KR100794722B1 - Displacement response sensor by that push down contact - Google Patents

Abstract

The present invention relates to a displacement-sensitive sensor by contact pressing, wherein the sensor 10 includes a conductive material 15 and has a stretchable semiconductive layer 14 and a first conductive layer on upper and lower surfaces of the semiconductive layer 14. A contact portion 11 on which the conductor layer 12 and the second conductor layer 13 are formed; A first resistor (19) connected to the first conductor layer (12) and connected to the Vcc side of the power supply; A second resistor (21) connected to the second conductor layer (13) and one side connected to the negative side of the power source; A first voltage comparator (16) having an inverting input (-) connected to the first conductor layer (12); A second voltage comparator (17) having a non-inverting input unit (+) connected to the second conductor layer (13); A third resistor 22 having one side connected to the Vcc side of the power supply and the other side connected to the non-inverting input unit (+) of the first voltage comparator 16; A fourth resistor 23 having one side connected to the non-inverting input unit (+) of the first voltage comparator 16 and the other side connected to the inverting input unit (-) of the second voltage comparator 17; A fifth resistor 24 having one side connected to the negative side of the power supply and the other side connected to the inverting input unit of the second voltage comparator 17; The OR gate 18 is connected to the first voltage comparator 16 and the second voltage comparator 17. The sensor of the present invention can be manufactured in various shapes and can be easily installed anywhere, and can be used for automatic doors, vehicle bumpers, pressure gauges or weigh scales, and even gas pressure and liquid pressure measurement.

Contact, pressed, displacement sensitive, sensor, voltage comparison, OR gate

Description

Displacement response sensor by that push down contact}

1 is a schematic circuit diagram showing a configuration of a displacement-sensitive sensor by contact pressing according to an embodiment of the present invention.

2 to 4 is a schematic cross-sectional view showing an example in which the displacement-sensing sensor by the contact pressing according to the present invention is installed.

Figure 5 is another embodiment of the displacement-sensitive sensor by the contact pressed in accordance with the present invention, a schematic perspective view of different shapes.

6 and 7 are still another embodiment of the displacement-sensitive sensor by contact pressing according to the present invention, schematic plan views showing examples of different installation state.

8 and 9 are still another perspective view of the displacement-sensitive sensor by contact pressing according to the present invention, schematic perspective views showing embodiments of varying shapes.

10 and 11 is a schematic circuit diagram configured to detect the disconnection between the contact portion and the comparison circuit portion of the sensor as another embodiment of the displacement-sensitive sensor by the contact pressed in accordance with the present invention.

12 is a schematic circuit diagram of another embodiment of the displacement-sensitive sensor by contact pressing according to the present invention, so that the contact pressing degree of the sensor can be obtained as an analog result.

 FIG. 13 is a schematic circuit diagram of another embodiment of a displacement-sensitive sensor by contact pressing according to the present invention to obtain a contact result of the sensor as a digital result value. FIG.

14 is a subtractive view showing the numerical value of the calculation process obtained according to the circuit configuration of FIG. 13 in accordance with the present invention.

FIG. 15 is a schematic circuit diagram of a method and a disconnection of a contact sensing method according to another embodiment of a displacement-sensitive sensor by contact pressing according to an embodiment of the present invention, based on the strength of a current flowing through a semiconductive layer; FIG.

FIG. 16 is a schematic circuit diagram of another embodiment of a displacement-sensing sensor due to contact pressing according to the present invention, in which a method and disconnection for eliminating a malfunction due to in-phase noise are eliminated by canceling and removing in-phase noise.

17 is a view illustrating a displacement-sensitive sensor according to the present invention according to the present invention, including a main circuit for contact signal processing and a sub-circuit for noise signal cancellation, eliminating in-phase noise, and hysteresis at a set contact degree. Schematic circuit diagram applying the characteristics and allowing disconnection to be determined.

18 to 22 is another embodiment of the displacement-sensitive sensor by the contact pressed in accordance with the present invention, the schematic perspective views of different shapes.
Fig. 23 shows another embodiment of the displacement-sensing sensor by contact pressing according to the present invention in which the main circuit and the sub-circuit are arranged in parallel so that the voltage signal of the sensor contact portion is differential through the main circuit and the signal for noise cancellation is via the sub-circuit. Schematic circuit diagram to remove in-phase noise by applying to amplifier.

Explanation of symbols on the main parts of the drawings

10; Sensor 11; Contact

12; First conductor layer 13; Second conductor layer

14; Semiconducting layer 15; Conductive material

16; First voltage comparator 17; Second voltage comparator

18; OR gate 19; First resistance

21; Second resistor 22; Third resistance

23; Fourth resistor 24; Fifth resistor
70: disconnection detection resistance

The present invention relates to a sensor, and more particularly to a displacement-sensitive sensor by contact pressing that is easy to manufacture and install.

In general, a sensor in the broad sense refers to a device that converts one physical quantity into another physical quantity.

That is, since it means a device that generates a constant response when there is a physical stimulus, sensors are diverse and new sensors are constantly being born.

Such a sensor includes a contact sensor that detects the presence of an object by being in direct contact with an object, and a non-contact sensor that detects the presence of an object without directly contacting an object in the vicinity of an object.

Here, the contact sensor is typically used a limit switch, which operates reliably even in a dusty environment, is suitable for the place where the stability to the explosion is required, non-contact sensor for the reason that has the advantage of insensitive to the influence of the magnetic field, etc. Compared to the widely used.

However, the conventional contact sensor has been somewhat difficult to mount to a part of any device that is narrower than the size of the limit switch as the limit switch is used.

In addition, in order for the limit switch to be installed and operated in a device, a separate device for pressing the limit switch without a breakage of the limit switch had to be installed together with the limit switch.

Accordingly, the conventional contact sensor has a problem that some restrictions to install to be suitable for all devices having a variety of shapes.

SUMMARY OF THE INVENTION An object of the present invention for solving the above problems is to provide a displacement-sensitive sensor by pressing the contact which can be manufactured in various shapes and can be freely installed in various devices.

In order to achieve the above object, the displacement-sensitive sensor according to the present invention is composed of a sensor contact part and a sensor signal processing and disconnection detection circuit part. The contact portion may include a stretchable material, and the volume thereof may be reduced by pressing, and the resistance thereof is reduced when the volume is reduced. The circuit part plays a role in detecting that the contact part has been touched or pressed by detecting a change in conductivity of the contact part, that is, a resistance value change. Specifically, the circuit unit may be configured in various ways, such as voltage comparison or analog or digital change detection of current and voltage. Furthermore, the present invention may further include a configuration for preventing malfunction, such as detecting disconnection inside the sensor.
In the displacement-sensitive sensor by contact pressing according to an aspect of the present invention, a conductive material is contained, and a semiconductive layer having a stretchable resistance value Rx is formed; A first conductor layer containing a conductive material is formed on an upper surface of the semiconductive layer; A contact portion having a second conductive layer containing a conductive material formed on a lower surface of the semiconductive layer; A first resistor having one side connected (connected) to the first conductor layer and the other side connected to the Vcc side of the power source; A second resistor having one side connected to the second conductor layer and the other side grounded (connected to the negative side of the power source); A first voltage comparator having a low terminal (inverting input section) connected to the first conductor layer; A second voltage comparator provided with a + terminal (non-inverting input section) on a high side connected to the second conductor layer; A third resistor having one side connected to the Vcc side of the power supply and the other side connected to the non-inverting input unit (+) of the first voltage comparator; A fourth resistor having one side connected to the non-inverting input unit (+) of the first voltage comparator and the other side connected to the inverting input unit (-) of the second voltage comparator; A fifth resistor having one side connected to the − side of the power supply and the other side connected to the inverting input unit (−) of the second voltage comparator; And an OR gate connected to the first voltage comparator and the second voltage comparator to output a signal according to the output thereof.

