KR100763966B1 - Semiconductor package and lead frame used in manufacturing such - Google Patents

Abstract

A semiconductor package is disclosed. The semiconductor package of the present invention includes a semiconductor chip, a die pad to which the semiconductor chip is bonded, a plurality of tie bars extending from the die pad, a heat dissipation terminal formed at an end of the tie bar, and dissipating heat to the outside; Encapsulation for enclosing a lead wire-bonded with an electrode terminal and electrically connected to the outside, and surrounding the semiconductor chip, die pad, tie bar, heat dissipation terminal, and lead to expose the heat dissipation terminal and the ends of the lead to the outside. Characterized in that it has been provided.

Description

Semiconductor package and lead frame used in manufacturing such}

1A and 1B are a cross-sectional view and a bottom view showing an example of a conventional semiconductor package.

2A, 2B, and 2C are cross-sectional, perspective, and bottom views showing a first embodiment of a semiconductor package of the present invention and a leadframe used in its manufacture;

3A and 3B are a cross-sectional view and a bottom view of a second embodiment of the semiconductor package of the present invention.

4A and 4B are a cross-sectional view and a bottom view of a third embodiment of the semiconductor package of the present invention.

5 is a perspective view showing a fourth embodiment of the present invention semiconductor package.

<Brief description of symbols for the main parts of the drawings>

10,100,200 ... Semiconductor Package 11,101,201 ... Semiconductor Chip

12,110,210 ... Die Pad 13,120.220 ... Lead

115 ... tie bar 130, 230 ... heat dissipation terminals

14,140,141 ... bonding wire 15,150,250 ... encapsulation

The present invention relates to a semiconductor package and a lead frame used in the manufacture thereof, and more particularly, to a semiconductor package having improved reliability by allowing heat generated from a semiconductor chip to be easily dissipated and a lead frame therefor.

Dividing the currently produced semiconductor package into two structural aspects can be divided into a lead frame and a circuit pattern using polyimide tape bonded to the semiconductor chip.

1A and 1B are cross-sectional views and bottom views schematically illustrating an example of a chip scale package (CSP) semiconductor package using a conventional lead frame.

Referring to the drawings, a semiconductor package includes a semiconductor chip 11, a die pad 12 to which the semiconductor chip is bonded, a lead 13 connected to the semiconductor chip 11 by wire bonding 14, and the components. And encapsulation 15 surrounding the fields 11 to 14. As shown in FIG. 1B, the bottom surface of the lead 13 is exposed under the encapsulation 15 so as to be electrically connected to the printed circuit board.

In the semiconductor package 10, the semiconductor chip 11 and the die pad 12 are molded in the encapsulation 15, so that the semiconductor package 10 is strong against moisture or other external factors. There is a shortage of emission characteristics, and therefore has a disadvantage in that it is difficult to apply to a high frequency device having a large amount of heat generation. In addition, this may reduce the reliability of the package.

 The present invention has been made to solve the above problems, the technical problem to be achieved by the present invention is to provide a semiconductor package having a heat dissipation terminal can be improved heat dissipation characteristics.

Another object of the present invention is to provide a semiconductor package capable of maintaining high reliability even when used as a high frequency device.

Another object of the present invention is to provide a semiconductor package having a heat dissipation terminal that also serves as a ground terminal.

It is also an object of the present invention to provide a leadframe for use in the manufacture of semiconductor packages in which heat dissipation characteristics can be improved.

In order to achieve the above object, a semiconductor package according to the present invention includes a semiconductor chip, a die pad to which the semiconductor chip is bonded, a plurality of tie bars extending from the die pad, and formed at an end of the tie bar to heat heat to the outside. A radiating heat dissipation terminal, a lead wire-bonded with an electrode terminal of the semiconductor chip and electrically connected to the outside, and surrounding the semiconductor chip, a die pad, a tie bar, a heat dissipation terminal, and a lead, and ends of the heat dissipation terminal and the lead Characterized in that the encapsulation to be exposed to the outside.

In the semiconductor package according to the present invention, an end portion of the die pad is exposed to the outside.

