KR100817663B1 - Perforating method of print wiring board, print wiring board, board for boc and perforating device - Google Patents

Abstract

A first hole for forming the through hole 22 in the BOC substrate 20 by lowering the punch 622 while the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642. After the punch 622 is raised while the step and the BOC substrate 20 are sandwiched between the stripper plate 630 and the die plate 642, a punch hole 632 is formed from the punch die 620 side. The punch 622 while the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642, and the second step of injecting compressed air into the through hole 22 through And a third step of descending again.

The perforated chip generated on the inner surface of the through hole 22 can be more completely removed, and the attachment of the perforated chip to the upper surface of the BOC substrate 20 can be suppressed and the through hole 22 can be formed. It is a method of punching a printed wiring board that makes the mechanism and method simple.

Stripper plate, die plate, BOC substrate, punch, punch mold

Description

Perforation method of printed wiring board, printed wiring board, PCB for PCB and perforating device {PERFORATING METHOD OF PRINT WIRING BOARD, PRINT WIRING BOARD, BOARD FOR BOC AND PERFORATING DEVICE}

The present invention relates to a method for punching a printed wiring board, a printed wiring board, a substrate for BOC and a punching device.

Recently, in the field of memory, CSP (Chip Scale Package), which can cope with miniaturization, large capacity, and high-speed data transfer, has attracted attention, and among them, BOC (Board-On / Board) that can use wire bonding technology during assembly. A semiconductor device having a chip) structure is particularly attracting attention. It is typical as a printed wiring board used for such a semiconductor device (henceforth simply a "substrate"), and the glass cloth base was impregnated with BT (bismarade triazine) resin, epoxy resin, imide resin, or the like. There exists a board | substrate which has a structure which clamped the base layer to the resist layer from both surfaces.

As a method of forming a hole such as a release hole in a substrate having such a structure, a hole forming method using a drill and a hole forming method using a press or the like are used. The hole forming processing method by drill has the disadvantage that the productivity is high and the machining cost is high because the hole roughening and shape of the inner surface of the drill are excellent, while the hole is drilled by the drill.

On the other hand, since the hole forming processing method using a press or the like forms a through hole in the substrate by punching using a punch and a die, the hole forming processing can be performed in a short time, so that there is an advantage of high productivity and low processing cost. have. Moreover, there exists an advantage of being able to simplify complex hole forming processes, such as a mold release hole (for example, refer patent document 1 and 2).

Patent Document 1: Japanese Utility Model Application Publication No. Hei 1-28915

Patent Document 2: Japanese Patent Application Laid-Open No. 62-241700

The drilling method described in Patent Literature 1 includes a first cutting edge having a diameter equal to the inner diameter of a through hole formed in a substrate, and a first cutting edge having a diameter slightly smaller than the inner diameter of the through hole located at a distal end portion of the first cutting edge. It is a method of performing a hole forming process using the punch which has 2 cutting edges. Thereby, the punching chip which generate | occur | produces on the inner surface of a through hole by punching by a 2nd cutting edge can be scraped off by the punching of a 1st cutting edge, and the punching chip which generate | occur | produced on the inner surface of a through hole can be removed. However, since a new punched chip is generated on the inner surface of the through hole by punching the first cutting edge, there is a problem that the punched chip generated on the inner surface of the through hole cannot be completely removed.

On the other hand, the punching method of patent document 2 is a method of finally forming a through-hole in a board | substrate by punching a board | substrate gradually by reciprocating a several times by a small distance, without punching a board | substrate at once once. This makes it possible to reduce the surface roughness of the inner surface of the through hole. However, since the fine punched chip generated in the process of reciprocating the punch a plurality of times has no place to escape until the hole is punched as a through hole, the punched chip without the escaped place is attached to the upper surface of the substrate. there is a problem.

In addition, since the punch is reciprocated a plurality of times in small distances to gradually punch the substrate, it is necessary to appropriately set and change the number of times of punching and the amount of stroke punched in accordance with the material and thickness of the substrate to form a through hole. There is a problem that it is not easy to simplify the mechanism and method.

Thus, the present invention has been made to solve the above problems, and it is possible to more completely remove the punched chip generated on the inner surface of the through hole, and to prevent the punched chip from adhering to the upper surface of the substrate. It is an object of the present invention to provide a method for punching a printed wiring board, in which the mechanism and method for forming the through hole are simplified to be simple. Moreover, it aims at providing the printed wiring board and BOC board | substrate with which the punching process was performed using this excellent method of punching a printed wiring board. Moreover, it aims at providing the perforation apparatus which can manufacture such an excellent printed wiring board.

(1) The punching method of the printed wiring board of this invention uses a punching apparatus provided with the punch metal mold | die which has a punch and a stripper plate, and the die metal mold | die which has a die plate, and performs a punching process to a printed wiring board. A method of perforating a printed wiring board, the first step of forming a through hole in the printed wiring board by lowering the punch in a state where the printed wiring board is sandwiched between the stripper plate and the die plate. After raising the punch while the printed wiring board is sandwiched between the stripper plate and the die plate, compressed air is injected into the through hole from the punch die side through the punch hole in the stripper plate. As a result, the perforated chip existing inside the through hole The second step of removing through the die hole in the die plate, and the punch is lowered again while the printed wiring board is sandwiched between the stripper plate and the die plate, the inner side of the through hole And a third step of removing the remaining punched chip through the die hole in this order.

For this reason, according to the punching method of the printed wiring board of the present invention, first, the punch is lowered in the first step to form a through hole in the substrate, and after the punch is raised in the second step, the compressed air is injected into the through hole. Since the punched chip existing inside the hole is removed via the die hole, and the punch is lowered again in the third step, the punched chip remaining inside the through hole is removed via the die hole. Even if the punched chip remains on the inner surface of the through hole at the time, the punched chip remaining on the inner surface of the through hole can be removed cleanly by lowering the punch again in the third step. As a result, the perforated chip generated in the inner surface of the through hole can be more completely removed.

Moreover, according to the punching method of the printed wiring board of this invention, since a series of operation | movement from said 1st step to 3rd step is performed in the state which always sandwiched the board | substrate between the stripper plate and the die plate, The upper surface of the substrate is always covered with the stripper plate, so that the perforated chip can be prevented from adhering to the upper surface of the substrate.

In addition, the punching method of the printed wiring board of this invention does not need to change suitably the frequency | count and stroke amount punched with a punch according to the material and thickness of a board | substrate like the case of the punching method of patent document 2, Since a straight through hole is formed by a total of two simple punching operations in the first step and the third step, it is easy to simplify the mechanism and method for forming the through hole.

For this reason, the punching method of the printed wiring board of this invention can remove the punching chip which generate | occur | produced in the inner surface of a through hole more completely, and can suppress that a punching chip adheres to the upper surface of a board | substrate, It is a method of punching a printed wiring board, which simplifies the mechanism and method for forming.

Herein, the term "perforated chip" in the present invention refers to a chip generated when a through hole is formed in the printed wiring board, and does not mean only a chip of the base layer generated when punching the printed wiring board. The metal material (for example, metal) of the wiring part formed in the vicinity of a hole scatters in the inside of a through hole at the time of a hole formation process, and also contains the fine metal chip which arises because the scattered metal material is a main cause. will be. Although such a metal chip adheres to the wiring part formed on the board | substrate, there exists a possibility that a short may arise, According to the punching method of the printed wiring board of this invention, it can suppress that such metal chip adheres also to the upper surface of a board | substrate.

(2) In the punching method of the printed wiring board as described in said (1), after the said 3rd step, after raising the said punch in the state which clamped the said printed wiring board between the said stripper plate and the said die plate, And a fourth step of removing the punched chip existing inside the through hole through the die hole by injecting compressed air back into the through hole from the punch die side via the punch hole. .

In this way, even if a new punched chip is generated in the inner surface of the through hole by performing the third step, the punched die is injected again by injecting compressed air into the through hole after raising the punch in the fourth step. Since it is possible to remove through a hole, the perforated chip remaining in the inner surface of the through hole can be removed more cleanly.

In addition, the operation of the fourth step is performed in a state where the substrate is sandwiched between the stripper plate and the die plate as in the case of the operation from the first step to the third step, so that the perforated chip is placed on the upper surface of the substrate. The adhesion can be suppressed.

In the punching method of the printed wiring board as described in said (1) or (2), it is preferable that the inner diameter of the said punch hole and the outer diameter of the said punch are substantially the same.

In this way, the area of the exposed part of the upper surface of the substrate, which is not covered by the stripper plate, can be reduced, so that the attachment of the perforated chip to the upper surface of the substrate can be further suppressed.

Here, "the inner diameter of a punch hole and the outer diameter of a punch are substantially the same" means that only the minimum clearance required between the inner circumferential surface of the punch hole and the outer circumferential surface of the punch is set.

(3) In the punching method of the printed wiring board as described in said (1) or (2), the inner surface of the said punch hole has the 1st inner peripheral part which consists of an inner surface shape corresponding to the outer shape of the said punch, and the said 1st inner A second inner circumferential portion provided at an upper end of the main portion and having a cross-sectional shape larger than the cross sectional shape of the first inner circumferential portion, wherein the distal end portion of the punch is formed from the first inner circumference portion in the punch hole. When ascending to, it is preferable that the compressed air is configured to be injected into the through hole through the punch hole.

By this method, the punch functions as a so-called air valve, and compressed air is not injected into the through hole when the tip portion of the punch is at a position between the die hole and the first inner circumferential portion of the punch hole. When the tip of the punch rises from the first inner circumference to the second inner circumference, compressed air is transferred to the through hole. This eliminates the need for ON / OFF control of the compressed air at high speed in accordance with the vertical movement of the punch at high speed, thereby facilitating control and facilitating the speedup of the punching.

In this case, the inner surface shape of the second inner circumferential portion may be an inner surface shape formed of a surface perpendicular to the surface facing the substrate in the stripper plate, or a predetermined angle with respect to the surface facing the substrate in the stripper plate. The inner surface shape which consists of a photographic taper surface may be sufficient.

(4) In the punching method of the printed wiring board as described in said (3), the said stripper plate has a flow path for injecting compressed air toward the said through hole, and the said 2nd in the said punch hole in communication with the said flow path. It is preferable that an air chamber provided to surround the upper end of the inner circumference portion is formed.

In this way, since compressed air is injected over the entire circumference of the inner surface of the through hole, it is possible to cleanly remove the punched chip remaining on the inner surface of the through hole.

In addition, since the compressed air injected from the flow path can be temporarily stored in the air chamber, the pressure and flow rate of the compressed air injected into the through hole can be kept substantially constant. For this reason, in the above-mentioned 2nd step or 4th step, since the uniform compressed air uniformized with respect to the through-hole is conveyed, the perforated chip which remain | survives in the inner surface of a through-hole can be removed more cleanly.

(5) In the punching method of the printed wiring board in any one of said (1)-(4), the bottom dead center of the said punch in said 1st step, and the bottom dead center of the said punch in said 3rd step Is preferably about the same.

In the punching method described in Patent Document 2, since the punch is reciprocated a plurality of times by a small distance to gradually punch the substrate, it is necessary to change the bottom dead center (and top dead center) of the punch every stroke, and as a result, the through hole There has been a problem that the mechanism and method for forming the system become more complicated. However, the above method eliminates the need to change the bottom dead center of the punch in the first step and the third step, making it easier to simplify the mechanism and method for forming the through hole.

(6) In the punching method of the printed wiring board in any one of said (1)-(5), it is preferable that the convex part is formed in the circumference | surroundings of the said die hole in the said die plate.

By this method, since the board | substrate part which contacts the peripheral part of a die hole is clamped with a big force compared with other board | substrate part, generation | occurrence | production of the nonuniformity in the peripheral part of a through hole can be suppressed, and the quality This good printed wiring board can be manufactured.

For example, when a through hole is formed in the BOC substrate, if the resist layer is coated on the die die side of the BOC substrate, the resist layer is relatively soft. Unevenness etc. may arise in a peripheral part. However, by the above-described method, since the substrate portion in contact with the peripheral portion of the die hole is fitted with a larger force than the other substrate portion, the occurrence of nonuniformity in the peripheral portion of the through hole can be suppressed. This makes it possible to manufacture high quality BOC substrates.

(7) In the punching method of the printed wiring board as described in any one of said (1)-(5), it is also preferable that the groove | channel is formed in the circumference | surroundings of the said die hole in the said die plate.

In this manner as well, the substrate portion in contact with the peripheral portion of the die hole is clamped with a greater force than other substrate portions, similarly to the effect of the above (6). The occurrence of nonuniformity can be suppressed, and a good quality printed wiring board can be manufactured.

(8) In the punching method of the printed wiring board as described in any one of said (1)-(7), it is preferable that the convex part is formed in the circumference | surroundings of the said punch hole in the said stripper plate.

In this way, since the upper surface of the substrate can be reliably covered along the through hole (inner surface of the through hole), it is possible to further suppress the attachment of the perforated chip to the upper surface of the substrate.

For example, when a through hole is formed in a BOC board | substrate, when a perforation chip | tip adheres to the wiring part formed in the vicinity of a through hole, there exists a possibility that a short may arise. However, by the above method, since the upper surface of the substrate can be reliably covered along the through hole (inner surface of the through hole), it is possible to further suppress the attachment of the perforated chip to the wiring portion formed near the through hole. .

(9) In the method for drilling a printed wiring board according to any one of the above (1) to (8), in the first step, the wiring part forming surface of the printed wiring board is the stripper plate side. It is preferable to form a through hole in the printed wiring board by lowering the punch while the printed wiring board is sandwiched between the stripper plate and the die plate.

By such a method, the through hole can be formed with high accuracy based on the pattern of the wiring part formation surface in a printed wiring board.

(10) In the punching method of the printed wiring board as described in any one of said (1)-(9), a some punch is arrange | positioned at the said metal mold | die for punch, and the said metal mold | die corresponds to the said several punch. It is preferable that a plurality of die holes are arranged.

In this way, a plurality of excellent through-holes in which the perforated chips generated on the inner surface of the through-holes are more completely removed can be formed in a single perforation operation, thereby increasing the productivity.

(11) In the punching method of the printed wiring board in any one of said (1)-(10), it opposes the surface which opposes the printed wiring board in the said stripper plate, or the printed wiring board in the said die plate. It is preferable that resin is coated on either or both of the surfaces.

By such a method, it becomes possible to suppress the occurrence of undesirable scratches on the surface of the printed wiring board when the printed wiring board is disposed between the punch die and the die die, or sandwiched between the stripper plate and the die plate. .

