KR100870854B1 - Multiple thermal cutting device, multiple thermal cutting method and computer-readable storage medium storing a processing program creation computer program to implement the same - Google Patents

Abstract

The present invention is a complex thermal cutting device having both a laser head and a plasma torch that can be independently controlled, and which can perform both laser processing and plasma processing, so that both thermal cutting heads can be appropriately used. Reduce running costs. The composite cutting device includes a laser head and a plasma torch. Many cutting lines for cutting various products from each sheet are classified into laser cutting type and plasma cutting type according to the cutting length, the outer periphery or the life of the product, the size of the product or the hole, the required processing precision, the plate thickness, and the like. . The line of the laser cutting type is cut by laser processing, and the line of the plasma cutting type is cut by plasma processing, respectively.

Description

MULTIPLE THERMAL CUTTING DEVICE, MULTIPLE THERMAL CUTTING METHOD AND COMPUTER-READABLE STORAGE MEDIUM STORING A PROCESSING PROGRAM CREATION COMPUTER PROGRAM TO IMPLEMENT THE SAME}

The present invention relates to a composite thermal cutting device and a composite thermal cutting method having two kinds of thermal cutting heads of laser and plasma.

Patent Literature 1 discloses an apparatus in which two thermal cutting heads, plasma and laser, are mounted in a turret punch press. The cutting head of either the plasma cutting head or the laser cutting head can be selected and brought to the cutting position.

In Patent Document 2, one or two carriages which are movable in the lateral direction are mounted on one gantry that is movable in the longitudinal direction across the table, and two thermal cutting heads of plasma and laser are listed in each carriage. A mounted device is disclosed. In one carriage, either one of a plasma cutting head and a laser cutting head is selected and used. In the case of using two carriages mounted on one gantry, two identical patterns or patterns in a mirror relationship can be cut at the same time.

In Patent Document 3, one machining head (carriage) which is movable in the lateral direction is mounted on one X-axis movable body (gantry) that is movable in the longitudinal direction across the table, and the plasma torch and the laser are mounted on the processing head. A device mounted with the heads enumerated is disclosed. The laser head and the plasma torch are divided according to whether it is pierced or cut. For example, pierce processing is performed with a laser head, and cutting processing is performed with a plasma torch.

Patent Document 1: US Patent No. 5350897

Patent Document 2: Japanese Patent Application Laid-Open No. 9-108875

Patent Document 3: Japanese Unexamined Patent Publication No. 2001-25873

Problems to be Solved by the Invention

In general, in the thermal cutting device, the reduction of the running cost (for example, the power consumption for generating the laser beam, the cost of the electrode of the plasma torch, etc.) is a very important problem. However, the patent document described above does not disclose a special technique for reducing the running cost.

In addition, in the case of mounting two kinds of thermal cutting heads of laser and plasma, it is conceivable that each head influences each other, but in the above document, the influence of two different thermal cutting heads on each other is sufficiently considered. Not. For example, it can be considered that processing by one heat cutting head affects processing by the other heat cutting head in terms of precision and durability, but in the prior art, sufficient measures are taken against each other. There was not.

Accordingly, an object of the present invention is to reduce the running cost in a complex thermal cutting device having a laser and plasma thermal cutting head. Another object of the present invention is to reduce the influence of one thermal cutting head on the other thermal cutting head in a composite thermal cutting device having different thermal cutting heads of laser and plasma.

Means to solve the problem

According to the present invention, a composite thermal cutting device having a plasma torch for generating a plasma arc and a laser head for generating a laser beam includes a table for holding a sheet and within the work space on the table, the plasma torch and the A moving mechanism for moving the laser head, and control means for controlling the plasma torch, the laser head, and the moving mechanism such that the plate on the table is cut along a predetermined cutting line. The control means defines the cutting line and classifies the cutting line into a plasma cutting type and a laser cutting type according to processing conditions including the geometric characteristics or processing accuracy of the cutting line or the characteristics of the sheet. An upper level control device having a processing instruction information, a plasma control device for controlling the plasma torch based on the processing instruction information, and cutting along the cutting line of the plasma cutting type; and based on the processing instruction information. It has a laser control apparatus which controls a laser head and cuts along the said cutting line of the said laser cutting type.

According to this composite cutting device, when cutting a plate along one or more cutting lines, the use of the plasma torch and the laser head can be divided according to cutting conditions such as the geometric characteristics of the cutting line, the processing accuracy, or the characteristics of the plate. . Accordingly, the cutting line having a more favorable condition for cutting by the plasma torch is costly cut by the plasma torch, and the cutting line having a favorable condition for cutting by the laser head is cut by the laser head. This becomes possible, and therefore, the running cost of cutting can be reduced.

As a method for classifying the cutting line into a plasma cutting type and a laser cutting type,

(1) a method according to the continuous length of the cutting line, for example, a plasma cutting type if it is longer than a predetermined criterion, or a laser cutting type if it is short;

(2) depending on whether the cutting line corresponds to one of the outer periphery and the hole of the product, for example, the method of dividing into a plasma cutting type if the outer periphery, laser cutting type if the hole;

(3) depending on the thickness of the plate, for example, if the thickness is thicker than a predetermined standard, a method of classifying it as a plasma cutting type, or thinning a laser cutting type

(4) According to the processing accuracy, for example, if the accuracy is lower than the predetermined reference, the method of classification such as plasma cutting type, high laser cutting type,

(5) According to the number of holes of the product, for example, a method of classifying a cutting line of a product having a smaller number of holes than a predetermined criterion is a plasma cutting type, and a cutting line of a product having a larger number of holes than a predetermined criterion such as a laser cutting type, or

(6) According to the size (diameter) of the product or the hole, for example, the cutting line of the product or the hole of a size larger than the predetermined standard is the plasma cutting type, and the cutting line of the product or the hole of the size smaller than the predetermined standard is the laser cutting type. How to categorize together,

And the like can be used alone or in combination.

According to another aspect of the present invention, a composite thermal cutting apparatus having a plasma torch for generating a plasma arc and a laser head for generating a laser beam includes a table for holding a plate and a working space on the table, the plasma A moving mechanism for moving the torch and the laser head, and a control device for controlling the plasma torch, the laser head, and the moving mechanism to cut the plate on the table along a cutting line. The plasma control device includes a plasma torch moving mechanism for moving the plasma torch and a laser head moving mechanism for moving the laser head, and the control means independently controls the plasma torch moving mechanism. And a laser control device that independently controls the laser head moving mechanism.

According to this composite thermal cutting device, plasma cutting and laser cutting can be performed simultaneously and simultaneously while moving the plasma torch and the laser head by mutually independent displacement amounts in mutually independent directions at different locations. Accordingly, the cutting line having a more favorable condition for cutting by the plasma torch costly is cut by the plasma torch, and the cutting line having a more favorable condition for cutting by the laser head is a plasma torch by the laser head. It becomes possible to cut | disconnect by this, and therefore the running cost of cutting can be reduced.

In a preferred embodiment, each of the plasma torch moving mechanism and the laser head moving mechanism is provided with a evacuation site at a place away from the work space. According to this configuration, it is also possible to evacuate one of the laser head moving mechanism or the plasma torch moving mechanism to the evacuation site, move the other freely, and perform only plasma cutting or laser cutting only in the whole work space.

According to another aspect of the present invention, a composite thermal cutting method for cutting a plate using a plasma arc and a laser beam along a cutting line comprises the steps of defining the cutting line, the geometric characteristics of the cutting line or the processing precision or Classifying the cutting line into a plasma cutting type and a laser cutting type according to processing conditions including the characteristics of the plate, cutting the plasma cutting type cutting line using the plasma torch, and cutting the laser cutting type. Cutting a cutting line of the laser beam using the laser beam.

According to still another aspect of the present invention, a computer program for creating a computer program for controlling a complex thermal cutting device for cutting a sheet material using a plasma torch and a laser head along a cutting line includes: Classifying the cutting line into a plasma cutting type and a laser cutting type according to the processing conditions including the characteristics or processing precision or the characteristics of the sheet, and cutting the plasma cutting type cutting line by the plasma torch. Creating a plasma processing program for instructing the composite thermal cutting device, and creating a laser processing program for instructing the composite thermal cutting device an order of cutting the laser cutting type cutting line by the laser head. On your computer.

According to another aspect of the present invention, a composite thermal cutting device having a plasma torch for generating a plasma arc and a laser head for generating a laser beam includes a table for holding a plate and moving the plasma torch on the table. A plasma torch moving mechanism, a laser head moving mechanism for moving the laser head on the table, the plasma torch, the laser head, the plasma torch moving mechanism, and the plate material on the table to be cut along a predetermined cutting line. And control means for controlling the laser head moving mechanism.

In a preferred embodiment, the control means controls the plasma torch moving mechanism and the laser head moving mechanism to independently move the plasma torch and the laser head, and controls the plasma torch to cut any cutting line of the plate. Cutting and also controlling the laser head to cut another cutting line of the sheet.

According to another aspect of the present invention, a composite thermal cutting device capable of performing both plasma processing and laser processing includes a table for holding a plate, a support portion formed near one side of the table, and movable along the table; The proximal end is supported by the support part, and the proximal side is placed over the table, and the arm part formed by extending the work space formed above the table from one side to the other side, and located near the proximal side of the arm part, can move the arm part. The laser beam is supplied to the laser head via a laser head formed in the center of the arm, a plasma torch positioned near the distal end of the arm part and movable to the arm part, and an optical path part formed at the proximal end of the arm part and extending along the arm part. To control the operation of the laser beam supply unit, the plasma torch, the laser head and the laser beam supply unit, respectively. Has control means. The plasma head is located near the tip side of the arm portion and the laser head is located near the proximal side of the arm portion, and the arm portion is formed to be movable, and a plasma head evacuation region for evacuating the plasma head is formed on the tip side of the arm portion. In the base end side of the arm portion, a laser head evacuation region for evacuating the laser head is formed. The control means controls the laser head to be evacuated to the laser head evacuation area when the plate is processed by the plasma torch, and to control the plasma torch to evacuate to the plasma torch evacuation area when the plate is processed by the laser head. .

