KR100783471B1 - Silicone-based adhesive composition, method for surface treatment of substrate and method for forming fine patterns using the same - Google Patents

Abstract

A silicone-based adhesive composition, a method for treating the surface of a substrate by using the composition for forming a circuit wiring, a method forming a micropattern by using the surface-treated substrate, and a circuit board containing the micropattern are provided to improve the adhesion of wiring and the spreading of an ink and to lower the surface energy of a substrate. A silicone-based adhesive composition comprises 55-65 parts by weight of a vinyl polysiloxane-based silicone polymer; 30-45 parts by weight of a polydimethyl siloxane-based silicone adhesive; 4-8 parts by weight of a hydrogen polysiloxane-based resin; and 0.1-2 parts by weight of a platinum catalyst. Preferably the vinyl polysiloxane-based silicone polymer is represented by the formula 1 (wherein n is an integer of 100-1,000); and the polydimethyl siloxane-based silicone adhesive is represented by the formula 2 (wherein n is an integer of 5,000-140,000).

Description

Silicon-based adhesive composition, method for surface treatment of substrate and method for forming fine patterns using the same}

1 is a wiring photograph formed in the case where the surface treatment is not performed (a) and the surface treatment using the silicone pressure-sensitive adhesive composition prepared in Example 1 of the present invention (b),

FIG. 2 shows a case where surface treatment is performed using the silicone pressure-sensitive adhesive composition prepared in Example 1 of the present invention (a) and the surface treatment with a fluoroalkyl compound (b) and the surface treatment with the fluoroalkyl compound (c). It is a photograph of the contact angle of the ink droplets on the substrate.

The present invention relates to a silicone pressure-sensitive adhesive composition, a surface treatment method of the substrate and a method of forming a fine pattern using the same, and more particularly, to improve adhesion to the substrate and suppress the spreading of the ink on the substrate when forming the pattern by the inkjet method It relates to a silicone pressure-sensitive adhesive composition for the surface treatment, and a surface treatment method and a method of forming a fine pattern using the same.

Conventionally, the corrosion resist method has been used as a method for forming wirings on a substrate, but it is difficult to form fine wirings in this method, and there is a process inconvenience in that the resist must be removed. Another method for forming fine wirings is a laser method. The laser method is a method of forming a conductive wiring by forming a water-repellent processed film on the entire substrate, then removing a part of the water-repellent processed film by laser light, and spraying conductive ink on a region where the processed film is removed. According to this method, since the provision of the laser light generating device is required separately, the manufacturing cost is increased, and the process of introducing and removing the water-repellent processed film which does not directly constitute the wiring has to go through, which is cumbersome and inefficient.

Recently, due to the advantages of simplicity, low cost, possibility of mass production, and environmental friendliness, many studies have been conducted to apply an inkjet method that can easily print an arbitrary pattern in a non-contact manner to form a circuit of an electronic component. In such an inkjet method, the droplet size control of the ejected ink and the ink spreadability on the substrate serve as important factors for implementing a fine pattern. Since it is very difficult to reduce ink droplets here, it is important to control the spreadability of the droplets.

In general, the surface treatment is a method of modifying the chemical and physical properties of the surface to control the spreading and wettability of the discharged droplets. Korean Laid-Open Patent Publication No. 2004-88507 discloses a method for surface treatment by generating an excitation type including plasma generated by corona discharge. This improves the adhesive force by applying a coating or printing to resins such as polyethylene, polypropylene, PTFE and the like to increase the hydrophilicity of the surface. However, when the surface is modified to be hydrophilic, there is a problem in that it is not suitable for the surface treatment application for ink jet, which has to maintain a constant contact angle of the droplets since the spreadability with the substrate is improved.

