KR100781285B1 - Lead frame for led and led package - Google Patents

Abstract

A lead frame for a light emitting device and a light emitting device package are provided to easily form a space unit for preventing short by coupling first and second frames. A first frame(100) includes a heat sink(110). A second frame(200) includes a mounting unit(210) and at least one pair of leads(220). The second frame is coupled to an upper side of the first frame. A hole is formed on the center of the mounting unit. At least section of the pair of leads are overlapped with the heat sink and face to each other. A space unit is formed between the heat sink and the lead. The space unit is a first groove that is formed at the overlapped section of the heat sink and the lead. The space unit is a second groove(221) that is formed on the lower side of the lead overlapped with the heat sink. A molding unit couples circumferences of the first and second frames.

Description

Lead frame for light emitting device and light emitting device package {lead frame for LED and LED package}

1 is a cross-sectional view showing an example of a conventional light emitting device package.

2 is an exploded perspective view showing the first embodiment of the lead frame of the present invention.

3 is a perspective view showing a coupled state of the lead frame of the present invention.

4 is a cross-sectional view taken along the line AA of FIG.

5 is a cross-sectional view showing a state in which a molding part is formed in a lead frame of the present invention.

6 is a cross-sectional view showing the first embodiment of the lead frame of the present invention.

7 is an exploded perspective view showing a second embodiment of the lead frame of the present invention.

8 is a cross-sectional view showing a second embodiment of the lead frame of the present invention.

9 is a plan view showing an example of a second frame for the multichip configuration of the lead frame of the present invention.

FIG. 10 is a cross-sectional view taken along the line BB of FIG. 9.

11 is a plan view showing an example of a first frame for the multichip configuration of the lead frame of the present invention.

12 is a cross-sectional view showing an example of a light emitting device package of the present invention.

13 is a plan view showing an example of a light emitting device package of the present invention.

14 is a plan view showing another example of the light emitting device package of the present invention.

<Brief description of the main parts of the drawing>

100: first frame 110: heat sink

111: first groove 120: first border

200: second frame 210: mounting portion

220: lead 221: second groove

230: Second border 300: Space part

400: light emitting device chip 500: filler

600: Lens

The present invention relates to a light emitting device lead frame and a light emitting device package, and more particularly, to a light emitting device lead frame and a light emitting device package that can be easily manufactured and multi-chip application.

Light Emitting Diodes (LEDs) are well-known semiconductor light emitting devices that convert current into light.In 1962, red LEDs using GaAsP compound semiconductors were commercialized, along with GaP: N series green LEDs. It has been used as a light source for display images of electronic devices, including.

The wavelength of light emitted by such LEDs depends on the semiconductor material used to make the LEDs. This is because the wavelength of the emitted light depends on the band-gap of the semiconductor material, which represents the energy difference between the valence band electrons and the conduction band electrons.

Gallium nitride compound semiconductors (Gallium Nitride (GaN)) have attracted much attention in the field of high power electronics development due to their high thermal stability and wide bandgap (0.8-6.2 eV). One reason for this is that GaN can be combined with other elements (indium (In), aluminum (Al), etc.) to produce semiconductor layers that emit green, blue and white light.

In this way, the emission wavelength can be adjusted to match the material's characteristics to specific device characteristics. For example, GaN can be used to create white LEDs that can replace incandescent and blue LEDs that are beneficial for optical recording.

In addition, in the case of the conventional green LED, it was initially implemented as GaP, which was inefficient as an indirect transition type material, and thus practical pure green light emission could not be obtained. However, as InGaN thin film growth succeeded, high brightness green LED could be realized. It became.

Because of these and other benefits, the GaN series LED market is growing rapidly. Therefore, since commercial introduction in 1994, GaN-based optoelectronic device technology has rapidly developed.

Since the efficiency of GaN LEDs surpassed that of incandescent lamps and is now comparable to that of fluorescent lamps, the GaN LED market is expected to continue to grow rapidly.