In the composite thermal cutting device configured as described above, both the laser head and the plasma torch can be operated independently, and one head can retract the other head during operation. As a result, the effects of the laser head and the plasma torch on the counterpart's head can be reduced, respectively, and the reliability can be improved.

In another preferred embodiment, a shield is provided for at least partially shielding between the work space and the laser head evacuation area. Thereby, it can reduce that the sputter | spatter by plasma cutting affects a laser head.

In another preferable embodiment, it further comprises adjustment means for adjusting the optical axis of the laser beam supplied from a laser beam supply part to a laser head according to the position of a laser head. As a result, even when deviation occurs in the position of the laser head due to the self-weight of the laser head, for example, the optical axis can be adjusted in order to eliminate the influence caused by the position deviation.

In another preferred embodiment, the control means defines a cutting line for cutting the sheet material and further comprises cutting the cutting line into a plasma cutting type and a laser according to the processing conditions including the geometrical characteristics of the cutting line or the processing precision or the sheet material. A higher-level control device having processing instruction information classified into the cutting type, a laser control device for controlling the laser head based on the processing instruction information, and cutting along the cutting line of the laser cutting type, and plasma based on the processing instruction information. It is comprised by the plasma control apparatus which controls a torch and cuts along the cutting line of a plasma cutting type. Then, when the laser processing is performed, the laser control device shifts the laser beam supply unit to a wake-up state, and when the plasma processing is performed, the laser beam supply unit shifts to the sleep state. Let's do it. Thereby, only when laser processing is performed, a laser beam supply part can be made into the state which can be used immediately (wake-up state), and power consumption can be reduced.

In another preferable embodiment, the control means uses predetermined measurement data measured at the time of any one of plasma processing or laser processing also for the other processing. As a result, for example, the same measurement can be prevented from being performed in both processings, the switching time of plasma processing and laser processing can be shortened, and the processing performance of the composite thermal cutting device can be improved.

According to another aspect of the present invention, a composite thermal cutting device having both a laser head and a plasma torch includes a table for holding a plate, a moving means for moving the laser head and the plasma torch, respectively, above the table. And control means for controlling the operation of the plasma torch and the laser head, respectively. In addition, a plasma head evacuation region for evacuating the plasma head and a laser head evacuation region for evacuating the laser head are respectively formed outside the work space for performing laser processing or plasma processing, and the control means includes a plasma torch. In the case of processing a plate by using the laser head, the laser head is retracted into the laser head evacuation region, and when the sheet is processed by the laser head, the plasma torch is controlled to retract to the plasma torch evacuation region.

According to still another aspect of the present invention, a composite thermal cutting device having both a laser head and a plasma torch includes a table for holding a plate and a moving means for moving the laser head and the plasma torch, respectively, above the table. And a laser beam supply unit for supplying a laser beam to the laser head, and control means for controlling the operation of the plasma torch, the laser head, and the laser beam supply unit, respectively. Then, the control means gives an operation start command to the laser beam supply unit when the laser processing is performed, and gives an operation stop command to the laser beam supply unit when the plasma processing is performed.

According to another aspect of the present invention, a composite thermal cutting device having both a laser head and a plasma torch includes a table for holding a plate, a moving means for moving the laser head and the plasma torch, respectively, above the table. And distance detecting means for detecting a distance between the laser head and the plate and control means for controlling the operation of the plasma torch and the laser head, respectively. And a control means calculates the distance data between the said board | plate material and a plasma torch based on the distance data measured by the distance detection means at the time of laser processing, and plasma-processes the said board | plate material based on this calculated distance data. To be done. Thereby, by correcting the distance data measured at the time of laser processing, it can also be used for plasma processing, and the distance measurement at the time of performing a plasma processing can be skipped.

According to still another aspect of the present invention, a composite thermal cutting device having both a laser head and a plasma torch includes a table for holding a plate and a moving means for moving the laser head and the plasma torch, respectively, above the table. And a laser beam supply unit for supplying a laser beam to the laser head, and adjustment means for adjusting the optical axis of the beam of light supplied from the laser beam supply unit to the laser head. The adjusting means includes a mirror portion for reflecting the laser beam, a posture change portion for changing the posture of the mirror portion in a predetermined direction, and a posture control portion for inputting and operating a control signal to the posture change portion. The posture control unit is based on a position detection unit that detects the position of the laser head, a correction amount storage unit that stores a correction amount for eliminating the positional shift occurring in the mirror unit according to the position change of the laser head, and a detection signal from the position detection unit. By referring to the correction amount storage section, a signal generation section for generating and outputting a control signal for operating the posture change section is provided. Thereby, the fall of the processing precision by the position shift of a laser head can be suppressed.

Effects of the Invention

According to the present invention, the running cost can be reduced in the composite thermal cutting device. Moreover, according to this invention, the influence which one heat cutting head has on the other heat cutting head can be reduced, and reliability can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the whole structure of the composite thermal cutting device which concerns on one Embodiment of this invention.

2 is a perspective view showing a state in which the laser head and the plasma torch are separately used according to the thickness of the sheet in the composite thermal cutting device.

3 is a perspective view showing a state in which the laser head and the plasma torch are separately used according to the geometrical characteristics of the cutting line or the degree of processing in the composite thermal cutting device.

4 is a perspective view showing a state in which the laser head and the plasma torch are separately used according to the geometric characteristics or the degree of processing of the cutting line in the composite thermal cutting device.

Fig. 5 is a perspective view showing a state in which a thick plate is cut using only a plasma torch in the composite thermal cutting device.

6 is a block diagram showing the configuration of the laser control device 60, the plasma control device 62, and the higher level control device 64.

7 is a flowchart showing a procedure in which the machining program creating apparatus creates the laser machining program 70 and the plasma machining program 72.

FIG. 8: is a top view which shows the example which cut | disconnects the sheet material 50 of a combination of laser cutting and plasma cutting.

9 is a diagram showing a schematic change in the running cost of laser cutting and plasma cutting due to a difference in cutting conditions.

It is explanatory drawing which shows the whole structure of the composite heat cutting device which concerns on other embodiment of this invention.

11 is a perspective view of a composite thermal cutting device.

It is a front view which shows the state which laser-processes in the state which retracted the plasma torch.

It is a front view which shows the state which performs a plasma processing in the state which retracted the laser head.

14 is a flowchart showing an outline of a process for retracting a plasma torch and a laser head according to the type of processing.

15 is an explanatory diagram schematically showing positions of a laser head and a plasma torch in laser processing and plasma processing, in which (A) shows a state during laser processing and (B) shows a state during plasma processing, respectively.

It is a flowchart which shows the outline | summary of the process of creating the laser processing program which could reduce the power used for laser processing.

It is a flowchart which shows the outline | summary of the process which performs laser processing based on a laser processing program.

18 is a flowchart showing an outline of a process of performing plasma processing using distance data measured with respect to a laser head.

19 is a flowchart showing an outline of a process of performing laser processing using distance data measured with respect to the plasma torch.

It is explanatory drawing which shows the outline | summary of the structure which adjusts the optical axis of the laser beam supplied to a laser head according to the position of a laser head.

21 is a flowchart showing an outline of a process for adjusting an optical axis.

FIG. 22: is a schematic diagram which shows the state which adjusts an optical axis, (A) output light beam when a position shift does not generate | occur | produce in a laser head, (B) output light beam when a position shift occurs to a laser head (C) shows the case where the optical axis of the incident light beam was adjusted so as to eliminate the positional shift of the laser head.

It is explanatory drawing which shows typically the optical system for inputting a laser beam into a laser head.

24 is a perspective view illustrating a mechanism for adjusting an optical axis of a laser beam.

* Description of the sign *

10... Composite heat cutting device, 12... Table, 14... X axis trajectory, 16... Laser shuttle, 18... Plasma shuttle, 20, 26... Moving cart, 22, 28... Y axis trajectory, 24, 30... Carriage, 32... Working space, 34, 36... Evacuation site, 40... Laser head, 42... Plasma torch, 44... Sheet metal, 46... Thick plate, 47... Laser processing area, 48... Plasma processing region, 49... Combined machining area, 50... Plate, 52, 54... Product, 56... Thick plate, 60... Laser control device, 62... Plasma control unit, 64... Upper control unit, 70... Laser processing program, 72... Plasma processing program, 80... Program creation apparatus, 94, 100, 102... Product's outer periphery, 92... Hole, 200... Table, 210... Plate, 300... Base portion, 301... X axis trajectory, 310... Moving support, 320... Arm portion, 330... Y axis trajectory, 340... Shielding portion, 410... Laser oscillation device, 411... Laser light source, 420... Optical system box, 421... Exit mirror, 421A... Mirror support, 421B... Mirror, 421C... Branch, 421D... Piezo elements 422, 423, 424... Mirror, 430... Guide barrel, 500... Laser head, 510... Connector 511... Folded mirror, 520... Laser head carriage, 600... Plasma torch, 610... Plasma torch carriage, 700... Host controller 701, 702. Signal transmission path, 710... A processing unit, 720... Memory, 721... Laser processing program, 722... Plasma processing program, 723... Evacuation control program, 724. Power saving program, 725... Head height adjustment program, 726... Optical axis control program, 730... Input device, 810... Laser controller, 811... Height sensor, 820... Plasma control device, 821... Height sensor, 830... Mirror angle adjuster, 831... Piezo element driving circuit, 832... Piezo element drive voltage calculating section, 833... Laser head Y-axis position detection unit, 834. Calibration data map

Implement the invention  Best form for

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to drawings. In the composite thermal cutting device of the present embodiment, as described later, a plurality of types of thermal cutting heads can be used simultaneously or switched.

