KR100875212B1 - A working system for heat sink - Google Patents

A working system for heat sink Download PDF

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Publication number
KR100875212B1
KR100875212B1 KR1020070083047A KR20070083047A KR100875212B1 KR 100875212 B1 KR100875212 B1 KR 100875212B1 KR 1020070083047 A KR1020070083047 A KR 1020070083047A KR 20070083047 A KR20070083047 A KR 20070083047A KR 100875212 B1 KR100875212 B1 KR 100875212B1
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KR
South Korea
Prior art keywords
heat sink
heat
unit
processing
tapping
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Application number
KR1020070083047A
Other languages
Korean (ko)
Inventor
최동철
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최동철
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Priority to KR1020070083047A priority Critical patent/KR100875212B1/en
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Publication of KR100875212B1 publication Critical patent/KR100875212B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D5/00—Planing or slotting machines cutting otherwise than by relative movement of the tool and workpiece in a straight line
    • B23D5/02—Planing or slotting machines cutting otherwise than by relative movement of the tool and workpiece in a straight line involving rotary and straight-line movements only, e.g. for cutting helical grooves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat sink processing system, and an object of the present invention is to heat the screw sink in the heat sink can be made more quickly and smoothly, the heat is provided to significantly improve the processing efficiency of the heat sink It is to provide a sink processing system.

To this end, the heat sink processing system according to the present invention has a heat contact having a device contact surface provided to contact the semiconductor device to absorb heat generated from the semiconductor device and a plurality of heat dissipation fins provided to release heat absorbed through the device contact surface. The sink is provided to process a screw hole for communicating the device contact surface and the heat dissipation fin side to the heat sink so as to be coupled to the semiconductor device, between the loading stage and the unloading stage, and between the loading stage and the unloading stage A work table having a processing path provided; A transfer unit configured to transfer the heat sink to guide the heat sink loaded on the loading stage to the unloading stage after passing through the processing path; And a processing unit installed in the middle of the processing path to process the screw holes in the heat sink transferred along the processing path. The screw holes are processed as the raw heat sinks are loaded one by one into the loading stage. Heat sinks are provided to be discharged one by one from the unloading stage.

Description

Heat sink processing system {A WORKING SYSTEM FOR HEAT SINK}

The present invention relates to a heat sink processing system, and more particularly, to a heat sink processing system provided to more quickly and smoothly perform a process of machining a screw hole for coupling with a semiconductor element in a heat sink.

  In general, semiconductor devices such as transistors, diodes, integrated circuits, and the like are mounted on driving circuit boards embedded in electronic products, and when the electronic devices are operated, excessive heat is generated in the semiconductor devices. Of course, there is a fear that the performance of the driving circuit board as a whole decreases.

Therefore, a heat sink for absorbing and releasing heat generated from the semiconductor device is installed in the driving circuit board of the electronic product together with the semiconductor device.

The heat sink is usually made of aluminum having excellent thermal conductivity and manufactured by extrusion molding or casting, and is provided with a device contact surface provided to be in contact with the semiconductor device to absorb heat generated from the semiconductor device, and absorbed through the device contact surface. It includes a plurality of heat radiation fins provided to release heat to the outside.

The semiconductor device is fixed to the device contact surface of the heat sink through a screw. For this purpose, a screw hole for communicating a space between the device contact surface and the heat dissipation fin is processed in the heat sink, and the semiconductor device is in contact with the device contact surface. In the screw hole is fixed to the heat sink through the screw.

The screw hole is formed by forming a through hole in the heat sink in the unprocessed state by using a conventional punching machine, and performing a tapping operation to process a spiral in the inner circumference of the through hole through a tapping machine.

However, in the related art, since the process of machining the screw holes in the heat sink is performed through the punching machine and the tapping machine respectively installed on separate working tables, there is a limit in improving the working speed of processing the screw holes in the heat sink.

