KR100854105B1 - Mask ink jet device for semiconductor wafer printer - Google Patents

Mask ink jet device for semiconductor wafer printer Download PDF

Info

Publication number
KR100854105B1
KR100854105B1 KR1020070026566A KR20070026566A KR100854105B1 KR 100854105 B1 KR100854105 B1 KR 100854105B1 KR 1020070026566 A KR1020070026566 A KR 1020070026566A KR 20070026566 A KR20070026566 A KR 20070026566A KR 100854105 B1 KR100854105 B1 KR 100854105B1
Authority
KR
South Korea
Prior art keywords
mask
ink
chuck
wafer
pattern
Prior art date
Application number
KR1020070026566A
Other languages
Korean (ko)
Inventor
박용봉
Original Assignee
(주) 대진유압기계
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주) 대진유압기계 filed Critical (주) 대진유압기계
Priority to KR1020070026566A priority Critical patent/KR100854105B1/en
Application granted granted Critical
Publication of KR100854105B1 publication Critical patent/KR100854105B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Coating Apparatus (AREA)

Abstract

The present invention relates to a mask ink spraying device for a semiconductor wafer printing apparatus, comprising: a wafer chuck installed on a base and mounted with a wafer to support a circumference of the mounted wafer; A mask disposed on the wafer and having a pattern formed thereon to be stamped on the wafer, the ink being applied to the pattern; A mask chuck installed on the wafer chuck to lift the mask and stamping the mounted mask onto the wafer; Ink spraying means installed on one side of the wafer chuck and the mask chuck to inject ink into a pattern of the mask; Rotation means connected to the mask chuck and rotating the mask chuck toward the ink ejection means so that ink is ejected onto the pattern of the mask; And a controller connected to the ink injection means and the rotation means to control them.

Therefore, the operation is very simple because a series of operations for transferring the stamped mask to the ink spraying means, injecting ink into the pattern of the transferred mask, and transferring the ink ejected mask back onto the wafer chuck are automatically performed. Workability is improved and printing accuracy can be improved.

Description

Mask ink jet device for semiconductor wafer printing equipment

1 is a schematic perspective view showing a mask ink spraying device for a semiconductor wafer printing apparatus of the present invention.

Figure 2 is a schematic perspective view of the main part of the present invention

3 is a schematic side view of FIG. 2

4 is a schematic front view showing the ink jetting means;

5 is a schematic perspective view showing a rotating means

6A and 6B are cross-sectional views of FIG. 5 and a plan view thereof;

7 is a schematic side view showing the mask chuck separated from the auxiliary axis;

8 and 9 are schematic plan views and side views showing the state in which the mask chuck is rotated 90 ° in the horizontal direction by operating the first rotating means;

10 and 11 are schematic plan views and side views showing a state in which the mask chuck is turned up by 180 ° with the second rotating means operated;

* Description of the symbols for the main parts of the drawings *

1: Base 2: Case

3: wafer 4: ball screw

5: Table guide shaft 6: Rotating means guide shaft

7: Transfer Table 8: Drive Motor

9: reducer 10: wafer chuck

20: mask chuck 21: removable groove

22: mask 23: electromagnet

24: hydraulic cylinder 25: auxiliary shaft

30: ink spraying means 31: main body

32: workspace 33: ink bottle

34: injector 35: pump

36: hot air fan 40: rotation means

50: first rotating means 51: lower case

51a: square hole 52: upper case

53: first drive motor 54: first drive shaft

55: First Drive Gear 56: First Drive Gear

57: index plate 57a: through hole

58: support 59: connecting shaft

60: second rotation means 61: second drive motor

62: second drive shaft 63: second drive gear

64: second electric gear 70: controller

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask ink spraying device for a semiconductor wafer printing apparatus, and more particularly, to transfer a stamped mask to an ink spraying means, to spray ink onto a pattern of the transported mask, and to apply the mask on which the ink is sprayed onto the wafer chuck. It relates to a mask ink spraying device for a semiconductor wafer printing device in which a series of operations to be transferred to the wafer is automatically performed.

The semiconductor manufacturing process is a process of making a wafer using silicon, forming a circuit pattern on the wafer, and then cutting the wafer to form a semiconductor chip. A detailed description thereof is as follows.

