KR100848707B1 - mold for injection molding - Google Patents

Abstract

According to the present invention, the injection mold for a cleaner using a shape-adaptive cooling passage and a high thermal conductivity material is provided with upper and lower molds which are combined with each other to form at least one cavity, and at least one of the upper mold and the lower mold is a mold. A base member, a heat conduction media layer formed on the mold base member by a molding method, a shaping layer formed on the heat conduction media layer and constituting the cavity, and formed between the shaping layer and the heat conduction media layer, The buffer layer which prevents a crack from generate | occur | producing by the difference of the thermal expansion amount of a layer is provided. This injection mold is simple to manufacture, and the cooling water passage can be formed on the side adjacent to the forming layer, thereby maximizing the cooling efficiency.

Injection mold, vacuum, cavity, heat conduction media layer, buffer layer.

Description

Mold for injection molding manufactured using a molding method

1 is a cross-sectional view of the injection mold for a cleaner produced using the molding method of the present invention,

Figure 2 is an enlarged cross-sectional view showing a part of the upper mold or lower mold according to the present invention.

<Explanation of symbols for the main parts of the drawings>

10; Injection mold 20; Upper mold

30; Lower mold 23,33; Heat conducting media

24,34; Cooling water passage 25,35; Buffer layer

26,36; Forming layer

The present invention relates to an injection mold, and more particularly to an injection mold for a cleaner produced using a molding method.

When manufacturing injection molds used in various fields such as automotive, electronics, aviation, etc., prototypes are generally manufactured for design errors and design verification in the early stages of product development. Prototypes are mainly manufactured using materials that are easy to process, such as wood and plastic, which takes a lot of time and money, and has the disadvantage of not being able to accurately process freeform surfaces.

To overcome this limitation, Rapid Prototyping (RP) is used at the design stage. Rapid Prototyping (RP) is a method that can be used directly from 3D CAD data using various non-metallic and metal materials such as paper, wax, and polymers. It is a method of rapidly forming a dimensional prototype or a mold for injection.

The rapid forming method is a method of joining a solid or granular solid material into a desired form by hardening a liquid or powder material by irradiating a laser beam to harden or melt to produce a three-dimensional shape. There are two ways to make it.

First, one of the above-mentioned curing methods (stereolithography, SLA; 3D Systems Co., Ltd.) continuously stacks one by one by selectively irradiating and solidifying a laser beam onto a liquid photopolymer. That's the way.

Such optical molding method is a method of irradiating a laser beam locally (3D Systems-SLA, Quadrax, Sony, Dupont, etc.) and a method of irradiating one layer at a time by using an ultraviolet lamp (Cubital-SGC, There are two ways: Light Sculpting.

Manufacturing an injection mold using such a molding method has an advantage that the processing time and the cooling time can be shortened. In applying this molding method to an injection mold, heterogeneous materials are laminated in order to improve the thermal conductivity of the mold and to realize the required hardness. However, this injection mold has many problems, such as cracks at the interface due to the difference in thermal expansion of the two materials.

Therefore, ongoing research on this is being attempted, the application of the injection mold for molding a precise part and the precise mold manufacturing of electronic products.

The present invention is to solve the problems described above, it is possible to form a cooling passage in the position close to the mold steel forming the surface of the cavity freely forming the cooling passage for shortening the processing time for the production, cooling water supply An object of the present invention is to provide an injection mold for a cleaner manufactured using a molding method capable of improving the cooling efficiency.

Another object of the present invention is to provide an injection mold for a cleaner manufactured by using a molding method that allows the design of a cooling passage to be free and reduces the occurrence of cracks due to a difference in thermal expansion between a high thermal conductive material and a mold steel.

Injection mold for cleaners produced using the molding method of the present invention to achieve the above object is

Having upper and lower molds which are mutually joined to form at least one cavity,

At least one of the upper mold and the lower mold is a mold base member, a heat conduction media layer formed by the molding method on the mold base member, a molding layer formed on the heat conduction media layer and forming the cavity;

The buffer layer is formed between the shaping layer and the heat conduction media layer, and is provided with a buffer layer that prevents cracks from being generated due to the difference in thermal expansion between the shaping layer and the heat conduction media layer.

