KR100838684B1 - Apparatus and method for bonding substrates - Google Patents

Abstract

The present invention provides a bonding method and a bonded substrate manufacturing apparatus that can improve the yield of the product, the upper substrate (W2) having a plurality of first marks (Au ~ Du), and each of the plurality of first marks The method of joining the lower substrate W1 having the plurality of second marks A _L to D _L for alignment is a process of acquiring the coordinate positions of the plurality of first marks and the coordinate positions of the plurality of second marks. And calculating a plurality of first deviation amounts CamnX and CamnY respectively representing positional deviation amounts of the plurality of second marks with respect to the plurality of first marks, and based on the plurality of first deviation amounts. And a step of joining both substrates at the joining position. The step of calculating the joining position calculates the amount of expansion and contraction deviation according to the expansion and contraction of the both substrates from the plurality of first deviation amounts, classifies the expansion and deviation amount into each of the plurality of first deviation amounts, and the plurality of second deviation amounts. (CalnX, CalnY) and calculating the correction amount for moving either one side of the said board | substrate to the bonding position with respect to the other side using a some 2nd deviation amount.

Coordinate position, bonded substrate, deviation amount, correction amount, array mark, glass substrate, yield

Description

Joining method and bonded substrate manufacturing apparatus {APPARATUS AND METHOD FOR BONDING SUBSTRATES}

The present invention relates to a bonding method of two substrates and a bonded substrate manufacturing apparatus, and more particularly to a method and apparatus for bonding two substrates used in a flat panel display (FPD) such as a liquid crystal display device. It is about.

The bonded substrate provided in the liquid crystal display device or the like has two glass substrates. Two glass substrates are arranged so as to face each other at very fine micrometer intervals, and liquid crystal is enclosed between both glass substrates. The glass substrate on one side is an array substrate (TFT), and a plurality of TFTs (thin film transistors) are formed in a matrix on the array substrate. The other glass substrate is a color filter substrate (CF), and color filters (red, green, blue) and a blocking film are formed on the CF substrate.

The bonded substrate is made of two glass substrates with a large enough area to make six sides of a 15-inch display connected to a computer. Each glass board | substrate is divided into six predetermined | prescribed zones (cells) which can be used as a display, respectively, and the electrode is formed in each cell. By joining two glass substrates, corresponding cells arranged at predetermined intervals on each glass substrate are bonded to each other.

A bonded substrate manufacturing apparatus (hereinafter referred to as a bonding apparatus) for manufacturing a bonded substrate includes a vacuum processing chamber for joining two substrates therein (see Patent Document 1). In the vacuum processing chamber, there is disposed a lower table supported for horizontal movement and horizontal rotation, and an upper table disposed so as to face the lower table so as to operate vertically. The lower glass substrate is placed on the lower table, and the upper glass substrate is adsorbed to the upper table. Then, the positions of the upper and lower glass substrates are optically aligned using four imaging apparatuses mounted on the lower table. A plurality of (four) array marks are stamped on the upper and lower glass substrates to adjust the positions.

As shown in FIG. 9, the array marks A _U , B _U , C _U , D _U are stamped on the upper glass substrate, and the array marks A _L , B _L , C _L , D _L are stamped on the lower glass substrate. . The black circle in FIG. 9 shows the center position of each array mark. The array marks A _U , B _U , C _U , and D _U are formed in a rectangular frame shape, and the array marks A _L , B _L , C _L , and D _L are formed in a rectangular shape. The control unit of the bonding apparatus obtains the coordinate value (center coordinate) of each array from the image data of each array mark picked up by the imaging device. The control unit obtains two virtual line segments A _U -B _U and C _U -D _U that connect diagonal array marks (A _U and B _U , C _U and D _U ) on the upper glass substrate. The average value of the angles of each of _U -B _U and C _U -D _U forming the X axis is calculated. This average value shows the inclination α of the upper glass substrate with respect to the X axis. Similarly, the control part calculates the inclination β of the lower glass substrate with respect to the X axis. And a control part calculates the inclination (DELTA) (theta) ((DELTA) (theta) = (beta)-(alpha)) of an upper glass substrate with respect to a lower glass substrate from the inclination of both glass substrates, and makes the calculation value the rotation correction angle.

Then, the controller is in the upper glass substrate, and calculates the coordinates of the center point of the second virtual line segment A _{U U} -B, C _U -D _U. The control unit also calculates the virtual line segment connecting the points between the two, and calculates the coordinate value of the substrate center of the virtual line segment. And the control unit rotates the lower table horizontally according to the rotation correction angle so that the inclination of the upper glass substrate with respect to the X axis coincides with that of the lower glass substrate. In addition, the control unit horizontally moves the lower table so that the centers of both glass substrates coincide with each other. In detail, the control unit calculates the position correction amount in the X-axis direction and the position correction amount in the Y-axis direction based on the difference between the center coordinate values of the two glass substrates and the rotational correction angle, so that the lower table is adjusted according to the respective position correction amounts. To move in the direction of

That is, as shown in FIG. 1, the center of the lower glass substrate is corrected from the coordinate point M _L1 to the left focal point M _U by the movement of the lower table which should be aligned with the center of the lower table. Therefore, when one or a plurality of cells are cut out from one glass substrate, the corresponding cells of the glass substrates overlap with each other with high accuracy as long as alignment can be made based on the center of the two glass substrates. This raises the finish accuracy of the product (display panel).

