KR100785308B1 - Chip led surface inspection method and apparatus - Google Patents

Chip led surface inspection method and apparatus Download PDF

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KR100785308B1
KR100785308B1 KR1020060064646A KR20060064646A KR100785308B1 KR 100785308 B1 KR100785308 B1 KR 100785308B1 KR 1020060064646 A KR1020060064646 A KR 1020060064646A KR 20060064646 A KR20060064646 A KR 20060064646A KR 100785308 B1 KR100785308 B1 KR 100785308B1
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chip
vertical
chip led
light
vertical illumination
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Korean (ko)
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이민형
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(주)아이엠에스나노텍
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

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Abstract

A method and an apparatus for inspecting a chip LED surface are provided to automatically detect failed chip LEDs according to various types of the chip LEDs. An apparatus for inspecting a chip LED surface includes an inclined part(21) and a cylindrical part(22). The inclined part has a slope lighting(24) with white LEDs(23) in a plurality of layers with a ring type which has a strong directionality. The light emitted from the white LEDs illuminates a surface of a wafer(25) of the chip LEDs to be inspected. A vertical lighting(27) illuminates the wafer surface of the LED through a lens after the vertical lighting is reflected to a half mirror(28). The control unit controls on-off of the vertical lighting and the slope lighting. The control unit transmits position information to a map file of failed chip LEDs by determining as the failed chip LEDs when the image photographed during the vertical lighting is different from a reference image of the vertical lighting and when the image photographed during the slope lighting is different from a reference image of the slope lighting.

Description

칩 엘이디 표면 검사 방법 및 장치{Chip LED Surface Inspection Method and Apparatus}Chip LED Surface Inspection Method and Apparatus

도1은 종래기술에서 수직조명을 사용하여 요철형 칩LED의 이물질 불량을 검사하는 장치를 도시함1 illustrates an apparatus for inspecting a foreign matter defect of an uneven chip LED using vertical lighting in the prior art.

도2는 종래기술에서 수직조명을 사용하여 평면형 칩LED의 스크래치 불량을 검사하는 장치를 도시함FIG. 2 illustrates an apparatus for inspecting a scratch defect of a planar chip LED using vertical lighting in the prior art.

도3은 본 발명에서 사용되는 경사조명을 이용하여 요철형 칩LED의 이물질을 검사하는 원리를 도시함 Figure 3 shows the principle of inspecting the foreign matter of the uneven chip LED using the inclined light used in the present invention

도4는 본 발명에서 사용되는 경사조명을 이용하여 평면형 칩LED의 스크래치를 검사하는 원리를 도시함 Figure 4 shows the principle of inspecting the scratch of the planar chip LED using the inclined light used in the present invention

도5는 본 발명의 검사장치의 전체적인 구조를 도시함5 shows the overall structure of the inspection apparatus of the present invention.

도6은 본 발명의 검사장치를 이용하여 칩LED 웨이퍼를 검사하는 과정을 설명함6 illustrates a process of inspecting a chip LED wafer using the inspection apparatus of the present invention.

본 발명은 요철형 칩LED의 표면의 다양한 불량 여부를 검출하는 검사방법 및 장치에 관한 것이다. The present invention relates to an inspection method and apparatus for detecting various defects of the surface of the uneven chip LED.

칩LED는 표면은 평면인 것도 있고 요철면인 경우도 있다.Chip LEDs may have a flat surface or an uneven surface.

칩LED의 표면을 평면으로 형성을 하면 내부의 빛이 퍼져서 분산되기 때문에, 강한 전면광을 원하는 경우(자동차 전조등, LCD Backlights 등)에는, 칩LED의 표면이 볼록렌즈와 오목렌즈가 반복되는 요철면이어서 이러한 렌즈 특징으로 인하여 내부의 빛이 전면을 향하게 되는 특성이 있는 요철면형의 칩LED를 사용하고, 일반적인 발광이 필요한 경우에는 평면형의 칩LED가 사용된다.If the surface of the chip LED is formed in a flat surface, the internal light spreads and is dispersed, so if strong front light is desired (car headlights, LCD backlights, etc.), the surface of the chip LED has an uneven surface in which convex and concave lenses are repeated. Subsequently, a chip-type LED having an uneven surface having a characteristic in which the internal light is directed toward the front due to the lens feature is used, and a planar chip LED is used when general light emission is required.

