KR100873667B1 - A injection mold using the peltier device - Google Patents

A injection mold using the peltier device Download PDF

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Publication number
KR100873667B1
KR100873667B1 KR1020070071712A KR20070071712A KR100873667B1 KR 100873667 B1 KR100873667 B1 KR 100873667B1 KR 1020070071712 A KR1020070071712 A KR 1020070071712A KR 20070071712 A KR20070071712 A KR 20070071712A KR 100873667 B1 KR100873667 B1 KR 100873667B1
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South Korea
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plate
injection
peltier element
mold
injection molding
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KR1020070071712A
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Korean (ko)
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김병희
신홍규
조창연
서영호
박동영
홍남표
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강원대학교산학협력단
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/33—Moulds having transversely, e.g. radially, movable mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/7207—Heating or cooling of the moulded articles
    • B29C2045/7257—Cooling or heating pins with temperature adjustment enhancing surface structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C2045/7362—Heating or cooling of the mould turbulent flow of heating or cooling fluid

Abstract

An injection mold using a Peltier element is provided to heat up and cool the mold more rapidly so that the molded material is prevented from being scorched or torn. An injection mold using comprises a fixed plate(100b) and a movable plate(100a) in which injection molding plates(110) are fixed in the center and a combination groove(101) for binding the injection molding plate is formed on the contact surface of the fixed and movable plates, a Peltier element(114) which is combined to the injection molding plate for rapid heating and cooling, an insulation board(120) for blocking the heat transfer which is interposed between the combination groove and the injection molding plate and has a cut groove(121) formed on the contact side with the Peltier element, and an aluminium plate(130) formed on the cut groove for smooth heat transmission with the Peltier element.

Description

펠티어소자를 이용한 사출금형{A Injection Mold Using The Peltier Device}Injection Mold Using The Peltier Device

본 발명은 기존 사출기에 비하여 금형의 빠른 가열을 통해 사출 가능 시간을 단축시키며, 또한 빠른 냉각을 가능하게 하여 이형시 뜯김이나 눌러붙는 현상을 감소시킬 수 있는 펠티어소자를 이용한 나노 사출금형에 관한 것으로, 보다 상세하게는 금형의 국부적인 온도의 컨트롤을 통해 최적 온도 조건으로 사출이 가능하도록 하여 가열과 냉각을 통해 마이크로-나노 구조물의 사출성형에서 높은 성형성을 갖도록 한 구조의 펠티어소자를 이용한 사출금형에 관한 것이다.The present invention relates to a nano-injection mold using a Peltier element that can reduce the time available for injection through the rapid heating of the mold as compared to the conventional injection molding machine, and also to enable rapid cooling to reduce the tearing or sticking phenomenon during release. More specifically, the injection mold using the Peltier element structured to have high moldability in the injection molding of micro-nano structure through heating and cooling by enabling injection at the optimum temperature condition by controlling the local temperature of the mold. It is about.

강원대학교 기계/메카트로닉스 공학과 한국소성가공학회 2007년도 춘계학술대회 논문집 PP.183 ~ 186Kangwon National University Dept.of Mechanical / Mechatronics Engineering Korean Society of Plastics and Engineering Proceedings 2007 Spring Conference PP.183 ~ 186

본 발명은 본 발명은 기존 사출기에 비하여 금형의 빠른 가열을 통해 사출 가능 시간을 단축시키며, 또한 빠른 냉각을 가능하게 하여 이형시 뜯김이나 눌러붙는 현상을 감소시킬 수 있는 펠티어소자를 이용한 사출금형에 관한 것이다.The present invention relates to an injection mold using a Peltier element that can reduce the time to be injected through the rapid heating of the mold as compared to the conventional injection molding machine, and also to enable rapid cooling to reduce the tearing or sticking phenomenon during mold release. will be.

일반적으로 고용량의 미디어 발달로 정보 저장 용량 증가를 위해 많은 연구와 새로운 제품의 출시가 이루어지고 있다.In general, due to the development of high-capacity media, a lot of research and new product releases are being conducted to increase information storage capacity.