[Patent Document 1] Japanese Patent Application Laid-Open No. 2004-151325

However, the size of a display such as a display of a car navigation device, a display of a cellular phone, and the like is smaller than that of a computer display, and its screen area is about 7 inches and about 2.7 inches. Therefore, the number of division of a cell increases with respect to one glass substrate. If the conventional bonding method is used under these conditions, a deviation occurs when bonding the glass substrates. When the glass substrate is multi-divided and the FPD is manufactured, the cells do not coincide with each other. For the lower glass substrate (G1) a lower glass substrate on which, if the original, as by stretching, deformation of itself and the array garment mark (B _U) of the top side glass substrate (G2) position to hit in line as shown in FIG. 11 g (G1 Array mark BL does not match. Such deviations occur because the cells 21a and 21b which are to be installed so as to overlap do not overlap.

Fig. 12 shows the deviation amount of the array mark of the lower substrate G1 and the substrate center relative to the upper substrate G2 when the upper substrate G2 and the lower substrate G1 are aligned by the conventional method. Table showing vehicles. In the figure, "AVE" represents an average value, "MAX" represents a maximum value, "MIN" represents a minimum value, and "3sigma" represents a variance value (unit is micron), and "1", "2", and "3" in the figure. , "4" represents the array marks "A _U , A _L ", "B _U , B _L ", "C _U , C _L ", "D _U , D _L ", respectively, "X", "Y" Denotes the X-axis and Y-axis, respectively. For example, "1X" represents an amount of deviation in the X-axis direction between the array marks "A _U and A _L ," and "1Y" represents an amount of deviation in the Y-axis direction between the array marks A _U and A _L. "Cx" And "Cy" represent the amount of deviation in the X-axis direction and the amount of the deviation in the Y-axis direction of the central axes of both substrates G1 and G2, respectively, as shown in Fig. 12. The dispersion value of the deviation amount of the array mark is large, for example, the maximum value of the dispersion value of the deviation amount of the array mark is 2.9 in " 3Y. &Quot;

In the conventional method, when there is a deviation in the position of the array mark due to the deformation of the substrate, the center point of the glass substrate is calculated using the coordinate value including the deviation. Therefore, as shown in FIG. 13, a big difference arises in the alignment by the square array mark of each glass substrate. Therefore, with respect to the cell formed in the vicinity of the array mark having a large amount of deviation, the positional difference between the two glass substrates G1 and G2 bonded together becomes larger than specified and becomes a defective product. Therefore, there existed a problem that the yield with respect to the purchase of the FPD completed rather than a set of glass substrates worsens.

The present invention has been made to solve the above problems, and an object thereof is to provide a bonding method and a bonded substrate manufacturing apparatus capable of improving the yield of the product.

A first side of the present invention is a bonding method for joining an upper substrate having a plurality of first marks and a lower substrate having a plurality of first marks and a plurality of second marks each for positioning. The method includes a position acquiring step of acquiring coordinate positions of the plurality of first marks and coordinate positions of the plurality of second marks, and a position deviation amount of the plurality of second marks with respect to the plurality of first marks. A first deviation amount calculating step of calculating a plurality of first deviation amounts respectively; a joining position calculating step of calculating a joining position of the upper substrate and the lower substrate based on the plurality of first deviation amounts; And a joining step of joining the upper substrate and the lower substrate to each other at a joining position, wherein the joining position calculating step calculates the amount of expansion and deflection according to expansion and contraction of the upper substrate and the lower substrate from the plurality of first deviations. And a second deviation amount calculating step of classifying the stretch deviation amount into each of the plurality of first deviation amounts to calculate a plurality of second deviation amounts, and one side of the upper substrate and the lower substrate on the other side. For includes a correction amount calculation step for calculating a correction amount for moving to the bonding location using the plurality of the second deviation.

The second side of the present invention is a bonded substrate for manufacturing a bonded substrate by bonding an upper substrate having a plurality of first marks and a lower substrate having a plurality of second marks for aligning positions with the plurality of first marks, respectively. It is a manufacturing apparatus. The apparatus further includes position acquiring means for acquiring coordinate positions of the plurality of first marks and coordinate positions of the plurality of second marks, and position deviation amounts of the plurality of second marks with respect to the plurality of first marks, respectively. First deviation amount calculating means for calculating a plurality of first deviation amounts indicated, joining position calculating means for calculating a joining position of the upper substrate and the lower substrate according to the plurality of first deviation amounts, and at the joining position Bonding means for joining the upper substrate and the lower substrate to each other, wherein the joining position calculating means calculates an amount of expansion and contraction deviation according to expansion and contraction of the upper substrate and the lower substrate from the plurality of first deviation amounts; A first deviation amount calculating means for classifying the expansion and contraction amount into each of the plurality of first deviation amounts to calculate a plurality of second deviation amounts, and one side of the upper substrate and the lower substrate on the other side; And correction amount calculating means for calculating a correction amount for moving to the joining position with respect to the plurality of second deviation amounts.

According to the present invention can provide a bonding method and a bonded substrate manufacturing apparatus that can improve the yield of the product.

EMBODIMENT OF THE INVENTION Hereinafter, the bonded substrate manufacturing apparatus of one Embodiment of this invention is demonstrated according to FIGS. 1 is a partial sectional view showing a schematic structure of a bonded substrate manufacturing apparatus. The bonded substrate manufacturing apparatus of one embodiment is a press apparatus, and the press apparatus joins two substrates in a cell manufacturing process during the manufacturing process of a liquid crystal display device. The bonding step is performed after the liquid crystal dropping onto the substrate on one side.