In addition, Korean Patent Laid-Open Publication No. 1997-12021 discloses a pattern forming method and a surface treatment agent to prevent a poorly soluble layer from being formed on the surface portion of a resist pattern. The surface treatment method used here is to supply isopropenoxy trimethylsilane as surface iron to the surface of a semiconductor substrate made of silicon to change the surface of the semiconductor substrate to hydrophobicity. However, this method has the advantage of improving the adhesion of the semiconductor substrate, but there is a problem that can not secure the interfacial adhesion with a polymer substrate such as polyimide and can not be used for surface treatment for inkjet.

On the other hand, in the inkjet method, there is a method of suppressing the spreadability of ink by surface treatment using a surfactant such as a fluoroalkyl compound in order to reduce the wiring width. However, such a method is useful for suppressing the spreadability of the ink to some extent, but there is a problem in that the adhesion of the ink to the substrate is poor, making it difficult to apply to forming the line width for the fine pattern.

The present invention is to solve the above-described problems of the prior art, one object of the present invention is to improve the adhesion to the substrate when forming the ink-jet printed wiring and to improve the adhesiveness for surface treatment silicone-based pressure-sensitive adhesive composition To provide.

Another object of the present invention to provide a surface treatment method of the substrate using the silicone pressure-sensitive adhesive composition.

Still another object of the present invention is to provide a method of forming a fine pattern using the same.

In one aspect of the invention,

55 to 65 parts by weight of a vinyl polysiloxane-based silicone polymer;

30 to 45 parts by weight of a polydimethylsiloxane (PDMS) -based silicone adhesive;

4 to 8 parts by weight of hydropolysiloxane-based resin; And

0.1 to 2 parts by weight of a platinum catalyst;

It provides a silicon-based pressure-sensitive adhesive composition for surface treatment for forming a printed wiring.

The vinyl polysiloxane-based silicone polymer may be represented by the following Chemical Formula 1.

[Formula 1]

In said formula, n is an integer of 100-1000.

The PDMS-based silicone adhesive may be represented by the following formula (2).

[Formula 2]

In said formula, R is a methyl group or an ethyl group, n is an integer of 5000-140000.

In addition, the hydropolysiloxane-based resin may be represented by the following formula (3).

[Formula 3]

In said formula, n is an integer of 300-1600.

According to one embodiment of the invention, the composition may further comprise a surfactant. Such a surfactant is at least one selected from the group consisting of alkylbenzene sulfonates, amine halides, quaternary ammonium salts, alkylpyridinium salts and amino acids, and the content of the surfactant is preferably 0 to 5 parts by weight.

According to one embodiment of the invention, the composition may further comprise a siloxane oligomer. The content of the siloxane oligomer is preferably 0 to 5 parts by weight.

In another aspect of the invention,

Preparing a polymer substrate;

Coating at least one surface of the polymer substrate with a coating solution containing the silicone pressure sensitive adhesive composition; And

Heat treating the substrate;

It provides a surface treatment method of a substrate for forming a printed wiring comprising a.

The polymer substrate may be made of a polymer material of polyimide or polyethylene terephthalate.

When the coating film is formed, an aromatic hydrocarbon solvent such as xylene, toluene, pyridine, quinoline, anisole, and mesitylene, or an aliphatic hydrocarbon solvent such as hexane and heptane is mixed with the silicone pressure sensitive adhesive composition to reduce the viscosity. It is more preferable to form a coating film.

The coating method may be performed by one method selected from the group consisting of spin coating, knife coating, gravure roll coating and casting.

According to one embodiment of the invention, the silicone pressure-sensitive adhesive composition is preferably coated on a substrate with a thickness of 0.1 to 50㎛.

In addition, the heat treatment step is preferably performed for 1 to 5 minutes at 100 to 150 ℃.

In another aspect of the present invention, forming a wiring using a metal ink containing conductive particles on the surface treated by the above method; And heat treating the substrate.

According to one embodiment of the invention, the conductive particles are silver (Ag), copper (Cu), gold (Au), platinum (Pt), nickel (Ni), palladium (Pd), iron (Fe) and their At least one metal nanoparticle selected from the group consisting of alloys.

