KR100835576B1 - Controlling apparatus of head operation and controlling method thereof and stage apparatus - Google Patents

Abstract

An object of the present invention is to correct a deviation between a plurality of heads and a plurality of processing points of a work when a tilt due to a yaw angle occurs.

Head operating control device 31, and has a correction amount calculation section (44 ₁ ~44 _5), the determination (46 ₁ ~46 _5). Correction amount calculation section (44 _1), Y1, based on the Y2 laser interferometer (36, 37) the distance difference (L1-L2) of the (L1, L2) measured by, and calculates a correction amount (ΔT) according to the yaw angle. The signal processing of the determination section (46 ₁ ~46 _5), the value of the corrected distance (L1 ± ΔT) and determines whether it matches the processing position data, a head (30 ₁ ~30 ₅₎ if a match Output

As a result, the processing timings of the heads 30 ₁ to 30 ₅ are shifted in time according to the yaw angle θ, and the processing points on the substrate placed on the movable table 20 are separated from the heads 30 ₁ to 30 ₅ . The machining is performed at the timing coinciding with the machining point.

Relief, head, stage device, interferometer, movable table, distance calculation, machining position data

Description

Controlling apparatus of head operation and controlling method approximately and stage apparatus

1 is a perspective view showing a stage apparatus to which an embodiment of a head operation control apparatus according to the present invention is applied.

2 is a plan view for explaining a measurement method using the Y1 and Y2 laser interferometers 36 and 37.

3 is a system diagram for explaining correction processing by the head operation control device 31 according to the first embodiment by analog control.

4 is a conceptual diagram of a control block for processing correction processing of the head operation control device 31 of the first embodiment by digital control.

FIG. 5 is a diagram showing the relationship between the Y-direction moving position and the correction amount [Delta] T according to the yaw angle.

6 is a system diagram for explaining correction processing by the head operation control device 31 according to the second embodiment by analog control.

7 is a conceptual diagram of a control block for processing correction processing of the head operation control device 31 of the second embodiment by digital control.

8 is a plan view showing a measurement method of Example 3. FIG.

FIG. 9 is a system diagram for explaining correction processing by the head operation control device 31 according to the third embodiment by analog control.

10 is a conceptual diagram of a control block for processing correction processing of the head operation control device 31 of the third embodiment by digital control.

Explanation of symbols on the main parts of the drawings

10: stage device

14: Y direction linear motor

16: Y stage

20: movable table

28: head support member

30 (30 ₁ ~30 _n): the head

31: Head operation control device

36: Y1 laser interferometer

37: Y2 laser interferometer

44: correction amount calculation unit

44 _{1 to} 44 ₅ : Correction amount calculator

46: head control unit

46 _{1 to} 46 ₅ : Decision section

50 _{1 to} 50 ₅ : laser interferometer

The present invention relates to a head operating control device and a control method configured to correct misalignment of operating timings of a plurality of heads caused by a yaw angle (a yawing direction angle around a Z axis) of a workpiece. And a stage device.

For example, in a laser irradiation system having a laser head, an inkjet system having an inkjet head, or the like, a table on which a substrate (work) as a workpiece is placed is moved to a position where the processing point of the substrate is opposed to the laser irradiation point of the head. The operation of the head is controlled so as to process the substrate surface at the moved timing.

In such a control system, the substrate is placed on the movable table mounted on the X and Y stages of the stage apparatus in order to run the workpiece at high speed with high accuracy. A head is attached to a frame (head support member) across the upper side, and predetermined processing (laser irradiation, ink application, etc.) is performed to the processing point on a board | substrate.

In the stage device, the Y sliders provided on both sides of the Y stage on which the movable table is mounted move in the Y direction by the thrust force of the Y direction linear motor, and the Y axis linear motor is controlled to control the thrust force of the Y direction linear motor. The yaw angle is adjusted (see Patent Document 1, for example).

In the stage apparatus, the X-direction laser interferometer and the Y-direction laser interferometer measure the movement of the processing point of the substrate to the position (laser irradiation point) facing the head due to the movement of the movable table. The head is operated at a timing at which the position of the machining point measured by the interferometer and the Y-direction laser interferometer is moved to a position opposite to the head, thereby performing a predetermined machining.

