KR100798778B1 - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
KR100798778B1
KR100798778B1 KR1020060077176A KR20060077176A KR100798778B1 KR 100798778 B1 KR100798778 B1 KR 100798778B1 KR 1020060077176 A KR1020060077176 A KR 1020060077176A KR 20060077176 A KR20060077176 A KR 20060077176A KR 100798778 B1 KR100798778 B1 KR 100798778B1
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KR
South Korea
Prior art keywords
printed circuit
circuit board
reinforcing member
electronic component
reinforcing
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KR1020060077176A
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Korean (ko)
Inventor
김연성
박태상
문영준
장세영
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삼성전자주식회사
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Priority to KR1020060077176A priority Critical patent/KR100798778B1/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3436Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A printed circuit board is provided to efficiently increase a strength around an electronic apparatus by being equipped with a reinforcing member of a pattern most suitable the periphery of the electronic apparatus at the time of mounting a plurality of electronic components on the printed circuit board. A printed circuit board(110) includes a reinforcing member. The reinforcing member(130) has one or more linear member of which cross-section includes a horizontal portion and a vertical portion. The linear members are coupled with the peripheries of an electronic apparatus(120) so as to prevent distortion of the printed circuit board. The linear member is disposed in parallel to at least one portion of the electronic apparatus. The reinforcing members are blazed onto a surface of the printed circuit board. The reinforcing members are partially blazed so that a trace(111) can pass a lower portion of the reinforcing member. The reinforcing members have a rectangular hollow tube shape.

Description

인쇄회로기판{Printed circuit board}Printed circuit board

도 1은 본 발명의 바람직한 실시예에 의한 인쇄회로기판의 구성을 개략적으로 나타낸 평면도이다.1 is a plan view schematically showing the configuration of a printed circuit board according to a preferred embodiment of the present invention.

도 2는 도 1의 Ⅰ-Ⅰ선을 따라 취한 단면도이다.FIG. 2 is a cross-sectional view taken along line II of FIG. 1.

도 3은 도 1의 Ⅱ-Ⅱ선을 따라 취한 단면도이다.3 is a cross-sectional view taken along the line II-II of FIG. 1.

도 4a 및 4b는 본 발명에 의한 인쇄회로기판에 구비되는 보강부재의 다양한 단면 형상을 나타낸 단면도이다.4A and 4B are cross-sectional views illustrating various cross-sectional shapes of reinforcing members provided in a printed circuit board according to the present invention.

도 5a 내지 도 5c는 본 발명에 의한 인쇄회로기판의 다양한 실시예들을 개략적으로 나타낸 평면도들이다.5A to 5C are plan views schematically illustrating various embodiments of a printed circuit board according to the present invention.

<도면의 주요부분에 대한 부호 설명><Description of Signs of Major Parts of Drawings>

110,210,310,410...인쇄회로기판110,210,310,410 ... Printed Circuit Board

111,211,311,411...트레이스111,211,311,411 ... Trace

120,220,320,420...전자부품120,220,320,420 ... electronic components

130,230,330,430...보강부재130,230,330,430 ... reinforcement member

본 발명은 인쇄회로기판에 관한 것으로, 더욱 상세하게는 휨이나 비틀림, 파손과 같은 변형 방지를 위한 보강부재를 구비하는 인쇄회로기판에 관한 것이다.The present invention relates to a printed circuit board, and more particularly, to a printed circuit board having a reinforcing member for preventing deformation such as bending, twisting, and damage.

일반적으로, 인쇄회로기판(PCB)은 그 표면에 BGA(Ball Grid Array), CSP(Chip Scale Package), LGA(Land Grid Array) 등의 전자부품이 실장되고, 가전제품, 통신기기, 사무용 기기, 산업용 장치, 컴퓨터 장치 등 다양한 전자제품에 장착되어 광범위하게 사용된다.In general, a printed circuit board (PCB) has electronic components such as a ball grid array (BGA), a chip scale package (CSP), a land grid array (LGA), and the like, such as home appliances, communication equipment, office equipment, It is widely used in various electronic products such as industrial devices and computer devices.

