KR100843972B1 - Liquid crystal display device and method for manufacturing lcd - Google Patents

Abstract

The present invention discloses a liquid crystal display device and a method of manufacturing the same, which can prevent substrate damage, data pad opening, seal rupture, and cell gap defect by performing cutting by spraying strong air pressure on the substrate in the cell cutting process of the liquid crystal display device. . The present invention discloses a method of forming a TFT, a gate bus line and a data bus line by sequentially applying and etching a metal film, a gate double insulating film, an amorphous silicon, a doped amorphous silicon, and a metal film on a transparent substrate, respectively; Applying a protective film to a cell gap thickness on the insulating substrate on which the TFT is formed; Forming a via hole, a post for protecting the cell gap, and a protective layer in the TFT, the gate pad, and the data pad by using a halftone mask on the insulating substrate coated with the protective film; And forming a pixel electrode by coating and etching an ITO metal on the insulating substrate on which the post is formed.

Cell, Cutting, Scribe, Post, Brake Bar, Air

Description

Liquid crystal display and its manufacturing method {LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING LCD}

1 is a plan view in which a scribe line is formed in units of panels of cells to which upper and lower substrates of a liquid crystal display are bonded according to the related art.

2A to 2F are cross-sectional views illustrating a process of cutting a cell in which a scribe line is formed according to the prior art.

3A-3C schematically illustrate a manufacturing process of an array substrate in accordance with the present invention.

FIG. 4 is a plan view of a scribe line formed in units of panels of cells to which upper and lower substrates of the liquid crystal display according to the present invention are bonded; FIG.

5 is an enlarged cross-sectional view of region X of FIG. 4.

6A through 6F are cross-sectional views illustrating a process of cutting a cell in which a scribe line is formed according to the present invention.

7 is a view showing the structure of an air jet used for cell cutting in the present invention.

* Description of the symbols for the main parts of the drawings *

30 transparent substrate 31 gate electrode

32: gate double insulating film 33: channel layer                 

34: ohmic contact layer 35a: source electrode

35b: drain electrode 37: protective film

38: post 39: pixel electrode

41: array lower substrate 45: color filter upper substrate

47a: First scribe line parallel to data bus line

47b: Second scribe line parallel to data bus line

48a: first scribe line parallel to gate bus line

48b: second scribe line parallel to gate bus line

50: cell

The present invention relates to a liquid crystal display device and a manufacturing method thereof, and more particularly, to a liquid crystal display that can prevent a data or gate pad opening on an array substrate without directly impacting the substrate, and can improve cell gap defects. An apparatus and a method of manufacturing the same.

In general, a liquid crystal display device has a structure in which an array substrate on which thin film transistors are arranged and a color filter substrate on which red, green, and blue color filter layers are formed are bonded to each other with a liquid crystal interposed therebetween.

As described above, the manufacturing process of the liquid crystal display cell in which the array lower substrate and the color filter upper substrate are bonded is as follows.                         

First, a metal film is deposited on a transparent glass substrate and etched to form a gate bus line, followed by forming a TFT, which is a pixel switching element, using a gate insulating film, an amorphous silicon film, a doped amorphous silicon film, and a source / drain electrode. do. Subsequently, an ITO transparent metal film is deposited and etched to form pixel electrodes to complete the array lower substrate.

On the array lower substrate as described above, two, four, and six independent active regions are formed according to the panel size of the liquid crystal display.

In addition, the color filter upper substrate facing the array lower substrate is completed by forming a black matrix on a transparent glass substrate and forming R, G, and B color filter layers sequentially between the black matrices. Similarly, two, four, and six independent active regions are formed on the color filter upper substrate so as to correspond to the array lower substrate.

A spacer for maintaining a cell gap is dispersed on the completed lower substrate of the array, and the color filter upper substrate aligns two substrates after forming a seal line for encapsulation during liquid crystal injection. The substrate thus bonded is called a liquid crystal cell or a liquid crystal display cell.

The cell cutting process is performed to separate the cells thus formed into panels including respective active regions.

In the cell cutting process, a hard material such as diamond is used to continuously form cracks or grooves on the surface of the organic substrate, and cut by applying an impact or load to the glass substrate along the cracks or grooves. do.                         

