KR100848709B1 - Downward type deposition source - Google Patents

Abstract

A downward type evaporation source is provided to prevent an evaporating material from flowing out even when the evaporation source is turned upside down or inclined. A crucible body(20) provides a charging space of an evaporating material(B) and includes a supply part(23) for supplying the evaporated material to the upper side and a moving part(21) positioned on the center axis of the supply part to move the evaporated material to the lower side. A cover(30) is coupled with the top part of the crucible body in order to connect the supply part and the moving part to each other. A diffusion unit(40) is installed on the lower part of the moving part in order to diffuse the deposition moved from the moving part of the crucible body.

Description

Top down evaporation source {DOWNWARD TYPE DEPOSITION SOURCE}

1 and 2 are views of the crucible body in the evaporation source according to the prior art, respectively,

3 is a perspective view of a state except the housing from the top-down evaporation source according to an embodiment of the present invention,

4 is an exploded perspective view of a state in which a cover is removed from FIG. 3;

5 is a partial cutaway perspective view of FIG. 3;

6 is a cross-sectional view taken along the line A-A of FIG.

7 is a longitudinal sectional view of a top-down evaporation source according to an embodiment of the present invention;

8 is a view in which the top-down evaporation source shown in FIG. 7 is inclined;

9 is a schematic structural diagram of a thin film deposition apparatus having a top-down evaporation source according to an embodiment of the present invention.

10 is a longitudinal sectional view of a top-down evaporation source further provided with an auxiliary heating unit therein according to an embodiment of the present invention.

11 is a longitudinal sectional view of a top-down evaporation source further provided with a small top-down evaporation source therein according to an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

1: process chamber 3: susceptor

5 substrate 10 top down evaporation source

20: crucible body 21: moving part

23: supply part 30: cover

33: extension part 40: diffusion part

40a: plate 40b: connection

50 housing 60 heating portion

63: auxiliary heating unit

The present invention relates to a top-down evaporation source, and more particularly, the evaporation material filled therein does not spill even when turned upside down or inclined at an angle. The present invention relates to a top-down evaporation source and a thin film deposition apparatus having the same, which can be easily applied to a product by having a simple structure, thereby reducing process costs and contributing to the development of the next-generation semiconductor and display industries.

Substrate is a term including both a thin wafer for manufacturing a semiconductor and a glass substrate.

Meanwhile, a variety of processes are involved before the substrate is released as a product, one of which is a thin film deposition process.

Typical methods of forming a thin film on a substrate include physical vapor deposition (PVD), such as vacuum deposition, ion-plating, and sputtering, and chemical vapor deposition (CVD) by gas reaction. have. Among them, the vacuum deposition method is mainly used to form a thin film such as an organic film layer, an electrode, etc. of the organic light emitting device as in the present embodiment.

As the evaporation source used in the vacuum deposition method, an effusion cell of an indirect heating method (or induction heating method) is usually used. The conventional vacuum deposition method is a method of forming a thin film on a substrate by mounting an evaporation source on the lower part of the process chamber and a film formation substrate on the evaporation source.

Meanwhile, as the display industry develops, the size of substrates, especially glass substrates, continues to grow.

In this case, although the glass substrate continues to grow in size, the conventional method of forming a thin film on the substrate by using an existing evaporation source, the glass substrate must be suspended on the upper side, so that the thin and wide glass substrate must be bent downward. It becomes difficult to obtain a uniform deposited thin film on the substrate. Therefore, in this case, it is equipped with a means for preventing the glass substrate suspended on the upper side, which has a disadvantage that considerably high technical cost.

Therefore, in recent years, a technique for forming a thin film on the upper surface of the substrate from the top of the substrate after placing the substrate on the bottom has been continuously studied, but there are still problems to be solved.

For example, Japanese Patent Application No. 1989-168024 and Korean Patent Application No. 2002-0052899 disclose a top-down evaporation source in which a substrate is placed at the bottom and an evaporation source is provided on the substrate. There is a problem that it is quite complicated and practically difficult to apply to the product.

In addition, as shown in FIGS. 1 and 2 as a means to be solved in addition to the solution to the technical problem disclosed in the document, when the inverted crucible body (120,220) filled with evaporation material therein, it is filled therein There is a means for preventing the evaporated substance (B) from pouring easily.

That is, in the conventional structure as shown in FIGS. 1 and 2, since the crucible main body 120 and 220 has a simple container structure, there is no limit to the angle of tilting the crucible main body 120 and 220. Therefore, this problem also needs to be solved.

