KR100873773B1 - Device for preventing malfunction of standard mechanical interface - Google Patents

Device for preventing malfunction of standard mechanical interface Download PDF

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KR100873773B1
KR100873773B1 KR1020070058635A KR20070058635A KR100873773B1 KR 100873773 B1 KR100873773 B1 KR 100873773B1 KR 1020070058635 A KR1020070058635 A KR 1020070058635A KR 20070058635 A KR20070058635 A KR 20070058635A KR 100873773 B1 KR100873773 B1 KR 100873773B1
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South Korea
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door
wafer
sump
process equipment
wafer cassette
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KR1020070058635A
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Korean (ko)
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송영환
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주식회사 동부하이텍
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A device for preventing error of the SMIF system is provided to prevent the damage of wafer and SMIF system by performing an interlock function using the detection means. A device for preventing the error of the SMIF system comprises a processing tool and a SMIF system. The processing tool comprises the door which opens and closes the gateway of the wafer cassette while being slid to the upward and downward. The SMIF system unloads the wafer or the wafer cassette to be processed in the processing tool. The detection means(24) senses the presence of object in the gateway of the processing tool when the door is closed. The relay(41) has the connection contact point and the closing contact point and is driven according to the object sensing of the detection means. The door open means is made of the solenoid valve for the solenoid valve for the door closing connected to the connection contact point and the door open connected to the closing contact point.

Description

스미프 시스템의 오동작 방지장치{Device for preventing malfunction of standard mechanical interface}Device for preventing malfunction of standard mechanical interface

도 1은 일반적인 공정장비 도어의 개폐구조를 설명하기 위한도면,1 is a view for explaining the opening and closing structure of a general process equipment door,

도 2는 종래 공정장비내로 웨이퍼카세트의 로딩/언로딩시 도어와 스미프 아암의 충돌상태를 설명하기 위한 도면,2 is a view for explaining the collision state of the door and the sump arm during loading / unloading of the wafer cassette into the conventional process equipment;

도 3은 본 발명이 적용되는 로드락 챔버의 도어 및 그 요부확대도,Figure 3 is an enlarged view of the door and its main door of the load lock chamber to which the present invention is applied,

도 4는 본 발명의 구현을 위한 로드락 챔버 도어의 시컨스회로도,4 is a sequence circuit diagram of a load lock chamber door for implementation of the present invention;

도 5는 본 발명에 따른 공정장비 도어의 작동상태를 설명하기 위한 도면을 각각 나타낸다.5 is a view for explaining the operating state of the process equipment door according to the present invention, respectively.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10(10A,10B) --로드락 챔버, 11(11A,11B) -- 도어,10 (10A, 10B)-load lock chamber, 11 (11A, 11B)-door,

12 -- 테이블, 20(20A,20B) -- 스미프 시스템,12-table, 20 (20A, 20B)-sump system,

21 -- 웨이퍼 카세트, 22 -- 파드.21-Wafer Cassette, 22-Pod.

본 발명은 스미프(standard mechanical interface) 시스템의 스미프 아암이 장비내로 웨이퍼 카세트를 로딩하거나 또는 장비로부터 언로딩할 때 스미프 아암이 공정장비의 도어와 충돌하는 오동작이 발생하는 것을 방지할 수 있도록 하는 스미프 시스템의 오동작 방지장치에 관한 것으로, 더욱 상세하게는 스미프 아암이 공정장비내로 진출입할 때 도어의 여닫음 상태를 감지하여 스미프 아암과 도어의 충돌을 방지할 수 있도록 하는 스미프의 오동작 방지장치에 관한 것이다.The present invention is intended to prevent the malfunction of the sump arm from colliding with the door of the process equipment when the sump arm of a standard mechanical interface system loads or unloads a wafer cassette into the machine. The present invention relates to a malfunction prevention device of a sump system, and more particularly, to a sump of a sump arm that detects an open / closed state of a door when the arm enters or leaves the process equipment. It relates to a malfunction prevention device.