In other words, when the punching machine and the tapping machine are installed on separate work benches, the worker must collect all the heat sinks formed with the through holes in the punching machine and transport them back to the tapping machine, and process or tap the through holes in the punching machine. When machining a screw hole in the unit, it was difficult to process a screw hole in a large number of heat sinks, such that the heat sink to be machined must be fixed in a newly aligned state on the workbench of the punching machine and the tapping unit.

The present invention is to solve this problem, it is an object of the present invention is to provide a faster and smoother operation for machining the screw holes in the heat sink is provided to significantly improve the processing efficiency of the heat sink It is to provide a heat sink processing system.

In order to achieve the above object, the heat sink processing system according to the present invention includes a device contact surface provided to be in contact with a semiconductor device to absorb heat generated from the semiconductor device, and a plurality of heat dissipation fins provided to release heat absorbed through the device contact surface. The heat sink is provided to process a screw hole for communicating the device contact surface and the heat dissipation fin side to the heat sink so as to be coupled to the semiconductor device, the loading stage and the unloading stage, and the unloading stage and A work bench having a machining path provided between the loading stages; A transfer unit configured to transfer the heat sink to guide the heat sink loaded on the loading stage to the unloading stage after passing through the processing path; And a processing unit installed in the middle of the processing path to process the screw hole in the heat sink transferred along the transfer path. The screw holes are processed as the raw heat sinks are loaded one by one into the loading stage. The heat sink is characterized in that it is provided to be discharged one by one from the unloading stage.

In addition, the heat sink processing system according to the present invention includes a first sensing sensor for detecting a state in which the heat sink of which the thread hole processing is completed is transferred to the unloading stage, and the heat sink in the unprocessed state is loaded on the loading stage. Further comprising a second detection sensor for detecting a state, wherein the transfer unit is provided to be operated in a state that the heat sink of the unprocessed state is loaded on the loading stage, the heat sink completed processing on the unloading stage is empty The processing unit is characterized in that it is provided to operate in a state in which the transfer operation of the transfer unit is made.

In addition, the processing unit may include a punching unit for drilling a through hole in the heat sink in the unprocessed state, a tapping unit for tapping a screw hole in the inner circumference of the through hole, and a chip generated around the screw hole in the tapping process. And a chip removing unit for removing.

In addition, the chip removing unit is characterized in that it comprises a chip removing member fixed on the processing path to be inserted between the heat sink fin of the heat sink.

In addition, the maximum cross-sectional area size of the chip removing member is characterized in that the same as the cross-sectional area size of the space formed between the radiating fins.

 In addition, the chip removing member is characterized in that it is provided with a plurality of spaced apart from each other.

In addition, the chip removing member is disposed so as to be adjacent to the heat sink in which the screw hole is processed through the tapping unit, the first chip removal is provided with an air injection port to inject high-pressure air between the heat sink fins of the heat sink transferred to the tapping processing position It includes a member, the chip removing unit is characterized in that it further comprises a compressed air supply device for compressing the high pressure air to supply to the air injection port.

In addition, the heat sink is transported along the processing path in a state where a plurality of heat sinks are arranged in series, and a collection space communicating with the processing path side is formed at a lower portion of the processing path to collect chips removed from the heat sink. The chip removing unit further includes a blocking member fixed on the processing path to be inserted between the heat dissipation fins of the heat sink and spaced apart from the first chip removing member by a predetermined distance in the spraying direction of the air injection port. The member is characterized in that it is provided to block the heat sink side chip at the tapping processing position from entering the other heat sink side in the air injection process by the air injection port.

The chip removing member may further include a second chip removing member disposed to be spaced apart from the first chip removing member in a direction opposite to the jet direction of the air injection port.

In addition, the worktable is provided with a plurality of guide members for rolling the upper surface of the heat sink to guide the transfer operation of the heat sink transferred from the loading stage to the unloading stage to prevent the heat sink being transferred to the upper portion Characterized in that provided.