The press apparatus joins two supplied board | substrates and manufactures a liquid crystal display panel. In the present specification, one substrate is referred to as a lower substrate W1 and the other substrate is referred to as an upper substrate W2. For example, in one embodiment, the lower substrate W1 is an array substrate TFT and the upper substrate W2. ) Is a color filter substrate CF, the array substrate includes a plurality of TFTs formed on a glass substrate. The CF substrate includes a color filter or a light shielding film formed on the glass substrate. Each of the lower substrate W1 and the upper substrate W2 is made by a separate process and then supplied to the press apparatus.

The press apparatus includes a controller (not shown). In one embodiment, the control unit functions as a means for controlling each of the position acquisition step, the first deviation amount calculation step, the joining position calculation step, the second deviation amount calculation step, the correction amount calculation step, the bonding step, and the imaging step.

The press apparatus 100 is provided with the support frame 101 whose cross section opened from the upper side is substantially "U" shaped. The support frame 101 has a side wall 102, and a plurality of pressure motors 103 are arranged on the top of the side wall 102. One end of the ball screw 104 disposed in the press apparatus 100 is connected to each pressurizing motor 103. Each ball screw 104 is rotationally driven by a corresponding pressurizing motor 103. The first support plate 105 is screwed to each of the ball screws 104 so as to be operated up and down. The plurality of first support plates 105 support the second support plate 107 through the load cell 106. The vacuum chamber 108 includes two vessels divided up and down. In the present specification, the vacuum chamber 108 includes two containers divided up and down. In this specification, one side of the container is referred to as the lower container 110, and the other side of the container is referred to as the upper container (111).

A moving mechanism 112 is disposed at the bottom of the support frame 101. The lower container 110 is supported by the mover mechanism 112 at the upper side of the mover 112 so as to be movable horizontally and horizontally. In the lower side or the S portion of the lower container 110, a plurality of imaging apparatuses 118a to 118d, such as a CCD camera, are simply called cameras 1 to 4.

In the lower container 110, a table 113 on which the lower substrate W1 is disposed is provided horizontally. The lift plate 114 is provided in the outer periphery of the upper surface of the table 113. A part of this lift plate 114 protrudes outward of the table 113. The lift plate 114 is configured to be able to be operated up and down with respect to the table 113 by the lift mechanism LM provided below the lift plate 114. The table 113 is configured to suck and hold the lower substrate W1 on the table 113 by at least one side of the suction attraction force or the electrostatic attraction force.

A plurality of bellows 115 is provided between the upper container 111 and the first support plate 107. Inside each bellows 115, a support 116 having one end and the other end fixed to the second support plate 107 is inserted. The strut 116 penetrates the upper container 111, and the pressure plate 117 disposed in the upper vessel 111 is fixed to the other end of the strut 116. The second support plate 107 and the upper container 111 are raised or lowered by the driving of the pressure motor 103. When the upper container 111 descends until the side edge portion of the upper container 111 contacts the side edge portion of the lower container 110, the vacuum chamber 108 is formed by the lower container 110 and the upper container 111. It is sealed. As a result, the internal space of the vacuum chamber 108 is hermetically sealed.

The lower substrate W1 and the upper substrate W2 are carried into the vacuum chamber 108 by a conveying apparatus (not shown) and are disposed to face each other in the vacuum chamber 108. After the lower substrate W1 and the upper substrate W2 are disposed in the vacuum chamber 108, the press apparatus 100 makes the inside of the vacuum chamber 108 into a vacuum. Subsequently, the press apparatus performs non-contact optical alignment of the lower substrate W1 and the upper substrate W2 by using the array mark attached to the lower substrate W1 and the array mark attached to the upper substrate W2. . The array mark is printed on each of the substrates W1 and W2 in advance. One array mark is attached to each of the four corners (corners) of the substrates W1 and W2.

In detail, as shown in FIG. 2, the upper substrate W2 has an alignment mark A _U , B _U , C _U , D _U on a rectangular frame. , The lower substrate W1 has a rectangular array mark A _L , B _L , C _L , D _L Is stuck. And, in the quadrangles, the array marks Au and A _L are at the upper left and the array marks B _{U and} B _L In the lower right corner, the array marks C _{U ,} C _L At the top right, the array marks D _{U , DL} Are attached to the lower left corner respectively. In one embodiment, six cells 21b are formed on the lower substrate W1, and six cells 21a are formed on the upper substrate W2.

Hereinafter, the position alignment control of the upper substrate W2 and the lower substrate W1 by the control unit will be described in detail.

[Position acquisition process ]

In the position acquisition process, first, the control unit controls four cameras 1 to 4 to image rectangular array marks of the lower substrate W1 and the upper substrate W2. The control unit acquires an image (image data) of the array mark from each of the cameras 1 to 4, and recognizes the position (coordinate position) of the array marks of both substrates W1 and W2 using the screen data. . In one embodiment, in the X and Y coordinate planes, the positions of the array marks Au and A _L captured by the camera 21 are arranged in the second quadrant, the array marks B _{U ,} captured by the camera 2 _. The position of B _L is the fourth quadrant, and the position of the array marks C _{U ,} C _L captured by the camera 3 is the position of the array marks D _{U ,} D _L captured by the first quadrant, the camera 4. Respectively correspond to the third quadrant.