Example  One

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the whole structure of the composite thermal cutting device which concerns on one Embodiment of this invention. 2 to 5 are perspective views showing this composite thermal cutting device when in various working states.

As shown in FIGS. 1-5, the composite cutting device 10 has the box-shaped table 12 provided in the bottom. The rectangular upper surface of the table 12 has a bald shape or a lattice shape, and a plate member 44, 46, 50 or 56 serving as a cut material is mounted thereon. In the numerical calculation process for controlling the cutting position of the plate on the table 12, an X-Y-Z rectangular coordinate system is defined. The X axis of this XYZ rectangular coordinate system is parallel to the long side of the upper surface of the table (the transverse direction in FIG. 1), the Y axis is parallel to the short side of the upper surface of the table 12 (the longitudinal direction in FIG. 1), and the Z axis is the table 12 It is perpendicular to the upper surface of the (direction through the ground in Figure 1).

On the bottom beside the long side of the table 12, an X axis trajectory 14 is provided in parallel with the long side (X axis) of the table 12. On the X-axis track 14, two cutting shuttles, namely, a laser shuttle 16 (corresponding to a laser head moving mechanism) for laser cutting using a laser beam, and plasma cutting using a plasma arc, Is equipped with a plasma shuttle 18 (corresponding to a plasma torch moving mechanism). Both the laser shuttle 16 and the plasma shuttle 18 are movable in the X axis direction along the X axis trajectory 14.

The laser shuttle 16 has a moving trolley 20 capable of traveling on the X-axis track 14 in the X-axis direction. The arm-shaped Y-axis track 22 that traverses the upper side of the table 12 in the Y-axis direction is fixed to the moving trolley 20. The carriage 24 is mounted in this Y-axis track | orbit 22, and this carriage 24 is movable along the Y-axis track | orbit 22 in the Y-axis direction. A laser head 40 for generating a laser beam is attached to the carriage 24 toward the table 12 (downward). The carriage 24 can move the laser head 40 in the Z axis direction.

In addition, the plasma shuttle 18 has a moving trolley 26 capable of traveling on the X-axis track 14 in the X-axis direction. The arm-shaped Y-axis track 28 that traverses the upper side of the table 12 in the Y-axis direction is fixed to the moving trolley 26. The carriage 30 is mounted on the Y-axis track 28, and the carriage 30 is movable in the Y-axis direction along the Y-axis track 28. In this carriage 30, a plasma torch 42 for generating a plasma arc is mounted toward the table 12 (downward). The carriage 30 can move the plasma torch 42 in the Z axis direction.

The laser shuttle 16 and the plasma shuttle 18 described above function as a moving device for moving the laser head 40 and the plasma torch 42. The laser shuttle 16 and the plasma shuttle 18 respectively place the laser head 40 and the plasma torch 42 in the work space 32 facing the surface of the plate mounted on the table 12. It is possible to move in the Z direction. As is apparent from the figure, as long as the laser shuttle 16 and the plasma shuttle 18 do not collide on the X axis trajectory 14, the laser head 40 and the plasma torch 42 are different in the working space 32. At the same time in the place, it is possible to move freely by independent displacement amounts in mutually independent directions. This means that laser cutting and plasma cutting can be performed simultaneously independently and in parallel.

At both ends of the X-axis trajectory 14, the laser shuttle evacuation site 34 and the plasma shuttle evacuation site 36 are formed. When the laser shuttle 16 is located at the laser shuttle evacuation site 34, the laser shuttle 16 is located at a position away from the table 12. As shown in FIG. Thereby, the plasma shuttle 18 is movable over the entire long side range of the table 12, and the plasma torch 42 can move freely throughout the work space 32 on the table 12. On the other hand, when the plasma shuttle 18 is located at the plasma evacuation site 36, the plasma shuttle 18 is located at a position away from the table 12. Thereby, the laser shuttle 16 is movable over the entirety of the long side range of the table 12, and the laser head 40 can move freely throughout the work space 32 on the table 12.

The laser control device 60 is mounted on the laser shuttle 16, and the plasma control device 62 is mounted on the plasma shuttle 18. The host controller 64 is connected to the laser controller 60 and the plasma controller 62.

FIG. 6 is a block diagram showing the configuration of the laser control device 60, the plasma control device 62, and the upper control device 64. As shown in FIG.

The laser controller 60 controls the operation of moving the laser head 40 in the laser shuttle 16 in the X, Y, and Z axis directions, and the operation of generating the laser beam from the laser head 40. . In addition, a plasma control device 62 is mounted on the plasma shuttle 18, and the plasma control device 62 moves the plasma torch 42 in the plasma shuttle 18 in the X, Y, and Z axis directions. And the operation of generating a plasma arc from the plasma torch 42 are controlled. The host control device 64 includes a laser processing program 70 instructing a working procedure of laser cutting and a plasma processing program 72 (a laser processing program 70 and a plasma processing program 72 instructing a working procedure of plasma cutting). ) Is inputted by the input device 69, stored in the storage device 68, and the plate material on the table 12 by the laser shuttle 16 in accordance with the laser processing program. The laser control device 60 is controlled so that the laser cutting is carried out with respect to the laser cutting device. To control.

Moreover, in order to create the laser processing program 70 and the plasma processing program 72, the processing program preparation device 80 is formed. The machining program creating device 80 is, for example, a personal computer, and an application program for creating the laser machining program 70 and the plasma machining program 72 is installed therein, and the application program is executed.

7 is a flowchart showing a procedure in which the machining program creating apparatus creates the laser machining program 70 and the plasma machining program 72.

In step S1 of FIG. 7, the machining program creating device 80 includes the product shape data 82 that defines the shape (the shape of the outer periphery or the shape of the periphery) of one or a plurality of products to be cut from the plate, the thickness of the plate, The board | plate material data 84 which specified the material, and the machining precision data 86 which specified the machining precision (dimension precision) of a product are input. And the process program preparation device 80 performs the process of step S2-S5 based on these input data 82, 84, 86, and produces the product of the shape defined by the product shape data 82, The laser processing program 70 and the plasma processing program 72 for cutting from the plate | board material of the thickness and material which were specified by the board | plate material data 84 are created. The laser machining program 70 and the plasma machining program 72 are input from the machining program creating device 80 to the host controller 64 online or offline.

By the way, in order to cut a certain product from a board | plate material, a board | plate material is naturally cut along the cutting line according to the shape of the product. As a cutting line for cutting one product, there is a cutting line corresponding to at least the outer circumference (contour) of the product, and in addition, when the product has a hole inside, there is also a cutting line corresponding to the inner circumference of the hole. . If there are many holes, there are a plurality of cutting lines corresponding to each hole. Thus, each product has one or more cutting lines according to the shape. Usually, since a plurality of products are cut from one sheet of board, a plurality of cutting lines are set for one sheet of board.

By the way, the above-mentioned process program creation apparatus 80 is based on the shape of one or more products defined by the product shape data 82 in step S2 of FIG. Stinging (i.e., designing the layout of the product on the plate, where to cut these products from), and based on the results of the nesting, use the coordinate values on the plate to cut the lines of these products. Decide by Thereafter, the machining program creating device 80, at step S3, cuts these cutting lines by the laser head 40 and the plasma cutting type to be cut by the plasma torch 42. Classify as The classification of this cutting line is based on the geometric characteristics of each cutting line (e.g., the length of the cutting line, the type of whether the cutting line corresponds to the perimeter of the product or the hole, the size or diameter of the product or hole to which the cutting line corresponds). Length, etc.), processing accuracy or the thickness of the plate. For example, this classification is performed based on any one of the following classification methods (1) to (6) or based on a combination of two or more classification methods.

(1) The laser cutting type and the plasma cutting type are classified according to the thickness of the plate. For example, in the case of a plate that is thinner than a predetermined threshold (eg, 6 mm) suitable for laser cutting or not for plasma cutting, the cutting lines of the plate are all classified as a laser cutting type. In addition, when thicker than a predetermined threshold (for example, 20 mm) suitable for plasma cutting or not for laser cutting, all the cutting lines of the sheet are classified as plasma cutting type.

(2) Classify the laser cutting type and the plasma cutting type according to the required processing accuracy. For example, a cutting line that requires a high degree of processing with a dimensional error below a predetermined threshold (e.g., ± 0.3 mm or ± 0.1 mm), which is suitable for laser cutting or not for plasma cutting, is a laser cutting type. Classify In addition, a cutting line that is not suitable for plasma cutting or unsuitable for laser cutting, which requires a high degree of processing with a dimensional error of more than a predetermined threshold (eg, ± 0.3 mm), is classified as a plasma cutting type.

(3) The laser cutting type and the plasma cutting type are classified according to the length of the cutting line. For example, a short cutting line whose continuous cutting length from the cutting start position to the cutting end position is less than a predetermined threshold is classified as a laser cutting type. Moreover, long cutting lines whose continuous cutting length is more than a predetermined threshold are classified into a plasma cutting type.

