JP2016205957A - Method for correcting movable head position of x-y substrate inspection device, and x-y substrate inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for correcting the movable head position of an X-Y substrate inspection device for correcting positional displacement by calculating an inclination on an X-Y plane of a Y-axis drive unit in X-Y substrate inspection devices that use a ball screw and a linear guide as the drive mechanism of a movable head, and also to provide and an X-Y substrate inspection device.SOLUTION: When reference mark sequences 22 and 23 with known coordinate positions are installed at both sides of the X axis direction, and a Y-axis drive unit 14 having a movable head 17 mounted thereon is moved to a target position in the X axis direction, a reference mark of the reference mark sequence 22 at one side is taken in with a camera 19 of the movable head 17 to calculate a distance between the position after movement and the reference mark. The Y-axis drive unit 14 is driven, a distance between the position after movement and a reference mark of the reference mark sequence 23 at the other side is calculated, and the inclination α of the Y-axis drive unit 14 is calculated from the calculated distance.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a movable head position correction method for an XY substrate inspection apparatus and an XY substrate inspection apparatus.

  As an inspection apparatus for a printed wiring board or the like, an XY board inspection apparatus that performs inspection by bringing a movable probe into contact with a substrate to be inspected is known. This XY substrate inspection device inspects a probe at a target position by moving a movable head mounted with a probe called a flying probe, which is brought into contact with a substrate to be inspected, on an XY plane (secondary plane). An inspection is performed by contacting the target substrate. An XY orthogonal two-axis drive mechanism for driving the movable head on the XY plane includes a Y-axis drive unit for moving the movable head with a ball screw, and the Y-axis drive unit in the X-axis direction orthogonal to the Y-axis. An X-axis drive unit that is moved by a ball screw is provided. Here, a unit that moves the movable head in the ball screw direction with a ball screw is referred to as a Y-axis drive unit, and a mechanism that moves the Y-axis drive unit with a ball screw in a direction orthogonal to the Y axis is referred to as an X-axis drive unit.

  This will be described with reference to the drawings. FIG. 7 is a simplified plan view of the XY orthogonal two-axis drive mechanism of the XY substrate inspection apparatus for explanation. The XY orthogonal two-axis drive mechanism includes an X-axis drive unit 10 that drives in the long X-axis direction and a Y-axis drive unit 14 that drives in the short Y-axis direction in the drawing. The X-axis drive unit 10 includes an X-axis ball screw 11 installed at one end in the Y-axis direction (one side of X) and an X-axis linear installed at the other end in the Y-axis direction (the other side of X). A guide 12 is provided. The Y-axis drive unit 14 is provided so as to be hung between the X-axis ball screw 11 and the X-axis linear guide 12, and the Y-axis ball screw 15 moves the movable head 17 on which the probe 18 is mounted in the Y-axis direction. . The X-axis drive unit 10 moves the Y-axis drive unit 14 in the X-axis direction.

The X-axis ball screw 11 and the Y-axis ball screw 15 are driven and controlled by a servo motor controlled by a control device (not shown), and the movable head 17 is placed at any coordinate position (X _i , Y _i ) in the X-axis direction and the Y-axis direction. The probe 18 can be moved down at a designated position and brought into contact with the substrate to be inspected.
The movable head 17 is provided with a camera 19, which can determine whether the probe 18 has accurately reached the position of the measurement target.

JP 2000-055971 A

  When the Y-axis drive unit 14 is moved in the X-axis arrow direction by the X-axis ball screw 11, the Y-axis drive unit 14 is inclined by a minute α in the Y-axis direction. That is, there is a slight difference between the amount of movement on the X-axis ball screw 11 side and the amount of movement on the X-axis linear guide 12 side, resulting in the inclination α. This inclination (displacement) is due to the X-axis linear guide 12 side being delayed with respect to the X-axis ball screw 11 side advance. This inclination also occurs because the rigidity of the ball screw 11 is weak, and is also caused by the play of the ball screw or the assembly accuracy of the apparatus. This deviation is as small as 10 μm or less, for example, but is not negligible in an XY substrate inspection apparatus in which the position control accuracy of the movable head is about 1 μm. Further, the amount of deviation is not uniform but takes different values for each apparatus.

  As described above, in the movement control of the movable head using the ball screw, it is necessary to control the position of the movable head by correcting the deviation from the target position of the movable head due to the deviation in the Y-axis direction caused by the rigidity of the ball screw.