Next, the controller controls the lower table 113 on which the lower substrate W1 is placed on the basis of the image data obtained by the cameras 1 to 4 so that the rectangular array marks of both the substrates W1 and W2 overlap at corresponding positions. Rotate and rotate horizontally. As a result, the alignment marks are aligned with each other on the quadrangles of the substrates W1 and W2.

3 is a schematic diagram schematically showing images Cam1 to Cam4 of array marks captured by cameras 1 to 4; The array mark of each of the substrates W1 and W2 has a positional deviation (pitch error) due to incomplete marking of the shape, a drawing error of the mark, or expansion or contraction of the substrate caused by heat of the substrate processing machine by a seal drawing device or a liquid crystal dropping device. ). Therefore, it is difficult to simply align the arrangement of the lower substrate W1 with respect to the array mark of the upper substrate W2. As shown in FIG. 3, the center of the lower substrate W1 is the center point M1 between the array marks A _L and B _L and the array marks C _L and D _L. It is obtained by the coordinate value of the middle point 3 of the middle point M2 of the liver. In the arrangement according to the conventional method, the lower substrate W1 is moved so that the center of the lower substrate W1 obtained by the coordinate value of the point M3 is coincident with the center of the obtained upper substrate W2. Therefore, in the state where the array is completed, the deviation of the array mark (in Fig. 3, the difference between the array marks B _{U and} B _L of the image Cam2) is different from that of the array mark (in Fig. 3). Deviation between the array marks of the images Cam 1, 3, and 4). If this amount of deviation is large, defective cells are produced because the cells of both substrates W1 and W2 do not overlap within a prescribed range. In the present invention, as described above, the present invention calculates the degree of pitch error in order to improve the product yield, and calculates the rotation correction amount and the position correction amount using the calculated result.

2nd deviation calculation process

In this step, the controller controls the deviation amount (first deviation amount) of the rectangular array mark of the lower substrate W1 with respect to the substrate W2 using the images Cam 1 to Cam4 captured by the cameras 1 to 4. Calculate. The first deviation amount is a relative deviation amount (hereinafter referred to as substrate deviation amount) between both substrates W2 and W1 and the amount of deviation due to expansion and contraction of both substrates W2 and W1 (hereinafter referred to as expansion deviation amount). It includes.

Specifically, as shown in FIG. 3, the control unit calculates the X component and the Y component of the first deviation amount of the array mark A _L with respect to the array mark Au by analyzing the image Cam 1 obtained by the camera 1.

Similarly, the controller analyzes the images Cam2 to Cam4 obtained by the cameras 2 to 3, respectively, so that the first deviation amounts (X component and Y component) of the array marks B _L , C _L , and D _L for the array marks Bu, Cu, and Du. ) Are respectively calculated.

[ Joining position calculation process ]

In this step, the control unit calculates the bonding positions of the two substrates W1 and W2 based on the plurality of first deviation amounts with respect to the rectangular array mark. The joining position calculating step includes a second deviation amount calculating step and a correction amount calculating step.

2nd deviation calculation process

In this step, the control unit first calculates the expansion and contraction amount based on the plurality of first deviation amounts with respect to the rectangular array mark. Subsequently, the controller calculates the plurality of second deviation amounts by classifying the expansion / deviation amount into a plurality of first deviation amounts so as to average the expansion / deviation amount in the rectangular array mark. This second deviation amount includes the amount of expansion and deflection which averages the deviations caused by expansion and contraction of the substrate deviation amounts of both the substrates W2 and W1 and the substrates W2 and W1.

Hereinafter, the method for calculating the second deviation amount will be described in detail.

In one embodiment, the control unit calculates the second deviation amount from the first deviation amount by using the first to fourth quadrant components respectively set to the first to fourth quadrants of the X and Y average coordinates. In addition, in this specification, a quadrant component means the code | symbol (1 or -1) of the X component and Y component of each quadrant.

The first deviation amount derived from the imaging results of each camera 1 to 4 has a correlation with the position of the corresponding camera. In one embodiment, quadrant components are associated with respect to the position of the camera. The controller calculates a relative amount of expansion (ie, amount of stretching) of the lower substrate W1 relative to the upper substrate W2 based on the X component and the Y component of the first deviation amount and the quadrant component of the corresponding camera position.

As an example, a case where the lower substrate W1 extends in the array mark B _L direction with respect to the upper substrate W2 as shown in FIG. 3 will be described. In this case, between the images Cam1, Cam3, and Cam4, the X component (the amount of deviation of the X direction (left and right directions in the drawing)) and the Y component (the Y direction (up and down direction in the drawings) of the first deviation amount are the same values. When the lower substrate W1 is moved only by the deviation amounts of the images Cam1, Cam3, and Cam4, the deviation amounts of the array marks Bu and B _L of the image Cam2 become the amount of expansion and contraction of the lower substrate W2 relative to the upper substrate W1. .

As shown in Fig. 4, the array mark Au belonging to the second quadrant is associated with the "X + direction" and the "Y + direction", and the second quadrant component is set to (X, Y) = (1, 1). . The array mark Bu belonging to the fourth quadrant is associated with the "X-direction" and "Y-direction", and the fourth quadrant component is set to (X, Y) = (-1, -1). The array mark Cu belonging to the first quadrant is associated with the "X-direction" and the "Y + direction", and the first quadrant component is set to (X, Y) = (-1, -1). The array mark Du belonging to the third quadrant is associated with the "X + direction" and the "Y-direction", and the third quadrant component is set to (X, Y) = (1, -1). In addition, in FIG. 3, the array marks A _L1 , B _L1 , C _L1 , and D _L1 on the lower substrate W1 indicate positions after rotational correction described later.