[Patent Document 1] Japanese Patent Application Laid-Open No. 06-163359

In recent years, a plurality of heads are arranged side by side on a frame in accordance with an increase in size (large area) of a substrate, and a plurality of processing points on the surface of the substrate are linked to move the movable table on which the substrate is placed. By simultaneously processing the head, it is required to improve the processing efficiency. By the way, in the method of measuring the distance between the head and the movable table which are located in the center of a plurality of heads from the coordinate position data measured by the X-direction laser interferometer and the Y-direction laser interferometer, the movable table is inclined in the yawing direction and is caused by the yaw angle. If an error occurs, the shift amount (error) due to the yaw angle varies depending on the positions of the plurality of heads, so that the machining point positions corresponding to the plurality of heads cannot be accurately detected.

For example, even if the error of the head located at the center of the plurality of heads measured by the X-direction laser interferometer and the Y-direction laser interferometer is zero, the shift amount in the θ direction (yaw direction) is larger for the head at a position away from the center head. Grows On the other hand, the demand for processing accuracy is a request for higher precision, and it is expected to suppress the error between the processing point of the substrate and the laser irradiation point of the head to about one millionth of a millimeter.

Therefore, even if the error caused by the yaw angle of the movable table is controlled in such a manner as to correct the thrust distribution ratio of the pair of linear motors described in Patent Document 1, when the error due to the small yaw angle occurs due to the thrust fluctuation of the linear motor. Since the error amount in the θ direction varies depending on the positions of the plurality of heads, there is a problem that it is difficult to suppress the errors of all the heads to several microns.

Accordingly, an object of the present invention is to provide a head operation control device, a control method and a stage device that solve the above problems.

In order to solve the said subject, this invention has the following means.

The invention according to claim 1 moves any one of a work support member on which a work is placed and a head support member for supporting a plurality of heads arranged opposite to the work support member, and at the relative displacement of the two members. A head control apparatus for controlling the operation of the plurality of heads in association with each other, wherein the operation timing of the plurality of heads is corrected according to the inclination of the yawing direction of the workpiece support member or the head support member. It characterized in that it comprises a correction means to.

The invention according to claim 2, wherein the correction means detects the inclination of the member to be the moving side, and correction amount calculating means for calculating a correction amount for each of the plurality of heads based on the detection result of the detection means. And control means for individually operating the plurality of heads at a timing corrected by the correction amount from the correction amount calculating means.

The invention as set forth in claim 3, wherein the correction amount calculating means has an inclination calculating means for obtaining an inclination in the yawing direction of the member to be the moving side based on the detection result of the detecting means, and the arithmetic result obtained by the inclination calculating means In accordance with the characterized in that for calculating the correction amount for each of the plurality of heads.

The invention according to claim 4, wherein the detection means comprises a pair of laser interferometers arranged in the yawing direction of the movable side member, and the inclination calculation means is a difference in distance measured by the pair of laser interferometers. It is characterized by obtaining the inclination of the member to be the moving side from the above.

The invention according to claim 5 moves any one of a work support member on which a work is placed and a head support member for supporting a plurality of heads arranged opposite to the work support member, and at the relative displacement of the two members. A control method of a head operation control apparatus for controlling the operation of the plurality of heads in association, comprising: a first process of detecting an inclination of a member to be the moving side and the plurality of heads based on a detection result of the first process And a third process of separately operating the plurality of heads at a timing corrected by the correction amount from the second process.

According to the sixth aspect of the present invention, in the second step, the inclination of the member to be the moving side is calculated based on the detection result of the first step, and the correction amount for each of the plurality of heads is calculated according to the inclination. It features.

The invention according to claim 7 includes a work support member on which a work is placed, a head support member intersected on the work support member, a plurality of heads provided in parallel with the head support member, and the work support member or the head support. Moving means for moving any one of the members, detecting means for detecting an inclination of a moving side member of the work support member or the head support member, and movement of the head support member in conjunction with movement of the work support member or the head support member. A stage apparatus comprising head operation control means for controlling operation, wherein the head operation control means calculates correction amounts for the plurality of heads based on a detection result of the detection means, and at the timing corrected with the correction amounts, It is characterized by operating a plurality of heads individually.