In addition, the processing unit includes a punching unit for punching a through hole in the heat sink in the unprocessed state, and a tapping unit having a tapping tool to tap the screw hole in the inner circumference of the through hole, and the transfer unit includes a punching unit. And a conveying device for alignment provided on the processing path between the punching unit and the tapping unit to transfer the heat sink passed below the tapping unit to match the position of the through hole and the tapping tool. .

In this way, the heat sink processing system according to the present invention, that is, the various equipment necessary for the screw hole processing is integrally formed on one work platform, and the work platform automatically supplies and transports a plurality of heat sinks to each work position. The transfer device is provided.

Therefore, according to the heat sink processing system according to the present invention, it is not necessary to transport the heat sink to another place during the machining of the screw hole, and the hassle of aligning and fixing the heat sink one by one during the various operations for the processing of the screw hole. Since it does not occur, the processing efficiency of the heat sink can be greatly improved.

Next, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 shows a structure of a heat sink 1 according to an embodiment of the present invention.

The heat sink 1 according to the present embodiment is formed through an aluminum material having excellent thermal conductivity, and may be manufactured through extrusion molding or casting. The heat sink 1 first includes a body 1a, and one surface of the body 1a forms a device contact surface 1b in contact with the semiconductor device to absorb heat generated from the semiconductor device. On the body 1a opposite the device contact surface 1b, a plurality of heat dissipation fins 1c are formed to extend to the outside to absorb heat absorbed through the device contact surface 1b, and reference numeral 1d denotes a heat sink 1 It is an insertion groove for the insertion of a fixing pin (not shown) fastened to the heat sink 1 to fix the to the drive circuit board.

For reference, in the present embodiment, both the forming direction and the length of the heat dissipation fin (1c) is the same, in contrast, the heat dissipation fin (1c) may have a different length, some heat dissipation fins may be formed in a different direction.

The semiconductor device is fixed to the heat sink 1 through screws, and for this purpose, a plurality of screw holes 1f are connected to the heat sink 1 so as to communicate a space between the device contact surface 1b and the heat dissipation fin 1c. ) Is processed to form a small lifting width of the tapping tool 423 which will be described later, the screw hole (1f) is each heat sink (1) according to the number of semiconductor elements coupled to the heat sink (1) ) May be formed in one or more.

In FIG. 2, the order in which the screw holes 1f are processed in the heat sink 1 is sequentially shown. Referring to FIG. 2, in order to process the screw hole 1f in the heat sink, first, a through hole 1g is formed in the heat sink 1 at the position where the screw hole 1f is to be machined. 1f) is formed by machining spirals in the inner circumference of the through-hole 1g.

3 to 6 show the overall structure of the heat sink processing system according to the present embodiment for processing such a screw hole 1f.

As shown in FIGS. 3 to 6, the heat sink processing system according to the present embodiment includes a main body 200 provided with a work table 100 at an upper portion thereof, and a bottom of the main body 200 includes a main body 200. Movement wheel 210 for movement is installed.

The worktable 100 first includes a loading stage 110 for loading a heat sink 1 in an unprocessed state, and an unloading stage 120 for unloading a heat sink 1 in which machining of a screw hole 1f is completed. And a processing path 130 formed to guide the plurality of heat sinks 1 along the longitudinal direction of the heat sink 1 between the loading stage 110 and the unloading stage 120. A collection space 220 is formed in the lower space of the work table 100 to collect foreign substances such as chips C generated in the process, and the plurality of processing paths 130 communicate with the collection space 220. A communication hole 131 is provided. (See FIG. 8).

In addition, the work platform 100 has a transfer unit 300 for transferring the heat sink 1 loaded on the loading stage 110 to the unloading stage 120 via the processing path 130, and the processing The processing unit 400 for processing the screw hole 1f is installed in the heat sink 1 in the unprocessed state, which is provided in the middle of the path 130, and the heat sink processing is performed at one side of the loading stage 110. For the overall control of the system is installed a control box 500 is built in the main PC (not shown) and provided with a plurality of operation buttons (510).

