KR100784903B1 - Ultrasonic cleaning system - Google Patents

Abstract

The present invention relates to an improvement of an ultrasonic cleaning device used in a semiconductor manufacturing process or a flat panel display (FPD) manufacturing process. The durability of the device is improved by preventing overheating by ultrasonic vibration, and the installation of a mist exhaust system is improved. It can be omitted and the ultrasonic output (negative pressure) can be irradiated uniformly on the whole surface of the object to be cleaned, the volume of the device can be light and small, and it can operate economically by reducing the amount of power or cleaning liquid used. It relates to an ultrasonic cleaning device that can be.

An ultrasonic cleaning apparatus according to the present invention includes: an ultrasonic cleaning apparatus for removing surface contamination of a substance to be cleaned by a combination of cleaning liquids and ultrasonic waves, comprising: linear transfer means for moving the substance to be cleaned; Cleaning liquid supply means for injecting and supplying the cleaning liquid to the surface of the object to be transported by the linear transfer means to form a cleaning liquid film on the surface of the object to be cleaned; And a body in which both side curves of the cross-sectional contour of the ultrasonic concentrator in contact with the cleaning liquid film on the surface of the object to be cleaned are in the form of an exponential curve or a suspension line, and a plurality of lines are arranged in a line within the body, and an insulating gap is formed between the adjacent surfaces of the object to be cleaned. A triangular shape formed obliquely to the direction of movement or "

" Ultrasonic cleaning vibrating body made of ultrasonic vibration element of the shape; characterized in that comprises a.

Ultrasonic Cleaning, Ultrasonic Concentration, Uniform Sound Pressure, Cooling, Plate, Vibration Element

Description

Ultrasonic cleaning system

Figure 1a is a plan view of the ultrasonic cleaning vibrating body according to an embodiment of the present invention.

Figure 1b is a plan view of the ultrasonic cleaning vibrating body according to another embodiment of the present invention.

Figure 2 is a side model view of the ultrasonic cleaning vibrating body shown in FIG.

Figure 3 is a side view of the ultrasonic cleaning vibrating body according to another embodiment of the present invention.

Figure 4 is a model of the ultrasonic cleaning apparatus according to an embodiment of the present invention.

Figure 5 is a model of the ultrasonic cleaning apparatus according to another embodiment of the present invention.

Figure 6 is a model of the ultrasonic cleaning vibrating body implemented by a large single ultrasonic vibration device.

Figure 7 is a model of the ultrasonic cleaning vibrating body according to the prior art implemented by a series arrangement of a plurality of ultrasonic vibration elements.

8 is a graph showing a non-uniform sound pressure distribution of the ultrasonic cleaning body of FIG.

9 is a model diagram of an ultrasonic cleaning vibrating body according to the prior art in which a plurality of ultrasonic vibration elements are arranged in two or more rows.

10 is a schematic view of a megasonic cleaning device according to the prior art.

[Description of Drawing Reference]

110... Ultrasonic vibrating member 111... Ultrasonic vibration device

112... Insulation interval 113. Body

114... Ultrasonic concentrator 115. Cooling hole

116... Home 121... Cleaning liquid supply means

122... Cleaning liquid 130... Ultrasonic Oscillator

131... Lead wire 200... Cleansed body

210... Straight line feeding means 220... Rotating support means

The present invention relates to an improvement of the structure of an ultrasonic cleaning device, and more particularly, to prevent overheating caused by ultrasonic vibration of an ultrasonic cleaning device used in a semiconductor manufacturing process or a flat panel display (FPD) manufacturing process. It is possible to improve the durability of the device, (ii) to operate economically by reducing the amount of power and cleaning liquid used, and (i) to install mist exhaust facilities to discharge the mist of cleaning liquid mist generated in the ultrasonic cleaning process. The present invention relates to an ultrasonic cleaning apparatus which can omit (i) uniformly irradiate ultrasonic power to the entire surface of a plate-like object to be cleaned and (i) make the volume of the device light and small.

