KR100808793B1 - Structure for preventing backward flow in drain pipe of semiconductor washing device - Google Patents

Structure for preventing backward flow in drain pipe of semiconductor washing device Download PDF

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KR100808793B1
KR100808793B1 KR1020030101881A KR20030101881A KR100808793B1 KR 100808793 B1 KR100808793 B1 KR 100808793B1 KR 1020030101881 A KR1020030101881 A KR 1020030101881A KR 20030101881 A KR20030101881 A KR 20030101881A KR 100808793 B1 KR100808793 B1 KR 100808793B1
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drain pipe
fluid
backflow
thin film
cleaning device
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KR1020030101881A
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Korean (ko)
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KR20050069627A (en
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이재권
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동부일렉트로닉스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Sink And Installation For Waste Water (AREA)

Abstract

본 발명은 반도체 습식 세정장치의 배수관 내부를 흐르는 유체가 세정장치로 역류되는 것을 방지하는 구조에 대한 것이다. 본 발명에 따른 역류방지구조는, 세정장치와 연결된 배수관(10) 내부에 그 내주면을 따라 다수의 박막 날개(22)들이 소정 각도로 경사진 상태로 서로 겹쳐지게 배열되어 이루어지며, 박막 날개(22)들은 유체가 배수관(10) 내부를 역방향으로 흐를 때 유체의 압력에 의하여 서로 좁혀짐으로써 배수관(10)을 밀폐하여, 유체의 역류를 방지한다. 본 발명에 의하면, 배수관에 역류방지를 위한 별도의 체크밸브를 설치할 필요가 없으므로, 좁은 공간에서의 배관 설치 및 보수 작업 용이하다는 장점이 있다.The present invention relates to a structure for preventing a fluid flowing inside a drain pipe of a semiconductor wet cleaning device from flowing back to the cleaning device. The backflow prevention structure according to the present invention is made of a plurality of thin film vanes 22 arranged along the inner circumferential surface of the drain pipe 10 connected to the cleaning device so as to be inclined at a predetermined angle to overlap each other, and the thin film vanes 22 ) Closes the drain pipe 10 by narrowing each other by the pressure of the fluid when the fluid flows in the reverse direction of the drain pipe 10 to prevent the backflow of the fluid. According to the present invention, there is no need to install a separate check valve for preventing the backflow in the drain pipe, there is an advantage that the piping installation and maintenance work in a narrow space is easy.

반도체, 세정, 테플론, 배관, 배수, 역류Semiconductor, Cleaning, Teflon, Plumbing, Drainage, Backflow

Description

반도체 세정장치 배수관의 역류방지구조{Structure for preventing backward flow in drain pipe of semiconductor washing device} Structure for preventing backward flow in drain pipe of semiconductor washing device             

도 1은 종래의 습식 세정장치에 사용되는 배수관을 나타낸 사시도.1 is a perspective view showing a drain pipe used in a conventional wet cleaning device.

도 2는 본 발명에 따른 역류방지구조가 적용된 배수관의 측단면도.Figure 2 is a side cross-sectional view of the drain pipe to which the backflow prevention structure according to the present invention is applied.

도 3은 도 2의 A-A선 단면도.3 is a cross-sectional view taken along the line A-A of FIG.

도 4는 본 발명에 따른 역류방지 구조물의 사시도.
4 is a perspective view of the backflow prevention structure according to the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

10 : 배수관 20 : 역류방지 구조물10: drain pipe 20: backflow prevention structure

22 : 박막 날개
22: thin film wings

본 발명은 반도체 습식 세정장치에 관한 것으로서, 더욱 상세하게는 습식 세정장치의 배수관의 역류를 방지하는 구조에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wet cleaning apparatus, and more particularly, to a structure for preventing backflow of a drain pipe of a wet cleaning apparatus.                         

반도체 장비 중 습식 세정장치에서는 각종 화학용액(Chemical)을 사용하여, 유기물, 무기물 및 파티글(Particle)을 세정하게 되는데, 세정 횟수나 시간에 의하여 화학용액의 수명(Chemical Life Time)에는 제한이 있다. 따라서, 세정 횟수나 시간에 따라 화확용액의 수명이 다하면, 세정장치에 연결된 배수관을 통해 배수하고 새로운 화학용액으로 교체하여야 한다. In the wet cleaning device of semiconductor equipment, various chemical solutions (Chemical) are used to clean organic materials, inorganic materials, and particles (particles), but the chemical life time is limited by the number of times and the time of cleaning. . Therefore, if the chemical solution reaches the end of its life according to the number of cleaning cycles or time, it must be drained through a drain pipe connected to the cleaning device and replaced with a new chemical solution.