The sensor of the present invention having such a configuration is formed of a synthetic resin or a soft rubber or silicone material containing a conductive material and having excellent elasticity, so that the semiconductive layer shrinks when a contact is applied to the contact portion from the outside. As the conductivity of the conductive material increases, the conductivity increases, so that the contact of the contact part can be sensed, and it can be made of soft material, which makes it easy to manufacture and install in various shapes. It can be installed in the front, rear, side, etc. of a track car, and can also be installed in a pressure gauge or a weight gauge, and can be installed in a device or pipe using gas, and can be used in various fields such as measuring gas pressure and liquid pressure. .

Specific features and advantages of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings.

1 is a schematic circuit diagram showing the configuration of the displacement-sensitive sensor 10 by the contact pressing of the present invention. The sensor 10 is largely classified into a sensor contact part and a comparison circuit part. The sensor contact part is manufactured in a form in which electrical properties, that is, resistance (or conductivity) change when compressed by physical pressing. The contact portion 11 is composed of a semiconductive layer 14, a first conductor layer 12, and a second conductor layer 13.

The semiconductive layer 14 contains a conductive material 15, is formed of a flexible material having elasticity, and is formed between the first conductor layer 12 and the second conductor layer 13, and has a resistance value Rx. Formed.

Here, the semiconductive layer 14 may be formed in a state of foaming or not foaming with not only a sponge material but also a flexible rubber material or a soft synthetic resin material, synthetic rubber, urethane, silicone, or the like.

The first conductor layer 12 is formed of a flexible rubber material or durable urethane, silicone, synthetic rubber, synthetic resin material, etc., containing the conductive material 15, and is formed on the upper surface of the semiconductive layer 14.

The second conductor layer 13 is formed of the same material as the first conductor layer 12 and is formed on the bottom surface of the semiconductive layer 14.

The first conductor layer 12 is provided with a first resistor 19 having one side connected to the first conductor layer 12 and the other side connected to a power source, that is, connected to the Vcc side of the power source.

The second conductor layer 13 is provided with a second resistor 21 having one side connected to the ground, that is, the negative side of the power supply, and the other side connected to the second conductor layer 13.

The comparison circuit unit of the sensor 10 may be configured to include a voltage comparator, resistors and an OR gate, and detects whether the sensor contact 11 is pressed. The first conductor layer 12 and the second conductor layer 13 are provided with a first voltage comparator 16 and a second voltage comparator 17, respectively, and the first voltage comparator 16 has a low side. -The terminal, i.e., the inverting input portion (-), is connected to the first conductor layer 12, and the second voltage comparator 17 has the + terminal on the high side, that is, the non-inverting input portion (+) is connected to the second conductor layer ( 13).

The third resistor 22, the fourth resistor 23, and the fifth resistor 24 are sequentially connected to the first voltage comparator 16 and the second voltage comparator 17.

Here, one side of the third resistor 22 is connected to the Vcc side of the power supply, and the other side thereof is connected to the non-inverting input unit (+) of the first voltage comparator 16.

The fourth resistor 23 has one side connected to the non-inverting input unit (+) of the third resistor 22 and the first voltage comparator 16, and the other side of the fourth resistor 23 and the second voltage comparator 17 to be described later. Is connected to the inverting input unit (-).

One side of the fifth resistor 24 is connected to the negative side of the power supply, and the other side thereof is connected to the inverting input unit (-) of the second voltage comparator 17.

The first voltage comparator 16 and the second voltage comparator 17 are provided with an OR gate 18 for outputting a signal according to the output values of the first voltage comparator 16 and the second voltage comparator 17. do.

In the present invention, the displacement-sensing sensor by contact pressing has the sensor 10 normally maintained in a normal state. As an example, the resistance value Rx of the semiconductive layer 14 is approximately the first resistance 19 R. Install at a resistance value twice that of the _first and second resistors 21 R ₂ (R ₁ : R _x : R ₂ = 1: 2: 1).

Accordingly, A 1 (the non-inverting input unit (+) of the first voltage comparator is Ah and the inverting input unit (-) is A 1), which is the inverting input unit (−) of the first voltage comparator 16, and the second voltage comparator 17 is referred to as A 1. The non-inverting input of (+) is referred to as Bh and the inverting input (-) is referred to as Bl. The first voltage is connected to the first conductor layer which is the position of 3/4 of the resistance values of R ₁ , Rx, and R ₂ . The input value of A1 of the comparator 16, that is, the voltage {(R _x + R ₂ ) / (R ₁ + R _x + R ₂ )} Vcc becomes (3/4) V _cc .

In addition, the second conductor layer 13 whose Bh of the second voltage comparator 17 is {R ₂ / (R ₁ + R _x + R ₂ )} 1/4 of the resistance values of R ₁ , Rx, and R ₂ . The voltage value of Bh of the second voltage comparator 17 is (1/4) V _{cc because it} is connected to.

For example, the third resistor 22 R ₃ and the fourth resistor 23 R ₄ and the fifth resistor 24 R ₅ are all provided with the same resistance value (R ₃ : R ₄ : R ₅ = 1: 1). 1), and provided on one side of the first voltage comparator 16 and the second voltage comparator 17, the first connected between the third resistor 22 R ₃ and the fourth resistor 23 R ₄ . Ah of the one voltage comparator 16 has a voltage value of {(R ₄ + R ₅ ) / (R ₃ + R ₄ + R ₅ )} Vcc, that is, (2/3) V _cc .

The voltage value of Bl of the second voltage comparator 17 connected to the fifth resistor 24 R ₅ is equal to {R ₅ / (R ₃ + R ₄ + R ₅ )} Vcc, that is, (1/3) V _cc . do.

Accordingly, Ah of the first voltage comparator 16 has a voltage value of 2 / 3V _cc and a voltage value of AL of 3 / 4V _cc , where Ah = (2/3) Vcc <Aℓ = (3/4) Since the input value of Al is larger than the input value of Ah as Vcc, the output value of the first voltage comparator 16 is low, and the voltage value of Bh of the second voltage comparator 17 is (1/4). ) V _cc and the voltage value of Bl becomes (1/3) V _cc , and Bh = (1/4) Vcc <Bℓ = (1/3) Vcc, so that the voltage value of Bl is larger than the voltage value of Bh. The output value of the second voltage comparator 17 becomes Low.

