JP2007144737A - Manufacturing method of three-dimensional structure and manufacturing method of three-dimensional resin structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an manufacturing method of a three-dimensional structure capable of being enhanced in dimensional precision and a manufacturing method of a three-dimensional resin structure. <P>SOLUTION: The manufacturing method of the three-dimensional structure comprises a process for forming an optically shaped resin part on a substrate by optical shaping performed by irradiating a photo-curable resin with a light and a process for forming the three-dimensional structure on the substrate on which the optically shaped resin part is formed by at least one kind of method selected from group consisting of an electrolytic plating method, an electroless plating method, a sputtering method, a CVD method and a vapor deposition method. The manufacturing method of a three-dimensional resin structure utilizes the three-dimensional structure obtained by this manufacturing method. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a three-dimensional structure and a method for manufacturing a three-dimensional resin structure, and more particularly to a method for manufacturing a three-dimensional structure and a method for manufacturing a three-dimensional resin structure capable of improving dimensional accuracy.

  Conventionally, methods for producing a molding die, a metal part, and the like using stereolithography are disclosed in Patent Document 1 and Patent Document 2.

  Referring to paragraphs [0003] to [0005] of Patent Document 1, first, slice data of a cross section for each layer of a formation target is created based on three-dimensional data of a model to be optically modeled. Here, a base plate is set in advance on a platform that can be moved up and down, a metal powder is supplied onto the base plate by the thickness of the first layer, and laser light is irradiated based on the created slice data. As a result, the metal powder is sintered to harden the first layer into the shape specified by the slice data, and the first layer and the base plate are bonded.

  Next, the platform is lowered, new metal powder is supplied by the thickness of the second layer, and the metal powder is sintered by irradiating laser light based on the created slice data. The second layer is cured to the specified shape, and the second layer and the first layer are bonded.

  By repeating such a process, in Patent Document 1, a molding die that is a shaped object obtained by sintering metal powder is produced.

  Further, referring to paragraphs [0007] to [0013] of Patent Document 2, first, laser light is irradiated based on data (three-dimensional CAD data) that numerically indicates a three-dimensional shape of a resin mold that is a formation target. Then, a two-dimensional resin film is stacked in layers to form a three-dimensional resin mold having a predetermined shape.

  Next, a resin gate type is joined to the resin mold formed by the above-described stereolithography through a resin branch. Then, the surface of the resin mold, the branch part, and the gate is coated with a slurry of silica sand or alumina, and then the process of sprinkling the sand is repeated several times to obtain a predetermined thickness on the surface of the resin mold, etc. A shell-shaped mold is formed.

  Then, by sufficiently drying and heating the mold formed as described above, the mold is modified into a ceramic-like material, and the resin-made resin mold, the branch part and the gate mold melt and flow out to the outside. As a result, a hollow mold is completed.

Molten metal is cast into the cavity inside the mold, and after the molten metal is cooled and solidified, the mold is broken, and the branch part and the gate-type part are cut. Thereby, a metal part having the same shape as the resin mold is completed.
JP 2002-129203 A JP 2001-219245 A

  However, in the method described in Patent Document 1, since metal powder is melted by laser light irradiation and then cooled and molded, thermal shrinkage occurs during cooling, and the shape of the molding die that is a molded product is There is a problem that the dimensional accuracy of the molding die deteriorates due to deformation.

  Further, in the method described in Patent Document 2, when a low melting point metal is poured into a mold, as in Patent Document 1, thermal shrinkage occurs during cooling of the low melting point metal, and the shape of the metal part is deformed. As a result, there is a problem that the dimensional accuracy of the metal parts deteriorates.

  In view of the above circumstances, an object of the present invention is to provide a method for manufacturing a three-dimensional structure and a method for manufacturing a three-dimensional resin structure, which can improve dimensional accuracy.

  The present invention is selected from the group consisting of a step of forming an optical modeling resin portion on a substrate by optical modeling performed by irradiating light to a photocurable resin, and electrolytic plating, electroless plating, sputtering, CVD, and vapor deposition Forming a three-dimensional structure on a substrate on which an optical modeling resin portion is formed by at least one method. According to this method, the dimensional accuracy of the three-dimensional structure can be improved.