In addition, the wiring is formed by discharging the metal ink by an inkjet method, and it is more preferable to increase the temperature by applying heat to the substrate when forming the wiring. The wiring width of the wiring that can be formed in this manner is 10 to 80 µm.

The heat treatment is preferably performed for 20 to 120 minutes at a temperature of 200 to 300 ℃.

In this way, a fine pattern can be formed on the circuit board.

Hereinafter, the silicone pressure-sensitive adhesive composition according to the present invention, the surface treatment method of the substrate and the method of forming a fine pattern using the same will be described in more detail.

Factors affecting the spreadability of the ink in the pattern formation process using the inkjet method include the properties of the ink, the size and concentration of the metal particles contained in the ink, the size of the nozzle, the size or surface tension of the ejected droplets, and the surface energy of the substrate. Or a surface treatment state. At this time, assuming that the size of the ejected droplets is constant, the spreadability of the ink is determined by the mechanical relationship between the surface tension of the ink and the surface energy of the substrate. For example, if the surface tension of the ink is greater than the surface energy of the substrate, the spreadability of the ink will be small. On the contrary, if the surface tension of the ink is less than the surface energy of the substrate, the spreadability of the ink will be large. Therefore, assuming that the ink droplets have the same size and surface tension as the ink, the surface energy of the substrate can be lowered to improve the spreadability of the ink. Such spreadability of the ink can be evaluated by measuring the contact angle of the droplets ejected onto the substrate surface and the wiring width of the printed wiring.

Accordingly, the present invention is to improve the adhesion of the droplets to the substrate by optimizing its composition to have a sticky property based on the silicon component that can form a siloxane bond with the substrate and adhesion to the substrate.

Silicone pressure-sensitive adhesive composition according to the present invention is 55 to 65 parts by weight of vinyl polysiloxane-based silicone polymer; 30 to 45 parts by weight of a polydimethylsiloxane (PDMS) -based silicone adhesive; 4 to 8 parts by weight of hydropolysiloxane-based resin; And 0.1 to 2 parts by weight of a platinum catalyst.

Here, the vinyl polysiloxane-based silicone polymer may be represented by the following formula (1).

[Formula 1]

In said formula, n is an integer of 100-1000.

The vinyl polysiloxane-based silicone polymer acts as a main chain when a crosslinking reaction occurs through a heat treatment process during surface treatment of a substrate. The content of the vinyl polysiloxane-based silicone polymer is preferably 55 to 65 parts by weight, more preferably 58 to 62 parts by weight. If the content is less than 55 parts by weight, cross-linking network formation is loose and the spreadability of the droplets is large during wiring formation, and it is not preferable. If the content is more than 65 parts by weight, the adhesion to the substrate is not preferable.

In addition, the polydimethylsiloxane (PDMS, polydimethylsiloxane) -based silicone adhesive may be represented by the following formula (2).

[Formula 2]

In said formula, R is a methyl group or an ethyl group, n is an integer of 5000-140000.

Specific examples of the silicone gel compound include polydimethylsiloxane (PDMS, polydimethylsiloxane), polydimethyldiphenylsiloxane and the like. The polydimethylsiloxane (PDMS, polydimethylsiloxane) -based silicone adhesive has a lower surface tension as the surface tension is 20 ~ 23mN / m, but when used alone has a disadvantage of weak chemical resistance. When the surface tension is low, the contact angle with the ink wiring is increased to control the spreadability, and it has a higher thickness when discharging the same amount of ink, which is advantageous for forming micro wirings according to the miniaturization of electronic products. In addition, since the adhesive has a tack, the adhesive force to the wiring and the adhesive force to the substrate can be improved. The content of the PDMS-based silicone adhesive is preferably 30 to 45 parts by weight, more preferably 38 to 42 parts by weight. If the content is less than 30 parts by weight, the contact angle with the ink wiring is lowered to increase the spreadability, which is not preferable because it is difficult to form fine wiring. If the content is more than 45 parts by weight, the swelling becomes weak when the surface treatment part is formed. This is undesirable because of the phenomenon and the disconnection of wiring.