The semiconductor package of the present invention includes a die pad, which is a place where a semiconductor chip is to be bonded, a plurality of tie bars extending from the die pad, a heat dissipation terminal formed at an end of the tie bar and dissipating heat to the outside, and the die pad; It is spaced apart and extended radially, characterized in that it comprises a lead arranged in parallel with the heat dissipation terminal.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

2A, 2B, and 2C are cross-sectional views, perspective views, and bottom views schematically showing a first embodiment of a semiconductor package of the present invention and a leadframe used for its manufacture. The perspective view is a plan perspective view showing the shape of the interior from which the encapsulation is removed, and the dotted line represents the boundary of the encapsulation.

Referring to the drawings, a semiconductor package includes a semiconductor chip 101, a die pad 110 positioned below the semiconductor chip 101, and a tie extending radially from four corners of the die pad 110, respectively. Bar 115, and the heat dissipation terminal 130 formed integrally with the end of the tie bar (115). A plurality of leads 120 connected to a printed circuit board (not shown) are provided between adjacent heat dissipation terminals 130. Since the lead 120 and the heat dissipation terminal 130 are located on the same plane, the heat dissipation terminal 130 is not shown by the lead 120 in FIG. 2A. In addition, it can be seen that the tie bar 115 connecting the heat dissipation terminal 130 and the die pad 110 is inclined downwardly from the die pad 110 by an angle, that is, down-set and extended. . The electrode terminals of the semiconductor chip 101 are electrically connected to the leads 120 by wire bonding 140, respectively. In addition, the ground terminal among the electrode terminals of the semiconductor chip 101 is also connected to the die pad 110 by a separate wire bonding 141. That is, the ground bonding pads of the semiconductor chip 101 and the bonding pads of the die pad 110 are connected by wire bonding 141, which is electrically connected to the heat dissipation terminal 130 through adjacent tie bars 115, respectively. It is. The semiconductor chip 101, the die pad 110, the tie bar 115, the heat dissipation terminal 130, and the lead 120 are encapsulated by encapsulation 150 by molding resin. However, as illustrated in FIG. 2C, the heat dissipation terminal 130 and the leads 120 may be exposed to the bottom surface of the encapsulation 150 and may be connected to a printed circuit board (not shown). As described above, the heat dissipation terminal 130 may be electrically connected to the ground bonding pad of the semiconductor chip 101 to serve as a ground terminal.

Due to the structure in which the semiconductor chip 101 and the die pad 110 are not exposed to the outside, performance degradation of the semiconductor package 100 due to penetration of moisture or the like may be prevented. Heat generated during operation of the semiconductor chip 101 is dissipated through the heat dissipation terminal 130 via the die pad 110 and the tie bar 115. This is to increase the heat dissipation area than the conventional case shown in Figures 1a and 1b, it is possible to improve the heat dissipation characteristics of the semiconductor package 100.

The die pad 110, the tie bar 115, the heat dissipation terminal 130, and the lead 120 of the illustrated semiconductor package 100 may be integrally formed and provided as a lead frame for manufacturing the semiconductor package.

The illustrated semiconductor package 100 may be manufactured by separately molding and trimming each unit, or may be manufactured by molding a plurality of units at once and then cutting them into individual units.                     

3A and 3B are cross-sectional and bottom views schematically showing a second embodiment of the semiconductor package of the present invention.

Referring to the drawings, the semiconductor package 200 has the same components as those of the first embodiment shown in FIGS. 2A, 2B, and 2C. The plan perspective view of the semiconductor package 200 is similar to that of FIG. 2B. However, as shown in FIG. 3B, a portion of the die pad 210 adhered to the semiconductor chip 201 under the semiconductor chip 201 is exposed to the bottom surface of the encapsulation 250.

Therefore, the semiconductor package 200 of the second embodiment may have heat dissipation directly not only to the heat dissipation terminal 230 but also to the die pad 210, and thus may have better heat dissipation characteristics than the case of the first embodiment. Not mentioned, reference numeral 220 denotes a lead to be connected to a terminal on a printed circuit board, reference numeral 240 denotes a bonding wire connecting the lead 220 and the semiconductor chip 201, and reference numeral 241 denotes the semiconductor chip 201. ) And a bonding wire connecting the die pad 210. Of course, the heat dissipation terminal 230 serves as a ground terminal.