  Here, in the method for producing a three-dimensional structure according to the present invention, a conductive film can be formed on the surface of the substrate, and the three-dimensional structure can be formed on the conductive film by electrolytic plating after the formation of the optical modeling resin portion. . According to this method, the dimensional accuracy of the three-dimensional structure can be improved, and the three-dimensional structure can be easily obtained by peeling off the conductive film.

  Moreover, in the manufacturing method of the three-dimensional structure of the present invention, after forming the conductive layer on the optical modeling resin portion by at least one method selected from the group consisting of electroless plating, sputtering, CVD, and vapor deposition, A three-dimensional structure can also be formed on the conductive layer by electrolytic plating. According to this method, the dimensional accuracy of the three-dimensional structure can be improved even when the optical modeling resin portions on the substrate are densely packed and the conductive film cannot be exposed.

  Moreover, this invention irradiates light to a photocuring resin at the process of immersing at least a board | substrate in a liquid photocuring resin, and the shape of the cross section of the predetermined height of the optical modeling resin part formed on a board | substrate. Forming the resin molding resin portion on the substrate by alternately repeating the formation of the resin film and the movement of the photocurable resin in the depth direction of the substrate, and electrolytic plating, electroless plating, sputtering, CVD, and Including a step of forming a three-dimensional structure on the substrate on which the optical modeling resin portion is formed by at least one method selected from the group consisting of vapor deposition and a step of separating the three-dimensional structure from the substrate. It is a manufacturing method of a dimensional structure. According to this method, the dimensional accuracy of the three-dimensional structure can be improved.

  Furthermore, the present invention provides a method for producing a three-dimensional resin structure, including a step of forming a three-dimensional resin structure by molding a resin using the three-dimensional structure produced by any of the above methods as a mold. It is. According to this method, the dimensional accuracy of the three-dimensional resin structure can be improved.

  In the present invention, since a conductive film or the like may be formed on the surface of the substrate, the substrate and the optical modeling resin portion, and the substrate and the three-dimensional structure may be in contact with each other or not. Also good.

  Further, in the present invention, “optical modeling” means that resin films having a cross-sectional shape from the bottom part to the top part of the optical modeling resin part are sequentially formed by irradiating light to the photo-curing resin, and these are stacked. This means a method of forming the optical modeling resin part.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the three-dimensional structure which can improve a dimensional accuracy, and the manufacturing method of a three-dimensional resin structure can be provided.

  Embodiments of the present invention will be described below. In the drawings of the present invention, the same reference numerals represent the same or corresponding parts.

(Embodiment 1)
First, as shown in the schematic cross-sectional view of FIG. 1, a conductive film 2 made of titanium, for example, with a thickness of 1 μm is formed on a substrate 1 such as glass or quartz by a sputtering method or the like. Next, as shown in the schematic cross-sectional view of FIG. 2, for example, a diameter of 50 μm on the conductive film 2 is formed on the conductive film 2 by stereolithography by irradiating a conventionally known photocuring resin such as epoxy resin or acrylic resin with laser light. A 500 μm cone-shaped optical modeling resin portion 3 is formed.

Here, formation of the optical modeling resin part 3 by optical modeling is performed as follows, for example.
First, based on the data indicating the three-dimensional shape of the optical modeling resin part 3 shown in the schematic side view of FIG. 3A, the cross section along the IIIB-IIIB of the optical modeling resin part 3 (FIG. 3). (B)) data (hereinafter also referred to as “slice data”) is created for all of the optical modeling resin part 3 from the bottom to the top (height h).

  Next, as shown in the schematic cross-sectional view of FIG. 4A, in the liquid photo-curing resin 4 accommodated in the container 5 in a state where the substrate 1 on which the conductive film 2 is formed is placed on the pedestal 6. Soak.