Therefore, since the output value of the first voltage comparator 16 and the output value of the second voltage comparator 17 are both low, the output is changed according to the output values of the first voltage comparator 16 and the second voltage comparator 17. The output value of the OR gate 18 to be determined is low, that is, "0" so that the displacement-sensing sensor 10 by contact contact is maintained in a normal state.

As such, when an external shock is applied to the contact portion 11 of the displacement-sensing sensor 10 due to the contact held in the normal state, the semiconductive layer 14 is pressed and pressed by an external force, thereby semiconducting layer 14. The density of the conductive material 15 contained therein becomes large, the conductivity of the semiconductive layer 14 becomes high, and the resistance value of the semiconductive layer 14 is shifted in the direction of "0".

When the resistance value of the semiconductive layer 14 is shifted in the direction of "0", the second of the first voltage comparator 16 connected to the first conductor layer 12 and the second conductor connected to the second conductor layer 13 are connected. The voltage value of Bh of the voltage comparator 17 comes close to (1/2) V _cc .

As a result, the voltage value of A L whose initial set value was (3/4) V _cc is reduced to (2/3) V _cc or lower, which is the voltage value of Ah set as the detection reference value, so that the voltage value applied to A L (1 / 2) As the transition to Vcc occurs, the output voltage of the first voltage comparator 16 becomes high because the voltage value of Ah becomes larger than the voltage value of Al.

Then, the voltage value of Bh whose initial set value was (1/4) V _cc is increased to (1/3) V _cc , which is the voltage value of Bℓ set as the detection reference value, so that the voltage value applied to Bh is (1/2). As the transition to Vcc occurs, the input value of Bh becomes larger than the input value of Bl, so that the output value of the second voltage comparator 17 becomes high.

Therefore, since the output values of the first voltage comparator 16 and the second voltage comparator 17 are high, the output value of the OR gate 18 is high, and the depression of the sensor 10 is detected.

In order to increase the detection sensitivity of the displacement-sensing sensor 10 by contact pressing by the above-described action, the ratio of R ₁ (19), R _x , R ₂ (21) is adjusted or the third resistor 22 R _{3 is used.} By adjusting the resistance values of the fourth resistor 23 R ₄ and the fifth resistor 24 R ₅ , the level difference between Ah and A 1 of the first voltage comparator 16 is reduced, or the second voltage comparator 17 The level difference between Bh and Bl can be set small.

Such a displacement-sensing sensor according to the present invention is characterized by having a contact portion manufactured by adding a conductive material or a semiconductive material to a material having elasticity. Therefore, the contact portion of the sensor 10 may be applied even when a pressure is applied to the contact portion from the outside while a material having elasticity and semiconductivity is placed between the conductive material and the conductive material and an electrode is applied between the conductive material and the conductive material. The conductivity of the semiconductive material that is pressed and disposed between the conductive materials is increased, that is, the resistance is reduced, so that the sensing function of the sensor 10 is activated.

In other words, when either the first voltage comparator 16 side or the second voltage comparator 17 side is operated, that is, high, the OR gate 18 is activated and outputs a high value. Even if any one of the first voltage comparator 16 and the second voltage comparator 17 is not operated, if only one of the other voltage comparators is operated, the OR gate 18 is operated, thereby ensuring reliability as a sensor.

The sensor according to the present invention can also be mounted and used in various ways as shown in Figs. 2 to 4 around the edges of the side and bottom of the revolving telegraph (D) or sliding automatic door (D), the revolving telegraph (D) When the human hand or foot is caught between the edge of the wall and the wall, or between the bottom edge of the electric telegraph (D) and the floor, the contact portion 11 of the sensor 10 may be pressed and sensed along with the buffering action. According to the detection signal, a control device for operating a separate clutch or brake, etc., can stop the electric rotating telegraph (D) in rotation.

And when the human hand or foot is caught in the gap between the door and the door of the sliding automatic door (D) prevents injuries by a buffering action, and the contact portion 11 of the sensor 10 is sensed by pressing the sliding automatic door (D) is configured to open again. Can be.

In addition, it may be used to be mounted on the front and rear bumpers of the play toy vehicle or the actual vehicle, may be mounted and used on the front, rear, side of the track car, to control the drive of the vehicle, track car, or to control the power connection, Alternatively, brakes can be installed to stop the vehicle or track vehicle between vehicles, between obstacles, between vehicles and people, or between tracks, between track cars and obstacles, between track cars and obstacles, or between track cars and people. have.

Another feature of the present invention, since the sensor contact portion 11 of the sensor 10 is formed of a flexible resin and sponge, urethane, silicone, synthetic rubber, etc., the material is easy to manufacture in various forms, Installation can be done anywhere, and it can alleviate the impact from the outside.

When the contact portion of the sensor 10 of the present invention is exposed to the outside, the insulation is covered on the entire contact portion of the sensor 10 and a protective film is formed to protect the contact portion of the sensor 10 from dust, moisture, heat, and the like. can do.

In addition, it can be used as a data of traffic control system such as signal system change data by measuring the traffic volume by installing it on the four-way ground of the roadway, and installing it on the ground where the parking line of the parking lot is drawn or the contact portion 11 of the sensor 10. It can be installed to protrude partly to guide the vehicle to park in the parking area, and can be useful for parking management system.

In addition, if the sensor is installed in the vehicle driving course line for the automobile test at the driving license test site, it is easy to check whether the test vehicle is out of the course or continues to the normal course.

According to the present invention, the displacement-sensing sensor due to contact pressing may have a cylindrical shape as shown in FIG. 5, which is installed so as to be wrapped around a gas pipe, such as an illegal intruder in a building such as a thief. When the gas pipe of the building to go up to the building holding the gas pipe by hand, the contact portion of the sensor 10 is pressed while being detected and the alarm sounds to prevent illegal intrusion in the building.

The displacement-sensitive sensor according to the present invention may be installed in the form of a footrest on the contact portion of the sensor 10 at the bottom of the door of the sliding automatic door D as shown in FIG. 6, and the door of the automatic revolving door D as shown in FIG. 7. The contact portion of the sensor 10 may be installed in the form of a scaffold on the bottom.

Accordingly, when a person entering and exiting the entrance and exit of the automatic sliding door D or the automatic revolving door D rises on the contact part 11 of the sensor 10 installed in the form of scaffolding, the contact part 11 is pressed and sensed to detect the sliding door. ) Is opened, and the automatic revolving door (D) can be operated to rotate.

On the other hand, unlike the above-mentioned to be installed in front of the elevator boarding position, that is, the elevator door, if there is someone in the boarding position, the door opens and the door is to be installed for the purpose of closing the door after the passenger enters the door from the boarding position. It may be. As another example, in the case of a train or other tracked vehicle, the presence of a passenger who is going to board or a passenger who is getting off from the end of the platform from the end of the platform is sensed, and may be installed for the purpose of not leaving when there is a passenger.

