KR100806755B1 - Photo-imaginable low-temperature co-fired ceramic composition and the manufacturing method therof - Google Patents

Abstract

A photo-imaginable low-temperature co-sintered ceramic composition is provided to be used for micro-patterning, show excellent microwave dielectric property and be able to be sintered with an inner conductor. A photo-imaginable low-temperature co-sintered ceramic composition consists of a photo-imaginable organic composition including a binder polymer, a monomer, a photoinitiator, a dispersant and a precipitation preventive agent and a functional inorganic composition including a glass-cordierite(2MgO-2Al2O3-5SiO2) filler complex ceramics or an amorphous cordierite composition(MgO-CaO-2Al2O3-5SiO2), wherein the weight ratio of the organic composition and the inorganic composition is in the range of 30:70-80:20. A method for preparing the photo-imaginable low-temperature co-sintered ceramic composition comprises the steps of: (a) dissolving at least one acrylic based resin having at least one glass transition temperature in an organic solvent to prepare a binder polymer solution; (b) adding the monomer, photoinitiator, dispersant and precipitation preventive agent to the binder polymer solution to prepare an excipient for paste; (c) mixing the excipient with a low-temperature sintered ceramic composition consisting of the glass-cordierite(2MgO-2Al2O3-5SiO2) filler complex ceramics or the amorphous cordierite composition(MgO-CaO-2Al2O3-5SiO2) to prepare a photoimaginable low-temperature co-sintered ceramic paste; and (d) sintering the paste at a temperature of 800-950 deg.C.

Description

Photosensitive low-temperature co-fired ceramic composition and its manufacturing method {PHOTO-IMAGINABLE LOW-TEMPERATURE CO-FIRED CERAMIC COMPOSITION AND THE MANUFACTURING METHOD THEROF}

1A-1D are SEM images of a pattern etched from the photosensitive LTCC paste of Example 1. FIG.

2A-2D are SEM photographs of patterns etched from the photosensitive LTCC paste of Example 2. FIG.

3A and 3B are SEM photographs of patterns obtained by etching the photosensitive LTCC paste of Example 3. FIG.

The present invention relates to a low temperature Co-Fired Ceramics (LTCC) composition and a method of manufacturing the same. Particularly, the present invention relates to a low temperature co-fired ceramics (LTCC) composition and a method of manufacturing the same. A calcined ceramic composition and a method for producing the same.

In recent years, for the fabrication of highly integrated ceramic multilayer integrated modules that can be applied to the next generation of portable information communication devices for digital convergence and ubiquitous, the excellent dielectric materials used for the microcircuit devices and the substrate materials, especially the microwave devices and modules for the RF, microwave and millimeter wave There is a growing interest in microwave materials for low temperature simultaneous firing.

In particular, in the implementation of the microcircuit of the integrated module, conventionally focused on the miniaturization of the conductive electrode material for the electrical signal transmission mainly for the purpose of two-dimensional integration, the electrode circuit pattern for the manufacture of the three-dimensional ultra-high integration system module in the future In addition to miniaturization of the structure, the structure of the RF element and the functional ceramic dielectric composition for three-dimensional connection is also required to be processed into a fine shape.

Therefore, a low temperature cofired ceramic (LTCC) paste, which is a ceramic material capable of processing micropatterns and having excellent microwave dielectric properties and capable of simultaneously firing with internal conductors in a multilayer integrated module, is available. It is required. Such LTCC paste may be prepared to have photosensitivity for patterning by photolithography for circuit realization.

In general, a circuit implementation method using a thick film paste is a screen printing method, which typically provides a pattern resolution of about 100 μm, and a pattern resolution of 50 is used when using some special screens (such as calendar type or etching mesh). Although it is reported that even up to -70㎛, in this case, there is a fatal disadvantage that the roughness or edge of the film actually obtained is not clear. Moreover, this also prevents the provision of connection structures such as via holes. Currently, via holes are reported to be capable of pattern resolutions up to about 100 μm by mechanical punching and up to about 50 μm by laser processing, but these methods are expensive equipment, frequent replacement of jig molds, limitations at high resolution, and There are problems such as constraints on various shapes.