First, it has a stage of Polisilicon creation. This is a step of making a silicon ingot while rotating the high purity purified silicon solution in a casting.

It has a wafer slicing step after the nodule growth step. In this silicon rod cutting step, the silicon pillar is cut into thin wafers of the same thickness. Wafer size is 4 inches, 6 inches and 8 inches depending on the size of the silicon rod.

Wafer surface polishing (Lapping & Polishing) step after the silicon rod cutting step. This step wipes one side of the wafer and polishes it smoothly like a mirror. The pattern of the electronic circuit is drawn on the polished surface. After the wafer surface polishing step, in the circuit design, electronic circuit patterns are designed using a computer system.

After the circuit design, the mask preparation stage is completed. The designed circuit pattern is drawn on a glass plate with an E-Beam facility to make a mask. Also known as a photo mask, it serves as the original photographic plate. In the development process, a mask is placed on a wafer and then exposed to strong ultraviolet rays so that the circuit drawn on the glass is also drawn on the wafer.

Oxidation (Oxidation Layering) step after the mask fabrication step. It sprays oxygen or water vapor on the surface of the silicon wafer at a high temperature (800-1200 degrees) to form a silicon oxide film (SiO2). The oxide films distinguish one another from each other so that wirings to be drawn on the wafer do not short-circuit.

After the oxidation step, there is a photoresist coating step. In this step, the photoresist is evenly applied to the wafer surface. It is then baked slightly and sent to a photographing device called an ligner. From this point on, the wafer serves as a photo paper for photographs.

After the photoresist application step, there is a stepper exposure step. This step is a step of taking a photo of the circuit pattern on the wafer on which the PR film is formed by passing light through the circuit pattern drawn on the mask using a stepper.

After the exposure step, there is a development process (Develop & Bake). This process is the same as for normal photographic phenomenon. When the developer is sprayed on the wafer, the wafer is divided into a lighted part and an unlighted part during the exposure process, and the developer of the lighted part is blown away and the part not receiving the light remains.

After the developing step, there is an etching process. This process selectively removes unnecessary parts using chemicals (wet) or corrosive gas (dry) to form circuit patterns on the wafer. Corrode the remaining parts leaving the remaining developer. After etching, remove the photoresist with sulfuric acid solution.

After the etching process, the ion implantation process, chemical vapor deposition process, and metal deposition process will be further provided. Has a wafer cutting process in which a wafer is cut into a small size using a diamond saw in order to remove one chip drawn on the wafer.

The most important process of such a semiconductor manufacturing process is the exposure operation for forming the circuit pattern formed in the mask on a wafer. As described above, various processes are required for such an exposure operation, and processes such as an oxidation process, a photoresist coating, an exposure, a developing process, and an etching process are required.

As described above, in order to form a circuit pattern of a mask on a wafer, various processes have to be performed, thereby increasing the overall semiconductor manufacturing process, thereby causing various problems such as lower workability and increased production cost.

In order to solve such a conventional problem, a stamping apparatus for a semiconductor wafer printing apparatus has been developed, which includes a wafer chuck supporting wafers on which the wafers are mounted and mounted, and blowing air into the wafer chuck. An air compressor for convexly deforming the wafer mounted on the wafer chuck, a mask provided to be elevated above the wafer chuck, and having a pattern formed thereon for stamping the wafer and injecting ink onto the pattern; And a mask chuck lifting means installed at one side of the wafer chuck and the mask chuck and connected to the mask chuck and stamping the ink pattern of the mask on the wafer chuck while lifting the mask chuck, and the air compressor. Connected to the center portion of the wafer to convex upwards Type to control the air compressor to be connected to a lifting means the mask chuck comprises a controller for controlling the stamping pressure in the mask and a mask chuck transfer.

Such a stamping apparatus for semiconductor wafer printing apparatus directly prints the pattern of the mask on the wafer by a stamping method, rather than forming the circuit pattern of the mask on the wafer by the exposure operation. That is, ink is applied to the mask on which the circuit pattern is formed, and the mask is directly stamped onto the wafer. Therefore, various processes such as a photoresist coating process, an exposure process, a developing process, and an etching process required for the conventional exposure work are deleted.

However, the stamping device for a semiconductor wafer printing apparatus has to spray the ink on the pattern of the mask for the next operation after one stamping operation, which is very complicated.