Such LED devices are packaged and used after the individual devices are manufactured. 1 shows an example of such an LED package 10.

In the configuration of the LED package 10, the LED chip 20 is mounted on the plastic package body 11 including the heat sink 12.

The LED chip 20 is electrically connected to the lead 13 through a wire 14, and an encapsulant such as resin 15 and silicon 17 is filled on the LED chip 20, and a lens is provided on the upper side thereof. 16 is provided.

The LED package having such a structure is not only low in heat dissipation effect because the heat generated when driving the LED is transmitted through the package body 11 of the late plastic heat transfer rate, thereby lowering the optical characteristics of the LED.

In addition, a package process performed by inserting the heat sink 12 between the plastic package bodies 11 is difficult to expect a fast process speed.

In particular, when LEDs are arranged and used as lighting devices such as backlights, the size, light uniformity, and cost are difficult to implement, and a multi-chip package in which red, green, and blue are formed in one package. There was a problem that is not easy to apply.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a lead frame and a light emitting device package for a light emitting device that can be easily manufactured and can be multi-chip applied to easily produce a light emitting device package that emits various colors including white. have.

In order to achieve the above technical problem, the present invention, the first frame including a heat sink; A second frame coupled to an upper side of the first frame and including a mounting portion having a hole formed at a center thereof, and at least a pair of leads overlapping at least a portion of the heat sink and facing each other; It is preferably configured to include a space that forms a gap between the heat sink and the lid.

The space portion may be a first groove formed in a portion overlapping the lead in the heat sink, and a second groove formed in a portion overlapping the heat sink in the lower side of the lead may form a space portion.

In this case, a molding part for coupling the edge of the first frame and the second frame may be further configured.

The mounting part may be formed in a circular shape, a rectangular shape, an elliptical shape, or the like, and may include an inclined part inclined toward the center of the second frame, and the inclined part may have a reflective surface.

The lead may be provided with three pairs, and three light emitting device chips may be attached to the mounting portion, and four or more pairs may be provided, and four or more light emitting device chips may be attached.

In this case, when three pairs of leads are configured, the three pairs of leads may be configured in parallel with each other.

Meanwhile, an edge may be formed in the first frame and the second frame.

That is, the heat sink is connected to the first edge of the first frame, the mounting portion and the lead are connected to the second edge of the second frame, and the first frame and the second border so that the lead frame overlaps with each other Can be configured.

As another aspect for achieving the above technical problem, the present invention, the first frame including a heat sink; A second frame coupled to an upper side of the first frame and including a mounting portion having a hole formed at a center thereof, and at least a pair of leads overlapping at least a portion of the heat sink and facing each other; A space portion forming a gap between the heat sink and the lid; A molding part for coupling the edges of the first frame and the second frame; It is preferably configured to include a light emitting device chip coupled to the mounting portion.

Three or four light emitting device chips may be coupled to the mounting unit. The light emitting device chips may be attached to light emitting device chips that emit one color. The light emitting device chips of three primary colors of red, green, and blue may be attached. This may be configured.

As described above, when the four light emitting device chips are combined, the light emitting device chip for emitting one of the red, green, and blue and one color for supplementing the brightness thereof may be further provided.

On the other hand, the sealing material on the upper side of the light emitting device chip; It may be configured to further include a lens.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 2, the first frame 100 and the second frame 200 may be coupled to each other to form a lead frame in which a light emitting device chip may be installed.

That is, the heat sink 110 may be connected to the inner side of the first frame 120 by the first connector 121 in the first frame 100, and the second frame 200 may be provided in the second frame 200. The mounting part 210 and the lead 220 may be connected to the inside of the 230 by the second connection part 231.

A hole 211 for mounting a light emitting device chip may be formed inside the mounting unit 210, and the mounting unit 210 may have a circular shape, and may be inclined toward the center of the second frame 200. Can be.

As shown in FIG. 2, the mounting portion 210 is connected to two second connectors 231 on the second edge 230, and the heat sink 110 is connected to the first edges by the two first connectors 121. May be connected to 120.