(4) The laser cutting type and the plasma cutting type are classified according to whether the cutting line corresponds to the outer periphery or the hole of the product. For example, the cutting line corresponding to the outer periphery of the product is classified into the plasma cutting type, and the cutting line corresponding to the hole is classified into the laser cutting type.

(5) The laser cutting type and the plasma cutting type are classified according to the diameter or area of the area surrounded by the cutting line or the curvature of the cutting line. That is, in the case of a cutting line corresponding to the outer periphery or hole of the product, the diameter of the product or hole (if not circular, the longest diameter, the shortest diameter or the average diameter, etc.), or the area of the product or the hole is predetermined If it is less than the threshold (in other words, if the size of the product or hole is smaller than the predetermined threshold), the cutting line is classified as a laser cutting type, and if it is more than the predetermined threshold (in other words, the size of the product or hole is a predetermined threshold) In this case, the cutting line is classified into a plasma cutting type. Alternatively, when the maximum, minimum or average radius of curvature of the cutting line is less than the predetermined threshold, the cutting line is classified as a laser cutting type. When the cutting line is above the predetermined threshold, the cutting line is classified as a plasma cutting type.

(6) According to the number of holes of the product, classification of laser cutting type and plasma cutting type is performed. That is, the cutting line corresponding to the outer periphery and the hole of the product with a large number of holes with a predetermined number of holes or more is classified as a laser cutting type, and the cutting line corresponding to the outer periphery and the hole of a product with a small number of holes with a number of holes below a predetermined threshold. Is classified as a plasma cutting type.

In this way, the machining program creating device 80, in step S3 of FIG. 7, cuts the cutting line of the product nested on the sheet according to the thickness of the sheet, the machining precision or the geometric characteristics of each cutting line. It is classified into laser cutting type and plasma cutting type. Thereafter, the machining program creating device 80 executes the laser machining program 70 on the basis of the cutting line, the sheet material data 84, and the machining precision data 86 classified into the laser cutting type in step S4 of FIG. 7. In addition, in step S5, the plasma processing program 72 is created based on the cutting line, the sheet material data 84, and the processing precision data 86 classified into the plasma cutting type. The laser processing program 70 describes an instruction of a procedure for cutting a sheet material by the laser head 40 along only a laser cutting type cutting line, while the plasma processing program 72 cuts a plasma cutting type. Instructions for the procedure for cutting the sheet material by the plasma torch 42 along the line are described. Therefore, in this composite cutting device 10, when cutting one or a plurality of products from one sheet of material, the laser head 40 and the laser beam 40 may be cut according to the thickness of the sheet, the processing accuracy, or the geometric characteristics of each cutting line. The plasma torch 42 can be used separately.

2 to 5 show some examples of using the laser head 40 and the plasma torch 42 separately.

2 shows an example in which the laser head 40 and the plasma torch 42 are divided and used according to the thickness of the sheet material.

As shown in FIG. 2, the board | plate material 44, 44 which is thinner than the predetermined threshold determined to apply laser cutting to the area | region on the left side of the figure of the upper surface of the table 12 by the classification method mentioned above. , 44). Then, the laser shuttle 16 moves in the space corresponding to the area 47 in the work space 32 (FIG. 1) in accordance with the laser machining program 70 (FIG. 6). 44, 44) is cut. Moreover, the board | plate material 46 thicker than the predetermined threshold determined to apply plasma cutting by the above-mentioned classification method is placed in the area | region 48 of the right side in the figure of the upper surface of the table 12. As shown in FIG. Then, the plasma shuttle 18 moves in the space corresponding to the region 48 in the work space 32 (FIG. 1) in accordance with the plasma processing program 72 (FIG. 6), while the thick plate 46 )).

In the creation process of the laser processing program 70 and the plasma processing program 72 for the board | plate materials 44, 44, 44, 46, as already demonstrated, the program preparation apparatus 80 is a thin plate 44, 44, 44. ), The cutting lines of the thin plate members 44, 44, 44 are all classified into the laser cutting type to create the laser processing program 70, and from the thickness of the thick plate member 46, the thick plate member 46 All of the cutting lines are classified into a plasma cutting type to create a plasma processing program 72. The worker arranges the thin plates 44, 44, 44 in the left region 47 of the upper surface of the table 12, the thick plate 46 in the right region 48, and the laser machining program 70. And when the plasma processing program 72 is input to the host controller 64 (FIG. 6) to instruct processing, the laser shuttle 16 is controlled by the laser processing program 70, and the plasma processing program 72 is controlled. The plasma shuttle 18 is controlled so that the cutting of the thin plates 44, 44, 44 by the laser shuttle 16 and the cutting of the thick plate 46 by the plasma shuttle 18 are independent of each other. It is done in parallel.

As in the above example, it is possible to use the left region on the table 12 as the laser cutting machining region 47 and the right region as the plasma cutting machining region 48. For example, the center region can also be used as the combined machining region 49 for cutting the same plate by combining laser cutting and plasma cutting. The use of these areas is often convenient for workers.

3 and 4 show an example of cutting the same plate by combining laser cutting and plasma cutting.

As shown in FIG. 3, the board | plate 12 of several sheets 50, 50, ... which have a thickness which can apply both laser cutting and plasma cutting is mounted. From each of these board | plate materials 50, 50, ..., for example, as shown to FIG. 8A, the product 90, 90, ... which has the hole 92, and the product 90, 90, which differs in size and a shape, A plurality of products 90, 90, ..., 96, 96, 96, ..., 98, such as ..., 96, 96, 96, ..., 98, are supposed to be cut | disconnected. The cutting lines of these products 90, 90, ..., 96, 96, 96, ..., 98 are, as already explained, by the above-described classification method, depending on their geometric characteristics, processing accuracy, etc., according to the laser cutting type and the plasma. The laser processing program 70 is classified into the cutting type, and the laser processing program 70 is created based on the laser cutting type cutting line, and the plasma processing program 77 is generated based on the plasma cutting type cutting line. ) Is entered.

As shown in FIG. 3, based on the laser processing program 70, the laser shuttle 16 moves the work space 32 (FIG. 1) on the table 12 from the right side to the left side in the drawing. 50, 50, ... only the cutting line of the laser cutting type is cut | disconnected. For example, as shown in Fig. 8B, the inner circumferences 92, 92, ... of the small holes of the products 90, 90, ..., the outer circumferences 100, 100, ... of the small products 96, 96,. The corresponding cutting line is cut by laser cutting.

Subsequently, as shown in FIG. 4, the plasma shuttle 18 moves the work space 32 (FIG. 1) from the right side to the left side in the drawing from the back of the laser shuttle 16. , ...) only the cutting line of the plasma cutting type is cut out. For example, as shown in FIG. 8C, the cutting line corresponding to the outer periphery 94, 94, ..., 102 of the large goods 90, 90, ..., 98 is cut | disconnected by plasma cutting.

The laser shuttle 16 and the plasma shuttle 18 simultaneously carry out laser cutting and plasma cutting while moving in the X, Y, and Z axis directions independently of each other, unless they collide with each other. The order of performing laser cutting and plasma cutting for each product is not limited to the order of laser cutting first and plasma cutting following as described above, and the reverse may be repeated or a plurality of repetitions may be performed. On the basis of this, when the laser cutting for cutting a hole or a small product is preceded and a plasma cutting for cutting an outer periphery or a large product is performed later, it is convenient for preventing the misalignment of the cut product on the table. There are many.

5 shows an example of cutting a thick plate that is difficult in laser cutting only by plasma cutting.

As shown in FIG. 5, the laser shuttle 16 enters the evacuation site 34, and the plasma shuttle 18 moves on the table 12 while the plasma shuttle 18 moves freely throughout the work space 32 (FIG. 1). The board | plate material 56 is cut | disconnected. In contrast to this example, when only the cutting plate is on the table 12 only by laser cutting, the plasma shuttle 18 is placed in the retracting place 36 and the laser shuttle 16 is placed in the work space 32. Can be freely moved throughout the region of FIG.

According to the composite cutting device 10 demonstrated above, as demonstrated below, the running cost of cutting can be reduced effectively.

9 shows a schematic change in the running cost of laser cutting and plasma cutting according to the difference in cutting conditions.

In FIG. 9, the graph 110 shows the change in the running cost per one product of plasma cutting, and the graph 112 shows the change in the running cost per one product of laser cutting. As shown, when the number of holes included in one product is examined, when the number of holes is smaller than a certain degree, the running cost for cutting the product is cheaper than that of laser cutting. On the contrary, if the number of holes is more than a certain degree, the cutting running cost of the product is cheaper than that of plasma cutting. Moreover, if the average value of the continuous length of one or more cutting lines (outer periphery, the inner periphery of a hole, etc.) contained in one product is examined, if the average value of the continuous cutting length is longer than some extent, the cutting running cost of the product The plasma cutting side is cheaper than laser cutting, and conversely, if the average value of the continuous cutting length is shorter than a certain degree, the cutting running cost of the product is cheaper than the plasma cutting side.

The reason for the large and small relationship between the running cost of laser cutting and plasma cutting according to the cutting conditions is that the causes of the running cost are different in laser cutting and plasma cutting. Most of the running cost of laser cutting is the cost of electricity and gas. The cost of electricity and gas of laser cutting is greater than that of plasma cutting. On the other hand, in the running cost of plasma cutting, in addition to the cost of electricity and gas, there is a cost of consumables such as electrodes, and the cost of the consumables accounts for about 2/3 of the total cost. Since the consumption of consumables such as electrodes is the greatest at the ignition of the plasma arc, the cost of plasma cutting is most affected by the number of ignitions. As a result, when cutting a long distance continuously, the plasma cutting side is less expensive than laser cutting. However, when cutting a short distance a plurality of times (the number of ignitions), the laser cutting side is more expensive than plasma cutting. It is cheaper.