현재 이동식 정보저장 매체의 발전은 대용량 광 정보 저장매체(DVD, BD(Blue ray)와, 플래시 저장매체와 같이 크게 두 가지의 방향으로 발전을 이루고 있다.Currently, the development of removable information storage media has been developed in two directions, large capacity optical information storage media (DVD, BD (Blue ray), and flash storage media).

이 중 현재 멀티미디어 저장 매체로 가장 많이 사용되고 있는 광 정보 저장매체의 생산에는 사출 성형 공정을 사용하고 있다.Among them, the injection molding process is used for the production of the optical information storage medium, which is the most widely used multimedia storage medium.

사출성형 공정은 저렴한 생산비용으로 폴리머 표면에 나노 구조물이나, 광학회절 제품 등과 같은 높은 정밀도를 유지하고 대량생산을 할 수 있는 효과적인 생산기술이다.The injection molding process is an effective production technology that enables mass production while maintaining high precision such as nanostructures or optical diffraction products on polymer surfaces at low production costs.

이러한 정밀한 구조물의 사출성형에서 높은 정밀도 유지조건과, 높은 AR(Aspect ratio) 성형조건, 마이크로 나노 체널의 폴리머 유동 조건에 있어 가장 중요한 조건 중의 하나가 금형의 온도이다.In the injection molding of such a precise structure, the temperature of the mold is one of the most important conditions in maintaining high precision, high aspect ratio (AR) molding conditions, and polymer flow conditions of the micro nanochannels.

전통적인 사출성형의 금형온도 조절은 물을 이용한 수냉과, 공기를 이용한 공냉 방식이다.The mold temperature control of the conventional injection molding is water cooling using water and air cooling using air.

이러한 전통적인 사출성형은 금형 온도 조절의 컨트롤이 수동적이거나 세미 엑티브(Semi-active)하여 에어 플로어 마크(air-floe mark)나 뜯김, 붙는 등의 성형 불량의 원인이 되었다.This traditional injection molding is passive or semi-active to control mold temperature control, causing mold defects such as air-floe marks, tearing and sticking.

때문에 마이크로 나노 구조물과 같은 정밀을 요하는 사출성형에서 금형의 국부적인 온도의 컨트롤을 통해 최적 온도 조건으로 사출이 가능하도록 하여 사출성형에서 높은 성형성을 갖도록 한 구조의 사출금형이 요구되고 있는 실정이다.Therefore, in the injection molding requiring precision such as micro-nano structure, the injection mold of the structure that has high moldability in injection molding is required by enabling the injection at the optimum temperature condition by controlling the local temperature of the mold. .

본 발명은 중앙부위에 각각 사출성형판이 고정된 고정형판 및 이동형판으로 구성되되, 상기 사출성형판의 타면으로는 급속한 가열과 냉각이 가능하도록 펠티어소자가 결합되어 구성되는 것을 특징으로 하는 펠티어소자를 이용한 사출금형을 제공하는 것이다.The present invention is composed of a fixed plate and a movable plate fixed to the injection molded plate in the center portion, respectively, the other side of the injection molded plate Peltier device characterized in that the Peltier device is configured to be coupled to enable rapid heating and cooling It is to provide an injection mold used.

본 발명에 따른 펠티어소자를 이용한 사출금형은 기존 사출기에 비하여 금형의 빠른 가열을 통해 사출 가능 시간을 단축시키며, 또한 빠른 냉각을 가능하게 하여 이형시 뜯김이나 눌러붙는 현상을 감소시킬 수 있는 특징이 있다. Injection mold using the Peltier device according to the present invention has a feature that can reduce the time available for injection through the rapid heating of the mold compared to the conventional injection molding machine, and also to enable fast cooling to reduce the tearing or pressing phenomenon during the release. .