For example, the BOC substrate has a structure in which a wiring portion is formed on one surface and a resist layer is coated, and a resist layer is coated on the other surface. By forming the through hole with respect to the BOC substrate, the above-described method makes it possible to suppress the occurrence of undesirable scratches on the wiring portion and the resist layer formed on the surface of the BOC substrate, thereby providing an excellent BOC substrate. It can be formed.

In this case, as resin used for coating, a polyurethane resin can be used suitably.

In addition, the thickness of the resin to be coated is preferably 5 µm to 40 µm, more preferably 10 µm to 30 µm.

(12) In the punching method of the printed wiring board in any one of said (1)-(11), the said punching apparatus is a board | substrate supply apparatus which can supply a printed wiring board between the said punch metal mold and the said die metal mold | die. A movable table that is movable in the y-axis direction along the substrate transport direction in the substantially horizontal plane and in the x-axis direction orthogonal to the substrate transport direction, and also rotatable around the z-axis perpendicular to the substantially horizontal plane A perforation device further comprising a substrate supplying device having an image pickup device and an image pickup device, wherein a predetermined position on a printed wiring board is photographed by the imaging device, and the printed wiring is based on the photographing result. After calculating the shift amount around the z axis in the substrate, the moving table is rotated around the z axis according to the shift amount around the z axis, The angle adjusting step of adjusting a printed wiring board to an accurate angle with respect to the punch metal mold | die, and the predetermined position in a printed wiring board is image | photographed with the said imaging element, and based on the imaging result, the said movable stand is moved to the x-axis direction Or it is preferable to include the drilling process which performs a perforation to a printed wiring board in this order in the state which moved and adjusted to either or both of the y-axis direction, and arrange | positioned a printed wiring board in the exact puncturing execution position.

By such a method, the predetermined position in a printed wiring board is image | photographed with an imaging element, and the shift amount around the z axis in a printed wiring board is calculated based on the imaging result, and the shift amount around a z axis is calculated. According to this, the movable table can be rotated around the z-axis to adjust the printed wiring board at an accurate angle with respect to the punch die, and then the perforation can be performed on the printed wiring board. Even if it is not arrange | positioned at an accurate angle, it becomes possible to perform a perforation with high precision.

In addition, since it is also possible to move and adjust the moving table in either or both of the x-axis direction and the y-axis direction every time the punching is performed on the printed wiring board, the punching can be performed with high precision.

In this case, the angle adjustment step may be performed at least once when the printed wiring board is supplied between the punch die and the die die. On the other hand, the movement adjustment of the moving table in either or both of the x-axis direction and the y-axis direction is performed at least once per drilling step.

(13) In the method for punching a printed wiring board according to (12), the substrate supply device is a substrate supply device further having two clampers for holding the printed wiring board, and the punching device is located above the moving table. A puncturing apparatus, which is provided between the two clampers in the apparatus and moves along the x-axis direction together with the movable table, further comprising a substrate guide plate for guiding a printed wiring board from a substrate standby position toward a puncturing position. It is preferable that the said two clampers are comprised so that the printed wiring board mounted on the said board | substrate guide plate may hold the printed wiring board on both sides in the x-axis direction of the said board | substrate guide plate.

In this way, since the board guide plate for guiding the printed wiring board is provided so as to move along the x-axis direction between the two clampers above the moving table and together with the moving table, the printed wiring board is a substrate. The guide plate is smoothly guided along the x-axis direction and along the y-axis direction on the substrate guide plate.

In this case, it is preferable that the height of the upper surface of the substrate guide plate is set at a position slightly higher (for example, about 0.050 mm to 2.0 mm) than the height of the upper surface of the die die.

In the punching method of the printed wiring board as described in said (13), it is preferable that the said two clampers are comprised so that each edge of the board | substrate standby position side end part in a printed wiring board may respectively hold | grip.

By such a method, it becomes possible to puncture a wide area | region from the board | substrate standby position side end part in a printed wiring board to a punching execution position side end part.

In this case, if the printed wiring board having been punched out is removed from the two clampers, gripped by the two clampers while being rotated 180 degrees in the horizontal direction, and punched again, the entire area of the printed wiring board is It becomes possible to carry out perforation.

(14) In the method for punching a printed wiring board as described in (13) above, the punching device is provided around the die die, and is provided with another fixed substrate guide plate for smoothly guiding the printed wiring board. It is preferable that it is a perforation apparatus further equipped.

In the case where the printed wiring board is rigid, the other substrate guide plates described above are not necessarily required. However, when a printed wiring board is flexible, when sending a printed wiring board from a board | substrate guide board to the front area | region, it originates in the vertical direction of the both ends of the x-axis direction and one end of a y-axis direction in a printed wiring board which fall vertically by gravity. As a result, warpage or wrinkles may occur in the printed wiring board. Even in such a case, as in the method of punching the printed wiring board described in the above (14), by providing another fixed board guide plate around the die die, it is possible to effectively suppress the occurrence of warpage and wrinkles of the printed wiring board. It becomes possible to send a printed wiring board smoothly.

In this case, it is preferable that the height of the upper surface of another board | substrate guide plate is set to the position slightly higher (for example, about 0.050 mm-about 2.0 mm) than the height of the upper surface of die die.

(15) In the punching method of the printed wiring board as described in any one of said (12)-(14), the said punching process is a printed wiring board so that the predetermined position in a printed wiring board may be arrange | positioned within the imaging range of the said imaging element. After moving the film, the first step of photographing the printed wiring board with the imaging device and calculating the amount of movement in the x-axis direction and the y-axis direction on the printed wiring board based on the photographing result, and the x-axis After moving and adjusting the said movable stand to either or both of the x-axis direction and the y-axis direction according to the movement amount of a direction and a y-axis direction, and press-contacting a printed wiring board with the said die plate by the said stripper plate, and then printed wiring It is preferable to include in this order the 2nd process of forming a through-hole by carrying out punching to the perforation site | part of a board | substrate.

According to this method, since the substrate can be punched after the moving table is moved or adjusted in either the x-axis direction or the y-axis direction according to the required amount of movement, it is necessary to perform high-precision drilling. It becomes possible.

(16) In the punching method of the printed wiring board as described in said (15), in the said 1st process, instead of calculating the moving amount of the x-axis direction and the y-axis direction in a printed wiring board, in a printed wiring board, Calculates the amount of movement in the x-axis direction and the y-axis direction, and the amount of deviation around the z-axis. In the second step, the movable table is moved in the x-axis direction or the y-axis direction according to the amount of movement in the x-axis direction and the y-axis direction. Instead of adjusting the movement in any one or both of the above, the moving table is moved in the X-axis direction and adjusted in the y-axis direction according to the shift amount in the x-axis direction and the y-axis direction and the shift amount around the z-axis. It is preferable to perform at least one adjustment of the movement adjustment or the rotation adjustment around the z axis.

By setting it as such a method, it becomes possible to perform puncturing more precisely than the case of the puncturing method of the printed wiring board as described in said (15).

(17) In the punching method of the printed wiring board as described in said (15) or (16), after a said 2nd process, a printed wiring board is arrange | positioned so that the through hole formed by the said 2nd process may be arrange | positioned within the imaging range of the said imaging element. After moving a predetermined distance, it is preferable to further include the 3rd process of photographing a printed wiring board with the said imaging element, and confirming whether the said through hole is formed in the correct position.

By this method, it is possible to confirm whether or not the through hole formed by the second step is formed at the correct position before performing the next drilling operation. That is, for example, when the through-hole formed by the 2nd process is not formed in the correct position, it becomes possible to stop performing drilling to a printed wiring board once, and to take necessary measures.

(18) In the punching method of the printed wiring board as described in any one of said (12)-(14), the said punching process supplies a printed wiring board to a punching execution position, and prints a printed wiring board with the said stripper plate. 1a process of image | photographing a printed wiring board with the said imaging element after pressure-contacting a die plate, and calculating the shift amount of the x-axis direction and the y-axis direction in a printed wiring board based on the imaging result, When the shift amount in the x-axis direction and the y-axis direction is within the allowable range, the printed wiring board is punched in a state where the printed wiring board is pressed onto the die plate, and the x-axis direction and the y-axis direction When the deviation amount of is not within the allowable range, the pressure contact state of the printed wiring board by the stripper plate is released, and the x After moving and adjusting the said movable stand to either or both of the x-axis direction or the y-axis direction according to the shift amount of an axial direction and a y-axis direction, and press-contacting a printed wiring board with the said die plate by the said stripper plate, It is preferable to include the 2a process of perforating a printed wiring board and forming a through hole in this order.

According to this method, since the movable wiring is moved and adjusted in either or both of the x-axis direction and the y-axis direction in accordance with the actual shift amount, perforation can be performed on the printed wiring board. It becomes possible. In this case, since the shift amount is calculated with high accuracy while the printed wiring board is press-contacted with the stripper plate, it is possible to perform more precise drilling.

(19) In the method for punching a printed wiring board according to any one of the above (12) to (14), the punching step supplies the printed wiring board to a punching position, and prints the printed wiring board by the stripper plate. A first step of photographing the printed wiring board with the imaging device after press-contacting the die plate, and calculating the deviation amounts in the x-axis direction and the y-axis direction on the printed wiring board based on the photographing result; When the shift amounts in the x-axis direction and the y-axis direction are within an allowable range, the printed wiring board is punched in the state where the printed wiring board is pressed onto the die plate, and the x-axis direction and the y-axis When the amount of shift in the direction is not within the allowable range, the pressure contact state to the printed wiring board by the stripper plate is released, The movable table is moved and adjusted in either or both of the x-axis direction and the y-axis direction according to the amount of displacement in the x-axis direction and the y-axis direction, and the printed wiring board is pressed against the die plate by the stripper plate. Thereafter, the printed wiring board is photographed by the imaging device, and based on the photographing result, the shift amounts in the x-axis direction and the y-axis direction in the printed wiring board are calculated, and the x-axis direction and the y-axis direction Until the shift amount is within the allowable range, the process of crimping / releasing, moving adjustment, press welding, photographing, and shift amount calculation are repeated, and then, when the shift amount in the x-axis direction and y-axis direction is within the allowable range, the printed wiring board In this order, the second wiring step of forming a through hole by punching the printed wiring board in the state of being pressed onto the die plate is included in this order. desirable.

By setting it as such a method, since the fine movement adjustment process of a mobile platform can be repeated until a shift | deviation amount is suppressed in an allowable range, it is more accurate to perform a perforation of the printed wiring board as described in said (18). It becomes possible.

(20) In the method for punching a printed wiring board according to any one of (l2) to (14), in the punching step, the printed wiring board is supplied to the imaging device after the printed wiring board is supplied to the punching execution position. 1b process which calculates the shift amount of the x-axis direction and the y-axis direction in a printed wiring board based on the imaging result, and the shift amount of the said x-axis direction and the y-axis direction exists in an allowable range. In this case, after the printed wiring board is press-contacted to the die plate by the stripper plate, perforation is performed on the printed wiring board, and the x-axis when the shift amount in the x-axis direction and the y-axis direction is not within an acceptable range. Moving the moving table in either or both of the x-axis direction and the y-axis direction according to the amount of displacement in the direction and the y-axis direction, After welding the printed circuit board by the site to the die plate, it is preferred to include the step 2c to perform puncturing on the printed circuit board to form the through hole in this order.

By using such a method, since the movable wiring is moved and adjusted in either or both of the x-axis direction and the y-axis direction in accordance with the actual shift amount, perforation can be performed on the printed wiring board, and thus the method described in (18) above. As in the case of the punching method of a printed wiring board, it becomes possible to perform a high precision punching.

(21) In the punching method of the printed wiring board as described in any one of said (12)-(14), after the said punching process supplies a printed wiring board to a punching execution position, a printed wiring board is made by the said imaging element. 1b process which calculates the shift amount of the x-axis direction and the y-axis direction in a printed wiring board based on the imaging result, and the shift amount of the said x-axis direction and the y-axis direction is in an allowable range. In the following, when the printed wiring board is press-contacted to the die plate by the stripper plate, perforation is performed on the printed wiring board, and the shift amount in the x-axis direction and the y-axis direction is not within the allowable range. And moving the moving table in either or both of the x-axis direction and the y-axis direction in accordance with the amount of displacement in the y-axis direction to raise the printed wiring board. When the image is taken by the image pickup device, the amount of deviation in the x-axis direction and the y-axis direction on the printed wiring board is calculated based on the photographing result, and the amount of deviation in the x-axis direction and the y-axis direction is within the allowable range. After repeating the steps of the movement adjustment, the photographing, and the deviation amount calculation, and the deviation amount in the x-axis direction and the axial direction is within the allowable range, after pressing the printed wiring board to the die plate by the stripper plate. It is preferable to include in this order the 2d process of perforating a printed wiring board and forming a through hole.

By setting it as such a method, since the fine movement adjustment process of a mobile base can be repeated until a shift | deviation amount is suppressed in an allowable range, it is more accurate to perform a perforation of the printed wiring board as described in said (20). It becomes possible.

(22) In the punching method of the printed wiring board as described in any one of said (18)-(21), in the said 1a process or the said 1b process, the x-axis direction and the y-axis direction in a printed wiring board Instead of calculating the amount of misalignment, the amount of misalignment in the x-axis direction and the y-axis direction and the amount of misalignment around the z-axis in the printed wiring board are calculated, and the second step, the second step b, and the second step c are obtained. Or in the said 2nd process, instead of moving and adjusting the said movable stand to either or both of the x-axis direction and the y-axis direction according to the shift amount of the said x-axis direction and the y-axis direction, the said x-axis direction and According to the shift amount in the y-axis direction and the shift amount around the z-axis, at least one of the adjustment of the movement table in the x-axis direction, the adjustment in the y-axis direction or the rotation adjustment in the z-axis direction is performed. Would Is recommended.

By setting it as such a method, it becomes possible to perform puncturing more precisely than the case of the puncturing method of the printed wiring board as described in said (18)-(21).

(23) The printed wiring board of the present invention is characterized in that the punching process is performed using the punching method of the printed wiring board according to any one of the above (1) to (22).

For this reason, since the punching process is performed using the punching method of the printed wiring board which can remove the punching chip which generate | occur | produced in the inner surface of the through-hole more completely, the punching chip which generated from the inner surface of the through-hole is It becomes an excellent printed wiring board removed more completely.

Further, in the printed wiring board of the present invention, since the punching process is performed by using the punching method of the printed wiring board which can suppress the attachment of the punched chip to the upper surface of the substrate, the attachment of the punched chip to the upper surface of the substrate is suppressed. It becomes a printed wiring board with high quality.