  Then, based on the slice data created as described above, first, the shape of the bottom surface of the optical modeling resin portion 3 is irradiated with the laser light 7, whereby the portion of the photo-curing resin 4 irradiated with the laser light 7 is obtained. By curing, a resin film having the same shape as that of the bottom surface of the optical modeling resin portion 3 is formed. Then, the board | substrate 1 is moved to the direction of the arrow 8 (depth direction of the photocurable resin 4).

  And based on said slice data, by irradiating the shape of the cross section of the optical modeling resin part 3 of the position of the same height as the movement distance of the board | substrate 1 with the laser beam 7, it is the same as the cross section of the position. A resin film having a shape is formed. Thereafter, the substrate 1 is further moved in the direction of the arrow 8 (the depth direction of the photocurable resin 4).

  By alternately repeating the irradiation of the laser beam 7 onto the photocurable resin 4 and the movement of the substrate 1 in the direction of the arrow 8, the resin films are sequentially stacked, and FIG. 4B and FIG. As shown in C), the optical modeling resin portion 3 is formed on the conductive film 2.

  Subsequently, the substrate 1 after the formation of the optical modeling resin portion 3 is taken out and washed, and then immersed in a nickel plating solution to perform electrolytic plating. As shown in the schematic sectional view of FIG. A three-dimensional structure 9 made of nickel is formed on 2. In the present embodiment, the case where a three-dimensional structure is formed by electrolytic plating has been described. However, in the present invention, at least one selected from the group consisting of electrolytic plating, electroless plating, sputtering, CVD, and vapor deposition is used. The three-dimensional structure 9 can be formed using this method.

  Thereafter, the conductive film 2 is removed by oxygen plasma ashing, and at the same time, the optical modeling resin portion 3 is removed, the three-dimensional structure 9 is separated from the substrate 1, and the three-dimensional structure shown in the schematic cross-sectional view of FIG. A body 9 is obtained. Here, since the conductive film 2 made of titanium can be removed by oxygen plasma ashing, the three-dimensional structure 9 can be easily separated from the substrate 1. The separation of the three-dimensional structure 9 from the substrate 1 is not limited to the method using oxygen plasma ashing, but can be performed by a method such as mechanical separation other than oxygen plasma ashing.

  Here, since the three-dimensional structure 9 shown in FIG. 6 has a conical hole 10 having a diameter of 50 μm and a depth of 500 μm, for example, the three-dimensional structure 9 is a nozzle (inkjet nozzle) of an inkjet printer or the like. Can be used for manufacturing.

  Thus, in the present embodiment, the three-dimensional structure can be formed using at least one method selected from the group consisting of electrolytic plating, electroless plating, sputtering, CVD, and vapor deposition. The amount of thermal shrinkage that occurs in the three-dimensional structure during the manufacturing process of the three-dimensional structure can be reduced as compared with the methods described in Patent Document 1 and Patent Document 2. Therefore, in this embodiment, the dimensional accuracy of the three-dimensional structure can be improved.

(Embodiment 2)
First, as shown in the schematic cross-sectional view of FIG. 1, a conductive film 2 made of titanium, for example, with a thickness of 1 μm is formed on a substrate 1 such as glass or quartz by a sputtering method or the like. Next, as shown in the schematic cross-sectional view of FIG. 2, for example, a diameter of 50 μm on the conductive film 2 is formed on the conductive film 2 by stereolithography by irradiating a conventionally known photocurable resin such as an epoxy resin or an acrylic resin with a laser beam. A 500 μm cone-shaped optical modeling resin portion 3 is formed.

Here, formation of the optical modeling resin part 3 by optical modeling is performed as follows, for example.
First, based on the data indicating the three-dimensional shape of the optical modeling resin part 3 shown in the schematic side view of FIG. 3A, the cross section along the IIIB-IIIB of the optical modeling resin part 3 (FIG. 3). The slice data of (B)) is created for all of the height (h) from the bottom to the top of the optical modeling resin portion 3.

  Next, as shown in the schematic cross-sectional view of FIG. 4A, in the liquid photo-curing resin 4 accommodated in the container 5 in a state where the substrate 1 on which the conductive film 2 is formed is placed on the pedestal 6. Soak.