Figure 8 is a schematic perspective view showing another embodiment of the displacement-sensitive sensor by the contact pressing of the present invention. In this embodiment, one or two or more horizontal conductors 32 in the form of horizontal or horizontal lines are formed on the upper portion of the semiconductive layer 34 in succession at equal intervals or as necessary, and the semiconductive layer 34 The grid-like contact portion in which one or two or more vertical conductors 33 are formed to be continuously formed at intervals as necessary at equal intervals in the vertical or vertical direction crossing the horizontal conductor 32 at the bottom of the The branch may be configured as the sensor 30.

This connects the horizontal conductor Rm to the connection line L1m connected to the circuit, and connects the vertical conductor Cn to the connection line L2n connected to the circuit to recognize contact push at one position. The contact position by the combination of the number and the number of C becomes 3 x 4 = 12, i.e., 12 positions if 3 R and 4 C, as shown in the figure, and when any one of the 12 positions is pressed You will notice the location.

Therefore, the grid contact portion of the sensor 30 formed as described above may be installed in a monitor or the like and used as a touch pad or a touch screen, or installed in a keyboard or the like.

Figure 9 is a schematic perspective view showing another embodiment of the displacement-sensitive sensor by the contact pressed in accordance with the present invention.

An insulating layer 41 is formed in the center, a horizontal conductor R is formed on the upper surface of the insulating layer 41, and a vertical conductor C is formed on the lower side.

The first semiconducting layer 44 is formed on the horizontal conductor R, and the first conductive layer 42 is formed on the first semiconducting layer 44.

A second semiconducting layer 44 'is formed under the vertical conductor C, a second conductive layer 42' is formed under the second semiconducting layer 44 ', and the first conductive Connection lines connected to the circuits are connected to the layer 42, the horizontal conductor R, the second conductive layer 42 ′, and the vertical conductors C, respectively.

This connects the first conductive layer 42 to the connecting line L1, and connects one horizontal conductor R among the m horizontal conductors R to one connecting line L2, thereby connecting one horizontal conductor R. Recognize contact push of position.

Meanwhile, one second conductive layer 42 'is connected to the connecting line L1', and one vertical conductor C is connected to one connecting line connecting line L2 'among the n vertical conductors C. Note that contact of the vertical conductor C is pressed.

Accordingly, the contact pressing positions of the m horizontal conductors R positions and the contact pressing positions of the number of the contact pressing positions of the n vertical conductors C positions (m x n) are recognized.

Figure 10 is a schematic circuit diagram showing another embodiment of the displacement-sensitive sensor by the contact pressing of the present invention. This embodiment is an example in which the disconnection between the contact portion of the sensor and the comparison circuit portion is detected by the disconnection check resistance. In the present embodiment, as shown, the disconnection check resistor 70 connected to A 1, which is the − terminal of the first voltage comparator 56 of the sensor 50, and B h, which is the + terminal of the second voltage comparator 57, Is installed more.

This can neglect the influence on the sensitivity, that is, when the disconnection check resistance 70 Rch is set to be larger than the resistance value Rx (60) of the semiconductive layer 54, the first voltage comparator 56 Since the input value of Ah is smaller than the input value of Al, the first voltage comparator 56 is in a low state. Since the input value of Bh of the second voltage comparator 57 is smaller than the input value of Bl, the second voltage is smaller. Since the comparator 57 is in a low state, the output value of the OR gate 58 becomes low, that is, "0", and the displacement-sensing sensor 50 due to contact contact is in a normal state.

In this state, when L1 is disconnected, since the input value of A1 of the first voltage comparator 56 and Bh of the second voltage comparator 57 is approximately equal to "0" level, Ah of the first voltage comparator 56 is maintained. It is detected that the input value of is greater than the input value of A1, so that the output of the first voltage comparator 56 becomes high, whereby the output of the OR gate 58 becomes high and is disconnected.

In the case of disconnection of L2, the Bh of the second voltage comparator 57 and the Al input value of the first voltage comparator 56 are at approximately the same " Vcc " level so that the input value of Bh of the second voltage comparator 57 is Since the output of the second voltage comparator 57 becomes high and the output of the OR gate 58 becomes high, the output of the second voltage comparator 57 is detected to be disconnected.

When both L1 and L2 are disconnected, the input value of A1 of the first voltage comparator 56 and Bh of the second voltage comparator 57 are internal resistances of the first voltage comparator 56 and the second voltage comparator 57. Since both are close to 1 / 2V _cc , the input value of Ah of the first voltage comparator 56 becomes larger than the input value of Aℓ, and the input value of Bh of the second voltage comparator 57 is larger than the input value of Bℓ. It becomes large so that the outputs of the first voltage comparator 56 and the second voltage comparator 57 are both high, and accordingly, it is sensed that the output of the OR gate 58 is high and is disconnected.

Accordingly, since the disconnection check resistor 70 connected to A1 of the first voltage comparator 56 and Bh of the second voltage comparator 57 is further connected, the first conductor layer 52 and the second conductor of the contact part 51 are provided. When any one of the connection lines L1 and L2 connecting the conductor layer 53, the first voltage comparator 56, and the second voltage comparator 57 is disconnected or both are disconnected, it is possible to detect that the circuit is disconnected.

Figure 11 is a schematic circuit diagram showing another embodiment of the displacement-sensitive sensor by the contact pressing of the present invention. This embodiment shows the configuration such that the disconnection between the contact portion of the sensor and the comparison circuit portion is detected by the voltage comparison. In the present embodiment, as shown, a third voltage comparator 96 is installed to connect OP1h, which is a + terminal, to lead wire L1 89 of sensor 80, and OP2ℓ, which is a negative terminal, to lead wire L2 91. The fourth voltage comparator 97 is installed to be connected.

In addition, a sixth resistor 100 is connected at one side to the power supply and the other side is connected to OP1 1 which is a negative terminal of the third voltage comparator 96, and one side is connected to a negative terminal of the third voltage comparator 96. And a seventh resistor 101 connected to the other side of the fourth voltage comparator 97, which is OP2h, and connected to the other side of the fourth voltage comparator 97, which is OP2h. 8 resistors 102 are provided.

One side of the third voltage comparator 96 and the fourth voltage comparator 97 is further provided with a second OR gate 98 connected thereto.

This means that the input value of OP1h of the third voltage comparator 96 is 3 / 4V _cc , which is the same input value as the AL of the first voltage comparator 86, and the input value of OP2ℓ of the fourth voltage comparator is the second voltage comparator. It is 1 / 4V _{cc which} is the same input value as Bh of (87).

In addition, the resistance values of the sixth resistor 100 R ₆ , the seventh resistor 101 R ₇ , and the eighth resistor 102 R ₈ may be differently installed as necessary. For example, the ratio of each resistor value is R _6. : R ₇ : R ₈ = 1: 3: 1, the input value of OP1ℓ of the third voltage comparator 96 is 4 / 5V _cc , and the input value of OP2h of the fourth voltage comparator 97 is 1 /. 5V _cc .

