KR100843439B1 - A elastic heat spreader and electro-magnetic apparatus having sameof - Google Patents

Abstract

The present invention provides an elastic heat dissipation unit capable of preventing the bending of the PCB and the detachment of the mounting parts by having an elasticity in the heat dissipation portion that contacts the PCB or the mounting component mounted on the PCB to release heat from the mounting component to the outside and An electronic device having the same.

The present invention relates to a chassis having a printed circuit board having a mounting component and a heat dissipation unit formed in a cover formed of a thermally conductive material to protect the mounting component of the printed circuit board by combining with the chassis and being formed of a thermally conductive material. It has one end connected to one surface of the cover, formed on the opposite side of the one end and having the other end toward the printed circuit board, connecting at least two or more inclined surfaces separated from each other, and each other end of the inclined surface, the thermally conductive material It includes a contact surface formed with.

Heat Spreader, Heat Sink, Tuner

Description

Elastic heat dissipation unit and electronic device having the same {A ELASTIC HEAT SPREADER AND ELECTRO-MAGNETIC APPARATUS HAVING SAMEOF}

1 is an exploded perspective view of a conventional tuner.

2 is a rear view and a longitudinal sectional view of a cover employed in a conventional tuner.

3 (a) and 3 (b) are cross-sectional views illustrating a contact state between a heat sink and a PCB or a mounting component employed in a conventional tuner.

4 is an exploded perspective view of the electronic device of the present invention.

5 is a rear view of the cover employed in the present invention.

Figure 6 (a) and (b) is a rear view showing another embodiment of the elastic heat dissipation unit located in the cover employed in the present invention.

7 (a) and 7 (b) are cross-sectional views illustrating a contact state between an elastic heat dissipation unit and a PCB or a mounting component employed in the electronic device of the present invention.

<Detailed description of the major symbols in the drawings>

100 ... electronics 110 ... PCB

111 Mounting parts 120 Chassis

130 ... cover 131 ... heat sink

131a ... slope 131b ... slit

131c ... contact surface 131d ... through

The present invention relates to an elastic heat dissipation unit and an electronic device having the same. More particularly, the present invention relates to a flexible heat dissipation unit, and more specifically, to a flexible heat dissipation unit that contacts with a PCB or a mounting component mounted on the PCB so as to have elasticity in a heat dissipation unit that radiates heat from the mounting component to the outside. The present invention relates to an elastic heat dissipation unit and an electronic device having the same, which can prevent and prevent detachment of mounting components.

In general, an electronic device such as a TV or a set-top box includes a receiver for receiving a broadcast, and a tuner for selecting a broadcast is used for the receiver.

The tuner is a device that selectively receives a signal of a desired channel and converts it into a frequency signal required for viewing according to a user's selection among signals transmitted from the broadcasting station.

1 is an exploded perspective view showing a conventional tuner.

Referring to FIG. 1, a tuner fixes a printed circuit board (PCB) 10 and a PCB 10 mounted with mounting components 11 including ICs, capacitors, and resistors. The chassis 20 and the cover 30 is assembled to the mounting surface of the PCB 10 of the chassis 20 to protect the PCB 10 fixed to the chassis 20.

The cover 30 includes a heat dissipation plate 31 for easily dissipating heat generated during operation of the mounting component 11 to the outside to prevent component damage due to overheating.

2 is a rear view and a longitudinal sectional view of a cover employed in a conventional tuner.

Referring to FIG. 2, the heat sink 31 is formed on one surface of the cover 30 and has a stepped surface 31b formed in a step shape toward the PCB 10 and a contact surface in contact with the heat generating portion of the PCB 10. 31a).

3 (a) and 3 (b) are cross-sectional views illustrating a contact state between a heat sink and a PCB or a mounting component employed in a conventional tuner.

Referring to FIGS. 3A and 3B, the contact surface 31a of the heat sink 31 is in contact with the mounting part 11 or the opposite surface of the mounting part 11 mounted on the PCB 10. The heat generated during operation from (11) is released.