In addition, various composition materials of ceramic pastes having conventional photosensitivity properties have been reported, but most of them have a method of manufacturing barrier ribs or substrates of a plasma display panel (PDP) (for example, Korean Patent No. 295110). And Korean Patent Publication No. 2003-13783) or the conductive electrode material field. In the conventional general fine pattern realization method, after printing and firing a functional material (electrode or ceramic layer), a photosensitive resin is applied to the upper part similarly to the semiconductor etching process, and UV (Ultra Violet) exposure and development are performed to perform fine A pattern is obtained (see US Pat. Nos. 4885963 and 5209688). In particular, US Pat. No. 5209688 describes a method by a transfer method, and Japanese Patent Laid-Open No. 3-57138 discloses a method of etching a photosensitive resin first to form a mold and filling a dielectric paste in the mold. Is a method of using a photosensitive organic film, and Korean Patent No. 491669 proposes a method of manufacturing a dry film resist and a dielectric green sheet and laminating the same, but all have to go through a number of processes. There is a disadvantage in that high resolution is difficult to implement. In addition, these methods are limited to only the unit layer and undergo two heat treatment steps, and thus are not suitable for the multilayer technology.

Accordingly, the present invention was devised to solve the above problems, and an object of the present invention is to provide a photosensitive low-temperature cofired ceramic composition capable of fine patterning and having excellent microwave dielectric properties and co-fired with an internal conductor, and to manufacture the same. To provide a way.

In order to achieve the above object, the photosensitive low-temperature cofired ceramic composition according to an aspect of the present invention includes a photosensitive low-temperature cofired ceramic composition comprising a photosensitive organic composition and a functional inorganic composition, wherein the photosensitive organic composition comprises a binder polymer, a monomer, a photoinitiator, And a dispersant and a sedimentation inhibitor, wherein the functional inorganic composition is composed of a glass + alumina (Al ₂ O ₃ ) filler-based ceramics and a glass + cordierite (2MgO-2Al ₂ O _3-5 SiO ₂ ) filler-based composite system. At least one of the ceramics and the amorphous cordierite composition (MgO-CaO-2Al ₂ O ₃ -5SiO ₂ ).

In addition, the weight ratio of the photosensitive organic composition and the functional inorganic composition may be in the range of 30:70 to 80:20. In this case, the binder polymer may be formed by mixing two acrylic resins having different transition temperatures (T _g ) in a weight ratio of 1: 1 to 1: 3. In addition, the binder polymer is 30 to 50wt of the total amount of the photosensitive organic composition, the monomer is 20 to 35wt% of the total amount of the photosensitive organic composition, the photoinitiator is 5 to 10wt% of the total amount of the photosensitive organic composition, the dispersing agent 1 to 5wt% of the total amount of the total photosensitive organic material, the anti-settling agent may be included in 0.5 to 5wt% of the total amount of the total photosensitive organic material.

In addition, the photosensitive organic composition may further include Benzotriazole to help the UV absorption and increase the refractive index.

In addition, the method for producing a photosensitive low-temperature cofired ceramic composition according to another aspect of the present invention is to prepare a binder polymer solution in which at least one acrylic resin having at least one glass transition temperature is mixed and dissolved in an organic solvent. A first step, a second step of preparing a paste excipient by adding a monomer, a photoinitiator, a dispersant and an antisettling agent to the binder polymer solution, [glass + alumina (Al ₂ O ₃ ) filler] composite ceramics and [glass + cordierite _{(2MgO-2Al 2 O 3 -5SiO} 2) filler; composite ceramics and amorphous cordierite composition _{(MgO-CaO-2Al 2 O} 3 -5SiO 2) to the low-temperature co-fired ceramic composition comprising at least any one of paste A third step of preparing a photosensitive low-temperature cofired ceramic paste by mixing with an excipient for use, and the photosensitive low-temperature cofired ceramic paste It can be achieved by a fourth step of firing at 800 to 950 ℃.