Accordingly, since the input value of OP1h of the third voltage comparator 96 has a smaller value than the input value of OP1l, the output of the third voltage comparator 96 becomes Low, and the fourth voltage comparator ( Since the input value of OP2h of 97) has a value smaller than that of OP2l, the output of the fourth voltage comparator 97 goes low.

In this state, when L1 is disconnected, the OP1h of the third voltage comparator 96 is connected to the first resistor 89 so that the power is transferred as it is, so the input value of the OP1h becomes 1V _cc and the input value of the OP1h becomes the OP1ℓ input. Since the value is larger than the value, the output of the third voltage comparator 96 becomes high.

When L2 is disconnected, OP2ℓ of the fourth voltage comparator 97 is connected to the second resistor 91 so that the value of OP2ℓ becomes zero potential and the input value of OP2h has a value larger than the input value of OP2ℓ. The output of the voltage comparator 97 goes high.

Accordingly, even when both L1 and L2 are disconnected, the outputs of the third voltage comparator 96 and the fourth voltage comparator 97 are both high, and the third voltage comparator 96 and the fourth voltage comparator 97 The second OR gate 98 recognizes that L1 and L2 are disconnected.

Therefore, a third voltage comparator 96, a fourth voltage comparator 97, a sixth resistor 100, a seventh resistor 101, and an eighth resistor 102 are further provided on the sensor 80, so that the sensor ( It is immediately identified that the connection line of 80 is broken, so that the sensor 80 can be repaired and replaced as soon as the connection line of the sensor 80 is broken.

FIG. 12 is a schematic block circuit diagram showing still another embodiment of the displacement-sensitive sensor according to the present invention, in which the degree of contact pressing of the sensor can be obtained as an analog result.

As shown in FIG. 12, a first voltage follower 113 having a non-inverting input unit + is connected to a first conductor layer 111 of the sensor 110, and a second conductor layer 112. The second voltage floor 114 is connected to the non-inverting input unit (+).

In addition, a first phase inverter 115 having a first voltage follower 113 connected to the inverting input unit (-) is provided, and a second phase having a second voltage follower 114 connected to the inversion input unit (-). An inverter 116 is provided.

One side of the first phase inverter 115 and the second phase inverter 116 is provided with a differential amplifier 117 connected to them, one side of the differential amplifier 117 is connected to the differential amplifier 117 and differential A load device 118 is provided which indicates the amount of current voltage delivered from the amplifier 117.

Here, the load device 118 may use a Volt Meter, a monitor, an ammeter, a light emitting lamp, or the like, or may transmit it as an input signal to another device.

When the sensor 110 is pressed by the external force, the displacement-sensing sensor 110 by the contact presses the output impedance of the next stage input impedance to the first voltage follower 113 and the second voltage follower 114. That is, lower enough to fit in, that is, increase the amount of electricity.

When the sensor 110 operates by inputting two signals through the first voltage follower 113 and the second voltage follower 114 to the first phase inverter 115 and the second phase inverter 116. The phase inversion of the two signals towards the neutral point causes the two signal differences to become large.

Here, the output of the phase inverter is reduced to 0.25 Vcc, and the output of the second phase inverter 116 decreases as the sensor 110 is pressed from 1/2 Vcc to shift to 1/4 Vcc. Do it.

When the signal amplified by the differential amplifier 117 is transmitted to the load device 118, the degree of operation of the load device 118 is changed according to the transmitted signal, so that the contact portion of the sensor 110 is pressed through the load device 118. To identify with the eye.
Referring to the operation of the sensor 110 of the present embodiment in more detail as follows. The side not in contact with the first conductor layer 111 of R1 is connected to Vcc, and the side not in contact with the second conductor layer 112 of R2 is connected to ground (0 volts). For example, when the relationship between R1, Rx, and R2 is 1: 2: 1 in a normal state, the voltage level of the first conductor layer 111 is 3/4 Vcc and the voltage level of the second conductor layer 112 is flat. 1/4 Vcc.
At this time, when the sensor 110 is pressed, Rx is shifted to a small value. Thereafter, when the sensor 110 is pressed further, the value of Rx approaches '0'. That is, R1: Rx: R2 = 1: 0: 1.
Therefore, the voltage level of the first conductor layer 111 shifts from 3/4 Vcc to 1/2 Vcc, and the voltage level of the second conductor layer 112 shifts from 1/4 Vcc to 1/2 Vcc. .
Accordingly, a change according to the voltage level of the first conductor layer 111 is applied to the + input of the first voltage follower 113 connected from the first conductor layer 111 via L1, and the second conductor layer ( A change in accordance with the voltage level of the second conductor layer 112 is applied to the second voltage follower 114 + input connected via L2 from 112.
Since the output voltage of the first voltage follower 113 is equal to the voltage applied to the + input, the sensor 110 decreases from 3/4 Vcc as the sensor 110 is pressed to shift to 1/2 Vcc, while the first voltage When the output of the follower 113 is reversed, the sensor 110 is pushed from 1/4 Vcc and then shifts to 1/2 Vcc.
Here, the output of the phase inverter is increased by 0.25 Vcc so that the output of the first phase inverter 115 increases from 1/2 Vcc as the sensor 11 is pressed to shift to 3/4 Vcc. .
Since the output voltage of the second voltage follower 114 is equal to the voltage applied to the + input, the voltage increases from 1/4 Vcc to 1/2 Vcc as the sensor 110 is pressed.
When the output of the second voltage follower 114 is inverted in phase, the sensor 110 decreases as it is pressed from 3/4 Vcc and shifts to 1/2 Vcc.
Here, the output of the phase inverter is output to be 0.25 Vcc downward, so that the output of the second phase inverter 116 is reduced from 1/2 Vcc as the sensor 110 is pressed to shift to 1/4 Vcc. .
In order to obtain the difference between the output level of the first phase inverter 115 and the output level of the second phase inverter 116, the outputs of the first phase inverter 115 are divided into two units of the differential amplifier 117. One of the inputs is applied, and the output of the second phase inverter 115 is applied to the other input of the differential amplifier 117. Output level (1 / 2Vcc ~ 3 / 4Vcc) of the first phase inverter 115 as the sensor 110 is pressed, and output of the second phase inverter 116 as the sensor 110 is pressed. The difference in level (1 / 2Vcc to 1 / 4Vcc) is (1 / 2Vcc to 3 / 4Vcc)-(1 / 2Vcc to 1 / 4Vcc) = (at the output of differential amplifier 117 if the differential amplifier has gain '1' 0 Vcc to 1/2 Vcc), which increases as the sensor 110 is pressed from the initial value of 0 Vcc, resulting in a value up to 1/2 Vcc.