At this time, while the load F is applied vertically to the contact portion of the PCB 10 or the contact portion of the mounting component 11 in contact with the contact surface 31a, the bending deformation may occur in the solid-line type PCB 10 in a dotted line shape. have.

In this case, a crack may occur between the PCB 10 and the mounting component 11, and thus, the mounting component 11 may not perform a unique electrical operation.

Accordingly, a problem arises in that the height H of the heat sink 31 must be strictly managed, which increases the manufacturing cost by processing the heat sink 31 with high precision.

In order to solve the above problems, an object of the present invention is to prevent the bending of the PCB and the detachment of the mounting part by making the elastic part in contact with the PCB or the mounting component mounted on the PCB to radiate heat from the mounting component to the outside The present invention relates to an elastic heat dissipating unit and an electronic device having the same, which can prevent the manufacturing cost and reduce manufacturing costs according to the dimension management of the height of the heat dissipating unit.

In order to achieve the above object, the elastic heat dissipation portion of the present invention is formed on a cover formed of a thermally conductive material and protect the mounting parts of the printed circuit board by combining with the chassis and the chassis having a printed circuit board having a mounting component At least two inclined surfaces formed of a thermally conductive material and having one end connected to one surface of the cover, the other end formed opposite to the one end to the printed circuit board, and separated from each other; The other end of the inclined surface is connected, characterized in that it comprises a contact surface formed of a thermally conductive material.

According to an embodiment of the present invention, the heating element may be a mounting component of the printed circuit board, and according to another embodiment of the present invention, the heating element may be an opposite surface to a surface on which the mounting component of the printed circuit board is mounted. have.

According to one embodiment of the invention, the elastic heat dissipating portion may have three inclined surfaces inclined toward the printed circuit board, the elastic heat dissipating portion, in accordance with another embodiment of the present invention, the inclined surface is inclined spirally Can be.

According to an embodiment of the present invention, one end of the inclined surface may be integrated with the cover, and the contact surface may be integrated with the other end of the inclined surface.

In addition, according to one embodiment of the present invention, the contact surface may have a through hole formed at the center thereof.

An electronic device having an elastic heat dissipation unit according to an embodiment of the present invention includes a printed circuit board having a surface on which mounting components are mounted, a chassis in which the printed circuit board is embedded, and a combination with the chassis to protect mounting components of the printed circuit board. At least two inclined surfaces each having a cover formed of a thermally conductive material, and having one end connected to one surface of the cover, and having the other end opposite to the one end and facing the printed circuit board, each formed of a thermally conductive material and separated from each other And a contact surface formed between the other ends of the inclined surface, the contact surface formed of a thermally conductive material, and having an elastic heat dissipation portion for dissipating heat from the heating element through the contact surface.

According to an embodiment of the present invention, the mounting component may be a mounting component for a tuner that receives a broadcast signal from the outside and selects a channel, and accordingly, the electronic device may be a tuner.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

4 is an exploded perspective view of the electronic device of the present invention.

Referring to FIG. 4, the electronic device 100 of the present invention includes a printed circuit board 110, a chassis 120, and a cover 130.

The printed circuit board 110 mounts at least one mounting component 111 on an upper surface or a lower surface.

Chassis 120 is composed of an outer chassis 121 and the inner chassis 122, the outer chassis 121 is fixed to the printed circuit board 110, the inner chassis 122 is divided into a predetermined zone to print The mounting component 111 mounted on the circuit board 110 is electromagnetically shielded.

In addition, the chassis 120 may further include connectors 123 and 124 electrically connected to the printed circuit board 110 to transmit and receive signals.

The cover 130 surrounds the front surface of the printed circuit board 110 mounted on one surface of the chassis 120 and is coupled to a portion of the chassis 120 to protect the printed circuit board 110 from external impact.

An elastic heat dissipation part 131 for dissipating heat generated from the printed circuit board 110 is formed on one surface of the cover 130.

The cover 130 may be formed of a thermally conductive material, and preferably, may be formed of a metal having excellent thermal conductivity.

5 is a rear view of the cover employed in the present invention.