In addition, the third step may further comprise the step of adjusting the viscosity by additionally adding an organic solvent to the photosensitive low-temperature co-fired ceramic composition before mixing the low-temperature fired ceramic composition with the paste excipient.

Hereinafter, the present invention will be described in detail.

First, the photosensitive low-temperature cofired ceramic composition according to the preferred embodiment of the present invention may be provided by mixing a photosensitive organic composition and a low temperature co-fired ceramic (LTCC) composition capable of low-temperature firing as a functional inorganic material. Can be. In this case, the weight ratio of the photosensitive organic compound composition and the LTCC composition is 30:70 to 80:20, preferably 40:60 to 70:30.

In addition, the photosensitive organic substance composition includes a binder polymer, an organic solvent, a photosensitive monomer, a photoinitiator, a dispersant, and an anti-setting agent. This is preferable.

At this time, the binder polymer may be prepared by mixing an acrylic resin having a transition temperature (T _g ) of 80 ° C. and an acrylic resin having a temperature of 123 ° C. in a weight ratio of 1: 1 to 1: 3, preferably 1: 3. The amount of the binder polymer is preferably 30-50 wt% of the total amount of the photosensitive organic material. Further, the acrylic resin having a transition temperature T _g of 80 ° C. is, for example, PB-2648RD (Mitsubishi Rayon), and the acrylic resin having a transition temperature T _g of 123 ° C. is, for example, PB-2656RD ( Mitsubishi Rayon) can be used.

In addition, it is preferable to use γ-Butyrolactone (C ₄ H ₆ O ₂ ) as the organic solvent and triphenylamine (C ₁₈ H ₁₅ N: for example, TPA 330 (Nippon Kayaku Co.)) as the monomer, and for example, as a photoinitiator, As IRACURE 369 (Ciba Specialty Chemical Co., Ltd.), a dispersing agent, Nopco 092 (Sun Nopco Co., Ltd.), and a sedimentation inhibitor, for example, Flownon SP-1000 (Kyoeisha Chemical Co., Ltd.) can be used. In this case, the monomer is 20-35wt% of the total amount of the total photosensitive organic material, the photoinitiator is 5-10wt% of the total amount of the total photosensitive organic material, the dispersant is 1-5wt% of the total amount of the total photosensitive organic material, the antisettling agent is the total Preferably, the total amount of the photosensitive organic substance is 0.5-5 wt%.

In addition, a small amount of Benzotriazole (BT: C ₆ H ₅ N ₃ ) may be added to the photosensitive organic compound in order to increase UV absorption and increase the refractive index of the organic material.

Further, as the LTCC composition, a composite system such as [glass + alumina (Al ₂ O ₃ ) filler], [glass + cordierite: 2MgO-2Al ₂ O ₃ -5SiO ₂ ) filler, etc. (composite) At least one of LTCC, an amorphous cordierite composition (MgO-CaO-2Al ₂ O ₃ -5SiO ₂ ) may be used. At this time, the average particle size of the LTCC is preferably in the range of 0.5-3.0㎛.

In this case, the dielectric properties of the alumina composition used in the composite LTCC are dielectric constant (ε _r ) of about 7.5-7.8, dielectric loss (tanδ) of about 0.0025-0.0033, and thermal coefficient of expansion (TCE). ) Is approximately 5.4-5.6 ppm / ° C. In addition, the cordierite composition (2MgO-2Al ₂ O ₃ -5SiO ₂ ) used in the composite LTCC is a pure cordierite crystalline composition and shows a complete crystal phase at a high temperature of 1200 ° C. or higher, and its dielectric constant (ε _r ) is About 4.2, dielectric loss (tanδ) is about 0.0015 (@ 100 kHz), and coefficient of thermal expansion (TCE) is about 2.83 ppm / ° C. In this case, the glass powder used in the composite LTCC composition has a dielectric constant (ε _r ) of about 4, a dielectric loss (tanδ) of about 0.0015, a thermal expansion coefficient (TCE) of about 4.2 ppm / ° C, and a glass transition temperature (T _g). ) Is approximately 350-430 ° C and the softening point is approximately 650-680 ° C. Therefore, the composite LTCC including the glass can be calcined at a low temperature, and in the case of the [glass + cordierite filler] composition, the glass transition temperature (T _g ) may be lowered to 650-820 ° C., resulting in an excellent dielectric. It is possible to have low temperature firing while having characteristics. At this time, the refractive index is 2.5 or less, Preferably it is 1.5-2.0.