이러한 칩LED의 제조 공정에서는 LED표면에 이물질이 침착되어 있거나 스크래치 등이 있는 불량 칩LED는 색출해서 출하가 되지 않게 하는 불량 칩LED 외관 검사공정을 반드시 거쳐야 한다.In the manufacturing process of such chip LEDs, the defective chip LEDs having foreign matters deposited on the surface of the LEDs or scratches, etc. must go through the inspection process of the defective chip LED appearance to prevent the shipment of the chip LEDs.

일례로, 종래기술에서는 요철형 칩LED의 불량을 검사하기 위하여 도1에서와 같이 수직조명을 사용하였다.For example, in the prior art, vertical illumination was used as shown in FIG. 1 to inspect the defect of the uneven chip LED.

그래서, 요철면형 칩LED(1)의 표면에 이물질(3)이 있는 경우에는 이물질(3)이 빛(5)을 흡수하여 이물질(3)로 향한 빛이 흡수되어 렌즈(4)로 향하지 않아 이물질(3) 부분이 검은색으로 나타나지만, 다른 요철 부분도 수직조명(2)에 의한 빛(6)이 요철 경사면에서 반사되어 렌즈(4) 외부로 향하게 되어, 결국 요철면형 표면의 칩LED에 있는 이물질(3)을 수직조명(2)을 비추어서 검사할 수가 없다.Therefore, when the foreign matter 3 is present on the surface of the uneven surface LED chip 1, the foreign matter 3 absorbs the light 5 and the light directed to the foreign matter 3 is absorbed and does not turn toward the lens 4 so that the foreign matter is not present. (3) The part appears black, but the other uneven part also reflects the light (6) by the vertical illumination (2) on the uneven inclined surface and is directed out of the lens (4), which eventually causes foreign matter in the chip LED on the uneven surface. (3) cannot be examined by illuminating the vertical light (2).

또한, 이러한 수직 조명을 이용하여 평면형 칩LED를 검사하는 경우에, 평면형 칩LED에 스크래치가 있는 도2와 같은 경우에는 스크래치 홈(7)에 조사된 광이 렌즈 외부로 향하므로 어둡게 보이고 나머지 부분은 밝게 보인다. 그러나, 전체 밝 은 부분에서의 빛이 산란이 되어 스크래치가 있는 어두운 부분까지 밝은 색으로 될 수 있으므로 실제로는 미세한 스크래치는 검출하기가 어렵다.In addition, in the case of inspecting the planar chip LED using such vertical illumination, in the case of FIG. 2 where the planar chip LED is scratched, the light irradiated to the scratch groove 7 is directed toward the outside of the lens, and the remaining part is dark. Looks bright. However, since the light in the entire bright part can be scattered and become a bright color in the dark part with scratches, it is difficult to actually detect a minute scratch.

결론적으로 종래기술에 따른 칩LED 불량 검사 장치 및 방법은 다양한 결함을 모두 검출하기가 어렵다.In conclusion, the chip LED failure inspection apparatus and method according to the prior art is difficult to detect all the various defects.

본 발명은 상기의 종래기술의 문제점을 감안하여, 표면이 요철형인 칩LED 뿐만 아니라 표면이 평면형인 칩LED까지도 다양한 유형의 불량 LED칩을 용이하게 검출하기 위한 칩LED의 검사장치 및 검사방법을 제공한다.The present invention, in view of the above problems of the prior art, provides a chip LED inspection device and inspection method for easily detecting a variety of types of defective LED chip as well as chip LED having a surface irregularities, as well as chip LED having a flat surface. do.

이상과 같은 본 발명의 과제를 달성하기 위하여, 본 발명은In order to achieve the above object of the present invention, the present invention

불량 칩LED 검사장치에 있어서,In the bad chip LED inspection device,

칩LED용 웨이퍼에 수직 조명을 인가하는 수직 조명 장치; 칩LED용 웨이퍼에 경사 조명을 인가하는 경사 조명 장치; 상기 수직 조명을 온시키도록 제어하여 수직 조명이 온되었을 때에 촬영된 영상을 수직조명시의 기준 영상과 비교하여, 일치하지 않으면 불량 칩LED로 판정하여 불량 칩LED맵 파일에 그 위치 정보를 전달하며, 상기 수직조명을 오프시키고 경사조명을 온시키도록 제어하여 경사조명이 온되었을 때에 촬영된 영상을 경사 조명시의 기준 영상과 비교하여, 일치하지 않으면 불량 칩 LED로 판정하여 불량 칩LED 맵 파일에 위치 정보를 전달하는 제어 장치를 포함하는 것을 특징으로 한다. Vertical illumination device for applying vertical illumination to the wafer for chip LED; A tilt lighting device for applying tilt lighting to the wafer for chip LEDs; By controlling the vertical illumination to be turned on, the image taken when the vertical illumination is turned on is compared with the reference image at the time of vertical illumination, and if it does not match, it is determined as a bad chip LED, and the location information is transmitted to the bad chip LED map file. The control unit is configured to turn off the vertical light and turn on the inclined light so that the image taken when the inclined light is turned on is compared with the reference image for the inclined light. It characterized in that it comprises a control device for transmitting location information.