That is, after the stamping operation, the mask should be separated from the mask chuck to spray ink on the mask pattern again, transferred to the spray apparatus, and then sprayed on the ink, and the ink jet mask should be mounted on the mask chuck again. do. This series of work causes problems that can complicate the print job, delay the work time, and reduce the accuracy of the print job.

SUMMARY OF THE INVENTION An object of the present invention for solving the above problems is to transfer a stamped mask to an ink spraying means, to spray ink onto a pattern of the transferred mask, and to transfer the mask from which ink is sprayed back onto a wafer chuck. The present invention provides a mask ink ejection device for a semiconductor wafer printing device that is automatically made.

The mask ink ejection apparatus for a semiconductor wafer printing apparatus of the present invention for achieving the above object comprises: a wafer chuck installed on a base and mounted with a wafer to support a circumference of the mounted wafer; A mask disposed on the wafer and having a pattern formed thereon to be stamped on the wafer, the ink being applied to the pattern; A mask chuck installed on the wafer chuck to lift the mask and stamping the mounted mask onto the wafer; Ink spraying means installed on one side of the wafer chuck and the mask chuck to inject ink into a pattern of the mask; Rotation means connected to the mask chuck and rotating the mask chuck toward the ink ejection means so that ink is ejected onto the pattern of the mask; And a controller connected to the ink injection means and the rotation means to control them.

According to another aspect of the present invention, a mask ink spraying device for a semiconductor wafer printing apparatus may include a main body provided on the base and having a working space formed therein so that the mask chuck enters and exits the upper surface of the main body. An ink container installed therein, an injector connected to the ink bottle for injecting ink into the pattern of the mask, and a pump connected to the ink bottle and the controller and operated under the control of the controller to pump ink in the ink bottle toward the ejector side. .

Another feature of the mask ink spraying device for a semiconductor wafer printing apparatus of the present invention is a hot air blower, which is connected to the controller and operated under the control of the controller, in the working space of the main body to dry the ink sprayed onto the pattern of the mask. Is installed more.

A further feature of the mask ink spraying device for a semiconductor wafer printing apparatus of the present invention is that the rotating means is installed to be elevated on the rotating means guide shaft on the base and connected to the mask chuck, wherein the mask chuck is on top of the wafer chuck and ink spraying. A first rotation means for rotating the mask chuck in a horizontal direction to reciprocate the means, and the mask chuck installed in the first rotation means and connected to the mask chuck and positioned in the ink ejection means is turned up It consists of a second rotating means to rotate it 180 ° as much as possible.

According to another aspect of the present invention, a mask ink spraying device for a semiconductor wafer printing apparatus may include: a lower case coupled to a rotating means guide shaft installed on the base and being elevated along the lower case; An upper case coupled to the upper case to be elevated together with the lower case, a first driving motor fixed to the lower case and connected thereto to be controlled by the controller, and fixed to the upper case and horizontally together with the upper case; A first driving gear and a first electric gear connected to the index plate being rotated, the first driving motor and the index plate, and transmitting the power of the first driving motor to the index plate to rotate the index plate in a horizontal direction; One end is fixed to the mask chuck and the other end is connected to the index plate so that the mask chuck is It consists of a connecting shaft which rotates together with the dex plate.

According to another aspect of the present invention, a mask ink ejecting device for a semiconductor wafer printing apparatus may include a second driving motor fixed to the upper case and connected thereto to be controlled by the controller, and the second driving gear. And a second driving gear and a second driving gear connected to the connecting shaft to transmit the power of the second driving gear to the connecting shaft and to rotate the connecting shaft clockwise or counterclockwise with respect to the center thereof.

Therefore, when the mask chuck is separated from the auxiliary shaft after the stamping operation, the first driving motor of the first rotating means is driven to rotate the index plate horizontally, and the mask chuck installed on the index plate is transferred into the main body of the ink ejection means. When the mask chuck is transferred into the main body, the first driving motor is stopped and the second driving motor of the second rotating means is driven to turn up the mask chuck so that the pattern of the mask faces upward. When the second driving motor which turns up the mask chuck is stopped, the pump is driven to pump the ink in the ink container toward the ejector side, spraying ink on the pattern of the mask, and slightly drying it with a hot air to prevent the ejected ink from flowing. The first driving motor of the second driving motor and the first rotating means are sequentially operated to position the mask chuck on the wafer chuck. Therefore, since a series of operations are performed to transfer the stamped mask to the ink jetting means, to spray ink onto the pattern of the transferred mask, and to transfer the mask on which the ink is ejected back onto the wafer chuck, the operation is very simple and easy to work. This improves the accuracy and accuracy of the print job.

