KR100881285B1 - Cooling apparatus of wasted-plastic chips manufacture system - Google Patents

Cooling apparatus of wasted-plastic chips manufacture system Download PDF

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Publication number
KR100881285B1
KR100881285B1 KR20080043489A KR20080043489A KR100881285B1 KR 100881285 B1 KR100881285 B1 KR 100881285B1 KR 20080043489 A KR20080043489 A KR 20080043489A KR 20080043489 A KR20080043489 A KR 20080043489A KR 100881285 B1 KR100881285 B1 KR 100881285B1
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South Korea
Prior art keywords
chip
synthetic resin
cooling
cooling device
extrusion
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KR20080043489A
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Korean (ko)
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윤병준
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주식회사 대산
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/88—Thermal treatment of the stream of extruded material, e.g. cooling
    • B29C48/911—Cooling
    • B29C48/9135—Cooling of flat articles, e.g. using specially adapted supporting means
    • B29C48/9145—Endless cooling belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/06—Rod-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/26—Scrap or recycled material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)

Abstract

A cooling apparatus at the synthetic resin regeneration chip manufacturing apparatus is provided to continuously manufacture the reproduction chip without a dryer part which is equipped in order to dry the moisture. A cooling apparatus at the synthetic resin regeneration chip manufacturing apparatus comprises the cylinder type extrusion melting furnace having the extrusion screw in which the waste synthetic resin is fused to the extrusion; the chip nozzle unit(24) in which chip wires fused to the compression are ejected; and the cooling apparatus(26) cooling ejected chip wires at the water indirect contact method.

Description

합성수지 재생칩 제조장치에서의 냉각장치{COOLING APPARATUS OF WASTED-PLASTIC CHIPS MANUFACTURE SYSTEM}COOLING APPARATUS OF WASTED-PLASTIC CHIPS MANUFACTURE SYSTEM}

본 발명은 합성수지 재활용장치에 관한 것으로, 특히 합성수지 재생칩을 제조하는 장치에서의 냉각장치에 관한 것이다.The present invention relates to a synthetic resin recycling apparatus, and more particularly to a cooling apparatus in the apparatus for producing a synthetic resin recycling chip.

산업현장에서 버려지는 폴리에틸렌(PE), 폴리프로필렌(PP) 등과 같은 각종 폐합성수지를 플라스틱 원료로 재활용할 수 있다면 환경보호 측면과 아울러 자원절감 측면에서도 매우 유용한 일이다.If various waste synthetic resins such as polyethylene (PE) and polypropylene (PP) discarded in industrial sites can be recycled as plastic raw materials, it is very useful in terms of environmental protection and resource saving.

각종 폐합성수지는 수집되어진 후 탈수, 선별, 건조와 같은 전처리단계들을 거친 후 분쇄, 용융압출 등의 본처리 단계를 거쳐서 플라스틱 사출공장에서 필요로 하는 플라스틱 원료(신재)의 보조재로 쓰이는 재생칩이나 펠렛(pallet)이 제조되어지는데, 그 단계들중 폐합성수지 분쇄물을 용융 압출하여서 재생칩이나 펠렛을 생산하는 기기가 바로 합성수지 재생칩 제조장치이다.Various waste synthetic resins are collected and then subjected to pretreatment steps such as dehydration, sorting and drying, followed by main processing steps such as grinding and melt extrusion, and recycled chips or pellets used as auxiliary materials for plastic raw materials (new materials) needed in plastic injection plants. Pallets are manufactured. Among them, an apparatus for producing recycled chips or pellets by melt extruding waste synthetic resin pulverized products is a synthetic resin recycled chip manufacturing apparatus.