도 1은 일반적인 습식 세정장치에 사용되는 배수관을 나타낸 도면이다. 도 1에 도시된 바와 같이, 종래의 배수관(1)은 테프론(Teflon) 소재로 만들어지며, 내부가 관통되어 있는 통상적인 원통형 파이프로 형성되어 있다. 한편, 이와 같은 테프론 배관은 고온의 화학용액의 배수관으로서만이 아니라, 순환 및 공급 라인과, 초순수의 공급 및 배수 라인에도 사용되고 있다.1 is a view showing a drain pipe used in a general wet cleaning device. As shown in FIG. 1, the conventional drain pipe 1 is made of Teflon material and is formed of a conventional cylindrical pipe penetrating therein. On the other hand, such Teflon piping is used not only as a drain pipe for high temperature chemical solution, but also for circulation and supply lines, and ultrapure water supply and drain lines.

그런데, 이러한 형태의 배수관(1)에 의하면, 간혹 배수관(1) 자체의 문제나, 세정장치와 배수관(1)을 연결하는 배수 밸브(미도시)의 고장으로 인하여 외부 오염물이 역류하여 세정장치로 유입되는 문제가 있다. 이와 같이, 오염물이 세정장치로 역류하면, 순환 라인 및 세정조(Bath)내의 오염을 유발 시키며, 화학용액의 질에 나쁜 영향을 주어 웨이퍼 생산에 지장을 초래 한다.By the way, according to the drain pipe 1 of this type, external contaminants flow back to the cleaning device due to a problem of the drain pipe 1 itself or a failure of the drain valve (not shown) connecting the cleaning device and the drain pipe 1. There is an inflow problem. As such, when the contaminants flow back to the cleaning apparatus, contamination in the circulation line and the cleaning bath (Bath) may occur, and the quality of the chemical solution may be adversely affected and the wafer production may be disturbed.

이러한 역류 현상을 방지하기 위하여, 배수관(1)에 별도의 체크밸브(Check Valve)(미도시)를 설치하여 사용하고 있으나, 이와 같이 별도의 체크밸브를 설치하기 위해서는 추가적인 설치 작업이 필요하며 협소한 공간에서의 설치 작업시 작업이 용이하지 않다는 문제점이 있다.
In order to prevent such a reverse flow phenomenon, a separate check valve (not shown) is installed and used in the drain pipe 1, but in order to install a separate check valve as described above, additional installation work is necessary and narrow. There is a problem that the work is not easy when the installation work in the space.

본 발명은 상기와 같은 문제점을 해결하기 위하여 개발된 것으로서, 별도의 체크밸브를 설치 않고도 오염물이 세정장치의 내부로 역류하는 것을 방지할 수 있도록, 배수관 내부에 직접 형성되는 역류방지구조를 제공하는 것을 목적으로 한다.
The present invention was developed to solve the above problems, It is an object of the present invention to provide a backflow prevention structure that is formed directly inside a drain pipe to prevent contaminants from flowing back into the cleaning apparatus without installing a separate check valve.

상기와 같은 본 발명의 목적은, 반도체 습식 세정장치와 연결된 배수관 내부에 그 내주면을 따라 다수의 박막 날개들이 소정 각도로 경사진 상태로 서로 겹쳐지게 배열되어 이루어지며, 상기 박막 날개들은 유체가 상기 배수관 내부를 역방향으로 흐를 때 유체의 압력에 의하여 서로 좁혀짐으로써 상기 배수관을 밀폐하는 것을 특징으로 하는 역류방지구조를 제공함으로써 달성된다.An object of the present invention as described above, a plurality of thin film blades are arranged to overlap each other in a state inclined at a predetermined angle along the inner circumferential surface in the drain pipe connected to the semiconductor wet cleaning device, the thin film blades fluid is the drain pipe It is achieved by providing a backflow preventing structure characterized in that the drainage pipe is closed by narrowing each other by the pressure of the fluid when flowing inside.