Specific features and advantages of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings.

Fig. 1 is a schematic perspective view showing a mask ink spraying device for a semiconductor wafer printing apparatus of the present invention, Fig. 2 is a schematic perspective view showing an essential part of the present invention, and Fig. 3 is a schematic side view of Fig. 2. Fig. 4 is a schematic front view showing the ink jetting means, Fig. 5 is a schematic perspective view showing the rotating means, and Figs. 6A and 6B are a sectional view of Fig. 5 and a plan view thereof. Such mask ink jetting device for semiconductor wafer printing apparatus of the present invention includes a wafer chuck 10 provided on the base 1, a mask 22, a mask chuck 20, an ink jetting means 30, and a rotating means. 40, the controller 70.

The wafer chuck 10 is mounted on the base 1 and mounted on the base 1 as shown in FIGS. 1 to 3 and supports the circumference of the mounted wafers 3.

The mask 22 is provided to be elevated above the wafer chuck 10, a pattern to be stamped is formed on the wafer 3, and ink is injected onto the pattern. The mask 22 is manufactured by drawing a circuit pattern designed like a general manufacturing method on a glass plate with an E-Beam facility to make a mask.

As shown in FIGS. 1 to 3, the mask chuck 20 is mounted with the above-described mask 22 mounted so as to be elevated above the wafer chuck 10. That is, the case 2 is provided on the base 1, and the case 2 is provided with the ball screw 4 and the table guide shaft 5 vertically, and this ball screw 4 and the table guide are provided. The transfer table 7 is coupled to the shafts 5. The transfer table 7 is coupled thereto so as to move up and down along its threads when the ball screw 4 rotates. The ball screw 4 is connected to the speed reducer 9 of FIG. 1 and the speed reducer 9 is connected to the drive motor 8 so as to be rotated when the drive motor 8 is driven.

The auxiliary shafts 25 are connected between the transfer table 7 and the mask chuck 20, and these auxiliary shafts 25 are attached to and detached from the mask chuck 20 by the electromagnet 23. That is, the electromagnet 23 controlled by the controller 70 is provided in the detachable groove 21 of the mask chuck 20, and the auxiliary shaft 25 is attached to the electromagnet 23.

A hydraulic cylinder 24 is provided between the transfer table 7 and the mask chuck 20, and is controlled by the controller 70 together with the electromagnet 23. When the mask 22 is raised after being stamped on the wafer 3, the hydraulic cylinder 24 is operated while the power is cut off to the electromagnet 23, and the rod of the hydraulic cylinder 24 is advanced to assist the mask chuck 20. Separate from the shaft 25.

Here, the detachment of the mask chuck 20 and the auxiliary shaft 25 may be made by the electromagnet 23 and the hydraulic cylinder 24 as described above, but a separate hydraulic cylinder (not shown) may be used instead of the electromagnet 23. Further installation, the mask chuck 20 can be detached from the auxiliary shaft (25).

That is, a separate hydraulic cylinder (not shown) may be further connected to the mask chuck 20 or the rotation means 40 connected to the mask chuck 20 instead of the electromagnet 23. The hydraulic cylinder (not shown) is operated in conjunction with the lifting of the mask chuck 20 so that the mask chuck 20 is raised and lowered together with the transfer table 7, the mask chuck 20 is the auxiliary shaft 25 When separated from the mask chuck 20 can be lowered so that the mask chuck 20 is separated from the auxiliary shaft 25 while interlocking with the hydraulic cylinder 24 connected to the transfer table 7 and the mask chuck 20. . This hydraulic cylinder (not shown) is also connected to and controlled by the controller 70.