또한 마이크로 나노 구조물과 같은 정밀을 요하는 사출성형에서 금형의 국부적인 온도의 컨트롤을 통해 최적 온도 조건으로 사출이 가능하도록 하여 가열과 냉각을 통해 마이크로-나노 구조물의 사출성형에서 적은 비용으로 높은 성형성을 갖는 특징이 있다.In addition, in injection molding requiring precision such as micro nano structure, it is possible to inject at optimum temperature condition by controlling the local temperature of the mold, and high moldability at low cost in injection molding of micro-nano structure through heating and cooling. It is characterized by having.

이하에서는 본 발명에 따른 펠티어소자를 이용한 사출금형에 대하여 첨부되 어진 도면과 함께 더불어 상세히 설명하기로 한다.Hereinafter, the injection mold using the Peltier device according to the present invention will be described in detail together with the accompanying drawings.

먼저 본 발명을 설명하기 앞서 본 발명이 적용된 사출기에 대하여 설명하기 로 한다.First, the injection molding machine to which the present invention is applied will be described before explaining the present invention.

도 1은 본 발명이 적용된 사출기를 도시한 개념도이다.1 is a conceptual diagram showing an injection machine to which the present invention is applied.

도 1에 도시된 바와 같이, 본 발명이 적용된 사출기(200)는 크게 3부분으로 구성되는데, 이는 폴리머가 투입되는 호퍼(211)가 형성된 사출실린더(210)와, 상기 사출실린더(210)에 결합되어 폴리머를 사출하는 유압실린더(220)와, 상기 사출실린더(210)에 결합되는 사출금형(100)에 보압력을 유지시키는 공압실린더(230)로 구성된다.As shown in FIG. 1, the injection machine 200 to which the present invention is applied is composed of three parts, which are coupled to the injection cylinder 210 and the injection cylinder 210 in which a hopper 211 into which a polymer is injected is formed. And a hydraulic cylinder 220 for injecting the polymer, and a pneumatic cylinder 230 for maintaining the holding pressure in the injection mold 100 coupled to the injection cylinder 210.

여기서 본 발명의 사출금형(100)은 고정형판(100b)과, 이동형판(100a)으로 분리구성되며, 이동형판(100a)은 공압실린더(230)에 의해 고정형판(100b)으로 이송되는 구조이다. 이 때 상기 공압실린더(230)는 이동형판(100a)이 고정형판(100b)에 밀착되면 사출금형(100)에 보압력을 계속해서 유지시켜 준다. 따라서 상기 공압실린더(230)는 유압실린더(220)에 의해 폴리머가 유입될 시 이동형판(100a)이 움직이지 못하도록 하는 기능을 한다.Here, the injection mold 100 of the present invention is configured to be separated into the stationary plate 100b and the movable plate 100a, and the movable plate 100a is transferred to the stationary plate 100b by the pneumatic cylinder 230. . At this time, the pneumatic cylinder 230 keeps the holding pressure on the injection mold 100 when the movable mold 100a is in close contact with the fixed mold 100b. Therefore, the pneumatic cylinder 230 functions to prevent the movable die 100a from moving when the polymer is introduced by the hydraulic cylinder 220.

한편 상기 본 발명의 사출금형(100)인 고정형판(100b)과 이동형판(100a)은 각각 밀착면으로 펠티어소자(114)가 결합된 사출성형판(110)이 결합되어 있어 사출성형판(110)의 급속한 냉각과 가열이 용이하도록 구성된다.On the other hand, the fixed mold plate 100b and the movable plate 100a, which are the injection mold 100 of the present invention, are injection molded plates 110 to which the Peltier element 114 is coupled to each other by a close contact with each other. It is configured to facilitate rapid cooling and heating.

도 2은 본 발명에 따른 펠티어소자를 이용한 사출금형은 단면 구성도이고, 도 3는 도 2에서 발췌된 사출성형판의 사시도이다.2 is a cross-sectional configuration of the injection mold using the Peltier device according to the present invention, Figure 3 is a perspective view of the injection molding plate extracted from FIG.