  In Patent Document 1, a linear scale is installed on the linear guide side having a large deviation with respect to a phenomenon in which a deviation occurs at both ends when the movable head is moved in the Y-axis direction. It is proposed to correct the given command value.

  However, in Patent Document 1, there is a problem that it takes time to perform control because position control is performed by measuring and correcting with a linear scale for each operation. In addition, since a linear scale is used, an expensive and precise device is required, and the cost of the apparatus is increased.

  The present invention solves the above-mentioned problems, and detects the tilt (deviation) of the Y-axis drive unit in advance using a camera mounted on the movable head, and is caused by the tilt in the substrate inspection process. It is an object of the present invention to provide a method and apparatus for correcting misalignment.

  In order to solve the above-described problems, one aspect of the present invention provides an XY orthogonal two-axis drive mechanism that enables a movable head mounted with a probe to move forward and backward on an XY plane composed of orthogonal X and Y axes. This XY orthogonal two-axis drive mechanism includes an orthogonal X-axis drive unit and Y-axis drive unit, and a control device that controls the drive of the X-axis drive unit and the Y-axis drive unit. Moves the Y-axis drive unit in the X-axis direction by an X-axis ball screw provided on one side in the X-axis direction and a linear guide provided at least on the other side. The Y-axis drive unit moves the movable head to the Y-axis ball screw. Is a movable head position correction method for an XY substrate inspection apparatus that moves in the Y-axis direction by using a reference mark having a known coordinate value on one side of the X-axis direction and the other, and moving the movable head in the X-axis direction. Moving to a target position on one side, imaging the one-side reference mark with the camera mounted on the movable head at the moved position, detecting the distance between the moved position and the one-side reference mark, and moving the movable head Moving to a target position on the other side in the X-axis direction, imaging the other side reference mark with the camera at the moved position, detecting the distance between the other side reference mark and the moved position, and the detected one side reference And a step of obtaining an inclination α when the movable head is moved in the X-axis direction from the distance from the mark and the distance from the other-side reference mark.

  It is preferable that the substrate inspection step includes a step of correcting the control values of the X-axis drive unit and the Y-axis drive unit using the inclination α. Further, it is preferable that the correction value is changed by obtaining the inclination α of the Y-axis drive unit according to the movement area unit of the Y-axis drive unit or the difference in the movement direction and the movement distance.

  Further, it is preferable that the reference mark is printed or stamped on a member made of a material having a small thermal expansion coefficient at a period of a distance that falls within the field of view of the camera.

  Another aspect of the present invention includes an XY orthogonal two-axis drive mechanism that enables a movable head carrying a probe to move forward and backward on an XY plane composed of orthogonal X and Y axes. The orthogonal two-axis drive mechanism includes an orthogonal X-axis drive unit and a Y-axis drive unit, and a control device that controls driving of the X-axis drive unit and the Y-axis drive unit. The X-axis drive unit includes a Y-axis drive unit. The Y-axis drive unit is moved in the X-axis direction by an X-axis ball screw provided on one side in the X-axis direction and a linear guide provided at least on the other side. An XY substrate inspection apparatus that moves in an axial direction, wherein reference marks whose coordinate positions are known are provided on one side and the other side in the X-axis direction, respectively, and the control device moves the movable head to a target on one side in the X-axis direction. Place The first reference mark image is picked up by the camera mounted on the movable head at the moved position, the distance between the moved position and the reference mark is detected, and the movable head is moved to the target on the other side in the X-axis direction. Means for detecting the distance between the other side reference mark and the moved position, the distance between the detected one side reference mark and the other side reference Means for obtaining an inclination α when the movable head unit is moved in the X-axis direction based on the distance from the mark.

  The control device preferably includes means for correcting the control values of the X-axis drive unit and the Y-axis drive unit using α in the substrate inspection process. The control device preferably includes means for obtaining the inclination α of the Y-axis drive unit according to the movement region unit of the Y-axis drive unit, or the difference in the movement direction and the movement distance, and changing the correction value.

  Further, it is preferable that the reference mark is printed or stamped on a member made of a material having a small thermal expansion coefficient at a period of a distance that falls within the field of view of the camera.

  According to the present invention, it is possible to correct the displacement of the movable head caused by the Y-axis drive unit tilting with respect to the X-axis, which is caused by the weak rigidity of the ball screw.