통상적으로 합성수지 재생칩 제조장치에서는 폐합성수지 분쇄물이 압출스크류를 갖는 실린더형 압출용융로에 투입이 되면 그 압출용융로내의 히터에 의한 용 융과 압출스크류에 의한 압출이 동시에 이루어지게 하고 그후 압출용융로의 출구를 통해 칩와이어(chip wire)들이 배출되게 한다. 상기 배출된 칩와이어들은 후부의 냉각장치에 의해서 냉각된 후 절단되어져서 재생칩이나 펠렛으로 생산되어진다. In general, in a synthetic resin recycling chip manufacturing apparatus, when the waste synthetic resin pulverized product is introduced into a cylindrical extrusion melting furnace having an extrusion screw, melting by a heater in the extrusion melting furnace and extrusion by the extrusion screw are performed at the same time, and then the exit of the extrusion melting furnace. Through the chip wire (chip wire) is discharged. The discharged chip wires are cooled by a rear cooling apparatus and then cut and produced into recycled chips or pellets.

종래 합성수지 재생칩 제조장치의 냉각장치는 주로 수냉식이다. 수냉식의 냉각장치는 압출용융로 후부에 위치한 수조내에 냉각수가 공급되게 하고, 압출용융로에서 배출된 칩와이어들이 냉각장치의 수조내 설치된 이송롤러들에 의해 이송되어서 물속을 지나고 후부의 권취롤러와 같은 견인부에 의해서 견인되어지게 하므로 칩와이어들의 냉각이 완료된다.The cooling apparatus of the conventional synthetic resin recycling chip manufacturing apparatus is mainly water-cooled. The water-cooled chiller allows the coolant to be supplied to the water tank located at the rear of the extrusion melting furnace, and the chip wires discharged from the extrusion melter are transported by the feed rollers installed in the water tank of the chiller to pass through the water, and the towing part such as the rear winding roller Cooling of the chip wires is completed because it is towed by.

하지만 상기와 같은 수냉식 냉각장치를 사용하는 냉각방식은 견인부의 당기는 힘에 의해서 냉각장치의 수조내에서 칩와이어들이 단락되는 경우가 종종 발생되므로 칩을 연속생산하는데 애로가 있었다. 또한 종래와 같이 수냉식 냉각장치를 사용하게 되면 냉각후 칩와이어에 물기가 묻게되므로 그 물기 묻은 칩와이어들을 건조시켜줄 건조부를 별도로 구비해야 하는 단점도 있다.However, in the cooling method using the water-cooled cooling device as described above, the chip wires are often short-circuited in the water tank of the cooling device due to the pulling force of the traction part, which causes difficulties in continuously producing the chips. In addition, when using a water-cooled cooling device as in the prior art, because the water on the chip wire after cooling, there is a disadvantage that a separate drying unit for drying the wet chip wire to dry.

따라서 본 발명의 목적은 합성수지 재생칩 제조장치의 냉각장치를 구현함에 있어 칩와이어의 단락여부에 상관없이 재생칩의 연속생산이 가능하도록 해주는 냉각장치를 제공하는데 있다.Accordingly, an object of the present invention is to provide a cooling device that enables continuous production of recycled chips regardless of whether a short circuit of chip wires is realized in realizing a cooling device of a synthetic resin recycled chip manufacturing apparatus.

본 발명의 다른 목적은 합성수지 재생칩 제조장치에서 냉각된 칩와이어의 물기를 건조시키는 건조부가 필요없도록 해주는 냉각장치를 제공하는데 있다.Another object of the present invention is to provide a cooling device that eliminates the need for a drying unit for drying the water of the chip wire cooled in the synthetic resin recycling chip manufacturing apparatus.

본 발명의 또 다른 목적은 냉각될 칩와이어의 굵기가 일정하도록 해주는 냉각장치를 제공하는데 있다.Still another object of the present invention is to provide a cooling device that allows a thickness of a chip wire to be cooled to be constant.