현재 다양한 전자제품들이 소형화, 슬림화, 콤팩트화를 추구하면서 이에 장착되는 인쇄회로기판의 두께도 점차 얇아지는 추세에 있다. 이렇게 인쇄회로기판의 두께가 얇아지게 되면, 인쇄회로기판에 충격이나 외력이 가해지는 경우 인쇄회로기판이 휘거나 비틀리거나 파손될 수 있기 때문에, 전자부품이 실장된 인쇄회로기판을 운반할 때나, 전자제품에 장착할 때와 같이 인쇄회로기판을 다룰 때 각별한 주의가 요구된다.As various electronic products are pursuing miniaturization, slimming, and compactness, the thickness of printed circuit boards mounted thereon is gradually becoming thinner. As the thickness of the printed circuit board becomes thinner, the printed circuit board may be bent, twisted or damaged when an impact or an external force is applied to the printed circuit board. Therefore, when carrying a printed circuit board on which electronic components are mounted, Special care must be taken when handling printed circuit boards, such as when mounted on a wall.

특히, 전자부품이 실장된 상태에서 인쇄회로기판에 외력이 가해져 인쇄회로기판이 휘거나 비틀리게 되면, 인쇄회로기판과 이에 실장된 전자부품 사이의 납땜 부위가 파손되어 인쇄회로기판뿐만이 아니라 전자부품도 폐기시켜야 하는 문제가 발생될 수 있다.In particular, when an external force is applied to a printed circuit board while the electronic component is mounted, and the printed circuit board is bent or twisted, the soldering part between the printed circuit board and the electronic component mounted thereon is damaged and thus not only the printed circuit board but also the electronic component is mounted. Problems that need to be discarded can arise.

이러한 문제를 해결하기 위해 종래에는 전자부품을 이루는 기판에 보강재를 설치하거나, 인쇄회로기판을 강도가 큰 재질로 제조하는 방법이 제안되었으나, 전자는 전자부품을 새로 설계해야 하는 문제가 있고, 후자는 인쇄회로기판의 제조비 용이 크게 상승되는 문제가 있다.In order to solve this problem, conventionally, a method of installing a reinforcing material on a board constituting an electronic component or manufacturing a printed circuit board with a high strength material has been proposed. However, the former has a problem of designing a new electronic component. There is a problem that the manufacturing cost of the printed circuit board is greatly increased.

본 발명은 상기와 같은 문제점을 해결하기 위한 것으로, 전자부품의 주변에 인쇄회로기판의 강도를 국부적으로 증가시킬 수 있는 보강부재가 구비되어 외력에 의한 휨이나 비틀림 등의 변형이 방지되는 인쇄회로기판을 제공하는데 그 목적이 있다.The present invention is to solve the above problems, the printed circuit board is provided with a reinforcing member that can locally increase the strength of the printed circuit board in the vicinity of the electronic component to prevent deformation such as bending or torsion due to external force The purpose is to provide.

상기 목적을 달성하기 위한 본 발명에 의한 인쇄회로기판은, 인쇄회로기판의 표면에 상기 인쇄회로기판의 변형을 방지하기 위한 보강부재가 구비된다.The printed circuit board according to the present invention for achieving the above object is provided with a reinforcing member on the surface of the printed circuit board to prevent deformation of the printed circuit board.

이에 의하면, 인쇄회로기판에 구비되는 보강부재가 인쇄회로기판의 강도를 국부적으로 증가시키기 때문에, 두께가 얇은 인쇄회로기판이 휘거나 비틀리는 것을 방지할 수 있어서 인쇄회로기판이 외력에 의해 변형되어 실장된 전자부품이 인쇄회로기판에서 단락되는 현상을 막을 수 있다.According to this, since the reinforcing member provided on the printed circuit board locally increases the strength of the printed circuit board, the printed circuit board can be prevented from bending or twisting because the printed circuit board is thinned and the printed circuit board is deformed by an external force to mount the printed circuit board. It is possible to prevent the electronic component from being short-circuited in the printed circuit board.