The ink injection means 30 is provided on one side of the wafer chuck 10 and the mask chuck 20 and injects ink into the pattern of the mask 22. The ink spraying means 30 is installed on the base 1 as shown in FIGS. 1, 4, 9, and 11, and the work space 32 is provided so that the mask chuck 20 enters and exits therein. The main body 31 formed thereon, an ink bottle 33 provided in an upper portion of the work space 32 of the main body 31, and an injector 34 connected to the ink bottle 33 to inject ink into a pattern of the mask 22; And a pump 35 connected to the ink bottle 33 and the controller 70 and operated under the control of the controller 70 to pump ink in the ink bottle 33 to the ejector 34.

The mask chuck 20 is moved into and out of the work space 32 of the main body 31 by a rotation means 40 which will be described later. In the workspace 32, a hot air blower 36 is connected to the controller 70 and operated under the control of the controller 70 to dry the ink sprayed on the pattern of the mask 22. Therefore, when the ink is spray-sprayed on the pattern of the mask 22, the hot air blower 36 is operated to dry slightly so that the ink on the mask 22 pattern does not flow or spread around.

The rotating means 40 is connected to the mask chuck 20 and rotates the mask chuck 20 toward the ink spraying means 30 so that ink is injected into the pattern of the mask 22. The rotating means 40 is composed of a first rotating means 50 and the second rotating means (60).

The first rotating means 50 is installed to be raised and lowered on the rotating means guide shaft 6 on the base 1 and connected to the mask chuck 20, and the mask chuck 20 is disposed above the wafer chuck 10 and ink spraying. The mask chuck 20 is rotated horizontally to reciprocate the means 30.

The first rotating means 50 is coupled to the lower case 51 and coupled to the rotating means guide shaft 6 installed on the base 1 to be elevated along the lower case 51 so as to rotate left and right. An upper case 52 which is lifted with the lower case 51 is provided.

The lower case 51 has a square hole 51a formed at the center thereof, and the square hole 51a is inserted into the rotating means guide shaft 6 in the form of a square column, and is elevated accordingly. In the lower case 51, a first driving motor 53 connected thereto is installed to be controlled by the controller 70. On the upper case 52, the index plate 57 which is rotated in the horizontal direction together with the upper case 52 is fixed. A circular through hole 57a is formed at the center of the index plate 57 so as to be coupled to the rotation means guide shaft 6, so that the index plate 57 rotates from side to side about the rotation means guide shaft 6. Or ascend.

The first driving motor 55 and the index plate 57 transmit the power of the first driving motor 53 to the index plate 57 to rotate the index plate 57 in the horizontal direction. ) And the first electric gear 56 is connected. The first drive gear 55 is coupled to the first drive shaft 54 of the first drive motor 53 and the first drive gear 56 is connected to the lower center of the index plate 57, the first drive The gear 55 and the first electric gear 56 are meshed with each other.

The connecting shaft 59 is connected to the mask chuck 20 and the index plate 57, and one end of the connecting shaft 59 is fixed to the mask chuck 20, and the other side of the connecting shaft 59 is connected to the mask chuck 20 and the index plate 57. It is inserted into the support part 58 on this index plate 57.

The second rotation means 60 is installed at the first rotation means 50 and connected to the mask chuck 20 and positioned 180 ° so that the mask chuck 20 located in the ink injection means 30 is turned up. Rotate The second rotation means 60 is fixed to the upper case 52 and connected to it so as to be controlled by the controller 70, the second drive motor 61 and the connecting shaft 59 The second drive gear 63 is connected to the power transmission of the second drive motor 61 to the connecting shaft 59 and the connecting shaft 59 is rotated clockwise or counterclockwise relative to the center thereof. And a second electric gear 64.

The second drive gear 63 is fixed to the second drive shaft 62 of the second drive motor 61, the second drive gear 64 is fixed on the connecting shaft 59, the second drive The gear 63 and the second electric gear 64 are meshed with each other.

The controller 70 is connected to the ink jetting means 30 and the rotating means 40 to control them. The controller 70 is connected to the electromagnet 23, and when the mask chuck 20 rises after the stamping operation, the power is cut off from the electromagnet 23 so that the mask chuck 20 is separated from the auxiliary shaft 25.

In addition, the controller 70 is connected to the pump 35 of the ink jetting means 30, and when the mask chuck 20 is positioned in the work space 32 of the main body 31, the pump operates the ink so that the mask 22 Control to spray onto the pattern.