먼저, 불량 칩LED의 유형에 대해 간단히 설명하기로 한다.First, the type of bad chip LED will be briefly described.

- LED칩이 깨진 경우-When the LED chip is broken

- LED칩이 두개가 있는 경우-If there are two LED chips

- 마킹이 있는 경우-If there is a marking

- 칩LED 내부에 메탈이 잔류된 경우-If metal remains inside the chip LED

- 코팅이 벗겨진 경우-Coating is peeled off

- 변색된 경우-Discoloration

- 스크래치가 있는 경우-If there is a scratch

- 이물질이 있는 경우-If there is a foreign object

- 푸루버 자국이 있는 경우-If there is a pour mark

이제 이상과 같은 다양한 결함(불량)을 모두 검출하기 위한 본 발명의 검사 방법에 대해 살펴보기로 한다.Now, the inspection method of the present invention for detecting all the various defects (defects) described above will be described.

먼저, 본 발명에서 부가적으로 사용되는 경사조명을 사용하여 이물질이 있는 요철면형 칩LED를 검사하는 방법에 대해 도3를 참고로 하여 살펴보기로 한다First, a method of inspecting a concave-convex chip LED having foreign matter using inclined light additionally used in the present invention will be described with reference to FIG. 3.

요철형 칩LED(11)의 표면에 이물질(12)이 있는 경우에 경사조명(13)을 비추면 이물질(12)이 있는 부분은 빛을 흡수하므로 어둡게 보이고, 요철부분(정상 부분)은 경사방향으로 입사된 빛이 요철면에 반사되어 렌즈(14)로 향하므로 밝게 보 인다.If there is a foreign material 12 on the surface of the uneven chip LED 11, when the inclined light 13 is illuminated, the part having the foreign material 12 appears to be dark because it absorbs light, and the uneven part (normal part) is in an inclined direction. The incident light is reflected by the uneven surface and directed toward the lens 14, which makes it look bright.

따라서, 경사조명(13)을 조사하여 얻은 영상과 기준 영상(우량 칩LED 영상)을 비교하면, 요철형 칩LED(11)에 존재하는 이물질(12)이 경사조명(13)에 의해 용이하게 검출되게 된다.Therefore, when the image obtained by irradiating the inclined light 13 and the reference image (excellent chip LED image) are compared, the foreign matter 12 present in the uneven chip LED 11 is easily detected by the inclined light 13. Will be.

그리고, 이러한 경사조명(13)은 평면형인 칩LED에서 스크래치에 의한 홈을 검출하는데에도 사용할 수 있다. 이때에는 경사조명(13)을 조사하면 도4에서와 같이 홈(15)으로 조사된 경사조명은 반사되어 렌즈로 향하여 밝게 보이지만 평평한 부분은 어둡게 보여서 스크래치가 있는 평면형의 칩 LED를 검출할 수 있게 된다. Incidentally, the inclined light 13 may be used to detect grooves due to scratches in the planar chip LED. In this case, when the inclined light 13 is irradiated, the inclined light irradiated by the groove 15 is reflected and looks bright toward the lens as shown in FIG. 4, but the flat part is dark so that a flat chip LED with scratches can be detected. .

한편, 이러한 평면형의 칩LED에서의 스크래치는 수직조명을 조사하여도 검출이 가능하다. 이때에는 경사 조명때와는 반대로 스크래칭 부분은 어둡게 보이지만 평평한 부분은 밝게 보인다. On the other hand, the scratch in the planar chip LED can be detected even by irradiating vertical illumination. At this time, the scratching part looks dark while the flat part looks bright as opposed to the oblique lighting.