That is, a scribe line is scribed on the surface of the glass substrate by a scriber formed of a hard member such as a sharp diamond to form a crack along the scribe line. The glass substrate is cut by applying an impact from the other side substrate of the surface in which this crack was formed, and making a crack advance.

When cutting the glass substrate of the liquid crystal display device, a scribe line is scribed on the surface of the substrate to form cracks according to the cut, that is, scribe lines. Then, the glass substrate is broken along the scribe line by uniformly impacting the scribe line from the other substrate of the glass substrate by a rubber rod-shaped member called a break bar. Accordingly, the glass substrate is cut to a desired size.

1 is a plan view of a scribe line formed in units of a panel of cells to which upper and lower substrates of a liquid crystal display are bonded according to the related art.

As shown in FIG. 1, a cell 10 formed by bonding an array lower substrate 1 and two color filter upper substrates 3 having two liquid crystal panels together by a seal line 5 with spacers therebetween. Is shown.

In general, when manufacturing a liquid crystal display, two, four, six liquid crystal display panels are formed on a transparent glass substrate (array lower substrate: 1) according to the panel size of the liquid crystal display. That is, active layers corresponding to a plurality of liquid crystal panels are simultaneously formed on the array lower substrate 1.

Accordingly, active regions formed of TFT (Thin Film Transistor) array layers having the same structure are formed on the array lower substrate 1 at a predetermined distance.

Similarly, two, four and six matrix color filter layers on the color filter upper substrate 3 to correspond to the active regions formed on the array lower substrate 1 to correspond to the TFT array lower substrate 1. The active regions are divided into three.

When the array lower substrate 1 and the color filter upper substrate 3 are completed, after forming the seal line 5 and dispersing the spacers (not shown), the two substrates are aligned. The cells 10 are bonded to each other.

As described above, two, four or six panels of liquid crystal display devices are formed in one cell 10 according to the size of the panel. When the cell process is completed, each panel is cut and then liquid crystal is injected.

In this case, scribe lines 7a, 7b, 8a, and 8b are formed on the cell for cutting, and a crack is formed on the cell 10 by placing a hard material such as diamond on the scriber. . The scribe lines 7a, 7b, 8a, and 8b are formed on the array lower substrate 1 and the color filter upper substrate 3 constituting the cell 10, which are parallel to the gate bus line and the data bus line. It is formed along the outside of the panel size.

In addition, the second scribe line 7b parallel to the data bus line formed on the color filter upper substrate 3 may be connected to the array lower substrate to open the gate pad and the data pad of the array lower substrate 1. A scribe line is formed to be biased toward the active region than the first scribe line 7a parallel to the data bus line formed on 1).

That is, as shown in the drawing, on the array lower substrate 1, first scribe lines 8a parallel to the gate bus lines along the panel size are formed at upper and lower edges corresponding to the panel area, respectively, and the data bus. First scribe lines 7a parallel to the lines are formed at the left and right edges corresponding to the panel area, respectively.

The scribe lines 7b and 8b formed on the color filter upper substrate 3 have the same number as the scribe lines 7a and 8a formed on the array lower substrate 1, but the array lower substrate Second scribe lines 7b and 8b parallel to the data bus line or the gate bus line are formed around the active area for the data pad and the gate pad open of (1).

Accordingly, the scribe lines 7a and 8a formed on the array lower substrate 1 are formed along the panel size of the liquid crystal display, and the scribe lines formed on the color filter upper substrate 3 ( 7b and 8b are formed along the active area.

As described above, in the cell cutting process, a scribe process and a cutting process are performed. When cracks 7a, 7b, 8a, and 8b are formed on the cell 10, a break bar is used for the other substrate on which the cracks are formed. Thereby breaking the substrates by applying an instantaneous impact force.

Next, a process of forming scribe lines on a cell and forming a liquid crystal display panel by performing a cutting process will be described.

2A to 2F are cross-sectional views illustrating a process of cutting a cell in which a scribe line is formed according to the prior art.

