KR100819134B1 - 다중 루프 구성으로부터 형성된 인덕턴스 루프를 갖는집적회로 패키지 - Google Patents

다중 루프 구성으로부터 형성된 인덕턴스 루프를 갖는집적회로 패키지 Download PDF

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KR100819134B1
KR100819134B1 KR1020067004265A KR20067004265A KR100819134B1 KR 100819134 B1 KR100819134 B1 KR 100819134B1 KR 1020067004265 A KR1020067004265 A KR 1020067004265A KR 20067004265 A KR20067004265 A KR 20067004265A KR 100819134 B1 KR100819134 B1 KR 100819134B1
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delete delete
package
output
loop
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KR1020067004265A
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English (en)
Korean (ko)
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KR20060115857A (ko
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구이도
허형기
이강윤
이정우
박준배
이경호
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지씨티 세미컨덕터 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
KR1020067004265A 2003-08-28 2004-08-27 다중 루프 구성으로부터 형성된 인덕턴스 루프를 갖는집적회로 패키지 Expired - Fee Related KR100819134B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49835403P 2003-08-28 2003-08-28
US60/498,354 2003-08-28

Publications (2)

Publication Number Publication Date
KR20060115857A KR20060115857A (ko) 2006-11-10
KR100819134B1 true KR100819134B1 (ko) 2008-04-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067004265A Expired - Fee Related KR100819134B1 (ko) 2003-08-28 2004-08-27 다중 루프 구성으로부터 형성된 인덕턴스 루프를 갖는집적회로 패키지

Country Status (8)

Country Link
US (1) US7768097B2 (https=)
EP (1) EP1665383A2 (https=)
JP (1) JP2007504716A (https=)
KR (1) KR100819134B1 (https=)
CN (1) CN1868065A (https=)
CA (1) CA2537259A1 (https=)
TW (1) TW200520121A (https=)
WO (1) WO2005022597A2 (https=)

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US7489022B2 (en) * 2005-08-02 2009-02-10 Viasat, Inc. Radio frequency over-molded leadframe package
CN100511664C (zh) * 2006-07-11 2009-07-08 日月光半导体制造股份有限公司 芯片封装结构
US8035218B2 (en) * 2009-11-03 2011-10-11 Intel Corporation Microelectronic package and method of manufacturing same
US9999129B2 (en) * 2009-11-12 2018-06-12 Intel Corporation Microelectronic device and method of manufacturing same
US9236872B2 (en) 2012-03-12 2016-01-12 Seiko Epson Corporation Voltage-controlled oscillator, signal generation apparatus, and electronic device
KR101888401B1 (ko) * 2012-05-09 2018-08-16 삼성전자주식회사 집적 회로를 위한 인덕터
US10734298B2 (en) * 2018-06-22 2020-08-04 Microchip Technology Incorporated Methods of reinforcing integrated circuitry of semiconductor devices and related semiconductor devices and packages
FR3099667A1 (fr) * 2019-07-29 2021-02-05 Stmicroelectronics S.R.L. Oscillateur commandé en tension à transformateur actif distribué
CN111835308B (zh) * 2020-07-15 2023-09-05 武汉博畅通信设备有限责任公司 一种数控电调滤波器
CN114864531B (zh) * 2021-02-03 2025-12-19 瑞昱半导体股份有限公司 集成电路导线架及其半导体装置

Citations (4)

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US6194774B1 (en) 1999-03-10 2001-02-27 Samsung Electronics Co., Ltd. Inductor including bonding wires
US6323735B1 (en) 2000-05-25 2001-11-27 Silicon Laboratories, Inc. Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors
KR20020069181A (ko) * 2002-05-13 2002-08-29 주식회사 엠씨링크 에프엠 전송신호 발생기용 전압조정 발진기의 집적회로 설계방법
KR20020089226A (ko) * 2002-09-12 2002-11-29 (주) 가인테크 상보성 트랜지스터를 이용한 전압 제어 발진기

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US5175884A (en) * 1990-06-01 1992-12-29 Motorola, Inc. Voltage controlled oscillator with current control
JP2581398B2 (ja) * 1993-07-12 1997-02-12 日本電気株式会社 Ｐｌｌ周波数シンセサイザ
US5739730A (en) * 1995-12-22 1998-04-14 Microtune, Inc. Voltage controlled oscillator band switching technique
EP0829143A1 (en) * 1996-04-02 1998-03-18 Koninklijke Philips Electronics N.V. Portable radio comprising a connectable circuit
GB2317279B (en) * 1996-09-11 2001-01-24 Nec Technologies Frequency synthesisers
US5839184A (en) * 1997-07-10 1998-11-24 Vlsi Technology, Inc. Method for creating on-package inductors for use with integrated circuits
US5909050A (en) * 1997-09-15 1999-06-01 Microchip Technology Incorporated Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
US5886393A (en) * 1997-11-07 1999-03-23 National Semiconductor Corporation Bonding wire inductor for use in an integrated circuit package and method
US6034423A (en) * 1998-04-02 2000-03-07 National Semiconductor Corporation Lead frame design for increased chip pinout
US6137372A (en) * 1998-05-29 2000-10-24 Silicon Laboratories Inc. Method and apparatus for providing coarse and fine tuning control for synthesizing high-frequency signals for wireless communications
US6194947B1 (en) * 1998-07-24 2001-02-27 Global Communication Technology Inc. VCO-mixer structure
US6335952B1 (en) * 1998-07-24 2002-01-01 Gct Semiconductor, Inc. Single chip CMOS transmitter/receiver
KR100877253B1 (ko) * 1999-08-02 2009-01-07 콸콤 인코포레이티드 잡음 면역성을 가진 다중 대역 전압제어 발진기를 위한방법 및 장치
JP2002076250A (ja) * 2000-08-29 2002-03-15 Nec Corp 半導体装置
US6538336B1 (en) * 2000-11-14 2003-03-25 Rambus Inc. Wirebond assembly for high-speed integrated circuits
DE10061241A1 (de) * 2000-12-08 2002-06-27 Infineon Technologies Ag Oszillatorschaltung
US6803665B1 (en) * 2001-11-02 2004-10-12 Skyworks Solutions, Inc. Off-chip inductor
US6621140B1 (en) * 2002-02-25 2003-09-16 Rf Micro Devices, Inc. Leadframe inductors
US6876266B2 (en) * 2002-06-10 2005-04-05 Gct Semiconductor, Inc. LC oscillator with wide tuning range and low phase noise

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6194774B1 (en) 1999-03-10 2001-02-27 Samsung Electronics Co., Ltd. Inductor including bonding wires
US6323735B1 (en) 2000-05-25 2001-11-27 Silicon Laboratories, Inc. Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors
KR20020069181A (ko) * 2002-05-13 2002-08-29 주식회사 엠씨링크 에프엠 전송신호 발생기용 전압조정 발진기의 집적회로 설계방법
KR20020089226A (ko) * 2002-09-12 2002-11-29 (주) 가인테크 상보성 트랜지스터를 이용한 전압 제어 발진기

Also Published As

Publication number Publication date
JP2007504716A (ja) 2007-03-01
TW200520121A (en) 2005-06-16
US7768097B2 (en) 2010-08-03
US20050045986A1 (en) 2005-03-03
KR20060115857A (ko) 2006-11-10
CA2537259A1 (en) 2005-03-10
EP1665383A2 (en) 2006-06-07
WO2005022597A3 (en) 2005-08-04
CN1868065A (zh) 2006-11-22
WO2005022597A2 (en) 2005-03-10

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