The cleaning process for removing impurities in the semiconductor manufacturing process or the LCD (LCD) panel manufacturing process accounts for 30% or more. In the case of semiconductors, starting from 0.18㎛ in 1999, the 0.13㎛ era began in earnest in 2002, and the circuit width is becoming smaller than expected at 0.09㎛ (90 nanometers), and the influence of dust and impurities is increasing.

For example, if the circuit line width is 0.18㎛, the dust size is allowed up to 0.09㎛, but if the circuit line width reaches 0.09㎛, the dust size should be adjusted to 0.05㎛ (50 nano) or less. If the cleaning technology is not supported, the microcircuit process itself becomes obsolete.

Dust and contaminant marks can make all display substrates defective, and cleaning technology is becoming increasingly important in the manufacturing of advanced display panels such as organic EL.

Therefore, in order to efficiently remove contaminants remaining on the substrate as described above, cleaning apparatuses of various configurations have been conventionally used. In particular, in the case of cleaning by irradiating with ultrasonic waves in the cleaning step, the ultrasonic cleaning device is typically used because the cleaning can be performed more efficiently.

Prior art

10 is a model diagram showing an example of an ultrasonic cleaning apparatus used for cleaning a large flat plate (substrate, panel) having a width of several hundred mm or more. (JP-A-2002-233837, Applicant: Honda Electronics Co., Ltd.)

As shown in the drawing, the ultrasonic cleaning vibrator 110 of the cleaning device is bonded to the ultrasonic vibration element 111 on the upper surface of the vibration member facing the substrate, and the oscillation output of the ultrasonic oscillator to the ultrasonic vibration element. The lead wires 131 to be applied are electrically connected, and the cleaning liquid supply means 121 is provided at both sides of the vibrating member.

Therefore, when the cleaning liquid is supplied to the microgap between the vibrating member and the substrate through the cleaning liquid supplying means, a cleaning liquid film is formed between the lower surface of the vibrating member and the substrate by the surface tension. In this state, when the oscillation output is applied to the ultrasonic vibrating element, ultrasonic waves are irradiated onto the substrate surface through the vibrating member and the cleaning liquid film to perform cleaning.

However, since the ultrasonic cleaning device does not have a cooling means for preventing overheating of the vibrating member by ultrasonic vibration, high heat is transmitted to each part connected to the vibrating member, thereby reducing the durability of the apparatus. In addition, since the mist generated when the overheated vibrating member is brought into contact with the cleaning liquid film by ultrasonic vibration must be exhausted, installation of exhaust means and energy use are required.

On the other hand, when the object to be cleaned is a large flat plate, it is necessary to use, for example, a large long ultrasonic vibration device as shown in FIG. 6 as the vibration device of the ultrasonic cleaning device 110.

This is because the ultrasonic vibration element must cover the entire width direction of the object to be cleaned 200.

However, since the ultrasonic vibration element 111 is usually made of ceramic and manufactured by sintering, it is difficult to produce a stable dimension when it is large, and is not only susceptible to local deformation due to heating or the like, but also to the surface of the ultrasonic vibration element. The problem of nonuniform ultrasonic power generation occurs.

Therefore, instead of using a large, long ultrasonic vibrating element, conventionally, a plurality of ultrasonic vibrating elements 111 are arranged side by side in series in correspondence with the width direction size of the object to be cleaned 200 as shown in FIG. 7. In the case of arranging a plurality of ultrasonic vibrating elements, in order to correct the unevenness of the ultrasonic output between the ultrasonic vibrating elements and to prevent the interference effect of the ultrasonic waves generated from each ultrasonic vibrating element affecting other adjacent ultrasonic vibrating elements. Arranged at an interval of insulation 112 of a predetermined interval.

This spacing varies depending on the type or size of the ultrasonic vibration device.