상기한 목적을 달성하기 위한 본 발명은, 압출스크류를 갖는 실린더형 압출용융로에서 폐합성수지를 압출용융하고 출구측의 칩노즐부를 통해 압축용융된 칩와이어들이 배출되게 구성한 합성수지 재생칩 제조장치에 있어서, 상기 배출되는 칩와이어들을 물 간접접촉방식으로 냉각시키는 냉각장치(26)를 구비하되, 상기 냉각장치(26)는 칩노즐부(24)의 하방에 설치되며 고온용 벨트(32)가 장치된 컨베이어(30)내 냉각수 순환부(33)와 연결되어 냉각수가 유입, 저장 및 배출되는 냉수자켓(34)을 설치하여서 구성함을 특징으로 한다. In the present invention for achieving the above object, in the cylindrical extrusion melting furnace having an extrusion screw in the synthetic resin recycled chip manufacturing apparatus configured to extrude melt molten resin and to discharge the melted chip wire through the chip nozzle portion of the outlet side, A cooling device 26 is provided to cool the discharged chip wires by indirect contact with water. The cooling device 26 is installed below the chip nozzle part 24 and is equipped with a high temperature belt 32. It is characterized in that it is connected to the cooling water circulation unit 33 in the 30 to install a cold water jacket 34, the cooling water is introduced, stored and discharged.

또한 본 발명은, 상기 컨베이어(30)는 실린더형 압출용융로(14)에 직교되는 길이방향으로 설치되며 길이방향으로 이동가능하게 장치됨을 특징으로 한다. In addition, the present invention is characterized in that the conveyor 30 is installed in the longitudinal direction orthogonal to the cylindrical extrusion melting furnace 14 and is arranged to be movable in the longitudinal direction.

또한 본 발명은, 칩노즐부(24)의 전단에 설치되며 압출용융된 수지액을 정량펌핑하여 칩노즐부(24)로 공급하는 정량펌핑부(22)를 구비하여 칩노즐부(24)에 의해서 컨베이어(30)로 균일한 와이어굵기를 갖는 칩와이어들이 낙하 공급되게 함을 특징으로 한다. In addition, the present invention, which is provided at the front end of the chip nozzle unit 24 and provided with a metering pump 22 for supplying to the chip nozzle unit 24 by metering the extruded molten resin liquid to the chip nozzle unit 24 By the conveyor 30 is characterized in that the chip wire having a uniform wire thickness drop supply.

본 발명은 컨베어 간접 물접촉 냉각방식으로 칩와이어의 단락여부에 상관없이 재생칩의 연속생산이 가능하도록 해주며, 기존 수냉식 냉각장치에서 냉각 칩와이어의 물기를 건조시키기 위해 구비되는 건조부가 필요없게 된다. 또한 본 발명은 정량펌핑부를 칩노즐부 전단에 두어 냉각될 칩와이어의 굵기도 일정하도록 해주는 장점이 있다. The present invention enables the continuous production of the regeneration chip regardless of whether the chip wire is shorted by the conveyor indirect water contact cooling method, and there is no need for a drying unit provided to dry the water of the cooling chip wire in the existing water-cooled cooling device. . In addition, the present invention has the advantage that the thickness of the chip wire to be cooled by placing the metering pump in front of the chip nozzle.

이하 본 발명의 바람직한 실시 예를 첨부한 도면을 참조하여 상세히 설명한다. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 실시 예에 따른 냉각장치를 구비한 합성수지 재생칩 제조장치의 개략 구성도이고, 도 2는 도 1의 냉각장치의 개략 구성도이다. 1 is a schematic configuration diagram of a synthetic resin recycling chip manufacturing apparatus having a cooling apparatus according to an embodiment of the present invention, Figure 2 is a schematic configuration diagram of the cooling apparatus of FIG.

합성수지 재생칩 제조장치(2)는 본 발명의 실시 예에 따라 특정되는 간접 물접촉 냉식방식의 냉각장치(26)를 구비한 제조장치이다. The synthetic resin recycled chip manufacturing apparatus 2 is a manufacturing apparatus provided with the cooling apparatus 26 of the indirect water contact cooling type specified according to the Example of this invention.