Accordingly, the first 110 and 113 second voltage floor 114, the first phase inverter 115 and the second phase inverter 116, the differential amplifier 117, the load on the sensor 110 Since the device 118 is provided with a connection, the result of the pressure measurement applied to the contact portion of the sensor is displayed on the load device 118. The sensor 110 is installed in an instrument of an analog type such as a pressure gauge or a weight scale, or a device such as various measuring devices to determine the degree of pressure of the sensor 110 according to pressure and weight to measure the degree of pressure and weight. You can do it.

In this case, when the sensor 110 is used for a weight scale for measuring the weight of an object, the first conductor layer 111 and the second conductor layer 112 of the sensor 110 may be hard, not soft.

It may be mounted on a chamber device using a pressure gas such as a dish dryer or the like to be used to measure the pressure of a gas, or may be mounted inside a pipe to measure the pressure of a gas or a liquid in the pipe.

FIG. 13 is a schematic block circuit diagram showing still another embodiment of the displacement-sensitive sensor 120 according to the present invention, in which a contact result of the sensor can be obtained as a digital result.

As shown in FIG. 13, the first A / D converter 125 is connected to the first voltage follower 123 connected to the first conductor layer 121 of the sensor 120 and the second conductor layer 122 is connected to the first conductor layer 121. The second A / D converter 126 is connected to the two-volt floor 124.

The subtractor 127 is connected to the first A / D converter 125 and the second A / D converter 126, and the digital phase inverter 128 is connected to the subtractor 127, and the digital phase inverter 128 is provided. ) Is provided with a shift register 129.

When the sensor 120 is pressed, the displacement-sensitized sensor 120 by the contact pressing is digitalized to obtain a numerical value as shown in FIG. 14 when the sensor 120 is pressed, and the sensor 120 is pressed. The first voltage follower 123 and the second voltage follower 124 lower the output impedance sufficiently to meet the next stage impedance, that is, increase the amount of electricity, and output the output signal to the first A / D converter 125 and The second A / D converter 126 converts the digital values.

If the digital values of two signals are subtracted through the subtractor 127, the numerical value when pressed is smaller than the normal value, and the smaller value is pressed than the normal value when passing through the inverter 128. When you lose, the figure is big.
Here, the digital numerical output of the first A / D converter 125 and the digital numerical output of the second A / D converter 126 are connected to one input (bus) of the subtractor 127 to the first A / D converter 125. In connecting the digital numerical output of the () and the digital numerical output of the second A / D converter 126 to the other input (bus) of the subtractor 127 to subtract,
The digital numerical output of the first A / D converter 125 is normally a large value far from the median, but appears as a value closer to the median as the sensor 120 is pressed. For example, as shown in FIG. 14, the values are represented as "111, 110, 101, 100".
The digital numerical output of the second A / D converter 126 is normally a large value far from the median, but appears as a value closer to the median as the sensor 120 is pressed. For example, as shown in Fig. 14, the values are represented by "000, 001, 010, 011".
The digital numerical output "111, 110, 101, 100" of the first A / D converter 125 is to be reduced, and the digital numerical output "000, 001, 010, 100 of the second A / D converter 126 is reduced. If subtracted with "," it appears as "111-000 = 111, 110-001 = 101, 101-010 = 011, 100-011 = 001". It is understood that the numerical value of the result of the subtraction is that the subtractor 127 output value when the sensor 120 is pressed is smaller than the normal subtractor 127 output value.

At this time, when the subtractor 127 output values " 111, 101, 011, 001 " are phase-inverted by the digital phase inverter 128, the result is " 000, 010, 100, 110 ". It can be seen that the output value of the digital phase inverter 128 when the sensor 120 is pressed down is larger than the output value of the digital phase inverter 128 in normal time. At this time, since the output value of the digital phase inverter 128 is "000, 010, 100, 110" and the LSB is always '0', the output value of the digital phase inverter 128 is applied to the right shift register 129. If the LSB of the digital phase inverter 128 is removed by moving 1 bit to the right, it becomes "00, 01, 10, 11", and the digital output value of the right shift register 129 according to the operation degree of the sensor 120 is continuous. To have.

FIG. 15 is a schematic circuit diagram illustrating still another embodiment of the displacement-sensitive sensor according to the present invention, and a schematic circuit diagram for determining contact pressure and disconnection by the strength of the current flowing through the semiconductive layer.

The current driver 134 is connected to the first conductor layer 131 of the sensor 130.

The current driver 134 is provided with a switch 135 for operating the current driver 134, and the second terminal layer 132 is connected to the-terminal of the second conductor layer 132 and the change of current is applied to the voltage. A current-voltage converter 136 that converts to a change in is provided.

A first voltage comparator 137 having a negative terminal connected to the current-voltage converter 136 is connected, and a second voltage comparator 138 having a positive terminal connected to the current-voltage converter 136. Is connected.

Such a displacement-sensing sensor by contact presses, by connecting the first conductor layer 131 and the current driver 134 by first operating the current driver 134 ID by closing the switch 135 and the semiconductive layer The resistance value Rx of 133, the Irx current flowing through the connecting line L2 connecting the second conductor layer 132 and the current-voltage converter 136 flows.

At this time, for example, if the output of the current-voltage converter 136 is adjusted to 1 / 2Vcc by adjusting IRx, and Vcp, which is a contact connected to the + terminal of the first voltage comparator 137, is set to 1 / 4Vcc, When the resistance value Rx of the semiconductive layer 133 is pressed down and the resistance value of Rx becomes small, the above-described current Irx increases and passes through the current voltage converter 136 while the current Irx is transferred to the voltage Viv by the current voltage converter 136. The value is converted to a value smaller than 1/4 Vcc.

Accordingly, a value smaller than 1/4 Vcc is input to the − terminal of the low side of the first voltage comparator 137 so that Vcp having 1/4 Vcc has a larger value, so that the output of the first voltage comparator 137 is high. It becomes high to recognize that the semiconductive layer 133 is pressed.

On the other hand, when the value of Vop, which is a contact connected to the negative terminal of the second voltage comparator 138, is set to 3 / 4Vcc, when L1 or L2 is disconnected or both L1 and L2 are disconnected, the current Ir2 reaches 0 and 0 Ir2 having a value of? Passes through the current voltage converter 136, and the current Ir2 is converted into a voltage Viv.

At this time, the converted voltage value is almost 1 Vcc, which is larger than 3/4 Vcc, and the value is input to the + terminal on the high side of the second voltage comparator 138.

Accordingly, since the input voltage value of the + terminal is greater than the voltage value of Vop of the second voltage comparator 138 having the value of 3 / 4Vcc, the output of the second voltage comparator 138 becomes high, so that L1 or L2 becomes high. It is recognized that the wire is disconnected or both L1 and L2 are disconnected.

This can determine contact depression and the disconnection of L1 and L2 by the intensity of the current flowing through the semiconductive layer 133, and the effect is the same as described above.

FIG. 16 is a schematic circuit diagram illustrating still another embodiment of the displacement-sensing sensor according to the present invention, and a schematic circuit diagram for determining disconnection and a method of eliminating malfunction due to in-phase noise by removing in-phase noise.