In addition, the amorphous cordierite composition (MgO-CaO-2Al ₂ O ₃ -5SiO ₂ ) has a glass transition temperature (T _g ) of 675-810 ° C., thus enabling low temperature firing. Thus, the composition can be sintered at 2 hours holding at 800-850 ° C. The dielectric constant (ε _r ) is about 6.7, the dielectric loss (tanδ) is about 1.4x10 ^-3 (@ 1 MHz), and the coefficient of thermal expansion (TCE) is about 5.3 ppm / ° C. In addition, the average particle size of the amorphous cordierite composition is 1.8-2.8㎛, in order to obtain a resolution of 50㎛ or less in the photosensitive etching process to obtain a fine pattern, the average particle diameter is 2.5㎛, D ₉₀ is 10㎛ or less possible, preferably Preferably less than 5 μm. In particular, the amorphous cordierite composition powder has a refractive index of 1.5-1.7, preferably about 1.65, which is very low compared to the conventional composite LTCC, and has a very small refractive index difference with the organic material used in the paste.

According to another preferred embodiment of the present invention, a method for preparing a photosensitive low-temperature cofired ceramic composition includes preparing a photosensitive organic material, pretreating the LTCC powder as a functional inorganic material, and mixing the LTCC powder with the photosensitive organic material. It may consist of preparing the LTCC composition.

In this case, the step of preparing the photosensitive organic material is prepared by first mixing and dissolving the binder polymer and the organic solvent to prepare a predetermined solution, by mixing the photosensitive monomer and additives such as photoinitiator, dispersant and anti-settling agent in the solution The photosensitive organic material may be prepared.

In addition, the method of manufacturing a photosensitive low-temperature cofired ceramic composition according to another preferred embodiment of the present invention is to form a thick film paste and pattern the same, and after coating the photosensitive LTCC paste as described above, coating and printing Adjusting the viscosity to a suitable viscosity, applying a thick film paste onto the substrate for fine patterning of the functional thick film, and drying the applied photosensitive LTCC thick film and ultraviolet light exposure, development and etching to form a fine pattern. It may further include. In addition, in this case, after the patterning is completed, the method may further include a heat treatment at 800-900 ° C. for 2 hours in an atmospheric atmosphere.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in detail. However, the embodiments described below are provided to help the overall understanding of the present invention, and the present invention is not limited only to the following examples.

Example  One

In this embodiment, a photosensitive LTCC ceramic paste including a photosensitive organic compound composition and a composite LTCC of [glass + alumina (Al ₂ O ₃ ) filler] as an LTCC composition was prepared.

First, in the photosensitive organic composition, in the case of the binder polymer, glass transition temperature (Tg) of 80 ° C and 123 ° C was respectively obtained using acrylic resins PB-2648RD (Mitsubishi Rayon) and PB-2656RD (Mitsubishi Rayon). Mix by weight ratio 3. An organic solvent (γ-Butyrolactone: γ-BL) was added to the mixed polymer binder resin and stirred at a temperature of 60-70 ° C. to completely dissolve it. Triphenylamine (TPA 330 (Nippon Kayaku)) as a monomer, IRACURE 369 (Ciba Specialty Chemical) as a photoinitiator, Nopco 092 (Sun Nopco) as a dispersant, and Flownon SP-1000 (Kyoeisha Chemical as a sedimentation agent) ), And paste excipients were prepared by adding organic materials including Benzotriazole (BT) to increase UV absorption and refractive index correction of photosensitive paste.