The invention according to claim 8 is characterized in that the head operation control means calculates the inclination of the work support member based on the detection result of the detection means, and calculates correction amounts for the plurality of heads according to the inclination. .

The invention according to claim 9 includes a movable table on which a work is placed, a head support member intersected on the movable table, a plurality of heads provided in parallel with the head support member, and a movement for moving the movable table. Means, detecting means for detecting an inclination of the movable table, correction amount calculating means for calculating a correction amount in accordance with a change in the detection value detected by the detecting means while moving the movable table from a start point to an end point, and the correction amount calculation Storage means for storing a correction amount of each movement position obtained in the process of moving the movable table calculated by the means from a start point to an end point, and a correction amount corresponding to the movement position of the movable table by the movement means. Read from the plurality of heads individually at a timing in accordance with the correction amount It characterized in that it has a head operation control means for operating.

The invention according to claim 10 includes a movable table on which a work is placed, a head supporting member intersected on the movable table, a plurality of heads provided in parallel with the head supporting member, moving means for moving the movable table, And a plurality of detection means for detecting a distance to the movable table, and a head operation control means for individually operating the plurality of heads at a timing corresponding to each distance data detected by the plurality of detection means. .

<Example>

EMBODIMENT OF THE INVENTION Hereinafter, the best form for implementing this invention with reference to drawings is demonstrated.

<Example 1>

1 is a perspective view showing a stage apparatus to which an embodiment of a head operation control apparatus according to the present invention is applied. As shown in FIG. 1, the stage apparatus 10 includes a pair of Y sliders 12 moving in the Y direction, a pair of guides 14 for guiding the Y sliders 12, and a Y slider 12. ), And a flat plate-shaped movable table (work support member) 20 moving in the X direction on the Y stage 16.

In addition, the stage apparatus 10 includes a stone slab 22 for supporting a pair of guides 14, a vibration removing mount 24 for supporting the stone slab 22, and a stone slab ( 22 has a pair of gantry frames 26 mounted over and a head support member 28 transversely between the gantry frames 26.

Here, the Y slider 12 is provided with a Y-direction linear motor (not shown) for driving the movable table 20 in the Y direction, and the movable table 20 for driving the movable table 20 in the X direction on the Y stage 16. An X direction linear motor (not shown) is provided. In addition, the Y stage 16 and the movable table 20 are provided with a plurality of static pressure pads (not shown), and the guide 14 and the stone plate 22 are almost free from friction. It is equipped to move.

The head support member 28 is fixed so that it may cross over to the substantially intermediate position of the pair of gantry frames 26 extended to the left and right sides of the stone slab 22. The head support member 28 is provided with a plurality of heads 30 (30 ₁ to 30 _n ) arranged side by side at predetermined intervals, and a head operation control device 31 for operating the plurality of heads 30. have.

The movable table 20 is a workpiece adsorption surface on which an upper surface thereof adsorbs a substrate, and a Y-direction mirror 32 and an X-direction mirror 34 are attached to the circumferential portion. Then, Y1 and Y2 laser interferometers (detecting means) 36 and 37 for Y-direction position detection are arranged in parallel in the Y-direction end portion of the stone plate 22, and the X of the stone plate 22 is arranged. An X laser interferometer 38 for X-direction position detection is disposed at the direction end portion.

Here, a measurement method using the Y1, Y2 laser interferometers 36, 37 will be described with reference to FIG. In FIG. 2, five heads 30 ₁ to 30 ₅ are arranged.

The Y1 laser interferometer 36 is a length measurement interferometer and is disposed on the Y-direction axis crossing the head 30 ₃ located at the center of the plurality of heads 30. The Y2 laser interferometer 37 is a yaw angle calculation interferometer, and is mounted at a position shifted from the Y1 laser interferometer 36 by the distance D1 in the X direction.