도 2 및 도 3에 도시된 바와 같이, 본 발명은 중앙부위에 각각 사출성형판(110)이 고정된 고정형판(100b) 및 이동형판(100a)으로 구성되되, 상기 사출성형판(110)의 타면으로는 급속한 가열과 냉각이 가능하도록 펠티어소자(114)가 결합되어 구성되는 것을 특징으로 하는 펠티어소자를 이용한 사출금형(100)에 관한 것이다.As shown in Figure 2 and 3, the present invention is composed of a fixed mold plate (100b) and a movable mold plate (100a) fixed to the injection molded plate 110 in the central portion, respectively, of the injection molded plate (110) The other side relates to an injection mold 100 using a Peltier element, characterized in that the Peltier element 114 is configured to be coupled to enable rapid heating and cooling.

본 발명의 펠티어소자를 이용한 사출금형(100)은 크게 2부분으로 구성되는데, 이는 중앙부위에 각각 사출성형판(110)이 고정된 고정형판(100b) 및 이동형판(100a)으로 구성되되, 상기 사출성형판(110)은 급속한 가열과 냉각이 가능하도록 펠티어소자(114)가 결합되는 구성이다.Injection mold 100 using the Peltier device of the present invention is composed of two parts, which is composed of a fixed mold plate (100b) and a movable mold (100a) fixed to the injection molding plate 110 in the central portion, respectively, The injection molding plate 110 is a configuration in which the Peltier element 114 is coupled to enable rapid heating and cooling.

여기서 상기 고정형판(100b) 및 이동형판(100a)은 상호 밀착면에 사출성형판(110)을 결합시키기 위한 결합홈(101)이 각각 형성되어 있는 구조이다.Here, the stationary plate 100b and the movable plate 100a have a structure in which coupling grooves 101 for coupling the injection molding plate 110 to each other are in close contact with each other.

아울러 각 사출성형판(110)은 고정형판(100b) 및 이동형판(100a)의 결합홈(101)에 고정될 수 있도록 모서리 4개소에 체결홈(111)이 형성되어 있어 볼트(111a) 결합되는 구조이다.In addition, each injection molding plate 110 has fastening grooves 111 formed at four corners to be fixed to the coupling grooves 101 of the stationary plate 100b and the movable plate 100a, so that the bolts 111a are coupled thereto. Structure.

이 때 상기 각 사출성형판(110)은 고정형판(100b) 및 이동형판(100a)과 밀착되는 타면으로는 2개의 펠티어소자(114)를 안착시킬 수 있는 한쌍의 안착홈(112)이 형성된 구조이며, 상기 안착홈(112)에는 펠티어소자(114)의 열전달이 용이하도록 써멀그리스(Thermal grease)(112a)가 도포된 구성이다. 따라서 상기 각 사출성형판(110)은 펠티어소자(114)가 위치된 반대면에 폴리머합성수지재가 성형되는 구조 이다.At this time, each injection molded plate 110 has a structure in which a pair of seating grooves 112 for seating two Peltier elements 114 on the other surface closely contacted with the stationary plate 100b and the movable plate 100a. The mounting groove 112 has a thermal grease 112a coated thereon to facilitate heat transfer of the Peltier element 114. Therefore, each of the injection molding plates 110 has a structure in which a polymer synthetic resin material is molded on the opposite surface on which the Peltier element 114 is located.

한편 상기 펠티어소자(114)는 세라믹절연층을 사이에 두고 P형반도체와 N형반도체 전체가 직열로 이루어져 구성된다. 이 때 세라믹절연층과, P형반도체 및 N형반도체의 사이에는 열전달을 위해 전도층이 형성되어 있는 구조이다.(미도시)On the other hand, the Peltier element 114 is composed of a P-type semiconductor and the entire N-type semiconductor in series with a ceramic insulating layer interposed therebetween. At this time, a conductive layer is formed between the ceramic insulating layer and the P-type semiconductor and the N-type semiconductor for heat transfer.