일반적으로 반도체소자의 제조를 위한 공정에는 여러 가지 열처리 공정이 포함된다. 최근 반도체 디바이스가 점점 고집적화됨에 따라 요구되는 소자의 크기가 작아지게 되어 제조 공정에서 받는 전체 열다발(thermal budget)을 줄이기 위해 매엽식 급속 열처리(RTP; Rapid Thermal Processing) 설비가 주로 이용되고 있다. 이러한 급속 열처리 설비는 기존의 확산로에서 수행하던 다양한 공정을 대부분 수행할 수 있으며, 웨이퍼에 대한 가열과 냉각이 고속으로 이루어지므로 초고집적 회로(VLSI) 공정에 적합한 불순물 재 확산과 확산로 벽면으로부터 방출되는 오염 등을 방지할 수 있는 장점이 있다.Generally, a process for manufacturing a semiconductor device includes various heat treatment processes. In recent years, as semiconductor devices have been increasingly integrated, the size of the required devices has become smaller, so that a rapid thermal processing (RTP) facility is mainly used to reduce the overall thermal budget received in the manufacturing process. This rapid heat treatment facility can perform most of the various processes performed in the existing diffusion furnace, and since the heating and cooling of the wafer is performed at a high speed, impurity re-diffusion and diffusion from the wall of the diffusion furnace suitable for the VLSI process are performed. There is an advantage that can prevent the contamination.

상기한 급속 열처리 설비를 통해 수행되는 급속 열처리 공정은 퍼니스(Furnace)의 고온을 이용하여 반도체 기판인 웨이퍼를 가열함으로써 반도체 소자의 결정성 회복 및 물성 안정화 등의 목적을 달성할 수 있는 RTA(Rapid Thermal Annealing)공정과, 반응가스의 종류에 따라 나이트라이드막, 산화막 및 실리사이드 막 등을 고온 상태에서 열확산에 의해서 성장시키는 RTN(Rapid Thermal Nitridation), RTO(Rapid Thermal Oxidation) 및 RTS(Rapid Thermal Silicide) 등 의 박막형성공정을 포함한다In the rapid heat treatment process performed through the rapid heat treatment facility, RTA (Rapid Thermal) capable of achieving the purpose of crystallinity recovery and physical property stabilization of a semiconductor device by heating a wafer, which is a semiconductor substrate, by using a high temperature of a furnace. Rapid Thermal Nitridation (RTN), Rapid Thermal Oxidation (RTO), Rapid Thermal Silicide (RTS), etc. to grow nitride film, oxide film and silicide film by thermal diffusion at high temperature according to the process of Annealing) It includes thin film formation process of

도 1은 RTP/RTS나 고전류 이온주입기인 베리안의 비스타(VIISta)80/810와 같이 출입구에 상하방향으로 슬라이드되는 도어(11;11A,11B)를 갖추고 있는 한 쌍의 로드락 챔버(10;10A,10B)를 포함하여 이루어진 일반적인 공정장비를 나타낸다. 상기 로드락 챔버(10;10A,10B)의 내측 바닥에 도시된 것은 웨이퍼카세트가 안착되는 테이블(12)을 나타낸다. 이러한 공정장비는 동일한 구조로 이루어져 있다. Figure 1 shows a pair of load lock chambers 10; 10A with doors 11; 11A, 11B sliding up and down at the entrance, such as Varian Vista (VIISta) 80/810, which is an RTP / RTS or high current ion implanter. , General process equipment, including 10B). Shown at the inner bottom of the load lock chambers 10; 10A, 10B represents a table 12 on which a wafer cassette is seated. These process equipments have the same structure.

한편, 상기와 같은 공정장비의 전방 즉 도어(11;11A,11B)의 전방에는 도 2에 도시된 바와 같이 동일한 구조로 이루어진 한 쌍의 스미프 시스템(20;20A,20B)이 설치되어 있다. 스미프 시스템(SMIF; Standard Mechanical Interface)이란 좁은 공간의 청정실 등에서의 대기 컨트롤 및 프로세스 처리시 인위적인 실수 등을 방지하기 위한 반도체 장비의 주변장치로서로써, 반도체 제조공정을 수행하는 반도체웨이퍼 또는 반도체웨이퍼가 저장된 웨이퍼카세트를 단위공정을 수행하기 위한 반도체 장비에 로딩하거나 언로딩하는데 이용된다. 아울러 스미프 시스템(20)은 공정 대기중인 웨이퍼 및 웨이퍼 카세트(21)를 파드(POD)(22)라고 하는 밀폐된 특수용기에 넣어서 보관 및 반송하고, 국부적, 고청정도가 유지된 국부환경에서만 공정이 이루어지도록 하여 외부 환경변화로부터 완전하게 격리되기 때문에 안정된 수율을 유지할 수 있도록 한다.On the other hand, a pair of sump systems (20; 20A, 20B) of the same structure is installed in front of the process equipment, that is, the front of the door (11; 11A, 11B) as shown in FIG. SMIF (Standard Mechanical Interface) is a peripheral device for semiconductor equipment to prevent human error during atmospheric control and process processing in a clean room of a narrow space, and a semiconductor wafer or a semiconductor wafer that performs a semiconductor manufacturing process The stored wafer cassette is used to load or unload semiconductor equipment for performing a unit process. In addition, the sump system 20 stores and transports the wafers and wafer cassettes 21 waiting to be processed in a sealed special container called a pod (POD) 22 and processes them only in a local environment in which local and high cleanliness are maintained. This ensures a stable yield since it is completely isolated from external environmental changes.