The composite LTCC powder of [glass + alumina filler] was kept at 300-400 ° C. for about 4 hours to remove moisture, and then mixed with the paste excipient. At this time, the mixing of the paste is first mixed with a high-speed centrifugal mixer (about 2,000rpm) in the first mixing the LTCC powder and the excipient in a weight ratio of 70:30, then the paste mixture in a 3-roll mill 3- The mixture was mixed five times to break up the aggregates of the paste and to homogenize the rheology. Finally, an organic solvent (γ-BL) was further added thereto, followed by remixing to have a viscosity suitable for spin coating or screen printing.

The composition ratio of the present embodiment as described above is summarized in Table 1 below, and the numerical value in parentheses in the weight ratio indicates the weight ratio of the organic solvent (γ-BL) added and remixed when the viscosity is adjusted:

Table 1

Paste ingredients Weight ratio (wt%) Remarks LTCC [Glass + Alumina] 70.0    Photosensitive organic composition TPA330 7.2 Polymer 15.0 IRACURE 369 3.6 Sudan Ⅳ 0.1 Nopco 092 0.5 BT 3.15 Flownon SP-1000 0.7 Organic solvents γ-BL 20 (+15) () Is the organic solvent added Sum 100 (+ 20-35) 〃

Example  2

In this embodiment, a photosensitive LTCC ceramic paste including a photosensitive organic compound composition and a composite LTCC of [glass + cordierite filler] as an LTCC composition was prepared, and the cordierite was composed of 2MgO-2Al ₂ O ₃ -5SiO ₂ . It was crystalline cordierite. And all other processes were the same as Example 1.

The composition ratio of this example is summarized in Table 2 below, and the numerical value in parentheses in the weight ratio indicates the weight ratio of the organic solvent (γ-BL) added and remixed when the viscosity is adjusted:

TABLE 2

Paste ingredients Weight ratio (wt%) Remarks LTCC [Glass + cordier light] 63.0 Crystalline Cordierite (2MgO-2Al ₂ O ₃ -5SiO ₂ )    Photosensitive organic composition TPA330 8.1 Polymer 17.5 IRACURE 369 3.5 Sudan Ⅳ 0.5 Nopco 092 0.6 BT 7.0 Flownon SP-1000 0.8 Organic solvents γ-BL 20 (+10) () Is the organic solvent added Sum 100 (+ 20-30) 〃

Example  3

In this embodiment, a photosensitive LTCC ceramic paste having a photosensitive organic composition and an amorphous cordierite composition (MgO-CaO-2Al ₂ O ₃ -5SiO ₂ ) as an LTCC composition was prepared, and all other processes were the same as in Example 1. It was made.

The composition ratio of this example is summarized in Table 3 below, and the numerical value in parentheses in the weight ratio indicates the weight ratio of the organic solvent (γ-BL) which is added and remixed during viscosity adjustment.

TABLE 3

Paste ingredients Weight ratio (wt%) Remarks LTCC Amorphous cordierite 63.0 MgO-CaO-2Al ₂ O ₃ -5SiO ₂    Photosensitive organic composition TPA330 8.1 Polymer 17.5 IRACURE 369 3.5 Sudan Ⅳ 0.5 Nopco 092 0.6 BT 7.0 Flownon SP-1000 0.8 Organic solvents γ-BL 20 (+10) () Is the organic solvent added Sum 100 (+ 20-30) 〃

Example  4

In this embodiment, a thick film paste was formed and patterned using the photosensitive LTCC paste prepared in Examples 1-3.

First, the output of the exposure machine for UV curing the photosensitive LTCC ceramic paste is set to 350-450W and the exposure conditions are exposed for 30-90 seconds, particularly preferably 350W for 40 seconds using a 500mW UV lamp of 365nm wavelength It was cured and it was increased and decreased according to the content of each LTCC powder. The developer was spray-sprayed using an aqueous solution of 0.25-2 mol%, preferably 0.5-0.75 mol%, in which NaCO ₃ or diethanolamine (DEA) was dissolved in deionized water, and then washed with deionized water. Was set to 20-25 ° C. Then, the development was etched with the aqueous solution for 30-90 seconds, and after the patterning was completed, the heat treatment in an atmospheric atmosphere at 800-950 ℃ for 2 hours.