합성수지 재생칩 제조장치(2)의 실린더형 압출용융로(14)의 투입구(16)에 폐 합성수지 분쇄물이 투입이 되면 그 압출용융로(14)는 히터를 통해서 합성수지 분쇄물을 용융시킴과 동시에 구동모터(10)와 기어박스(12)를 통해서 전달되는 회전력으로 회전하는 압출스크류에 의해서 그 용융된 용융물이 실린더의 후방으로 압출되게 한다. 압출용융로(14)에서의 압출용융과정에서 발생하는 실린더내 가스이나 수분은 가스제거 연결부(18)를 통해서 외부로 배출되어지고, 실린더의 후방으로 압출되어진 합성수지 용융물은 이물질제거망 교환부(20)의 이물질제거망을 통과하면서 비용융성 이물질들이 걸러지고, 이후 본 발명의 냉각장치(26)를 구성하는 선택적 구성요소로서 구비된 정량펌핑부(22)에 의해서 정량펌핑이 이루어진다.When the waste synthetic resin pulverized product is introduced into the inlet 16 of the cylindrical extrusion melting furnace 14 of the synthetic resin recycling chip manufacturing apparatus 2, the extrusion melting furnace 14 melts the synthetic resin pulverized product through a heater and simultaneously drives the motor. The molten melt is extruded to the rear of the cylinder by an extrusion screw that rotates with the rotational force transmitted through the 10 and the gearbox 12. Gas or water in the cylinder generated during the extrusion melting process in the extrusion melting furnace 14 is discharged to the outside through the degassing connection 18, the synthetic resin melt extruded to the rear of the cylinder is foreign matter removal network exchange unit 20 The non-fusible foreign substances are filtered while passing through the foreign substance removal network, and then the quantitative pumping is performed by the quantitative pumping unit 22 provided as an optional component constituting the cooling device 26 of the present invention.

정량펌핑부(22)는 대용량 기어펌프로 구성하는 것이 바람직하며, 정량펌핑부(22)는 유입된 합성수지 용융물을 펌핑하여서 미리 설정된 공급량만큼을 후부의 칩노즐부(24)로 지속적으로 배출시켜준다. 칩노즐부(24)는 다수의 칩노즐들 예컨대 8개 내지 40개 노즐들을 구비하며, 정량펌핑부(22)로부터 지속적으로 배출된 합성수지 용융물을 칩노즐들을 통해서 칩와이어(chip wire)들이 배출되게 한다. The metering pump 22 is preferably configured as a large-capacity gear pump, and the metering pump 22 continuously pumps the introduced synthetic resin melt into the rear chip nozzle part 24 by a predetermined supply amount. . The chip nozzle unit 24 includes a plurality of chip nozzles, for example, 8 to 40 nozzles, and discharges the synthetic resin melt continuously discharged from the metering pump 22 through the chip nozzles. do.

칩노즐부(24)에 의해서 배출되는 칩와이어들은 정량펌핑부(22)의 지속적인 정량펌핑 작동에 의해서 균일한 와이어굵기를 갖게 되며, 본 발명의 실시 예에 따른 냉각장치(26)를 구성하는 컨베이어(30)의 고온용 벨트(32)로 낙하되어진다.The chip wires discharged by the chip nozzle part 24 have a uniform wire thickness by the continuous metering pumping operation of the metering pump 22, and the conveyor constituting the cooling device 26 according to an embodiment of the present invention. It falls to the high temperature belt 32 of (30).

상기 고온용 벨트(32)를 갖는 컨베이어(30)는 도 2에 도시된 바와 같이, 고온용 벨트(32)의 상부벨트 최근접 하방에 냉수자켓(34)을 설치하고 그 냉수자켓(34)의 입구(36)와 출구(38)를 통해서는 냉각수 순환부(33)와 연결되게 구성하여서 냉수자켓(34)에는 냉각수가 냉각수 순환부(33)에 의해서 유입, 저장 및 배출되 게 해준다. As shown in FIG. 2, the conveyor 30 having the high temperature belt 32 is provided with a cold water jacket 34 below the upper belt closest to the high temperature belt 32. The inlet 36 and the outlet 38 are configured to be connected to the coolant circulation unit 33 so that the coolant jacket 34 allows the coolant to be introduced, stored, and discharged by the coolant circulation unit 33.