This is provided with a first voltage follower 148 having a + terminal connected to the first resistor 145, and a second voltage follower 149 having a + terminal connected to the second resistor 147.

The first voltage follower 148 and the second voltage follower 149 are provided with a differential amplifier 150 to which the outputs of the first voltage follower 148 and the second voltage follower 149 are input.

The differential amplifier 150 includes a first voltage comparator 151 having a − terminal connected thereto, and a second voltage comparator 152 having a + terminal connected to the differential amplifier 150.

The displacement-sensing sensor by contact contact as described above has the in-phase noise introduced into the circuit through the first resistor 145 R ₁ , L1, Rx, L2, and the second resistor 147 R ₂ and the first voltage follower 148. In-phase noise introduced into a circuit, such as the second voltage follower 149, is removed while passing through the differential amplifier 150, and assuming that the gain of the differential amplifier 150 is n, the output of the differential amplifier 150 Since Vdfa = n (Vf1-Vf2), this only obtains the signal due to the displacement of Rx.

As an example of this, when R ₁ : Rx: R ₂ = 1: 2: 1 is set and the value of Vcp, which is a contact point connected to the + terminal of the first voltage comparator 151, is set to 1 / 3Vcc, If the value of the first voltage follower 148 is 3 / 4Vcc, the value of the second voltage follower 149 is 1 / 4Vcc, and the voltage gain of the differential amplifier 150 is 1, the output Vdfa of the differential amplifier 150 is The value is 1 / 2Vcc.

Accordingly, since the output of the differential amplifier 150 has a value smaller than 1/3 Vcc, which is the value of Vcp, the output of the first voltage comparator 151 becomes high, so that the output of the semiconducting layer 144 Recognize pressing.
On the other hand, when L1 or L2 is disconnected or both L1 and L2 are disconnected while the value of the "-" input terminal voltage Vop of the second voltage comparator 152 is set to 2/3 Vcc, Vcc passes through R1. It is applied to Vfl1 of the first voltage follower 148, and Vfl1 is almost 1 Vcc, and Gnd is applied to Vfl1 of the second voltage follower 149 via R2, and Vfl2 is almost 0 Vcc.
Accordingly, the output Vf1 of the first voltage follower 148 becomes almost 1 Vcc,
Since the output Vfl2 of the second voltage follower 149 becomes almost 0 Vcc, the value of the output Vdfa of the differential amplifier 150 is greater than the value of Vop, which is 2/3 Vcc.
The output of the second voltage comparator 152 becomes high to recognize that L1 or L2 is disconnected or both L1 and L2 are disconnected.

In this state, if Rx decreases due to the pressing of the semiconductive layer 144 having semiconductivity to R ₁ : Rx: R ₂ = 2: 1: 2, the value of the first voltage follower 148 is 3 The value of the / 5Vcc and the second voltage follower 149 is 2 / 5Vcc, and the value of the output Vdfa of the differential amplifier 150 is 1 / 5Vcc.

Accordingly, since the value of the output Vdfa of the differential amplifier 150 has a value smaller than the value 1/3 Vcc of the Vcp, the output of the first voltage comparator 151 becomes high to press the semiconductive layer 144. Recognize.

On the other hand, when L1 or L2 is disconnected or both L1 and L2 are disconnected while the value of the "-" input terminal voltage Vop of the second voltage comparator 152 is set to 2 / 3Vcc, Vcc passes through R1. Vf1i is applied to Vf1i of the first voltage follower 148 to be approximately 1 Vcc, and Vf2i is applied to Vf2i of the second voltage follower 149 via ground (Gnd) to Vf2i to be 0Vcc.

Accordingly, the output Vf1 of the first voltage follower 148 becomes almost 1 Vcc, the output Vf2 of the second voltage follower 149 becomes almost 0 Vcc, and the output Vdfa of the differential amplifier 150 is (almost). 1 Vcc-almost 0 Vcc) = about 1 Vcc, so that the value of the output Vdfa of the differential amplifier 150 is larger than the value of Vop which is 2/3 Vcc. Accordingly, the output of the second voltage comparator 152 becomes high to recognize that L1 or L2 is disconnected, or both L1 and L2 are disconnected.

When the contact portion of the sensor 140 is installed outside, the in-phase noise generated by the unnecessary current flowing into the circuit is removed by the differential amplifier 150 to obtain only a signal due to the displacement of Rx of the sensor 140. Depression of the contact of the sensor 140 can be recognized.

Figure 17 is a schematic circuit diagram showing another embodiment of the displacement-sensitive sensor by the contact pressing of the present invention. As shown in the drawing, the main circuit and the sub-circuit are arranged in parallel, the in-phase noise is eliminated, the hysteresis characteristics are applied at the set contact depression degree, and the circuit configuration is such that disconnection is determined.

It is provided with a switch 165, and is provided with a current driver 164 connected to one side of the switch 165, the current driver 164 is connected to the first conductor layer 161 of the sensor 160 by the connecting line L1 Connected.

In addition, a first current-voltage converter 166 connected to the second conductor layer 162 of the sensor 160 by a connecting line L2 is provided, and on one side of the first current-voltage converter 166, a first phase inverter 168 is connected, the first phase inverter 168 is connected to the differential amplifier 173, one side of the differential amplifier 173 is equipped with a press detector 174, the press detector 174 A hysteresis resistor Rhis is connected at one side to the output side of the depression detector 174 and at the other side to the + side of the depression detector 174.

In addition, a second current-voltage converter 167 connected by the connecting line L2 'to the first conductor layer 161 via a resistor Rx' having the same value as the usual resistance value Rx or an arbitrary value is provided. A second phase inverter 169 is connected to one side of the current-voltage converter 167, and the output side of the second phase inverter 169 is connected to the differential amplifier 173.

Between the first phase inverter 168 and the differential amplifier 173, a first breaker 171 to which the negative terminal is connected is connected, and the second phase inverter 169 and the differential amplifier 173 are connected to each other. Between the second terminal discriminator 172 is connected to the terminal is connected.

In this connected circuit, the output voltage Vdfa of the differential amplifier 173 has a value of 0 at normal times, and when the sensor 160 is pressed down, the value of Rx decreases, and if Ir2 increases, the first phase inverter 168 As the difference between the output voltage Vmain and the output voltage Vsub of the second phase inverter 169 increases, the output voltage Vdfa of the differential amplifier 173 increases.

For example, if Vcp is set to 1 / 3Vcc, when the value of the output voltage Vdfa of the differential amplifier 173 increases, and the value of Vdfa becomes larger than 1 / 3Vcc, the output of the push detector 174 becomes high to recognize contact contact. .

Afterwards, Rhis is positively fed back to Vdfa, resulting in hysteresis characteristics.

On the other hand, when Irx becomes 0 due to disconnection of L2, the output voltage Vmain of the first phase inverter 168 becomes the minimum value.