Taken together, in order to develop a top-down evaporation source, even if the top-down evaporation source is turned upside down or tilted at an angle, the evaporation material charged inside does not spill and it is convenient for use and can be deposited from the top to the bottom of the substrate located below. However, it is necessary to research and develop in a direction that can be applied to products by having a simple structure, thereby reducing process costs and contributing to the development of next-generation semiconductor and display industries.

An object of the present invention is to solve the problems of the existing process, even if the inverted or inclined at an angle in the opposite direction is not easy to use because it does not spill the evaporated material filled inside, but also from the top to the bottom substrate Providing a top-down evaporation source and a thin film deposition apparatus having the same, which can be deposited in a direction but have a simple structure, which can be easily applied to a product, thereby reducing process costs and contributing to the development of the next-generation semiconductor and display industries. will be.

The object of the present invention is to provide a filling space for evaporation material, and a crucible having a supply part for supplying evaporated deposition material to an upper part and a moving part positioned at an axis of the supply part and communicating with an upper part of the supply part to move the deposition material downward. main body; And a lid detachably coupled to the upper portion of the crucible body or integral with the crucible body so that the supply part and the moving part communicate with each other; And a diffusion part disposed below the moving part and configured to diffuse and discharge the deposition material moved from the moving part of the crucible body; Characterized in that it comprises a.

The supply can be annular.

The supply portion may be plural and radially disposed around the moving portion.

The supply may be in communication with an adjacent supply.

The cover may be hemispherical or dome shaped.

The diffusion part may be a disk-shaped plate forming a bottom surface, and a reducer-type connection part that connects the moving part and the plate of the crucible body and extends downward.

A housing coupled to the diffusion portion to accommodate the crucible body and the cover therein, and a heating unit for heating the evaporation material filled in the supply portion between the crucible body and the inner wall surface of the housing may be further provided.

The heating unit may extend from the top of the cover to the top of the plate.

The cover may further include a cylindrical extension portion extending to the inner lower end of the moving part at the center.

An auxiliary heating part may be further provided inside the extension part.

The cover may further include an extension part extending from the inside of the moving part to the diffusion part in the center, and further provided with a small top-down evaporation source inside the extension part.

An auxiliary heating part may be further provided between the extension part and the crucible body of the top-down evaporation source.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention.

Prior to the description, the substrate to be described below includes a thin wafer for manufacturing a semiconductor, a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED). It is to be considered a term that includes all glass substrates.

Figure 3 is a perspective view of a state without the housing from the top-down evaporation source according to an embodiment of the present invention, Figure 4 is an exploded perspective view of the cover removed in Figure 3, Figure 5 is a partially cutaway perspective view of Figure 3, Figure 6 3 is a cross-sectional view of the top-down evaporation source according to an embodiment of the present invention, FIG. 8 is a view in which the top-down evaporation source shown in FIG. 7 is inclined, and FIG. 9 is an embodiment of the present invention. Figure 10 is a schematic structural diagram of a thin film deposition apparatus having a top down evaporation source according to the present invention, Figure 10 is a longitudinal sectional view of a top down evaporation source further provided with an auxiliary heating unit in accordance with an embodiment of the present invention, Figure 11 is an embodiment of the present invention The vertical cross-sectional view of the top-down evaporation source is further provided with a small top-down evaporation source therein.

First, referring first to FIG. 9, the top-down evaporation source 10 (see FIG. 7) of the present embodiment may be used in the same structure as in FIG. 9.

That is, the top-down evaporation source 10 is installed in the upper region in the process chamber 1, but the top-down evaporation source 10 is installed in the upper region of the substrate 5 supported by the susceptor 3. By depositing the evaporation material downward toward), it is possible to form a deposited thin film on the upper surface of the substrate (5).

Of course, Fig. 9 is merely a diagram schematically showing the present embodiment, and the vapor deposition apparatus is not substantially the same as Fig. 9. For example, the process chamber 1 should be equipped with various valves for maintaining the vacuum therein, structures for elevating the susceptor 3, and means for entering and exiting the substrate 5 into the process chamber 1. Seen to be. However, these various additional configurations will be referred to the known ones.

Next, the top-down evaporation source 10 of the present embodiment that can be used as shown in FIG. 9 will be described with reference to FIGS. 3 to 8.