As shown in FIG. 2A, when the TFT array lower substrate 1 is completed, the spacers 15 are scattered on the substrate, and when the color filter upper substrate 3 is completed, the seal line 5 is formed. After aligning the array lower substrate 1 on which the spacer is dispersed and the color filter upper substrate 3 on which the seal line 5 is formed, the two substrates are bonded to each other.

Since the bonding process is a material in which the seal line 5 formed on the color filter upper substrate 3 is cured by ultraviolet rays, the two substrates are bonded to each other, and then the pressure and heat are applied to the sealing line. 5) is cured and bonded. The spacers 15 scattered on the array lower substrate 1 serve to maintain a constant cell gap when the two substrates are bonded to each other.

As shown in the drawing, when the array lower substrate 1 and the color filter upper substrate 3 are bonded to each other to complete a cell, as shown in FIG. 2B, a scribe line (crack: to form a crack). That is, when a scribe line is formed in the region to be cut, it appears in the form of a crack on the substrate. The crack formed on the lower substrate 1 of the array corresponds to a panel edge region of the liquid crystal display.

Then, as shown in FIG. 2C, the bottom of the array is applied by applying an impact using a brake bar 20 on the color filter upper substrate 3 facing the array lower substrate 1 on which cracks are formed. The cutting is performed by transmitting a uniform impact force on the scribe line of the substrate 1.

The brake bar 20 has a cutting portion made of urethane rubber on one side of the support portion, and the edge of the cutting portion in contact with the substrate is formed in a sharp model so that a strong impact force can be applied only to an area where the scribe line is formed. .

When the color filter upper substrate 3 facing the scribe line formed on the array lower substrate 1 is momentarily impacted by the brake bar 20, the array lower substrate 1 is cut along the scribe line. do.

As described above, when the array lower substrate 1 is cut, a scribing process is performed on the color filter upper substrate 3. As shown in FIG. 2D, a scribe line is formed on the color filter upper substrate, and the scribe line of the color filter upper substrate runs about the active region.

That is, since the scribing process is performed along the entire panel size of the liquid crystal display device, the array lower substrate 1 may be cut to a portion including an active layer, a data pad, and a gate pad region by cutting. The color filter upper substrate 3 is formed with scribe lines such that only the active region where the color filter layer is formed is included.

When a scribe line is formed on the color filter upper substrate 3, as shown in FIG. 2E, the cell in which the array lower substrate 1 and the color filter upper substrate 3 are bonded are turned upside down. The substrate 1 is placed upward, and the color filter upper substrate 3 is positioned so as to be in contact with a sustable (not shown).

Then, the array lower substrate 1 facing the scribe line formed on the color filter upper substrate 3 is momentarily impacted using the brake bar 20. The color filter upper substrate 3 in which the crack is formed by the impact of the brake bar 20 is cut.

As shown in FIG. 2F, when the array lower substrate and the color filter upper substrate are cut, only one panel is completed. Since the edge of the substrate is a cutting surface of the organic substrate, it is very sharp, so that the sharp part is sharpened through the grinding process. Proceed with the process.

As described above, when the scribe line forming region formed on the array lower substrate and the color filter upper substrate is separated from the cell after the cutting process is completed, one liquid crystal panel including the array substrate 11 and the color filter substrate 13 is completed. .

The size of the color filter substrate 13 is cut smaller than the size of the array substrate 11 because the color filter substrate 13 includes an active region, a gate pad, and a data pad open region. When the cell is cut and the panel is formed as described above, the liquid crystal injection process is performed.

However, when the shock is applied to the color filter substrate or the array substrate by the direct brake bar as described above, there is a problem that damage to the organic substrate occurs.

In addition, when the brake bar is used, a uniform force should be instantaneously applied to the entire substrate. However, it is very difficult to balance the force, which may cause cutting defects of the substrate.

In addition, a strong impact by the break bar may cause damage to the data pad formed on the array substrate and the metal film formed on the gate pad, causing the pad open and the disconnection of the gate bus line and the data bus line.

In addition, the impact applied to the cell may cause damage to the seal line joining the color filter substrate and the array substrate, and may cause a gap defect between the substrates spaced at a predetermined distance.