The processing unit 400 includes a punching unit 410 for drilling the through hole 1g into the heat sink 1 in the unprocessed state, and a through hole 1g of the heat sink 1 passing through the punching unit 410. A tapping unit 420 for tapping spirals to form a screw hole 1f, and a chip removing unit 430 for removing chips C generated around the screw hole 1f in the tapping process. It is configured by.

The punching unit 410 and the tapping unit 420 are fixed to the upper part of the processing path 130 through the support 411 and 421, respectively, a plurality of punching tools (not shown) are mounted inside the punching unit 410. The lifting plate 422 of the tapping unit 420 is equipped with a plurality of tapping tools 423 rotatably installed, and the punching tool (not shown) and the tapping tool 423 are provided through lifting means 412 and 424. It is possible to go up and down.

In addition, the transfer unit 300 is a feeding device 310 provided on one side of the loading stage 110 to inject the heat sink 1 loaded on the loading stage 110 into the processing path 130, and the Installed at one side of the collecting space 220 in the lower side of the processing path 130 to transfer the heat sink 1 having the through hole 1g formed therethrough through the punching unit 410 to be aligned with the lower portion of the tapping tool 423. It is provided with a transfer device 320 for alignment. (See Fig. 7)

In addition, a loading guide path 140 for guiding the plurality of heat sinks 1 to the loading stage 110 along the width direction of the heat sink 1 is formed at one side of the loading stage 110, and the processing path ( 130, a first guide path 150 for guiding the plurality of heat sinks 1 along the width direction of the heat sink 1 is formed at the end thereof, and a plurality of heat sinks are formed at the end of the first guide path 150 again. A second guide path 160 for guiding (1) to the unloading stage 120 along the longitudinal direction of the heat sink 1 is formed, and the discharge path 170 is successively connected to the unloading stage 120. The transfer unit 300 is installed at one side of the first end of the first guide path 150 to transfer the heat sink 1 transferred to the first guide path 150 to the second guide path 160. The first guide transfer device 330 for transferring one by one and the second guide path 160 is installed on one side of the start end of the three second guide path (160) The second guide feeder 340 for transferring the transferred heat sinks to the unloading stage 120 one by one, and the heat sink 1 transferred to the unloading stage 120 are transferred to the discharge path 170. It is configured to further include a discharge transfer device 350 to.

In this case, the loading guide path 140 may be omitted, and when the loading stage 110 and the unloading stage 120 are formed in a date, the first and second guide paths 150 and 160 may also be omitted. Do. When the first and second guide paths 150 and 160 are omitted, the first and second guide transfer devices 330 and 340 may also be omitted.

The feeding device 310, the first and second guide feed device (330, 340), and the discharge feeder 350 is formed of a conventional pneumatic cylinder, and the body (311, 331, 341, 351) and the forward and backward shafts (312, 332, 342, 352) It is provided with. On the other hand, in the case of the transfer device 320 for alignment, the retraction member 321 moving forward and backward in the direction of the machining path 130 to prevent the heat sink 1 from being pushed up and down, and the lifting motion at the tip of the retraction member 321. It is configured to include a lifting member 322 provided to be possible.

As illustrated in FIG. 7, the transfer device 320 for alignment may include a heat sink passing through the punching unit 410 while the elevating member 322 is elevated during an advancing operation of the retracting member 321. 1) Lightly push the end of the heat sink 1 of the front end side of the heat sink 1, and thus the through-hole 1g of the heat sink 1 lightly pushed by the elevating member 322 is prevented from being pushed. It is conveyed toward the tapping unit 420 in a state aligned with 423.