The top-down evaporation source 10 of the present embodiment includes a crucible body 20, a lid 30, a diffusion portion 40, a housing 50, and a heating portion 60.

The crucible body 20 is a part which forms a basic skeleton in the top down evaporation source 10 of this embodiment. The crucible body 20 has a cylindrical shape. However, since this is only one embodiment, the crucible body 20 does not necessarily have a cylindrical shape.

For example, the crucible body 20 may be made of various polygonal columns such as triangular, square, or hexagonal columns. Inside the crucible body 20, a moving part 21 and a supply part 23 are provided as a space in which the evaporation material B is moved or filled.

The moving part 21 is a part which forms the moving space which moves the evaporation material B which completed heating by the heating part 60 mentioned later below. The moving part 21 is disposed at the shaft center of the crucible body 20 in the form of a cylinder. That is, one of the plurality of holes shown in FIG. 6 is located at the center of the moving part 21. The upper part and the lower part of the moving part 21 are open. The upper area communicates with the upper area of the supply part 23 and the space in the cover 30, and the lower area communicates with the diffusion part 40.

The supply part 23 is arrange | positioned in multiple numbers by the moving part 21 as the axial center. In the present embodiment, as shown in FIGS. 4 and 6, the supply part 23 may have a total of six supply parts 23 arranged radially or may be formed in an annular shape, and a portion of the supply parts 23 communicate with each other. Can be. Of course, since the scope of the present invention is not limited thereto, the supply unit 23 and the moving unit 21 may be appropriately changed.

Each of the supply parts 23 is filled with an evaporation material B for forming a deposited thin film on the substrate 5. Thus, when the evaporation material (B) is heated by the heating unit 60, the heated evaporation material (B) is moved to the upper portion of the moving unit 21 through the open upper portion of the supply unit 23, and then moved While moving below the portion 21, it can finally exit through the diffusion portion 40 and face the upper surface of the substrate 5.

The cover 30 is detachably coupled to the upper portion of the crucible body 20 or integrally formed to prevent the evaporation material B from flowing out. The cover 30 serves to shield the upper opening of the moving part 21 and the supply part 23 forming the upper part of the crucible body 20 from the outside, and the upper part of the moving part 21 and the supply part 23. It does not shield the openings individually. Therefore, the cover 30 preferably has a hemispherical or dome shape.

As such, the lid 30 is coupled to the upper portion of the crucible body 20 without separately shielding the upper openings of the moving portion 21 and the supply portion 23, thereby, for example, FIG. Even though inclined as shown in FIG. 8, the evaporation material B therein has an advantage not to be poured out.

The diffusion part 40 is disposed below the moving part 21 and discharges the deposition material transferred from the moving part 21 of the crucible body 20.

The diffusion portion 40 includes a disk-shaped plate 40a that forms a bottom surface, and a connection portion 40b of a reducer type that connects the crucible body 20 and the plate 40a to each other.

As such, the diffusion part 40 including the connection part 40b and the plate 40a is manufactured to have a reducer shape in which the cross-sectional area gradually expands from the crucible body 20 to the plate 40a. However, since this is just one embodiment, the diffusion part 40 does not necessarily have a reducer shape in which its cross-sectional area is extended.

On the other hand, the housing 50 is combined with the diffusion portion 40 so that the crucible body 20 and the cover 30 can be accommodated therein to form the appearance of the top-down evaporation source 10 of the present embodiment.

Between the inner wall surface of the housing 50 and the crucible body 20 is further provided with a heating unit 60 for heating the evaporation material (B) filled in the supply unit (23). Although not shown in detail, the heating unit 60 must be efficiently disposed along the outer wall surface of the crucible body 20 like the supply unit 23 must be efficiently. As one example, the heating unit 60 may be provided by being reciprocated along the longitudinal direction of the crucible body 20 after being replaced with a coil.

The operation of the top-down evaporation source 10 having such a configuration will be described.

First, as shown in FIG. 9, in the state where the thin film deposition apparatus is designed, power is applied to turn on the heating unit 60. When the heating part 60 is turned on, the evaporation material B filled in the supply part 23 by the heating part 60 starts to heat.

The heated evaporation material (B) is raised as shown in the arrow direction of Figures 5 and 7, and then flows into the upper portion of the moving part 21 provided on the shaft center of the crucible body (20).

As such, the heated evaporated material B introduced into the upper portion of the moving part 21 is downwardly moved in the moving part 21 and then diffused through the diffusion part 40 to be directed toward the upper surface of the substrate 5. . Accordingly, a thin film made of the evaporated material B ejected may be formed on the upper surface of the substrate 5 of FIG. 9.