도 2는 로드락 챔버(10)의 전방에 스미프 시스템(20)이 설치된 상태의 정면 도를 도시한 것으로, 도면중 좌측은 스미프 아암(23A)에 의하여 웨이퍼카세트(21)가 로드락 챔버(10A) 측으로 로딩중이거나 언로딩 중인 상태를 나타내고, 도면중 우측은 웨이퍼카세트(21)가 로드락 챔버(10B)의 전방에 있는 스미프 시스템(20B)에 안착되어 있는 상태를 나타내며, 이때 스미프 아암(23B)은 로드락 챔버(10B)의 전방에 있는 스미프 시스템(20B)에서 대기위치에 머물러 있는 상태이다.FIG. 2 is a front view of the sump system 20 installed in front of the load lock chamber 10, and the left side of the figure shows that the wafer cassette 21 is loaded by the sump arm 23A. The loading or unloading state to the 10A side is shown, and the right side of the figure shows a state where the wafer cassette 21 is seated on the sump system 20B in front of the load lock chamber 10B. The arm 23B remains in the standby position in the sump system 20B in front of the load lock chamber 10B.

그런데 도 2의 좌측에 도시된 바와 같이 스미프 시스템(20A)이 웨이퍼카세트를 로드락 챔버(10A)의 내측으로 로딩하거나 그로부터 언로딩중일때 도어(11)가 닫히게 되면 스미프 아암(23A)과 충돌하게 됨으로써, 스미프 아암(23A)이 손상된다거나 웨이퍼카세트에 적재되어 있는 웨이퍼가 낙하되어 손상된다거나 인체가 끼여 손상을 입을 수 있는 등의 문제점이 발생될 수 있다.However, as shown in the left side of FIG. 2, if the door 11 is closed while the sump system 20A is loading or unloading the wafer cassette into the load lock chamber 10A, the sump arm 23A and By colliding with each other, problems such as damage to the sum arm 23A, falling of the wafer loaded on the wafer cassette, damage, and human body damage may occur.

본 발명은 상기한 문제점을 개선하기 위하여 발명한 것으로, 스미프 시스템에 의하여 로드락 챔버로 웨이퍼카세트를 로딩/언로딩 하는 과정에서 잘못된 명령이 발생되어 로드락 챔버의 도어가 닫히는 경우 발생될 수 있는 사고를 미연에 방지할 수 있도록, 로드락 챔버의 도어가 닫힐 때 로드락 챔버의 입구에 스미프 아암 등과 같은 물체가 존재하는 것으로 판단되는 경우 로드락 챔버의 도어가 다시 개방되도록 한 스미프 시스템의 오동작 방지장치를 제공하고자 함에 발명의 목적이 있다.The present invention has been invented to improve the above problems, which may occur when an incorrect command is generated in the process of loading / unloading the wafer cassette into the load lock chamber by the sump system to close the door of the load lock chamber. In order to prevent accidents, when the door of the load lock chamber is closed, if there is an object such as a smear arm at the entrance of the load lock chamber, An object of the present invention is to provide a malfunction preventing device.