Moreover, since the punching process is performed using the punching method of the printed wiring board which is easy to simplify the mechanism and method for forming a through hole, the printed wiring board of this invention becomes a cheap printed wiring board.

(24) The BOC board | substrate of this invention is punching-processed using the punching method of the printed wiring board in any one of said (1)-(22), It is characterized by the above-mentioned.

For this reason, in the BOC board | substrate of this invention, since the punching process is given using the punching method of the printed wiring board which can remove the punching chip which generate | occur | produced in the inner surface of a through hole easily, the punching chip which generate | occur | produced from the inner surface of a through hole is carried out. It becomes an excellent BOC board | substrate removed more completely than this.

Further, in the BOC substrate of the present invention, since the punching process is performed using the punching method of the printed wiring board which can suppress the punching chip from adhering to the upper surface of the substrate, it is suppressed that the punching chip is attached to the upper surface of the substrate. It becomes the board | substrate for BOC with high quality.

Moreover, since the punching process is performed using the punching method of the printed wiring board which is easy to simplify the mechanism and method for forming a through hole, the BOC board | substrate of this invention becomes a cheap BOC board | substrate.

(25) The punching device of the present invention comprises a punching die having a punch and a stripper plate and a die for having a die plate, and is a punching device for punching a printed wiring board, wherein the stripper plate and the die A first function of forming a through hole in the printed wiring board by lowering the punch in a state where the printed wiring board is sandwiched between the plates; and supporting the printed wiring board between the stripper plate and the die plate. After raising the punch in a state where it is in the state, compressed air is injected into the through hole through the punch hole in the stripper plate on the punch die side, so that the drill chip existing inside the through hole is cut into the die. Second machine to remove via die hole in plate And a third function of removing the punched chip remaining inside the through hole through the die hole by lowering the punch again while the printed wiring board is sandwiched between the stripper plate and the die plate. It characterized by having a.

For this reason, according to the punching device of the present invention, first, the punch is lowered to form the through hole in the substrate by the first function, and the punch is raised by the second function, and then the compressed air is injected into the through hole. Since the punched chip existing inside is removed via the die hole, and the punch is lowered again by the third function, the punched chip remaining inside the through hole is removed via the die hole. Even when the punched chip remains on the inner surface of the through hole, the punched chip remaining on the inner surface of the through hole can be cleanly removed by lowering the punch again by the third function. As a result, an excellent printed wiring board can be produced in which the perforated chip generated from the inner surface of the through hole is more completely removed.

Further, according to the punching device of the present invention, the first and third functions described above are to be operated while the substrate is always sandwiched between the stripper plate and the die plate, so that the upper surface of the substrate is always the stripper plate. The high quality printed wiring board with which the perforated chip adhered to the upper surface of a board | substrate is suppressed can be manufactured.

In addition, according to the punching device of the present invention, it is not necessary to set and change the number of punches and the stroke amount appropriately in accordance with the material and thickness of the substrate as in the case of the punching device using the punching method described in Patent Document 2. Since the straight through hole is formed by two simple punching operations by the first function and the third function, it is easy to simplify the mechanism and method for forming the through hole. For this reason, a cheap printed wiring board can be manufactured.

1 is an overall plan view of a BOC substrate 20.

2 (a) and 2 (b) are enlarged and schematic views of a part of the BOC substrate 20.

3 is a diagram schematically showing the semiconductor device 1.

4 is a front view showing the drilling device 100 according to the first embodiment.

FIG. 5 is a plan view of the drilling device 100 according to the first embodiment.

Fig. 6 is a side view showing the drilling device 100 according to the first embodiment.

7 is a plan view showing the substrate supply apparatus 400.

8 is a side view showing the substrate supply apparatus 400.

9 is a front view showing the substrate supply apparatus 400.

10A to 10C are diagrams for explaining the punch die 620.

11A to 11C are diagrams for explaining the die mold 640.

12A and 12B are diagrams schematically illustrating the structures of the punch die 620 and the die die 640.

FIG. 13 is a flowchart for explaining the punching method of the printed wiring board according to the first embodiment. FIG.

Fig. 14 is a flowchart for explaining the perforation method of the printed wiring board according to the first embodiment.

15A to 15D are diagrams for explaining the punching method of the printed wiring board according to the first embodiment.

16A to 16F are diagrams for explaining the punching method of the printed wiring board according to the first embodiment.

17A to 17F are diagrams for explaining the punching method of the printed wiring board according to the second embodiment.

FIG. 18 is a flowchart for explaining the punching method of the printed wiring board according to the third embodiment. FIG.

Fig. 19 is a flowchart for explaining the perforation method of the printed wiring board according to the fourth embodiment.

20 is a flowchart for explaining a method of punching a printed wiring board according to the first modification.

FIG. 21 is a flowchart for explaining a method of punching a printed wiring board according to a second modification. FIG.

Fig. 22 is a flowchart for explaining the punching method of the printed wiring board according to the third modification.

FIG. 23 is a diagram schematically showing the structure of a die die 640B in the method for punching a printed wiring board according to a fourth modification.

FIG. 24 is a diagram schematically showing the structure of a punch die 620C in the method for punching a printed wiring board according to a fifth modification.

FIG. 25 is a diagram schematically illustrating the structures of a punch die 620D and a die die 640D in the method of punching a printed wiring board according to a sixth modification.

FIG. 26 is a diagram schematically illustrating the structure of a punch die 620E in the method of punching a printed wiring board according to a seventh modification.

EMBODIMENT OF THE INVENTION Hereinafter, the punching method of the printed wiring board of this invention, the printed wiring board, the board | substrate for BOC, and a punching apparatus are demonstrated based on embodiment shown in drawing.

Before explaining each embodiment of this invention in detail, the BOC board | substrate with which the through-hole was formed by the punching method of the printed wiring board of this invention, and the semiconductor device which has this BOC board | substrate are demonstrated.

1 is an overall plan view of a BOC substrate 20. 2 (a) and 2 (b) are enlarged and schematic views of a part of the BOC substrate 20. FIG. 2A is a plan view schematically showing an enlarged portion of the BOC substrate 20, and FIG. 2B is a sectional view taken along the line A-A in FIG. 3 is a diagram schematically showing the semiconductor device 1.

The BOC substrate 20 has a base layer 24 and resist layers 26 and 28 formed on both surfaces of the base layer 24 as shown in FIG. As the base layer 24, the resin substrate (200 micrometers in thickness) which impregnated BT (bismarade triazine) resin in the glass cloth base, for example is used. As the resist layers 26 and 28, the organic resist layer of 40 micrometers in thickness is used, for example.

The through-holes 22 formed in the BOC substrate 20 are substantially elliptical in plan view as shown in Fig. 2A. In the circumference | surroundings of the through-hole 22, the wiring part 30 which has the land 32 and the bonding pad 34 is formed. The land 32 and the bonding pad 34 have, for example, a structure in which a gold layer 36 having a thickness of 3 μm is laminated on the surface of the copper layer 38 having a thickness of 10 μm.

As shown in FIG. 1, the BOC substrate 20 in which the through hole 22 is formed is separated one by one as the BOC substrate cell 20a, and then used as one component constituting the semiconductor device 1. .

As shown in FIG. 3, the semiconductor device 1 includes an IC chip 10 and a BOC substrate cell 20a on which the IC chip 10 is mounted. The IC chip 10 is attached to one surface of the BOC substrate cell 20a via an adhesive C. Solder balls 36 are fixedly attached to each of the lands 32. The bonding pad 34 and the electrode 12 of the IC chip 10 are connected by the metal wire 14 via the through hole 22.

EMBODIMENT OF THE INVENTION Below, each embodiment is demonstrated about the punching method of the printed wiring board of this invention, the board | substrate for BOC, and a punching apparatus.

[First Embodiment]

First, the outline | summary of the drilling apparatus 100 which concerns on 1st Embodiment is demonstrated using FIGS.

4 is a front view showing the drilling device 100 according to the first embodiment. FIG. 5 is a plan view of the drilling device 100 according to the first embodiment. Fig. 6 is a side view showing the drilling device 100 according to the first embodiment.

The trimming apparatus 100 according to the first embodiment conveys the apparatus main body 200 and the BOC substrate 20 for mounting and fixing various mechanisms (to be described later) as shown in Figs. Perforation mechanism for perforating to the conveyance mechanism 300, the board | substrate supply apparatus 400 located below the conveyance mechanism 300, and the BOC board | substrate 20 supplied by the board | substrate supply apparatus 400 600 is provided.

The apparatus main body 200 is comprised by the base of a substantially rectangular plane. On the right side of the apparatus main body 200, a controller box 210 having a controller (not shown) for driving control of each mechanism or the like by a setting program is disposed. The board | substrate carrying-in part 220 which mounts the BOC board | substrate 20 before a punching process, and the board | substrate carrying out part 230 which mounts the BOC board | substrate 20 after a punching process to the both sides of the apparatus main body 200 in the x-axis direction. ) Is arranged.

The board | substrate carrying-in part 220 has the loader mechanism 240 for giving the board | substrate 20 for BOCs before a punching process to the conveyance mechanism 300. As shown in FIG. In addition, detailed description about the loader mechanism 240 is abbreviate | omitted.

The board | substrate carrying out part 230 has the collection box 250 for receiving the BOC board | substrate 20 after a punching process from the conveyance mechanism 300. As shown in FIG. The recovery box 250 is movable along the y axis direction.

As shown in FIG. 4, the conveyance mechanism 300 is the 1st conveyance mechanism 310 which conveys the BOC board | substrate 20 toward the board | substrate guide plate 500 mentioned later from the board | substrate carrying-in part 220, and a board | substrate. It has the 2nd conveyance mechanism 320 which conveys the board | substrate 20 for BOC from the guide board 500 toward the board | substrate carrying out part 230, and is arrange | positioned on the apparatus main body 200 via the climbing plate 260.

Thereby, only the BOC board | substrate 20 before a punching process is supplied to the board | substrate carrying-in part 220, and the BOC board | substrate 20 can be supplied. In addition, the BOC substrate 20 can be recovered only by recovering the BOC substrate 20 after the drilling process from the substrate carrying out portion 230. For this reason, productivity of a drilling operation | work can be improved as a whole. Moreover, the conveyance of the BOC board | substrate 20 from the board | substrate carrying-in part 220 to the board | substrate guide plate 500, and the conveyance of the BOC board | substrate 20 from the board | substrate guide plate 500 to the board | substrate carrying out part 230 are respectively, respectively. Since it is performed by another conveyance mechanism, productivity of a drilling operation | work can be improved as a whole.

7 is a plan view showing the substrate supply apparatus 400. 8 is a side view showing the substrate supply apparatus 400. 9 is a front view showing the substrate supply apparatus 400. In addition, in FIG. 8, illustration of the two clampers 450 and 460 is abbreviate | omitted, and in FIG. 9, illustration of the clamper 460 is abbreviate | omitted.

As shown in Figs. 4 to 6, the substrate supply apparatus 400 is movable in the y-axis direction along the substrate transfer direction and in the x-axis direction orthogonal to the substrate transfer direction, and also rotatable around the z-axis. A table 402 and two clampers 450 and 460 for holding the BOC substrate 20 are provided.

As shown in FIGS. 7 to 9, the moving table 402 includes a first moving mechanism 410 moving along the x axis direction, a second moving mechanism 420 moving along the y axis direction, and z It has the 3rd moving mechanism 430 rotating about an axis.

The first moving mechanism 410 includes a servo motor 412, a screw shaft 414 journaled to the servo motor 412, a first table 416, and a guide 418 extending along the x-axis direction (FIG. 5). Reference) and disposed on the apparatus main body 200. The first moving mechanism 410 is configured such that the first table 416 moves on the guide 418 along the x-axis direction by the rotation of the screw shaft 414 driven by the servo motor 412. .

The second moving mechanism 420 has a servo motor 422, a screw shaft 424 journaled to the servo motor 422, a second table 426, and a guide 428 extending along the y-axis direction, It is disposed on the first table 416. The second moving mechanism 420 is configured such that the second table 426 moves on the guide 428 along the y-axis direction by the rotation of the screw shaft 424 by the driving of the servo motor 422. have.

The third moving mechanism 430 is a mover 438 that applies rotational force to the servo motor 432, the screw shaft 434 journaled to the servo motor 432, the third table 436, and the third table 436. ) And a sensor 440 for detecting the home position of the mover 438, and are disposed on the second table 426. The third table 436 is pivotally supported by the pivot shaft 442 on the second table 426, and is disposed on the mover 438 so as to be swingable via the table support 444. Moreover, clamper holders 446 and 448 for disposing two clampers 450 and 460 are disposed on both sides of the third table 436 along the x-axis direction. The third moving mechanism 430 is configured to rotate around the z axis with the pivot axis 442 as the center of rotation by the rotation of the screw shaft 424 by the drive of the servo motor 432.

The two clampers 450 and 460 include rotating members 452 and 462 having a function of holding the BOC substrate 20, fixing members 454 and 464 supporting the rotating members 452 and 462, and rotating members. The drive cylinders 456 and 466 for driving 452 and 462 are respectively respectively arrange | positioned on the clamper holder 446 and 448 of the 3rd table 436, respectively. In addition, the two clampers 450 and 460 are comprised so that the edges of both sides of the board | substrate standby position side end part in the BOC board | substrate 20 may respectively hold | grip.

Of the two clampers 450 and 460, the clamper 450 is used for the BOC between the rotating member 452 and the fixing member 454 by the rotation of the rotating member 452 by the driving of the driving cylinder 456. It is comprised so that the board | substrate 20 may be gripped. The same applies to the clamper 460.

Between the two clampers 450 and 460 above the moving table 402, as shown in Figs. 5 and 8, to guide the BOC substrate 20 from the substrate standby position toward the puncturing position. The board | substrate guide plate 500 for this is arrange | positioned via the leg member 502. FIG. The substrate guide plate 500 is movable along the x-axis direction together with the movable table 402. The height of the upper surface of the board guide plate 500 is set to a position higher by, for example, 0.10 mm than the height of the upper surface of the die metal mold 640 described later.

In addition, another fixed substrate guide plate 510 (not shown) is provided around the die die 640 to be described later to more smoothly guide the BOC substrate 20. The height of the upper surface of the other board | substrate guide plate 510 is set to the position higher by 0.10 mm than the height of the upper surface of the die metal mold 640 mentioned later, for example.