It is a figure explaining the control structure of the XY orthogonal two-axis drive mechanism of the XY board | substrate inspection apparatus of this invention. It is a top view explaining the structure in the XY plane of the XY orthogonal biaxial drive mechanism of this invention. It is explanatory drawing which detects the inclination of the Y-axis of the XY board | substrate inspection apparatus in this invention. It is explanatory drawing which detects the inclination of the Y-axis of the XY board | substrate inspection apparatus in this invention. It is a flowchart explaining the operation | movement which detects the inclination of the Y-axis of the XY board | substrate inspection apparatus in this invention. It is a flowchart explaining the operation | movement which correct | amends a target coordinate value at the time of the test | inspection of the XY board | substrate inspection apparatus in this invention. It is a figure explaining the inclination of the Y-axis which arises with the conventional XY board | substrate inspection apparatus.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram for explaining a drive control configuration of an XY orthogonal two-axis drive mechanism of an XY substrate inspection apparatus according to an embodiment of the present invention, and FIG. 2 is an XY orthogonal two-axis drive mechanism. It is a figure which shows the structure in XY plane. In addition, the same number is provided about the part which is common in FIG.

  That is, the XY orthogonal two-axis drive mechanism includes an X-axis drive unit 10 that drives in the X-axis direction that is long in the drawing, and a Y-axis drive unit that drives in the Y-axis direction that is orthogonal to the X-axis and short in the drawing. 14 and a control device 20. The X-axis drive unit 10 includes an X-axis ball screw 11 and an X-axis servo motor 13 that rotationally drives the X-axis ball screw 11. The Y-axis drive unit 14 includes a Y-axis ball screw 15 and a Y-axis servo motor 16 that rotationally drives the Y-axis ball screw. The Y-axis drive unit 14 is equipped with a movable head 17, and the movable head 17 includes a probe 18 and a camera 19.

  Both the X-axis servo motor 13 and the Y-axis servo motor 16 are driven under the control of the control device 20, and the X-axis drive unit 10 moves the Y-axis drive unit 14 in the X-axis direction, and the Y-axis drive unit 14. Moves the movable head 17 in the Y-axis direction, and moves the movable head 17 to the XY coordinate position indicated by the control device 20.

  In FIG. 2, the X-axis drive unit 10 has only one X-axis linear guide 12 represented on the other side of the X-axis ball screw 11, but a linear guide is provided along the X-axis ball screw 11. As a result, the operation of the X-axis drive unit 10 is not changed. In the Y-axis drive unit 14, a Y-axis ball screw 15 is shown. However, the positioning drive device using the ball screw includes one or two linear guides, but is not shown for the sake of simplicity. did.

  The movable head 17 is provided with a probe 18 that can move in a direction orthogonal to the XY plane (Z direction). During substrate inspection, the control device 20 controls the substrate to be inspected at a predetermined position (inspection point). ) To contact the substrate and inspect the substrate. In addition, a camera 19 is attached to the movable head 17, and at the time of inspection, an image of the position where the probe 18 has arrived is acquired and it is determined whether the probe 18 has moved to the designated position on the substrate to be inspected. be able to.

In the present embodiment, in order to detect the inclination α generated when the Y-axis drive unit 14 moves in the X-axis direction, the X-axis direction of the stage 21 on which the substrate to be inspected on the XY plane is mounted. Reference mark rows 22 and 23 in which reference marks whose coordinate positions are known are arranged on both sides, that is, inside the X-axis ball screw 11 and the opposed X-axis linear guide 12.
Here, the reference mark row refers to a reference mark arranged in a line, and each mark is referred to as a reference mark.

  The reference mark rows 22 and 23 are obtained by periodically printing or engraving marks for image recognition. The medium on which the reference mark rows 22 and 23 are printed or engraved is preferably made of a material having a small coefficient of thermal expansion and no deterioration in accuracy due to environmental changes, such as quartz glass. The fiducial mark rows 22 and 23 may be printed or stamped directly on the stage 21 on which the substrate is mounted, or may be affixed to the stage 21 with precise alignment. In addition, since the reference mark may be captured and recognized by the camera 19 of the movable head 17 separately from the stage 21, it may be provided along the X-axis ball screw 11 and the X-axis linear guide 12 separately from the stage 21.