In one embodiment, the control unit first multiplies the quadrant components corresponding to the coordinate values (X component, Y component) of each first deviation amount to obtain their sum, divides the sum by four, and averages the expansion / deflection amount (X component). , Y component).

When the X component of the first deviation amount calculated from the images of the cameras 1 to 4 is CamnX (n = 1 to 4), and the Y component of the first deviation amount is CamnY (n = 1 to 4), The average value AveX of the X component of the vehicle and the average value AveY of the Y component of the expansion-contraction deviation are calculated by the following Equations 1 and 2 below.

[Equation 1]

AveX = ((Cam1X * 1) + (Cam2X * -1) + (Cam3X * -1) + (Cam4X * 1)) / 4

[Equation 2]

AveY = ((Cam1Y * 1) + (Cam2Y * -1) + (Cam3Y * 1) + (Cam4Y * -1)) / 4

Then, the control unit calculates a correction value (X component, Y component) for averaging the stretching deviation amount of the rectangular array mark on the basis of the average values AveX and AveY of the stretching deviation amount. This correction value is obtained by multiplying the quadrant components (X, Y) by the average values AveX and AveY of the expansion and contraction deviation, respectively.

The X component VirXn (n = 1 to 4) and the Y component VirYn (n = 1 to 4) of the correction values respectively corresponding to the cameras 1 to 4 (that is, the rectangular array marks) are represented by the following equations.

VirX1 = AveX * 1

VirX2 = AveX * -1

VirX3 = AveX * -1

VirX4 = AveX * 1

VirY1 = AveY * 1

VirY2 = AveY * -1

VirY3 = AveY * 1

VirY4 = AveY * -1

Subsequently, the controller corrects the first deviation amount based on the calculated correction amount to calculate the second deviation amount. Specifically, the controller calculates the second deviation amount by subtracting the corresponding correction value X, Y from the first deviation amount X, Y. As described above, the second deviation amounts CalnX and CalnY include an average value of the amount of expansion of the substrate between the two substrates W2 and W1 and the amount of expansion and contraction deviation due to the expansion and contraction of the two substrates W1 and W2.

The X component CalnX (n = 1 to 4) and the Y component CalnY (n = 1 to 4) of the second deviation amount corresponding to the cameras 1 to 4 (that is, the rectangular array marks) are represented by the following equations.

CalnX = CamnX-VirXn

CalnY = CamnY-VirYn

For example, the first deviation amount X, Y is for the array marks Au, A _L (O.1, 1.2), for the array marks Bu, B _L (0.9, -0.8), the array mark Assume (-1.0, -2.4) for Cu and C _L and (2.5, 0.8) for array marks Du and D _L.

At this time, Equation 1 and Equation 2 calculate the X component of the average value of expansion and contraction deviations as Ave X = 0.675, and the Y component of the average value as AveY = -0.3. In addition, the X component is rounded off to 0.7 by taking into account precision limits.

By multiplying this average value by the quadrant component, the X component and the Y component of the correction value are calculated as follows.

(VirX1, VirX2, VirX3, VirX4) = (0.7, -0.7, -0.7, 0.7)

(VirY1, VirY2, VirY3, VirY4) = (-0.3, 0.3, -0.3, 0.3)

Therefore, the second deviation amount X, Y of the second quadrant (camera 1) is (-0.6, 1.5), and the second deviation amount X, Y of the fourth quadrant (camera 2) is (1.6, -1.1), the second deviation amount X, Y of the first quadrant (camera 3) becomes (-0.3, -2.1), and the second deviation amount X, Y of the third quadrant (camera 4) ) Becomes (1.8, 0.5).

In this step, the control unit moves one side of the upper substrate W2 and the lower substrate W1 (in one embodiment, the lower substrate W1) to the joining position with respect to the other side based on the second deviation amount of the rectangular array. The correction amount for moving is calculated. The correction amount includes a rotation correction amount for horizontally rotating the lower substrate W1 and a movement correction amount for horizontally correcting the lower substrate W1.

Rotation correction amount (rotation angle) is computed by [Equation 3]-[Equation 9]. Specifically, the control unit obtains a virtual component Au-Bu connecting the array marks Au and Bu in the diagonal direction and the virtual line segment Cu-Du connecting the array Cu and Du in the diagonal direction in the upper substrate W2, The average values α of the angles α1 and α2 where the two virtual line segments each form the X axis are calculated using Equations 3 to 5. This average value α represents the inclination of the upper substrate W2 with respect to the X axis. The controller calculates the inclination β of the lower substrate W1 with respect to the X axis by using Equations 6 to 8 in the lower substrate W1. In one embodiment, the coordinate values X and Y corresponding to the second deviation amount are used to calculate the slope β of the lower substrate W1. In FIG. 4, the array marks of the lower substrate W1 are represented by A _L1 , B _L1 , C _L1 and D _{L1 based} on the second deviation amount. Then, the inclination Δθ (rotation correction amount) of the upper substrate W2 with respect to the lower substrate W1 from the inclinations α and β of the two substrates W1 and W2 is calculated by Equation (9).