As an example, the Ｗ-357LS-380 (Honda Electronics Co., Ltd.), which has a diaphragm of 200 mm x 15 mm, is known to have a minimum gap of 0.2 mm, and is larger than the minimum insulation gap to effectively avoid interference. It is desirable to secure a gap.

However, due to the existence of such an insulating gap, there is a problem that the ultrasonic output in the surface of the ultrasonic vibration element is lowered in the portion without the vibration element as shown in FIG.

In Korean Patent No. 10-414540, in order to solve the problem that cleaning is not efficient due to unevenness of sound pressure output, a plurality of ultrasonic vibrating elements are arranged in two or more rows, and ultrasonic vibrating elements 111 of different rows are arranged. An ultrasonic cleaning vibrator having an ultrasonic cleaning vibrator 110 having overlapping regions in parallel with each other in the rows is disclosed. Therefore, according to the apparatus as shown in FIG. 9, even if the cleaning is insufficient due to the decrease of the ultrasonic power output in the portion without the ultrasonic vibration element in the first row, the ultrasonic vibration element is superimposed on the same portion in the second row, so that the cleaning can be performed efficiently. Can be.

However, since the ultrasonic cleaning apparatus basically requires two or more rows of ultrasonic cleaning vibrators, there is a fundamental structural problem in that the power and the amount of the cleaning liquid used to drive the ultrasonic cleaning apparatus are large, as well as the size of the apparatus must be increased. In addition, since the ultrasonic wave output is only half of the area A where the ultrasonic vibration device is not overlapped, it is difficult to expect a uniform cleaning effect.

The present invention has been made to improve the problem of the conventional ultrasonic cleaning device, while maintaining the ultrasonic power output of the ultrasonic cleaning device to maintain a constant ultrasonic volume, the ultrasonic cleaning device can be economically driven by reducing the volume of the ultrasonic cleaning device, the amount of power and cleaning solution used The purpose is to provide a device.

Further, another object of the present invention is to provide an ultrasonic cleaning apparatus which can prevent insufficient cleaning and damage to the pattern of the object to be cleaned.

In addition, another object of the present invention is to provide an ultrasonic cleaning apparatus capable of preventing the durability of the ultrasonic cleaning apparatus from being lowered due to overheating by absorbing and removing heat generated during ultrasonic vibration with a cooling fluid such as water. have.

" 모양의 초음파 진동소자로 이루어진 초음파 세정용 진동체 ; 를 포함하여 구성된 것을 특징으로 한다. (청구항 1)The ultrasonic cleaning apparatus of the present invention can achieve the above technical problem, the ultrasonic cleaning apparatus for removing the surface contamination of the object to be cleaned by the combined use of the cleaning liquid and ultrasonic wave, the linear transfer means for moving the object to be cleaned; Cleaning liquid supply means for injecting and supplying the cleaning liquid to the surface of the object to be transported by the linear transfer means to form a cleaning liquid film on the surface of the object to be cleaned; And a body in which both side curves of the cross-sectional contour of the lower ultrasonic concentrator in contact with the cleaning liquid film on the surface of the object to be cleaned are of an exponential curve type or a cathodic curve type, and a plurality of lines are arranged in a line in the body. In which the insulating gap formed between the adjacent surfaces is diagonally formed with respect to the moving direction of the object to be cleaned or "

Ultrasonic cleaning vibrating body consisting of a ultrasonic vibration device of the shape; characterized in that it comprises a configuration. (Claim 1)

