KR100851605B1 - 화이트 엘이디의 제조방법 - Google Patents
화이트 엘이디의 제조방법 Download PDFInfo
- Publication number
- KR100851605B1 KR100851605B1 KR1020060085683A KR20060085683A KR100851605B1 KR 100851605 B1 KR100851605 B1 KR 100851605B1 KR 1020060085683 A KR1020060085683 A KR 1020060085683A KR 20060085683 A KR20060085683 A KR 20060085683A KR 100851605 B1 KR100851605 B1 KR 100851605B1
- Authority
- KR
- South Korea
- Prior art keywords
- lamp
- fluorescent material
- lead frame
- blue chip
- white led
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title description 2
- 239000000463 material Substances 0.000 claims abstract description 40
- 238000000465 moulding Methods 0.000 claims abstract description 30
- 230000020169 heat generation Effects 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000011247 coating layer Substances 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (3)
- 블루칩에서 발생되는 블루라이트에 의해 형광물질이 여기되어 블루라이트의 파장을 변환시킴으로써 백색의 빛을 발산토록 하는 화이트 엘이디의 제조방법에 있어서,리드프레임 상에 블루칩을 장착시키는 다이본딩단계;상기 다이본딩단계에서 리드프레임 상에 장착된 블루칩과 리드프레임을 와이어를 통해 전기적으로 연결시키는 와이어본딩단계;상기 와이어본딩단계에서 리드프레임과 전기적으로 연결된 블루칩 상에 1차램프를 형성시키는 1차램프몰딩단계;상기 1차램프몰딩단계에서 형성된 1차램프 상에 형광물질을 도포하는 형광물질도포단계; 및상기 형광물질도포단계에서 형광물질이 도포된 상기 1차램프 상에 2차램프를 형성시키는 2차램프몰딩단계;를 포함하여 이루어지는 것을 특징으로 하는 화이트 엘이디의 제조방법.
- 삭제
- 삭제
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060085683A KR100851605B1 (ko) | 2006-09-06 | 2006-09-06 | 화이트 엘이디의 제조방법 |
US11/653,641 US20080057601A1 (en) | 2006-09-06 | 2007-01-16 | Method for manufacturing a white LED |
CN200710003213.XA CN101140970A (zh) | 2006-09-06 | 2007-01-29 | 用于制造白色led的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060085683A KR100851605B1 (ko) | 2006-09-06 | 2006-09-06 | 화이트 엘이디의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080022344A KR20080022344A (ko) | 2008-03-11 |
KR100851605B1 true KR100851605B1 (ko) | 2008-08-12 |
Family
ID=39152161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060085683A KR100851605B1 (ko) | 2006-09-06 | 2006-09-06 | 화이트 엘이디의 제조방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20080057601A1 (ko) |
KR (1) | KR100851605B1 (ko) |
CN (1) | CN101140970A (ko) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030063211A (ko) * | 2002-01-21 | 2003-07-28 | 솔리드라이트 코퍼레이션 | 백색 led의 제조 방법 |
KR20040044701A (ko) * | 2002-11-21 | 2004-05-31 | 삼성전기주식회사 | 발광소자 패키지 및 그 제조방법 |
KR20040080883A (ko) * | 2003-06-23 | 2004-09-20 | 럭스피아 주식회사 | 사마륨을 포함하는 알루미늄산이트륨계 적색형광체를 갖는발광다이오드 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1534803B (zh) * | 1996-06-26 | 2010-05-26 | 奥斯兰姆奥普托半导体股份有限两合公司 | 具有发光变换元件的发光半导体器件 |
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2006
- 2006-09-06 KR KR1020060085683A patent/KR100851605B1/ko active IP Right Grant
-
2007
- 2007-01-16 US US11/653,641 patent/US20080057601A1/en not_active Abandoned
- 2007-01-29 CN CN200710003213.XA patent/CN101140970A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030063211A (ko) * | 2002-01-21 | 2003-07-28 | 솔리드라이트 코퍼레이션 | 백색 led의 제조 방법 |
KR20040044701A (ko) * | 2002-11-21 | 2004-05-31 | 삼성전기주식회사 | 발광소자 패키지 및 그 제조방법 |
KR20040080883A (ko) * | 2003-06-23 | 2004-09-20 | 럭스피아 주식회사 | 사마륨을 포함하는 알루미늄산이트륨계 적색형광체를 갖는발광다이오드 |
Also Published As
Publication number | Publication date |
---|---|
KR20080022344A (ko) | 2008-03-11 |
CN101140970A (zh) | 2008-03-12 |
US20080057601A1 (en) | 2008-03-06 |
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