In addition, the chuck 20 is connected to the first driving motor 53 and the second driving motor 61 of the rotating means 40 so that the mask chuck 20 has a working space (above the wafer chuck 10 and the main body 31). It controls to reciprocate transfer between 32, and controls so that the mask chuck 20 located in the workspace 32 is turned up.

When the drive motor 8 and the reducer 9 are driven by the controller 70, the ball screw 4 connected to the reducer 9 is rotated. . When the ball screw 4 is rotated, the transfer table 7 engaged with the ball screw 4 is transferred downward, and the mask 22 mounted on the mask chuck 20 comes into contact with the wafer 3 on the wafer chuck 10. As such, when the mask 22 contacts the wafer 3, the driving motor 8 is stopped and the hydraulic cylinder 24 is operated to stamp the pattern of the mask 22 onto the wafer 3.

When the mask chuck 20 is raised after the stamping operation, the power of the electromagnet 23 is cut off and the transfer table 7 is slightly raised as shown in FIG. 7, while the rod of the hydraulic cylinder 24 is advanced while the mask chuck 20 is advanced. ) Is separated from the auxiliary shaft 25.

When the mask chuck 20 is separated from the auxiliary shaft 25, the first rotating means 50 and the second rotating means 60 of the rotating means 40 as shown in detail in FIGS. 5 and 6 are sequentially operated. do.

First, when the first driving motor 53 of the first rotating means 50 is driven, the rotational force is index plate (1) through the first driving shaft 54, the first driving gear 55, the first transmission gear 56 ( 57, the index plate 57 is rotated 90 degrees in the horizontal direction.

When the index plate 57 is rotated, a plurality of parts installed thereon are rotated therewith, and the upper case 52 fixed to the lower part of the index plate 57 and the support 58 installed on the index plate 57 and the A connecting shaft 59 connected to the support 58, a mask chuck 20, and a second rotating means 60 installed on the upper case 52, that is, a second driving motor 61, a second driving shaft 62, The second drive gear 63 and the second electric gear 64 are rotated together with the index plate 57.

As such, when the index plate 57 is rotated by the first rotation means 50, the main body 31 of the ink jetting means 30 is the mask chuck 20 connected to the index plate 57 as shown in FIGS. 8 and 9. Is entered. When the mask chuck 20 is located in the work space 32 of the main body 31, the first driving motor 53 of the first rotating means 50 is stopped and the second driving motor of the second rotating means 60 ( 61 is driven.

When the second driving motor 61 is operated, the second driving shaft 62, the second driving gear 63, and the second electric gear 64 are linked to each other to connect the connecting shaft 59 connected to the second electric gear 64. The center is rotated by 180 ° with respect to the center thereof, and as a result, the entire mask chuck 20 is turned up as shown in FIGS. 10 and 11. Accordingly, the mask 22 positioned at the bottom of the mask chuck 20 faces upward, and the pattern of the mask 22 faces the injector 34.

As such, when the mask chuck 20 is turned up by the second rotating means 60, the second driving motor 61 is stopped and the pump 35 and the injector 34 of the ink jetting means 30 are operated to form an ink container ( Ink in 33 is spray-sprayed onto the mask 22 pattern.

When the ink is sufficiently injected into the mask 22 pattern, the pump 35 and the injector 34 are stopped and the hot air blower 36 is operated. The ink is slightly dried to prevent the ink on the sprayed mask 22 pattern from flowing or spreading around the pattern. Let's do it.

When the ink jetting operation is completed, the second rotating means 60 is operated to return the turned up mask chuck 20 to its original state, and the first rotating means 50 is operated to wafer the mask chuck 20 in the main body. Position the upper position, the electromagnet 23 is operated and the transfer table 7 is lowered to couple the mask chuck 20 to the auxiliary shaft (25).

Such a mask ink jetting device for a semiconductor wafer printing apparatus of the present invention has the following advantages.

First, when the mask chuck 20 is separated from the auxiliary shaft 25 after the stamping operation, the first driving motor 53 of the first rotating means 50 is driven to rotate the index plate 57 in the horizontal direction. The mask chuck 20 provided on the plate 57 is transferred into the main body 31 of the ink jetting means 30.

When the mask chuck 20 is transferred into the main body 31, the first driving motor 53 is stopped and the second driving motor 61 of the second rotating means 60 is driven to turn up the mask chuck 20. The pattern of the mask 22 is directed upward.