냉수자켓(34)에는 도 3에 도시된 횡단면도와 같이, 바닥부에 직립판(35)들을 일정 간격으로 횡방 설치하여서 냉각자켓(34)의 입구(36)로 유입된 냉각수가 직립판(35)들에 의해 와류(FL)를 형성하면서 이동하고 냉각자켓(34)의 출구(38)로 빠져나가도록 해준다. 이러한 와류(FL)의 형성은 내부 충진된 냉각수를 상하로 섞어주므로 고온용벨트(32)의 상부벨트에 최근접하게 위치한 냉수자켓(34)의 상측 냉각수만이 온도상승되도록 하는 현상을 방지해준다. In the cold water jacket 34, as shown in the cross-sectional view shown in FIG. 3, the upright plates 35 are installed laterally at regular intervals on the bottom, and the coolant flowing into the inlet 36 of the cooling jacket 34 is upright plates 35. To move and form the vortex (FL) and exit to the outlet 38 of the cooling jacket 34. Since the formation of the vortex (FL) mixes the internally charged cooling water up and down, only the upper cooling water of the cold water jacket 34 positioned close to the upper belt of the high temperature belt 32 prevents the phenomenon of temperature rise.

냉각수 순환부(33)는 냉수자켓(34)으로 냉장온도나 상온온도와 같은 저온의 냉각수를 펌핑 공급하며 냉수자켓(34)으로부터는 잠시 머물고 있는 냉각수를 배출되게 순환제어하므로 냉수자켓(34)에서의 열교환이 지속적으로 일어날 수 있도록 해준다. The cooling water circulation part 33 pumps and supplies a low temperature cooling water such as a refrigerating temperature or a room temperature temperature to the cold water jacket 34, and circulates and controls the cooling water staying for a while from the cold water jacket 34 in the cold water jacket 34. Heat exchange can occur continuously.

컨베이어(30)의 고온용 벨트(32)는 고온상태의 칩와이어들이 얹혀져도 견딜 수 있으며 아울러 내구성도 있어야 하고 또 하방의 냉각수의 냉기를 상부 벨트상에 얹혀진 칩와이어들에게 바로 전달할 수 있어야 하므로 바람직하게는 테프론수지재질의 벨트로 구성한다.The high temperature belt 32 of the conveyor 30 is preferable because it can withstand high temperature chip wires, and must be durable, and must be able to directly transfer cold air from the lower cooling water to the chip wires mounted on the upper belt. It consists of a belt made of Teflon resin.

또한 본 발명의 냉각장치(26)를 구성하는 컨베이어(30)는 실린더형 압출용융로(14)에 직교되는 길이방향으로 칩노즐부(24)의 하방에 설치되며, 길이방향으로 이동가능하게 그 하부에는 바퀴들이나 레일 슬라이더와 같은 이동구들이 장치된다. 그래서 각 합성수지재질 칩와이어들의 냉각속도에 따라 적응적으로 냉각구간의 길이를 가변시킬 수 있도록 한다. 예컨대, 만일 배출되는 칩와이어들이 이전 작업된 칩와이어들에 비해서 상대적으로 냉각속도가 느리다면 컨베이어(30)의 냉각구간을 길게 늘려서 배출 칩와이어에 아주 적절한 냉각이 이루어지도록 한다.In addition, the conveyor 30 constituting the cooling device 26 of the present invention is installed below the chip nozzle part 24 in the longitudinal direction orthogonal to the cylindrical extrusion melting furnace 14, and its lower portion is movable in the longitudinal direction. It is equipped with moving tools such as wheels or rail sliders. Therefore, the length of the cooling section can be adaptively changed according to the cooling speed of each synthetic resin chip wire. For example, if the discharged chip wires have a relatively slow cooling rate compared to the previously worked chip wires, the cooling section of the conveyor 30 is extended to allow a very suitable cooling to the discharge chip wires.

