KR100882410B1 - 나노 화학기상증착 다이아몬드 소재를 이용한 경면 가공용 다이아몬드 공구의 제조방법 - Google Patents
나노 화학기상증착 다이아몬드 소재를 이용한 경면 가공용 다이아몬드 공구의 제조방법 Download PDFInfo
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- KR100882410B1 KR100882410B1 KR1020050054254A KR20050054254A KR100882410B1 KR 100882410 B1 KR100882410 B1 KR 100882410B1 KR 1020050054254 A KR1020050054254 A KR 1020050054254A KR 20050054254 A KR20050054254 A KR 20050054254A KR 100882410 B1 KR100882410 B1 KR 100882410B1
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- diamond
- tool
- cvd diamond
- nano
- cvd
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims (3)
- 화학기상증착(CVD) 다이아몬드를 사용하는 경면가공용 공구제조에 있어서,다이아몬드의 입자크기는 다이아몬드막 내에서 균일한 크기로 1 마이크로미터 (micrometer)이하를 가지며, 다이아몬드막의 두께는 30 마이크로미터 이상 2 미리미터 이하를 특징으로 하고 표면조도가 Ra=0.1㎛ 이하로 연마된 CVD 다이아몬드 소재를 사용하여 공구를 제조하는 방법.
- 청구항 1에 있어서, 가공된 피삭재의 가공조도가 Ra=0.2㎛이하 또는 Rmax=1.0㎛이하인 공구제조법.
- 청구항 1에 있어서, 경면가공된 피삭재의 재질이 금속 또는 프라스틱인 공구제조법.
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KR1020050054254A KR100882410B1 (ko) | 2005-06-23 | 2005-06-23 | 나노 화학기상증착 다이아몬드 소재를 이용한 경면 가공용 다이아몬드 공구의 제조방법 |
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KR1020050054254A KR100882410B1 (ko) | 2005-06-23 | 2005-06-23 | 나노 화학기상증착 다이아몬드 소재를 이용한 경면 가공용 다이아몬드 공구의 제조방법 |
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KR20070087709A KR20070087709A (ko) | 2007-08-29 |
KR100882410B1 true KR100882410B1 (ko) | 2009-02-05 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03277424A (ja) * | 1990-03-23 | 1991-12-09 | Mitsubishi Materials Corp | ダイヤモンド被覆切削工具の製造法 |
JPH0592307A (ja) * | 1991-09-30 | 1993-04-16 | Sumitomo Electric Ind Ltd | ダイヤモンド多結晶体切削工具およびその製造方法 |
KR950004663B1 (ko) * | 1990-10-08 | 1995-05-04 | 스미또모 덴끼 고교 가부시끼가이샤 | 다결정 다이아몬드를 사용한 절삭공구 및 그 제조 방법 |
KR950007672B1 (ko) * | 1991-11-07 | 1995-07-14 | 스미토모덴키코교 가부시키가이샤 | 다결정 다이아몬드 절삭공구 및 이의 제조방법 |
KR20050030991A (ko) * | 2003-09-27 | 2005-04-01 | 한국야금 주식회사 | 절삭공구용 다이아몬드 코팅막의 형성방법 |
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2005
- 2005-06-23 KR KR1020050054254A patent/KR100882410B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03277424A (ja) * | 1990-03-23 | 1991-12-09 | Mitsubishi Materials Corp | ダイヤモンド被覆切削工具の製造法 |
KR950004663B1 (ko) * | 1990-10-08 | 1995-05-04 | 스미또모 덴끼 고교 가부시끼가이샤 | 다결정 다이아몬드를 사용한 절삭공구 및 그 제조 방법 |
JPH0592307A (ja) * | 1991-09-30 | 1993-04-16 | Sumitomo Electric Ind Ltd | ダイヤモンド多結晶体切削工具およびその製造方法 |
KR950007672B1 (ko) * | 1991-11-07 | 1995-07-14 | 스미토모덴키코교 가부시키가이샤 | 다결정 다이아몬드 절삭공구 및 이의 제조방법 |
KR20050030991A (ko) * | 2003-09-27 | 2005-04-01 | 한국야금 주식회사 | 절삭공구용 다이아몬드 코팅막의 형성방법 |
Non-Patent Citations (2)
Title |
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1000931710000* |
1020050030991* |
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