10A to 10C are diagrams for explaining the punch die 620. Fig. 10A is a view of the punch die 620 from below, Fig. 10B is a cross-sectional view taken along line AA of Fig. 10A, and Fig. 10C is Fig. 10A. ) BB cross section. 11A to 11C are diagrams for explaining the die mold 640. FIG. 11A is a view of the die die 640 viewed from above, FIG. 11B is an AA cross-sectional view of FIG. 11A, and FIG. 11C is FIG. ) BB cross section. 12A and 12B are diagrams schematically illustrating the structures of the punch die 620 and the die die 640. FIG. 12A is a view schematically illustrating the structures of the punch die 620 and the die die 640. FIG. 12B is an enlarged view of a portion around the punch hole 632. FIG. The figure is shown.

12A and 12B, the structures of the punch die 620 and the die die 640 are schematically shown, and the positioning pins and the positioning holes are shown in the drawings. Omitted. In addition, for the sake of simplicity, only one punch 622 of the three punches 622 of the punch die 620 is shown, and the three die holes (the die die 640) Only one die hole 646 is shown in 646.

The punching mechanism 600 includes a punching die 610 and a punching die 610 for punching the BOC substrate 20 supplied by the substrate supply device 400 as shown in FIG. Perforation die attachment part 680 (not shown) for attaching), and an elevating mechanism 690 for lifting and lowering the perforation die 610, and are disposed inside the front of the perforation device 100. .

The punching die 610 includes a punch die 620, a die die 640, a punch die 620, and the die as shown in Figs. 10A to 12B. The positioning mold 640 has two positioning pins 650 for positioning with respect to the drilling die attaching portion 680.

The punch die 620 includes three punches 622 having a substantially elliptic shape as shown in Figs. 10A to 10C and Figs. 12A and 12B. a) and (b) shows only one punch 622], a punch plate 624, a backing plate 626, and a stripper plate 630, and an upper punching die attaching portion 680. Attached to the The punch plate 624 has a punching engagement hole (not shown) for latching the three punches 622 and is fixed to the backing plate 626.

The stripper plate 630 has a punch hole 632 through which the punch 622 can be inserted, as shown in Figs. 10A to 10C and Figs. 12A and 12B. It is held by the backing plate 626 so that the pin 658 can be lifted up and down. A convex portion 638 is formed around the punch hole 632. The stripper plate 630 is also provided with a positioning hole 652 corresponding to the positioning pin 650.

As shown in Fig. 12B, the inner surface of the punch hole 632 has a first inner circumference portion 634 and a first inner circumference portion 634 having an inner surface shape corresponding to the outer shape of the punch 622. A second inner circumferential portion 636 is provided at the upper end of the upper circumferential portion and has a cross sectional shape larger than that of the first inner circumferential portion 634. The inner surface shape of the 2nd inner peripheral part 636 is an inner surface shape which consists of a taper surface inclined at predetermined angle with respect to the surface facing the BOC board | substrate 20 in the stripper plate 630. As shown in FIG.

In the stripper plate 630, compressed air is directed toward the through-hole 22 of the BOC substrate 20 as shown in Figs. 10 (a) to (c) and 12 (a) and (b). A flow path 660 for injection and an air chamber 662 provided to communicate with the flow path 660 to surround the upper end of the second inner peripheral portion 636 in the punch hole 632 are formed.

The die die 640 has a die plate 642 and a backing plate 644 as shown in Figs. 11A to 11C, and Figs. 12A and 12B. It is attached to the drilling die attaching portion 680. The die plate 642 is fixed to the backing plate 644. The die plate 642 has three die holes 646 corresponding to the three punches 622 in the punch die 620. A convex portion 647 is formed around the die hole 646. The die plate 642 and the backing plate 644 are provided with positioning holes 654 corresponding to the positioning pins 650.

In addition, although illustration is abbreviate | omitted in FIG.12 (a) and (b), the imaging element 670 for image | photographing the BOC board | substrate 20 is arrange | positioned at the side of the punch metal mold 620 (FIG. 15). (A) to (d)).

The positioning pins 650 are arranged to be able to move forward and backward along the z axis in the die die 640 as shown in FIGS. 10A to 10C and 11A to 11C. have. And the punching die attaching part 680 which can be fitted with respect to the positioning hole 652 of the stripper plate 630, and which can be inserted through the positioning hole 654 of the die die 640 is inserted. It is formed by the cylindrical member fitted to the positioning hole (not shown) provided in the site | part for attaching the die metal mold | die 640 in ().

Next, the punching method of the printed wiring board which concerns on 1st Embodiment is demonstrated using FIGS. 13-15 (a)-(d).

13 and 14 are flowcharts for explaining the punching method of the printed wiring board according to the first embodiment. 15A to 15D are diagrams for explaining the punching method of the printed wiring board according to the first embodiment. 15A to 15D are diagrams for explaining the first step and the second step in the punching method of the printed wiring board according to the first embodiment.

In addition, in FIG.15 (a)-(d), the structure of the punch metal mold 620 etc. is shown schematically in order to make understanding of each process demonstrated below easily.

The punching method of the printed wiring board which concerns on 1st Embodiment is a board | substrate supply process which supplies the BOC board | substrate 20 before a punching process to a punching execution position, and the punching die 610 as shown in FIG. The angle adjustment process of adjusting the BOC board | substrate 20 to an exact angle, the punching process of punching the BOC board | substrate 20, and the board | substrate collection | recovery which collect | recovers the BOC board | substrate 20 after a punching process from a punching execution position. It includes a process. The drilling step includes the first step and the second step shown in FIG. The 1st process includes the (C1) board | substrate movement process in the imaging range, and the (C2) horizontal direction movement amount calculation process. The second step includes a (C3) horizontal movement amount adjustment step, a (C4) substrate pressing step, and a (C5) punch hole forming step. Hereinafter, each of these steps will be described in turn.

(A) Substrate Supply Process

First, the BOC board | substrate 20 mounted in the board | substrate carrying-in part 220 is conveyed toward the board | substrate guide plate 500 from the board | substrate carrying-in part 220 by the 1st conveyance mechanism 310. As shown in FIG. When the BOC substrate 20 is loaded at a predetermined position on the substrate guide plate 500 by the first transfer mechanism 310, the rotating members 452 and 462 of the two clampers 450 and 460 are rotated, respectively. Both edges of the substrate standby position side end portion of the BOC substrate 20 are gripped, respectively. Thereafter, the moving table 402 is moved and adjusted in either or both of the x-axis direction and the y-axis direction to move the BOC substrate 20 from the substrate standby position to the puncturing position.

(B) angle adjustment process

First, the predetermined position in the BOC board | substrate 20 is image | photographed with the imaging element 670, and the shift | offset | difference amount around the z-axis in the BOC board | substrate 20 is calculated based on the imaging result. At this time, when this shift | deviation amount exists in an allowable range, it progresses to the following (C) drilling process. If this shift amount is not within the allowable range, the movable table 402 is rotated and adjusted around the z axis in accordance with the shift amount around the z axis, and the BOC substrate 20 is precisely angled with respect to the punch die 620. Adjust

(C) drilling process

The imaging device 670 photographs a predetermined position on the BOC substrate 20, and moves the movable stage 402 in either or both of the x-axis direction and the y-axis direction based on the photographing result. In the state which adjusted and arrange | positioned the BOC board | substrate 20 in the exact puncturing execution position, it punctures the BOC board | substrate 20. This (C) perforation process is a substrate movement process and (C2) horizontal movement amount calculation process in the (C1) imaging range as a 1st process shown below, (C3) horizontal movement amount adjustment process as a 2nd process, ( C4) substrate pressing step and (C5) punch hole forming step.

(C1) substrate moving process within the shooting range

The BOC substrate 20 is moved so that the position detection mark M on the BOC substrate 20 is disposed within the imaging range 672 of the imaging device 670 (Figs. 15A and 15B). ) Reference].

In addition, in the said (B) angle adjustment process, when the position detection mark M in the BOC board | substrate 20 is in the imaging range 672 of the imaging element 670, it will be in this (C1) imaging range. It goes without saying that the substrate transfer step is omitted.

(C2) horizontal movement amount calculation process

The BOC board | substrate 20 (position detection mark M of the BOC board | substrate 20) is image | photographed with the imaging element 670, and an x-axis direction and a y-axis direction to a perforation plan site | part are based on the imaging result. The amount of movement (the amount of movement in the x-axis direction and the y-axis direction in the BOC substrate 20) is calculated.

In addition, in this process, imaging | photography by the imaging element 670 can also be abbreviate | omitted. In that case, the movement amount of the x-axis direction and the y-axis direction in the BOC board | substrate 20 is calculated based on the imaging result image | photographed in the said (B) angle adjustment process.

(C3) horizontal movement amount adjustment process

According to the movement amount of the x-axis direction and the y-axis direction computed by the said (C2) horizontal direction movement amount calculation process, the movement table 402 is moved and adjusted to either or both of an x-axis direction and a y-axis direction (FIG. 15 (c)].

(C4) substrate pressing process

The lifting mechanism 690 is driven to lower the punch die 620, and the stripper plate 630 presses the BOC substrate 20 to the die die 640 (see Fig. 15 (d)). .

(C5) punch hole forming process

The elevating mechanism 690 is driven to further lower the punch die 620 to punch the substrate 20 for BOC.

The above (C) punching process is repeated as many times as necessary until the punching required for the BOC substrate 20 is completed. Then, the drilling operation for the BOC substrate 20 is completed.

(D) substrate recovery process

The moving table 402 is moved and adjusted in either or both of the x-axis direction and the y-axis direction to move the BOC substrate 20 after the punching process from the punching position to the punching standby position. Then, the rotating members 452 and 462 of the two clampers 450 and 460 are rotated, respectively, to release the holding state of the BOC substrate 20.

Next, the BOC substrate 20 loaded on the substrate guide plate 500 is conveyed from the substrate guide plate 500 toward the substrate carrying out portion 230 by the second transfer mechanism 320. The BOC substrate 20 which has been punched out is stacked in the recovery box 250 of the substrate carrying out portion 230.

In this manner, the drilling operation for the BOC substrate 20 is performed.

As described above, the punching method of the printed wiring board according to the first embodiment is a punching method for punching the BOC substrate 20 using the punching device 100 according to the first embodiment described above. After imaging the predetermined position in the substrate 20 for imaging with the imaging element 670, and calculating the shift amount around the z-axis in the BOC substrate 20 based on the imaging result, the z-axis An angle adjustment step of rotating the moving table 402 around the z-axis in accordance with the amount of deviation of the surroundings to adjust the BOC substrate 20 to the correct angle with respect to the punch die 620, and the BOC substrate 20 Image pickup device 670, and based on the photographing result, the moving table 402 is moved or adjusted in either or both of the x-axis direction and the y-axis direction, and then the BOC substrate. In the state which arrange | positioned 20 at the exact puncturing execution position, it cloth | punches the board | substrate 20 for BOC. It includes the step of drilling carried out in this order.

For this reason, according to the perforation method of the printed wiring board which concerns on 1st Embodiment, the predetermined position in the BOC board | substrate 20 is image | photographed with the imaging element 670, and the BOC board | substrate is based on the imaging result. The shift amount around the z-axis in (20) is calculated, and the moving table 402 is rotated around the z-axis in accordance with the shift amount around the z-axis, and the BOC substrate ( After adjusting 20 to an accurate angle, it becomes possible to puncture the BOC substrate 20, even if the BOC substrate 20 is not disposed at the correct angle with respect to the punch die 620, It becomes the drilling method which can perforate with high precision.

In addition, since the moving table 402 can be moved and adjusted in either or both of the x-axis direction and the y-axis direction each time the BOC substrate 20 is punctured, the puncturing can be performed with high accuracy. Become.

In this case, the angle adjustment step (B) may be performed at least once when the BOC substrate 20 is supplied between the punch die 620 and the die die 640. On the other hand, the movement adjustment of the moving table 402 in either or both of the x-axis direction and the y-axis direction is performed at least once per each (C) drilling step.

In the punching method of the printed wiring board which concerns on 1st Embodiment, said (C) punching process is a board | substrate movement process in the (C1) imaging range as a 1st process, (C2) horizontal direction movement amount calculation process, (C3) horizontal movement amount adjustment process as a 2nd process, (C4) board | substrate pressing process, and (C5) punch hole formation process.

Thus, after the moving table 402 is moved and adjusted in either or both of the x-axis direction and the y-axis direction in accordance with the required amount of movement in the x-axis direction and the y-axis direction, the BOC substrate 20 is drilled. As a result, high-precision drilling can be performed.

In addition, in the punching method of the printed wiring board which concerns on 1st Embodiment, since the moving stage 402 can be moved and adjusted to an x-axis direction and a y-axis direction by the above-mentioned (C3) horizontal movement amount adjustment process, it is a yes. For example, in the case of using the punch die 620 (see Fig. 10 (a)) in which three punches 622 are arranged as in the first embodiment, the mold can be made relatively small, so that the manufacturing cost of the die is low. In addition, it becomes possible to restrain, and at the same time, it becomes possible to raise the processing precision of each one of the through-holes relatively. On the other hand, for example, in the case of using a punching die in which nine punches are arranged in three rows in length and width, a large amount of through holes can be formed in one punching operation, so that the time required for drilling per printed wiring board is relatively small. It becomes possible to make less.

Here, the punching method of the printed wiring board which concerns on 1st Embodiment is characterized by performing the following (1st step)-(3rd step) in said (C5) punch hole formation process. 16A to 16F are diagrams for explaining the punching method of the printed wiring board according to the first embodiment. 16A to 16F are diagrams showing (first step) to (third step).

(First step)

The punch 622 is lowered while penetrating the BOC substrate 20 while the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642 (see FIG. 16A). A hole 22 is formed (see Fig. 16B).

(Second step)

After the punch 622 is raised while the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642, the punch 622 is raised from the punch die 620 side through the punch hole 632. By injecting compressed air into the through hole 22, the punched chip existing inside the through hole 22 is removed via the die hole 646 (see Fig. 16 (c)).

(Third step)

The punch 622 is lowered again while the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642, whereby the punched chip remaining inside the through hole 22 is die-holeed. It removes via 646 (refer FIG. 16 (d)).

When the third step ends, the punch 622 is raised (see FIG. 16 (e)), and the stripper plate 630 is raised again (see FIG. 16 (f)).