" 모양의 초음파 진동소자로 이루어진 초음파 세정용 진동체 ; 를 포함하여 구성된 것을 특징으로 한다. (청구항 2)According to another aspect of the present invention, an ultrasonic cleaning apparatus includes: an ultrasonic cleaning apparatus for removing surface contamination of a body to be cleaned by a combination of cleaning liquids and ultrasonic waves, comprising: rotation support means for rotating the body to be cleaned; Cleaning liquid supplying means for injecting and supplying a cleaning liquid to the surface of the object to be rotated while being mounted on the rotation supporting means to form a cleaning liquid film on the surface of the object to be cleaned; And a body having both curves in the cross-sectional contour of the lower-side ultrasonic concentrator in contact with the cleaning liquid film on the surface of the object to be exponentially curved or in the form of a suspension line, and a plurality of insulating lines arranged in a line between the adjacent surfaces. A triangular shape formed obliquely to the direction of movement of the object or "

Ultrasonic cleaning vibrating body consisting of "ultrasonic ultrasonic vibration device of the shape; characterized in that it comprises a. (Claim 2)

Preferably, a cooling hole for preventing overheating is additionally formed in the body (claim 3), or a groove is formed in the inner bottom of the body in which the ultrasonic vibration device is installed to block the lateral progression of the ultrasonic wave. (Claim 4)

Hereinafter, with reference to the accompanying drawings, the configuration and operation of the ultrasonic measuring apparatus according to each embodiment of the present invention will be described.

Example 1

1A and 1B and FIG. 2 are planar model views and side model views of an ultrasonic cleaning vibrating body according to an example of the present invention, and FIG. 4 is a schematic view of the ultrasonic cleaning device according to an embodiment of the present invention.

" 모양의 초음파 진동소자(111)가 복수 개 연결되어 있으며, 상기 초음파 세정용 진동체가 소정간격 이상 이동할 시, 상기 초음파 진동소자의 표면과 피세정체(200)의 표면이 모두 대면(對面)되도록 배치되어 있다. 더욱 구체적으로, 본 실시예의 초음파 세정용 진동체는 인접면이 진동체의 상대적 이동방향에 대해 사선(斜線)으로 형성된 복수 개의 초음파 진동소자가 일정한 절연간격(112)을 두고 상기 진동체의 몸체 내에 일렬로 배치되어 있다.As shown in Figures 1a and 1b, the ultrasonic cleaning vibrating body 110 of the present embodiment has a triangular shape or "

"Is connected to a plurality of ultrasonic vibrating element 111 of the shape, when the ultrasonic cleaning vibrating body moves more than a predetermined interval, the surface of the ultrasonic vibrating element and the surface of the object to be cleaned 200 are disposed so as to face. More specifically, in the ultrasonic cleaning vibrating body of the present embodiment, the vibrating body has a plurality of ultrasonic vibrating elements formed in a diagonal line with respect to the relative moving direction of the vibrating body with a constant insulation interval 112. It is arranged in a line in the body of the.

In particular, in the case of FIG. 1B, the diagonal insulating gap 112 formed between the ultrasonic vibration elements and the horizontal insulating gap 112 are arranged to have the same length d. Here, the height, thickness, and length of the ultrasonic vibration device shown in Figure 1b can be arbitrarily determined, and the length of the interval of the insulation interval formed in the horizontal direction can be shortened or lengthened.

Therefore, according to the ultrasonic cleaning vibrating body 110 of the present embodiment in which the shape and arrangement of the ultrasonic vibration element 111 are as described above, there is a problem related to the unevenness of the ultrasonic output (sound pressure) as shown in FIG. Can be eliminated.

In addition, as shown in Figures 1a, 1b and 2, in the ultrasonic cleaning vibrating body of the present embodiment, the cooling holes 115 are formed inside both sides of the body 113 in which a plurality of ultrasonic vibration elements 111 are arranged in a line. It is. Therefore, when electric power is supplied through the lead wire 131 electrically connected to the ultrasonic vibration element 111, and a cooling fluid such as water flows in and out of the cooling hole 115, heat generated by the ultrasonic vibration is cooled through the body. Since it is absorbed into, it is possible to prevent the ultrasonic cleaning vibrating body from overheating.

