KR100809428B1 - manufacturing method and device of printed circuit board - Google Patents

Abstract

Disclosed are a printed circuit board manufacturing method and apparatus. (a) applying conductive powder to the substrate corresponding to the position where the circuit pattern is to be formed, (b) supplying a current having a predetermined frequency to an electromagnetic induction coil located adjacent to the substrate, and (c) electromagnetic induction Printed circuit board manufacturing method comprising the step of blocking the current supplied to the coil, by applying a conductive powder to the substrate in a predetermined pattern, by melting it by the electromagnetic induction heating method to form a circuit pattern with high precision easily Patterns can be produced.

Conductor Powder, Electromagnetic Induction, Coil

Description

Manufacture method and device of printed circuit board

1 is a flow chart showing a printed circuit board manufacturing method according to an embodiment of the present invention.

2 is a flow chart showing a printed circuit board manufacturing process according to an embodiment of the present invention.

Figure 3 is a flow chart showing a printed circuit board manufacturing process according to another embodiment of the present invention.

Figure 4 is a schematic view showing a printed circuit board manufacturing apparatus according to a first embodiment of the present invention.

Figure 5 is a schematic diagram showing a printed circuit board manufacturing apparatus according to a second embodiment of the present invention.

6 is a schematic view showing a printed circuit board manufacturing apparatus according to a third embodiment of the present invention.

7 is a schematic view showing a printed circuit board manufacturing apparatus according to a fourth embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10 substrate 12 ditch

20: conductor powder 22: circuit

30: magnetic field 40: support plate

42: moving means 50, 52, 54: electromagnetic induction coil

60: power supply

The present invention relates to a method and an apparatus for manufacturing a printed circuit board.

A conventional manufacturing process of a printed circuit board is a wet manufacturing process to which a plating or etching process is applied, and there is a limitation that changes in size and warpage of the substrate material may occur in this process. As a result, various problems occur, such as the problem of interlayer alignment due to expansion of the insulating layer, the variation of circuit width due to the tolerance of the film used for exposure, and the plating or etching process. Problems caused by foreign substances can be mentioned.

In the conventional printed circuit board manufacturing process, first, a dry film is laminated on a substrate, and then a portion where a circuit pattern is to be formed through exposure by ultraviolet rays (UV) or the like is left, and then the remaining portion is etched to form an inner layer circuit. Form a pattern. If necessary, the build-up process is applied again to stack the outer layers, and vias are formed by drilling and plating to form vias for electrical connection between the circuit patterns.

Next, through exposure and etching, the circuit pattern of the outer layer is also formed in the same manner as the circuit pattern of the inner layer. Finally, after the solder resist coating and gold plating process is completed, the printed circuit board is completed.

This conventional printed circuit board manufacturing process is a dry film, forming a circuit pattern, etching, drilling and plating through a number of complex wet manufacturing processes, such as the above-mentioned problems in addition to the precision of the circuit is reduced, so fine It also has a limitation that it is difficult to form a circuit pattern.

SUMMARY OF THE INVENTION The present invention provides a printed circuit board manufacturing method and apparatus for easily forming a fine circuit pattern with high precision by applying a method of applying conductive powder on a substrate and melting the conductive powder by electromagnetic induction heating. .

According to one aspect of the invention, (a) applying a conductive powder to the substrate corresponding to the position where the circuit pattern is to be formed, (b) supplying a current having a predetermined frequency to the electromagnetic induction coil located adjacent to the substrate Provided is a method of manufacturing a printed circuit board, comprising the steps of: and (c) blocking a current supplied to the electromagnetic induction coil. Step (b) is preferably carried out during the time when the conductor powder is melted due to heating by electron induction.

Step (a) may include (a1) laminating a mask having a pattern corresponding to the circuit pattern on the substrate, (a2) applying conductive powder to the mask, and (a3) removing the mask. Can be.

Step (a) may comprise (a4) forming a groove of the pattern corresponding to the circuit pattern on the substrate, and (a5) applying the conductor powder to the substrate so that the groove is filled with the conductive powder, and the step After (a5), (a6) may further comprise the step of removing the conductor powder applied to the surface of the substrate.

The conductor powder may include any one or more selected from the group consisting of copper (Cu), nickel (Ni), iron (Fe), cobalt (Co), silver (Ag), and gold (Au).

In addition, according to another aspect of the present invention, a device for manufacturing a printed circuit board by melting the conductive powder applied to the substrate corresponding to the position where the circuit pattern is to be formed, the support plate on which the substrate is mounted, and is located adjacent to the support plate Provided is a printed circuit board manufacturing apparatus including an electromagnetic induction coil and a power supply unit supplying a current having a predetermined frequency to the electromagnetic induction coil. The electromagnetic induction coil may have a coil spring shape that winds up the support plate.