On the other hand, the hydropolysiloxane-based resin may be represented by the following formula (3).

[Formula 3]

In said formula, n is an integer of 300-1600.

The hydropolysiloxane-based resin is a resin having a short silicone polymer and containing excessive silica, thereby crosslinking the vinylpolysiloxane-based silicone polymer to increase surface hardness. The hydropolysiloxane-based resin is preferably 4 to 8 parts by weight, more preferably 5 to 7 parts by weight. If the content is less than 4 parts by weight, the amount of crosslinking is small and ink may penetrate between the polymers of the coating film after the surface treatment, thereby increasing the ink spreadability, which is not preferable. Is not preferable because of the increase in stickiness and the decrease in stickiness and problems in linearity.

In the silicone pressure-sensitive adhesive composition of the present invention, the platinum catalyst plays a role of controlling the crosslinking density and is preferably included in the range of 0.1 to 2 parts by weight. If the content is less than 0.1, the crosslinking reaction may not proceed smoothly. If the content is more than 2 parts by weight, the crosslinking reaction rate is too fast, which is not preferable because it is difficult to control the crosslinking density.

According to one embodiment of the invention, the composition may further comprise a surfactant to lower the surface tension. Surfactants that can be used include one or more selected from the group consisting of alkylbenzene sulfonates, amine halides, quaternary ammonium salts, alkylpyridinium salts and amino acids, but are not limited thereto. The amount of the surfactant is preferably 0 to 5 parts by weight. When the content of the surfactant exceeds 5 parts by weight, the adhesive strength with the wiring of the pressure-sensitive adhesive is lowered, which is not preferable.

According to one embodiment of the invention, the composition may further comprise a siloxane oligomer to control the adhesion by controlling the sticking of the coating film during the surface treatment. The content of the siloxane oligomer is preferably 0 to 5 parts by weight. If the content of the siloxane oligomer exceeds 5 parts by weight, the adhesion to the substrate is lowered, which is undesirable.

The silicone pressure-sensitive adhesive composition according to the present invention configured as described above has an advantage of having a hydrophobic surface and strong heat resistance due to the silicone component, and can secure a uniform adhesive force between the wiring and the substrate by using sticky physical properties. When surface-treating the substrate using the silicone pressure-sensitive adhesive composition of the present invention, a wiring width of 10 to 80 μm may be formed when wiring is formed using an inkjet technique. In one embodiment of the present invention it can be confirmed that the fine wiring of about 40㎛ is formed.

Next, another aspect of the present invention relates to a method for treating a surface of a substrate for forming printed wiring.

Surface treatment method of a substrate according to the invention, preparing a polymer substrate; Forming a coating film on at least one surface of the polymer substrate using the silicone pressure sensitive adhesive composition; And heat treating the substrate.

The polymer substrate used herein may be used without limitation as long as it can form a surface treatment film stably by forming a siloxane bond with the silicone pressure-sensitive adhesive composition. Specifically, it is preferable to use a substrate made of a polymer material of polyimide or polyethylene terephthalate among plastic substrates.

When the polymer substrate is prepared, a coating film is formed on at least one surface of the polymer substrate by using a coating solution containing the silicone pressure-sensitive adhesive composition.

Although the coating film may be formed by using the silicone pressure sensitive adhesive composition itself as a coating solution when forming the coating film, aromatic hydrocarbon solvents such as xylene, toluene, pyridine, quinoline, anisole, mesitylene, or hexane, in the silicone pressure sensitive adhesive composition It is more preferable to prepare a coating solution having a lower viscosity by mixing an aliphatic hydrocarbon solvent such as heptane and to form a coating film using the same. When preparing a coating solution, the silicone pressure-sensitive adhesive composition is preferably included in 70 to 99.9% by weight of the total coating solution, more preferably 90 to 99.9% by weight. If the content is less than 70% by weight of the droplet is not good spreadability, if the content is more than 99.9% by weight of the droplet (tolerance) may not be good.