  Then, based on the slice data created as described above, first, the shape of the bottom surface of the optical modeling resin portion 3 is irradiated with the laser light 7, whereby the portion of the photo-curing resin 4 irradiated with the laser light 7 is obtained. By curing, a resin film having the same shape as that of the bottom surface of the optical modeling resin portion 3 is formed. Then, the board | substrate 1 is moved to the direction of the arrow 8 (depth direction of the photocurable resin 4).

  And based on said slice data, by irradiating the shape of the cross section of the optical modeling resin part 3 of the position of the same height as the movement distance of the board | substrate 1 with the laser beam 7, it is the same as the cross section of the position. A resin film having a shape is formed. Thereafter, the substrate 1 is further moved in the direction of the arrow 8 (the depth direction of the photocurable resin 4).

  By alternately repeating the irradiation of the laser beam 7 onto the photocurable resin 4 and the movement of the substrate 1 in the direction of the arrow 8, the resin films are sequentially stacked, and FIG. 4B and FIG. As shown in C), the optical modeling resin portion 3 is formed on the conductive film 2.

  Subsequently, the substrate 1 after the formation of the optical modeling resin portion 3 is taken out and washed, and then immersed in a nickel plating solution to perform electrolytic plating. As shown in the schematic sectional view of FIG. A three-dimensional structure 9 made of nickel is formed on 2. In the present embodiment, the case where a three-dimensional structure is formed by electrolytic plating has been described. However, in the present invention, at least one selected from the group consisting of electrolytic plating, electroless plating, sputtering, CVD, and vapor deposition is used. A three-dimensional structure can be formed using this method.

  Thereafter, the conductive film 2 is removed by oxygen plasma ashing, and at the same time, the optical modeling resin portion 3 is removed, the three-dimensional structure 9 is separated from the substrate 1, and the three-dimensional structure shown in the schematic cross-sectional view of FIG. A body 9 is obtained. Here, since the conductive film 2 made of titanium can be removed by oxygen plasma ashing, the three-dimensional structure 9 can be easily separated from the substrate 1. The separation of the three-dimensional structure 9 from the substrate 1 is not limited to the method using oxygen plasma ashing, but can be performed by a method such as mechanical separation other than oxygen plasma ashing.

  Here, the three-dimensional structure 9 shown in FIG. 6 has, for example, a conical hole 10 having a diameter of 50 μm and a depth of 500 μm.

  Finally, using the three-dimensional structure 9 shown in FIG. 6 as a mold, the resin is molded by pouring a resin such as an acrylic resin into the hole 10 and then curing the resin, thereby forming the three-dimensional resin structure shown in FIG. The body 11 can be obtained.

  The three-dimensional resin structure 11 thus obtained has, for example, a conical protrusion having a diameter of 50 μm and a height of 500 μm. Therefore, the three-dimensional resin structure 11 can be used for a painless needle or the like. it can.

  Thus, in the present embodiment, a three-dimensional structure serving as a mold can be formed using at least one method selected from the group consisting of electrolytic plating, electroless plating, sputtering, CVD, and vapor deposition. Therefore, the dimensional accuracy of the three-dimensional structure can be improved as compared with the methods described in Patent Document 1 and Patent Document 2. Therefore, in this embodiment, since the three-dimensional resin structure can be molded using the three-dimensional structure with improved dimensional accuracy as a mold, the dimensional accuracy of the three-dimensional resin structure after molding is also improved. .

(Embodiment 3)
First, a substrate 1 such as glass or quartz as shown in the schematic cross-sectional view of FIG. 8 is prepared. Next, as shown in the schematic cross-sectional view of FIG. 9, for example, a diameter of 50 μm is formed on the surface of the substrate 1 by optical modeling that irradiates a conventionally known photo-curing resin such as an epoxy resin or an acrylic resin with a laser beam, A cone-shaped optical modeling resin portion 3 having a height of 500 μm is formed.

Here, formation of the optical modeling resin part 3 by optical modeling is performed as follows, for example.
First, based on the data indicating the three-dimensional shape of the optical modeling resin portion 3 shown in the schematic side view of FIG. 10A, the cross section along the XB-XB of the optical modeling resin portion 3 (FIG. 10). The slice data of (B)) is created for all of the height (h) from the bottom to the top of the optical modeling resin portion 3.