When two substrates are bonded together, spacers are positioned between the substrates in order to maintain a cell gap. Since these spacers are separated from the scribe line or located at a small density, the impact force applied on the substrates is not accurately applied to the other substrate. It is cut at and causes chip defects.

In addition, the position where the brake bar impacts the glass substrate, that is, the brake position is generally high by 1 mm with respect to the scribe line. When a shock is applied to the glass substrate while the brake bar is out of the scribe line, the impact may be transmitted through a spacer disposed at a position away from the scribe line. For this reason, cut defects often occur, and glass fragments and glass fragments are generated in a subsequent manufacturing process, and the yield is reduced.

Furthermore, in the liquid crystal display device, the array substrate is often arranged with a plurality of drive circuits in the peripheral area, and in particular, many wiring patterns are arranged in the peripheral part of the scribe line. When such a spacer is arranged on the wiring pattern, the height of the spacer is higher by the film thickness of the wiring pattern than the spacer arranged on the glass substrate.

For this reason, the impact applied by the brake bar is concentrated on the spacer on the wiring pattern without being uniformly transmitted to all the spacers. As a result, there is a possibility that a cut defect may occur, and a wiring pattern may be destroyed by an applied shock, which causes a decrease in yield.

According to the present invention, when cutting a cell in which a color filter upper substrate and an array lower substrate on which a plurality of active layers are formed are bonded, the impact force is not directly applied to the substrate, thereby preventing the data or gate pads from being opened during the cutting process. It is an object of the present invention to provide a liquid crystal display device and a method of manufacturing the same, which can prevent seal burst and cell gap defect.

In order to achieve the above object, the liquid crystal display device manufacturing method according to the present invention,

Applying and etching a metal film, a gate double insulating film, an amorphous silicon, a doped amorphous silicon, and a metal film, respectively, on the transparent substrate in order to form a TFT, a gate bus line, and a data bus line;

Applying a protective film to a cell gap thickness on the insulating substrate on which the TFT is formed;

Forming a via hole, a post for protecting the cell gap, and a protective layer in the TFT, the gate pad, and the data pad by using a halftone mask on the insulating substrate coated with the protective film; And

And forming a pixel electrode by applying and etching an ITO metal on the insulating substrate on which the post is formed.

Here, the post is formed in an area where the gate bus line and the data bus line cross in an active area where the TFT is formed, and an area where a scribe line to be formed in a cell cutting process is to be formed, and the ratio of the halftone mask The exposure area is the post formation area, the complete exposure area is the via hole formation area, and the predetermined amount exposure area is a protective layer formation area.

In addition, the posts formed on the lower substrate of the array may be formed in two or more rows in the region where the scribe line is to be formed to form the posts densely per unit area.

According to another embodiment of the present invention,

Forming a cell by bonding an array lower substrate having a post and a color filter upper substrate having a seal line when forming a protective film; Forming a scribe line on the array lower substrate to cut the cell to form a panel;

Aligning an air jet on the upper portion of the color filter upper substrate to cut the array lower substrate on which the scribe line is formed, and then cutting the scribe line of the array lower substrate by instantaneous air injection; And

Forming a scribe line on the color filter upper substrate, aligning the air jet on the upper surface of the array lower substrate, and cutting the scribe line of the color filter upper substrate by instantaneous air injection; It features.

Here, a post located in an area corresponding to the scribe line formed for cutting the cell transfers the air pressure sprayed on the substrate by the air jet to the opposite substrate, and adjusts the nozzle portion of the air jet to adjust the air pressure. It is characterized in that the range to be delivered on the substrate can be adjusted.

And the nozzle portion of the air jet for applying the air pressure for the cell cutting is characterized in that spaced apart from the substrate.

According to another embodiment of the present invention,

A color filter substrate composed of a black matrix and R, G, B color filter layers;

An array substrate facing the color filter substrate and composed of a switching element TFT, a gate bus line, a data bus line and a pixel electrode;

A liquid crystal layer interposed between the color filter substrate and the array substrate; And

And a post interposed between the color filter substrate and the array substrate and disposed in a region in which a scribe line forming region for cell cutting and an area where a gate bus line and a data bus line of the array substrate intersect.