In the present invention, the mold base member and the heat conductive medium layer may be made of copper or copper alloy. The buffer layer is made of a material having a higher coefficient of thermal expansion than the thermally conductive medium layer and a smaller coefficient of thermal expansion than the molding layer. It is preferable to use an alloy of Cu and Ni. In addition, a cooling water passage through which cooling water circulates is formed in the thermal conductive medium layer.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The injection mold for a cleaner manufactured using the molding method according to the present invention is to facilitate the processing of the mold and to maximize the cooling efficiency by installing a cooling passage adjacent to the molding layer. Showed in.

Referring to the drawings, the injection mold 10 manufactured by the molding method is the upper and lower molds 20, 30 and the upper and lower molds 20, which are mutually joined to form at least one cavity 11. 30 is provided with upper and lower support plates 21 and 31 respectively installed at upper and lower portions of the upper and lower portions, and guide pins (not shown) for guiding them when they are molded and separated.

The mold of at least one side of the upper and lower molds 20 and 30 configured as described above is a thermally conductive medium layer 23 laminated on the surface of the mold base members 22 and 32 by a molding method as shown in FIG. 2. 33). The thermally conductive media layers 23 and 33 irradiate the surface of the mold base members 22 and 32 with a YAG laser or a CO ₂ laser to the surface of the mold base members 22 and 32 to form metal powders, that is, thermally conductive media layers. The Cu powder, which is a high thermal conductivity material for forming (23) and (33), is precisely supplied and controlled to form a three-dimensional shape by laminating it, and then molded using a rapid metal molding method.

In this process, the cooling water supply passages 24 and 34 through which the cooling water flows are formed, and the cooling water supply passages 24 and 34 can be formed in various forms regardless of the shape thereof. That is, in order to form a cooling line in the upper and lower molds as in the prior art, it is possible to fundamentally solve the design constraints derived when forming by mechanical processing.

As described above, when the formation of the thermally conductive media layers 23 and 33 made of a high thermal conductivity material is completed on the upper surfaces of the mold base members 22 and 32, the buffer layers 25 and 35 are formed on the upper surfaces thereof. The buffer layers 25 and 35 are formed of a material having a larger thermal expansion coefficient than the thermally conductive media layers 23 and 33 and a smaller thermal expansion coefficient than the molding layer described later. Preferably, the buffer layers 25 and 35 are formed of an alloy of copper and nickel, and the alloy is mixed at a mixing ratio of 5-10 wt% nickel and 90-95 wt% copper. The buffer layers 25 and 35 are not limited to the above-described embodiments, and may be any materials as long as they can absorb the difference in thermal expansion amount between the molded layer and the heat conductive medium layer.

Meanwhile, molding layers 26 and 36 are formed on upper surfaces of the buffer layers 25 and 35 to form a cavity for molding a product. The molding layers 26 and 36 are made of mold steel.
The injection mold for a cleaner manufactured using the molding method according to the present invention configured as described above can shorten the manufacturing time compared to the conventional mold manufacturing, and can improve productivity, and there is no restriction on metal materials. The choice of materials is easy.

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In addition, it is possible to freely design and manufacture a complex cooling circuit inside the mold, thereby increasing the cooling efficiency. In particular, a cooling passage is formed on the side adjacent to the forming layers 26 and 36 to maximize the cooling efficiency. .

As described above, the injection mold for a cleaner manufactured using the molding method of the present invention may form a cooling water passage on a side adjacent to the forming layer by using the molding method of the upper mold and the lower mold, and thus, the mold base from the molding layer. Since the heat transfer efficiency to the member side can be improved, the cooling time of the injection molding cycle can be significantly shortened.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (4)

Having upper and lower molds which are mutually joined to form at least one cavity, At least one of the upper mold and the lower mold is a mold base member, a heat conduction media layer formed by the molding method on the mold base member, a molding layer formed on the heat conduction media layer and forming the cavity; An injection mold for a cleaner manufactured by using a molding method, wherein the buffer layer is formed between the molding layer and the thermally conductive media layer to prevent cracking due to a difference in thermal expansion between the molding layer and the thermal conductive media layer. . The method of claim 1, The mold base member and the thermally conductive media layer are made of copper or a copper alloy, and the buffer layer is a cleaner manufactured using a molding method, characterized in that the thermal expansion coefficient is greater than the thermal conductivity media layer and the thermal expansion coefficient is smaller than the molding layer. Injection mold The method of claim 2, The buffer layer is an injection mold for a cleaner manufactured using a molding method, characterized in that the alloy of Cu and Ni. The method of claim 1, The injection mold for a cleaner manufactured by using a molding method, characterized in that the heat conduction medium layer has a coolant passage through which coolant is circulated.

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