Meanwhile, a spiral chip C is generated around the screw hole 1f of the heat sink 1 while the screw hole 1f is processed by the tapping tool 423. ) Exits into the space between the heat dissipation fins 1c and sticks to the surface of the heat dissipation fins 1c according to the direction in which the screw holes 1f are formed, and the chips C pass through the chip removal unit 430. It is effectively removed on the machining path 130.

As shown in FIG. 8, the chip removing unit 430 is first fixed on the processing path 130 so that the chip removing unit 430 may be inserted between the heat dissipation fins 1c of the heat sink 1. And removing members 60 and 70.

Therefore, the chip C generated during the screw hole 1f process and stuck between the heat dissipation fins 1c passes through the processing path 130 where the heat sink 1 is installed with the chip removing members 60 and 70. During the process, the chip removing members 60 and 70 are removed from the heat sink 1 by scraping the space between the heat dissipation fins 1c provided to communicate with the screw holes 1f.

The chip removing members 60 and 70 are provided to scrape the chip C substantially, and the chisel portions 61 and 71 having a high height and the chisel portions 61 and 71 for fixing the chip removing members 60 and 70. 71 is integrally provided with lower fixing parts 62 and 72, and is fixed to the bottom of the processing path 130 through the fastening member F fastened to the fixing parts 62 and 72.

Among the chisels 61 and 71, the maximum cross-sectional area size is provided to be equal to the cross-sectional area size of the space formed between the heat sink fins 1c so as to remove all the chips C existing between the heat sink fins 1c. desirable.

In addition, the chip removing members 60 and 70 are provided in plural numbers spaced apart from each other at predetermined intervals so that the operation of removing chips from the heat sink 1 may be repeatedly performed several times over a plurality of times. The chip C removed from the heat sink 1 through 70 is collected into the collection space 220 through the communication hole 131.

In the present embodiment, the chip removing members 60 and 70 are first chip removing members installed to be adjacent to the heat sink 1 transferred to the tapping unit 420 on the downstream processing path 130 of the tapping unit 420. And a second chip removing member 70 disposed on the downstream processing path 130 of the first chip removing member 60 and spaced apart from the first chip removing member 60 by a predetermined distance. Are provided in pairs.

At the tip of the chisel 61 of the first chip removing member 60, an air injection port 61a for injecting high-pressure air between the heat dissipation fins 1c of the heat sink 1 transferred to the tapping unit 420 is formed. The chip removing unit 430 further includes a compressed air supply device 80 for compressing high pressure air and supplying the compressed air to the air injection port 61a.

Compressed air supply device 80 is an air guide tube 81 connected to the air injection port (61a), the body of the lower portion of the collection space 220 to generate the high-pressure air to deliver to the air guide tube 81 Compressed air tank (82) is installed in the interior, and the air of the compressed air tank 82 on the air flow path between the compressed air tank 82 and the air guide tube 81 is the tapping unit (420) Control valve may be installed to control the flow of air to be delivered to the air guide tube 81 when the drive.

Therefore, as shown in FIG. 9, when high-pressure air is injected between the heat dissipation fins 1c of the heat sink 1 through which the screw holes 1f are processed through the air injection holes 61a, the screw holes 1f Most of the chips C generated in the process are removed from the heat sink fins 1c of the heat sink 1 during the machining of the screw holes 1f due to the high-pressure air, and the remaining remainder As shown in FIG. 10, the chip C is a process in which the heat sink 1 having completed the processing of the screw hole 1f passes through the first chip removing member 60 and the second chip removing member 70 in sequence. It is neatly removed from.

In addition, since the plurality of heat sinks 1 on the processing path 130 are arranged in series with each other, when high-pressure air is injected through the air injection port 61a, chips are removed from the heat sink 1 being tapped. (C) may flow between the heat dissipation fins 1c of the other heat sink 1 adjacent to the upstream side of the processing path 130.

Therefore, to prevent this, the chip removing unit 430 is fixed on the processing path 130 to be inserted between the heat dissipation fins 1c of the heat sink 1 like the chip removing members 60 and 70, and It further comprises a blocking member 90 is provided to be spaced apart from the first chip removing member 60 in the spraying direction of the air injection port (61a).