The substrate is mounted on one surface of the support plate, and the electromagnetic induction coil is preferably located adjacent to the support plate on the other side of the support plate. The electromagnetic induction coil may have a torsion spring shape or a coil spring shape, and a plurality of the electromagnetic induction coils may be disposed in correspondence with a region on which the substrate is mounted. The moving plate may be coupled to the supporting plate such that the substrate mounted on the supporting plate is movable.

Other aspects, features, and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

Hereinafter, preferred embodiments of a method and apparatus for manufacturing a printed circuit board according to the present invention will be described in detail with reference to the accompanying drawings. In the following description with reference to the accompanying drawings, the same or corresponding components have the same reference numerals. And duplicate description thereof will be omitted.

1 is a flowchart illustrating a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention, FIG. 2 is a flowchart illustrating a process of manufacturing a printed circuit board according to an exemplary embodiment of the present invention, and FIG. A flowchart illustrating a printed circuit board manufacturing process according to another exemplary embodiment. 2 and 3, a substrate 10, a trench 12, a conductor powder 20, a circuit 22, and a magnetic field 30 are shown.

In this embodiment, in forming the circuit 22 pattern on the substrate 10, a powdered copper, nickel, iron, cobalt or the like is applied in the shape of the circuit 22 pattern, and then electromagnetic induction heating is performed. It is a printed circuit board manufacturing process in which the conductor powder 20 forms the circuit 22 by melting through it.

That is, since the present embodiment is a method of forming a circuit 22 by melting a powdered conductor through electromagnetic induction heating, the circuit 22 can be formed by a simple dry process without a plating or etching process. There are many problems that can be solved.

Electromagnetic induction means that a magnetic force line occurs when a current flows through a coil, and when the current flowing through the coil is alternating current, the magnetic force line changes periodically according to the period of the alternating current. When another conductor having a permeability is placed close, a phenomenon in which a predetermined voltage is induced in the conductor.

Electromagnetically-induced heating refers to a method of heating an object through eddy currents caused by the induced voltage, where eddy currents or eddy currents are currents flowing in a locally closed passage inside a conductor. It is a current generated by the change of magnetic flux passing through the inside.

Regarding the control of the electromagnetic induction heating, narrowing the distance between the induction coil for heating and the object to be heated increases the heating rate, and the resistance of the metal to be heated and the coil The frequency of alternating current is also related. In particular, the frequency of the alternating current supplied to the coil is a condition for determining the depth at which the object is heated. However, if the frequency is increased to several tens of MHz or more, a phenomenon may occur in which a material other than metal, for example, a surrounding non-metallic object, is heated.

In this embodiment, the electromagnetic induction heating method is applied to the manufacture of a printed circuit board. As shown in FIGS. 2 and 3, the powder having a predetermined permeability in a region where a circuit 22 on the substrate 10 is to be formed is formed. After the applied conductor is applied, the conductor powder 20 is melted through electromagnetic induction heating to complete the circuit 22.

To this end, the conductive powder 20 is first applied to the position where the circuit 22 pattern on the substrate 10 is to be formed (100). The conductor powder 20 is copper (Cu), nickel (Ni), iron (Fe), cobalt (Co), having a predetermined permeability and electrical conductivity so as to be melted by electromagnetic induction heating to form the circuit 22. It may be made of a metal material such as silver (Ag) and gold (Au).

In order to selectively apply the conductor powder 20 to the position where the circuit 22 pattern is to be formed, a mask having the same pattern as that of the circuit 22 pattern perforated is laminated on the substrate 10 (102), and the mask is formed on the substrate ( 10, after applying the conductor powder 20 as a whole (104), the mask is removed 106, so-called 'screen printing' method can be applied. Thus, as shown in FIG. 2A, the conductive powder 20 is applied to only the portion where the circuit 22 is to be formed on the substrate 10.

Alternatively, after the grooves 12 are formed on the substrate 10 in the same pattern as the circuit 22 pattern (103), and the conductive powders 20 are applied so that the conductor powders 20 are filled in the grooves 12 ( 105, by removing the conductive powder 20 remaining on the surface of the substrate 10 without filling the trench 12 (107), selectively applying the conductive powder 20 only to the position where the circuit 22 pattern is to be formed. can do. As a result, the conductive powder 20 is filled in the trench 12 formed in the substrate 10 as shown in FIG. 3A.

To form the grooves 12 in a predetermined pattern on the substrate 10, a selective etching process used in a conventional printed circuit board manufacturing process may be applied. After forming the grooves 12 on the substrate 10 and applying the conductive powders 20 to be filled, although the process of forming the grooves 12 is added, the conductive powders 20 may be adjusted by controlling the depth of the grooves 12. There is an advantage that the thickness of the circuit 22 formed due to the melting of can be adjusted.