상기한 목적을 실현하기 위한 본 발명의 스미프 시스템의 오동작 방지장치는, 상하방향으로 슬라이딩되면서 웨이퍼카세트의 출입구를 개폐하는 도어를 구비하고 있는 공정장비와, 상기 공정장비에서 처리할 웨어퍼 또는 웨이퍼카세트를 로딩/언로딩하는 스미프 시스템을 포함하고 있는 반도체 제조장비의 오동작 방지장치에 있어서, 상기 도어가 닫힐 때 공정장비의 출입구측에 물체의 존재여부를 감지하는 물체감지수단, 상기 물체감지수단이 물체를 감지하는 순간 도어개방신호를 발생시키는 도어개방수단을 포함하여 이루어져 있다.The malfunction prevention device of the sump system of the present invention for achieving the above object is a process equipment having a door for opening and closing the entrance and exit of the wafer cassette while sliding in the vertical direction, and the wafer or wafer to be processed in the process equipment An apparatus for preventing malfunction of a semiconductor manufacturing apparatus including a sump system for loading / unloading a cassette, the apparatus comprising: object sensing means for detecting the presence or absence of an object on an entrance side of a process equipment when the door is closed; And a door opening means for generating a door opening signal at the moment of detecting the object.

상기에 있어서, 물체감지수단은 도어의 상측면에 설치되는 것을 특징으로 한다.In the above, the object detecting means is installed on the upper side of the door.

상기에 있어서, 물체감지수단은 적외선 센서인 것을 특징으로 한다.In the above, the object detecting means is characterized in that the infrared sensor.

상기에 있어서, 상기 도어개방수단은 상기 적외선 센서의 물체감지에 따라 구동되며 상시접속접점과 상시폐쇄접점을 갖고 있는 릴레이와, 상기 상시접속접점에 연결되는 도어폐쇄용 솔레노이드밸브 및 상기 상시폐쇄접점에 연결되는 도어개방용 솔레노이드밸브로 이루어진 것을 특징으로 한다.In the above, the door opening means is driven in accordance with the object detection of the infrared sensor and has a normally connected contact and the normally closed contact, a door closing solenoid valve and the normally closed contact connected to the always connected contact. It characterized in that the door consisting of a solenoid valve for opening.

이하 본 발명의 바람직한 일실시예의 구성 및 작용을 예시도면에 의거하여 상세히 설명한다.Hereinafter, the configuration and operation of a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명이 적용되는 로드락 챔버의 도어 및 그 요부확대도를 나타낸다.3 shows an enlarged view of a door of the load lock chamber to which the present invention is applied.

첨부도면에 도시된 바와 같이, 도어(11)의 상면에는 도어(11)의 수직 상방향에 존재하는 물체를 감지할 수 있는 물체감지수단(24)이 설치된다. 이러한 물체감지수단(24)은 도어(11)가 닫히는 과정에서 도어(11)의 상방향에 근접된 물체를 감지하기 위한 것으로, 감지거리가 짧고 감지각도가 좁은 것을 이용하게 되므로 도어(11) 상면의 양측 가장자리와 중앙부위에 설치하는 것이 바람직하다.As shown in the accompanying drawings, the upper surface of the door 11 is provided with an object detecting means 24 for detecting an object existing in the vertical upward direction of the door 11. The object detecting means 24 is for detecting an object proximate to the upper direction of the door 11 while the door 11 is closed. Since the sensing distance is short and the detection angle is used, the upper surface of the door 11 is used. It is desirable to install at both the edge and the center of the.

본 발명의 실시예에서는 물체감지수단(24)으로써 일례로 적외선센서가 이용되며, 상기 적외선센서는 평상시 스위치 온상태를 유지하다가 물체감지시 스위치 오프상태로 전환되는 구조이다. In the embodiment of the present invention, an infrared sensor is used as an object detecting means 24, for example, and the infrared sensor is structured to be switched to a switched off state during object sensing while being normally switched on.

도 4는 본 발명의 구현을 위한 로드락 챔버 도어의 시컨스회로도를 나타낸다.4 shows a sequence circuit diagram of a load lock chamber door for implementation of the present invention.

도어폐쇄신호라인의 양단에 걸쳐, 물체감지수단(24)과 직렬로 연결된 릴레이(41), 상기 릴레이(24)의 상시접속접점(41a)과 직렬로 연결된 도어폐쇄용 솔레노이드밸브(42), 상기 릴레이(24)의 상시개방접점(41b)과 직렬로 연결된 도어개방용 솔레노이드밸브(43)가 각각 병렬로 연결되어 있다.On both ends of the door closing signal line, the relay 41 connected in series with the object detecting means 24, the solenoid valve 42 for door closing connected in series with the normally connected contact 41a of the relay 24, Door opening solenoid valves 43 connected in series with the normally open contact 41b of the relay 24 are connected in parallel, respectively.