Referring to FIG. 5, the cover 130 employed in the electronic device 100 of the present invention includes an elastic heat dissipation unit 131 on one surface.

The elastic heat dissipation part 131 includes an inclined surface 131a facing the printed circuit board. The inclined surface 131a may be formed in at least two, and when the inclined surface is two, it may be preferably formed to face each other. This may allow the contact surface 131c to stably contact the heating element. In addition, the inclined surface 131a may be utilized as a transmission path capable of transferring heat from the contact surface 131c to the entire cover. Thereby, heat from the heat generating body which contacts the contact surface 131c can be easily discharged.

In addition, the inclined surface 131a may be assembled to the cover 130 through bolts or screws, and may be preferably integrally formed on the cover 130, and may further include the inclined surface 131a and the contact surface 131c. ) May be integrated into one thermally conductive material.

In addition, the elastic heat dissipation unit 131 of the present invention may be formed in plural on one surface of the cover 130 corresponding to the number of the heating elements.

The slits 131b, which are open regions, are formed between the inclined surfaces 131a. The slit 131b provides a space in which the inclined surface 131a can move according to the height of the heating element so that the elastic heat dissipating part 131 of the present invention can have elasticity.

Each end of the inclined surface 131a facing each other is connected to each other to form a contact surface 131c.

The contact surface 131c is in contact with the heating element and emits heat from the heating element to the outside. If the inclined surface 131a is formed in two, the contact surface 131c may be formed in a rectangle or a square, in order to facilitate connection with the inclined surface 131a.

A through hole 131d may be formed at the center of the contact surface 131c to more easily discharge heat from the heating element.

The heating element may be one surface of the printed circuit board 110 or the mounting component 111 of the printed circuit board 110.

6 (a) and 6 (b) are rear views showing other embodiments of a heat dissipation unit located in a cover employed in the present invention.

Referring to FIG. 6A, the elastic heat dissipation part 131 of the present invention may have three inclined surfaces 131a. The set of three inclined surfaces 131a may provide more transmission paths for transferring heat from the contact surface 131c to the entire cover 130. As a result, heat from the heating element in contact with the contact surface 131c can be more easily released.

Slits 131b are formed between each of the three inclined surfaces 131a to form a space in which the three inclined surfaces 131a can move according to the height of the heating element.

The contact surface 131c may be formed in a rectangle or a square to facilitate connecting the three inclined surfaces 131a, respectively.

Although not shown, the elastic heat dissipation portion 131 of the present invention may have four inclined surfaces, which may provide more and more transfer paths capable of transferring heat from the contact surface 131c to the entire cover 130. Can be. As a result, heat from the heating element in contact with the contact surface 131c can be more easily released.

Referring to FIG. 6B, the elastic heat dissipation unit 131 of the present invention may have three inclined surfaces 131a, and the three inclined surfaces 131a may be spirally formed toward the printed circuit board. . The slits 131b formed between the three inclined surfaces 131a may provide a space in which the inclined surfaces 131a can move, and thus the elastic heat dissipating unit 131 of the present invention may be more easily according to the height of the heating element. It can be modified. This relieves the load concentrated on the printed circuit board at the time of assembly of the cover 130 to reduce the probability of cracking between the printed circuit board 110 and the mounting component 111 mounted on the printed circuit board. Can be significantly reduced.

The contact surface 131c may be preferably formed in a circular or elliptical shape in order to easily connect the three inclined surfaces 131a, respectively.

7A and 7B are cross-sectional views illustrating a contact state between a heat dissipation unit and a PCB or a mounting component employed in the electronic device of the present invention.

Referring to FIG. 7A, the contact surface 131c of the elastic radiator 131 of the present invention contacts the heating element to transfer heat from the heating element to the entire cover 130 through the inclined surface 131a. Heat dissipation

The heating element may be a printed circuit board 110, and more preferably, may be an opposite surface to a surface on which the mounting component 111 that generates heat during operation is mounted.