상기 펠티어소자(114)는 냉각면과 발열면이 바뀌게 되는 구성인데, 이는 전압이 흐르는 방향에 따라 펠티어소자(114)의 전자 및 정공의 흐름도 바뀌게 되어 결과적으로 열을 방출하고 흡수하는 냉각면과 가열면을 선택적으로 조절할 수 있는 구조이다. The Peltier element 114 has a configuration in which the cooling surface and the heating surface are changed, which changes the flow of electrons and holes of the Peltier element 114 according to the direction in which the voltage flows, and consequently, the cooling surface and the heating surface emit and absorb heat. It is a structure that can selectively adjust the face.

따라서 이러한 상기의 펠티어소자(114)를 사출성형판(110)에 결합시켜 사출성형판(110)의 온도를 제어할 수 있게 한 구성이다.Therefore, the Peltier device 114 is coupled to the injection molded plate 110 to control the temperature of the injection molded plate 110.

한편 상기 사출성형판(110)에는 온도를 측정하기 위한 서머커플(Thermocouple)(140)이 결합되어 구성되는데, 상기의 서머커플(140)은 상호 밀착되는 사출성형판(110)의 사이에 개재되며, 이러한 서머커플(140)은 상기 각 사출성형판(110)에 형성된 선형의 홈부(113)에 삽입되는 구성이다.On the other hand, the injection molded plate 110 is composed of a thermocouple (Thermocouple) 140 for measuring the temperature is coupled, the thermocouple 140 is interposed between the injection molded plate 110 in close contact with each other. The thermocouple 140 is inserted into a linear groove 113 formed in each injection molded plate 110.

여기서 상기 서머커플(140)은 각각의 사출성형판(110)의 온도를 개별적으로 측정할 수 있도록 각각의 사출성형판(110)에 설치하여도 무방하다.Here, the thermocouple 140 may be installed on each injection molded plate 110 so as to individually measure the temperature of each injection molded plate 110.

이러한 서머커플(140)은 상기 사출성형판(110)의 온도를 측정하여 측정된 온도에 따라 펠티어소자(114)의 전압을 조절하여 소망하는 온도의 컨트롤을 통해 최적 온도 조건으로 사출할 수 있도록 하여 가열과 냉각을 통해 마이크로-나노 구조물의 높은 성형성을 갖질 수 있다.The thermocouple 140 measures the temperature of the injection molded plate 110 and adjusts the voltage of the Peltier element 114 according to the measured temperature so that the thermocouple 140 can be injected at an optimum temperature condition by controlling the desired temperature. Heating and cooling can provide high formability of the micro-nano structure.

한편 상기 사출성형판(110)은 상기 고정형판(100b) 및 이동형판(100a)에 형성된 결합홈(101)이 각각 결합되는 구조인데. 이 때 상기 각 결합홈(101)과 사출성형판(110)의 사이에는 열전달을 차단하기 위한 단열판(120)이 개재되는 구성이다.Meanwhile, the injection molding plate 110 is a structure in which the coupling grooves 101 formed in the stationary plate 100b and the movable plate 100a are respectively coupled. At this time, the insulating plate 120 for blocking heat transfer is interposed between the coupling grooves 101 and the injection molded plate 110.

이러한 단열판(120)은 펠티어소자(114)에 의해 발열되는 사출성형판(110)의 열의 방출을 막기 위한 것이다.The heat insulating plate 120 is to prevent the release of heat of the injection molded plate 110 generated by the Peltier element 114.

여기서 상기 단열판(120)은 펠티어소자(114)와의 밀착면으로 절개홈(121)이 형성되어 있다. 이러한 절개홈(121)에는 알루미늄판(130)이 개재되어 펠티어소자(114)와의 열전달이 원활하도록 구성된다.In this case, the insulating plate 120 is formed with a cutting groove 121 in close contact with the Peltier element 114. An aluminum plate 130 is interposed in the incision groove 121 and is configured to facilitate heat transfer with the Peltier element 114.