상기 릴레이(41)의 상시개방접점(41b)과 도어개방용 솔레노이드밸브(43)는 도어개방수단으로 작용되며, 상기 릴레이(41)의 상시개방접점(41b)과 도어개방용 솔레노이드밸브(43)는 도어개방수단으로 작용된다.The normally open contact 41b of the relay 41 and the solenoid valve 43 for door opening act as door opening means, and the normally open contact 41b of the relay 41 and the solenoid valve 43 for door opening are provided. Acts as a door opening means.

이와 같은 시컨스회로에서는 스미프 시스템(20)의 스미프 아암(23)이 로딩중이거나 언로딩 중인 과정에서 도어폐쇄신호가 발생되어 공정장비 즉 로드락 챔 버(10)의 도어(11)가 닫히려할 때 물체감지수단(24)에 의하여 물체가 감지되면 물체감지수단(24)은 오프상태를 유지하게 된다.In such a sequence circuit, a door closing signal is generated while the sump arm 23 of the sump system 20 is being loaded or unloaded to close the door 11 of the process equipment, that is, the load lock chamber 10. When the object is detected by the object detecting means 24, the object detecting means 24 maintains the off state.

이에 따라 릴레이(41)에 공급되던 전원이 차단되어 릴레이 상시접속접점(41a)은 개방되고 릴레이 상시개방접점(41b)은 접속되어 도어개방용 솔레노이드밸브(43)가 작동됨으로써 도어(11)가 다시 개방되는 방향으로 하강되어 스미프 아암(23)과의 충돌을 방지할 수 있게 된다.Accordingly, the power supplied to the relay 41 is cut off, the relay normally connected contact 41a is opened, and the relay normally open contact 41b is connected to operate the door open solenoid valve 43 so that the door 11 is again operated. It descends in the opening direction and can prevent a collision with the sump arm 23.

다시 말해서, 스미프 아암(23)이 로딩중이거나 언로딩중일 때 공정장비에서 도어폐쇄신호가 발생되더라도 도어(11)의 상면에 설치된 물체감지수단(24)에 의해 스미프 아암(23)이 감지된 후에는 도어폐쇄신호가 차단되고 도어개방신호가 인가되게 되어 도어(11)가 다시 내려감으로서 스미프 아암(23)과의 충돌을 방지할 수 있게 된다.In other words, even if the door closing signal is generated in the process equipment when the sump arm 23 is being loaded or unloaded, the sump arm 23 is detected by the object detecting means 24 installed on the upper surface of the door 11. After the door closing signal is blocked and the door opening signal is applied, the door 11 is lowered again to prevent the collision with the sump arm 23.

도 5는 본 발명에 따른 공정장비 도어의 작동상태를 설명하기 위한 도면으로, 도 5의 (a)는 스미프 아암에 의한 웨이퍼카세트의 로딩/언로딩시 도어의 상승상태 감지동작을 설명하는 도면이고, 도 5의 (b)는 웨이퍼카세트의 로딩/언로딩시 도어의 상승상태 감지에 따른 도어개방동작을 설명하는 도면이다.5 is a view for explaining the operating state of the process equipment door according to the present invention, Figure 5 (a) is a view for explaining the operation of detecting the rising state of the door when loading / unloading the wafer cassette by the smudge arm. 5 (b) is a view for explaining the door opening operation according to the detection of the rising state of the door when loading / unloading the wafer cassette.

도 5의 (a)에 도시된 바와 같이, 스미프 시스템(20)의 스미프 아암(23)이 웨이퍼카세트(21)를 공정장비인 로드락 챔버(10)내로 로딩/언로딩 하는 과정에 있고, 로드락 챔버(10)의 오동작에 의하여 로드락 챔버(11)가 출입구에 설치되어 있는 도어(11)가 닫히는 과정중에 있다면, 스미프 시스템(20)의 우측에서 로드락 챔버(11) 내로 진입되어 있는 스미프 아암(23)이 도어(11)의 상면중 우측에 설치되어 있는 물체감지센서(24)에 의하여 충돌직전에 감지된다.As shown in FIG. 5A, the sump arm 23 of the sump system 20 is in the process of loading / unloading the wafer cassette 21 into the load lock chamber 10, which is a process equipment. If the load lock chamber 11 is in the process of closing the door 11 installed at the entrance due to a malfunction of the load lock chamber 10, the rod lock chamber 11 enters the load lock chamber 11 from the right side of the sump system 20. The sump arm 23 is detected just before the collision by the object detecting sensor 24 provided on the right side of the upper surface of the door 11.