Next, a current having a predetermined frequency, such as alternating current, is supplied to the electromagnetic induction coil located adjacent to the substrate 10 so that the conductor powder 20 is surrounded by FIGS. 2B and 3B. The magnetic field 30 is formed as shown in FIG. Accordingly, the conductor powder 20 is heated and melted by electron induction.

As described above, when the alternating current is supplied to the electromagnetic induction coil, the conductor powder 20 is heated and melted by the electromagnetic induction. When the magnetic field 30 is maintained by the electromagnetic induction for a predetermined time or more, the conductor powder 20 Since the phenomenon of heating up to an object other than the above may occur, it is preferable that the current is supplied to the electromagnetic induction coil only during the time when the conductor powder 20 is melted due to the heating by the electromagnetic induction.

As a result, the conductor powder 20 coated on the substrate 10 is melted to form a circuit 22. Finally, after the conductor powder 20 is melted, the electric current supplied to the electromagnetic induction coil 120 is blocked, whereby a printed circuit board on which the circuit 22 pattern is formed is manufactured.

Figure 4 is a schematic diagram showing a printed circuit board manufacturing apparatus according to a first embodiment of the present invention, Figure 5 is a schematic diagram showing a printed circuit board manufacturing apparatus according to a second preferred embodiment of the present invention, Figure 6 Schematic diagram showing a printed circuit board manufacturing apparatus according to a third preferred embodiment of the invention Figure 7 is a schematic diagram showing a printed circuit board manufacturing apparatus according to a fourth preferred embodiment of the present invention. 4 to 7, the substrate 10, the conductor powder 20, the support plate 40, the moving means 42, the electromagnetic induction coils 50, 52, 54, and the power supply unit 60 are illustrated. .

The configuration of the printed circuit board manufacturing apparatus using the electromagnetic induction heating method according to the present embodiment can be largely implemented in three types as shown in FIGS. 4 to 6. 4, the coil is wound around the substrate 10 so that the magnetic field 30 generated by the electromagnetic induction coil 50 directly reaches the substrate 10, that is, the substrate 10 is formed inside the coil. 5, the torsion spring-shaped electromagnetic induction coil 52 is positioned on the lower surface of the substrate 10. In the case of FIG. 6, the coil spring-shaped electromagnetic induction coil 54 is disposed on the substrate 10. It is located on the bottom surface. 5 and 6, the magnetic field 30 generated from the electromagnetic induction coils 52 and 54 is formed from the lower side to the upper side of the substrate 10 so that the conductor powder 20 is heated by the electromagnetic induction. to be.

That is, the apparatus for manufacturing a printed circuit board according to the present embodiment is a device for melting the conductive powder 20 applied at the position where the circuit 22 pattern is to be formed by heating by electromagnetic induction. It consists of the support plate 40 for mounting the board | substrate 10, and the electromagnetic induction coils 50, 52, and 54 located adjacent to the support plate 40. As shown in FIG. A power source is connected to the electromagnetic induction coils 50, 52, and 54 so as to supply a current having a predetermined frequency such as alternating current.

4 shows a substrate 10 selectively coated with coil powder on a moving means 42 such as a roller or a belt provided on the support plate 40, and the coil spring-shaped electromagnetic induction coil 50 is placed on the substrate 10. By arranging the electromagnetic induction coil 50 so as to be formed in the form of winding), the magnetic field 30 formed by the electromagnetic induction extends to the conductor powder 20 applied to the substrate 10. As described above, since the degree of electromagnetic induction heating may vary depending on the distance between the electromagnetic induction coil 50 and the substrate 10, the substrate 10 may be placed on the support plate 40 so as to be movable.

On the other hand, the electromagnetic induction coil 50 is connected to the power source so that the alternating current can be supplied, the degree of electromagnetic induction heating varies depending on the frequency of the current supplied to the coil, including the power supply or connected to the power supply It is preferable to combine a control device that can adjust the frequency of the current.

Unlike FIG. 4, the electromagnetic induction coils 52 and 54 may be disposed on the bottom surface of the support plate 40 while the substrate 10 is placed on the top surface of the support plate 40. In this case, as shown in FIG. 5, the electromagnetic induction coil 52 may be formed in a torsion spring shape so as to be attached to the lower surface of the substrate 10. As shown in FIG. 6, the coil spring shape electromagnetic induction coil 54 may be attached to the substrate ( It may be attached to the lower surface of 10). In the case of FIG. 6, the electromagnetic induction coil 54 may be disposed so that the magnetic force lines formed by the electromagnetic induction coil 54 may pass through the conductor powder 20 applied to the substrate 10.