[Equation 3]

α1 = arctan ((B _U yA _U y) / (B _U xA _U x))

[Equation 4]

_{α2 = arctan ((D U yC} U y) / (C U xD U x))

[Equation 5]

α = (α1 + α2) / 2

[Equation 6]

β1 = arctan ((B _L1 yA _L1 y) / (B _L1 xA _L1 x))

[Equation 7]

β2 = arctan ((D _L1 yC _L1 y) / (C _L1 xD _L1 x))

[Equation 8]

β = (β1 + β2) / 2

[Equation 9]

Δθ = β-α

Subsequently, the controller controls the movement compensation amount for positioning the rectangular array marks, that is, the array marks Au, A _L1 , the array marks Bu, B _L1 , the array marks Cu, C _L1 , the array marks Du, and D _L1 . (X direction, Y direction) is calculated. This movement correction amount is calculated based on the deviation amount of the array mark after rotation correction.

In calculating the movement correction amount, the control unit extracts the singular point. The singular point is the array mark having the largest deviation amount (third deviation amount) between the X component and the Y component after rotation correction. For example, the deviation amounts after rotation correction of each array mark are ΔA1, ΔB1, ΔC1, and ΔD1, and the maximum and minimum values of the X components ΔAX1, ΔBX1, ΔCX1, ΔDX1 and the Y components ΔAY1, ΔBY1, ΔCY1, and ΔDY1. Are obtained using Equation 10 and Equation 11, respectively.

[Equation 10]

XA = MAX (ΔBX1, ΔCX1)

XB = MIN (ΔAX1, ΔDX1)

XC = MIN (ΔBX1, ΔCX1)

XD = MAX (ΔAX1, ΔDX1)

[Equation 10]

YA = MAX (ΔBY1, ΔDY1)

YB = MIN (ΔAY1, ΔCY1)

YC = MIN (ΔBY1, ΔDY1)

YD = MAX (ΔAY1, ΔCY1)

Here, the calculation center deviation of the board | substrate in each of X and Y components is calculated | required by comparing a board | substrate center direction and a board | substrate outer direction. For example, the calculated deviation amount (DiffX) of the X component of the substrate at this time is (XA + XB) / if the absolute value of the sum of XA and XB obtained from Equation 10 is greater than the absolute value of the sum of XC and XD. Obtained by 2. If the absolute value of the sum of XC and XD is greater than the absolute value of the sum of XA and XB, the calculation deviation DiffX is obtained as (XC + XD) / 2.

Similarly, DiffY is calculated as (YA + YB) / 2 if the absolute value of the sum of YA and YB obtained from Equation 11 is greater than the absolute value of YC and YD. If the absolute value of the sum of YC and YD is larger than the absolute value of the sum of YA and YB, the calculation deviation amount DiffY is obtained as (YC + YD) / 2.

As described above, the upper and lower substrates W2 and the lower substrate W1 are overlapped by performing position correction by averaging the expansion and contraction amounts in consideration of the amount of expansion and contraction deviation. Compared with the conventional method, correction is made so that the cells 21a and 21b in the substrate overlap with each other. In FIG. 5, although the variation between the cells 21a and 21b seems to be large, the expansion and contraction of the substrate W1 is erroneously indicated, the actual amount of expansion and contraction is very small, and the variation between the cells 21a and 21b is practical. There is no problem.

When the calculation of the correction coordinates is completed in the control unit, the control unit rotates the upper table horizontally according to the rotation correction amount (angle), and at the same time, the difference between the center coordinate values of the two substrates W1 and W2 and the X calculated by the rotation correction amount. The lower table is horizontally moved in the X and Y axis directions in accordance with the movement correction amounts in the axial direction and the Y axis direction.

This method is, of course, the case where the position of the array mark is not deformed by the expansion and contraction of the upper substrate W2 and the lower substrate W1 as shown in Fig. 6 (a). As shown in FIG. 6 (c), even when a deviation occurs in the position of the array mark D _L , the bonding position can be determined in consideration of the expansion and contraction of the substrate.

7 is a table showing the deviation amounts of the array marks and the center of the substrate as measurement results of the 50 sets of bonded substrates manufactured. In Fig. 7, "AVE" represents an average value, "MAX" represents a maximum value, "MIN" represents a minimum value, and "Ssigma" represents a variance value (unit is micron), and "1", "2" and "3". And “4” represent the array marks “Au, A _L ”, “Bu, B _L ”, “Cu, C _L ”, “Du, D _L ”, and “X” and “Y” are the X axis, Y-axis is shown respectively. For example, "1X" represents the amount of deviation in the Y-axis direction between the array marks "Au, A _L. ""Cx" and "Cy" indicate the deviation in the X-axis direction between the centers of both substrates W1 and W2. The deviation amounts in the vehicle and Y-axis directions are shown, respectively, and Fig. 12 shows the measurement results of 50 sets of bonded substrates manufactured according to the conventional example.

In 7, the maximum value of the dispersion value is 1.9 (Final 2Y is the Y component of the deviation amount between the array marks “Bu, B _L ” of the camera 2). In contrast, in Fig. 12, the maximum value of the dispersion value is 2.9 (Final 3Y is the Y component of the deviation amount between the array marks “Cu, C _L ” of the camera 3). Thus, in one Embodiment, the maximum value of a dispersion value is 1.0 or less compared with the conventional joining method. Therefore, the deviation amount of the array mark can be reduced.