  The reference marks in the reference mark rows 22 and 23 are preferably image processing marks that are captured by the camera 19 and that can calculate deviations by image processing. Such a mark may be a circle or a cross. The reference marks are periodically arranged. When the field of view (view angle) of the camera 19 is about 3 mm, for example, printing and marking are performed at intervals of 3 mm. This is because the distance from the center (optical axis) of the camera can be calculated by image processing if a reference mark enters the field of view of the camera 19. As described above, the reference marks provided in the reference mark rows 22 and 23 do not need a scale like a linear scale used in a precision machine tool or the like. Although the accuracy of the reference mark itself depends on the resolution of the camera 19, it may be about the drive control accuracy of the XY orthogonal biaxial drive mechanism and does not require the accuracy required for the linear scale.

  The reference mark rows 22 and 23 are provided in alignment so that the coordinates of the individual reference marks are known. Since the fiducial mark only needs to be within the field of view of the camera when the movable head moves to the commanded target position, the fiducial mark itself does not need to display a numerical value indicating the coordinate position like the scale, and the same mark A periodic arrangement of Further, since the coordinates of each reference mark are known, if the control device indicates the coordinate value of the reference mark as a command value, the movable head 17 reaches the position of the commanded coordinate value of the reference mark, If there is no deviation, the reference mark is positioned at the center of the field of view of the camera 19. Note that the positional error between the reference mark rows 22 and 23 is small because they are aligned.

Next, with reference to FIGS. 3 and 4 and FIGS. 5 and 6, the detection operation of the tilt generated in the Y-axis drive unit 14 when the Y-axis drive unit 14 is moved in the X-axis direction and the detected tilt are used. The position correction operation in the inspection operation will be described.
FIG. 3 is a diagram for explaining the inclination that occurs when the Y-axis drive unit 14 is moved in the direction of the arrow on the X-axis. FIG. 4 is a diagram for explaining correction to be added to the command value (target coordinate value) when the movable head 17 is instructed to move to an arbitrary position (Xi, Yi) using the detected inclination. FIG. 5 is a flowchart for explaining the operation for detecting the tilt, and FIG. 6 is a flowchart for explaining the operation for controlling the movement with the command value corrected by the detected tilt.

  First, prior to substrate inspection, an inclination that occurs when the Y-axis drive unit 14 is moved in the X-axis direction, which is the long direction, is detected.

  Since the inclination changes depending on the rigidity and assembly accuracy of the X-axis ball screw 11, it is considered that the inclination changes depending on the position of the moving ball screw, that is, the X coordinate position. For this reason, the X-axis direction is divided into a plurality of regions, and the inclination when moving to the plurality of regions is detected. In addition, since it is considered that the distance varies depending on the moving direction and moving distance on the X axis, the inclination may be detected for each moving direction and moving distance. The inclination detected differently depending on the movement position, movement direction, and movement distance is created and stored for each detection item. The values stored in this table are read out during the movement control of the movable head at the time of inspection to correct the command value (target coordinate value).

  First, the X-axis drive unit 10 and the Y-axis drive unit 14 are first driven to adjust the movable head 17 to the origin position (step S1). The origin position is normally provided at the end of the stage 21 and is a position that becomes the base point of the operation range (XY coordinates) of the movable head 17. In this embodiment, a base point may be provided at either one end of the reference mark rows 22 and 23.

Next, the X-axis drive unit 10 is driven to move the Y-axis drive unit 14 and the movable head 17 by an arbitrary amount in the X-axis direction (step 2). For example, at this time, if the Y coordinate on the X-axis ball screw 11 side is set to “0” and the movable head 17 is moved toward the reference mark row 22 side, the Y-axis drive unit 14 is moved in the X-axis direction. As a position, a command value of (X _i , Y ₀ ) is given.

  Next, the camera 19 attached to the movable head 17 is moved to the theoretical coordinate position of the target reference mark in the reference mark row 22 (step S3). For example, an actuator that forms a part of the camera driving mechanism of the movable head 17 that is close to the reference mark row 22 side is operated to perform an operation of positioning the camera 19 at a position where the target reference mark can be taken.

  When the camera 19 reaches the reference mark position of the indicated reference mark row 22, the camera 19 captures the reference mark at the target coordinate position, and the deviation (distance) between the reference mark coordinate (indicated coordinate) and the movable head 17. x1 is detected (step S4). In this detection, for example, the distance between the center position of the reference mark captured as an image and the center axis of the camera 19 is obtained by image processing. If the resolution of the camera 19 is about 1 μm, the amount of deviation between the reference mark on the X-axis ball screw 11 side and the actual position of the movable head 17 can be detected with substantially the same accuracy.