Here, in the scribe line formation region for cell cutting, the post is characterized in that the ratio disposed per unit area is higher than the ratio of the post disposed in the region where the gate bus line and the data bus line intersect.

According to the present invention, when cutting a cell in which an array lower substrate and a color filter upper substrate are joined, cutting is performed by using a high-pressure gas injection method, thereby preventing direct contact with the substrate and preventing defects such as breakage of the substrate and seal burst. There is an advantage to this.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3A to 3C are schematic views illustrating a manufacturing process of an array substrate according to the present invention.

As shown in FIG. 3A, a metal film is coated on the transparent substrate 30 (array lower substrate) and etched to form a gate bus line and a gate electrode 31. Gate double insulating layers 32a and 32b are sequentially coated on the insulating substrate 30 on which the gate bus lines and the gate electrodes 31 are formed.

Then, as shown in Figure 3b, amorphous silicon is applied and etched to form a channel layer 33. Doped amorphous silicon is coated on the insulating substrate 30 on which the channel layer 33 is formed, and then etched to form an ohmic contact layer 34. A metal film is coated on the insulating substrate 30 on which the ohmic contact layer 34 is formed, and then etched to form source / drain electrodes 35a and 35b to complete a thin film transistor (TFT).

Then, a thick protective film 37 is formed on the insulating substrate 30 on which the TFT is formed, the thickness of which is capable of supporting a cell gap. That is, when the array lower substrate and the color filter upper substrate are bonded together, a protective film 37 corresponding to a thickness that can be supported by acting as a spacer is applied onto the insulating substrate 30.

As shown in FIG. 3C, a gate bus line of an active region in which a TFT is formed using a halftone mask during gate pad opening, data pad opening, and via hole formation on the insulating substrate 30 to which the protective film 37 is applied is formed. And a post (38) made of a protective film 37 are formed in the region where the scribe line is to be formed in the cross region and the scribe process.

The post 38 formed in the active region serves as a spacer which is dispersed to maintain a constant cell gap, and the post 38 formed in the region where the scribe line is to be formed has a force caused by air pressure in the cutting process. It is to ensure accurate delivery to the substrate.

Although not shown in the drawing, the halftone mask pattern used to form the via hole in the passivation layer 37 is a mask divided into a complete exposure area, a non-exposure area, and a predetermined amount of exposure area.

Accordingly, the complete exposure region is a region in which the pixel electrode 39 is contacted or a via hole forming region for opening the gate pad and the data pad, and the non-exposed region is formed by the intersection of the gate bus line and the data bus line of the active region of the array substrate. After the exposure, the applied protective film 37 is a scribe line forming region, and then a post 38 is formed. In addition, a certain amount of exposure area is formed with a protective film that can serve as a protective layer of the entire array substrate.

Therefore, the non-exposed areas are areas where gate bus lines and data bus lines intersect in the active layer of the insulating substrate (array lower substrate 30), and areas where scribe lines formed on the color filter substrate and the array substrate are to be formed.

In the manufacturing process of the liquid crystal display device formed by the above process, when the array lower substrate and the color filter upper substrate are bonded together, the spacer scattering process scattered on the lower substrate of the array may be omitted, and the spacer struts in the scribe line region may be omitted. By forming the post), the force transmitted in the cutting process can be easily transmitted on the other side of the substrate on which the scribe line is formed.

4 is a plan view illustrating a scribe line formed in units of panels of cells to which upper and lower substrates of the liquid crystal display according to the present invention are bonded.

As shown in FIG. 4, as shown in FIG. 3, an array lower substrate and a color filter upper substrate having posts of a protective film are bonded to each other by a seal line to show one cell.

For convenience of description, a liquid crystal cell structure having two liquid crystal display panels will be described.

Two color filter layers (active regions) are formed on the color filter upper substrate 43, and seal lines are formed on each active region, and are firmly bonded to the array lower substrate 41. Although not clearly shown in the drawing, a TFT active layer is formed on the array lower substrate 41 so as to face two active regions of the color filter upper substrate 43.