The blocking member 90 has a structure substantially the same as the chip removing members 60 and 70, but is disposed on the processing path 130 to form a symmetrical structure with the chip removing members 60 and 70. During the air spraying process by 61a), the chip C of the heat sink 1 in which the tapping is being performed is introduced into the heat dissipation fin 1c of the other heat sink 1 adjacent to the upstream side of the processing path 130. Will be blocked.

In addition, in the state in which the blocking member 90 is installed, the chips C moved toward the blocking member 90 by the high pressure air injected from the air injection port 61a of the first chip removing member 60 are blocked. Since it hits 90 and then falls down to the collection space 220 through the communication hole 131, the blocking member 90 guides the chip C to the collection space 220 It will also play a role.

In addition, the unloading stage 120 has a first detection sensor 121 for detecting a state in which the heat sink 1, in which the processing of the screw hole 1f is completed, is transferred to the unloading stage 120. The loading stage 110 is provided with a second detection sensor 111 for detecting a state in which the heat sink 1 of the raw state is loaded on the loading stage 110, and the first guide path. At the beginning of the 150 and the second guide path 160, auxiliary sensing sensors 151 and 161 for detecting the presence or absence of the heat sink 1 are provided, respectively, through which the heat sink processing system according to the present embodiment is adjusted. As the heat sink 1 of the unprocessed state is loaded into the loading stage 110 one by one through the control of the box 500, the heat sink 1 in which the screw holes 1f are processed is the unloading stage 120. Machining of the heatsink (1) automatically It is able to.

That is, the control box 500 is the first end of the unloading stage 120 and the first and second guide paths (150, 160) through the first sensor 121 and the auxiliary sensor (151,161). The heat sink 1 of which the thread hole 1f processing is completed is emptied, and at the same time, the heat sink 1 of the unprocessed state is loaded on the loading stage 110 through the second detection sensor 111. In the state of detecting the state to operate the transfer unit 300.

In this case, first, the feeding device 310 for feeding inserts the heat sink 1 loaded on the loading stage 110 into the processing path 130, and passes through the punching unit 410 while passing through the punching hole 1g. The formed heat sink 1 is supplied toward the tapping unit 420 by being aligned so that the through hole 1g and the tapping tool 423 are aligned by the alignment transfer device 320. In this case, the heat sinks 1 on the downstream processing path 130 of the tapping unit 420 are pushed by the heat sink 1 transferred to the tapping unit 420 to pass through the chip removing members 60 and 70. The heat sink 1 at the end of the processing path 130 through the chip removing members 60 and 70 is guided to the first guide path 150.

When the heat sink 1 is transferred to the start end of the first guide path 150, the heat sink 1 positioned at the end of the first guide path 150 while the first guide feed device 330 is operated. To the start end of the second guide path 160, in this state the second guide transfer device 340 is operated while the heat sink (1) located at the end of the second guide path 160 The heat sink 1 transferred to the unloading stage 120 and transferred to the unloading stage 120 is transferred to the discharge path 170 by driving the discharge transfer device 350, and in this process, the discharge path. The heat sink 1 located at the end of 170 is collected in a collection not shown and is ready for release.

When the transfer operation 1 cycle of the transfer unit 300 is completed, the control box 500 drives the processing unit 400. That is, in the punching unit 410, a process of processing the through hole 1g in the heat sink 1 transferred to the punching unit 410 is performed, and in the tapping unit 420, the screw hole 1f is tapped. As the operation cycles of the transfer unit 300 and the processing unit 400 are repeatedly performed, the heat sink processing system according to the present embodiment is processed to the loading stage 110. As it is loaded one by one, the heat sink 1 in which the screw holes 1f are processed is discharged one by one from the unloading stage 120, and the machining operation of the heat sink 1 can be automatically and continuously performed.