The connection parts 121 and 231 and the edges 120 and 230 may be removed later in the packaging process of the light emitting device.

Meanwhile, when the first frame 100 and the second frame 200 are coupled to each other, a first groove 111 is formed in a portion where the heat sink 110 and the lead 220 overlap, and the lead 220 is formed. And a short between the heat sink 110 can be prevented.

When the first frame 100 and the second frame 200 are combined, a state as shown in FIG. 3 is achieved.

4 shows a cross section of the first frame 100 and the second frame 200 in a coupled state.

As described above, a molding part 240 is formed at the edge of the combined first frame 100 and the second frame 200 to form the first frame 100 and the second frame 200. Can be fixed

In this case, the molding part 240 may be formed of both transfer molding and injection molding.

After this process, the connection parts 121 and 231 and the edges 120 and 230 described above are removed to form a lead frame as shown in FIG. 6.

At this time, as shown, the space portion 300 is formed between the heat sink 110 and the lead 220, in this case, the first groove 111 formed in the heat sink 110 is such a space portion 300 ) Can be formed.

Meanwhile, as shown in FIG. 7, instead of forming the groove 111 in the heat sink 110 in order to form the space 300, the second groove 221 is formed in a part of the lower side of the lid 220. It may be formed. The rest of the configuration is the same as in the case of FIG.

By the same process as that of FIGS. 3 to 5 described above, the configuration shown in FIG. 7 forms the lead frame as shown in FIG. 8.

As shown, the space part 300 in this example is formed by the second groove 221 formed below the lead 220 of the portion where the heat sink 110 and the lead 220 overlap.

In some cases, as described above, forming the space part 300 by forming the second groove 221 in the lead 220 may be performed by forming the first groove 111 in the heat sink 110. It may be advantageous to form 300.

When the plurality of light emitting device chips are coupled to the lead frame, that is, when the multi chip package is applied, the number of leads 220 increases by the number of chips to be applied, resulting in a short circuit. The space 300 for prevention is also increased by the number of leads 220 increased in this way.

However, in forming such a groove, since the lower first frame 100 including the heat sink 110 uses a thick material, it may be difficult to apply a pattern having a complex shape such as the first groove 111. Because it can.

In addition, since the thickness of the second frame 200 positioned on the upper portion is relatively thin as compared to the first frame 100 on the lower portion, the second groove 221 is easily formed using an etching process or a stamping process to form a space part. 300 can be achieved.

9 to 14 show an embodiment in which such a lead frame is applied to a multi chip.

That is, in order to configure a package using a plurality of light emitting device chips, as shown in FIG. 9, a plurality of pairs of leads 220 may be provided.

In FIG. 9, three pairs of leads 220 are provided in the second frame 200 to apply three light emitting device chips.

As shown in FIG. 10, a second groove 221 may be formed at the lower side of each lead 220 to form the space 300 (see FIG. 12) as described above.

Accordingly, all leads 220 may prevent short circuits by preventing contact with the heat sink 110.

In addition, the mounting unit 210 may be formed in a shape having a hole 221 in the longitudinal direction in consideration of the mounting space of the light emitting device chip, and may have a rectangular or oval shape.

The mounting portion 210 may be provided in a state of being connected to the second edge 230 by the second connector 231.

In this case, as shown in FIG. 11, the first frame 100 includes a heat sink 110, and as described above, may be provided by being connected to the first border 120 by the first connector 121. .

As described above, the first frame 100 and the second frame 200 as shown in FIGS. 9 to 11 may be completed as a lead frame by the manufacturing process as described above, and the light emitting device chip is packaged in the lead frame. 12 and 13 may be in the same state.

That is, the mounting part 210 and the lead 220 are coupled to each other by the molding part 240 on the upper side of the heat sink 110 to form a lead frame. The light emitting device chip 400 is mounted on the mounting part 210. .