In addition, spacers are not dispersed in the lower substrate of the array, and posts are formed by applying a halftone pattern method in a via hole formation process after applying a protective film. In addition, the post is formed not only on the active region but also on the array lower substrate 41 in the region corresponding to the scribe lines 47a, 47b, 48a, and 48b to be formed in the cell cutting process (not shown).

Therefore, when the array lower substrate 41 and the color filter upper substrate 43 are completed, the two substrates are bonded to each other and a single panel is manufactured through a cutting process.

In this case, the scribe lines 47a, 47b, 48a, and 48b are formed to cut the cells in which the array lower substrate 41 and the color filter upper substrate 43 are bonded to each other. It means to form a crack on the cell by using.

The area where the scribe lines 47a, 47b, 48a, and 48b are formed to cut the cell is formed on the array lower substrate 41 and the color filter upper substrate 43 based on the size of the panel and the active layer. It is formed to be parallel to the gate bus line and the data bus line.

Therefore, the first scribe line 48a parallel to the gate bus line and the first scribe line 47a parallel to the data bus line formed on the lower substrate of the array are formed in a rectangular shape along the panel size of the liquid crystal display. That is, a second scribe line 48b parallel to the gate bus line formed on the color filter upper substrate 43 and a second scribe parallel to the data bus line but having a circumference of a size including the data pad and the gate pad area. Line 47b is formed around the active layer formed of the color filter layer.

That is, as shown in the figure, on the array lower substrate 41, first scribe lines 48a parallel to the gate bus lines are formed on the left and right edges of the panel along the panel size, and parallel to the data bus lines. Two first scribe lines 47a are formed, respectively.

The scribe lines 47b and 48b formed on the color filter upper substrate 43 have the same number as the scribe lines 47a and 48a formed on the array lower substrate 41, but the array lower substrate In the data pad and gate pad open region of 41, scribe lines 47a and 48a are formed along the active region.

Therefore, the scribe line region formed on the array lower substrate 41 is larger than the scribe line formed on the color filter upper substrate 43 by the data pad and the gate pad region.

When the array lower substrate 41 and the color filter upper substrate 43 are bonded to each other to form a cell, the upper surface of the color filter upper substrate 43 is formed by cutting and forming a scribe line on the array lower substrate 41. Cell cutting proceeds in the order of forming and cutting scribe lines.

5 is an enlarged cross-sectional view of region X of FIG. 4.

As shown in FIG. 5, in the region X of FIG. 4, a first scribe line 47a is formed on the array lower substrate in parallel with the data bus line, and the data bus is formed along the active region on the color filter upper substrate. A second scribe line 47b parallel to the line is formed.

On the lower substrate of the array, a post 38 for maintaining the cell gap is formed in the via hole forming process after the protective film is applied, and a post 38 is also formed in the scribe line forming region.

Therefore, when a strong air pressure by an air jet is applied when the cells are formed by joining the substrates together with the scribe lines, the force is applied to the other substrate on which the scribe lines are formed along the post 38. This is easily delivered.

Therefore, when the air pressure applied by the air jet is transferred to the substrate, it is transferred to the substrate with the scribe line formed through the posts 38 located between the cell gaps so as to be cut cleanly.

In addition, although the posts are formed in a line to face the scribe lines 47a and 47b in the drawing, the posts may be formed to form a double structure or a plurality of rows in some cases. Then, the force applied to the scribe line is balanced and transmitted to the other substrate with a balanced force, thereby reducing the impact on the substrate.

6A to 6F are cross-sectional views illustrating a process of cutting a cell in which a scribe line is formed according to the present invention.

As shown in FIG. 6A, when the array lower substrate 41 having the posts 38 formed in the active region and the scribe line forming region is completed, a seal line is formed on the color filter upper substrate 43 without a spacer scattering process. After forming, the two substrates are aligned and then bonded to form a liquid crystal display cell.

The seal line 45 formed on the color filter upper substrate 43 is formed along the circumference of the active region, and after bonding, the seal lines 45 are irradiated with a constant pressure, heat, and ultraviolet rays to cure the seal lines 45 to form two substrates. Stick together.