In addition, laser cutting has the advantage of being able to cope with higher processing accuracy than plasma cutting, while plasma cutting has the advantage of cutting thicker plates than laser cutting. Generally, there exists a tendency for many products cut from a small product or a thin board | plate material to require high processing precision.

In this situation, laser cutting is more cost-effective than plasma cutting, which includes holes with many holes, cutting lines with short continuous cutting lengths, small (high precision) products, thin (high precision) products, Piercing and the like can be mentioned. On the contrary, when plasma cutting is more advantageous than laser cutting, the outer periphery of a large product, the cutting line with a long continuous cutting length, the product of a thick plate, etc. are mentioned.

In the above-described complex cutting device 10, the cutting lines are classified by the classification method as described above. According to the classification method, as can be seen from the above, the running cost is as much as possible during laser cutting and plasma cutting. The cheaper cutting method is applied to each cutting line. By setting the classification method appropriately, it is preferable to use laser cutting and plasma cutting separately so that cutting processing is performed at the point where the graphs 110 and 112 of FIG. 9 intersect, that is, the running cost of cutting is minimized. It is possible.

In addition, in the above-mentioned complex cutting device 10, since the laser shuttle 16 and the plasma shuttle 18 can each independently perform cutting processing simultaneously and simultaneously, it is possible to improve the efficiency of cutting processing. It is also easy.

Example  2

Next, a second embodiment of the present invention will be described based on FIGS. 10 to 24. In this embodiment, as described later, the laser head and the plasma torch are attached to the same plane side of the substantially C-shaped frame so as to be movable, respectively, and each thermal cutting head is supported in a so-called cantilever method. In this embodiment, since the description of the first embodiment can be appropriately used, the following description mainly describes differences.

FIG. 10 is an explanatory diagram showing an outline of the configuration of the composite thermal cutting device 10A according to the present embodiment. 11 is a perspective view of the composite thermal cutting device 10A. The composite thermal cutting device 10A of this embodiment can be comprised, for example with the processing apparatus main body and the control apparatus 700, 810, 820 for controlling a processing apparatus main body so that it may mention later, respectively.

First, the structure of the processing apparatus main body is demonstrated briefly. The more detailed structure of a processing apparatus main body is mentioned later, referring another figure. The table 200 is provided on the floor similarly to the table 12 described in the first embodiment, and is formed in a box shape. The upper surface of the table 200 is formed in a bald shape or a lattice shape, and the plate material 210 is mounted.

In order to cut | disconnect the board | plate material 210 put on the table 200, also in this embodiment, an X-Y-Z rectangular coordinate system is defined. As also shown in FIG. 11, the X axis is parallel to the long side of the table 200 (the direction transverse to the ground in FIG. 10), the Y axis is parallel to the short side of the table 200 (the transverse direction in FIG. 10), and the Z axis is Perpendicular to the table 200.

The base part 300 is provided in the vicinity of the table 200 so that one long side of the table 200 may be along (ie, parallel to the X-axis direction). X-base tracks 301 and 301 are formed in the pedestal 300. On the base 300, the movement support part 310 is attached so that a movement to an X-axis direction is possible.

The moving support part 310 is formed to protrude upward from the pedestal 300. As also shown in FIG. 11, the arm part 320 is integrally formed in the movement support part 310 so that the upper part of the table 200 may be extended to the Y-axis direction. The base end side P1 of the arm part 320 is being fixed to the moving support part 310, and the front end side P2 of the arm part 320 is formed so that the table 200 may be crossed. Y-axis track | orbit 330,330 is formed in one surface among the both surfaces of the X-axis direction which the arm part 320 has. The laser head 500 and the plasma torch 600 are respectively attached to the Y axis tracks 330 and 330 so as to be movable in the Y axis direction. The laser head 500 and the plasma torch 600 are attached to the arm part 320 so as to face the table 200.

The laser head 500 cuts the plate 210 by emitting the laser beam incident from the laser oscillation device 410 via the optical system box 420 and the guide cylinder 430 toward the plate 210. do. The laser head 500 is mounted on the carriage 520 (see FIG. 12), and the carriage 520 is attached to the Y-axis direction along the Y-axis tracks 330 and 330 so as to be movable. The carriage 520 is configured to move the laser head 500 in the Z axis direction. Therefore, the laser head 500 is movable in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.

When the plasma head 500 is being subjected to plasma processing, the laser head 500 retracts to the retraction region A3 provided near the root of the arm portion 320 (see FIG. 13). A shield 340 is formed in the retraction region A3. The shield 340 at least partially shields between the work space A1 and the retracted area A3 to suppress the heat or the like during the plasma processing from affecting the laser head 500.

The plasma torch 600 cuts the plate 210 by generating a plasma arc. The plasma torch 600 is mounted on the carriage 610 (see FIG. 12) (the combined movement support 310, the arm portion 320, the carriage 520 and the carriage 610 correspond to the moving means). . The carriage 610 is attached to the Y-axis direction along the Y-axis track | orbit 330 and 330 so that a movement is possible. The carriage 610 may move the plasma torch 600 in the Z axis direction. Therefore, the plasma torch 600 is movable in the X axis direction, the Y axis direction, and the Z axis direction, respectively. When the laser torch 600 is subjected to laser processing, the plasma torch 600 retracts to the retraction region A2 formed near the tip end of the arm portion 320 (see FIG. 12).

Although the details will be described later, the composite thermal cutting device 10A of the present embodiment includes any one of laser processing or plasma processing by arranging any one of the laser head 500 or the plasma torch 600 in the work space A1. Run While the laser processing is being performed, the plasma torch 600 is evacuated to the plasma torch evacuation region A2. Thereby, the laser head 500 can process the board | plate material 210 by moving the whole work space A1 freely, without being disturbed by the plasma torch 600. As shown in FIG. On the contrary, since the plasma head 500 is evacuated to the laser head evacuation area A3 while the plasma processing is being performed, the plasma torch 600 is not disturbed by the laser head 500, and thus the work space A1. ) The whole can be moved freely.

In the moving support part 310, the laser oscillation apparatus 410 (corresponding to a laser beam supply part) and the optical system box 420 are formed, respectively. The laser oscillation apparatus 410 outputs the laser beam of a predetermined output from the laser light source 411. The optical system box 420 bends the optical path of the laser beam output from the laser oscillation apparatus 410, and supplies it toward the laser head 500.

The connection part 510 is formed in the upper part of the laser head 500, and the guide cylinder 430 is connected to this connection part 510. As shown in FIG. This guide cylinder 430 is freely expanded and constructed like an accordion structure, for example. One end side of the guide cylinder 430 is connected to the output part of the optical system box 420, and the other end side thereof is connected to the connection part 510 of the laser head 500. The connection part 510 is provided with the folding mirror 511 for reflecting the laser beam incident in the arrow R2 direction from the guide cylinder 430 in the arrow R3 direction.

Next, the structure of a control apparatus is demonstrated. The control device of the present embodiment may include, for example, the upper control device 700, the laser control device 810, and the plasma control device 820, similarly to the above embodiment.

The host controller 700 can be configured to include, for example, an arithmetic processing unit 710, a storage unit 720, and an input unit 730 in the same manner as in the above embodiment. Each of these devices 710, 720, 730 is connected to each other via a signal transmission path 701. In addition, the arithmetic processing unit 710, the laser control device 810, and the plasma control device 820 are connected through another signal transmission path 702.

The storage device 720 includes a laser machining program 721, a plasma machining program 722, a retraction control program 723, a power saving program 724, a head height adjustment program 725, and an optical axis adjustment program. 726 are stored respectively. The laser machining program 721 and the plasma machining program 722 are created by the machining program creating device 80 and are stored in the storage device 720 through the input device 730.

The evacuation control program 723 is a program for evacuating the laser head 500 and the plasma torch 600 to predetermined places A2 and A3 according to the type of processing. The power saving program 724 is a program for reducing power related to laser processing. The head height adjustment program 725 is a program for adjusting the height between the laser head 500 or / and the plasma torch 600 and the plate 210. The optical axis adjustment program 726 is a program for fine-adjusting the optical axis of the laser beam incident on the laser head 500 in accordance with the Y-axis direction position of the laser head 500. The details of each of these programs 723 to 726 will be described later.

The laser control apparatus 810 controls the position control in each of the X-axis, the Y-axis, and the Z-axis of the laser head 500, and the operation | movement of a laser beam, respectively. The laser control device 810 may include a height sensor 811. This height sensor 811 can be comprised as a non-contact sensor using a laser beam etc., for example. The laser control apparatus 810 measures and adjusts the height of the laser head 500 and the board | plate material 210 before performing laser processing according to the head height adjustment program 725. FIG. Thereafter, the laser controller 810 controls the laser head 500 in accordance with the laser machining program 721. In addition, the laser control device 810 controls the operation of the laser oscillation device 410 in accordance with the power saving program 724. In addition, the laser control apparatus 810 fine-tunes the optical axis of the laser beam supplied to the laser head 500 according to the optical axis adjustment program 726. Each of these controls is executed by an instruction from the host controller 700, respectively.