그러나, 위의 종래기술에서 설명한 바와 같이, 스크래치 부분이 전체 표면의 적은 부분을 차지하므로 이 대부분을 차지하는 평평한 부분의 빛의 산란으로 인하여 스크래치 부분의 어두운 부분이 잘 인식되지 않을 가능성이 높으므로 평면형의 칩LED는 경사조명을 사용하는 것이 바람직하다.However, as described in the prior art, since the scratch portion occupies a small portion of the entire surface, it is highly likely that the dark portion of the scratch portion is not well recognized due to the scattering of light in the flat portion which occupies most of the surface. It is preferable to use inclined light as the chip LED.

다음으로 평면형 및 요철형 칩LED에서 나머지 불량 유형(LED칩이 깨진 경우, LED칩이 두개가 있는 경우, 마킹이 있는 경우, 칩LED 내부에 메탈이 잔류된 경우, 코팅이 벗겨진 경우, 변색된 경우, 푸루버 자국이 있는 경우)의 경우에는 수직 조 명을 사용하면 이 부분에서 정상부분과 상이한 색깔이 검출되므로 불량 칩LED 검출이 가능하다.Next, in the flat and uneven chip LED, the remaining defect types (when the LED chip is broken, there are two LED chips, there are markings, the metal remains inside the chip LED, the coating is peeled off, and the discoloration occurs. In the case of a pluver mark, the vertical light is used to detect a bad chip LED because the color is different from the normal part.

이제 도5를 참고로 하여 본 발명의 검사장치의 구조를 자세히 설명하기로 한다.Referring now to Figure 5 will be described in detail the structure of the inspection apparatus of the present invention.

본 발명의 검사장치는 측면은 원추형의 경사면 부분(21)과 원통형 부분(22)로 구성되고, 이 경사면 부분에는 링형태로 다수층의 직진성이 강한 백색LED들(23)(예를들면, 요철형 칩LED)에 의한 경사조명(24)을 설치하고 이 LED들(23)에서 나오는 빛이 검사하고자 하는 칩LED의 웨이퍼(25) 표면을 조사하도록 한다.In the inspection apparatus of the present invention, the side surface is composed of a conical inclined surface portion 21 and a cylindrical portion 22, and the inclined surface portion has a plurality of layers of straight white LEDs 23 (eg, unevenness) in a ring shape. The inclined illumination 24 by the type chip LEDs is installed and the light emitted from the LEDs 23 is irradiated to the surface of the wafer 25 of the chip LED to be inspected.

그리고, 수직조명(27)은 하프미러(28)에서 반사되어 렌즈(26)를 통해 LED 웨이퍼(25) 표면을 조사하게 된다.The vertical light 27 is reflected by the half mirror 28 to irradiate the surface of the LED wafer 25 through the lens 26.

또한, 제어장치(29)에 의해 수직조명(27)과 경사 조명(24)의 온/오프가 제어된다.In addition, the on / off of the vertical illumination 27 and the inclination illumination 24 is controlled by the control apparatus 29. FIG.

그리고, 웨이퍼(25)를 한번에 검사하기가 어려운 경우, 즉 다수의 섹션(프레임)으로 분할하여 불량 검사를 해야 하는 경우에는 웨이퍼(25)의 하부의 다이(30)에는 섹션(프레임) 선택용 구동장치가 있어 제어장치(29)에 의해 검사를 원하는 웨이퍼 섹션(프레임)이 본 발명의 검사장치 바로 아래에 놓이게 한다.In the case where it is difficult to inspect the wafer 25 at one time, that is, when a defect inspection is to be performed by dividing into a plurality of sections (frames), a section (frame) selection drive is performed on the die 30 below the wafer 25. The device allows the section 29 of the wafer to be inspected by the controller 29 to be placed directly under the inspection device of the present invention.

다음으로, 본 발명의 검사장치를 사용해서 칩LED웨이퍼를 검사하는 단계를 도6을 참고로 하여 구체적으로 설명하기로 한다.Next, the step of inspecting the chip LED wafer using the inspection apparatus of the present invention will be described in detail with reference to FIG.

먼저, 칩LED웨이퍼를 검사장치의 다이(30)에 올려 놓는다(S11). 검사하고자 하는 웨이퍼 섹션이 검사장치의 바로 아래에 놓이도록 제어장치(29)가 구동장치를 제어한다(S12).First, the chip LED wafer is placed on the die 30 of the inspection apparatus (S11). The controller 29 controls the driving device so that the wafer section to be inspected is directly under the inspection device (S12).