Therefore, the Y-direction position of the movable table 20 is measured by the Y1 laser interferometer 36, and the X-direction position of the movable table 20 is measured by the X laser interferometer 38. Incidentally, the inclination (the yaw angle θ) around the Z axis of the movable table 20 is the distance L1 measured by the Y1 laser interferometer 36 and the distance L2 measured by the Y2 laser interferometer 37. Is obtained from the interval (X-direction spacing D1) between the difference? 1 (= L1-L2) and the Y1, Y2 laser interferometers 36, 37.

In addition, the position (distance) of the processing point corresponding to the head 30 ₃ located in the center among the plurality of heads 30 is measured by the Y1 laser interferometer 36 and the X laser interferometer 38. If the distance from the head 30 ₃ to the other head 30 ₁ is D2 and the machining point error due to the yaw angle θ is δ2, the correction amount ΔT for the trigger signal is obtained from the following equation. Become.

In the above Equation 1, since D1 and D2 are known, the difference δ1 between the measured values of the Y1 and Y2 laser interferometers 36 and 37 and the measured value L1 of the Y1 laser interferometer 36 are determined. By substituting for the correction amount ΔT can be obtained. In Equation 1, the correction amount ΔT can be obtained without calculating the yaw angle of the movable table 20.

Further, the correction amount (ΔT) of the head other than the 30 _2, 30 _4, 30 ₅ also similar to the above can be calculated using the equation (1). Then, by correcting the operating positions of the _five heads 30 ₁ to 30 ₅ with the correction amount T, for example, the movable table 20 is moved in the Y direction in the state in which the angle θ is inclined clockwise when viewed from above. In this case, the correction amount ΔT is added or subtracted to the machining positions of the heads 30 ₁ to 30 ₅ to shift the machining timing.

For example, the head 30 ₁ accelerates processing by the correction amount ΔT ₁ with respect to the head 30 ₃ as a reference. In addition, the head 30 ₂ advances processing by the correction amount ΔT ₂ with respect to the head 30 ₃ as a reference. The head 30 ₄ delays processing by the correction amount ΔT ₄ with respect to the head 30 ₃ serving as a reference. The head (30, _5), a processing by the correction amount (ΔT ₅₎ against the head (30, ₅₎ serving as a reference is late. As a result, the machining points P1 to P5 by the heads 30 ₁ to 30 _{5 become} circular portions indicated by broken lines in FIG. 2 (however, the center head 30 ₃ has no correction), It becomes a position which correct | amended the deviation amount (delta) by the retardation angle (theta) to zero.

Therefore, the timings of the heads 30 ₁ to 30 ₅ are shifted in time according to the yaw angle θ of the movable table 20, so that the processing points on the substrate placed on the movable table 20 are placed on the head 30. The machining can be performed at a timing consistent with a machining point of ₁ to 30 ₅ ).

Here, the correction processing by the head operation control device 31 is represented by analog control, as shown in FIG.

3, the correction amount calculation section (44 ₁₎ performs the operation of the above-described Equation 1, Y1, Y2 laser interferometer (36, 37) the distance difference (L1-L2) of the (L1, L2) measured by the Based on this, the correction amount ΔT corresponding to the yaw angle is calculated.

The distance L1 measured by the Y1 laser interferometer 36 is corrected by adding or subtracting the correction amount ΔT. The determination unit 46 ₁ determines whether or not the value of the corrected distance L1 ± ΔT coincides with the machining position data, and outputs the signal of the head 30 ₁ when it matches.

In addition, it subjected to a correction amount computing unit (44 _{2-44 5)} and a judging section (46 _{2-46 5),} the correction process of the same with respect to the other heads (30, _{2-30. 5)} and outputs a signal. Thus, the head (30 ₁ ~30 _5), the processing timing are temporally shifted in accordance with the yaw angle (θ) of the movable table 20, the machining point on the binary placing the substrate on a movable table (20) head (30 _The machining is performed at a timing coinciding with the machining point of ₁ to 30 ₅ ).

4 is a conceptual diagram of a control block for processing correction processing of the head operation control device 31 of the first embodiment by digital control. As shown in FIG. 4, the head operation control device 31 is made of a microcomputer and calculates a distance L1 from the signal measured by the Y1 laser interferometer 36 to the movable table 20. 40 and a correction amount calculating unit for calculating a correction amount ΔT for each of the heads 30 ₁ to 30 ₅ based on the distances L1 and L2 measured by the Y1 and Y2 laser interferometers 36 and 37 ( 44) and has a head control section (control means) 46 of the timing correction head (30 ₁ ~30 ₅₎ as defined by from the correction amount calculation section (44) separately operate.