즉, 본 발명은 폴리머합성수지재가 주입시키기 전에 펠티어소자를 통해 사출성형판을 가열시키되, 열손실을 방지하기 위해 단열판이 개재되는 구성이며, 이 후 펠티어소자를 전압의 흐름을 반대방향으로 하여 사출성형판을 냉각시킬때는 알루미늄판을 통해 열방출을 원활히 하여 냉각의 효과를 극대화한 구조이다.That is, the present invention is configured to heat the injection molded plate through the Peltier element before the polymer resin material is injected, the insulating plate is interposed to prevent heat loss, after which the Peltier element is injection molded in the opposite direction of the flow of voltage When cooling the plate, it is a structure that maximizes the cooling effect by smoothly dissipating heat through the aluminum plate.

상기와 같이 본 발명에 따른 펠티어소자를 이용한 사출금형(100)은 폴리머합성수지재를 사출금형(100)내로 주입하기 전에 펠티어소자(114)를 통해 사출성형판(110)의 온도를 상승시켜 주입되는 폴리머합성수지의 주입밀도를 높여 성형성을 증대시키고, 이 후 펠티어소자(114)를 통해 사출성형판(110)을 급속히 냉각시켜 이형시 뜯김이나 눌러붙는 현상을 감소시킬 수 있는 구성이다.As described above, the injection mold 100 using the Peltier element according to the present invention is injected by raising the temperature of the injection molding plate 110 through the Peltier element 114 before injecting the polymer synthetic resin material into the injection mold 100. The injection density of the polymer synthetic resin is increased to increase the moldability, and then the Peltier device 114 rapidly cools the injection molding plate 110 to reduce tearing or sticking phenomenon during mold release.

도 1은 본 발명이 적용된 사출기를 도시한 개념도,1 is a conceptual diagram showing an injection machine to which the present invention is applied;

도 2는 본 발명에 따른 펠티어소자를 이용한 사출금형은 단면 구성도,2 is a cross-sectional configuration of the injection mold using the Peltier device according to the present invention;

도 3은 도 1에서 발췌된 사출성형판의 사시도,Figure 3 is a perspective view of the injection molded plate extracted from Figure 1,

도 4는 본 발명에 따른 펠티어소자를 이용한 사출금형의 열전달을 도시한 개념도이다.4 is a conceptual diagram illustrating heat transfer of an injection mold using a Peltier device according to the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

100: 본 발명에 따른 펠티어소자를 이용한 사출금형,100: injection mold using the Peltier device according to the present invention,

100a: 이동형판 100b: 고정형판100a: moving plate 100b: fixed plate

101: 결합홈 110: 사출성형판101: coupling groove 110: injection molding plate

111: 체결홈 111a: 볼트111: fastening groove 111a: bolt

112: 안착홈 112a: 써멀그리스112: seating groove 112a: thermal grease

113: 홈부 114: 펠티어소자113: groove 114: Peltier element

120: 단열판 121: 절개홈120: insulation plate 121: incision groove

130: 알루미늄판 140: 서머커플130: aluminum plate 140: thermocouple

200: 사출기 210: 사출실린더200: injection machine 210: injection cylinder

211: 호퍼 220: 유압실린더211: hopper 220: hydraulic cylinder

230: 공압실린더 230: pneumatic cylinder

Claims (6)