여기에서, 상기 보강부재는 상기 인쇄회로기판에 실장되는 상기 전자부품의 주변에 결합되는 것이 좋다.The reinforcing member may be coupled to the periphery of the electronic component mounted on the printed circuit board.

그리고, 상기 보강부재는 상기 전자부품의 적어도 일측면과 평행하게 배치되는 것이 좋다.The reinforcing member may be disposed in parallel with at least one side of the electronic component.

또한, 상기 보강부재는 서로 수직을 이루도록 결합되는 복수의 직선부재를 포함하는 것이 좋다.In addition, the reinforcing member may include a plurality of linear members coupled to be perpendicular to each other.

또한, 상기 보강부재는 상기 인쇄회로기판의 표면에 납땜되는 것이 좋다.In addition, the reinforcing member is preferably soldered to the surface of the printed circuit board.

또한, 상기 보강부재는 그 하부로 트레이스가 통과할 수 있도록 일부분만 납땜되는 것이 좋다.In addition, the reinforcing member is preferably soldered only a portion so that the trace can pass through the bottom.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예에 의한 인쇄회로기판에 대하여 설명한다.Hereinafter, a printed circuit board according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

도 1은 본 발명의 바람직한 실시예에 의한 인쇄회로기판의 구성을 개략적으로 나타낸 평면도이고, 도 2는 도 1의 Ⅰ-Ⅰ선을 따라 취한 단면도이고, 도 3은 도 1의 Ⅱ-Ⅱ선을 따라 취한 단면도이다.1 is a plan view schematically showing the configuration of a printed circuit board according to a preferred embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line I-I of FIG. 1, and FIG. 3 is a line II-II of FIG. It is a cross section taken along.

도 1에 도시된 것과 같이, 본 발명의 바람직한 실시예에 의한 인쇄회로기판(110)은 그 일측 표면에 BGA(Ball Grid Array), CSP(Chip Scale Package), LGA(Land Grid Array)와 같은 전자부품(120)이 실장되고, 전자부품(120)의 주변에는 인쇄회로기판(110)의 변형을 방지하기 위한 보강부재(130)가 구비된다.As shown in FIG. 1, a printed circuit board 110 according to a preferred embodiment of the present invention has electronics such as a ball grid array (BGA), a chip scale package (CSP), and a land grid array (LGA) on one surface thereof. The component 120 is mounted, and a reinforcement member 130 is provided around the electronic component 120 to prevent deformation of the printed circuit board 110.

보강부재(130)는 복수의 직선부재(131)(132)(133)가 서로 직교하도록 연결된 "ㄷ"자 형태로 이루어져 전자부품(120)의 주변 일부를 감싼다. 제 1 직선부재(131)는 전자부품(120)의 일측면(121)과 평행하게 배치되고, 제 2 직선부재(132)는 전자부품(120)의 다른 일측면(122)과 평행하게 배치되고, 제 3 직선부재(133)는 전자부품(120)의 또다른 일측면(123)과 평행하게 배치된다.The reinforcement member 130 is formed in a "c" shape in which a plurality of straight members 131, 132, 133 are connected to each other at right angles to surround a portion of the electronic component 120. The first linear member 131 is disposed in parallel with one side 121 of the electronic component 120, and the second linear member 132 is disposed in parallel with the other side surface 122 of the electronic component 120. The third straight member 133 is disposed in parallel with another side surface 123 of the electronic component 120.

도 2에 도시된 것과 같이, 보강부재(130)의 각 직선부재(131)(132)(133)는 휨이나 비틀림 같은 변형에 잘 견딜 수 있도록 그 단면이 사각형상인 바(bar) 형태로 이루어진다. 보강부재(130)의 재질로는 SUS, 텡스텐, 철, Cu, Al, PCB 등이 바람직하나, 이러한 재질 이외에 무게가 가볍고 강도가 큰 다른 재질로 이루어질 수 있다.As shown in FIG. 2, each of the linear members 131, 132 and 133 of the reinforcing member 130 has a bar shape having a rectangular cross section so as to withstand deformation such as bending and torsion. As the material of the reinforcing member 130, SUS, tungsten, iron, Cu, Al, PCB, etc. are preferable, but in addition to these materials, the material may be made of other materials having light weight and high strength.