In addition, in the ultrasonic cleaning vibrating body of the present embodiment, the ultrasonic concentrating portion 114 is formed in the form of an exponential curve or a suspension curve on both sides of the cross-sectional contour on the lower side of the body 113. Therefore, even when the ultrasonic power is intentionally reduced by reducing the amount of power applied to the ultrasonic vibration device, the intensity of ultrasonic waves incident on the cleaning liquid film on the surface of the object to be cleaned through the ultrasonic concentrator is high, thus reducing the power consumption and cleaning the surface. The effect was also better.

The ultrasonic cleaning apparatus of this embodiment shown in FIG. 4 forms a cleaning liquid film on the surface of the object by spraying and supplying the linear transfer means 210 for moving the object to be cleaned 200 and the cleaning liquid 122 on the surface of the object to be cleaned. The cleaning liquid supply means 121 and the ultrasonic cleaning vibrating body 110 is configured to include, in particular, in the case of the ultrasonic cleaning vibrating body so as to always be in contact with the cleaning liquid film formed on the surface of the object to be cleaned. For example, they were installed at intervals of about 3 mm. Therefore, when the output of the ultrasonic oscillator 130 is applied to the ultrasonic vibration element through the lead wire 131, the ultrasonic wave is irradiated to the cleaning liquid film on the surface of the object to be cleaned by the ultrasonic concentrator formed on the lower part of the body.

On the other hand, the temperature of the ultrasonic cleaning vibrating body is increased by the ultrasonic vibration which is continued during the cleaning operation, but the cooling fluid in the cooling hole formed in the body absorbs the heat, thereby preventing overheating.

Example 2

Attached Figure 3 is a side view of the ultrasonic cleaning vibrating body according to another embodiment of the present invention.

As shown in the figure, a groove 116 is further formed on the inner bottom of the body 113 in which the ultrasonic vibration element 111 is built, to block the lateral movement of the ultrasonic waves.

The groove 116 is formed on the bottom surface along a circumference of the plurality of ultrasonic vibration elements arranged in a line, and the ultrasonic wave is blocked by the groove so that the ultrasonic waves are concentrated toward the object to be cleaned. Will be generated.

Example 3

5 is a view illustrating an ultrasonic cleaning apparatus according to another embodiment of the present invention, which shows a case particularly suitable for cleaning a wafer.

As shown in the figure, the ultrasonic cleaning apparatus of the present embodiment to remove the surface contamination of the object to be cleaned by the combined use of the cleaning liquid and the ultrasonic wave and the rotary support means 220 to rotate in the state supporting the object to be cleaned 200, It comprises a cleaning liquid supply means 121 for supplying the cleaning liquid 122 to the surface of the stagnation and the ultrasonic cleaning vibrating body 110 according to the present invention for irradiating ultrasonic waves to the surface of the object to be cleaned through the cleaning liquid.

Here, since the ultrasonic cleaning apparatus of this embodiment is very similar to that disclosed in Example 1 except that the object to be cleaned rotates in place, a detailed description of the operation / effect is omitted.

Other Example

The ultrasonic cleaning vibrating body mentioned in each of the above-described embodiments can be used as a component of the body 113, A60660-T6, STS (stainless steel), quartz (Quartz), etc., and the piezoelectric ceramics as the ultrasonic vibration element 111. Ordinary piezoelectric elements made of materials can be used.

In addition, although both gases and liquids may be used as the cooling fluid, it is preferable to use water in terms of heat transfer properties and economics.

In addition, the cooling hole 115 may be penetrated and installed in the longitudinal direction (longer direction) of the body or penetrated and installed in the width direction (shorter direction) of the body, and the circulation of the normal structure (piping) in the cooling hole. The cooling fluid can be continuously circulated by connecting the system.

In addition, a water jacket type overheat prevention means in contact with the outer surface of the ultrasonic cleaning vibrating body instead of the cooling hole or installed at an interval of, for example, about 1 cm from the outer surface to remove heat by radiation or convection. You may.

