top surface. In addition, when the derivative 28 is triangular as shown in FIG. 4C, the center of the bottom surface of the Hall sensor chip 30 is disposed to face the upper surface of each corner of the derivative 28.

After that, the wire bonding to the Hall sensor chip 30 is performed to connect with a circuit, and then the molding unit 32 is formed by epoxy molding, thereby completing the manufacture of the 3-axis Hall sensor in the present invention.

In the triaxial Hall sensor of the present invention manufactured by the above-described manufacturing method as an example, three Hall sensor chips 30 are provided at respective positions. The Hall sensor chip 30 is installed horizontally in the geomagnetic field to detect and output the geomagnetic field induced in the vertical direction by the derivative 28, the output ha (X axis), hb (Y Axis), and the output waveform for hc (Z axis) becomes like the waveform illustrated in FIG. In FIG. 7, the outputs of ha, hb, and hc can be converted into the X, Y, and Z axes of the rectangular coordinate system through a predetermined calculation.

In the three-axis hall sensor of the present invention, a processor such as a microcomputer (not shown) capable of extracting angle information (that is, orientation information) from the output waveforms of ha, hb, and hc as shown in FIG. Of course, the microcomputer may be external. By the operation at the microcomputer, it is possible to extract three-axis information of the rectangular coordinate system.

According to the semiconductor component of the present invention described above, it is possible to extract three-axis information of the Cartesian coordinate system by different simple calculations according to the shape of the derivative 28, that is, the cross shape, the Weiza shape, and the triangular shape. Their correlation is shown in FIG. The equation used for correlation is

In the case of the cross type, the value of the fixed coordinate system can be sufficiently extracted as shown in Equation 6 below through a very simple algebraic operation.

(식 6)

(Equation 6)

Here, X1 _out and X2 _out are outputs of a pair of Hall sensor chips facing each other, and Y1 _out and Y2 _out are outputs of another pair of Hall sensor chips aligned at the remaining 90 degrees.

In the case of the Y-shape, it is composed of a complex equation, but it can be converted into a simple equation as shown in Equation 7 below. As shown in FIG. 9, if the axes X and A coincide and the vector H is defined,

(식 7)

(Eq. 7)

,

,

는 각 축을 나타내는 단위벡터이다. 이를 balanced three phase로 가정하면 하기의 식 8과 같이 된다. Becomes Here, ha, hb, hc represent the output magnitude of each axis of the 3-axis Hall sensor with a Wei-shaped or triangular derivative

,

,

Is a unit vector representing each axis. Assuming this is a balanced three phase, Equation 8 is given below.

(식 8)

(Eq. 8)

On the complex horizontal plane, the vector ht is expressed in the form as shown in Equation 9 below.

(식 9)

(Eq. 9)

here,

(식 10)

(Eq. 10)

Becomes

= hx ,

= hy가 가능하다. If we convert this to Cartesian coordinate system, if we use Cartesian axes of x and y

= hx,

= hy is possible

In addition, when said Formula 8 is synthesize | combined with Formula 10, it will become following formula 11.

(식 11)

(Eq. 11)

Here, hx = ha, so K = 2/3.

Therefore, said Formula 10 becomes like following Formula 12.

(식 12)

(Eq. 12)

If it is not balanced three phase,

로 정의한다면 (여기서

는 불균형을 나타내는 벡터임) 하기의 식 13과 같이 된다.

If you define as (where

Is a vector representing an imbalance).

(식 13)

(Eq. 13)

,

,

은 수평면상에 투영된 Y형 또는 삼각형 a,b,c축의 투영벡터이다. 상기의 식 13에 의하여 x, y, z의 3축 직교좌표계로 환산된 각 벡터의 값들은 하기의 식 14와 같이 변경되어진다.In equation 13,

,

,

Is the projection vector of the Y or triangle a, b, and c axes projected on the horizontal plane. According to Equation 13, values of each vector converted into three-axis rectangular coordinate systems of x, y, and z are changed as shown in Equation 14 below.