이제, 제어장치(29)가 수직조명(27)을 온 시켜서 렌즈(26)를 통해 영상을 얻어(S13), 제어장치(29)가 저장하고 있는 수직 조명시의 기준 영상과 비교하여 불량 LED칩을 검출하여(S14), 불량 LED칩 맵 파일에 이 수직 조명시의 불량 LED의 위치 정보를 등록한다(S15).Now, the controller 29 turns on the vertical light 27 to obtain an image through the lens 26 (S13), and compares the defective LED chip with the reference image at the time of vertical illumination stored in the controller 29. Is detected (S14), and the positional information of the defective LED at the time of vertical illumination is registered in the defective LED chip map file (S15).

다음으로 제어장치(29)가 수직조명을 오프시키고 경사조명(24)를 온시켜서 렌즈(26)를 통해 영상을 얻어(S16), 제어장치(29)가 저장하고 있는 경사 조명시의 기준 영상과 비교하여 불량 LED칩을 검출하여(S17), 불량 LED칩 맵 파일에 이 경사 조명시의 불량 LED의 위치 정보를 등록한다(S18).Next, the control device 29 turns off the vertical light and turns on the inclined light 24 to obtain an image through the lens 26 (S16), and the reference image in the inclined light stored in the control device 29 and In comparison, the defective LED chip is detected (S17), and the positional information of the defective LED at the time of the inclined illumination is registered in the defective LED chip map file (S18).

이제, 웨이퍼의 다음 섹션을 검사하기 위해 상기 단계(S12) 내지 단계(S18)를 반복한다.Now, the above step S12 to step S18 are repeated to inspect the next section of the wafer.

이상과 같이 하여 하나의 칩LED웨이퍼에 대한 검사가 완료되면 다음 웨이퍼에 대해서도 이상의 과정을 반복한다.When the inspection of one chip LED wafer is completed as described above, the above process is repeated for the next wafer.

이상과 같이 수직조명을 인가하여 불량 칩LED를 검출하고, 다시 경사조명을 인가하여 다시 불량 칩LED를 검출한다면 평면형 뿐만 아니라 요철형에 있어서의 다 양한 불량을 모두 자동으로 검출 가능하게 된다.As described above, if the bad chip LED is detected by applying vertical illumination, and the bad chip LED is detected again by applying oblique illumination, various defects in the flat type as well as the irregularities can be automatically detected.

이렇게 하여 형성된 불량 LED칩 맵 파일은 불량 LED칩 마킹 장치에 전달되어 불량 LED칩에 마킹을 하여 추후 추출해 낸다.The defective LED chip map file formed in this way is transferred to the defective LED chip marking device, and then extracted after marking the defective LED chip.

이상과 같은 본 발명을 이용하면, 칩LED에서의 다양한 불량 유형에 따른 불량 칩LED를 자동적으로 검출할 수 있게 된다..By using the present invention as described above, it is possible to automatically detect the defective chip LED according to various types of failure in the chip LED.

Claims (5)