As described above, according to the punching method of the printed wiring board according to the first embodiment, first, the punch 622 is lowered in the first step to form the through hole 22 in the BOC substrate 20, and in the second step, After raising the punch 622, the compressed air is injected into the through hole 22 to remove the punched chip existing inside the through hole 22 via the die hole 646, and the punch 622 in the third step. Since the drill chip remaining in the inside of the through hole 22 is removed via the die hole 646 by lowering again, the drill chip remains on the inner surface of the through hole 22 at the end of the second step. Even if it has done, the punched chip 622 is lowered again in the third step, so that the punched chip remaining on the inner surface of the through hole 22 can be removed cleanly. As a result, the punched chip generated in the inner surface of the through hole 22 can be more completely removed.

Moreover, according to the punching method of the printed wiring board which concerns on 1st Embodiment, from the above-mentioned 1st step in the state which always sandwiched the BOC board | substrate 20 between the stripper plate 630 and the die plate 642. Since the series of operations up to the third step is performed, the upper surface of the BOC substrate 20 is always covered with the stripper plate 630, thereby suppressing the attachment of the perforated chip to the upper surface of the BOC substrate 20. can do.

In addition, the punching method of the printed wiring board which concerns on 1st Embodiment needs to change suitably the frequency | count and stroke amount punched with a punch according to the material and thickness of a board | substrate like the case of the punching method of patent document 2, Since the straight through hole is formed by two simple punching operations in the first step and the third step, it is easy to simplify the mechanism and method for forming the through hole 22.

For this reason, in the punching method of the printed wiring board which concerns on 1st Embodiment, the punching chip which generate | occur | produced in the inner surface of the through-hole 22 can be removed more completely, and a punching chip adheres to the upper surface of the BOC board 20. It becomes possible to suppress the formation, and to simplify the mechanism and method for forming the through hole 22, which is a method of punching a printed wiring board.

As mentioned above, although the characteristic and effect of the punching method of the printed wiring board which concerns on 1st Embodiment were demonstrated in detail using FIGS. 13-16 (f), the punching method of the printed wiring board which concerns on 1st Embodiment was demonstrated. Also has the following characteristics and effects.

In the method of punching the printed wiring board according to the first embodiment, as shown in Figs. 10A to 12B, the inner diameter of the punch hole 632 and the outside of the punch 622 are shown. Since the diameters are substantially the same, the area of the portion exposed on the upper surface of the BOC substrate 20 without being covered by the stripper plate 630 can be reduced. As a result, the attachment of the perforated chip to the upper surface of the BOC substrate 20 can be further suppressed.

Here, "the inner diameter of the punch hole 632 and the outer diameter of the punch 622 are about the same" means the minimum gap required between the inner circumferential surface of the punch hole 632 and the outer circumferential surface of the punch 622. It is set only outside.

In the method of punching a printed wiring board according to the first embodiment, as shown in Fig. 12B, the inner surface of the punch hole 632 has an inner surface shape corresponding to the outer shape of the punch 622; A first inner circumferential portion 634 and a second inner circumferential portion 636 are formed on the upper end of the first inner circumferential portion 634 and have a cross sectional shape larger than that of the first inner circumferential portion 634. When the tip portion of the upholstery rises from the first inner circumference 634 to the second inner circumference 636 in the punch hole 632, compressed air is injected into the through hole 22 via the punch hole 632. It is configured (see Fig. 16 (c)).

For this reason, according to the punching method of the printed wiring board which concerns on 1st Embodiment, the punch 622 functions like a so-called air valve, and the front-end | tip part of the punch 622 is punch hole 632 from the die hole 646. When in the position between the first inner peripheral portion 634 in the compressed air is not injected into the through hole 22, the tip portion of the punch 622 from the first inner peripheral portion 634 to the second inner peripheral portion When it rises up to 636, the compressed air is transferred to the through-hole 22. As a result, there is no need to control on / off the compressed air at a high speed in accordance with the high speed of vertical movement of the punch 622, so that the control becomes easy and the speed of punching becomes easy to cope with.

In the method for punching the printed wiring board according to the first embodiment, as shown in FIGS. 10A to 10C and 12A, the through hole 22 is formed in the stripper plate 630. A flow path 660 for sending compressed air toward the air, and an air chamber 662 provided to communicate with the flow path 660 to surround the upper end of the second inner peripheral portion 636 in the punch hole 632. . As a result, since compressed air is injected over the entire circumference of the inner surface of the through hole 22, the punched chip remaining on the inner surface of the through hole 22 can be removed cleanly. Moreover, since the compressed air injected from the flow path 660 can be temporarily stored in the air chamber 662, it becomes possible to keep the pressure and flow volume of the compressed air injected into the through-hole 22 substantially constant. For this reason, in the above-mentioned 2nd step, since the uniform compressed air uniformized with respect to the through-hole 22 is conveyed, the perforated chip which remain | survives on the inner surface of the through-hole 22 can be removed more cleanly.

In the punching method of the printed wiring board which concerns on 1st Embodiment, since the bottom dead center of the punch 622 in a 1st step and the bottom dead center of the punch 622 in a 3rd step are substantially the same, it is a 1st step. And it is not necessary to change the bottom dead center of the punch 622 in the third step, and it becomes easier to simplify the mechanism and method for forming the through hole 22.

In the method of punching the printed wiring board according to the first embodiment, as shown in FIG. 12A, a convex portion 647 is formed around the die hole 646 in the die plate 642. Formed.

For example, when a through hole is formed in the BOC substrate, if the resist layer is coated on the surface of the die die in the BOC substrate, the resist layer is relatively soft, so that the periphery of the through hole is performed by drilling. Unevenness etc. may arise in a part. However, according to the punching method of the printed wiring board which concerns on 1st Embodiment, the board | substrate part of the BOC board | substrate 20 which contacts the peripheral part of the die hole 646 fits with a big force compared with another board | substrate part. Since it is supported, the occurrence of nonuniformity in the peripheral part of the through hole 22 can be suppressed, and the board | substrate for BOC of high quality can be manufactured.

In the punching method of the printed wiring board which concerns on 1st Embodiment, as shown in FIG.12 (b), the convex part 638 is provided around the punch hole 632 in the stripper plate 630. FIG. Formed.

For example, when a through hole is formed in a BOC board | substrate, when a perforation chip | tip adheres to the wiring part formed in the vicinity of a through hole, there exists a possibility that a short may arise. However, according to the punching method of the printed wiring board which concerns on 1st Embodiment, since the upper surface of the BOC board 20 can be reliably covered along the through-hole 22 (inner surface of the through-hole 22), it punches The chip can be further suppressed from adhering to the wiring portion 30 formed near the through hole 22.

In the method of punching the printed wiring board according to the first embodiment, as shown in Figs. 16A and 16B, the wiring portion in the BOC substrate 20 is described in the above-described first step. The BOC substrate 20 is lowered by lowering the punch 622 while the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642 so that the forming surface is the stripper plate 630 side. Since through holes 22 are formed in the through hole 22, the through holes 22 can be formed with high accuracy on the basis of the pattern of the wiring portion forming surface in the BOC substrate 20.

In the method of punching the printed wiring board according to the first embodiment, as shown in Figs. 10A to 10C and 11A to 11C, the punch die 620 has three parts. Punches 622 are arranged, and three die holes 646 corresponding to the three punches 622 are disposed in the die die 640. This makes it possible to form a plurality of excellent through holes 22 in which the punching chips generated on the inner surface of the through holes are more completely removed in one punching operation, thereby making it possible to increase the productivity.

In the punching method of the printed wiring board which concerns on 1st Embodiment, the said punching | drilling apparatus 100 further moves between two clampers 450 and 460 in the upper side of the movable table 402, and the movable table 402. And a substrate guide plate 500 for guiding the BOC substrate 20 from the substrate standby position toward the puncture execution position. The two clampers 450 and 460 are configured to hold the BOC substrate 20 loaded on the substrate guide plate 500 at both sides in the x-axis direction of the substrate guide plate 500. It is.

For this reason, according to the punching method of the printed wiring board which concerns on 1st Embodiment, the board | substrate guide plate 500 for guiding the BOC board | substrate 20 has two clampers (the upper side of the moving table 402) ( Since it is provided between 450 and 460 to move along the x-axis direction with the movable table 402, the BOC board | substrate 20 is also along the x-axis direction with the board | substrate guide plate 500, and also the board | substrate guide plate 500 is smoothly guided along the y-axis direction.

In the punching method of the printed wiring board which concerns on 1st Embodiment, since the two clampers 450 and 460 are comprised so that each edge of the board | substrate standby position side end part in the BOC board | substrate 20 may be respectively hold | maintained, BOC The perforation can be performed to a wide area from the substrate standby position side end portion in the substrate 20 for the substrate to the perforation position side end portion.

In this case, the punched-out BOC substrate 20 is removed from the two clampers 450 and 460 and gripped by the two clampers 450 and 460 in a state of rotating 180 degrees in the horizontal direction. The perforation can be performed over the entire area of the BOC substrate 20.

In the punching method of the printed wiring board which concerns on 1st Embodiment, the said punching apparatus 100 is provided in the periphery of the die metal mold 640, and is fixed for carrying out the guidance of the BOC board | substrate 20 more smoothly. It is a punching device further comprising another substrate guide plate 510 (not shown).

In the case where the BOC substrate 20 is rigid, the other substrate guide plate 510 is not necessarily required. However, when the BOC substrate 20 is flexible, when the BOC substrate 20 is sent from the board guide plate 500 to the front region, both ends of the BOC substrate 20 in the x-axis direction and y Bending or wrinkles may occur in the BOC substrate 20 due to the vertical lowering of the axial one side end by gravity. Even in such a case, as in the method of punching the printed wiring board according to the first embodiment, the other fixed board guide plate 510 is provided around the die die 640, whereby the warpage and wrinkles of the BOC substrate 20 are provided. Can be effectively suppressed and the BOC substrate 20 can be smoothly sent.

The BOC board | substrate 20 which concerns on 1st Embodiment is a punching process performed using the punching method of the printed wiring board which concerns on said 1st Embodiment.

For this reason, since the BOC board | substrate 20 which concerns on 1st Embodiment is punching-processing using the punching method of the printed wiring board which can remove the punching chip which generate | occur | produced in the inner surface of the through-hole 22 more completely. The perforated chip generated from the inner surface of the through hole 22 is more completely removed, thereby providing an excellent BOC substrate.

In addition, since the BOC board | substrate 20 which concerns on 1st Embodiment is punched | drilled using the punching method of the printed wiring board which can suppress that a punching chip adheres to the upper surface of the BOC board | substrate 20, It becomes a BOC board | substrate with high quality by which a perforation chip adheres to the upper surface of the BOC board | substrate 20.

In addition, since the BOC board | substrate 20 which concerns on 1st Embodiment is punched | drilled using the punching method of the printed wiring board which it is easy to simplify the mechanism and method for forming the through-hole 22, Inexpensive BOC substrate.

The punching apparatus 100 which concerns on 1st Embodiment is provided with the punch die 620 which has the punch 622 and the stripper plate 630, and the die die 640 which has the die plate 642, It is a punching device which performs a punching process to printed wiring boards, such as the BOC board | substrate 20. Then, the punching device 100 lowers the punch 622 while the printed wiring board is sandwiched between the stripper plate 630 and the die plate 642 to form a through hole in the printed wiring board. And the punch 622 is raised while the printed wiring board is sandwiched between the stripper plate 630 and the die plate 642, and then the stripper plate 630 is removed from the punch die 620 side. 2nd function which removes the perforation chip which exists in the inside of a through hole through the die hole 646 in the die plate 642 by injecting compressed air into a through hole through the punch hole 632, and a stripper plate By lowering the punch 622 again while the printed wiring board is sandwiched between the 630 and the die plate 642, the punch hole remaining inside the through hole is subjected to the die hole 646. It has a 3rd function which removes through).

For this reason, according to the drilling device 100 which concerns on 1st Embodiment, the punch 622 is first lowered by a 1st function, a through hole is formed in a board | substrate, and the punch 622 is raised by a 2nd function. Later, by injecting compressed air into the through hole, the punching chip existing inside the through hole is removed via the die hole 646, and the punch remaining in the inside of the through hole is lowered by lowering the punch 622 again by the third function. Since the chip is to be removed via the die hole 646, even if the punched chip remains on the inner surface of the through hole by the second function, the punch 622 is lowered again by the third function to thereby penetrate the chip. The perforated chip remaining on the inner surface of the hole can be removed cleanly. As a result, an excellent printed wiring board can be produced in which the perforated chip generated from the inner surface of the through hole is more completely removed.

In addition, according to the drilling device 100 according to the first embodiment, the above-described first to third functions are operated while the substrate is always sandwiched between the stripper plate 630 and the die plate 642. Since the upper surface of the board | substrate is always covered with the stripper plate 630, the high quality printed wiring board which suppressed attachment of a perforated chip to the upper surface of a board | substrate can be manufactured.

Further, according to the punching device 100 according to the first embodiment, as in the case of the punching device using the punching method described in Patent Literature 2, the number of punches and the amount of strokes punched with a punch are appropriately set. It is not necessary to change it, and since the straight through hole is formed by a total of two simple punching operations by the first function and the third function, it becomes easy to simplify the mechanism and method for forming the through hole. For this reason, a cheap printed wiring board can be manufactured.

Second Embodiment

17A to 17F are diagrams for explaining the punching method of the printed wiring board according to the second embodiment. 17A to 17F are diagrams showing (first step) to (fourth step). 17 (a) to 17 (f), the same members as those described in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

The punching method of the printed wiring board according to the second embodiment is basically the same as the punching method of the printed wiring board according to the first embodiment, as shown in Figs. 17A to 17F. After the third step, the method further includes a fourth step shown below, which differs from the method for punching the printed wiring board according to the first embodiment.

(Fourth step)

After the punch 622 is raised while the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642, the punch 622 is raised from the punch die 620 side through the punch hole 632. By again injecting compressed air into the through hole 22, the punched chip existing inside the through hole 22 is removed via the die hole 646 (see Fig. 17E).

When the fourth step is finished, the injection of compressed air is stopped to raise the stripper plate 630 (see FIG. 17 (f)).

As described above, the punching method of the printed wiring board according to the second embodiment is different from the punching method of the printed wiring board according to the first embodiment in that the fourth step is further included after the third step. As in the case of the punching method of the printed wiring board according to the first embodiment, first, the punch 622 is lowered in the first step to form the through hole 22 in the BOC substrate 20, and the punch is performed in the second step. After raising 622, the compressed air is injected into the through hole 22 to remove the punched chip existing inside the through hole 22 via the die hole 646, and the punch 622 is removed in the third step. By lowering again, the punched chip remaining inside the through hole 22 is removed via the die hole 646. For this reason, even when the punching chip remains in the inner surface of the through hole 22 at the end of the second step, the punch 622 is lowered again in the third step, thereby remaining on the inner surface of the through hole 22. The punched chip can be removed cleanly. As a result, the punched chip generated in the inner surface of the through hole 22 can be more completely removed.