1A-1D, 2A-2D, and 3A, 3B show electron microscopy (SEM) photographs of pastes of Examples 1-3 patterned with micro via holes as described above in sizes according to respective predetermined magnifications, In particular, Figures 3a and 3b is a heat treatment in an atmospheric atmosphere for 2 hours at 800-900 ℃ after patterning. That is, FIGS. 1A-1D show the SEM picture of Example 1, FIGS. 2A-2D show the SEM picture of Example 2, and FIGS. 3A and 3B show the SEM picture of Example 3, respectively.

Referring to Table 1 and FIGS. 1A-1D, Example 1 is a photosensitive LTCC ceramic paste which is a composite LTCC of [glass + alumina filler], and it is understood that the resolution of the UV-etched fine via holes is not very good. Furthermore, in the case of the via hole of 50 μm or less, the original circular pattern was hardly realized. This is due to the difference in refractive index according to the difference in dielectric constant. In other words, the composite LTCC of [glass + alumina filler] is a mixture of glass having a dielectric constant of 4 and alumina having a dielectric constant of 9 and has a large value with an average dielectric constant of 7.5 or more. However, in the case of photoetching the thick-film paste printed matter, the transmission of UV light is affected by the refractive index of the organic material and the refractive index of the filled inorganic material, and in general, the refractive index of the material is directly proportional to the dielectric constant. Therefore, the refractive index of the composite LTCC of the [glass + alumina filler] has a large difference from the average refractive index of 1.33-1.45 of the organic material, and the scattering rate of UV rays irradiated to the thick film is increased. As a result, an irregular interface is formed during UV curing of the photosensitive resin and the UV transmittance is also lowered, thereby lowering the resolution.

In addition, referring to Table 2 and FIGS. 2A-2D, Example 2 is a photosensitive LTCC ceramic paste which is a composite LTCC of [glass + cordierite filler], having a glass having a dielectric constant of 4 and a relatively low dielectric constant of 4.2. Since the composition is composed of an alight, the difference in refractive index between the photosensitive organic material and the LTCC is minimized to suppress scattering of UV during exposure, thereby obtaining a more clear pattern than in the case of the first embodiment.

In addition, referring to Table 3 and FIGS. 3A and 3B, Example 3 is a photosensitive LTCC ceramic paste which becomes an LTCC of amorphous cordierite, and has a refractive index of about 1.65, which is much lower than that of other composite LTCCs. The refractive index difference is very small. Therefore, the interface of the fine via hole is clear and can be etched up to a resolution of the via hole diameter of 25 μm.

As described above, in the case of the photosensitive LTCC ceramic paste manufactured by using the photosensitive organic composition and the LTCC composition, by selecting the LTCC composition to minimize the difference in refractive index between the photosensitive organic material and the LTCC composition, UV scattering during exposure It is suppressed, thereby enabling micro patterning with improved resolution. In addition, since the LTCC ceramic composition is included, firing is possible at a low temperature in the range of 800 to 950 ° C.

On the other hand, in the preferred embodiments of the present invention, in addition to the materials and / or products exemplified with respect to the binder polymer, organic solvent, photosensitive monomer, photoinitiator, dispersant, anti-settling agent and the like as described above, and / or materials commonly used in the art Alternatively, the fact that the products can be selected and used very easily to implement the present invention is quite natural to those skilled in the art.

In addition, the patterning characteristics of the preferred embodiments of the present invention described above vary slightly within the usual error range depending on the powder characteristics such as the average particle size, distribution and specific surface area of the composition powder, the purity of the raw material, the amount of impurity addition and the sintering conditions. It can be quite natural for one of ordinary skill in the art to be there.

