JPH05102642A - Production of circuit board - Google Patents
Production of circuit boardInfo
- Publication number
- JPH05102642A JPH05102642A JP28353491A JP28353491A JPH05102642A JP H05102642 A JPH05102642 A JP H05102642A JP 28353491 A JP28353491 A JP 28353491A JP 28353491 A JP28353491 A JP 28353491A JP H05102642 A JPH05102642 A JP H05102642A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductive paste
- board
- offset printing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は導電性ペーストによる回
路基板の作成方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a circuit board using a conductive paste.
【０００２】[0002]
【従来の技術】従来、導電性ペーストによる回路基板を
作成するには、原画フィルムをＰＳ版に焼付け、オフセ
ット印刷機にセットし、次に導電性ペーストをインキン
グロールでインキングし、前記ＰＳ版に移し、さらにブ
ランケットに移した後基板に印刷し、然る後焼成してい
る。2. Description of the Related Art Conventionally, in order to prepare a circuit board made of a conductive paste, an original film is printed on a PS plate and set on an offset printing machine, and then the conductive paste is inked by an inking roll to form the PS film. It is transferred to a plate, further transferred to a blanket, printed on a substrate, and then baked.
【０００３】ところで、この回路基板の作成方法は、一
度ブランケットに導電性ペーストを移した後基板に印刷
する所謂オフセット印刷法を採る為、又基板が紙のよう
にインクを吸い込まない為、印刷回数を多くしないと、
シート抵抗を小さくできない。さらに導電性ペースト中
のＡｇを多くする為、ねばくなってラインのエッヂが不
明確で曲がったり、膨らんだりし、またべた部分に穴が
できたりする。By the way, this circuit board is produced by a so-called offset printing method in which the conductive paste is once transferred to the blanket and then printed on the board, and since the board does not suck ink like paper, the number of printings is reduced. Not much,
Sheet resistance cannot be reduced. Further, since the amount of Ag in the conductive paste is increased, the edge of the line becomes unclear and the line is bent and swollen, and a hole is formed in the solid portion.
【０００４】[0004]
【発明が解決しようとする課題】そこで本発明は、真っ
直ぐラインを有し、またべた部分に穴のない精度の高い
導電ペーストによる回路基板を作成することのできる方
法を提供しようとするものである。SUMMARY OF THE INVENTION Therefore, the present invention is intended to provide a method capable of producing a circuit board having a highly accurate conductive paste having straight lines and having no holes in the solid portion. ..
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
の本発明の回路基板の作成方法は、基板にシリコンゴム
のネガティブパターンをフォトリソ法又はオフセット印
刷法で形成し、次に所定量のＡｕ、Ａｇ、Ａｇ／Ｐｄ、
Ｐｔ、Ｃｕ、ＩＴＯ等の導電性ペーストを均一に広げた
インキングロールをローリングして基板上のシリコンゴ
ムの付着していない部分にポジティブパターンを形成
し、然る後焼成することを特徴とするものである。According to a method of manufacturing a circuit board of the present invention for solving the above problems, a negative pattern of silicon rubber is formed on a substrate by a photolithography method or an offset printing method, and then a predetermined amount of Au is formed. , Ag, Ag / Pd,
It is characterized in that an inking roll in which a conductive paste such as Pt, Cu, ITO or the like is uniformly spread is rolled to form a positive pattern on a portion of the substrate where the silicon rubber is not attached, and then firing is performed. It is a thing.
【０００６】[0006]
【作用】上記のように本発明の回路基板の作成方法は、
導電性ペーストのポジティブパターンを形成するのに、
シリコンゴムの非付着性を利用するので、繰り返しイン
キングロールをローリングすることができ、またシリコ
ンゴムのネガティブパターンは、フォトリソ法により形
成した場合フォトリソの精度となり、オフセット印刷法
により形成した場合エッチングレジスト並の印刷が可能
でべた部分に穴のないものができる。さらに基板を印刷
機から一度外しても寸法精度上の問題がないので、印刷
途中で加温したり、真空脱泡したり、超音波をかけたり
することができ、ラインの真っ直ぐなべた部分に穴のな
いネガティブパターンを形成できる。従って基板上に精
度の高いポジティブパターンを形成でき、焼成によりエ
ッジのしっかりした精度の高い導電回路を有しパット部
の滑らかな回路基板が得られる。As described above, the method of manufacturing the circuit board of the present invention is
To form a positive pattern of conductive paste,
Since the non-adhesiveness of silicone rubber is used, the inking roll can be rolled repeatedly, and the negative pattern of silicone rubber has the accuracy of photolithography when formed by the photolithography method and etching resist when formed by the offset printing method. It is possible to print on a regular basis and have no solid holes. Furthermore, even if you remove the board from the printing machine once, there is no problem with dimensional accuracy, so you can heat it during printing, degas in vacuum, or apply ultrasonic waves to the straight line of the line. A negative pattern without holes can be formed. Therefore, a highly accurate positive pattern can be formed on the substrate, and a circuit board having a highly accurate conductive circuit with a firm edge and a smooth pad portion can be obtained by firing.