The coating method may be performed by one method selected from the group consisting of spin coating, knife coating, gravure roll coating, and casting, but is not limited thereto. In terms of convenience, a preferred coating method is gravure roll coating. According to one embodiment of the present invention, in the case of gravure roll coating, the rotation speed of the roller is preferably 1 to 10 mm / s, and the substrate is preferably impregnated for 10 seconds to 1 minute in the coating solution.

According to one embodiment of the invention, the silicone pressure-sensitive adhesive composition is preferably coated on a substrate with a thickness of 0.1 to 50㎛. If the thickness is less than 0.1 µm, the adhesive force between the substrate and the wiring decreases due to a decrease in the tack value. If the thickness exceeds 50 µm, there is no problem in the formation of the wiring. I can't.

After the polymer substrate is coated with a coating solution, the coated substrate is subsequently heat treated.

Through the heat treatment step, a crosslinking reaction occurs between the silicon components in the coating solution, and also forms a bond with the reactor of the substrate to form a stable surface treatment film. The heat treatment step is preferably performed for 1 to 5 minutes at 100 to 150 ℃. If the heat treatment temperature is less than 100 ℃ cross-linking reaction does not occur, if it exceeds 150 ℃ may cause surface state modification. The heat treatment time is determined by the heat treatment temperature. At high temperatures, the reaction time is short, and at low temperatures, a longer reaction time is required. This heat treatment terminates the heat treatment process when the tack of the surface is kept constant.

Another aspect of the present invention relates to a method of forming a fine pattern using the surface treatment method of the substrate described above.

Method for forming a fine pattern according to the present invention comprises the steps of forming a wiring using a metal ink containing conductive particles on the surface treated by the above-described method; And heat treating the substrate.

The conductive particles may be selected from the group consisting of silver (Ag), copper (Cu), gold (Au), platinum (Pt), nickel (Ni), palladium (Pd), iron (Fe), and alloys thereof. It may be composed of one or more metal nanoparticles, the size of these metal nanoparticles is in the tendency to become smaller to form a microwire. In the present invention, the metal nanoparticles preferably have a size of 5 to 50 nm, more preferably 15 to 30 nm.

Metal inks including the conductive particles may be prepared by conventional methods in the art. Metal inks are divided into aqueous or non-aqueous, depending on the nature of the solvent to form them. The solvent of the aqueous ink is not limited thereto, and for example, diethylene glycol butyl ether acetate, an ethanol aqueous solution, ethylene glycol, and the like can be used. The solvent of the non-aqueous ink is not limited thereto, but specifically, for example, at least one selected from the group consisting of hexane, octane, tetradecane, hexadecane, 1-hexadecine, 1-octadecine, toluene, xylene, and chlorobenzoic acid. More choices are possible.

The method of forming the wiring using the metal ink includes screen printing, gravure printing, inkjet printing, and the like, and an inkjet printing method is preferable in order to form a double fine wiring. When the wiring is formed by discharging the metal ink by an inkjet method, fine wiring having a wiring width in a range of 10 to 80 μm may be formed. In one embodiment of the present invention it can be seen that the wire width of 40㎛ implemented.

The substrate on which the wiring is formed is subjected to a heat treatment step again to form a bond between the metal particles. When the wiring is formed by the inkjet method, the wiring may be performed by a heat treatment process that is usually performed. For example, the heat treatment may be performed at a temperature of 200 to 300 ° C. for 20 to 120 minutes. Such heat treatment is preferably performed under conditions that can impart excellent electrical conductivity to the wiring.

According to the present invention, it is possible to reduce the spreadability of the ink on the substrate and to form a fine line width without breakage and bulge, as compared with the conventional surface treatment method.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the following Examples are for illustrative purposes only and are not intended to limit the present invention.