Moreover, according to the punching method of the printed wiring board which concerns on 2nd Embodiment, from the above-mentioned 1st step, the board | substrate 20 for BOC is always clamped between the stripper plate 630 and the die plate 642. Since the series of operations up to the third step is performed, the upper surface of the BOC substrate 20 is always covered with the stripper plate 630, thereby suppressing the attachment of the perforated chip to the upper surface of the BOC substrate 20. can do.

In addition, according to the punching method of the printed wiring board which concerns on 2nd Embodiment, since the through-hole 22 is formed by a straight punching operation in a total of 2 simple punching operations in a 1st step and a 3rd step, It becomes easy to simplify the mechanism and method for forming.

For this reason, the punching method of the printed wiring board which concerns on 2nd Embodiment can remove the punching chip which generate | occur | produced in the inner surface of the through-hole 22 more completely like the case of the punching method of the printed wiring board which concerns on 1st Embodiment. At the same time, the perforation of the printed wiring board can be suppressed from being attached to the upper surface of the BOC substrate 20, and it is easy to simplify the mechanism and method for forming the through hole 22. It is a way.

In addition, in the punching method of the printed wiring board which concerns on 2nd Embodiment, since the said 4th step is included after a 3rd step, it is new to the inner surface of the through-hole 22 by performing a 3rd step, for example. Even if a puncture chip has occurred, it is possible to remove such a puncture chip via the die hole 646 by injecting compressed air into the through hole 22 again after raising the punch 622 in the fourth step. For this reason, the perforation chip | tip which remain | survives in the inner surface of the through-hole 22 can be removed more cleanly.

The operation of the fourth step is also performed in a state where the BOC substrate 20 is sandwiched between the stripper plate 630 and the die plate 642 as in the case of the operation from the first step to the third step. Since the upper surface of the BOC substrate 20 is covered with the stripper plate 630, it is possible to suppress the attachment of the perforated chip to the upper surface of the BOC substrate 20.

Since the punching method of the printed wiring board which concerns on 2nd Embodiment is the same as the punching method of the printed wiring board which concerns on 1st Embodiment except the point which further includes the said 4th step after 3rd step, The effect obtained by using the punching method of the printed wiring board which concerns on 1st Embodiment is similarly obtained.

[Third Embodiment]

FIG. 18 is a flowchart for explaining the punching method of the printed wiring board according to the third embodiment. FIG.

The punching method of the printed wiring board according to the third embodiment is basically the same as the punching method of the printed wiring board according to the first embodiment, as shown in FIG. 18, but the punch (C5) in the second step is performed. It differs from the punching method of the printed wiring board which concerns on 1st Embodiment by the point which includes the 3rd process after a hole formation process further.

In the third process, as shown in Fig. 18, the BOC substrate 20 is moved by a predetermined distance so that the through hole 22 formed by the second process is disposed within the imaging range 672 of the imaging device 670 ( C6) The substrate movement step (second) within the shooting range, and the BOC substrate 20 are photographed by the imaging element 670 to confirm whether or not the through hole 22 is formed at the correct position (C7). ) It includes the through-hole identification process.

As described above, the method for punching the printed wiring board according to the third embodiment includes the substrate movement step (second) within the (C6) imaging range as the third step after the punch hole forming step (C5) in the second step, and (C7) In addition to the method for punching the printed wiring board according to the first embodiment, in that it further includes a through hole checking step, the punching step is the same as in the case of the punching method for the printed wiring board according to the first embodiment. Is a substrate movement step (C2) in the photographing range as a first step and a horizontal shift amount calculation step (C3), a horizontal shift amount adjustment step (C4) as a second step, a substrate pressing step (C5) and a punch The hole formation process is included.

For this reason, the method of punching the printed wiring board according to the third embodiment is the moving table 402 in accordance with the required amount of movement in the x-axis direction and the y-axis direction as in the case of the method of punching the printed wiring board according to the first embodiment. ) Can be perforated to the BOC substrate 20 after moving and adjusting in either the x-axis direction or the y-axis direction, or both, so that high-precision drilling can be performed.

Moreover, in the punching method of the printed wiring board which concerns on 3rd Embodiment, the board | substrate movement process (second) in the (C6) imaging range as a 3rd process after the (C5) punch hole formation process in a 2nd process, and (C7) In order to perform the through-hole confirmation process, whether or not the through-hole 22 formed by the 2nd process is formed in the correct position can be confirmed before performing a next drilling operation. That is, for example, when the through hole 22 formed by the 2nd process is not formed in the correct position, it becomes possible to stop drilling once on the BOC board | substrate 20, and to take necessary measures.

[4th Embodiment]

Fig. 19 is a flowchart for explaining the perforation method of the printed wiring board according to the fourth embodiment.

The punching method of the printed wiring board which concerns on 4th Embodiment basically includes the process similar to the punching method of the printed wiring board which concerns on 1st Embodiment. Specifically, the substrate supply process of supplying the BOC substrate 20 before a drilling process to a drilling execution position, the angle adjustment process of adjusting the BOC substrate 20 to an exact angle with respect to the drilling die 610, It includes a punching step of punching the BOC substrate 20 and a substrate recovery step of recovering the BOC substrate 20 after the punching process from a punching position. However, it is the content of the punching process that the punching method of the printed wiring board which concerns on 4th Embodiment differs from the punching method of the printed wiring board which concerns on 1st Embodiment.

That is, in the punching method of the printed wiring board which concerns on 1st Embodiment, a punching process is a board | substrate movement process in the (C1) imaging range as a 1st process, (C2) horizontal movement amount calculation process, and a 2nd process ( C3) horizontal movement amount adjustment process, (C4) board | substrate pressing process, and (C5) punch hole formation process. In contrast, in the punching method of the printed wiring board according to the fourth embodiment, the punching step includes the (E1) substrate pressing step and the (E2) horizontal shift amount calculating step as the first step, as shown in FIG. And (E3) substrate pressing release step, (E4) horizontal displacement amount adjusting step, (E5) substrate pressing step (second) and (E6) punch hole forming step as step 2a. Hereinafter, these (E1)-(E6) process is demonstrated in order.

In addition, the board | substrate supply process, angle adjustment process, and board | substrate collection process in the punching method of the printed wiring board which concerns on 4th Embodiment are the (A) board | substrate supply process, (B) angle adjustment process which were demonstrated in 1st Embodiment, and (D) Since it is the same as that of a board | substrate collection | recovery process, detailed description is abbreviate | omitted.

(E1) substrate pressing process

With respect to the BOC substrate 20 disposed between the punch die 620 and the die die 640, the lifting mechanism 690 is driven to lower the punch die 620, and thus the stripper plate 630. ), The BOC substrate 20 is pressed against the die die 640.

In the (B) angle adjustment step, when the BOC substrate 20 is already pressed against the die die 640 by the stripper plate 630, the (E1) substrate pressing step is omitted. Of course.

(E2) Horizontal shift amount calculation step

The BOC board | substrate 20 is image | photographed with the imaging element 670, and the shift amount (the x-axis direction and the y-axis direction) from the exact puncturing execution position in the BOC board | substrate 20 based on the imaging result. The amount of deviation) is calculated. At this time, when the amount of shift | offset | difference from an exact puncturing execution position exists in an allowable range, it progresses to the punch hole formation process (E6) mentioned later. If the amount of shift from the correct puncturing position is not within the allowable range, the process proceeds to the next (E3) substrate pressing release step.

In addition, in this process, imaging | photography by the imaging element 670 can also be abbreviate | omitted. In that case, the amount of shift | offset | difference from the exact puncturing implementation position in the BOC board | substrate 20 is calculated based on the imaging result image | photographed in the (B) angle adjustment process.

(E3) substrate press release process

The lifting mechanism 690 is driven to raise the punch die 620, and the pressure contact state of the BOC substrate 20 by the stripper plate 630 is released.

(E4) Horizontal shift amount adjusting step

The moving table 402 is moved or adjusted in either or both of the x-axis direction and the y-axis direction in accordance with the shift amount from the exact puncturing execution position calculated by the horizontal shift amount calculation step (E3).

(E5) Substrate Pressing Process (Second)

The lifting mechanism 690 is driven to lower the punch die 620 again, and the BOC substrate 20 is press-contacted to the die die 640 by the stripper plate 630.

(E6) punch hole forming process

The lifting mechanism 690 is driven to lower the punch die 620 again, and the punching is performed on the BOC substrate 20.

The above-described process is repeated as many times as necessary until the perforations necessary for the BOC substrate 20 are completed. Then, the drilling operation for the BOC substrate 20 is completed.

As described above, in the method for punching the printed wiring board according to the fourth embodiment, the punching step supplies the BOC substrate 20 to the punching position, and the stripper plate 630 die-plates the BOC substrate 20. After the pressure contact to 642, the BOC substrate 20 is photographed by the imaging device 670, and based on the photographing result, the X-axis direction and the y-axis direction misalignment in the BOC substrate 20 are obtained. In the case of the 1a process of calculating an amount, and the deviation amount of an x-axis direction and a y-axis direction in an allowable range, the BOC board | substrate 20 in the state which the BOC board | substrate 20 was press-contacted on the die plate 642 20) and when the shift amount of the x-axis direction and the y-axis direction is not within the allowable range, the contact state of the BOC substrate 20 by the stripper plate 630 is released, and the x-axis direction and Depending on the amount of displacement in the y-axis direction, the moving table 402 may be moved in the x-axis direction or the y-axis direction. After moving and adjusting to either or both, the BOC substrate 20 is press-contacted to the die plate 642 by the stripper plate 630, and then, the BOC substrate 20 is drilled to form through holes. Step 2a is included in this order.

For this reason, according to the perforation method of the printed wiring board which concerns on 4th Embodiment, after moving the moving stand 402 to either or both of the x-axis direction or the y-axis direction according to the actual shift | deviation amount, for BOC, Since the board | substrate 20 can be drilled, it becomes possible to perform a high precision punching. In this case, since the shift amount is calculated with high accuracy in the state where the BOC substrate 20 is press-contacted by the stripper plate 630, it is possible to perform more precise drilling.

As mentioned above, although the punching method of the printed wiring board, the printed wiring board, the BOC board | substrate, and the punching apparatus of this invention were demonstrated based on each above-mentioned embodiment, this invention is not limited to each above-mentioned embodiment, The summary It is possible to implement in various forms in the range which does not deviate, and the following modification is also possible, for example.

[First Modification Example]

20 is a flowchart for explaining a method of punching a printed wiring board according to the first modification.

Although the perforation method of the printed wiring board which concerns on a 1st modification includes the process similar to the case of the perforation method of the printed wiring board which concerns on 4th Embodiment as shown in FIG. 19, the printing which concerns on a 1st modification In the perforation method of a wiring board, in a perforation process, it is a 3rd point in that a (E7) horizontal direction shift amount calculation process (second) is performed after the (E5) board | substrate pressurization process (second) in a 2nd process. It is different from the case of the perforation method of the printed wiring board which concerns on embodiment. And according to the shift amount calculated by (E7) horizontal shift amount calculation process (2nd), when the shift amount from an exact puncturing execution position exists in an allowable range, it will advance to (E6) punch hole formation process, and When the amount of shift from the puncturing position is not within the allowable range, the process returns to the substrate press release step (E3).

That is, in the method of punching a printed wiring board according to the first modification, the BOC is a BOC when the punching step is within the allowable range between the first step described in the fourth embodiment and the x-axis direction and the y-axis direction. In the state where the substrate 20 is pressed against the die plate 642, the substrate 20 for BOC is punctured, and when the shift amount in the x-axis direction and the y-axis direction is not within the allowable range, the stripper plate The pressure contact state with respect to the BOC board | substrate 20 by 630 is canceled | released, and one or both of the moving stage 402 or the x-axis direction or the y-axis direction is changed according to the shift amount of the x-axis direction and the y-axis direction. The BOC substrate 20 is press-bonded to the die plate 642 by the stripper plate 630, and then the BOC substrate 20 is photographed by the imaging device 670. Based on this, the x-axis direction and y-axis direction in the BOC board | substrate 20 The amount of displacement is calculated, and the processes of pressure release, movement adjustment, pressure welding, photographing, and displacement amount calculation are repeated until the amount of displacement in the x-axis direction and the y-axis direction is within the allowable range, and then the x-axis direction and the y-axis 2b which perforates the board | substrate 20 for BOCs and forms the through-hole 22 in the state in which the BOC board | substrate 20 was press-contacted on the die plate 642, when the amount of shift | offset | difference of a direction exists in the tolerance range. The process is characterized by including in this order.

For this reason, according to the perforation method of the printed wiring board which concerns on a 1st modification, since the fine movement adjustment process of the movable stand 402 can be repeated until a shift amount is suppressed in an allowable range, the printed wiring according to 4th Embodiment More precise puncturing can be achieved than in the case of the puncturing method of the substrate.

Second Modification Example

FIG. 21 is a flowchart for explaining a method of punching a printed wiring board according to a second modification. FIG.

Although the punching method of the printed wiring board which concerns on 2nd modified example includes the process similar to the punching method of the printed wiring board which concerns on 4th Embodiment as shown in FIG. 21, the printed wiring board which concerns on 2nd modified example In the drilling method of (E2) in the drilling step, the stripper plate 630 does not press-contact the BOC substrate 20 to the die die 640, and (E2) the horizontal shift amount calculation step and (E4) horizontally. It differs from the case of the perforation method of the printed wiring board which concerns on 4th Embodiment by the point which performs a direction shift amount adjustment process.

That is, in the punching method of the printed wiring board which concerns on a 2nd modified example, after a punching process supplies the BOC board | substrate 20 to a punching execution position, the BOC board | substrate 20 is image | photographed by the imaging element 670 1b process which calculates the deviation amount of the x-axis direction and the y-axis direction in the BOC board | substrate 20 based on the imaging result, and the deviation amount of the x-axis direction and the y-axis direction are in an allowable range. After the BOC substrate 20 is press-contacted to the die plate 642 by the stripper plate 630, the BOC substrate 20 is drilled, and the deviation amount in the x-axis direction and the y-axis direction is allowed. If not, the moving table 402 is moved or adjusted in either or both of the x-axis direction and the y-axis direction in accordance with the shift amounts in the x-axis direction and the y-axis direction, and the stripper plate 630 is used for the BOC. The substrate 20 is press-contacted to the die plate 642 and then punched into the substrate 20 for BOC. And it characterized in that it comprises a first step of forming a through-hole 2c 22 in this order.