이러한 보강부재(130)는 전자부품(120)의 실장시 전자부품(120)과 함께 인쇄회로기판(110)의 표면에 납땜된다. 전자부품(120)이 리플로우(reflow) 공정을 통해 인쇄회로기판(110)에 납땜되는 경우, 보강부재(130)를 인쇄회로기판(110)에 결합하기 위해 인쇄회로기판(110)에는 전자부품(120)이 실장되는 부분뿐만이 아니라 보강부재(130)가 결합되는 부분에도 땜납(112)이 도포된다. 여기에서, 보강부재(130)의 전 부분이 모두 인쇄회로기판(110)에 납땜되는 것은 아니다. 즉, 도 3에 도시된 것과 같이, 인쇄회로기판(110)의 트레이스(trace, 111)가 지나가는 부분에서는 보강부재(130)가 위치하더라도 땜납(112)이 도포되지 않으며, 트레이스(111)가 지나가는 보강부재(130)의 하부는 땜납(112)에 의한 납땜이 이루어지지 않는다.The reinforcing member 130 is soldered to the surface of the printed circuit board 110 together with the electronic component 120 when the electronic component 120 is mounted. When the electronic component 120 is soldered to the printed circuit board 110 through a reflow process, the electronic component 120 is connected to the printed circuit board 110 to couple the reinforcing member 130 to the printed circuit board 110. Solder 112 is applied not only to the portion on which the 120 is mounted, but also to the portion to which the reinforcing member 130 is coupled. Here, not all parts of the reinforcing member 130 are soldered to the printed circuit board 110. That is, as shown in FIG. 3, the solder 112 is not applied even when the reinforcing member 130 is positioned in the portion where the trace 111 of the printed circuit board 110 passes, and the trace 111 passes. The lower part of the reinforcing member 130 is not soldered by the solder 112.

이렇게 휨이나 비틀림 등의 변형에 강한 보강부재(130)가 인쇄회로기판(110)에 실장되는 전자부품(120)의 주변에 납땜 결합됨으로써, 전자부품(120)이 실장된 인쇄회로기판(110) 일부분의 국부적인 강도를 높일 수 있다. 따라서, 인쇄회로기판(110)에 외력이 가해지더라도 인쇄회로기판(110)에 휨이나 비틀림 등의 변형이 발생되는 것을 방지할 수 있고, 인쇄회로기판(110)이 휘거나 비틀릴 때 전자부품(120)이 인쇄회로기판(110)에서 단락되는 현상을 막을 수 있다.The reinforcing member 130 resistant to deformation such as bending and torsion is soldered around the electronic component 120 mounted on the printed circuit board 110, whereby the electronic component 120 is mounted on the printed circuit board 110. The local strength of some can be increased. Therefore, even when an external force is applied to the printed circuit board 110, it is possible to prevent deformation such as bending or torsion in the printed circuit board 110, and the electronic component (when the printed circuit board 110 is bent or twisted). 120 may prevent a short circuit from the printed circuit board 110.

한편, 본 발명에 의한 인쇄회로기판(110)에 구비되는 보강부재(130)는 그 단면 형상이 사각형상으로 한정되는 것이 아니다. 즉, 본 발명에 의한 인쇄회로기판(110)에 구비되는 보강부재의 각 직선부재들은 휨이나 비틀림에 잘 견딜 수 있도록 그 단면이 다양한 형상으로 이루어질 수 있다. 도 4a에 도시된 보강부재(140)는 "I형강" 형상으로 이루어진 것이고, 도 4b에 도시된 보강부재(150)는 속이 빈 사각의 중공관 형상으로 이루어진 것이다. 보강부재는 그 이외에도 휨이나 비틀림에 잘 견딜 수 있는 다양한 단면 형상으로 이루어질 수 있다. On the other hand, the reinforcing member 130 provided in the printed circuit board 110 according to the present invention is not limited to the cross-sectional shape thereof. That is, each of the linear members of the reinforcing member provided in the printed circuit board 110 according to the present invention may have a cross-section in various shapes so as to withstand bending or torsion. The reinforcing member 140 shown in Figure 4a is made of "I-shaped steel" shape, the reinforcing member 150 shown in Figure 4b is made of a hollow hollow hollow tube shape. In addition to the reinforcing member may be made of a variety of cross-sectional shapes that can withstand bending and torsion well.