When the second driving motor 61 which turns up the mask chuck 20 is stopped, the pump 35 and the injector 34 are driven to inject the ink in the ink container 33 into the pattern of the mask 22 and the ejected ink After drying slightly with the hot air blower 36 to prevent flow, the second driving motor 61 of the second rotating means 60 and the first driving motor 53 of the first rotating means 50 are sequentially operated to mask The chuck 20 is positioned on the wafer chuck 10.

Therefore, the operation of transferring the stamped mask 22 to the ink spraying means 30, the operation of turning up the transferred mask 22, the operation of spraying ink onto the pattern of the turned-up mask, and such a mask chuck ( A series of operations for transferring 20) back onto the wafer chuck 10 are automatically and accurately performed. Therefore, the process of spraying ink back to the stamped mask of the mask chuck 20 and positioning the wafer on the wafer chuck 10 is performed easily and accurately, so that the ink spraying on the mask 22 is very efficient, The defective rate of the stamped product can be reduced.

In the present invention as described above, since a series of operations are automatically performed to transfer the stamped mask to the ink spraying means, spray ink onto the pattern of the transferred mask, and transfer the ink ejected mask back onto the wafer chuck. The work is very simple, the workability is improved and the accuracy of the print job is improved.

Claims (6)

A wafer chuck (10) installed on the base (1) and supporting a circumference of the wafer (3) on which the wafer (3) is mounted; A mask 22 positioned on the wafer 3 to form a pattern to be stamped on the wafer 3 and to which ink is applied to the pattern; A mask chuck (20) mounted on the wafer chuck (10) to raise and lower the mask (22) and stamping the mounted mask (22) on the wafer (3); Ink spraying means (30) installed on one side of the wafer chuck (10) and the mask chuck (20) to eject ink onto the pattern of the mask (22); Rotating means (40) connected to the mask chuck (20) and rotating the mask chuck (20) toward the ink injection means (30) so that ink is injected into the pattern of the mask (22); And a controller (70) connected to the ink spraying means (30) and the rotating means (40) to control them. The method of claim 1, wherein the ink injection means 30, A main body 31 installed on the base 1 and having a work space 32 formed therein to allow the mask chuck 20 to enter and exit therein; An ink container 33 installed at an upper portion of the work space 32 of the main body 31; An injector 34 connected to the ink container 33 to inject ink into the pattern of the mask 22; The pump 35 is connected to the ink container 33 and the controller 70 and operated under the control of the controller 70 to pump the ink in the ink container 33 toward the injector 34. Mask ink jetting apparatus for semiconductor wafer printing apparatus. The work space 32 of the main body 31, And a hot air blower 36 connected to the controller 70 and operated under the control of the controller 70 to dry the ink sprayed on the pattern of the mask 22. Mask ink jetting apparatus for wafer printing apparatus. The method of claim 1, wherein the rotating means 40, It is installed to be raised and lowered on the rotating means guide shaft 6 on the base 1 and connected to the mask chuck 20, and the mask chuck 20 is on top of the wafer chuck 10 and inside the ink spraying means 30. A first rotating means 50 for rotating the mask chuck 20 in a horizontal direction so as to reciprocate and; Second rotating means (60) installed on the first rotating means (50), connected to the mask chuck (20), and rotating the mask chuck (20) located within the ink injection means (30) by 180 ° so as to turn up. Mask ink spraying device for a semiconductor wafer printing apparatus comprising a). The method of claim 4, wherein the first rotating means 50, A lower case 51 coupled to the rotating means guide shaft 6 installed on the base 1 and being elevated accordingly; An upper case 52 coupled to the lower case 51 so as to be rotated left and right and lifted together with the lower case 51; A first driving motor 53 fixed to the lower case 51 and connected thereto to be controlled by the controller 70; An index plate 57 fixed to the upper case 52 and rotated in a horizontal direction together with the upper case 52; A first motor connected to the first driving motor 53 and the index plate 57 to transmit the power of the first driving motor 53 to the index plate 57 to rotate the index plate 57 in a horizontal direction. The first driving gear 55 and the first electric gear 56; One end is fixed to the mask chuck 20 and the other end is connected to the index plate 57 is characterized in that consisting of the connecting shaft 59 for rotating the mask chuck 20 together with the index plate 57 A mask ink spraying device for a semiconductor wafer printing device. The method of claim 5, wherein the second rotating means 60, A second driving motor 61 fixed to the upper case 52 and connected thereto to be controlled by the controller 70; It is connected to the second drive motor 61 and the connecting shaft 59 transmits the power of the second driving motor 61 to the connecting shaft 59, the connecting shaft 59 is a clock based on the center A mask ink spraying device for a semiconductor wafer printing apparatus, comprising a second drive gear (63) and a second electric gear (64) for rotation in a direction or counterclockwise direction.
KR1020070026566A 2007-03-19 2007-03-19 Mask ink jet device for semiconductor wafer printer KR100854105B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070026566A KR100854105B1 (en) 2007-03-19 2007-03-19 Mask ink jet device for semiconductor wafer printer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070026566A KR100854105B1 (en) 2007-03-19 2007-03-19 Mask ink jet device for semiconductor wafer printer