The head control section 46 inputs the machining position data in advance, and corrects the distance L1 from the distance calculating section 40 by the correction amount ΔT from the correction amount calculating section 44, and this correction value (L1 ±). ΔT), and outputs the processed signal when the match processing data, a head (30 ₁ ~30 _5). As a result, the heads 30 ₁ to 30 ₅ are shifted in time according to the yaw angle θ of the movable table 20, so that the processing points on the substrate placed on the movable table 20 are moved to the head ( The machining is performed at a timing coinciding with the machining points P1 to P5 of 30 ₁ to 30 ₅ .

<Example 2>

The head operation control device 31 of the second embodiment first moves the movable table 20 in the Y direction before entering the machining step, and changes the respective moving positions by the change in the yaw angle during the start point to the end point of the Y direction stroke. The amount of correction is calculated and stored in advance in the database (memory means). The correction amount ΔT corresponding to the yaw angle at the Y-direction moving position stored in the database changes, for example, as schematically shown in FIG. 5. In FIG. 5, the horizontal axis shows the Y-direction moving position, and the vertical axis shows the correction amount (DELTA) T according to a yaw angle. Therefore, if the Y-direction moving position is measured by the Y1 laser interferometer 36, the correction amount [Delta] T corresponding to the moving position can be read out instantaneously.

Then, the movable table when processing the binary release substrate up to 20, a movable table it is possible to compensate for the processing timing of reading the correction amount of each movement position previously stored in the database heads (30 ₁ ~30 ₅₎ In the case of moving 20 at high speed, the correction processing can be performed at high speed in accordance with the moving speed.

Here, the correction processing by the head operation control device 31 is represented by analog control, as shown in FIG.

In FIG. 6, the correction amount calculator 44 ₁ checks the database (FIG. 6) for the correction amount ΔT corresponding to the distance L1 from the signal measured by the Y1 laser interferometer 36 to the movable table 20. ), The correction amount ΔT is added or subtracted from the distance L1 measured by the Y1 laser interferometer 36. The determination unit 46 ₁ judges whether or not the value of the corrected distance L1 ± ΔT coincides with the machining position data, and outputs the machining signal of the head 30 ₁ when it matches.

In this correction method, the yaw angle of obtaining the yaw angle θ around the Z axis of the movable table 20 based on the distances L1 and L2 measured by the Y1 and Y2 laser interferometers 36 and 37 as in the first embodiment. The arithmetic processing becomes unnecessary, and the time until outputting the machining signal of the head 30 ₁ is shortened so that the correction processing can be performed at high speed in response to the high-speed movement of the movable table 20.

Further, the correction processing is performed for the same making it possible to output the processed signal at a high speed the other head (30 _{2-30 5)} correction amount calculating section (44 _{2-44 5)} and a judging section (46 _{2-46 5)} with respect to the do. As a result, the timings of the heads 30 ₁ to 30 ₅ are shifted in time according to the change in the yaw angle θ of the movable table 20, and the processing points on the substrate placed on the movable table 20 are headed. Machining can be performed at a timing consistent with the machining points P1 to P5 of (30 ₁ to 30 ₅ ).

As a result, the machining points P1 to P5 by the heads 30 ₁ to 30 _{5 become} circular portions indicated by broken lines in FIG. 2 (however, the head 30 _{3 in the} center has no correction), and the yaw angle θ It becomes a normal position which correct | amended the deviation amount (delta) by zero.

7 is a conceptual diagram of a control block for processing correction processing of the head operation control device 31 of the second embodiment by digital control.