8 plots the deviation amount of the array mark between the board | substrates W1 and W2 bonded by one Embodiment, and the deviation amount of the board center. 13 shows the amount of deviation of the conventional example. 8 and 13, the first graduations of the images Cam1 to Cam4 correspond to 1 micron, and the first graduation of the substrate center corresponds to 0.1 micron. In one embodiment (FIG. 8), it can be seen that the variation amount of the array mark is smaller than in the conventional example (FIG. 13). Therefore, even if the cells of the upper substrate W2 and the lower substrate W1 overlap on average, and the expansion and contraction of both the substrates W1 and W2 occurs, the amount of deviation of all the cells of the upper and lower substrates W1 and W2 that are originally overlapped is within the prescribed range. I become Therefore, the yield with respect to the number of sheets of FPD completed with two board | substrates improves compared with the past.

The bonding production apparatus and method of the embodiment have the following advantages.

(1) The first deviation amount of the rectangular array mark is calculated from the images of the cameras 1 to 4, and the deviation amount due to the expansion and contraction of both substrates W1 and W2 in each of the first deviation amounts (extension deviation amount) ) Is calculated. The second deviation amount is calculated to average the expansion and contraction deviation of the rectangular array mark, and the correction amount (rotation preservation amount and movement) moves the upper substrate W2 and the lower substrate W1 based on the second deviation amount. The amount of correction) is calculated. As a result, the number of cells in which the cells between both the substrates W1 and W2 overlap on average and are arranged in the prescribed range increases as compared with the conventional example. That is, the number of defective products manufactured is reduced. Therefore, the upper substrate W2 and the lower substrate W1 with good yield can be joined.

(2) The deviation amount can be easily obtained by the image processing of the control unit based on the image data of the array mark captured by the plurality of cameras and the coordinate position of the camera.

(3) The rotation correction angle for calculating the angle deviation between the upper substrate W2 and the lower substrate W1 is calculated on the basis of the coordinate values corresponding to the second deviation amount that averages the amount of expansion and contraction deviation. Based on this rotation correction angle, the movement correction amount when one side of the upper substrate W2 and the lower substrate W1 is rotated is calculated. Therefore, horizontal angle correction and movement correction can be made preferable.

In addition, you may implement the said embodiment in the following aspects.

The cameras 1 to 4 (imaging devices 118a to 118d) may be provided on the inner wall of the vacuum chamber 108, the upper container 111, or the like.

The upper substrate may be rotatable and movable.

The array mark may have a shape other than a rectangular shape, for example, a circle or a triangle. The number can be arbitrarily set according to the shape of the work and the substrate.

It is good also as a board | substrate bonding apparatus which can replace the joining method of both board | substrates which concerns on the said embodiment, and the joining method by a prior art example suitably. This apparatus compares the deviation amount by expansion and contraction of a board | substrate with a predetermined determination value, for example, and when the expansion deviation amount is smaller than a determination value, it performs the joining method of the said embodiment, and the expansion deviation amount is larger than a determination value. The joining method by the said prior art is implemented. In the case of carrying out the joining method in consideration of the expansion and contraction deviation, if the amount of deviation is too large, there are cases in which the cells after the joining have a large amount of deviation exceeding the prescribed range (the amount of deviation of all cells exceeds the prescribed range). In such a case, by carrying out the joining method of the conventional example, the number of cells in which the amount of deviation is arranged within the prescribed range increases, and the yield can be improved.

According to the present invention, it is possible to provide two substrate bonding methods and a bonded substrate manufacturing apparatus capable of improving the yield of products.

1 is a schematic configuration diagram of a press apparatus of one embodiment of the present invention.

2 is a conceptual diagram of a lower substrate, and (b) is a conceptual diagram of an upper substrate.

3 is a conceptual diagram illustrating a bonding deviation.

4 is a conceptual diagram illustrating a center deviation component.

5 is a conceptual diagram illustrating a modified substrate.

Fig. 6 is a plan view showing a substrate (substrate without deformation) after position bonding, (b) is a plan view showing a substrate (modified substrate) before alignment, and (c) a substrate after alignment. It is a top view which shows (the board | substrate shown to (b)).

7 is an explanatory diagram showing the amount of expansion and contraction of the array mark and the deviation amount of the substrate center.

8 is an explanatory diagram of a deviation component when the bonding method of one embodiment of the present invention is used.

9 is a conceptual diagram of a conventional rotation correction.

10 is a conceptual diagram of a conventional rotation correction and movement correction.

11 is a plan view of a substrate bonded using a conventional bonding method.

It is explanatory drawing which shows the deviation amount of the conventional array and the deviation amount of the center of a board | substrate.

It is explanatory drawing of the deviation component when the conventional joining method is used.