As shown in the figure, the posts 38 serve as spacers for maintaining the cell gap of the two substrates, and a scribe line including an inlet region of the seal line 45 into which liquid crystal is injected outside the active region. Located in the formation region to prevent chips to be generated during the cell cutting process to enter into the seal line (45).

In addition, since posts are formed in the scribe line forming region, the force generated at the strong air pressure applied during cell cutting can be transferred to the other substrate.

6B, first, a scribe line is formed on the array lower substrate 41, and then moved to a sustable for cutting operation in a process, although not shown in the drawing, in which the scribe line is formed. The array lower substrate 41 is seated in contact with the sustable surface.

In addition, since a scribe line formed in the array lower substrate 41, that is, a crack, is formed along the size of one liquid crystal display panel, the scribe line includes an active region, a data pad, and a gate pad region.

As shown in FIG. 6C, the cell fixed to the sustable for cutting the cell is an air jet 60 composed of a support part and a nozzle part on the color filter upper substrate 43 facing the array lower substrate 41. Is aligned to face the scribe line formed on the array lower substrate 41.

Then, gas is instantaneously injected from the tank in which the gas of high pressure is stored to apply a strong gas pressure onto the color filter upper substrate 43, and the injected air pressure is located between the cell gaps along the screed through the substrate. Delivered to the posts.

The air pressure transmitted to the post 38 is transmitted to the scribe line of the array lower substrate 41 to be cut.

The air jet 60 used for cell cutting is spaced apart from the color filter upper substrate 43 by a predetermined distance so that only high pressure gas pressure is transferred to the substrate to prevent substrate damage generated during cell cutting.

In addition, since the air jet method by the air jet 60 is transmitted to a predetermined area along the portion opposite to the scribe line, it is possible to reduce the force transmission error than when transmitting the impact force to the corner portion of the conventional brake bar. have.

In other words, when the brake bar is used in the related art, it is often impossible to apply an impact accurately so as to be integrated with the scribe line. In this case, a force is applied only to a substrate in another area, which causes cutting defects. The wider width can prevent chip generation due to cutting.

Since the force applied for the cell cutting is a gas or air pressure injected from the high pressure tank, it is possible to prevent the glass substrate from being damaged and to prevent the data pad and the gate pad from being opened.

And, although not clearly shown in the drawings, by adjusting the nozzle portion (63 in FIG. 7) of the air jet 60 can adjust the air pressure to be injected, it is possible to adjust the range to which the air pressure is applied.                     

As described above, when the array lower substrate 41 is cut, a scribing process is performed on the color filter substrate 43. As shown in FIG. 6D, when the scribe line of the array lower substrate 41 is cut, a scribe line is formed on the color filter upper substrate 43 by the following process, and the scribe line of the color filter upper substrate 43 is formed. Proceeds around the active layer area.

That is, since the scribe line is formed along the entire panel size of the array lower substrate 41, the array lower substrate 41 includes an active layer, a data pad, and a gate pad region. A scribe line is formed on the color filter upper substrate 43 to include only the active region where the color filter layer is formed.

When a scribe line is formed on the color filter upper substrate 43, as shown in FIG. 6E, the cell in which the array lower substrate 41 and the color filter upper substrate 43 are bonded are turned upside down, and then The sus table and the color filter upper substrate 43 are fixed to be in contact with each other.

Then, as in the case of cutting the array lower substrate 41, the air jet is positioned on the array lower substrate 41, and then aligned with the scribe line formed on the color filter upper substrate 43. . The nozzle portion (63 in FIG. 7) of the air jet 60 is positioned at a predetermined distance from the array lower substrate 41 opposite to the scribe line on the color filter upper substrate 43, and is a high pressure gas tank. Air pressure is applied to the array lower substrate 41 by the instant injection method.                     

When air pressure is applied to the array lower substrate 41, a force is transmitted to a post 38 formed along the scribe line, and the force is transmitted to the color filter upper substrate 43 on which the scribe line is formed. Passed in and cut.

As shown in FIG. 6F, when the array lower substrate and the color filter upper substrate are cut, only one panel is completed. Since the edge of the cut substrate is a cut surface of the glass substrate, a sharp process is performed through a grinding process. do.