The plasma control apparatus 820 controls the position control in the X, Y, and Z axes of the plasma torch 600 and the operation of the plasma arc, respectively. The plasma control device 820 may include a height sensor 821. This height sensor 821 can be configurable as a contact sensor using, for example, a mechanical limit switch or the like. The plasma control device 820 adjusts the distance between the plasma torch 600 and the plate 210 before performing the plasma processing in accordance with the head height adjustment program 725. As described later, data measured at the time of laser processing can be used for plasma processing. The plasma control device 820 is also configured to perform control relating to plasma processing based on an instruction from the host controller 700.

12 is a view of the composite thermal cutting device 10A viewed from the front in the X axis direction. 11, 12, and 13 show the outline of the composite thermal cutting device 10A, respectively, for convenience of explanation, the details of the drawings do not coincide. 12 shows a case of performing laser processing. When performing laser processing, the laser head 500 is located in the working space A1 on the table 200, and the plasma torch 600 retracts to the retraction area A2 formed in the left side in the figure. The laser head 500 can move the work space A1 freely.

It is a front view which shows the case where plasma processing is performed. When performing plasma processing, the plasma torch 600 is located in the work space A1, and the laser head 500 retracts to the retraction area A3 formed on the right side in the figure. The plasma torch 600 can freely move the work space A1.

14 is a flowchart showing the evacuation control process. This evacuation control processing, for example, causes the arithmetic processing unit 710 to read and execute the evacuation control program 723 stored in the storage device 720, and to provide predetermined instructions to the laser control apparatus 810 and the plasma control apparatus. Are given to 820, respectively.

The host controller 700 analyzes the processing programs 721 and 722 stored in the storage device 720 (S11), and determines whether the type of processing to be performed is laser processing or plasma processing (S12). . When it determines with laser processing, the higher-level control apparatus 700 gives a retraction command to the plasma control apparatus 820. Thereby, as shown to FIG. 15A, the plasma torch 600 evacuates to the plasma torch evacuation area | region A2 (S13).

After the plasma torch 600 is evacuated to the evacuation region A2, the laser processing is started when the host controller 700 gives the laser control apparatus 810 a command based on the laser processing program 721 (S14). ). When laser processing is complete | finished (S15), the host controller 700 determines whether all the processes regarding the board | plate material 210 are complete | finished (S16). If another machining program exists (S16: YES), the process returns to S11 again to determine the machining type.

On the other hand, when it is determined that it is plasma processing, the host controller 700 gives the retraction instruction to the laser controller 810. As a result, as shown in FIG. 15B, the laser head 500 retracts to the laser head evacuation region A3 (S17). After retracting the laser head 500, the host controller 700 gives an instruction based on the plasma processing program 722 to the plasma control apparatus 820 to perform plasma processing (S18). When plasma processing is complete | finished (S19), it is determined whether all the processes regarding the board | plate material 210 are complete | finished (S16).

Here, the shielding part 340 is formed in the boundary between the laser head evacuation area | region A3 and the working space A1. The shield 340 protects the laser head 500 from high temperatures, gases, etc. generated during plasma processing.

Since this embodiment is configured as described above, the following effects are obtained. In this embodiment, a so-called cantilever system is adopted, and the laser head 500 and the plasma torch 600 are attached to the arm portion 320 that extends over the table 200, respectively. Therefore, a structure can be simplified compared with the so-called cantilever system which supports the movable arm from both sides of the table 200, and manufacturing cost can be reduced.

In this embodiment, the plasma torch 600 is retracted out of the work space A1 during laser processing, and the laser head 500 is retracted out of the work space A1 during plasma processing. Therefore, the laser head 500 can freely move within the working space A1 and perform laser processing without being restricted by the plasma torch 600, while the plasma torch 600 is a laser head 500. The plasma processing can be performed by freely moving in the working space A1 without being restricted by the above.

In the present embodiment, the laser head evacuation region A3 is formed on the root side of the arm portion 320, and the plasma torch evacuation region A2 is formed on the tip side of the arm portion 32, respectively. Is set to the vicinity of the root side of the arm part 320, and the plasma torch 600 to be formed near the tip side of the arm part 320, respectively. As a result, when the laser head 500 is evacuated to the laser head evacuation area A3, the length of the freely stretchable guide cylinder 430 can be shortened, and the laser head 500 and the guide cylinder 430 are short. Both can be protected from heat, gas, etc. at the time of plasma processing, for example. On the contrary, it is also conceivable to form the laser head evacuation region near the tip side of the arm portion 320. In this case, however, when the laser head 500 is retracted, the length of the guide cylinder 430 becomes maximum and is exposed on the work space A1 at the maximum length. Therefore, the possibility that the guide cylinder 430 is influenced externally becomes high.

In this embodiment, the shielding part 320 is formed between the laser head evacuation area | region A3 and the work space A1. Therefore, the laser head 500 can be protected from the plasma processing performed in the work space A1, and the reliability is improved.

Example  3

Next, a third embodiment of the present invention will be described with reference to Figs. 16 and 17. In this embodiment, the power consumption at the time of laser processing is reduced. 16 is a flowchart showing an outline of a process for generating a laser machining program. The machining program generating device 80 is provided with product shape data 82 and S21, sheet data 84 and S22, and machining accuracy data 86 and S23, respectively. (S24) to generate cutting line data (S25).

The process program preparation device 80 classifies the cutting line data into either laser processing or plasma processing as described in the first embodiment (S26). In the case of cutting line data suitable for laser processing, the machining program creating device 80 generates a laser machining program (S28). In the case of cutting line data suitable for plasma processing, the machining program creating device 80 creates a plasma machining program (S29).

And the process program preparation device 80 analyzes the created process program, and inserts the command for controlling the laser oscillation apparatus 410, for example (S30). As this additional command, the start command and the stop command of the laser oscillation apparatus 410 are mentioned, for example. The operation start command is a command to warm up so that a laser beam can be supplied. A shutdown instruction is added so that the timing is matched with the timing at which laser processing is started. The operation stop command is a command for stopping the laser oscillation apparatus 410. When placed in the resting state, the power consumption of the laser oscillation device 410 is lowered.

The time taken for processing the cutting line data can be determined based on, for example, the length of the cutting line, the thickness of the plate member 210, and the like. Therefore, the waiting time until laser processing starts can also be estimated. When this waiting time is more than the predetermined time, the standby power of the laser oscillation apparatus 410 can be reduced by adding the interruption instruction to a process program. Here, the predetermined time is substantially the same as the operating time of the laser oscillation apparatus 410. When the waiting time is longer than the time necessary for performing stable laser oscillation, the laser oscillation apparatus 410 is stopped. As such, in the step of writing the machining program, it may be specified whether the laser oscillation apparatus 410 is to be operated or stopped.

Based on FIG. 17, another example of realizing the power saving operation during laser processing will be described. 17 is a flowchart showing an outline of a power saving machining process that saves electric power during laser machining.

The host controller 700 reads the machining program stored in the storage device 720 (S41), and determines whether or not laser machining is included in the machining program (S42). When the laser processing is included (S42: YES), the higher-level control apparatus 700 commands the operation of the laser oscillation apparatus 410 (S43). When the laser oscillation apparatus 410 is operated and can output the laser beam stably, laser processing is started (S44). When laser processing is complete | finished (S45), the host controller 700 determines whether the whole process with respect to the board | plate material 210 was complete | finished (S46). If an unprocessed machining program exists, the process returns to S41.

On the other hand, when the laser processing is not included in the machining program to be executed next (S42: NO), the higher-level control apparatus 700 issues a command to stop operating the laser oscillation apparatus 410 (S47). As a result, the laser oscillation apparatus 410 stands by with the minimum power consumption required. Then, plasma processing is performed (S44), and the plasma processing ends soon (S46).

In this embodiment constituted as described above, in addition to the effect described in the second embodiment, the power consumption during laser processing can be reduced. Therefore, the running cost of the composite thermal cutting device 10A can be reduced.

Example  4

Next, a fourth embodiment of the present invention will be described with reference to FIGS. 18 and 19. In this embodiment, data is shared between the laser head 500 and the plasma torch 600 with respect to the measurement of the head height.

18 is a flowchart of a machining process showing a state where data measured at the time of laser machining is also used for plasma machining. When performing laser processing, the higher-order control apparatus 700 makes it possible to measure the distance H1 from the laser head 500 to the board | plate material 210 (S51). This distance measurement can be performed by the non-contact height sensor 811 (corresponding to the distance detecting means).

The laser control apparatus 810 fine-adjusts the height of the laser head 500 based on the measured distance H1 (S52), and starts laser processing (S53). When laser processing is complete | finished (S54), plasma processing is performed next.

When the plasma control device 820 includes the height sensor 821, the plasma height sensor 822 is used to measure the distance H2 between the plasma torch 600 and the plate 210 again. It may be. In this case, however, it takes time to measure the distance H2 again, and it takes time to switch from laser processing to plasma processing. In particular, in the case where the plasma height sensor 821 is a contact sensor, the measurement time becomes long, so that the switching time also increases.

So, in the present Example, when laser processing is performed first with respect to the board | plate material 210 which is the same process target, the distance H1 measured at the time of the laser processing is used. That is, the host controller 700 calculates the distance H2 between the plate member 210 and the plasma torch 600 based on the distance H1 between the laser head 500 and the plate member 210. (S55). Since the attachment positions of the plasma torch 600 and the laser head 500 in the XYZ coordinate system are already known, the plasma torch 600 is based on the difference ΔH and the distance H1 of both height positions. And the distance H2 between and the plate 210 can be calculated (H2 = H1 + ΔH).

The host controller 700 starts the plasma processing after finely adjusting the height of the plasma torch 600 based on the calculated distance H2 (S56). When the plasma processing is finished (S57), it is determined whether or not the following processing is performed on the other plate material (S58), and when processing the other plate material (S58: YES), the process returns to S51.