In addition, as shown in Figure 10, by increasing the diameter of the moving part 21 can increase the amount of evaporation material (B) is ejected per unit time, wherein the moving part at a distance from the heating unit 60 (21) The evaporation material (B) at the center may be entangled with each other due to the relatively low temperature, and thus may act as a fouling material on the substrate. Therefore, the center of the cover 30 forms an extension part 33 extending into the moving part 21, and the auxiliary heating part 63 is provided in the extension part 33 to the evaporated material B ejected. Provide constant heat to prevent them from tangling with each other.

In addition, as shown in FIG. 11, the cover 30 further includes an extension part 33 extending from the inside of the moving part 21 to the diffusion part 40 in the center, and the inside of the extension part 33. It is provided with a small top-down evaporation source (10) filled with a different material to deposit two kinds of materials on the substrate, between the inner wall surface of the extension portion 33 and the crucible body 20 of the top-down evaporation source (10) The auxiliary heating unit 63 is provided to continuously supply heat so that the evaporated material B ejected is not entangled.

As described above, according to the present embodiment, even if the top-down evaporation source 10 is turned upside down or inclined at an angle, the evaporation material B filled therein does not spill and is convenient for use. Can be ejected at the same time, increasing production efficiency.

In addition, it is possible to deposit from the top to the bottom for the substrate (5) located on the bottom, but having a simple structure can be easily applied to the product can reduce the process cost. Ultimately, it must be able to contribute to the development of the next-generation semiconductor and display industries.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

As described above, according to the present invention, even if the inverted direction or inclined angle in the opposite direction is not easy to use because the evaporated material does not pour inside, it is possible to deposit in a downward direction from the top to the bottom substrate is simple By having a structure, it is easy to apply to a product, thereby reducing process costs and further contributing to the development of the next-generation semiconductor and display industries.

Claims (12)

The filling space of the evaporation material (B) is formed, the supply unit 23 for supplying the evaporated deposition material to the upper portion, and located in the axial center of the supply unit 23 and communicates with the upper portion of the supply unit 23 to lower the deposition material Crucible body 20 is provided with a moving unit 21 for moving to; A lid 30 detachably coupled to an upper portion of the crucible body 20 or integrally formed with the crucible body 20 so that the supply part 23 and the moving part 21 communicate with each other; And A diffusion part 40 provided below the moving part 21 and configured to diffuse and discharge the deposition material moved from the moving part 21 of the crucible body 20; Top down evaporation source comprising a. The method of claim 1, The supply unit 23 is a top-down evaporation source, characterized in that the annular. The method of claim 1, The supply unit 23 is a plurality of top-down evaporation source, characterized in that arranged radially around the moving part (21). The method of claim 1, Downward evaporation source, characterized in that the supply portion 23 is in communication with the adjacent supply portion (23). The method of claim 1, The cover 30 is a top-down evaporation source, characterized in that hemispherical or dome-shaped. The method of claim 1, The diffusion portion 40, A disk-shaped plate 40a forming a bottom surface, Downward evaporation source, characterized in that the connection portion of the crucible body (20) and the plate (40a) of the reducer-type connecting to each other and extending toward the bottom. The method according to any one of claims 1 to 6, A housing 50 coupled with the diffusion part 40 to accommodate the crucible body 20 and the cover 30 therein; Downward evaporation source, characterized in that further provided between the crucible body (20) and the inner wall surface of the housing (50) for heating the evaporation material (B) filled in the supply (23). The method of claim 7, wherein The heating unit (60) is a top-down evaporation source, characterized in that extending from the top of the cover (30) to the upper portion of the plate (40a). The method of claim 5, wherein The cover 30 is a top-down evaporation source, characterized in that the center is further formed with a cylindrical extension portion 33 extending to the inner lower end of the moving portion (21). The method of claim 9, Downward evaporation source, characterized in that the auxiliary heating portion 63 is further provided inside the extension portion (33). The method according to any one of claims 1 to 6, The cover 30 further has an extension part 33 extending from the inside of the moving part 21 to the diffusion part 40 in the center, and the downward evaporation source 10 is small inside the extension part 33. Downward evaporation source, characterized in that further provided. The method of claim 11, Downward evaporation source, characterized in that further provided between the extension 33 and the crucible main body 20 of the top-down evaporation source (10).

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