On the other hand, as shown in FIGS. 4 to 6 when the magnetic field 30 is formed by one electromagnetic induction coil to heat the conductor powder 20 applied to the substrate 10, the magnetic force line passing through the conductor powder 20 The direction may be different for each conductor powder 20, especially at the center and the end of the substrate 10, and thus, the degree of electromagnetic induction heating of each conductor powder 20 may vary.

In this case, when a plurality of electromagnetic induction coils 54 are arranged as shown in FIG. 7, the magnetic force lines formed for each coil penetrate the substrate 10, and as a result, the magnetic force lines are constantly in a direction perpendicular to the substrate 10. Can be formed. As a result, a uniform magnetic field 30 may be formed as a whole without variation according to each conductor powder 20, so that more uniform electromagnetic induction heating may be performed.

In the case where a plurality of electromagnetic induction coils 54 are arranged, the area corresponding to the area where the conductor powder 20 is applied on the substrate 10 so that the uniform magnetic field 30 is formed on the conductor powder 20. It is preferable to arrange the electromagnetic induction coil 54. On the other hand, as described above, by moving the roller, belt, etc. to the support plate 40 on which the substrate 10 is mounted so that the degree of electromagnetic induction heating can be adjusted by adjusting the distance between the conductor powder 20 and the electromagnetic induction coil 54. Means 42 are preferably formed.

Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

According to a preferred embodiment of the present invention as described above, by applying a conductive pattern to a substrate in a predetermined pattern, and by melting it by an electromagnetic induction heating method to form a circuit pattern with high precision can be easily manufactured with high precision .

In addition, exposure, development, peeling, etching, plating, and other processes applied to the conventional PCB manufacturing process can be omitted, thereby shortening the process, reducing the process cost and defective rate, and the overall equipment is simple. Therefore, it is possible to reduce the installation space and to form a circuit pattern only by the dry process, thereby reducing the amount of wastewater discharged.

Claims (13)

(a) applying the conductor powder to the substrate corresponding to the position where the circuit pattern is to be formed; (b) supplying an alternating current to an electromagnetic induction coil located adjacent to the substrate; And (c) blocking the AC current supplied to the electromagnetic induction coil. The method of claim 1, The step (b) is a printed circuit board manufacturing method, characterized in that carried out during the time that the conductor powder is melted due to the heating by the electromagnetic induction. The method of claim 1, Step (a) is, (a1) stacking a mask having a pattern corresponding to the circuit pattern on the substrate; (a2) applying the conductor powder to the mask; And (a3) A method of manufacturing a printed circuit board comprising the step of removing the mask. The method of claim 1, Step (a) is, (a4) forming a groove of the pattern corresponding to the circuit pattern on the substrate; And (a5) A method of manufacturing a printed circuit board comprising applying the conductor powder to the substrate such that the conductor powder is filled in the groove. The method of claim 4, wherein After the step (a5), (a6) The method of manufacturing a printed circuit board further comprising the step of removing the conductor powder applied to the surface of the substrate. The method of claim 1, The conductive powder includes at least one selected from the group consisting of copper (Cu), nickel (Ni), iron (Fe), cobalt (Co), silver (Ag), and gold (Au). Substrate manufacturing method. An apparatus for manufacturing a printed circuit board by melting the conductive powder applied to the substrate corresponding to the position where the circuit pattern is to be formed, A support plate on which the substrate is mounted; An electromagnetic induction coil positioned adjacent to the support plate; Printed circuit board manufacturing apparatus comprising a power supply for supplying an alternating current to the electromagnetic induction coil. The method of claim 7, wherein The electromagnetic induction coil has a coil spring shape for winding the support plate. The method of claim 7, wherein The substrate is mounted on one surface of the support plate, the electromagnetic induction coil is a printed circuit board manufacturing apparatus, characterized in that located adjacent to the support plate on the other surface of the support plate. The method of claim 9, The electromagnetic induction coil has a torsion spring shape, characterized in that the printed circuit board manufacturing apparatus. The method of claim 9, The electromagnetic induction coil has a coil spring shape, and a plurality of printed circuit board manufacturing apparatus, characterized in that arranged in correspondence to the area on which the substrate is mounted. The method of claim 7, wherein Printed circuit board manufacturing apparatus characterized in that the moving plate is coupled to the support plate to move the substrate mounted on the support plate. The method of claim 7, wherein The conductive powder includes at least one selected from the group consisting of copper (Cu), nickel (Ni), iron (Fe), cobalt (Co), silver (Ag), and gold (Au). Substrate manufacturing apparatus.

Images