한편, 도 5a 내지 도 5c는 본 발명에 의한 인쇄회로기판의 다양한 실시예들을 개략적으로 나타낸 평면도들이다.5A to 5C are plan views schematically illustrating various embodiments of a printed circuit board according to the present invention.

먼저, 도 5a에 도시된 인쇄회로기판(210)은 보강부재(230)가 하나의 직선부재(231)로 이루어진 것으로, 보강부재(230)는 실장된 사각 형상의 전자부품(220)의 어느 일측면(221)과 평행하게 배치된다. 본 실시예에서도 보강부재(230)는 사각의 단면 형상으로 이루어지는 바 타입, I형강 타입, 사각의 중공관 타입 등 다양한 형태로 이루어질 수 있다. 이러한 보강부재(230)는 전자부품(220)과 함께 땜납(112;도 2참조)에 의해 납땜되며, 트레이스(211)가 통과하는 부분에서는 납땜이 이루어지지 않는다.First, in the printed circuit board 210 illustrated in FIG. 5A, the reinforcing member 230 is formed of one linear member 231, and the reinforcing member 230 may be any one of the mounted rectangular electronic components 220. Disposed parallel to the side surface 221. In this embodiment, the reinforcing member 230 may be formed in various forms such as a bar type, an I-shaped steel type, and a rectangular hollow tube type. The reinforcing member 230 is soldered together with the electronic component 220 by the solder 112 (see FIG. 2), and soldering is not performed at a portion through which the trace 211 passes.

도 5b에 도시된 인쇄회로기판(310)은 보강부재(330)가 서로 직교하는 두 개의 직선부재(331)(332)로 이루어진 것이다. 제 1 직선부재(331)는 인쇄회로기판(310)에 실장된 전자부품(320)의 일측면(321)과 평행을 이루도록 배치되고, 제 2 직선부재(332)는 그 끝단이 제 1 직선부재(331)의 끝단과 연결되며 전자부품(320)의 다른 일측면(322)과 평행을 이루도록 배치된다. 본 실시예에서도 각 직선부재(331)(332)는 사각의 단면을 갖는 바 타입, I형강 타입, 사각의 중공관 타입 등 다양한 형태로 이루어질 수 있다. 여기에서, 트레이스(311)가 통과하는 제 1 직선부재(331)의 하부에는 납땜이 이루어지지 않는다. 이러한 "ㄱ"자 형상의 보강부 재(330)는 인쇄회로기판(310)에 실장되는 전자부품(320)의 크기가 작은 경우 형상이 단순하면서 전자부품(320) 주변의 강도를 효율적으로 증가시킬 수 있다.The printed circuit board 310 illustrated in FIG. 5B includes two straight members 331 and 332 in which the reinforcing members 330 are perpendicular to each other. The first linear member 331 is disposed to be parallel to one side 321 of the electronic component 320 mounted on the printed circuit board 310, the second linear member 332 is the end of the first linear member It is connected to the end of the 331 and is arranged to be parallel to the other side surface 322 of the electronic component (320). In this embodiment, each of the straight members 331 and 332 may be formed in various forms such as a bar type having a rectangular cross section, an I-shaped steel type, and a rectangular hollow tube type. Here, soldering is not performed on the lower portion of the first straight member 331 through which the trace 311 passes. The "a" shaped reinforcement member 330 has a simple shape when the size of the electronic component 320 mounted on the printed circuit board 310 is small and effectively increases the strength around the electronic component 320. Can be.