When the detection of the displacement amount x1 on the reference mark row 22 side is completed, the Y-axis drive unit 14 is operated to move the movable head 17 to the reference mark row 23 side, and the camera 19 is moved to the reference mark row 23 side. Move to theoretical coordinates (step S5).
The camera 19 images the reference mark on the reference mark row 23 side, and detects the deviation (distance) x2 between the coordinates of the reference mark and the movable head 17 (step S6). In step S6, the same operation as in step S4 is performed on the reference mark on the reference mark row 23 side.

  From the obtained deviation amount x1 of the reference mark row 22 from the reference mark, the deviation amount x2 of the reference mark row 23 from the reference mark, and the movement distance in the Y direction, that is, the distance between the reference mark rows 22 and 23. Then, α, which is the inclination of the Y-axis drive unit 14 when the Y-axis drive unit 14 moves in the X direction, is obtained (step S7). This inclination α is represented by α = (x2−x1) / Y (Y is the distance between the reference mark row 22 and the reference mark row 23 in the Y-axis direction). Further, α can be a correction coefficient when the movable head 17 is moved in the X-axis direction.

  The inclination α is slightly different depending on the position of the X-axis ball screw 11 (moving position of the movable head), the moving direction of the movable head, the moving distance of the movable head, and the like. The operation of step S6 is repeated (step S8). These acquired α values are stored for each item such as a movement position, direction, and distance in a table for inclination correction.

  The inclination α will be described with reference to FIG. FIG. 3 is a diagram for explaining the inclination α that occurs when the Y-axis drive unit 14 is moved in the direction of the arrow on the X-axis. It is assumed that there is x1 as a deviation amount between the reference mark in the reference mark row 22 and the theoretical coordinates. If the movable head is moved Y toward the reference mark row 23 and the deviation from the theoretical coordinates of the reference mark is x2, the inclination α generated by the movement in the X direction is (x2−x1) / Y. Here, Y in the equation is the distance in the Y-axis direction between the reference mark rows 22 and 23. In FIG. 3, the reference mark on the reference mark row 21 side captured by the camera 19 and the reference mark on the reference mark row 23 side are adjacent to each other. (X2−x1), which is a shift amount caused by the inclination, is approximately 10 μm or less, and the interval between the reference marks is extremely larger than the shift amount in mm units. Since the reference mark imaged by the camera 19 only needs to be known in its coordinate position, the reference mark arrays 22 and 23 may be misaligned in the reference mark array, period, or reference mark array. First, it is only necessary to know the coordinate position of the reference mark for each of the reference mark rows 22 and 23.

  Next, the operation of correcting the position of the movable head 17 during substrate inspection will be described with reference to FIGS.

The value of x _i to be corrected when the movable head 17 is moved to the coordinate position x _i , y _i is the value obtained by moving the inclination at the x _i position obtained in step S7 by y _i. A corrected X coordinate value Δx = αy _i obtained from the Y coordinate (y _i ) and the inclination α of the head 15 is given as a command value for the coordinate position added to x _i . In the correction, the inclination α is extracted from the table corresponding to the target coordinates, a command value in which the coordinate value in the X-axis direction is corrected is created, and the X-axis drive unit 10 is controlled (steps S10 to S13). As shown in FIG. 4, the movable head 16 at a position of x _i, in the Y direction, the deviation [Delta] x of the X direction of the theoretical coordinates when moving y _i, because the [Delta] x = alpha × y _i, this The command value of the coordinate corrected by adding the value to xi is given to the X-axis drive unit 10 (steps S10 to S13).

  Since α that is the correction value is acquired for each movement range (position on the X-axis ball screw), movement direction, and movement distance of the movable head 17, the value of α is used for each control during substrate inspection. It is taken out from the table and corrected with the value of the position (yi) in the Y direction to give a command value.

  Since α has individual differences for each substrate inspection apparatus, it is acquired for each apparatus before the inspection is performed, and a coefficient for correction is obtained and stored in a table. Further, α is periodically taken back and stored, and correction is performed at the time of inspection.

  In the above description, the number of movable heads 17 is described. However, a plurality of movable heads 17 may be provided, and a plurality of Y-axis drive units may be provided for each movable head. At this time, as the X-axis drive unit, an X-axis ball screw is provided for each movable head to move the movable head, and the linear guide may be provided for every two movable heads, or may be shared. Furthermore, the movable head may be provided on both sides of the XY plane to inspect the substrate to be inspected from both sides.