삭제delete 불량 칩LED 검사장치에 있어서,In the bad chip LED inspection device, 칩LED용 웨이퍼에 수직 조명을 인가하는 수직 조명 장치;Vertical illumination device for applying vertical illumination to the wafer for chip LED; 칩LED용 웨이퍼에 경사 조명을 인가하고, 각각의 상기 경사조명이 백색 LED들로 링형태로 구성된 다수층으로 구성되는 경사 조명 장치;An inclined illumination device configured to apply inclined illumination to a wafer for chip LEDs, wherein each of the inclined illuminations comprises a plurality of layers formed in a ring shape with white LEDs; 상기 수직 조명을 온시키도록 제어하여 수직 조명이 온되었을 때에 촬영된 영상을 수직조명시의 기준 영상과 비교하여, 일치하지 않으면 불량 칩LED로 판정하여 불량 칩LED맵 파일에 그 위치 정보를 전달하며, 상기 수직조명을 오프시키고 경사조명을 온시키도록 제어하여 경사조명이 온되었을 때에 촬영된 영상을 경사 조명시의 기준 영상과 비교하여, 일치하지 않으면 불량 칩 LED로 판정하여 불량 칩LED 맵 파일에 위치 정보를 전달하는 제어 장치를 포함하는 것을 특징으로 하는 불량 칩LED 검사장치.By controlling the vertical illumination to be turned on, the image taken when the vertical illumination is turned on is compared with the reference image at the time of vertical illumination. The control unit is configured to turn off the vertical light and turn on the inclined light so that the image taken when the inclined light is turned on is compared with the reference image for the inclined light. Defective chip LED inspection device comprising a control device for transmitting position information. 불량 칩LED 검사장치에 있어서,In the bad chip LED inspection device, 수평으로 조사된 빛을 하프미러에 의해 수직으로 반사시켜 조사하여, 칩LED용 웨이퍼에 수직 조명을 인가하는 수직 조명 장치;A vertical illumination device for vertically reflecting light irradiated horizontally by a half mirror to apply vertical illumination to a wafer for chip LEDs; 칩LED용 웨이퍼에 경사 조명을 인가하는 경사 조명 장치;A tilt lighting device for applying tilt lighting to the wafer for chip LEDs; 상기 수직 조명을 온시키도록 제어하여 수직 조명이 온되었을 때에 촬영된 영상을 수직조명시의 기준 영상과 비교하여, 일치하지 않으면 불량 칩LED로 판정하여 불량 칩LED맵 파일에 그 위치 정보를 전달하며, 상기 수직조명을 오프시키고 경사조명을 온시키도록 제어하여 경사조명이 온되었을 때에 촬영된 영상을 경사 조명시의 기준 영상과 비교하여, 일치하지 않으면 불량 칩 LED로 판정하여 불량 칩LED 맵 파일에 위치 정보를 전달하는 제어 장치를 포함하는 것을 특징으로 하는 불량 칩LED 검사장치.By controlling the vertical illumination to be turned on, the image taken when the vertical illumination is turned on is compared with the reference image at the time of vertical illumination, and if it does not match, it is determined as a bad chip LED, and the location information is transmitted to the bad chip LED map file. The control unit is configured to turn off the vertical light and turn on the inclined light so that the image taken when the inclined light is turned on is compared with the reference image for the inclined light. Defective chip LED inspection device comprising a control device for transmitting position information. 불량 칩LED 검사장치에 있어서,In the bad chip LED inspection device, 칩LED용 웨이퍼에 수직 조명을 인가하는 수직 조명 장치;Vertical illumination device for applying vertical illumination to the wafer for chip LED; 칩LED용 웨이퍼에 경사 조명을 인가하는 경사 조명 장치;A tilt lighting device for applying tilt lighting to the wafer for chip LEDs; 상기 수직 조명을 온시키도록 제어하여 수직 조명이 온되었을 때에 촬영된 영상을 수직조명시의 기준 영상과 비교하여, 일치하지 않으면 불량 칩LED로 판정하여 불량 칩LED맵 파일에 그 위치 정보를 전달하며, 상기 수직조명을 오프시키고 경사조명을 온시키도록 제어하여 경사조명이 온되었을 때에 촬영된 영상을 경사 조명시의 기준 영상과 비교하여, 일치하지 않으면 불량 칩 LED로 판정하여 불량 칩LED 맵 파일에 위치 정보를 전달하는 제어 장치;By controlling the vertical illumination to be turned on, the image taken when the vertical illumination is turned on is compared with the reference image at the time of vertical illumination. The control unit is configured to turn off the vertical light and turn on the inclined light so that the image taken when the inclined light is turned on is compared with the reference image for the inclined light. A control device for transmitting location information; 상기 칩LED용 웨이퍼의 특정 프레임을 검사하기 위하여, 상기 제어장치에 의해 제어되어, 이 특정 프레임이 상기 검사장치 바로 아래에 놓이도록 구동하는 구동장치를 포함하는 것을 특징으로 하는 불량 칩LED 검사장치.And a driving device controlled by the controller for driving the specific frame of the wafer for chip LEDs, the driving device driving the specific frame to be directly under the inspection device. 삭제delete
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KR101168316B1 (en) 2009-12-01 2012-07-25 삼성전자주식회사 Apparatus for inspecting light emitting diode
KR101204345B1 (en) * 2010-10-19 2012-11-23 (주)아이엠에스나노텍 Apparatus for inspecting chip led surface
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KR20000007250A (en) * 1998-07-01 2000-02-07 윤종용 Apparatus and method for testing a cream solder on a printed circuit board
JP2002221496A (en) * 2001-01-25 2002-08-09 Dainippon Printing Co Ltd Instrument for inspecting diffraction pattern of light

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101168316B1 (en) 2009-12-01 2012-07-25 삼성전자주식회사 Apparatus for inspecting light emitting diode
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