According to the present invention constituted as described above, the heat generated by the ultrasonic vibration is absorbed by the cooling fluid flowing in and out of the cooling hole, it is possible to prevent overheating of the ultrasonic cleaning vibrating body. Therefore, since the cleaning liquid film can be prevented from changing into mist due to heat, the installation of the mist exhaust means can be omitted, and the number of operations can be reduced even when the exhaust means is provided.

In addition, the surface of the to-be-cleaned body facing the ultrasonic cleaning vibrator can be prevented from being damaged by heat, and deterioration of other components adjacent to the ultrasonic cleaning vibrator can be prevented. As a result, the durability of the ultrasonic cleaning device is improved.

In addition, since the ultrasonic concentrator is formed in the lower part of the body, a sufficiently strong ultrasonic output can be obtained even using a low-power ultrasonic oscillator. In particular, when the groove is formed on the inner bottom of the body in which the ultrasonic vibration device is embedded, the concentration of the ultrasonic waves can be induced more effectively.

In addition, since the ultrasonic wave is irradiated in a state where the ultrasonic concentrator formed in the lower part of the body of the ultrasonic cleaning vibrator is always in contact with the cleaning liquid membrane, the sound pressure may be kept constant. Therefore, the damage of the pattern of the to-be-cleaned object which occurred due to the uneven distribution of sound pressure can be prevented.

In addition, the ultrasonic cleaning vibrating body of the present invention can be evenly distributed even while the ultrasonic vibrating elements are arranged in a row, so the ultrasonic cleaning device implemented by the ultrasonic cleaning vibrating body is ultrasonic cleaning with only one vibrating body. Not only can it be effectively implemented and implemented in a simpler structure, but it can also be operated very economically.

Claims (4)

In the ultrasonic cleaning apparatus for removing the surface contamination of the object to be cleaned by using a combination of the cleaning liquid and ultrasonic wave, Linear transfer means for moving the object to be cleaned; Cleaning liquid supply means for injecting and supplying a cleaning liquid to the surface of the object to be carried by the linear transfer means to form a cleaning liquid film on the surface of the object to be cleaned; And Both sides of the cross-sectional contour of the cross-sectional contour of the lower ultrasonic concentrator contacting the cleaning liquid film on the surface of the object to be cleaned are in the form of an exponential curve or a suspension line, and a plurality of lines are arranged in a line within the body, and an insulating gap is formed between the adjacent surfaces. Triangular shape formed diagonally with respect to the stagnation direction or "

Ultrasonic cleaning vibrating body consisting of an ultrasonic vibration device of the shape; Ultrasonic cleaning apparatus comprising a. In the ultrasonic cleaning apparatus for removing the surface contamination of the object to be cleaned by using a combination of the cleaning liquid and ultrasonic wave, Rotation support means for rotating the object to be cleaned; Cleaning liquid supply means for injecting and supplying a cleaning liquid to the surface of the object to be rotated while being mounted on the rotation supporting means to form a cleaning liquid film on the surface of the object to be cleaned; Both sides of the cross-sectional contour of the cross-sectional contour of the lower ultrasonic concentrator contacting the cleaning liquid film on the surface of the object to be cleaned are in the form of an exponential curve or a suspension line, and a plurality of lines are arranged in a line within the body, and an insulating gap is formed between the adjacent surfaces. Triangular shape formed diagonally with respect to the stagnation direction or "

Ultrasonic cleaning vibrating body consisting of an ultrasonic vibration device of the shape; Ultrasonic cleaning apparatus comprising a. The method according to claim 1 or 2, Within the body, Ultrasonic cleaning apparatus, characterized in that the cooling hole for preventing overheat is further formed. The method of claim 3, On the inner bottom of the body, the ultrasonic vibration device is installed, Ultrasonic cleaning apparatus, characterized in that the groove is further formed to block the progress of the ultrasonic waves.

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