도 5c에 도시된 인쇄회로기판(410)은 보강부재(430)가 네 개의 직선부재(431)(432)(433)(434)가 연결된 사각의 틀 형상으로 이루어진 것이다. 보강부재(430)를 이루는 제 1 내지 제 4 직선부재(431)(432)(433)(434)는 각각 사각의 전자부품(420)의 각 일측면(421)(422)(423)(424)들과 평행을 이루도록 배치된다. 여기에서, 각 직선부재(431)(432)(433)(434)와 전자부품(420) 사이의 거리는 동일한 것이 좋다.In the printed circuit board 410 illustrated in FIG. 5C, the reinforcing member 430 has a rectangular frame shape in which four linear members 431, 432, 433 and 434 are connected. The first to fourth linear members 431, 432, 433, and 434 constituting the reinforcing member 430 are respectively one side surfaces 421, 422, 423, and 424 of the rectangular electronic component 420. Are arranged to be parallel to each other. Here, the distances between the linear members 431, 432, 433 and 434 and the electronic component 420 may be the same.

각 직선부재(431)(432)(433)(434) 역시 상기 실시예들에 개시되어 있는 것과 같이, 사각 단면의 바 타입, I형강 타입, 사각의 중공관 타입 등 다양한 형태로 이루어질 수 있다. 각 직선부재(431)(432)(433)(434)는 전자부품(420)과 함께 동시에 납땜되는데, 트래이스(411)가 통과하는 제 1 및 제 3 직선부재(431)(433)의 하부에는 납땜이 이루지지 않는다. 이러한 사각틀 형상의 보강부재(430)는 전자부품(420)의 둘레를 완전히 감싸기 때문에 전자부품(420) 둘레 부분의 국부적인 변형을 확실히 방지할 수 있다.Each of the linear members 431, 432, 433, and 434 may also be formed in various forms, such as a bar type of a rectangular cross section, an I-shaped steel type, and a rectangular hollow tube type, as disclosed in the above embodiments. Each of the linear members 431, 432, 433 and 434 is simultaneously soldered together with the electronic component 420, and the lower part of the first and third linear members 431 and 433 through which the trace 411 passes. There is no soldering. Since the rectangular frame reinforcing member 430 completely surrounds the periphery of the electronic component 420, local deformation of the peripheral portion of the electronic component 420 may be prevented.

이상에서 도시하고 설명한 실시예들에서는 인쇄회로기판의 표면에 하나의 전자부품이 실장되고 그 주변에 하나의 보강부재가 구비된 것으로 도시하고 설명하였으나, 본 발명이 이러한 구성으로 한정되는 것 아니다.In the embodiments illustrated and described above, one electronic component is mounted on the surface of the printed circuit board and one reinforcing member is provided around the same, but the present invention is not limited to this configuration.

즉, 인쇄회로기판에 복수의 전자부품이 실장되고 각 전자부품의 주변에는 가장 적합한 형태의 보강부재가 각각 구비될 수 있다. 이 경우, 각 보강부재가 각 전 자부품 주변의 강도를 국부적으로 증가시켜서 이들 부분에서는 외력에 의한 변형이 발생되지 않으므로, 인쇄회로기판의 변형에 의한 전자부품의 이탈을 효과적으로 방지할 수 있다.That is, a plurality of electronic components may be mounted on a printed circuit board, and a reinforcing member having a form most suitable for each electronic component may be provided. In this case, since each reinforcing member locally increases the strength around each electronic component, and no deformation due to external force occurs in these portions, departure of the electronic component due to deformation of the printed circuit board can be effectively prevented.

이상에서 설명한 본 발명에 의하면, 인쇄회로기판에 실장되는 전자부품의 주변에 "I"형상, "ㄱ"형상, "ㄷ"형상, "ㅁ" 형상 등 적어도 하나의 직선부재로 이루어지는 보강부재가 구비되어 인쇄회로기판의 전자부품 주변의 국부적인 강도를 증가시키기 때문에, 인쇄회로기판에 외력이 가해지더라도 인쇄회로기판이 쉽게 휘거나 비틀리지 않게 된다. 따라서, 종래와 같이 인쇄회로기판의 변형에 의한 실장된 전자부품의 단락 현상을 방지할 수 있다.According to the present invention described above, a reinforcing member including at least one linear member such as an "I" shape, a "b" shape, a "c" shape, and a "wh" shape is provided around the electronic component mounted on the printed circuit board. In order to increase the local strength around the electronic components of the printed circuit board, even if an external force is applied to the printed circuit board, the printed circuit board is not easily bent or twisted. Therefore, the short circuit phenomenon of the mounted electronic component due to the deformation of the printed circuit board as in the prior art can be prevented.