As shown in Fig. 7, the head operation control device 31 is made of a microcomputer and includes the above-described distance calculating section 40, yaw angle calculating section 42, correction amount calculating section 44, database 48 and The correction amount of the heads 30 ₁ to 30 ₅ corresponding to the movement position of the movable table 20 is read from the database 48, and the heads 30 ₁ to 30 ₅ are individually operated at a timing corresponding to the correction amount. It has a head control part (control means) 46. The yaw angle calculation section 42 calculates the yaw angle θ around the Z axis of the movable table 20 based on the distances L1 and L2 measured by the Y1 and Y2 laser interferometers 36 and 37. Then, the correction amount computing section 44, and calculates a correction amount (ΔT) for each of the heads (30 ₁ ~30 ₅₎ according to the yaw angle (θ) obtained by the yaw angle calculating means (42).

That is, the correction amount calculation unit 44 moves the movable table 20 from the start point to the end point of the Y-direction stroke, and the difference δ2 of the distances L1 and L2 measured by the Y1 and Y2 laser interferometers 36 and 37. It calculates a correction amount (ΔT) for each of the heads (30 ₁ ~30 ₅₎ in accordance with the change. Database 48 stores a correction amount for each moving position of the correction amount computing section 44, the head (30 ₁ ~30 ₅₎ obtained by operation of the movable table 20 in the course of moving from the start point to the end point by.

The head control section 46 inputs the machining position data in advance, and reads the correction amount ΔT of the heads 30 ₁ to 30 ₅ from the distance L1 from the distance calculating section 40 from the database 48. When the correction value L1 ± ΔT coincides with the processing data, the processing signal of the heads 30 ₁ to 30 ₅ is outputted. Thus, the head (30 ₁ ~30 _5), the processing timing are temporally shifted in accordance with the yaw angle (θ) of the movable table 20, the machining point on the binary placing the substrate on a movable table (20) head (30 Processing can be performed at timings consistent with the processing points P1 to P5 of ₁ to 30 ₅ ).

<Example 3>

8 is a plan view showing a measuring method of Example 3. FIG. In 8, the third embodiment, a head (30 ₁ ~30 ₅₎ corresponds to Y Y1~Y5 laser interferometer for measuring the distance to the movable table 20 in the direction of a position (50 ₁ ~50 ₅₎ Is provided. The Y3 laser interferometer 50 ₁ disposed at the center is an interferometer for length measurement, and the other laser interferometers 50 ₁ , 50 ₂ , 50 ₄ , 50 ₅ are position detection interferometers functioning as correction means.

Y1~Y5 laser interferometer (50 ₁ ~50 _5), the head (30 ₁ ~30 ₅₎ and the slope (the yaw angle (θ) in the yaw direction of the movable table 20 is arranged on a line in the Y direction, which crosses Measure the distances L1 to L5. Therefore, the Y1 to Y5 laser interferometers 50 _{1 to} 50 ₅ can detect the shift amount δ2 due to the yaw angle of the machining point that the heads 30 ₁ to 30 _{5 face} .

The head operation control device 31 individually adjusts the heads 30 ₁ to 30 ₅ when the distances L1 to L5 measured by the Y1 to Y5 laser interferometers 50 _{1 to} 50 ₅ coincide with the machining position data. It works

Thus, in the present embodiment, since the heads 30 ₁ to 30 ₅ and the Y1 to Y5 laser interferometers 50 _{1 to} 50 ₅ are provided at 1: 1, the Y1 to Y5 laser interferometers 50 _{1 to} 50 ₅ By operating the heads 30 ₁ to 30 _{5 at} a timing at which the distances L1 to L5 measured by the coincidence with the machining position data, the machining points P1 to P5 are moved to the yaw angle θ of the movable table 20. The deviation amount δ2 caused by this is corrected to a normal position where zero is corrected.

Here, when the correction process by the head operation control device 31 is represented by analog control, it becomes as shown in FIG.

9, when the judging section (46 _1), the feed distance (L1) of the Y1 to the laser interferometer (50 _1), the movable table 20 from the signal measured by, determining whether or not to match the processing position data If a match is found, the processing signal of the head 30 ₁ is output.