19 is a flowchart showing the case where data measured at the time of plasma processing is also used for laser processing, as opposed to the example of FIG. 18. The host controller 700 allows the distance H2 between the plasma torch 600 and the plate 210 to be measured (S61), and executes plasma processing (S62, S63, S64).

When switching from plasma processing to laser processing, the distance H1 between the laser head 500 and the plate is calculated based on the distance H2 already measured (S65), and the laser processing is executed (S66, S67). For example, when a board is changed and another process is performed (S68: NO), it returns to S61.

This embodiment configured in this manner also exhibits the same effects as those of the second embodiment. In addition, in the present Example, the distance data measured by the process performed previously was set as the structure which is used for the following different types of process. Therefore, the switching time of laser processing and plasma processing for the same plate can be shortened, and efficiency can be improved.

In particular, when the laser processing which performs the high-precision distance measurement by non-contact is preceded, based on this high precision and short time distance data, the distance H2 at the time of plasma processing can be calculated in high precision and short time. On the other hand, if plasma processing precedes laser processing, the measurement of the distance H2 by the contact height sensor 821 is performed for the first time. However, the contact height sensor 821 is generally inferior in precision to the non-contact height sensor 811, and the measurement time is also long. In the present Example, the case where the distance H1 of the laser head 500 and the board | plate material was calculated also based on the distance H2 measured at the time of plasma processing was shown (FIG. 19), and it demonstrated with FIG. Similarly, it is advantageous to calculate the distance H2 between the plasma torch 600 and the plate based on the distance H1 measured at the time of laser processing.

Example  5

A fifth embodiment of the present invention will be described with reference to Figs. In the present embodiment, the optical axis of the laser beam emitted from the optical system box 420 is finely adjusted in accordance with the position of the laser head 500 in the Y axis direction. The reason why the optical axis adjustment is necessary in accordance with the Y axis position of the laser head 500 will be described later with reference to FIG. 22, and the configuration will be described first.

It is explanatory drawing which shows typically the mechanism for adjusting a mirror angle. The mechanism for adjusting the mirror angle may be configured to include, for example, a mirror angle adjusting device 830 and an exit mirror 421 of the optical system box 420.

First, the configuration of the mirror 421 will be described. Since the mirror 421 is formed in the laser beam exit portion of the optical system box 420, for example, the mirror support portion 421A, the mirror 421B (corresponding to the mirror portion), the point 421C, and the piezo. The element 421D (the mirror support part 421A, the point 421C, and the piezo element 421D combined correspond to a posture change part) can be comprised. The mirror support part 421A is made to be rotatable by the minute angle by any one of arrow F1, F2, making point 421C the center of rotational movement.

The mirror 421B is formed in one surface of the mirror support part 421A, and the piezo element 421D is formed in the other surface of the mirror support part 421A. The piezoelectric element 421D expands and contracts in response to a signal input from the piezoelectric element driving circuit 831, thereby changing the attitude of the mirror support 421A. When the piezoelectric element 421D is extended, the mirror support portion 421A makes a small angle rotational movement in the direction of the arrow F1 about the point 421C. Thereby, the angle of the laser beam R2 radiate | emitted from the optical system box 420 changes downward in a figure. On the other hand, when the piezo element 421D is reduced, the mirror support part 421A rotates by the micro angle in the arrow F2 direction centering on the point 421C. Thereby, the emission angle of the laser beam R2 changes upward in the figure. In addition, the piezo element 421D is an example, and this invention is not limited to this. Any element that can be microdisplaced in accordance with a control signal from the outside can be used.

The configuration of the mirror angle adjusting device 830 will be described. The mirror angle adjusting device 830 (corresponding to the posture control unit) includes a piezo element driver circuit 831 and a piezo element driver voltage calculating unit 832 (the piezo element driver circuit 831 and the piezo element driving voltage calculating unit 832). The summation corresponds to a signal generating section, a laser head Y axis position detecting section 833 (corresponding to a position detecting section), and a correction data map 834 (corresponding to a correcting amount storage section). . The laser head Y axis position detector 833 detects and outputs the Y axis position of the laser head 500. In the correction data map 834, the piezoelectric element drive voltage for correcting the amount of warpage caused by the Y-axis position of the laser head 500 is stored.

The piezoelectric element drive voltage calculating unit 832 refers to the correction data map 834 based on the detection signal from the laser head Y axis position detecting unit 833, thereby making the piezo element suitable for the current Y axis position of the laser head 500. Read the value of the device drive voltage. The calculating part 832 inputs the value of this read voltage to the piezo element drive circuit 831. The piezoelectric element driving circuit 831 inputs the input voltage value into the piezoelectric element 421D. Thereby, the piezo element 421D is extended or reduced in the left-right direction in the figure, the angle of the mirror 421B is fine-adjusted, and the emission angle of the laser beam R2 changes.

21 is a flowchart showing an outline of a process for adjusting an optical axis. This processing can be performed by one or both of the host controller 700 or the laser controller 810. Here, the case where the upper control apparatus 700 makes it run through the laser control apparatus 810 is taken as an example. When laser processing is started (S71: YES), it is monitored whether the Y-axis position of the laser head 500 has changed (S72).

The laser head 500 is retracted to the retraction area A3 before the laser processing starts. When performing laser processing, the laser head 500 moves from the retraction area A3 to the working space A1. When this movement is detected (S72: YES), the host controller 700 detects the position of the laser head 500 (S73) and refers to the correction data map 834 with the detected value (S74).

The host controller 700 determines the value of the drive voltage according to the current Y-axis position of the laser head 500 (S75), and applies this voltage to the piezoelectric element 421D (S76). Until the laser processing is completed (S77), the steps of S72 to S76 are repeated.

It is explanatory drawing which shows typically the state of optical axis adjustment. FIG. 22A illustrates a case where no positional shift occurs in the laser head 500 even when the Y axis position of the laser head 500 is changed. The initial position of the laser head is L1, the intermediate position is L2, and the maximum position is L3. The laser head 500 is free to move in the Y-axis direction within the range from L1 to L3. Even if the laser head 500 changes the Y axis position from L1 to L2 and L2 to L3, the optical axis adjustment needs to be performed when there is no change in the position of the laser head 500 (the position of the folding mirror 511). There is no. The laser beam R3 reflected in the Z axis direction by the mirror 511 is irradiated to the target point accurately.

FIG. 22B shows a case where position shift occurs in the laser head 500. As described above, in the present embodiment, the laser head 500 and the plasma torch 600 are respectively supported by the arm portion 320 that traverses the upper side of the table 200 from one side to the other side. In addition, the evacuation region A2 of the plasma torch 600 is formed on the tip P2 side of the arm portion 320. Therefore, when the laser head 500 moves in the Y axis direction so as to move away from the root of the arm part 320, the arm part 320 is slightly bent by the weight of the laser head 500. By this bending, the position of the folding mirror 511 is changed slightly. When the position of the folding mirror 511 shifts, as shown to FIG. 22 (B), the irradiation point of the laser beam R3e radiate toward the board | plate material 210 will change (DELTA) Y. Here, ΔX in the figure represents the amount of change in the mirror position due to warping, R3e represents the changed optical axis position, and R3 represents the original optical axis position, respectively.

Therefore, in the present embodiment, as shown in Fig. 22C, the optical axis of the laser beam R2r emitted from the optical system box 420 is taken from the reference angle (horizontal) in consideration of the deflection of the arm portion 320. Fine tune by θ. R2r represents the corrected optical axis. That is, even when the folding mirror 511 is shifted, the optical axis is finely adjusted so that the irradiation point to the plate does not change, and the laser beam R2r is made to enter the folding mirror. For example, by slightly rotating the mirror 421B about the point 421C, the optical axis of the laser beam can be corrected from R2 to R2r.

For this reason, in the correction data map 834 shown in FIG. 20, the piezoelectric element drive voltage value for eliminating the position shift of the folding mirror 511 in the Y-axis position L1-L3 of the laser head 500 is shown. It is memorized in advance. Specifically, for example, the optical axis is aligned with the case where the laser head 500 is located at the root side P1 of the arm portion 320 as a reference position, and the position shift that occurs according to the Y axis position of the laser head 500. Are measured at predetermined intervals to create a correction data map. In addition, when located between the measured point and the measured point, the required drive voltage value can be calculated by interpolating calculation from the value in the vicinity.

An example of the optical system box 420 is demonstrated based on FIG. 23, FIG. 23 is an explanatory diagram schematically showing the inside of the optical system box 420. The laser beam R1 from the laser oscillation device 410 is incident on the incident mirror 422 and reflected. The reflected laser beam R11 is reflected again by the next mirror 423 to become R12, and is incident on another mirror 424. The laser beam R13 reflected by the mirror 424 is incident on the exit mirror 421 and folded back in the Y axis direction. The folded laser beam R2 is incident on the folding mirror 511 of the laser head 500 via the guide cylinder 430.

24 is a perspective view illustrating an example of the exit mirror 421. In this way, the laser beam R13 is folded back in the Y axis direction by the mirror 421 to become the laser beam R2 and is emitted toward the laser head 500. The piezoelectric element 421D fine-tunes the optical axis of the laser beam R2 by changing the attitude of the mirror 421.