 In addition, the heat sink 1 conveyed along the processing path 130 and the first and second guide paths 150 and 160 is transferred in a state in which the heat sink 1 is arranged in succession, such a heat sink 1 During the transfer of), the heat sink 1 located in the middle is hit by the neighboring heat sink 1, and there is a fear that the heat sink 1 may not be smoothly transferred.

Accordingly, the worktable 100 may prevent the heat sink 1 being transported from being lifted while guiding a transfer operation of the heat sink 1 transferred from the loading stage 110 to the unloading stage 120. Guide member 600 is installed.

As shown in FIG. 11, the guide member 600 includes a support 610 fixed to the work table 100 and a cloud member provided to support the upper surface of the heat sink 1 being transferred to the end of the support 610. And 620.

And the guide member 600 is the processing in which the heat sink 1 is transferred in a state arranged along the longitudinal direction rather than the first guide path 150 that the heat sink 1 is somewhat stable along the width direction It is preferable to be concentrated on the path 130 and the second guide path 160.

1 is a perspective view illustrating a structure of a heat sink in a state in which a screw hole processing is completed through a heat sink processing system according to an exemplary embodiment of the present invention.

2 is a cross-sectional view sequentially illustrating a process of processing a screw hole in the heat sink through the heat sink processing system according to an embodiment of the present invention.

Figure 3 is a side cross-sectional view showing the overall structure of a heat sink processing system according to an embodiment of the present invention.

Figure 4 is a plan view showing the overall structure of a heat sink processing system according to an embodiment of the present invention.

5 and 6 are plan views showing the transfer path of the heat sink sequentially by removing some structures of the processing unit in FIG.

7 is a cross-sectional view showing the structure of the transfer device for alignment in the heat sink processing system according to an embodiment of the present invention, showing the transfer operation of the heat sink by the transfer device for alignment.

8 is a perspective view showing an extract of the structure of the chip removing unit in the heat sink processing system according to an embodiment of the present invention.

9 and 10 are cross-sectional views showing the chip removal unit side structure in the heat sink processing system according to the preferred embodiment of the present invention, showing the chip removal operation by the chip removal unit sequentially.

11 is a cross-sectional view showing the guide member side structure in the heat sink processing system according to an embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

1: heat sink 1b: device contact surface

1c: heat sink fin 1f: screw hole

1 g: through hole 100: workbench

200: main body 300: transfer unit

400: machining unit 500: control box

410: punching unit 420: tapping unit

430: chip removing unit 60: first chip removing member

70: second chip removing member 61a: air jet

80: high pressure air supply device 81: air guide tube

82: compressed air tank 90: blocking member

Claims (11)