<Example 1-2>

Each component was mixed according to the content of Table 1 below to prepare a silicone-based pressure-sensitive adhesive composition. The polyimide substrate having a thickness of 51 μm was coated by moving in a roller method at a rate of 3 mm / s to a treatment tank containing the coating solution. At this time, the substrate was impregnated in the coating solution within 15 seconds to move. The coated substrate was cured by drying at 100 ° C. for 2 to 5 minutes. A non-aqueous ink of tetradecane solvent containing about 20 nm of silver nanoparticles was discharged on the surface-treated substrate by using a nozzle having a diameter of 35 μm to form wiring. At this time, the surface tension of the non-aqueous ink was 28.8 dyne / cm. The formed wiring was heat-treated at 200 to 300 ° C. for 30 to 60 minutes to form a wiring pattern.

The breakage of the formed wiring, the bulge (bulge) and the wiring width were measured and the results are shown in Table 1 together.

<Comparative Example 1-3>

A wiring pattern was formed by performing the same process as in Example 1 except that each component was mixed according to the content of Table 1 below. The breakage of the formed wiring, the bulge (bulge) and the wiring width were measured and the results are shown in Table 1 together.

TABLE 1

Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Vinylsiloxane Silicone Polymer (Dow Corning) 60 60 - - 10 Polydimethylsiloxane (PDMS) -based silicone adhesive (Dow Corning) 40 40 20 20 - Hydrogen Polysiloxane Resin (Dow Corning) 7 6 1.5 80 10 Platinum Catalyst One 1.5 80 1.5 1.5 Siloxane oligomers (Dow Corning) - 0.5 One One 0.5 Line formation state ○ ○ △ × ×

* Property evaluation method

(Circle): There is no line break and a bulge, and wiring width is formed in about 40 micrometers.

(Triangle | delta): There exists a line break and a bulge, and wiring width is formed in about 40 micrometers.

X: There is a break and bulge of the line, and there is swelling.

As shown in Table 1, when the surface treatment with the silicone pressure-sensitive adhesive composition according to the present invention can be seen that it is advantageous to form a fine line width without breaking and bulging of the line.

Moreover, the wiring photograph formed in the case where surface treatment was not carried out (a) and the surface treatment using the silicone adhesive composition prepared in Example 1 (b) is shown in FIG. (a) The dark part in the picture is the board and the bright part is the wiring. (b) In the picture, the part with dark line and dark edge is wiring. When the surface treatment was not performed (a) the lines were not well formed due to the spreading of the ink and the wiring width was about 100 to 200 μm, whereas when the surface treatment was performed using the silicone pressure-sensitive adhesive composition (b) clean and high resolution A line was formed and showed a wiring width of 35 to 60 mu m.

On the other hand, in order to determine the contact angle results according to the surface treatment, the substrate (b) and the surface treated with a coating solution containing a substrate (a) and a fluoroalkyl compound (3M-novec) and not the surface treatment and Example 1 A non-aqueous ink of tetradecane solvent containing silver nanoparticles of about 20 nm was discharged onto each of the substrates (c) surface-treated using the silicone pressure-sensitive adhesive composition prepared by using a nozzle having a diameter of 35 μm. The contact angle of the ink droplets was measured according to ATSM D 724-99 (time elapsed after discharging: 5 seconds) using a dataphysics TBU 90B measuring device. The contact angle photograph of the ink droplet in each board | substrate (a)-(c) is shown in FIG. Each contact angle was 1.1 degrees when the surface treatment was not performed (a), 20.2 degrees when the surface treatment was performed with a fluoroalkyl compound (2) degrees, and 57.9 degrees when the surface treatment was performed with the silicone pressure-sensitive adhesive composition of the present invention (c). appear.

As described above, it can be seen that when the substrate is treated using the silicone pressure-sensitive adhesive composition according to the present invention, not only the adhesive force is good but also the spreadability of the ink is suppressed to form a fine wiring having high resolution.

The present invention is not limited to the above embodiments, and many variations are possible by those skilled in the art within the spirit of the present invention.