This embodiment configured in this manner also has the same effect as the second embodiment. In addition, in this embodiment, since the optical axis of the laser beam R2 supplied to the laser head 500 is fine-tuned according to the Y-axis position of the laser head 500, the position of a laser processing is It is possible to keep the machining accuracy by suppressing the deviation. In particular, in the present embodiment, a so-called cantilever system is employed, and the plasma torch 600 is evacuated to the tip side of the arm portion 320 during laser processing. Therefore, when the laser head 500 moves near the tip end of the arm part 320, the arm part 320 may be slightly bent by the weight of the laser head 500 and the plasma torch 600. However, in the present embodiment, since the optical axis of the laser beam can be adjusted in consideration of this warpage, it is possible to prevent a decrease in processing accuracy. In addition, optical axis adjustment is not limited to the exit mirror 421, For example, you may make it perform in other places, such as the incident mirror 422.

As mentioned above, although embodiment of this invention was described, this embodiment is only the illustration for demonstrating this invention, and it is not the meaning which limits the scope of this invention only to this embodiment. This invention can be implemented also in other various forms, without deviating from the summary. For example, when cutting a cutting line classified into a plasma cutting type according to the principles of the present invention, the piercing at the cutting start position may be performed using a laser beam. Moreover, in the above-mentioned embodiment, the processing program preparation device classified the cutting line into the plasma cutting type and the laser cutting type, and produced the plasma processing program and the laser processing program. However, as a modification, in the machining program preparation device, the cutting program is nested to define a cutting line, but the machining program is created at a stage in which the above classification is not yet performed, and on the composite thermal cutting device side, the machining program is performed. The cutting line defined therein may be classified into a plasma cutting type and a laser cutting type to generate a plasma processing program and a laser processing program.

Claims (19)

In the complex thermal cutting device having a plasma torch for generating a plasma arc and a laser head for generating a laser beam, Table for holding plate, A moving mechanism for moving the plasma torch and the laser head in a working space on the table;  Control means for controlling the plasma torch, the laser head, and the moving mechanism such that the plate material on the table is cut along a predetermined cutting line, The control means, Processing instruction information that defines the cutting line and classifies the cutting line into a plasma cutting type and a laser cutting type according to processing conditions including the geometric characteristics or the processing accuracy of the cutting line or the characteristics of the sheet. And upper control device having, A plasma control device for controlling the plasma torch based on the processing instruction information and cutting the plasma torch along a cutting line of the plasma cutting type; And a laser control device for controlling the laser head based on the processing instruction information and cutting the laser head along a cutting line of the laser cutting type. The method of claim 1, In the processing instruction information, the cutting line is classified into the plasma cutting type and the laser cutting type according to the continuous length of the cutting line. The method of claim 1, In the processing instruction information, the cutting line is classified into the plasma cutting type and the laser cutting type according to whether the cutting line corresponds to one of the outer periphery and the hole of the product. The method of claim 1, In the processing instruction information, the cutting line is classified into the plasma cutting type and the laser cutting type according to the thickness of the sheet material. In the complex thermal cutting device having a plasma torch for generating a plasma arc and a laser head for generating a laser beam, Table for holding plate, A moving mechanism for moving the plasma torch and the laser head in a working space on the table; Control means for controlling said plasma torch, said laser head, and said moving mechanism to cut said plate material on said table along a cutting line, The moving mechanism, A plasma torch moving mechanism for moving the plasma torch; Having a laser head moving mechanism for moving the laser head, The control means, A plasma control device for independently controlling the plasma torch moving mechanism; Having a laser control device for independently controlling the laser head moving mechanism, And each of the plasma torch moving mechanism and the laser head moving mechanism includes a evacuation site at a position away from the work space. delete In the composite thermal cutting method for cutting a plate using a plasma torch and a laser head along a cutting line, Defining the cutting line; Classifying the cutting line into a plasma cutting type and a laser cutting type according to processing conditions including geometric characteristics or processing degree of the cutting line or characteristics of the sheet material; And the cutting line of the plasma cutting type is cut using the plasma torch, and the cutting line of the laser cutting type is cut using the laser beam. A recording medium for storing a computer program for creating a computer program for controlling a complex thermal cutting device for cutting a plate using a plasma torch and a laser head along a cutting line. Classifying the cutting line into a plasma cutting type and a laser cutting type according to processing conditions including geometric characteristics or processing degree of the cutting line or characteristics of the sheet material; Creating a plasma processing program for instructing the composite thermal cutting device an order of cutting the plasma cutting type cutting line using the plasma torch; And a processing program preparation program for causing a computer to execute a step of creating a laser processing program instructing the composite thermal cutting device of an order of cutting the laser cutting type cutting line using the laser head. In the complex thermal cutting device having a plasma torch for generating a plasma arc and a laser head for generating a laser beam, Table for holding plate, A plasma torch moving mechanism for moving the plasma torch on the table; A laser head moving mechanism for moving the laser head on the table; And control means for controlling the plasma torch, the laser head, the plasma torch moving mechanism, and the laser head moving mechanism such that the plate material on the table is cut along a predetermined cutting line. The control means controls the plasma torch moving mechanism and the laser head moving mechanism to independently move the plasma torch and the laser head, and controls the plasma torch to cut any cutting line of the plate. And controlling the laser head to cut another cutting line of the sheet. delete In the composite thermal cutting device which can perform both plasma processing and laser processing, Table for holding plate, A support portion formed near one side of the table and movable along the table; An arm portion formed by extending the working space formed above the table from one side to the other side such that the proximal side is supported by the support portion, and the front end side spans the table; A laser head positioned near the proximal end of the arm part, the laser head being formed to be movable; A plasma torch positioned near the tip side of the arm portion and formed to be movable; A laser beam supply unit formed at the proximal end of the arm portion and supplying a laser beam to the laser head via an optical path portion extending along the arm portion; Control means for controlling the operation of the plasma torch, the laser head, and the laser beam supply unit, respectively; The plasma head is located near the tip side of the arm portion, the laser head is located near the proximal side of the arm portion, and the arm portion is formed to be movable. On the tip side of the arm portion, a plasma head evacuation region for evacuating the plasma head is formed, On the proximal side of the arm portion, a laser head evacuation region for evacuating the laser head is formed, The control means retracts the laser head to the laser head evacuation area when the plate is processed by the plasma torch, and when the plate is processed by the laser head, the plasma torch is the plasma. And controlling the evacuation to the torch evacuation area. The method of claim 11, And a shield for shielding at least partially between the work space and the laser head evacuation area. The method of claim 11, And a means for adjusting the optical axis of the laser beam supplied from the laser beam supply unit to the laser head in accordance with the position of the laser head. The method of claim 11, The control means, A cutting line which defines a cutting line for cutting the plate, and classifies the cutting line into a plasma cutting type and a laser cutting type according to processing conditions including the geometric characteristics or the degree of processing of the cutting line or the characteristics of the plate. An upper control device having instruction information; A laser control device for controlling the laser head based on the processing instruction information and cutting along the cutting line of the laser cutting type; And a plasma control device for controlling the plasma torch based on the processing instruction information and cutting the plasma torch along a cutting line of the plasma cutting type. The said laser control apparatus is a composite thermal cutting device which shifts the said laser beam supply part to a wake-up state, when the said laser processing is performed, and makes the said laser beam supply part transition to a sleep state, when the said plasma processing is performed. . The method of claim 11, The said control means uses a predetermined measurement data measured at the time of any one of the said plasma processing or the said laser processing also for the other processing. In the composite heat cutting device having both a laser head and a plasma torch, Table for holding plate, Moving means for moving the laser head and the plasma torch, respectively, above the table; Control means for controlling the operation of the plasma torch and the laser head, respectively; Outside the work space for laser processing or plasma processing, a plasma head evacuation region for evacuating the plasma head and a laser head evacuation region for evacuating the laser head are respectively formed, The control means, When the plate is processed by the plasma torch, the laser head is evacuated to the laser head evacuation region. When the plate is processed by the laser head, the plasma torch is evacuated to the plasma torch evacuation region. Composite thermal cutting device characterized in that for controlling to. In the composite heat cutting device having both a laser head and a plasma torch, Table for holding plate, Moving means for moving the laser head and the plasma torch, respectively, above the table; A laser beam supply unit for supplying a laser beam to the laser head; Control means for controlling the operation of the plasma torch, the laser head, and the laser beam supply unit, respectively; The control means, And a start operation command to the laser beam supply unit when the laser processing is performed, and an operation stop command to the laser beam supply unit when the plasma processing is performed. In the composite heat cutting device having both a laser head and a plasma torch, Table for holding plate, Moving means for moving the laser head and the plasma torch, respectively, above the table; Distance detecting means for detecting a distance between the laser head and the plate; Control means for controlling the operation of the plasma torch and the laser head, respectively; The control means, Based on the distance data measured by said distance detecting means at the time of laser processing, distance data between the said board | plate material and the said plasma torch is calculated, and plasma processing is performed on the said board | plate material based on this calculated distance data. Complex thermal cutting device, characterized in that. In the composite heat cutting device having both a laser head and a plasma torch, Table for holding plate, Moving means for moving the laser head and the plasma torch, respectively, above the table; A laser beam supply unit for supplying a laser beam to the laser head; And adjusting means for adjusting an optical axis of light beams supplied from the laser beam supply unit to the laser head, The adjusting means, A mirror unit for reflecting the laser beam, A posture change unit for changing the posture of the mirror unit in a predetermined direction; And a posture control unit configured to input and operate a control signal to the posture change unit. The posture control unit, A position detector for detecting a position of the laser head; A correction amount storage unit for storing a correction amount for eliminating positional deviation occurring in the mirror unit in accordance with the positional change of the laser head; And a signal generation unit for generating and outputting a control signal for operating the posture change unit on the basis of the detection signal from the position detection unit.

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