사출기의 사출금형에 있어서,In the injection mold of the injection machine, 중앙부위에 각각 사출성형판(110)이 고정된 고정형판(100b) 및 이동형판(100a)으로 구성되되,Consists of a fixed mold plate (100b) and a movable mold plate (100a) fixed to the injection molded plate 110, respectively in the central portion, 상기 사출성형판(110)은 급속한 가열과 냉각이 가능하도록 펠티어소자(114)가 결합되어 구성되며,The injection molding plate 110 is configured by combining the Peltier element 114 to enable rapid heating and cooling, 상기 고정형판(100b) 및 이동형판(100a)은 상호 밀착면에 사출성형판(110)을 결합시키기 위한 결합홈(101)이 각각 형성되고, 상기 각 결합홈(101)과 사출성형판(110)의 사이에는 열전달을 차단하기 위한 단열판(120)이 개재되며,The stationary plate 100b and the movable plate 100a are formed with coupling grooves 101 for coupling the injection molding plate 110 to each other in close contact with each other, and each of the coupling grooves 101 and the injection molding plate 110 is formed. Between) is interposed a heat insulating plate 120 for blocking heat transfer, 상기 각 단열판(120)은 펠티어소자(114)와의 밀착면으로 절개홈(121)이 형성되고, 상기 각 절개홈(121)에는 펠티어소자(114)와의 열전달이 원활하도록 알루미늄판(130)이 개재되는 것을 특징으로 하는 펠티어소자를 이용한 사출금형.Each of the insulation plates 120 is formed with an incision groove 121 in close contact with the Peltier element 114, and the aluminum plate 130 is interposed in each of the incision grooves 121 to facilitate heat transfer with the Peltier element 114. Injection mold using the Peltier element, characterized in that the. 제 1항에 있어서,The method of claim 1, 상기 사출성형판(110)과 펠티어소자(114)의 사이에는 고른 열전달이 용이하도록 써멀그리스(112a)가 도포되는 것을 특징으로 하는 펠티어소자를 이용한 사출금형.An injection mold using the Peltier element, characterized in that the thermal grease (112a) is applied between the injection molded plate 110 and the Peltier element (114) to facilitate even heat transfer. 제 1항에 있어서,The method of claim 1, 상기 사출성형판(110)에는 온도를 측정하기 위한 서머커플(140)이 결합되어 구성되는 것을 특징으로 하는 펠티어소자를 이용한 사출금형.The injection molding plate 110 is an injection mold using a Peltier element, characterized in that the thermocouple 140 for measuring the temperature is coupled to be configured. 삭제delete 삭제delete 삭제delete
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011111986A2 (en) * 2010-03-08 2011-09-15 주식회사 나다이노베이션 Mold having porous member arranged together with electric heater and method and apparatus for rapidly heating/cooling same
KR101204460B1 (en) 2010-03-08 2012-11-23 주식회사 나다이노베이션 Forming mold having porous member installed with electric heater, method for rapid heating/cooling of the forming mold, and apparatus for rapid heating/cooling of the forming mold
US10549465B2 (en) 2014-03-19 2020-02-04 Sabic Global Technologies B.V. Injection mold with thermoelectric elements

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07184354A (en) * 1993-12-24 1995-07-21 Agency Of Ind Science & Technol Self-cooling motor
JPH1052842A (en) * 1996-08-12 1998-02-24 Nec Corp Mold temperature regulator
KR100708947B1 (en) * 2006-02-23 2007-04-18 이진영 A cooling and heating apparatus with thermal electric module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07184354A (en) * 1993-12-24 1995-07-21 Agency Of Ind Science & Technol Self-cooling motor
JPH1052842A (en) * 1996-08-12 1998-02-24 Nec Corp Mold temperature regulator
KR100708947B1 (en) * 2006-02-23 2007-04-18 이진영 A cooling and heating apparatus with thermal electric module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011111986A2 (en) * 2010-03-08 2011-09-15 주식회사 나다이노베이션 Mold having porous member arranged together with electric heater and method and apparatus for rapidly heating/cooling same
WO2011111986A3 (en) * 2010-03-08 2012-03-15 주식회사 나다이노베이션 Mold having porous member arranged together with electric heater and method and apparatus for rapidly heating/cooling same
KR101204460B1 (en) 2010-03-08 2012-11-23 주식회사 나다이노베이션 Forming mold having porous member installed with electric heater, method for rapid heating/cooling of the forming mold, and apparatus for rapid heating/cooling of the forming mold
US10549465B2 (en) 2014-03-19 2020-02-04 Sabic Global Technologies B.V. Injection mold with thermoelectric elements

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