In addition, the degree determining section (46 _{2-46 5)} relative to the other heads (30, _{2-30. 5)} performs the correction processing of the same, and outputs the processed signal. Accordingly, the determination (46 ₁ ~46 _5), each Y1~Y5 laser interferometer (50 ₁ ~50 ₅₎ to the movable table (20, the distance data (L1~L5) of each of the machining point by the measured by the parallel ) the processing point on the binary they rest on the substrate is carried out by processing a timing consistent with the machining point (P1~P5) of the head (30 ₁ ~30 _5). Therefore, when the movable table 20 has an inclination due to the yaw angle, the processing timing of the heads 30 ₁ to 30 ₅ is shifted in time according to the change of the yaw angle θ of the movable table 20.

As a result, the machining points P1 to P5 by the heads 30 ₁ to 30 _{5 become} circular portions indicated by broken lines in FIG. 8 (however, the head 30 _{3 in the} center has no correction), and the yaw angle θ It becomes a normal position which correct | amended the shift amount (delta) 2 by zero.

10 is a conceptual diagram of a control block for processing correction processing of the head operation control device 31 of the third embodiment by digital control. As shown in FIG. 7, the head operation control device 31 is made of a microcomputer, and the distance calculation unit 44 ₁ which changes with the movement of the distance calculating units 44 _{1 to} 44 ₅ and the movable table 20. ~44 ₅₎ has a movable table (head controller (control means) 46 of the timing to the head (30 ₁ ~30 ₅₎ according to the distance data of the 20) individually operated by the operation.

Distance calculation unit (44 ₁ ~44 _5), and calculates the distance (L1~L5) Y1~Y5 measured by the laser interferometer (50 ₁ ~50 ₅₎ as a correction amount for each of the heads (30 ₁ ~30 ₅₎ .

The head control section 46 processes the operation timings of the heads 30 ₁ to 30 ₅ in parallel, and the machining position data is input in advance. Then, the head control unit (46), the distance calculation unit (44 ₁ ~44 ₅₎ when the distance data (L1~L5) from a match with each of the raw data of the heads (30 ₁ ~30 _5), a head (30 ₁ Output the processing signal of ˜30 ₅ ). As a result, the timings of the heads 30 ₁ to 30 ₅ are shifted in time according to the yaw angle θ of the movable table 20, so that the processing points on the substrate placed on the movable table 20 are placed on the head 30. Processing can be performed at timings consistent with the processing points P1 to P5 of ₁ to 30 ₅ ).

In the present embodiment, however, the configuration in which the heads 30 ₁ to 30 ₅ and the Y1 to Y5 laser interferometers 50 _{1 to} 50 ₅ are disposed at 1: 1 is given as an example, but the present invention is not limited thereto. When the number increases, one laser interferometer may be arranged for two heads. In this case, the operation timing of the head coinciding with the Y-direction position of the laser interferometer is controlled by the distance data measured by the laser interferometer, and the operation timing of the head coinciding with the Y-direction position of the laser interferometer is the embodiment described above. 1 or embodiment 2 by correcting the way of the movable table 20 to be processed by a timing consistent with the processing point (P1~Pn) of the head (30 ₁ ~30 _n) processing point on the substrate, it rests on a binary phase Can be.

<Industrial availability>

In the above embodiment has been described above in the configuration for moving the movable table 20 by a stage device in the Y direction, the present invention is not limited thereto, and a work table which is fixed by placing the side of the head (30 ₁ ~30 ₅₎ It goes without saying that the present invention can also be applied to a configuration in which the head support member 28 for supporting the movable member is moved in the Y direction by a linear motor or the like.

In the above embodiment, the case where the head operation control device 31 corrects the operation timing of the heads 30 ₁ to 30 _n mounted on the stage device has been described as an example. It goes without saying that the present invention can be applied to apparatuses other than the stage apparatus as long as the apparatus moves one of the supporting members.

Further, as the heads 30 ₁ to 30 _{n of the} above embodiment, a laser processing head for irradiating a laser light to a processing point of a work, an inkjet head for ejecting ink onto the surface of the work, or a surface for processing the processed workpiece The present invention can also be applied to a configuration in which an inspection head or the like is mounted on the head support member 28.

According to the present invention, since the operation timing for the plurality of heads is corrected according to the inclination of the yawing direction of the member on the moving side, the operation timing is shifted according to the inclination even if the inclination of the member on the moving side is minute. The head can be operated with respect to the position at which the inclination is zero, so that the accuracy can be increased without being influenced by an error caused by the yaw angle of the moving side.