For this reason, according to the perforation method of the printed wiring board which concerns on a 2nd modified example, after moving the moving stand 402 to either or both of the x-axis direction or the y-axis direction according to the actual shift | offset | difference amount, BOC Since punching can be performed to the board | substrate 20 for a board | substrate, it becomes possible to perform high precision punching like the case of the punching method of the printed wiring board which concerns on 4th Embodiment.

[Third Modification]

Fig. 22 is a flowchart for explaining the punching method of the printed wiring board according to the third modification.

Although the perforation method of the printed wiring board which concerns on 3rd modified example includes the process similar to the case of the perforation method of the printed wiring board which concerns on 2nd modified example as shown in FIG. 22, the print which concerns on 3rd modified example In the perforation method of a wiring board, in a perforation process, a 2nd deformation | transformation is performed in the point which performs (E7) horizontal displacement amount calculation process (2nd) after (E4) horizontal displacement amount adjustment process in 2nd process. It differs from the punching method of the printed wiring board which concerns on an example. And according to the shift amount calculated by (E7) horizontal shift amount calculation process (2nd), when the shift amount from an exact puncturing execution position exists in an allowable range, it will punch (E6) via a board | substrate pressing process (E6) When it progresses to a hole formation process and a shift amount from an exact puncturing execution position does not exist in an allowable range, it returns to (E4) horizontal shift amount adjustment process again.

That is, the punching method of the printed wiring board which concerns on a 3rd modified example is a stripper when a punching process is in the 1b process demonstrated by said 2nd modified example, and the shift amount of an x-axis direction and a y-axis direction exists in an allowable range. When the BOC substrate 20 is press-contacted to the die plate 642 by the plate 630, perforation is performed to the BOC substrate 20, and the shift amount in the x-axis direction and the y-axis direction is not within the allowable range. The moving table 402 is moved and adjusted in either or both of the x-axis direction and the y-axis direction in accordance with the shift amounts in the x-axis direction and the y-axis direction, so that the BOC substrate 20 is picked up by the imaging element 670. When the image is taken, the amount of deviation in the x-axis direction and the y-axis direction in the BOC substrate 20 is calculated based on the photographing result, and the amount of deviation in the x-axis direction and the y-axis direction is within the allowable range. Repeat the process of movement adjustment, photography, and deviation calculation until Then, when the shift amount in the x-axis direction and the y-axis direction falls within the allowable range, the stripper plate 630 press-bonds the BOC substrate 20 to the die plate 642, and then punches the BOC substrate 20. It is characterized by including in this order the 2d process of implementing and forming the through-hole 22. FIG.

For this reason, according to the perforation method of the printed wiring board which concerns on a 3rd modified example, since the fine motion adjustment process of the movable stand 402 can be repeated until a shift amount is suppressed within an allowable range, the printed wiring which concerns on a 2nd modified example More precise puncturing can be achieved than in the case of the puncturing method of the substrate.

[Example 4]

FIG. 23 is a diagram schematically showing the structure of a die die 640B in the method for punching a printed wiring board according to a fourth modification.

The punching method of the printed wiring board which concerns on 4th modification differs from the punching method of the printed wiring board which concerns on 1st Embodiment is the structure of the die die used for the punching method. That is, in the punching method of the printed wiring board which concerns on 1st Embodiment, as shown to FIG. 12 (a), the die hole 646 of the die plate 642 of the die metal mold 640 is used. While the convex part 647 is formed in the periphery, in the method of punching the printed wiring board according to the fourth modified example, as shown in FIG. 23, the die plate 642B of the die die 640B is used. A groove 648 is formed around the die hole 646 of the die.

As described above, the punching method of the printed wiring board according to the fourth modified example is different from the case of the punching method of the printed wiring board according to the first embodiment, although the structure of the die die used in the punching method is different. As in the case of the perforation method of the printed wiring board according to the form, the board portion of the BOC substrate 20 in contact with the peripheral portion of the die hole 646 is clamped with a greater force than the other board portions. The occurrence of nonuniformity in the peripheral portion of the through hole 22 can be suppressed, so that a BOC substrate having good quality can be manufactured.

 [Fifth Modification Example]

FIG. 24 is a diagram schematically illustrating the structure of a punch die 620C in the method of punching a printed wiring board according to a fifth modification.

The punching method of the printed wiring board which concerns on 5th modification differs from the punching method of the printed wiring board which concerns on 1st Embodiment is the structure of the punch metal mold | die used for this punching method. That is, in the punching method of the printed wiring board which concerns on 1st Embodiment, as shown to FIG. 12 (a), the punch hole 632 of the stripper plate 630 of the punch metal mold 620 is shown. While the convex portion 638 is formed around the periphery, in the method of punching the printed wiring board according to the fifth modification, as shown in FIG. 20, the stripper plate 630C of the punch die 620C is shown in FIG. 20. The convex part is not formed around the punch hole 632 in this case.

As described above, the punching method of the printed wiring board according to the fifth modification is different from the case of the punching method of the printed wiring board according to the first embodiment, although the structure of the punching die used in the punching method is different. As in the case of the perforation method of the printed wiring board according to the form, the board portion of the BOC substrate 20 in contact with the peripheral portion of the die hole 646 is clamped with a greater force than the other board portions. The occurrence of nonuniformity in the peripheral portion of the through hole 22 can be suppressed, so that a BOC substrate having good quality can be manufactured.

[Sixth Modified Example]

FIG. 25 is a diagram schematically illustrating the structures of a punch die 620D and a die die 640D in the method for punching a printed wiring board according to a sixth modification.

The punching method of the printed wiring board which concerns on the 6th modification differs from the punching method of the printed wiring board which concerns on 1st Embodiment is the structure of the punching die and die die used for the punching method. Specifically, in the punching method of the printed wiring board according to the sixth modification, the surface facing the BOC substrate 20 in the stripper plate 630D of the punch die 620D, as shown in FIG. And the polyurethane resin R is coated on the surface of the die die 640D that faces the BOC substrate 20 in the die plate 642D. The thickness of polyurethane resin R is 20 micrometers, for example.

When forming the through-hole 22 with respect to the BOC board | substrate 20 used for the punching method of the printed wiring board of this invention, according to the drilling method of the printed wiring board which concerns on the 6th modification, the BOC board | substrate 20 It is possible to suppress the occurrence of undesirable scratches on the wiring portion 30 and the resist layers 26 and 28 (both in Fig. 2) formed on the surface of the substrate, thereby forming an excellent BOC substrate.

[Seventh Variant]

FIG. 26 is a diagram schematically illustrating the structure of a punch die 620E in the method of punching a printed wiring board according to a seventh modification.

The punching method of the printed wiring board according to the seventh modification is different from the punching method of the printed wiring board according to the first embodiment in that the inner surface shape of the second inner peripheral part in the punch hole of the stripper plate used for the punching method is used. to be. That is, in the punching method of the printed wiring board which concerns on 1st Embodiment, as shown to FIG. 12 (a), the 2nd inner peripheral part 636 of the punch hole 632 of the stripper plate 630 is carried out. The inner surface shape is an inner surface shape consisting of a tapered surface inclined at a predetermined angle with respect to the surface facing the BOC substrate 20 in the stripper plate 630, whereas the method for drilling a printed wiring board according to the seventh modification example In Fig. 26, as shown in Fig. 26, the inner surface shape of the second inner circumferential portion 636E in the punch hole 632E (not shown) of the stripper plate 630E is defined as the substrate for BOC in the stripper plate 630. It is an inner surface shape which consists of a surface perpendicular | vertical with respect to the surface facing 20).

As described above, the punching method of the printed wiring board according to the seventh modified example is different from the case of the punching method of the printed wiring board according to the first embodiment in the second inner hole in the punch hole of the stripper plate used for the punching method. Although the inner surface shape of a main part is different, when the tip part of the punch 622 rises from the 1st inner peripheral part 634E to the 2nd inner peripheral part 636E like the case of the perforation method of the printed wiring board which concerns on 1st Embodiment. The compressed air is configured to be injected into the through hole 22 via the punch hole 632E. For this reason, when the punch 622 functions like a so-called air valve, and the tip end of the punch 622 is in a position between the die hole 646 and the first inner circumferential portion 634E, the compressed air is a through hole. When the tip of the punch 622 rises from the first inner circumference 634E to the second inner circumference 636E without being injected into the 22, compressed air is transferred to the through hole 22. As a result, there is no need to control on / off the compressed air at a high speed in accordance with the high speed of vertical movement of the punch 622, so that the control becomes easy and the speed of punching becomes easy to cope with.

In addition, in the punching method of the printed wiring board of this invention, of course, the deformation | transformation shown next is also possible.

(1) In the punching method of the printed wiring board which concerns on the said 1st Embodiment, although including and demonstrated the above-mentioned 1st process and 2nd process as a punching process, this invention is not limited to this. For example, in the first step, instead of calculating the amount of movement in the x-axis direction and the y-axis direction in the BOC substrate 20, the x-axis direction and the y-axis direction in the BOC substrate 20 are calculated. The shift amount and the shift amount around the z-axis are calculated, and in the second step, the moving table 402 is moved or adjusted in either the x-axis direction or the y-axis direction according to the shift amount in the x-axis direction and the y-axis direction. Instead, the moving table 402 is moved in the x-axis direction, moved in the y-axis direction, or rotated around the z-axis, depending on the amount of movement in the x-axis and y-axis directions and the shift amount around the z-axis. The method of performing at least one adjustment may be sufficient.

(2) In the punching method of the printed wiring board which concerns on the said 3rd Embodiment, although what demonstrated including the above-mentioned 1a process and 2a process as a punching process was demonstrated, this invention is not limited to this. For example, in the 1a process, instead of calculating the deviation amounts in the x-axis direction and the y-axis direction in the BOC substrate 20, the x-axis direction and the y-axis direction in the BOC substrate 20. And the amount of shifts around the z-axis and the amount of shifts around the z-axis is calculated. Instead of adjusting the movement in the x-axis direction and the y-axis direction and the shift amount around the z-axis, the movable stage 402 is moved in the x-axis direction, the y-axis direction or the z-axis. The method of performing at least one adjustment of rotation adjustment to the periphery may be sufficient.

(3) In the punching method of the printed wiring board which concerns on the said 1st Embodiment, in the said (B) angle adjustment process, the stripper plate 630 carries out the BOC board | substrate 20 to die die 640 by the stripper plate 630. Although imaging was performed by the imaging element 670 without pressure contact, and the deviation amount around the z-axis in the BOC board | substrate 20 was computed based on the imaging result as an example, this invention is limited to this. It doesn't happen. In the angle adjustment step (B), the stripper plate 630 photographs the BOC substrate 20 with the die mold 640 in the state of being pressed by the imaging element 670, and based on the photographing result. In addition, the shift amount around the z-axis in the BOC substrate 20 may be calculated.

(4) In each said embodiment, although the case where the punching method of the printed wiring board of this invention is applied to the BOC board | substrate is illustrated and demonstrated, this invention is not limited to this and is applied to another printed wiring board. Of course it is possible.

Claims (28)