냉수자켓(34)을 통해서 저온 냉각수가 지속적인 공급되어지므로 컨베이어(30)의 고온용 벨트(32)상에 얹혀진 고온의 칩와이어들은 열교환을 통해서 냉각되어지며, 벨트상 칩와이어들중 일부가 단락되더라도 전혀 문제없이 컨베이어(30)의 출부로 이송되어진다. 그러므로 본 발명은 칩와이어의 단락으로 인한 기계 중단없이 재생칩 연속생산이 가능하게 해준다. Since low-temperature cooling water is continuously supplied through the cold water jacket 34, the high temperature chip wires mounted on the high temperature belt 32 of the conveyor 30 are cooled by heat exchange, and even if some of the belt-shaped chip wires are shorted. It is conveyed to the exit of the conveyor 30 without any problem. Therefore, the present invention enables continuous production of recycled chips without machine interruption due to short circuit of the chip wire.

또한 본 발명에서 컨베이어(30)의 이송속도도 제어기를 통해 제어할 수 있는데, 컨베이어(30)의 이송속도 제어를 통해서 칩와이어들의 굵기도 다소 조절할 수 있다. In addition, in the present invention, the conveying speed of the conveyor 30 can also be controlled through a controller, through which the thickness of the chip wires can be controlled through the conveying speed control of the conveyor 30.

컨베이어(30)의 출구측으로 이송된 칩와이어들은 컨베이어(30)의 후측 구동롤러와 상방 압축롤러(40)에 의해서 압착되어지고, 고정커터(42)와 회전커터(44)에 의해서 절단된 후 하방 호퍼(46)를 통해서 재생칩(48)들이 배출되어진다. The chip wires transferred to the exit side of the conveyor 30 are compressed by the rear driving roller and the upper compression roller 40 of the conveyor 30, cut by the fixed cutter 42 and the rotary cutter 44, and then downward. The recycling chips 48 are discharged through the hopper 46.

상기와 같은 본 발명의 냉각장치(26)는 기존 수냉식 냉각장치에서의 칩와이어의 물기 건조를 위해 구비되는 건조부가 필요없으며, 호퍼(46)를 통해서 배출되어진 재생칩(48)이나 펠렛을 대략 75℃에서 바로 포장을 할 수 있으므로 포장전 물기의 흡수 걱정을 하지 않아도 되며, 재생칩 수요자는 재생칩 포장제품을 즉각 개방하여 바로 사용할 수 있게 해준다.As described above, the cooling device 26 of the present invention does not need a drying unit provided to dry the chip wires in the existing water-cooled cooling device, and the recycling chips 48 or pellets discharged through the hopper 46 are approximately 75. It can be packaged directly at ℃, so there is no need to worry about the absorption of moisture before packing, and consumers of recycled chips can immediately open the recycled chip packaged products and use them immediately.

상술한 본 발명의 설명에서는 구체적인 실시 예에 관해 설명하였으나, 여러 가지 변형이 본 발명의 범위에서 벗어나지 않고 실시할 수 있다. 따라서 본 발명의 범위는 설명된 실시 예에 의하여 정할 것이 아니고 특허청구범위와 특허청구범위의 균등한 것에 의해 정해 져야 한다. In the above description of the present invention, specific embodiments have been described, but various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the equivalent of claims and claims.

본 발명은 합성수지 재생칩 제조에 이용될 수 있다.The present invention can be used to manufacture a synthetic resin recycled chip.

도 1은 본 발명의 실시 예에 따른 냉각장치를 구비한 합성수지 재생칩 제조장치의 개략 구성도, 1 is a schematic configuration diagram of a synthetic resin recycling chip manufacturing apparatus having a cooling device according to an embodiment of the present invention,

도 2는 도 1의 냉각장치 개략 구성도,2 is a schematic configuration diagram of the cooling device of FIG.

도 3은 냉수자켓의 횡단면도.3 is a cross-sectional view of the cold water jacket.