  Next, as shown in the schematic cross-sectional view of FIG. 11A, the substrate 1 is immersed in the liquid photocurable resin 4 accommodated in the container 5 in a state where the substrate 1 is placed on the base 6.

  Then, based on the slice data created as described above, first, the shape of the bottom surface of the optical modeling resin portion 3 is irradiated with the laser light 7, whereby the portion of the photo-curing resin 4 irradiated with the laser light 7 is obtained. By curing, a resin film having the same shape as that of the bottom surface of the optical modeling resin portion 3 is formed. Then, the board | substrate 1 is moved to the direction of the arrow 8 (depth direction of the photocurable resin 4).

  And based on said slice data, by irradiating the shape of the cross section of the optical modeling resin part 3 of the position of the same height as the movement distance of the board | substrate 1 with the laser beam 7, it is the same as the cross section of the position. A resin film having a shape is formed. Thereafter, the substrate 1 is further moved in the direction of the arrow 8 (the depth direction of the photocurable resin 4).

  By alternately repeating the irradiation of the laser beam 7 onto the photocurable resin 4 and the movement of the substrate 1 in the direction of the arrow 8, the resin films are sequentially stacked, and FIG. 11B and FIG. As shown in C), the optical modeling resin portion 3 is formed.

  Subsequently, the substrate 1 after the formation of the optical modeling resin portion 3 is taken out and washed, and then immersed in an electroless nickel plating solution to perform electroless plating, as shown in the schematic cross-sectional view of FIG. The conductive layer 12 made of nickel is formed on the surface of the optical modeling resin portion 3. In the present embodiment, the case where the conductive layer 12 is formed by electroless plating has been described. However, in the present invention, at least one method selected from the group consisting of electroless plating, sputtering, CVD, and vapor deposition is used. The conductive layer 12 can be formed.

  Then, a three-dimensional structure 9 is formed on the surface of the conductive layer 12 by electrolytic plating, as shown in the schematic cross-sectional view of FIG.

  Thereafter, the three-dimensional structure 9 is separated from the conductive layer 12, and the three-dimensional structure 9 having a shape as shown in the schematic cross-sectional view of FIG. 6 is obtained.

  Here, the three-dimensional structure 9 shown in FIG. 6 has, for example, a conical hole 10 having a diameter of 50 μm and a depth of 500 μm.

  Finally, using the three-dimensional structure 9 shown in FIG. 6 as a mold, the resin is molded by pouring a resin such as an acrylic resin into the hole 10 and then curing the resin, thereby forming the three-dimensional resin structure shown in FIG. The body 11 can be obtained.

  The three-dimensional resin structure 11 thus obtained has, for example, a conical protrusion having a diameter of 50 μm and a height of 500 μm. Therefore, the three-dimensional resin structure 11 can be used for a painless needle or the like. it can.

  As described above, in the present embodiment, a three-dimensional structure that becomes a mold can be formed by electrolytic plating. Therefore, the dimensional accuracy of the three-dimensional structure is compared with the methods described in Patent Document 1 and Patent Document 2. Can be improved. Therefore, in this embodiment, since the three-dimensional resin structure can be molded using the three-dimensional structure with improved dimensional accuracy as a mold, the dimensional accuracy of the three-dimensional resin structure after molding is also improved. be able to.

  Furthermore, in this embodiment, since a three-dimensional structure can be formed by electroplating after forming a conductive layer by electroless plating or the like, the optical modeling resin portion on the substrate is densely exposed to expose the conductive film. Even if this is not possible, a three-dimensional structure with improved dimensional accuracy can be produced on the conductive layer by electrolytic plating.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be suitably used for manufacturing an inkjet nozzle, a painless needle, a nebulizer, a microlens array, or the like.