The light emitting device chip 400 is attached to the heat sink 110 by a heat transfer material, and is electrically connected to the lead 220 by a wire 410.

Thereafter, the encapsulant 500 may be filled on the upper side of the light emitting device chip 400, and the lens 600 may be mounted on the encapsulant 500.

The encapsulant 500 may be a silicon encapsulant or other resin.

In some cases, the encapsulant 500 may include a phosphor that changes a color of light emitted from the light emitting device chip 400.

FIG. 13 illustrates a light emitting device package in which a light emitting device chip 400 that emits light of three colors is combined. The three colors may be red, green, and blue, and the light of the three colors may be different from each other. Can be mixed to achieve white light.

Meanwhile, as shown in FIG. 14, four light emitting device chips 400 may be provided to form a package.

That is, the package may be formed by further comprising a light emitting device chip that emits light that needs reinforcement among the red, green, and blue light emitting device chips.

In FIG. 14, four light emitting device chips 400 and leads 220 are arranged in a radial manner. However, the light emitting device chips 400 and the leads 220 may be arranged in a straight line as shown in FIG. 13.

As described above, not only the four light emitting device chips 400 but also the light emitting device chips 400 and the leads 220 may be arranged.

Of course, it is possible to form a light emitting device package capable of emitting light of various colors other than white.

In addition, the luminance of the white light emitting device chip may be increased by configuring the multi-chip. Therefore, the package with increased brightness can be used for lighting and other decorative packages.

The above embodiment is an example for explaining the technical idea of the present invention in detail, and the present invention is not limited to the above embodiment, various modifications are possible, and various embodiments of the technical idea are all protected by the present invention. It belongs to the scope.

The present invention as described above has the following effects.

First, a lead frame can be easily manufactured by combining two frames.

Second, in this way, when combining the two frames, it is possible to easily constitute a space to prevent the occurrence of short circuit.

Third, it is possible to improve the heat dissipation characteristics of the package.

Fourth, multi-chip application is possible, it is possible to easily configure a package for decoration, lighting.

Claims (13)

A first frame including a heat sink; A second frame coupled to an upper side of the first frame and including a mounting portion having a hole formed at a center thereof, and at least a pair of leads overlapping at least a portion of the heat sink and facing each other; And a space portion forming a gap between the heat sink and the lead. The lead frame for a light emitting element according to claim 1, wherein the space portion is a first groove formed in a portion overlapping the lead in the heat sink. The lead frame for a light emitting element according to claim 1, wherein the space portion is a second groove formed in a portion overlapping the heat sink under the lead. The lead frame for a light emitting device according to claim 1, further comprising a molding part for coupling the edge side of the first frame and the second frame. The lead frame for a light emitting element according to claim 1, wherein the mounting portion is formed in a circle, a rectangle, or an oval. The lead frame for a light emitting element according to claim 1, wherein the mounting portion includes an inclined portion inclined toward the center of the second frame. The lead frame for a light emitting element according to claim 6, wherein a reflection surface is formed on the inclined portion. The lead frame for a light emitting device according to claim 1, wherein the lead is provided with three or more pairs. The method of claim 1, wherein the heat sink is connected to the first edge of the first frame, the mounting portion and the lead is connected to the second edge of the second frame, the first border and the second border A lead frame for light emitting elements, characterized by the above-mentioned. A first frame including a heat sink; A second frame coupled to an upper side of the first frame and including a mounting portion having a hole formed at a center thereof, and at least a pair of leads overlapping at least a portion of the heat sink and facing each other; A space portion forming a gap between the heat sink and the lid; A molding part for coupling the edges of the first frame and the second frame; Light emitting device package comprising a light emitting device chip coupled to the mounting portion. The light emitting device package according to claim 10, wherein at least three light emitting device chips are coupled to the mounting unit. The light emitting device package according to claim 11, wherein the light emitting device chip comprises a red, green, and blue light emitting device chip. The light emitting device chip of claim 10, further comprising: Encapsulant; The light emitting device package further comprises a lens.

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