한편, 상기 박막 날개는 상기 배수관과 동일하게 테플론 소재를 형성되는 것이 바람직하다.
On the other hand, the thin film wing is preferably formed of a Teflon material in the same way as the drain pipe.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

도 2는 본 발명에 따른 역류방지구조가 적용된 세정장치의 배관의 단면도이다. 도 2에 도시된 바와 같이, 배수관(10)은 테플론(Teflon) 소재의 원통형 파이프로 이루어져 있다. 그리고, 배수관(10)의 내부에는 유체(화학용액 또는 초순수)의 흐름 방향에 따라 배수관(10)의 단면을 개방하거나 밀페하는 역류방지 구조물(20)이 설치되어 있다. 2 is a cross-sectional view of the pipe of the cleaning device to which the backflow prevention structure according to the present invention is applied. As shown in FIG. 2, the drain pipe 10 is formed of a cylindrical pipe made of Teflon material. In addition, the backflow prevention structure 20 is installed inside the drainage pipe 10 to open or close the end surface of the drainage pipe 10 according to the flow direction of the fluid (chemical solution or ultrapure water).

역류방지 구조물(20)은 배수관(10)의 내벽에 일체로 고정된 상태에서 배수관(10)의 길이방향을 따라 선단부(21)로 갈수록 점차 그 내경이 작아지는 노즐형의 단면 형상을 가지며, 유체의 흐름에 따라 선단부(21) 구멍의 직경이 늘어나거나 줄어드는 구조로 이루어져 있다. 즉, 역류방지 구조물(20)은 배수관(10) 내를 흐르는 유체(화학용액)가 도 2에 실선의 화살표로 나타낸 바와 같이 정방향으로 흐를 때는 선단부(21) 구멍의 직경이 늘어나 유체를 통과시키지만, 유체가 도 2에서 점선의 화살표로 나타낸 바와 같이 역방향으로 흐를 때는 선단부(21) 구멍의 직경이 작아지다가 최종적으로 밀폐(도 2에서의 점선의 상태)됨으로써, 유체가 세정장치의 내부로 역류하는 것을 방지한다.The non-return structure 20 has a nozzle-shaped cross-sectional shape that gradually decreases its inner diameter toward the tip portion 21 along the longitudinal direction of the drain pipe 10 in a state of being integrally fixed to the inner wall of the drain pipe 10. According to the flow of the tip portion 21 is made of a structure that increases or decreases the diameter of the hole. That is, the backflow prevention structure 20 is a fluid (chemical solution) flowing in the drain pipe 10, as shown by the solid arrow in Figure 2 flows in the forward direction, the diameter of the hole of the tip portion 21 is increased to pass the fluid, When the fluid flows in the reverse direction, as indicated by the dotted arrows in FIG. 2, the diameter of the hole of the tip 21 decreases and finally closes (the dotted state in FIG. 2), whereby the fluid flows back into the cleaning apparatus. prevent.

도 3은 도 2에서의 A-A선 단면도로서, 역류방지 구조물(20)의 정면 형태를 나타낸 것이며, 도 4는 역류방지 구조물(20)의 사시도이다.3 is a cross-sectional view taken along the line A-A in Figure 2, showing the front shape of the backflow prevention structure 20, Figure 4 is a perspective view of the backflow prevention structure (20).

도 3 및 도 4에 도시된 바와 같이, 역류방지 구조물(20)은 다수의 박막 날개(22)들이 배수관(10)의 내주면을 따라 소정 각도로 경사진 상태로 서로 겹쳐지게 배열되어 형성된다. 상기 다수의 박막 날개(22)들은, 배수관(10)과 마찬가지로 테플론 소재로 이루어진다.As shown in FIGS. 3 and 4, the backflow prevention structure 20 is formed by arranging the plurality of thin film vanes 22 overlapping each other in an inclined state at an angle along the inner circumferential surface of the drain pipe 10. The plurality of thin film vanes 22 is made of a Teflon material, similar to the drain pipe 10.

따라서, 유체가 배수관(10) 내에서 정방향으로 흐를 때는, 박막 날개(22)들의 서로 벌어지면서 그 선단부(21)의 구멍이 확대되어 유체가 원활하게 흐르게 되며, 유체가 역방향으로 흐를 때는, 유체의 압력에 의하여 박막 날개(22)들이 서로 좁혀지면서 선단부(21)의 구멍이 점차 축소되어 최종적으로는 밀폐됨으로써 유체가 역류방지 구조물(20)의 상류 쪽으로 역류하지 못하도록 한다.Therefore, when the fluid flows in the drain pipe 10 in the forward direction, the openings of the tip portion 21 of the thin-film vanes 22 are enlarged so that the fluid flows smoothly, and when the fluid flows in the reverse direction, As the thin-film vanes 22 are narrowed by pressure, the holes of the tip portion 21 are gradually reduced to be finally closed, thereby preventing the fluid from flowing back upstream of the backflow preventing structure 20.