As described above, the silicone pressure-sensitive adhesive composition according to the present invention, the surface treatment method of the substrate and the method of forming the fine pattern using the same, not only improve the adhesion of the wiring, but also lower the surface energy of the substrate to improve the spreadability of the ink, thereby improving the quality of the fine particles. Patterns can be formed.

Claims (22)

55 to 65 parts by weight of a vinyl polysiloxane-based silicone polymer; 30 to 45 parts by weight of a polydimethylsiloxane (PDMS) -based silicone adhesive; 4 to 8 parts by weight of hydropolysiloxane-based resin; And 0.1 to 2 parts by weight of a platinum catalyst; A silicone-based pressure-sensitive adhesive composition for surface treatment for forming a printed wiring. The method of claim 1, The vinyl polysiloxane-based silicone polymer is a silicone pressure-sensitive adhesive composition represented by the following formula (1): [Formula 1]

In said formula, n is an integer of 100-1000. The method of claim 1, The polydimethylsiloxane (PDMS, polydimethylsiloxane) silicone adhesive is a silicone-based pressure-sensitive adhesive composition represented by the following formula (2): [Formula 2]

In said formula, R is a methyl group or an ethyl group, n is an integer of 5000-140000. The method of claim 1, The hydropolysiloxane-based resin is a silicone pressure-sensitive adhesive composition represented by the following formula (3): [Formula 3]

In said formula, n is an integer of 300-1600. The method of claim 1, The composition is a silicone-based pressure-sensitive adhesive composition further comprises a surfactant The method of claim 5, The surfactant is at least one silicone-based pressure-sensitive adhesive composition selected from the group consisting of alkylbenzene sulfonate, amine halide, quaternary ammonium salt, alkylpyridinium salt and amino acid. delete The method of claim 1, The composition is a silicone-based pressure-sensitive adhesive composition further comprises a siloxane oligomer. delete Preparing a polymer substrate; Coating at least one surface of the polymer substrate with a coating solution comprising the silicone pressure sensitive adhesive composition according to claim 1; And Heat treating the substrate; A surface treatment method for a substrate for forming a printed wiring comprising a. The method of claim 10, The polymer substrate is a surface treatment method of the substrate made of a polymer material of polyimide or polyethylene terephthalate. The method of claim 10, Coating with the coating solution is a coating solution having a lower viscosity by mixing at least one solvent selected from the group consisting of xylene, toluene, pyridine, quinoline, anisole, mesitylene, hexane and heptane to the silicone pressure-sensitive adhesive composition Surface treatment method of the substrate to form a coating film using. The method of claim 10, The coating method is a surface treatment method of the substrate is carried out by one method selected from the group consisting of spin coating, knife coating, gravure roll coating and casting. The method of claim 10, The silicon-based pressure-sensitive adhesive composition is a surface treatment method of a substrate that is coated with a thickness of 0.1 to 50㎛. The method of claim 10, The heat treatment step is a surface treatment method of the substrate is performed for 1 to 5 minutes at 100 to 150 ℃. Forming a wiring using a metal ink including conductive particles on the surface treated by the method of claim 10; And Heat treating the substrate; Method of forming a fine pattern comprising a. The method of claim 16, The conductive particles may be at least one selected from the group consisting of silver (Ag), copper (Cu), gold (Au), platinum (Pt), nickel (Ni), palladium (Pd), iron (Fe), and alloys thereof. Method of forming a fine pattern that is a metal nanoparticle. The method of claim 16, And the wiring is formed by ejecting the metal ink by an inkjet method. The method of claim 16, The method of forming a fine pattern to increase the temperature by applying heat to the substrate when forming the wiring. The method of claim 16, A fine pattern forming method wherein the wiring width of the wiring is 10 to 80 µm. The method of claim 16, The heat treatment is a method of forming a fine pattern is performed for 20 to 120 minutes at a temperature of 200 to 300 ℃. A circuit board comprising a fine pattern formed by the method of claim 16.

Images