delete It is a punching method of the printed wiring board for punching a printed wiring board using the punching apparatus provided with the punching mold which has a punch and a stripper plate, and the die for die which has a die plate, A first step of forming a through hole in the printed wiring board by lowering the punch in a state where the printed wiring board is sandwiched between the stripper plate and the die plate; After raising the punch while the printed wiring board is sandwiched between the stripper plate and the die plate, compressed air is applied to the through hole from the punch die side through the punch hole in the stripper plate. A second step of removing the punched chip existing inside the through hole by the injection through the die hole in the die plate; A third step of removing the punched chip remaining inside the through hole through the die hole by lowering the punch again while the printed wiring board is sandwiched between the stripper plate and the die plate; Including in the order of the first step, the second step, and the third step, After the third step, the punch is raised while the printed wiring board is sandwiched between the stripper plate and the die plate, and then compressed air is passed through the punch hole from the punch die side to the through hole. And a fourth step of removing the punched chip remaining inside the through hole through the die hole by injecting again. It is a punching method of the printed wiring board for punching a printed wiring board using the punching apparatus provided with the punching mold which has a punch and a stripper plate, and the die for die which has a die plate, A first step of forming a through hole in the printed wiring board by lowering the punch in a state where the printed wiring board is sandwiched between the stripper plate and the die plate; After raising the punch while the printed wiring board is sandwiched between the stripper plate and the die plate, compressed air is applied to the through hole from the punch die side through the punch hole in the stripper plate. A second step of removing the punched chip existing inside the through hole by the injection through the die hole in the die plate; A third step of removing the punched chip remaining inside the through hole through the die hole by lowering the punch again while the printed wiring board is sandwiched between the stripper plate and the die plate; Including in the order of the first step, the second step, and the third step, On the inner surface of the punch hole, a first inner circumferential portion formed of an inner surface shape corresponding to the outer shape of the punch, and a second cross-sectional shape provided at an upper end of the first inner circumferential portion that is larger than the cross-sectional shape of the first inner circumferential portion. The inner circumference is formed, and when the leading end of the punch rises from the first inner circumference in the punch hole to the second inner circumference, compressed air is injected into the through hole through the punch hole. There is a puncturing method of a printed wiring board. The said stripper plate is formed with the flow path for injecting compressed air toward the said through hole, and the air chamber provided in communication with the said flow path and surrounding the upper end part of the said 2nd inner peripheral part in the said punch hole. The punching method of the printed wiring board characterized by the above-mentioned. 3. The punching method of a printed wiring board according to claim 2, wherein the bottom dead center of the punch in the first step and the bottom dead center of the punch in the third step are the same. It is a punching method of the printed wiring board for punching a printed wiring board using the punching apparatus provided with the punching mold which has a punch and a stripper plate, and the die for die which has a die plate, A first step of forming a through hole in the printed wiring board by lowering the punch in a state where the printed wiring board is sandwiched between the stripper plate and the die plate; After raising the punch while the printed wiring board is sandwiched between the stripper plate and the die plate, compressed air is applied to the through hole from the punch die side through the punch hole in the stripper plate. A second step of removing the punched chip existing inside the through hole by the injection through the die hole in the die plate; A third step of removing the punched chip remaining inside the through hole through the die hole by lowering the punch again while the printed wiring board is sandwiched between the stripper plate and the die plate; Including in the order of the first step, the second step, and the third step, The convex part is formed in the circumference | surroundings of the said die hole in the said die plate, The punching method of the printed wiring board characterized by the above-mentioned. It is a punching method of the printed wiring board for punching a printed wiring board using the punching apparatus provided with the punching mold which has a punch and a stripper plate, and the die for die which has a die plate, A first step of forming a through hole in the printed wiring board by lowering the punch in a state where the printed wiring board is sandwiched between the stripper plate and the die plate; After raising the punch while the printed wiring board is sandwiched between the stripper plate and the die plate, compressed air is applied to the through hole from the punch die side through the punch hole in the stripper plate. A second step of removing the punched chip existing inside the through hole by the injection through the die hole in the die plate; A third step of removing the punched chip remaining inside the through hole through the die hole by lowering the punch again while the printed wiring board is sandwiched between the stripper plate and the die plate; Including in the order of the first step, the second step, and the third step, A groove is formed in the periphery of the said die hole in the said die plate, The drilling method of the printed wiring board characterized by the above-mentioned. It is a punching method of the printed wiring board for punching a printed wiring board using the punching apparatus provided with the punching mold which has a punch and a stripper plate, and the die for die which has a die plate, A first step of forming a through hole in the printed wiring board by lowering the punch in a state where the printed wiring board is sandwiched between the stripper plate and the die plate; After raising the punch while the printed wiring board is sandwiched between the stripper plate and the die plate, compressed air is applied to the through hole from the punch die side through the punch hole in the stripper plate. A second step of removing the punched chip existing inside the through hole by the injection through the die hole in the die plate; A third step of removing the punched chip remaining inside the through hole through the die hole by lowering the punch again while the printed wiring board is sandwiched between the stripper plate and the die plate; Including in the order of the first step, the second step, and the third step, The convex part is formed in the circumference | surroundings of the said punch hole in the said stripper plate, The punching method of the printed wiring board characterized by the above-mentioned. The perforation of the printed wiring board according to claim 2, wherein in the first step, the printed wiring board is disposed between the stripper plate and the die plate such that a wiring portion forming surface is located on the stripper plate side. Way. The method of claim 2, wherein a plurality of punches are disposed in the punch die, And a plurality of die holes corresponding to the plurality of punches are arranged in the die die. It is a punching method of the printed wiring board for punching a printed wiring board using the punching apparatus provided with the punching mold which has a punch and a stripper plate, and the die for die which has a die plate, A first step of forming a through hole in the printed wiring board by lowering the punch in a state where the printed wiring board is sandwiched between the stripper plate and the die plate; After raising the punch while the printed wiring board is sandwiched between the stripper plate and the die plate, compressed air is applied to the through hole from the punch die side through the punch hole in the stripper plate. A second step of removing the punched chip existing inside the through hole by the injection through the die hole in the die plate; A third step of removing the punched chip remaining inside the through hole through the die hole by lowering the punch again while the printed wiring board is sandwiched between the stripper plate and the die plate; Including in the order of the first step, the second step, and the third step, Resin is coated on any one or both of the surface which opposes the printed wiring board in the said stripper plate, or the surface which opposes the printed wiring board in the said die plate, The punching method of the printed wiring board characterized by the above-mentioned. . It is a punching method of the printed wiring board for punching a printed wiring board using the punching apparatus provided with the punching mold which has a punch and a stripper plate, and the die for die which has a die plate, A first step of forming a through hole in the printed wiring board by lowering the punch in a state where the printed wiring board is sandwiched between the stripper plate and the die plate; After raising the punch while the printed wiring board is sandwiched between the stripper plate and the die plate, compressed air is applied to the through hole from the punch die side through the punch hole in the stripper plate. A second step of removing the punched chip existing inside the through hole by the injection through the die hole in the die plate; A third step of removing the punched chip remaining inside the through hole through the die hole by lowering the punch again while the printed wiring board is sandwiched between the stripper plate and the die plate; Including in the order of the first step, the second step, and the third step, The punching device is a substrate supply device capable of supplying a printed wiring board between the punch die and the die die, the x-axis being perpendicular to the y-axis direction along the substrate transfer direction in a horizontal plane and the substrate transfer direction. A perforation device further comprising a substrate supply device having a moving table and an image pickup device, each of which is movable along a direction and rotatable about a z-axis perpendicular to the horizontal plane; After imaging the predetermined position in a printed wiring board with the said imaging element, and calculating the shift amount around the z axis in a printed wiring board based on the imaging result, according to the shift amount around the z axis An angle adjustment step of rotating the movable table about the z-axis to adjust the printed wiring board at an accurate angle with respect to the punch die; A predetermined position on the printed wiring board is photographed by the imaging device, and based on the photographing result, the movable stand is moved and adjusted in either or both of the x-axis direction and the y-axis direction to correct the printed wiring board. The punching method of punching a printed wiring board in the state arrange | positioned at a punching execution position is included in the order of the said angle adjustment process and the said punching process, The punching method of the printed wiring board characterized by the above-mentioned. The substrate supply apparatus according to claim 12, wherein the substrate supply apparatus further comprises two clampers for gripping a printed wiring board, The punching device is provided to move along the x-axis direction between the two clampers above the movable table and together with the movable table, for guiding a printed wiring board from the substrate standby position toward the punching position. It is a punching device further comprising a substrate guide plate, The two clampers are configured to hold the printed wiring board mounted on the substrate guide plate on both sides in the x-axis direction of the substrate guide plate. 15. The printed wiring according to claim 13, wherein the drilling apparatus is a punching apparatus provided around the die die and further provided with another fixed substrate guide plate for guiding the printed wiring board more smoothly. Method of puncturing the substrate. The method of claim 12, wherein the drilling step, After the printed wiring board is moved so that a predetermined position on the printed wiring board is disposed within the imaging range of the imaging device, the printed wiring board is photographed by the imaging device, and based on the photographing result, the printed wiring board is A first step of calculating an amount of movement in the x-axis direction and the y-axis direction of After moving the moving table in any one or both of the x-axis direction or the y-axis direction according to the amount of movement in the x-axis direction and the y-axis direction, and pressing the printed wiring board to the die plate by the stripper plate And a second step of forming a through hole by puncturing a punctured portion of the printed wiring board in the order of the first step and the second step. The method according to claim 15, wherein in the first step, Instead of calculating the amount of movement in the x-axis direction and the y-axis direction in the printed wiring board, The amount of movement in the x-axis direction and the y-axis direction and the shift amount around the z-axis in the printed wiring board is calculated, In the second step, Instead of moving and adjusting the movable table in either or both of the x-axis direction and the y-axis direction according to the amount of movement in the x-axis direction and the y-axis direction, According to the movement amount in the x-axis direction and the y-axis direction and the shift amount around the z-axis, at least one of the movement adjustment in the x-axis direction, the movement adjustment in the y-axis direction or the rotation adjustment around the z-axis Adjustment is carried out, The punching method of the printed wiring board characterized by the above-mentioned. The method of claim 15, wherein after the second process, After moving the printed wiring board a predetermined distance so that the through hole formed by the second step is disposed within the photographing range of the imaging device, the printed wiring board is photographed by the imaging device, and the through hole is formed at the correct position. And a third step of checking whether there is any. The method of claim 12, wherein the drilling step, After supplying a printed wiring board to the perforation position and pressing-contact the printed wiring board to the die plate by the stripper plate, the printed wiring board is photographed by the imaging device, and based on the photographing result, the printed wiring board 1a process which calculates the deviation amount of the x-axis direction and the y-axis direction in When the shift amount in the x-axis direction and the y-axis direction is within the allowable range, the printed wiring board is punctured while the printed wiring board is pressed onto the die plate, and the x-axis direction and the y-axis direction When the amount of misalignment is not within the allowable range, the press-contact state to the printed wiring board by the stripper plate is released, and the movable table is moved in the x-axis direction or the y-axis direction in accordance with the shift amounts in the x-axis direction and the y-axis direction. The 1a process is a 2a process which moves and adjusts to any one or both of them, press-contacts a printed wiring board with the said die plate by the said stripper plate, and then drills through a printed wiring board to form a through hole. And perforating the printed wiring board, in the order of the second step. The method of claim 12, wherein the drilling step, After supplying a printed wiring board to the perforation position and pressing-contact the printed wiring board to the die plate by the stripper plate, the printed wiring board is photographed by the imaging device, and based on the photographing result, the printed wiring board 1a process which calculates the deviation amount of the x-axis direction and the y-axis direction in When the shift amount in the x-axis direction and the y-axis direction is within the allowable range, the printed wiring board is punctured while the printed wiring board is pressed onto the die plate, and the x-axis direction and the y-axis direction When the amount of misalignment is not within the allowable range, the press-contact state to the printed wiring board by the stripper plate is released, and the movable table is moved in the x-axis direction or the y-axis direction in accordance with the shift amounts in the x-axis direction and the y-axis direction. After moving and adjusting to either or both of them, the printed wiring board is press-contacted to the die plate by the stripper plate, and then the printed wiring board is photographed by the imaging device, and based on the photographing result, the printed wiring board Calculates the amount of deviation in the x-axis direction and the y-axis direction, and the amount of deviation in the x-axis direction and the y-axis direction Repeat the process of calculating the crimp welding, moving adjustment, crimping, photographing, and shift amount until it is within the allowable range, and after that, when the shift amounts in the x-axis direction and y-axis direction are within the allowable range, the printed wiring board is In the state of being pressed on the die plate, the second wiring step of forming a through hole by punching the printed wiring board is included in the order of the first step and the second b step. Perforation method. The method of claim 12, wherein the drilling step, After supplying the printed wiring board to the drilling execution position, the printed wiring board is photographed by the imaging device, and based on the photographing result, the amount of deviation in the x-axis direction and the y-axis direction in the printed wiring board is calculated. Step 1b, When the shift amount in the x-axis direction and the y-axis direction is within the allowable range, the printed wiring board is press-contacted to the die plate by the stripper plate, and then the printed wiring board is drilled, and the x-axis direction and y When the shift amount in the axial direction is not within the allowable range, the moving table is moved and adjusted in either or both of the x-axis direction and the y-axis direction in accordance with the shift amounts in the x-axis direction and the y-axis direction, so that the stripper plate And a second c step of forming a through hole by punching the printed wiring board to the die plate, and forming a through hole by the step of the first step b and the second c step. Method of punching printed wiring boards. The method of claim 12, wherein the drilling step, After supplying the printed wiring board to the drilling execution position, the printed wiring board is photographed by the imaging device, and based on the photographing result, the amount of deviation in the x-axis direction and the y-axis direction in the printed wiring board is calculated. Step 1b, When the shift amount in the x-axis direction and the y-axis direction is within the allowable range, the printed wiring board is press-contacted to the die plate by the stripper plate, and then the printed wiring board is drilled, and the x-axis direction and y When the shift amount in the axial direction is not within the allowable range, the moving table is moved and adjusted in either or both of the x-axis direction and the y-axis direction in accordance with the shift amounts in the x-axis direction and the y-axis direction, thereby providing a printed wiring board. Is taken by the imaging device, and based on the photographing result, the amount of deviation in the x-axis direction and the y-axis direction on the printed wiring board is calculated, and the amount of deviation in the x-axis direction and the y-axis direction is within the allowable range. The process of the movement adjustment, the photographing, and the shift amount calculation is repeated until the shift is repeated. After that, when the shift amount in the x-axis direction and the y-axis direction is within the allowable range, And a second step of forming a through hole by punching the printed wiring board to the die plate by a stripper plate, and then forming a through hole in the order of steps 1b and 2d. The perforation method of the printed wiring board made into. The method according to claim 18, wherein in the first step a, Instead of calculating the amount of deviation in the x-axis direction and the y-axis direction in the printed wiring board, The shift amount in the x-axis direction and the y-axis direction and the shift amount around the z-axis in the printed wiring board are calculated, In the second step, Instead of moving and adjusting the movable table in either or both of the x-axis direction and the y-axis direction according to the shift amounts in the x-axis direction and the y-axis direction, According to the shift amount in the x-axis direction and the y-axis direction, and the shift amount around the z-axis, at least one of the movement adjustment in the x-axis direction, the movement adjustment in the y-axis direction, or the rotation adjustment around the z-axis One adjustment is performed, The punching method of the printed wiring board characterized by the above-mentioned. The punching process was performed using the punching method of the printed wiring board as described in any one of Claims 2, 3, 6, 7, 8, 11, or 12. Printed wiring board. The punching process was performed using the punching method of the printed wiring board as described in any one of Claims 2, 3, 6, 7, 8, 11, or 12. BOC substrate. delete The method of claim 19, wherein in the first step a, Instead of calculating the amount of deviation in the x-axis direction and the y-axis direction in the printed wiring board, The shift amount in the x-axis direction and the y-axis direction and the shift amount around the z-axis in the printed wiring board are calculated, In the second step, Instead of moving and adjusting the movable table in either or both of the x-axis direction and the y-axis direction according to the shift amounts in the x-axis direction and the y-axis direction, According to the shift amount in the x-axis direction and the y-axis direction, and the shift amount around the z-axis, at least one of the movement adjustment in the x-axis direction, the movement adjustment in the y-axis direction, or the rotation adjustment around the z-axis One adjustment is performed, The punching method of the printed wiring board characterized by the above-mentioned. The method of claim 20, wherein in the first step b, Instead of calculating the amount of deviation in the x-axis direction and the y-axis direction in the printed wiring board, The shift amount in the x-axis direction and the y-axis direction and the shift amount around the z-axis in the printed wiring board are calculated, In the second c step, Instead of moving and adjusting the movable table in either or both of the x-axis direction and the y-axis direction according to the shift amounts in the x-axis direction and the y-axis direction, According to the shift amount in the x-axis direction and the y-axis direction, and the shift amount around the z-axis, at least one of the movement adjustment in the x-axis direction, the movement adjustment in the y-axis direction, or the rotation adjustment around the z-axis One adjustment is performed, The punching method of the printed wiring board characterized by the above-mentioned. The method of claim 21, wherein in the first step b, Instead of calculating the amount of deviation in the x-axis direction and the y-axis direction in the printed wiring board, The shift amount in the x-axis direction and the y-axis direction and the shift amount around the z-axis in the printed wiring board are calculated, In the second step, Instead of moving and adjusting the movable table in either or both of the x-axis direction and the y-axis direction according to the shift amounts in the x-axis direction and the y-axis direction, According to the shift amount in the x-axis direction and the y-axis direction, and the shift amount around the z-axis, at least one of the movement adjustment in the x-axis direction, the movement adjustment in the y-axis direction, or the rotation adjustment around the z-axis One adjustment is performed, The punching method of the printed wiring board characterized by the above-mentioned.

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