한편, 이상의 실시예에서는 역류방지 구조물(20)을 배수관(10)에 설치한 것을 예로 들어 설명하였으나, 역류방지 구조물(20)을 습식 세정장치의 다른 배관들, 즉 공급관이나 순환배관 등과 같은 곳에 설치하여 적용할 수도 있을 것이다.
On the other hand, in the above embodiment has been described as an example in which the backflow preventing structure 20 is installed in the drain pipe 10 as an example, the backflow preventing structure 20 is installed in other pipes of the wet scrubber, that is, the supply pipe or the circulation pipe, etc. May be applied.

이상에서 설명한 바와 같이, 본 발명에 의하면, 다수의 박막 날개들이 습식세정 장치의 배수관 내주면을 따라 서로 겹쳐지게 배열된 역류방지 구조물을 구비함으로써, 오염물이 습식 세정장치의 내부로 역류하는 것을 방지할 수 있다. As described above, according to the present invention, a plurality of thin film vanes are provided with a backflow prevention structure arranged to overlap each other along the inner circumferential surface of the drain pipe of the wet cleaning device, thereby preventing contaminants from flowing back into the inside of the wet cleaning device. have.

그에 따라, 배수관에 별도의 체크밸브를 설치할 필요가 없으므로, 좁은 공간에서의 배관 설치 및 보수 작업 용이하다는 장점이 있다.Accordingly, there is no need to install a separate check valve in the drain pipe, there is an advantage that the piping installation and maintenance work in a narrow space is easy.

이상에서는 본 발명의 특정의 바람직한 실시예에 대하여 도시하고 또한 설명하였다. 그러나, 본 발명은 상술한 실시예에 한정되지 아니하며, 특허청구의 범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형실시가 가능할 것이다.In the above, certain preferred embodiments of the present invention have been illustrated and described. However, the present invention is not limited to the above-described embodiments, and various modifications can be made by those skilled in the art without departing from the gist of the present invention as claimed in the claims. will be.

Claims (2)

반도체 습식 세정장치와 연결된 배수관(10) 내부에 그 내주면을 따라 다수의 박막 날개(22)들이 경사진 상태로 서로 겹쳐지게 배열되어 이루어지며, 상기 박막 날개(22)들은 유체가 상기 배수관(10) 내부를 역방향으로 흐를 때 유체의 압력에 의하여 서로 좁혀짐으로써 상기 배수관(10)을 밀폐하는 것을 특징으로 하는 역류방지구조.A plurality of thin film vanes 22 are arranged to overlap each other in an inclined state along an inner circumferential surface of the drain tube 10 connected to the semiconductor wet scrubber, and the thin film vanes 22 have fluid in the drain tube 10. Backflow prevention structure characterized in that to close the drain pipe by narrowing each other by the pressure of the fluid when flowing inside the reverse direction. 제 1 항에 있어서,The method of claim 1, 상기 박막 날개(22)는 테플론 소재를 형성되는 것을 특징으로 하는 역류방지구조.The thin film blade 22 is a backflow prevention structure, characterized in that to form a Teflon material.
KR1020030101881A 2003-12-31 2003-12-31 Structure for preventing backward flow in drain pipe of semiconductor washing device KR100808793B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230158921A (en) * 2022-05-12 2023-11-21 주식회사 경신 Corrugated tube for wire harness

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102233409B1 (en) * 2020-08-26 2021-03-29 주식회사 썬하이테크 Composition for repairing semiconductor pipes and a method for repairing semiconductor pipes using the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980005313U (en) * 1996-06-27 1998-03-30 Exhaust system with backflow prevention
KR20010019003A (en) * 1999-08-24 2001-03-15 김영환 Backward preventing apparatus for semiconductor etching equipment
KR200280148Y1 (en) * 2002-03-12 2002-07-02 임호훈 A Prevention structure of backward flow for valve

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980005313U (en) * 1996-06-27 1998-03-30 Exhaust system with backflow prevention
KR20010019003A (en) * 1999-08-24 2001-03-15 김영환 Backward preventing apparatus for semiconductor etching equipment
KR200280148Y1 (en) * 2002-03-12 2002-07-02 임호훈 A Prevention structure of backward flow for valve

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230158921A (en) * 2022-05-12 2023-11-21 주식회사 경신 Corrugated tube for wire harness
KR102692796B1 (en) * 2022-05-12 2024-08-07 주식회사 경신 Corrugated tube for wire harness

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