The cut panel has a structure in which the array substrate 51 and the color filter substrate 53 are bonded to each other, and the array substrate 51 is larger than the color filter substrate because the data pad and the gate pad region exist. As such, when the panel is completed by the cell cutting process, the process moves to the liquid crystal injection process to inject the liquid crystal into the panel.

7 is a view showing the structure of an air jet used for cell cutting in the present invention.

As shown in FIG. 7, the air jet 60 is connected to the high pressure gas tank to inject gas or air pressure with a strong force, and is connected to the support of the air jet 60. The support part 61 is provided with a nozzle part so that the strong gas flow introduced into the support part can narrow the outlet of the nozzle part 63 so as to disperse the stronger gas pressure to the outside.

The nozzle portion 63 is an area in which air is injected, and the air pressure injected after being spaced apart from the substrate by a predetermined distance is transmitted to the substrate to apply a force.

However, various types of air jets capable of transferring air pressure on the substrate using air pressure as well as being formed in a constant model as shown in the drawing can be used.

As described in detail above, the present invention arranges a post formed of a protective film in an active region and a scribe line region in manufacturing an array substrate of a liquid crystal display device, and then adheres the substrate without a spacer scattering process, and then cuts the cell. There is an effect that the clean cut is made without damaging the substrate in the process.

In addition, when the cell is cut, the panel is manufactured by a strong air blowing method, thereby preventing damage to the substrate, data pad opening, seal burst, and cell gap defect that may occur in the cutty operation.

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

Claims (10)

Applying and etching a metal film, a gate double insulating film, an amorphous silicon, a doped amorphous silicon, and a metal film, respectively, on the transparent substrate in order to form a TFT, a gate bus line, and a data bus line; Applying a protective film to a cell gap thickness on the insulating substrate on which the TFT is formed; Forming a via hole, a post for protecting the cell gap, and a protective layer in the TFT, the gate pad, and the data pad by using a halftone mask on the insulating substrate coated with the protective film; Forming a pixel electrode by coating and etching an ITO metal on the insulating substrate on which the post is formed. The method of claim 1, The post may be formed in a region where the gate bus line and a data bus line cross in an active region where the TFT is formed, and a region where a scribe line to be formed in a cell cutting process is to be formed. . The method of claim 1, The non-exposed area of the halftone mask is the post formation area, the complete exposure area is the via hole formation area, and the predetermined amount exposure area is the protective layer formation area. The method of claim 1, And the posts are formed in two or more rows in a region where a scribe line is to be formed to form posts densely per unit area. Forming a cell by bonding an array lower substrate having a post and a color filter upper substrate having a seal line when forming a protective film; Forming a scribe line on the array lower substrate to cut the cell to form a panel; Aligning an air jet on the upper portion of the color filter upper substrate to cut the array lower substrate on which the scribe line is formed, and then cutting the scribe line of the array lower substrate by instantaneous air injection; And Forming a scribe line on the color filter upper substrate, aligning the air jet on the upper surface of the array lower substrate, and cutting the scribe line of the color filter upper substrate by instantaneous air injection; Characterized in that the liquid crystal display device manufacturing method. The method of claim 5, wherein A post is positioned in a region corresponding to the scribe line of the lower substrate of the array, and the air pressure injected from the air jet is transferred to the substrate facing the post. The method of claim 5, wherein And a range in which air pressure is transmitted to the substrate by adjusting the nozzle part of the air jet. The method of claim 5, wherein And a nozzle portion of the air jet is spaced apart from the substrate. A color filter substrate composed of a black matrix and R, G, B color filter layers; An array substrate facing the color filter substrate and composed of a switching element TFT, a gate bus line, a data bus line and a pixel electrode; A liquid crystal layer interposed between the color filter substrate and the array substrate; And A liquid interposed between the color filter substrate and the array substrate, the post including a scribe line forming region for cell cutting and a post disposed in an area where the gate bus line and the data bus line of the array substrate cross each other; Display device. The method of claim 9, And wherein the posts have a higher ratio per unit area in the scribe line formation area for cell cutting than a ratio of posts disposed in an area where the gate bus line and the data bus line cross each other.

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