On the other hand, preferred embodiments of the present invention are disclosed for the purpose of illustration, anyone of ordinary skill in the art will be possible to various modifications, changes, additions, etc. within the spirit and scope of the present invention, such modifications, changes And additions should be regarded as within the scope of the claims.

As described above, the photosensitive LTCC ceramic composition according to the present invention is composed of a photosensitive organic material composition and a predetermined LTCC composition, and has excellent dielectric properties such as low dielectric constant and low dielectric loss, and can be simultaneously fired with the internal conductor by low temperature firing. At the same time, the pattern resolution is 50 μm or less, so that fine patterning is possible in which the fine via hole diameter and the line width separation distance are micronized to at least 25 μm.

In addition, the photosensitive low-temperature cofired ceramic composition according to the present invention is promising as a core material of the three-dimensional ceramic composite module for ultra-high speed and high efficiency transmission.

Claims (11)

In the photosensitive low-temperature cofired ceramic composition comprising a photosensitive organic composition and a functional inorganic composition, The photosensitive organic substance composition includes a binder polymer, a monomer, a photoinitiator, a dispersant, and a sedimentation inhibitor, The functional inorganic material composition comprising the [glass + cordierite _{(2MgO-2Al 2 O 3 -5SiO} 2) filler; composite ceramics or amorphous cordierite composition _{(MgO-CaO-2Al 2 O} 3 -5SiO 2) A photosensitive low-temperature cofired ceramic composition. The method of claim 1, The weight ratio of the photosensitive organic composition and the functional inorganic composition is in the range of 30:70 to 80:20 photosensitive low temperature cofired ceramic composition. The method according to claim 1 or 2, The binder polymer is a photosensitive low-temperature cofired ceramic composition, characterized in that the transition temperature (T _g ) is an acrylic resin of 80 ℃ and 123 ℃ acrylic resin is mixed in a weight ratio of 1: 1 to 1: 3. The method according to claim 1 or 2, The binder polymer is a photosensitive low-temperature cofired ceramic composition, characterized in that it comprises 30 to 50wt% of the photosensitive organic composition. The method according to claim 1 or 2, The monomer is a photosensitive low-temperature cofired ceramic composition, characterized in that it comprises 20 to 35wt% of the photosensitive organic composition. The method according to claim 1 or 2, The photoinitiator is a photosensitive low-temperature cofired ceramic composition, characterized in that it comprises 5 to 10wt% of the photosensitive organic composition. The method according to claim 1 or 2, The dispersant is a photosensitive low-temperature co-fired ceramic composition, characterized in that it comprises 1 to 5wt% of the total photosensitive organic composition. The method according to claim 1 or 2, The anti-settling agent is a photosensitive low-temperature cofired ceramic composition, characterized in that it comprises 0.5 to 5wt% of the total photosensitive organic composition. The method according to claim 1 or 2, The photosensitive organic composition is a photosensitive low-temperature co-fired ceramic composition, characterized in that it further comprises Benzotriazole to increase the refractive index. A first step of preparing a binder polymer solution in which at least one acrylic resin having at least one glass transition temperature is mixed and dissolved in an organic solvent; A second step of preparing a paste excipient by adding a monomer, a photoinitiator, a dispersant and an antisettling agent to the binder polymer solution; [Glass + Cordierite (2MgO-2Al ₂ O ₃ -5SiO ₂ ) Filler] The paste is a low-temperature fired ceramic composition comprising a composite ceramic or an amorphous cordierite composition (MgO-CaO-2Al ₂ O ₃ -5SiO ₂ ). A third step of preparing a photosensitive low-temperature cofired ceramic paste by mixing with the excipient; And a fourth step of baking the photosensitive low-temperature cofired ceramic paste at 800 to 950 ° C. The method of claim 10, The third step further comprises the step of adjusting the viscosity by additionally adding an organic solvent to the photosensitive low-temperature co-fired ceramic composition before mixing the low-temperature fired ceramic composition with the paste excipient. Method for producing a low temperature cofired ceramic composition.

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