Publications (1)

Publication Number Publication Date
KR100854105B1 true KR100854105B1 (en) 2008-08-26

Family

ID=39878579

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070026566A KR100854105B1 (en) 2007-03-19 2007-03-19 Mask ink jet device for semiconductor wafer printer

Country Status (1)

Country Link
KR (1) KR100854105B1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020080534A (en) * 2001-04-16 2002-10-26 삼성전자 주식회사 Method and transfer apparatus for wafer
KR200397740Y1 (en) 2005-07-26 2005-10-06 마이다스시스템주식회사 Mask aligner mounted with air bearing
JP2006116824A (en) 2004-10-21 2006-05-11 Oki Electric Ind Co Ltd Printing method of electrically conductive ink and printing equipment of electrically conductive ink

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020080534A (en) * 2001-04-16 2002-10-26 삼성전자 주식회사 Method and transfer apparatus for wafer
JP2006116824A (en) 2004-10-21 2006-05-11 Oki Electric Ind Co Ltd Printing method of electrically conductive ink and printing equipment of electrically conductive ink
KR200397740Y1 (en) 2005-07-26 2005-10-06 마이다스시스템주식회사 Mask aligner mounted with air bearing

Similar Documents

Publication Publication Date Title
KR100240022B1 (en) Developing device for semiconductor device fabrication and its controlling method
TWI405620B (en) Nozzle cleaning for liquid process, method for preventing dryout of processing liquid and the apparatus thereof
US4021278A (en) Reduced meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
US7976896B2 (en) Method of processing a substrate and apparatus processing the same
TW201941289A (en) Substrate processing method and substrate processing apparatus
US8147153B2 (en) Rinsing method, developing method, developing system and computer-read storage medium
KR100854105B1 (en) Mask ink jet device for semiconductor wafer printer
JP2006173462A (en) Wafer processor
US10766054B2 (en) Substrate processing method and substrate processing apparatus
KR100824776B1 (en) Semiconductor wafer printer
KR101061700B1 (en) Development method of substrate, processing method of substrate and developer supply nozzle
KR101347925B1 (en) Coating treatment apparatus, substrate treatment system, coating treatment method, and computer storage medium
JP2006032905A (en) Chemical coating machine and chemical coating method
KR20080085291A (en) Mask vacuum adsorption device for semiconductor wafer printer
JP4715144B2 (en) Slit nozzle application system
US11915948B2 (en) Flattening apparatus, article manufacturing method, flattening method, and imprinting apparatus
JP4966262B2 (en) Manufacturing method and manufacturing apparatus for hot press mold
US7367725B2 (en) Method for removing developing solution
KR102075685B1 (en) Apparatus and method for washing mask
KR100437850B1 (en) Development apparatus for fabricating semiconductor device and controlling method thereof to avoid causing product defect in subsequent process to development process
KR20070077089A (en) Coating method, coating apparatus and memory medium
KR102371362B1 (en) Apparatus for coating PLP wafer surfaces
KR100832373B1 (en) Stamping device for semiconductor wafer printer
JP2607382B2 (en) Ashing apparatus and ashing method
US20220197159A1 (en) Developing method and substrate treatment system

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20120606

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20130813

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20140804

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20150811

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20160803

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20171016

Year of fee payment: 10

FPAY Annual fee payment

Payment date: 20180904

Year of fee payment: 11