A heat sink having a device contact surface provided to be in contact with the semiconductor device to absorb heat generated from the semiconductor device and a plurality of heat dissipation fins provided to dissipate heat absorbed through the device contact surface so as to be combined with the semiconductor device; In order to process the screw hole which communicates the element contact surface and the heat radiation fin side to the heat sink. A worktable having a loading stage and an unloading stage, and a machining path provided between the loading stage and the unloading stage; A transfer unit configured to transfer the heat sink to guide the heat sink loaded on the loading stage to the unloading stage after passing through the processing path; And a processing unit installed in the middle of the processing path to process the screw hole in the heat sink transferred along the transfer path. The screw holes are processed as the raw heat sinks are loaded one by one into the loading stage. And a heat sink for discharging one from the unloading stage. The method of claim 1, A first sensing sensor for sensing a state in which the heat sink in which the screw hole is completed is transferred to the unloading stage, and a second sensing sensor for detecting a state in which the heat sink in the unprocessed state is loaded in the loading stage; More, The transfer unit is provided to be operated in a state in which the heat sink of the raw state is loaded on the loading stage, the heat sink completed processing on the unloading stage is empty, The processing unit is a heat sink processing system, characterized in that provided to be operated in a state in which the transfer operation of the transfer unit. The method of claim 1, The processing unit includes a punching unit for punching through holes in the unprocessed heat sink, a tapping unit for tapping a screw hole in the inner circumference of the through hole, and a chip generated around the screw hole in the tapping process. Heat sink processing system comprising a chip removal unit to. The method of claim 3, wherein And the chip removing unit includes a chip removing member fixed on the processing path to be inserted between the heat sink fins of the heat sink. delete The method of claim 4, wherein The chip removing member is a heat sink processing system, characterized in that provided in a plurality of spaced apart from each other by a predetermined interval. The method of claim 6, The chip removing member is disposed so as to be adjacent to the heat sink in which the screw hole is processed through the tapping unit, and the first chip removing member is provided with an air injection port to inject high pressure air between the heat dissipation fins of the heat sink transferred to the tapping processing position. Including, The chip removing unit further comprises a compressed air supply device for compressing high-pressure air to supply the air injection port. The method of claim 7, wherein The heat sink is transferred along the processing path in a state where a plurality of heat sinks are arranged in series, A collecting space communicating with the processing path side is formed at the lower portion of the processing path to collect chips removed from the heat sink. The chip removing unit further includes a blocking member fixed on the processing path to be inserted between the heat dissipation fins of the heat sink and spaced apart from the first chip removing member by a predetermined distance in the spraying direction of the air injection port. The blocking member is a heat sink processing system, characterized in that to block the heat sink side chip in the tapping processing position from entering the other adjacent heat sink in the air injection process by the air injection port. The method of claim 7, wherein The chip removing member further comprises a second chip removing member disposed to be spaced apart from the first chip removing member in a direction opposite to the jet direction of the air injection port. The method of claim 1, The work table is provided with a plurality of guide members for rolling the upper surface of the heat sink to guide the transfer operation of the heat sink transferred from the loading stage to the unloading stage to prevent the heat sink being transferred upward. Heat sink processing system, characterized in that. The method of claim 1, The processing unit includes a punching unit for drilling a through hole in the heat sink in the unprocessed state, and a tapping unit having a tapping tool to tap a screw hole in the inner circumference of the through hole, The transfer unit is a transfer device for alignment provided on the processing path between the punching unit and the tapping unit to transfer the heat sink passed through the punching unit to the lower portion of the tapping unit to match the position of the through hole and the tapping tool. Heat sink processing system comprising a.
KR1020070083047A 2007-08-17 2007-08-17 A working system for heat sink KR100875212B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103662786A (en) * 2013-10-30 2014-03-26 陈继文 Novel auxiliary punching device for radiator
CN103820803A (en) * 2012-10-18 2014-05-28 常州泰坦机械有限公司 Acid pickling conversion equipment for diode semi-finished products
JP2020146771A (en) * 2019-03-12 2020-09-17 株式会社片山製作所 Cooling body processing jig
KR20210043812A (en) * 2019-10-14 2021-04-22 (주)화승코퍼레이션 Automation apparatus for valve assemble and pipe punching

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103820803A (en) * 2012-10-18 2014-05-28 常州泰坦机械有限公司 Acid pickling conversion equipment for diode semi-finished products
CN103662786A (en) * 2013-10-30 2014-03-26 陈继文 Novel auxiliary punching device for radiator
CN103662786B (en) * 2013-10-30 2015-12-09 山东建筑大学 A kind of radiator assists drilling device
JP2020146771A (en) * 2019-03-12 2020-09-17 株式会社片山製作所 Cooling body processing jig
JP7191324B2 (en) 2019-03-12 2022-12-19 株式会社片山製作所 Machining jig for cooling body
KR20210043812A (en) * 2019-10-14 2021-04-22 (주)화승코퍼레이션 Automation apparatus for valve assemble and pipe punching
KR102260595B1 (en) 2019-10-14 2021-06-07 주식회사 화승알앤에이 Automation apparatus for valve assemble and pipe punching

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