또한, 본 발명에 의하면, 인쇄회로기판에 복수의 전자부품이 실장되는 경우, 각 전자부품의 주변에 가장 적합한 형태의 보강부재를 부분적으로 설치할 수 있기 때문에 각 전자부품 주변의 강도를 효율적으로 증가시킬 수 있다.In addition, according to the present invention, when a plurality of electronic components are mounted on a printed circuit board, a reinforcing member having a shape most suitable for each electronic component can be partially installed, thereby effectively increasing the strength around each electronic component. Can be.

이상에서 설명한 본 발명은 도면화되고 설명된 그대로의 구성 및 작용으로 한정되는 것이 아니다. 즉, 본 발명은 기재된 특허청구범위의 사상 및 범위 내에서 다양한 변경 및 수정이 가능하다.The present invention described above is not limited to the configuration and operation as illustrated and described. That is, the present invention is capable of various changes and modifications within the spirit and scope of the appended claims.

Claims (8)

전자부품이 표면에 실장되는 인쇄회로기판에 있어서,In a printed circuit board in which an electronic component is mounted on the surface, 상기 인쇄회로기판의 표면에는 상기 인쇄회로기판의 변형을 방지하기 위해 상기 전자부품의 주변에 결합되고 그 단면이 가로부와 세로부를 포함하는 하나 이상의 직선부재를 구비하는 보강부재가 설치되는 것을 특징으로 하는 인쇄회로기판.Reinforcing members are provided on a surface of the printed circuit board, the reinforcing member having one or more linear members coupled to the periphery of the electronic component to prevent deformation of the printed circuit board and having a cross section and a vertical section thereof. Printed circuit board. 삭제delete 제 1 항에 있어서,The method of claim 1, 상기 직선부재는 상기 전자부품의 적어도 일측면과 평행하게 배치되는 것을 특징으로 하는 인쇄회로기판.The linear member is a printed circuit board, characterized in that disposed in parallel with at least one side of the electronic component. 제 1 항에 있어서,The method of claim 1, 상기 직선부재는 복수가 서로 수직을 이루도록 결합되는 것을 특징으로 하는 인쇄회로기판.The linear member is a printed circuit board, characterized in that the plurality is coupled to be perpendicular to each other. 제 1 항에 있어서,The method of claim 1, 상기 보강부재는 상기 인쇄회로기판의 표면에 납땜되는 것을 특징으로 하는 인쇄회로기판.The reinforcing member is a printed circuit board, characterized in that soldered to the surface of the printed circuit board. 제 5 항에 있어서,The method of claim 5, 상기 보강부재는 그 하부로 트레이스가 통과할 수 있도록 일부분만 납땜되는 것을 특징으로 하는 인쇄회로기판.The reinforcing member is a printed circuit board, characterized in that only a portion is soldered so that the trace can pass through the bottom. 제 1 항에 있어서,The method of claim 1, 상기 직선부재는 그 단면이 I형강 형상으로 된 것을 특징으로 하는 인쇄회로기판.The linear member is a printed circuit board, characterized in that the cross section of the I-shaped steel shape. 제 1 항에 있어서,The method of claim 1, 상기 직선부재는 그 단면이 사각의 중공관 형상으로 된 것을 특징으로 하는 인쇄회로기판.The linear member is a printed circuit board, characterized in that the cross section is a rectangular hollow tube shape.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0761177A (en) * 1993-08-30 1995-03-07 Omron Corp Electronic card
JPH1185938A (en) 1997-07-17 1999-03-30 Denso Corp Ic card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0761177A (en) * 1993-08-30 1995-03-07 Omron Corp Electronic card
JPH1185938A (en) 1997-07-17 1999-03-30 Denso Corp Ic card

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