(식 14)

(Eq. 14)

As a result, the values of the three axes of the rectangular coordinate system are obtained by simple algebraic operations.

In addition, hz is a trigonal shape of the derivative 28 also has the same characteristics as the Weiza shape, the equation to obtain is also the same.

The above-described embodiment of the present invention can convert the value into angular information and prove its performance through the algorithm described in the flowchart of FIG. 10. The core of the algorithm is in the simple algebraic operation described above, and a process for adjusting the offset and scale is required as a preprocessing operation. The preprocessing operation can be sufficiently computed by accepting the output of the 3-axis Hall sensor at an initial constant time. Based on this, the preprocessing operation can be directly driven by the azimuth operation without the preprocessing operation.

In other words, it is assumed that the derivative 28 is in a Wei-shape, and it is assumed that the angle information is extracted by calculating the output of the 3-axis Hall sensor in a microcomputer (not shown). First, the output size Ha, Hb, Hc of the three-axis Hall sensor is represented by the waveform as shown in Figure 7 (S10). The microcomputer corrects the offset and the gain with respect to the output value (S12). Then, the microcomputer converts the output values of ha, hb and hc whose offset and gain are corrected into the values of the rectangular coordinate system (S14). After that, the microcomputer re-adjusts the offset and gain with respect to the value of the converted Cartesian coordinate system, and then performs angle estimation inverse transformation to obtain angle information (S16 and S18). Finally, the microcomputer displays the obtained angle information (S20). In order to display the angle information, the three-axis hall sensor may be provided with a display unit, or may be sent to the external display unit to display the angle information. Matters related to the display unit are easily understood by those skilled in the art and will not be described in detail.

FIG. 11A is a graph showing the output of a three-axis hall sensor manufactured in a wiser form, and FIG. 11B is a microcomputer using the output (FIG. 11A) of the three-axis hall sensor. Graph converted to Cartesian coordinate system. The error of the angular information is shown to be good within a maximum of 5 degrees, which is comparable to the existing three-axis Hall sensors, or at the same level of performance, it is possible to fully develop and mass produce the actual product.

On the other hand, the present invention is not limited only to the above-described embodiments and can be carried out by modifications and variations within the scope not departing from the gist of the present invention, and the technical spirit to which such modifications and variations are applied also belongs to the following claims. Must see

As described in detail above, according to the present invention, it is possible to manufacture in a much simpler method than the conventional method because the sensing in the three-axis direction can be installed even in the horizontal state without setting the hall sensor in the X-axis and Y-axis.

In addition, the output of the three-axis Hall sensor is also maximized, it is possible to more accurately measure the direction and size of the fine magnetic field.

Claims (9)

delete delete A substrate composed of an insulating first substrate and a second substrate; A derivative formed in a Wei-shaped or triangular shape horizontally on the substrate to induce a geomagnetic field; And It is installed on the upper surface of the substrate asymmetrically on top of the derivative, including three Hall sensor chips installed to have a direction of detecting the earth magnetic field perpendicular to the direction of formation of the derivative, 3. The triaxial hall sensor of claim 1, wherein the derivative is patterned on the first substrate, and the second substrate is stacked on the first substrate on which the derivative is patterned . delete The method according to claim 3, The center of the bottom surface of the three Hall sensor chips is opposed to the upper surface of each end of the derivative. delete Forming a derivative which induces an external magnetic field on the first substrate in a Wei-shaped or triangular shape; A second process of forming a base substrate by stacking a second substrate on an upper surface of the first substrate on which the derivative is formed; And And a third process of installing three Hall sensor chips asymmetrically on the upper surface of the base substrate, and installing the upper part of the derivative so as to have a magnetic field sensing direction perpendicular to the direction of formation of the derivative. Method of manufacturing 3-axis Hall sensor. delete The method according to claim 7, In the third process, the center of the bottom surface of the three Hall sensor chip to face the upper surface of each end portion of the derivative.

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