<도면의 주요 부분에 대한 부호의 설명> <Description of the symbols for the main parts of the drawings>

(2)-- 합성수지 재생칩 제조장치 (14)-- 압출용융로(2)-Synthetic Resin Recycling Chip Manufacturing Equipment (14)-Extrusion Melting Furnace

(20)-- 이물질제거망 교환부 (22)-- 정량펌핑부(20)-Foreign substance removal network exchange (22)-Metering pump

(24)-- 칩노즐부 (26)-- 냉각장치(24)-Chip nozzle part (26)-Chiller

(30)-- 컨베이어 (32)-- 고온용 벨트(30)-Conveyor (32)-High Temperature Belt

(33)-- 냉각수 순환부 (34)-- 냉수자켓(33)-Cooling water circulation (34)-Cold water jacket

(44)-- 회전커터 (46)-- 호퍼 (44)-Rotary Cutter (46)-Hopper

Claims (3)

삭제delete 압출스크류를 갖는 실린더형 압출용융로에서 폐합성수지를 압출용융하고 출구측의 칩노즐부를 통해 압축용융된 칩와이어들이 배출되게 구성한 합성수지 재생칩 제조장치에 있어서,An apparatus for manufacturing a synthetic resin recycling chip comprising extrusion molten waste resin in a cylindrical extrusion melting furnace having an extrusion screw, and compressed and melted chip wires through an exit chip nozzle part, 상기 배출되는 칩와이어들을 물 간접접촉방식으로 냉각시키는 냉각장치(26)를 구비하되, 상기 냉각장치(26)는 칩노즐부(24)의 하방에 설치되며 고온용 벨트(32)가 장치된 컨베이어(30)내 냉각수 순환부(33)와 연결되어 냉각수가 유입, 저장 및 배출되는 냉수자켓(34)을 설치하여서 구성하고, 상기 컨베이어(30)는 실린더형 압출용융로(14)에 직교되는 길이방향으로 설치되며 길이방향으로 이동가능하게 장치됨을 특징으로 하는 합성수지 재생칩 제조장치에서의 냉각장치. A cooling device 26 is provided to cool the discharged chip wires by indirect contact with water. The cooling device 26 is installed below the chip nozzle part 24 and is equipped with a high temperature belt 32. It is configured by installing a cold water jacket 34 connected to the cooling water circulation section 33 in the cooling water inlet, storage and discharge, the conveyor 30 is a longitudinal direction orthogonal to the cylindrical extrusion melting furnace 14 Cooling device in the synthetic resin recycling chip manufacturing apparatus, characterized in that the device is installed to be movable in the longitudinal direction. 제2항에 있어서, 칩노즐부(24)의 전단에 설치되며 압출용융된 수지액을 정량펌핑하여 칩노즐부(24)로 공급하는 정량펌핑부(22)를 구비하여 칩노즐부(24)에 의해서 컨베이어(30)로 균일한 와이어굵기를 갖는 칩와이어들이 낙하 공급되게 함을 특징으로 합성수지 재생칩 제조장치에서의 냉각장치. 3. The chip nozzle part 24 according to claim 2, further comprising a fixed amount pumping part 22 which is provided at the front end of the chip nozzle part 24 and which pumps the extruded molten resin liquid to the chip nozzle part 24. Cooling device in the synthetic resin recycling chip manufacturing apparatus characterized in that the chip wire having a uniform wire thickness by dropping supply to the conveyor (30).
KR20080043489A 2008-05-09 2008-05-09 Cooling apparatus of wasted-plastic chips manufacture system KR100881285B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110978331A (en) * 2019-12-26 2020-04-10 刘荷花 Treatment system and treatment method for granulating and processing master batch of regenerated plastic particles

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523656A (en) * 1991-07-18 1993-02-02 Toshio Yoshida Pelletizing device for plastic waste treating device
JPH10337768A (en) 1997-06-05 1998-12-22 Nippon Poripuro Kk Method and apparatus for cooling plastic melting cylinder
KR200246820Y1 (en) 2001-06-05 2001-10-19 이정 Cooling device for cylinder of extruding machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0523656A (en) * 1991-07-18 1993-02-02 Toshio Yoshida Pelletizing device for plastic waste treating device
JPH10337768A (en) 1997-06-05 1998-12-22 Nippon Poripuro Kk Method and apparatus for cooling plastic melting cylinder
KR200246820Y1 (en) 2001-06-05 2001-10-19 이정 Cooling device for cylinder of extruding machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110978331A (en) * 2019-12-26 2020-04-10 刘荷花 Treatment system and treatment method for granulating and processing master batch of regenerated plastic particles

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