이에 따라 도 4에 의거 설명된 바와 같이 도어개방신호가 발생되며, 도 5의 (b)에 도시된 바와 같이 도어(11)가 다시 개방되는 방향으로 하강하게 되어 충돌이 일어나지 않게 된다.Accordingly, the door open signal is generated as described with reference to FIG. 4, and as shown in FIG. 5 (b), the door 11 is lowered in the opening direction again to prevent collision.

상기한 바와 같이, 본 발명은 공정장비의 도어 상측에 물체감지수단이 설치되어 공정장비내로 웨이퍼카세트가 스미프 시스템에 의거 로딩/언로딩 중일 때 도어가 닫히는 오동작이 발생되어도 인터락 기능을 수행하게 됨으로써 스미프 시스템과 웨이퍼의 손상을 방지할 수 있고, 공정장비의 도어에 인체의 일부가 끼일 수 있는 사고를 미연에 방지할 수 있으며, 이와 같은 기능은 평상시에는 동작하지 않다가 도어가 닫힐 때에만 동작하기 때문에 장비운용상 불편함이 수반되지 않는 장점이 있다. As described above, the present invention is an object detection means is installed on the upper side of the process equipment to perform the interlock function even if a malfunction occurs that the door is closed when the wafer cassette is being loaded / unloaded by the sump system into the process equipment. This prevents damage to the sump system and the wafer, and prevents accidents that may cause part of the human body to the door of the process equipment. Such a function is not normally operated but only when the door is closed. Because it operates, there is an advantage that does not come with inconvenience in equipment operation.

Claims (4)

상하방향으로 슬라이딩되면서 웨이퍼카세트의 출입구를 개폐하는 도어를 구비하고 있는 공정장비와, 상기 공정장비에서 처리할 웨어퍼 또는 웨이퍼카세트를 로딩/언로딩하는 스미프 시스템을 포함하고 있는 반도체 제조장비의 오동작 방지장치에 있어서, 상기 도어가 닫힐 때 공정장비의 출입구측에 물체의 존재여부를 감지하는 물체감지수단, 상기 물체감지수단의 물체감지에 따라 구동되며 상시접속접점과 상시폐쇄접점을 갖고 있는 릴레이와, 상기 상시접속접점에 연결되는 도어폐쇄용 솔레노이드밸브 및 상기 상시폐쇄접점에 연결되는 도어개방용 솔레노이드밸브로 이루어진 도어개방수단을 포함하여 이루어진 것을 특징으로 하는 스미프 시스템의 오동작 방지장치. Malfunction of semiconductor manufacturing equipment including a process equipment having a door for opening and closing a wafer cassette opening and closing while sliding up and down, and a sump system for loading / unloading a wafer or wafer cassette to be processed by the process equipment. In the prevention device, the object detecting means for detecting the presence of the object on the entrance side of the process equipment when the door is closed, the relay which is driven in accordance with the object detection of the object detecting means and has a normally connected contact and a normally closed contact; And a door opening means comprising a door closing solenoid valve connected to the normally connected contact point and a door opening solenoid valve connected to the normally closed contact point. 제1항에 있어서, 물체감지수단은 도어의 상측면에 설치되는 것을 특징으로 하는 스미프 시스템의 오동작 방지장치.The malfunction preventing device of the sump system according to claim 1, wherein the object detecting means is installed on an upper surface of the door. 제2항에 있어서, 물체감지수단은 적외선 센서인 것을 특징으로 하는 스미프 시스템의 오동작 방지장치.The malfunction preventing device of the sump system according to claim 2, wherein the object detecting means is an infrared sensor. 삭제delete
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Publication number Priority date Publication date Assignee Title
KR200217107Y1 (en) * 2000-10-16 2001-03-15 아남반도체주식회사 Apparatus for detecting a loading error of semiconductor wafer of SMIF system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200217107Y1 (en) * 2000-10-16 2001-03-15 아남반도체주식회사 Apparatus for detecting a loading error of semiconductor wafer of SMIF system

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