<Description of the symbols for the main parts of the drawings>

A _U , B _U , C _U , D _{U ,} A _L , B _L , C _L , D _{L :} Array Mark

W1: Lower board W2: Upper board

21a: Cell (Upper Substrate) 21b: Cell (Lower Substrate)

100: press device 108: vacuum chamber

118a ~ 118d: Image pickup device (Camera 1 ~ 4) Cam1X ~ Cam4X, Cam1Y ~ Cam4Y: First deviation

AveX, AveY: Average CalnX, CalnY: Second Deviation

DiffX, DiffY: Calculation deviation VirX1 ~ VirX4, VirY1 ~ VirY4: Correction value

Claims (8)

Upper substrate W2 having a plurality of first marks Au to Du, and lower substrate W1 having a plurality of second marks A _L to D _L for aligning positions with the plurality of first marks, respectively. As a joining method for joining, A position acquiring step of acquiring coordinate positions of the plurality of first marks and coordinate positions of the plurality of second marks, and a plurality of first marks each indicating a positional deviation amount of the plurality of second marks with respect to the plurality of first marks; A first deviation amount calculating step of calculating deviation amounts CamnX and CamnY, a joining position calculating step of calculating a joining position of the upper substrate and the lower substrate based on the plurality of first deviation amounts, and the joining position And a joining process of joining the upper substrate and the lower substrate to each other, wherein the joining position calculating process calculates the amount of expansion and contraction deviation according to expansion and contraction of the upper substrate and the lower substrate from the plurality of first deviations. And calculating a second deviation amount calculating a plurality of second deviation amounts CalnX and CalnY by dividing the expansion / contraction amount into each of the plurality of first deviation amounts, and one side of the upper substrate and the lower substrate. Stand on the other side And a correction amount calculating step of calculating a correction amount for moving to the joining position by using the plurality of second deviation amounts. The said position acquisition process is a process of image | photographing the some 1st mark and the said 2nd mark with the some imaging device 118a-118d, and the image data obtained from the said some imaging device. And acquiring the coordinate positions of the plurality of first marks and the coordinate positions of the plurality of second marks based on the coordinate positions of the plurality of imaging devices. The process according to claim 1 or 2, wherein the plurality of first marks and the plurality of second marks are associated with four quadrant components with respect to the X and Y coordinate planes, respectively, and the second deviation amount calculating step includes: And adding or subtracting the average value of the expansion and deviation amounts to each of the plurality of first deviation amounts according to quadrant components to calculate the plurality of second deviation amounts, wherein the correction amount calculation step includes: Calculating a rotation correction amount for correcting the angular deviation of the upper substrate and the lower substrate based on the deviation amount, and positioning deviations in the X and Y axis directions of the upper substrate and the lower substrate after rotation correction. And a step of calculating a movement correction amount for correction. 4. The process of claim 3, wherein the step of calculating the amount of movement correction comprises: setting the maximum and minimum values of the positional deviation amounts of the plurality of second marks with respect to the plurality of first marks after the rotation correction in the X-axis and Y-axis directions. Calculating the movement correction amount for horizontally moving one side of the upper substrate and the lower substrate based on the maximum and minimum values in the X-axis direction and the maximum and minimum values in the Y-axis direction. Bonding method comprising the step. Upper substrate W2 having a plurality of first marks Au to Du, and lower substrate W1 having a plurality of second marks A _L to D _L for aligning positions with the plurality of first marks, respectively. A bonded substrate manufacturing apparatus for manufacturing a bonded substrate by bonding a plurality of parts, comprising: position acquiring means for acquiring coordinate positions of the plurality of first marks and coordinate positions of the plurality of second marks; First deviation amount calculating means for calculating a plurality of first deviation amounts CamnX and CamnY respectively indicating position deviation amounts of a plurality of second marks, and the upper substrate and the lower side based on the plurality of first deviation amounts. Bonding position calculating means for calculating a bonding position of a substrate, and bonding means for bonding the upper substrate and the lower substrate to each other at the bonding position, wherein the bonding position calculating means includes the plurality of the first deviation amounts; According to the stretching of the upper substrate and the lower substrate Second deviation amount calculation means for calculating the extension deviation amount and classifying the extension deviation amount into each of the plurality of first deviation amounts to calculate a plurality of second deviation amounts CalnX and CalnY, the upper substrate and the And a correction amount calculating means for calculating a correction amount for moving one side of the lower substrate to the bonding position with respect to the other side using the plurality of second deviation amounts. 6. The position acquisition means according to claim 5, wherein the position acquisition means includes a plurality of imaging means 118a to 118d for imaging the plurality of first marks and the plurality of second marks, and the image data obtained from the plurality of imaging means. And acquiring the coordinate positions of the plurality of first marks and the coordinate positions of the plurality of second marks based on the coordinate positions of the plurality of imaging means. The method according to claim 5 or 6, wherein the plurality of first marks and the plurality of second marks are associated with four quadrant components with respect to the X and Y coordinate planes, respectively, and the second deviation amount calculating means includes: Means for calculating the plurality of second deviation amounts by adding or subtracting the average value of the expansion and deviation amounts to each of the plurality of first deviation amounts according to quadrant components, wherein the correction amount calculating means includes: the plurality of first deviation amounts; Means for calculating a rotation correction amount for correcting an angular deviation between the upper substrate and the lower substrate based on the deviation amount, and the positional deviations in the X and Y axis directions of the upper substrate and the lower substrate after rotation correction. Bonded substrate manufacturing apparatus comprising a means for calculating a movement correction amount for correction. 8. The apparatus according to claim 7, wherein the means for calculating the movement correction amount includes the maximum value and the minimum value of the positional deviation amounts of the plurality of second marks with respect to the plurality of first marks after the rotation correction in the X and Y axis directions. Calculating the movement correction amount for horizontally moving one side of the upper substrate and the lower substrate based on the maximum and minimum values in the X-axis direction and the maximum and minimum values in the Y-axis direction. Bonded substrate manufacturing apparatus, characterized in that.

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