Further, according to the present invention, the correction amount of each movement position obtained in the process of moving the movable table calculated by the correction amount calculating means from the start point to the end point is stored in the storage means, and corresponds to the movement position of the movable table by the movement means. Since the correction amount is read from the storage means and the plurality of heads are individually operated at the timing corresponding to the correction amount, even if the tilt of the movable table is minute, the operation timing is shifted according to the tilt of the movable table, so that the position of the tilt is zero. The head can be operated, and the accuracy can be increased without being affected by the error caused by the yaw angle of the movable table.

Further, according to the present invention, since the plurality of heads are individually operated at a timing in accordance with the distance data to the movable table facing the plurality of heads detected by the plurality of detection means, the head is moved at a position according to the tilt of the movable table. It can operate, and it becomes possible to raise precision, without being influenced by the error by the yaw angle of a movable table.

Claims (10)

Relative displacement of the work support member and the head support member while moving any one of a work support member on which a work is placed and a head support member for supporting a plurality of heads arranged opposite to the work support member. A head control device for controlling the operation of the plurality of heads in conjunction with, And correcting means for correcting operating timings of the plurality of heads according to the inclination of the yawing direction of the workpiece supporting member or the head supporting member, which is a moving side. The method according to claim 1, The correction means, Detecting means for detecting an inclination of the member to be the moving side; Correction amount calculation means for calculating correction amounts for each of the plurality of heads based on the detection result of the detection means; And control means for individually operating the plurality of heads at a timing corrected by the correction amount from the correction amount calculating means. The method according to claim 2, The correction means has a storage means for storing the correction amount; And the control means individually operates the plurality of heads based on the correction amount stored in the storage means. The method according to claim 2, The detecting means comprises a pair of laser interferometers arranged in the yawing direction of the member to be the moving side, And said correction amount calculating means obtains said correction amount from the difference of the distance from each laser interferometer measured by said pair of laser interferometers to the member which becomes a moving side. The work support member on which the work is placed and the head support member for supporting the plurality of heads arranged opposite to the work support member are moved, and in conjunction with the relative displacement of the work support member and the head support member. As a control method of a head operation control device for controlling the operation of the plurality of heads, A first process of detecting an inclination of a member to be a moving side of the work support member or the head support member; A second step of calculating a correction amount for each of the plurality of heads based on the detection result of the first step; And a third step of individually operating the plurality of heads at a timing corrected by the correction amount from the second step. The method according to claim 5, And a step of storing the correction amount in a storage means between the second process and the third process. A workpiece support member on which the workpiece is placed, A head support member across the work support member, A plurality of heads installed side by side in the head support member; Moving means for moving any one of the work support member or the head support member; Detecting means for detecting an inclination of a moving side member of the work support member or the head support member; A stage apparatus having a head operation control means for controlling the operation of the head in conjunction with the movement of the work support member or the head support member, And the head operation control means calculates a correction amount for the plurality of heads based on the detection result of the detection means, and individually operates the plurality of heads at a timing corrected by the correction amount. The method according to claim 7, And the head operation control means obtains the inclination of the work support member based on the detection result of the detection means, and calculates a correction amount for the plurality of heads according to the inclination. Movable table on which work is placed, A head support member across the movable table, A plurality of heads installed side by side in the head support member; Moving means for moving the movable table; Detecting means for detecting an inclination of the movable table; Correction amount calculation means for calculating a correction amount corresponding to a change in the detection value detected by the detection means while moving the movable table from a start point to an end point; Storage means for storing a correction amount of each moving position obtained in the process of moving the movable table calculated by the correction amount calculating means from a start point to an end point; And a stage operation control means for reading the correction amount corresponding to the movement position of the movable table by the moving means from the storage means and operating the plurality of heads individually at a timing corresponding to the correction amount. . The movable table on which the work is placed, A head support member across the movable table, A plurality of heads installed side by side in the head support member; Moving means for moving the movable table; A plurality of detection means for detecting a distance from the movable table; And a head operation control means for individually operating the plurality of heads at a timing corresponding to each distance data detected by the plurality of detection means.

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