Referring to FIG. 7B, the contact surface 131c of the elastic radiator 131 of the present invention contacts the heating element to transfer heat from the heating element to the entire cover 130 through the inclined surface 131a. In this case, the heating element may be a mounting component 111 mounted on the printed circuit board 110. Preferably, the contact surface 131c may be in contact with the top surface of the mounting component 111 to transfer heat generated during operation of the mounting component 111 to the entire cover 130 through the inclined surface 131a to radiate heat.

Referring to FIGS. 7A and 7B, it can be seen that the heating elements contacting the contact surfaces of the elastic radiator 131 of the present invention are different. That is, the heating element may be a printed circuit board 110 or a mounting component 111 mounted on the printed circuit board 110, and each heating element has a different height.

Accordingly, a load may be applied to the heating element through the heat dissipation part 131 when the cover 130 is assembled to the chassis 120, but as can be seen with reference to FIGS. 7A and 7B, the heating element As a result, the inclined surface 131a is deformed to have elasticity.

That is, the slits 131b formed between the inclined surfaces 131a provide a space in which the inclined surfaces 131a can be deformed, and thus the inclined surfaces 131a deform the load formed when the contact surface 131c contacts the heating element during assembly. Thus, the height H from the contact surface 131c to the cover 130 is deformed to relieve the load.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, but is defined by the following claims, and the configuration of the present invention may be modified in various ways without departing from the spirit of the present invention. It will be apparent to those skilled in the art that modifications and variations are possible in the art.

As described above, according to the present invention, by contacting with the PCB or the mounting component mounted on the PCB to have elasticity in the heat dissipation portion that radiates heat from the mounting component to the outside, it is possible to prevent the bending of the PCB and the detachment of the mounting component. And, there is an effect that can reduce the manufacturing cost according to the dimension management for the height of the heat radiating portion.

Claims (17)

In the chassis having a printed circuit board having a mounting component and the heat dissipation unit is formed on a cover formed of a thermally conductive material to protect the mounting component of the printed circuit board in combination with the chassis, At least one formed of a thermally conductive material and having one end connected to one surface of the cover, the other end formed opposite to the one end and having the other end facing the printed circuit board, separated from each other and spirally inclined toward the printed circuit board. incline; And Connecting the other ends of the inclined surface, including a contact surface formed of a thermally conductive material An elastic heat dissipation unit characterized in that the heat is emitted from the heating element in contact with the heating element through the contact surface. The method of claim 1, The heating element is an elastic heat dissipation unit, characterized in that the mounting component of the printed circuit board. The method of claim 1, The heating element is an elastic heat dissipation unit, characterized in that the opposite side of the surface on which the mounting component of the printed circuit board is mounted. delete delete The method of claim 1, One end of the inclined surface is an elastic heat dissipation unit, characterized in that integrated with the cover. The method of claim 1, And the contact surface is integrated with the other end of the inclined surface. The method of claim 1, And the contact surface has a through hole formed in the center thereof. A printed circuit board having a surface on which mounting components are mounted; A chassis incorporating the printed circuit board; A cover formed by a heat conductive material in combination with the chassis to protect the mounting component of the printed circuit board; And At least one end having one end connected to one surface of the cover, the other end formed on the one end opposite to the printed circuit board, formed of a thermally conductive material, and separated from each other and spirally inclined toward the printed circuit board. An insulated heat dissipation unit which connects an inclined surface with each other end of the inclined surface and includes a contact surface formed of a thermally conductive material, and dissipates heat from the heating element through the contact surface; Electronic device having an elastic heat dissipation unit, characterized in that it comprises a. The method of claim 9, The heating element is an electronic device having an elastic heat dissipation unit, characterized in that the mounting part of the printed circuit board. The method of claim 9, The heating element is an electronic device having an elastic heat dissipation unit, characterized in that the opposite side to the surface on which the mounting component of the printed circuit board is mounted. delete delete The method of claim 9, And one end of the inclined surface is integrated with the cover. The method of claim 9, And the contact surface is integrated with the other end of the inclined surface. The method of claim 9, And the contact surface has a through hole formed in the center thereof. The method of claim 9, The mounting component is a mounting component for a tuner that receives a broadcast signal from the outside and selects a channel. And the electronic device is a tuner for a broadcast receiver.

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