【０００７】[0007]
【実施例】本発明の回路基板の作成方法の一実施例につ
いて説明すると、原画フィルムをＰＳ版に焼き付けて版
を作り、オフセット印刷法によりガラス基板にシリコン
ゴムのネガティブパターンを厚さ３μｍに形成し、次に
このネガティブパターンの形成されたガラス基板上に35
ｇのＡｕペーストを均一に広げたインキングロールをロ
ーリングしてシリコンゴムの付着していない部分に厚さ
６μｍのポジティブパターンを形成し、然る後 500℃、
10分間焼成して回路基板を作成した。EXAMPLE An example of a method for producing a circuit board of the present invention will be described. An original film is printed on a PS plate to form a plate, and a negative pattern of silicon rubber is formed on a glass substrate to a thickness of 3 μm by an offset printing method. And then 35 on the glass substrate with this negative pattern.
g of Au paste is spread evenly to roll an inking roll to form a positive pattern with a thickness of 6 μm on the part where silicon rubber is not attached, and then 500 ° C.,
A circuit board was prepared by firing for 10 minutes.
【０００８】一方、従来例について説明すると、原画フ
ィルムを平版水なし版に焼き付けて版を作り、オフセッ
ト印刷法により青板ガラスにＡｇペーストを印刷した。
そして１回当りのＡｇペーストの移転量が少ないので、
20回重ね印刷した。然る後550℃、10分間焼成して回路
基板を作成した。On the other hand, to explain the conventional example, an original film was printed on a planographic waterless plate to prepare a plate, and Ag paste was printed on soda lime glass by an offset printing method.
And since the transfer amount of Ag paste per time is small,
Overprinted 20 times. Then, it was baked at 550 ° C. for 10 minutes to prepare a circuit board.
【０００９】このようにして作成した実施例及び従来例
の回路基板を検査した処、従来例の回路基板は、導電回
路の精度が悪く、パット部に無数のへこみがあったが、
実施例の回路基板は導電回路の精度が高く、パット部が
滑らかであった。When the circuit boards of the example and the conventional example thus prepared were inspected, the circuit board of the conventional example had a poor precision of the conductive circuit and had a lot of dents in the pad portion.
In the circuit board of the example, the precision of the conductive circuit was high and the pad portion was smooth.
【００１０】[0010]
【発明の効果】以上の説明で判るように本発明の回路基
板の作成方法によれば、真っ直ぐラインを有し、べた部
分に穴のない精度の高い導電ペーストによる回路基板を
作成できるという効果がある。As can be seen from the above description, according to the method for producing a circuit board of the present invention, it is possible to produce a circuit board with a highly accurate conductive paste having straight lines and having no holes in solid portions. is there.
Claims (1)
ンをフォトリソ法又はオフセット印刷法で形成し、次に
所定量のＡｕ、Ａｇ、Ａｇ／Ｐｄ、Ｐｔ、Ｃｕ、ＩＴＯ
等の導電性ペーストを均一に広げたインキングロールを
ローリングして基板上のシリコンゴムの付着していない
部分にポジティブパターンを形成し、然る後焼成するこ
とを特徴とする回路基板の作成方法。1. A negative pattern of silicon rubber is formed on a substrate by a photolithography method or an offset printing method, and then a predetermined amount of Au, Ag, Ag / Pd, Pt, Cu, ITO is formed.
A method for producing a circuit board, characterized by rolling an inking roll in which a conductive paste is evenly spread to form a positive pattern on a portion of the substrate where silicon rubber is not adhered, and then firing. ..
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28353491A JPH05102642A (en) | 1991-10-03 | 1991-10-03 | Production of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28353491A JPH05102642A (en) | 1991-10-03 | 1991-10-03 | Production of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05102642A true JPH05102642A (en) | 1993-04-23 |
Family
ID=17666780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28353491A Pending JPH05102642A (en) | 1991-10-03 | 1991-10-03 | Production of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05102642A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100783471B1 (en) * | 2006-09-05 | 2007-12-07 | 삼성전기주식회사 | Silicone-based adhesive composition, method for surface treatment of substrate and method for forming fine patterns using the same |
-
1991
- 1991-10-03 JP JP28353491A patent/JPH05102642A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100783471B1 (en) * | 2006-09-05 | 2007-12-07 | 삼성전기주식회사 | Silicone-based adhesive composition, method for surface treatment of substrate and method for forming fine patterns using the same |
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