If the disconnection discrimination voltage Vop1 of the first disconnection discriminator 171 is set slightly above the minimum value of Vmain, the output of the first disconnection discriminator 171 becomes High to recognize the disconnection of L2.

When Ir2 'becomes 0 due to disconnection of L2', Vsub becomes the minimum value.

If the circuit breaker voltage Vop2 of the second circuit breaker 172 is set slightly above the minimum value of the output voltage Vsub of the second phase inverter 169, the output of the second circuit breaker 172 becomes High and L2 ' Recognize disconnection of.

18 to 22 are perspective views showing another embodiment of the displacement-sensitive sensor according to the present invention contact pressing, perspective views that vary the shape of the sensor.

As shown in FIG. 18, the first semiconductive layer 181 and the second semiconductive layer 182 are formed, and the conductive layer 183 is disposed between the first semiconducting layer 181 and the second semiconducting layer 182. The plurality of horizontal conductors R are formed on the first semiconducting layer 181, and the plurality of vertical conductors C are formed on the bottom of the second semiconducting layer 182. The shape and structure of the can be different, which can be installed and used in the touch screen, keyboard, and the like.

As shown in FIG. 19, a first semiconducting layer 191 and a second semiconducting layer 192 are formed, a first conductive layer 193 is formed below the first semiconducting layer 191, and a second semiconducting layer. The second conductive layer 194 is formed below the conductive layer 192, and a plurality of horizontal conductors R are formed on the first semiconductive layer 191, and the second conductive layer 192 is formed of the second conductive layer 194. A plurality of vertical conductors C are formed thereon, and the shape and structure of the sensor 190 are different so that the insulating layer 195 is formed between the first conductive layer 193 and the second semiconducting layer 192. The effect is the same as that mentioned above.

As shown in FIG. 20, the overall shape of the sensor 200 is formed in a cylindrical shape, a first semiconducting layer 201 and a second semiconducting layer 202 are formed, and an upper portion of the first semiconducting layer 201 is formed. A disk-shaped first conductive layer 203 is formed, a second conductive layer 204 having a target shape is formed below the first semiconductive layer 201, and an upper portion of the second semiconductive layer 202. A target-shaped third conductive layer 205 is formed, and a disk-shaped fourth conductive layer 206 is formed under the second semiconductive layer 202, and the second conductive layer 204 and the third conductive layer are formed. The shape and structure of the sensor 200 may be varied so that the insulating layer 207 is formed between the layers 205, and may be used as a target plate in a pistol shooting range or an archery shooting range.

As shown in FIG. 21, the overall shape of the sensor 210 is formed in a cylindrical shape, a first conductive layer 211 and a second conductive layer 212 are formed in a target shape, and the first conductive layer 211 and the second conductive layer 212 are formed. The shape and structure of the sensor 210 may be varied so that the semiconductive layer 213 is formed between the conductive layers 212, and the effects thereof are the same as described above.

As shown in FIG. 22, the overall shape of the sensor 220 is formed in a cylindrical shape, a first semiconducting layer 221 and a second semiconducting layer 222 are formed, and an upper portion of the first semiconducting layer 221 is formed. The target-type first conductive layer 223 is formed, and the target-shaped second conductive layer 224 is formed below the second conductive layer 222, and the first semiconductive layer 221 and the second conductive layer 224 are formed. The shape and structure of the sensor 220 may be varied so that the third conductive layer 225 is formed between the semiconductive layers 222, and the effects thereof are the same as described above.

Figure 23 is a schematic circuit diagram showing another embodiment of the displacement-sensitive sensor by the contact pressing of the present invention, which detects the degree of contact pressing in parallel with the main circuit and the sub-circuit to the in-phase introduced from both outside It is designed to extract the degree of conductivity change due to pure contact decay by eliminating noise using a differential amplifier.

According to the displacement-sensing sensor according to the present invention as described above, the contact portion 11 is formed of a synthetic resin or soft rubber or silicone material containing a conductive material and having good elasticity, so that the contact portion 11 is pressed against the contact portion 11 from the outside. When this is applied, the semiconducting layer 14 shrinks and the density of the conductive material 15 of the semiconducting layer 14 increases, so that the resistance can be reduced and the pressing can be sensed. It is easy to manufacture and install, so it can be installed on electric motors (D), automatic sliding doors (D), bumpers of vehicles, front and back and side of track cars, and can be installed on pressure gauges or weigh scales. It is installed on the back and can be used in various fields such as the measurement of the gas pressure, liquid pressure, and the like.

Claims (7)

In the displacement-sensitive sensor by contact pressing, The conductive material 15 is contained in a flexible material having a predetermined density, and the resistance value Rx (Rx> 0) is normal, but when pressed, the density of the conductive material 15 in the soft material increases, thereby increasing the resistance value. An elastic semiconductive layer 14, formed to approach 0 and become small; A first conductor layer 12 containing a conductive material 15 is formed on an upper surface of the semiconductive layer 14; A contact portion (11) is formed on a lower surface of the semiconductive layer (14) to form a second conductor layer (13) containing a conductive material (15); A first resistor (19) having one side connected to the first conductor layer (12) and the other side connected to the Vcc side of the power supply; A second resistor (21) having one side connected to the second conductor layer (13) and the other side connected to the negative side of the power source; A first voltage comparator (16) having an inverting input unit (-) connected to the first conductor layer (12); A second voltage comparator 17 having a non-inverting input unit + connected to the second conductor layer 13; A third resistor 22 having one side connected to the Vcc side of the power supply and the other side connected to the non-inverting input unit (+) of the first voltage comparator 16; A fourth resistor (23) having one side connected to the non-inverting input unit (+) of the first voltage comparator (16) and the other side connected to the inverting input unit (-) of the second voltage comparator (17); A fifth resistor 24 having one side connected to the − side of the power supply and the other side connected to the inverting input unit (−) of the second voltage comparator 17; And an OR gate (18) connected to the first voltage comparator (16) and the second voltage comparator (17) and outputting a signal in accordance with the output thereof. The method of claim 1, One side is connected to the inverting input unit (-) of the first voltage comparator 56, the other side is connected to the non-inverting input unit (+) of the second voltage comparator 57 is further provided with a disconnection check resistor (70) Displacement sensor by contact pressing, characterized in that. The method of claim 1, A third voltage comparator (96) installed so that a non-inverting input unit (+) is connected to the first resistor (89); A fourth voltage comparator 97 installed to connect an inverting input unit (-) to the second resistor 91; A sixth resistor 100 having one side connected to the Vcc side of the power supply and the other side connected to the inverting input unit (-) of the third voltage comparator 96; A seventh resistor (101) having one side connected to the inverting input unit (-) terminal of the third voltage comparator 96 and the other side connected to the non-inverting input unit (+) terminal of the fourth voltage comparator 97; An eighth resistor 102 having one side connected to the − side of the power supply and the other side connected to the non-inverting input unit (+) of the fourth voltage comparator 97; And a second OR gate (98) connected to the third voltage comparator (96) and the fourth voltage comparator (97). delete delete delete delete

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