DESCRIPTION OF SYMBOLS 10 X-axis drive unit 11 X-axis ball screw 12 X-axis linear guide 13 X-axis servo motor 14 Y-axis drive unit 15 Y-axis ball screw 16 Y-axis servo motor 17 Movable head 18 Probe 19 Camera 20 Controller 21 Stage 22, 23 Reference mark Column

Claims (8)

An XY orthogonal two-axis drive mechanism that enables a movable head carrying a probe to move forward and backward on an XY plane composed of orthogonal X and Y axes,
The XY orthogonal two-axis drive mechanism includes an orthogonal X-axis drive unit and a Y-axis drive unit, and a control device that controls driving of the X-axis drive unit and the Y-axis drive unit.
The X-axis drive unit moves the Y-axis drive unit in the X-axis direction by an X-axis ball screw provided on one side in the X-axis direction and a linear guide provided at least on the other side,
The Y-axis drive unit is a movable head position correction method for an XY substrate inspection apparatus, wherein the movable head is moved in the Y-axis direction by a Y-axis ball screw,
Install reference marks with known coordinate values on one side and the other side in the X-axis direction,
The movable head is moved to a target position on one side in the X-axis direction, the one-side reference mark is imaged by a camera mounted on the movable head at the moved target position, and the target position and the one-side reference mark are Detecting the distance;
Moving the movable head to a target position on the other side in the X-axis direction, imaging the other-side reference mark with the camera at the moved position, and detecting a distance between the other-side reference mark and the moved position; ,
Obtaining a slope α when the movable head is moved in the X-axis direction from the detected distance from the one-side reference mark and the distance from the other-side reference mark;
A movable head position correction method for an XY substrate inspection apparatus including: In the position correction method of the XY board | substrate inspection apparatus of Claim 1,
A method for correcting a movable head position of an XY substrate inspection apparatus, comprising: a step of correcting a control value of the X-axis drive unit and the Y-axis drive unit using the inclination α in a substrate inspection step . In the movable head position correction method of the XY board | substrate inspection apparatus of Claim 1 or 2,
An inclination of the Y-axis drive unit is acquired according to a movement area unit of the Y-axis drive unit, or a difference in a movement direction and a movement distance, and the correction value is changed. Movable head position correction method. In the position correction method of the XY board | substrate inspection apparatus of any one of Claim 1 to 3,
The fiducial mark is printed or imprinted on a member of a material having a low thermal expansion coefficient at a period of a distance that falls within the camera field of view.
A movable head position correction method for an XY substrate inspection apparatus. An XY orthogonal two-axis drive mechanism that enables a movable head carrying a probe to move forward and backward on an XY plane composed of orthogonal X and Y axes,
The XY orthogonal two-axis drive mechanism includes an orthogonal X-axis drive unit and a Y-axis drive unit, and a control device that controls driving of the X-axis drive unit and the Y-axis drive unit.
The X-axis drive unit moves the Y-axis drive unit in the X-axis direction by an X-axis ball screw provided on one side in the X-axis direction and a linear guide provided at least on the other side,
The Y-axis drive unit is an XY substrate inspection apparatus that moves the movable head in the Y-axis direction by a Y-axis ball screw,
A reference mark having a known coordinate position is provided on one side and the other side in the X-axis direction,
The controller is
The movable head is moved to a target position on one side in the X-axis direction, and the one-side reference mark image is captured by a camera mounted on the movable head at the moved position, and the distance between the moved position and the reference mark is detected. Means,
Means for moving the movable head to a target position on the other side in the X-axis direction, capturing the other-side reference mark image with the camera at the moved position, and detecting a distance between the other-side reference mark and the moved position; ,
Means for obtaining an inclination α when the movable head unit is moved in the X-axis direction from the measured distance from the one side reference mark and the distance from the other side reference mark;
An XY substrate inspection apparatus comprising: In the XY board | substrate inspection apparatus of Claim 5,
The XY substrate inspection apparatus, wherein the control device includes means for correcting control values of the X-axis drive unit and the Y-axis drive unit using α in the substrate inspection process. In the XY board | substrate inspection apparatus of Claim 5 or 6,
The control device includes means for obtaining the inclination α of the Y-axis drive unit according to a movement region unit of the Y-axis drive unit, or a difference in a movement direction and a movement distance, and changing a correction value. XY board inspection equipment. In the XY board | substrate inspection apparatus of any one of Claim 5 to 7,
The XY substrate inspection apparatus, wherein the reference mark is printed or stamped on a member made of a material having a small coefficient of thermal expansion at a period of a distance that falls within the field of view of the camera.

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