It is typical sectional drawing of an example of the board | substrate after forming the electrically conductive film in this invention. It is typical sectional drawing of the board | substrate after forming the optical modeling resin part on the electrically conductive film shown in FIG. 1 in this invention. (A) is a typical side view of an example of the optical modeling resin part formed in this invention, (B) is a cross section along IIIB-IIIB of the optical modeling resin part shown to (A) typically. FIG. (A) is a schematic cross-sectional view illustrating an example of the step of immersing the substrate shown in FIG. 1 on a pedestal in the present invention and immersing it in a liquid photo-curing resin accommodated in a container. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view illustrating an example of a process in the middle of forming an optical modeling resin portion in the present invention, and (C) is a schematic diagram illustrating an example of a state after completion of the optical modeling resin portion in the present invention. It is sectional drawing. It is typical sectional drawing which shows an example after forming a three-dimensional structure on the board | substrate shown in FIG.4 (C) in which the optical modeling resin part was formed in this invention. It is typical sectional drawing which shows the three-dimensional structure shown in FIG. 5 after cut | disconnecting from the board | substrate in this invention. FIG. 7 is a schematic cross-sectional view illustrating an example of a step of molding a resin using the three-dimensional structure shown in FIG. 6 as a mold in the present invention. It is typical sectional drawing which shows another example of the board | substrate used in this invention. It is typical sectional drawing of the board | substrate after forming the optical modeling resin part on the board | substrate shown in FIG. 1 in this invention. (A) is a typical side view of an example of the optical modeling resin part formed in this invention, (B) is a cross section along XB-XB of the optical modeling resin part shown to (A) typically. FIG. (A) is a schematic cross-sectional view illustrating an example of the step of immersing the substrate shown in FIG. 9 on a pedestal in the present invention and immersing it in a liquid photo-curing resin accommodated in a container. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view illustrating an example of a process in the middle of forming an optical modeling resin portion in the present invention, and (C) is a schematic diagram illustrating an example of a state after completion of the optical modeling resin portion in the present invention. It is sectional drawing. It is typical sectional drawing which shows an example after forming a conductive layer on the board | substrate shown in FIG.11 (C) in which the optical modeling resin part was formed in this invention. It is typical sectional drawing which shows an example after forming a three-dimensional structure on the conductive layer shown in FIG. 12 in this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Board | substrate, 2 Conductive film, 3 Stereolithography resin part, 4 Photocurable resin, 5 Container, 6 Base, 7 Laser beam, 8 Arrow, 9 Three-dimensional structure, 10 Hole, 11 Three-dimensional resin structure, 12 Conductive layer .

Claims (5)

Forming an optical modeling resin portion on the substrate by optical modeling performed by irradiating light to the photocurable resin; and
Forming a three-dimensional structure on the substrate on which the optical modeling resin portion is formed by at least one method selected from the group consisting of electrolytic plating, electroless plating, sputtering, CVD, and vapor deposition;
A method for manufacturing a three-dimensional structure including:   The conductive film is formed on the surface of the substrate, and the three-dimensional structure is formed on the conductive film by electrolytic plating after the formation of the optical modeling resin portion. A manufacturing method of a dimensional structure.   After the conductive layer is formed on the optical modeling resin portion by at least one method selected from the group consisting of electroless plating, sputtering, CVD, and vapor deposition, the three-dimensional structure is formed on the conductive layer by electrolytic plating. The method for manufacturing a three-dimensional structure according to claim 1, wherein the three-dimensional structure is formed. Immersing at least the substrate in a liquid photo-curing resin; and
Formation of a resin film by irradiating the photocuring resin with light in a shape of a cross section of a predetermined height of the optical modeling resin portion formed on the substrate, and in the depth direction of the photocuring resin of the substrate Forming the stereolithographic resin portion on the substrate by alternately repeating the movement of
Forming a three-dimensional structure on the substrate on which the optical modeling resin portion is formed by at least one method selected from the group consisting of electrolytic plating, electroless plating, sputtering, CVD, and vapor deposition;
Separating the three-dimensional structure from the substrate;
A method for manufacturing a three-dimensional structure including:   A method for producing a three-dimensional resin structure, comprising a step of forming a three-dimensional resin structure by molding a resin using the three-dimensional structure produced by the method according to any one of claims 1 to 4 as a mold.

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