As illustrated in FIG. 2, the die pad 210, the tie bar (not shown), the heat dissipation terminal 230, and the lead 220 of the illustrated semiconductor package 200 are integrally formed to manufacture the semiconductor package. It will be provided as a leadframe for.

4A and 4B are cross-sectional and bottom views schematically showing a third embodiment of the semiconductor package of the present invention.

Referring to the drawings, the semiconductor package 300 includes the same components as those of the first or second embodiment described above. However, the die pad 310 is a so-called Smart Metal Chip Scale Package (SMCSP) type that is adhered to the semiconductor chip 301 on the semiconductor chip 301. When the semiconductor package 300 of the type is viewed from the bottom, the bonding wires 340 and 341 are shown, and may be similar to that of FIG. 2B. In view of the encapsulation 350, the bottom view (FIG. 4B) is illustrated in FIG. It may appear similar to 2c. Although not shown, it will be readily understood that a tie bar supporting the die pad 310 and connected to the heat dissipation terminal 330 will be provided. Not mentioned, reference numeral 320 is a lead to be connected to a terminal of a printed circuit board. The heat dissipation terminal 330 may serve as a ground terminal, of course.

The die pad 310 is positioned at the same height as the encapsulation 350 and is exposed to the outside. Therefore, heat dissipation is performed not only through the heat dissipation terminal 330 but also through this portion, and thus may have heat dissipation characteristics superior to those of the semiconductor package of the first embodiment.

As illustrated in FIG. 2, the die pad 310, the tie bar (not shown), the heat dissipation terminal 330, and the lead 320 of the illustrated semiconductor package 300 are integrally formed to manufacture the semiconductor package. It will be provided as a leadframe for.

Fig. 5 is a plan perspective view schematically showing a fourth embodiment of the semiconductor package of the present invention.

Referring to the drawings, the semiconductor package 400 is similar to the first or second embodiment in which the die pad 410 adheres to the semiconductor chip 401 under the semiconductor chip 401. The 430 is positioned between the adjacent corners and the corners rather than the corners of the semiconductor package 400. The tie bar 415 also extends to the heat dissipation pad 430 between adjacent corners of the die pad 410. As described above, the semiconductor package 400 may arrange the heat dissipation terminal 430 and the lead 420 in various ways according to the shape of the mounting portion of the printed circuit board. The heat dissipation pad 430 may also serve as a ground terminal.

Not mentioned, reference numeral 440 denotes a bonding wire connecting the semiconductor chip 401 and the lead 420, and reference numeral 441 denotes a bonding wire connecting the semiconductor chip 401 and the die pad 410.

As illustrated in FIG. 2, the die pad 410, the tie bar 415, the heat dissipation terminal 430, and the lead 420 of the illustrated semiconductor package 400 are integrally formed to manufacture the semiconductor package. It will be provided as a leadframe for it.

By the semiconductor package described above and the lead frame used therein, the heat dissipation terminal formed at the end of the tie bar may be promoted to release heat generated from the semiconductor chip, thereby improving heat dissipation characteristics of the semiconductor package.

Therefore, the semiconductor package of the present invention can maintain high reliability even when used as a high frequency device such as for communication equipment.

In addition, since the heat dissipation terminal is mounted on the printed circuit board, it may also serve as a ground terminal, and there is no need to provide a separate ground terminal.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (3)

Semiconductor chips; A die pad to which the semiconductor chip is bonded; A plurality of tie bars extending from the die pad; A heat dissipation terminal formed at an end of the tie bar to dissipate heat to the outside; A lead wire-bonded with an electrode terminal of the semiconductor chip and electrically connected to the outside; And And encapsulation enclosing the semiconductor chip, the die pad, the tie bar, the heat dissipation terminal, and the lead to expose the ends of the heat dissipation terminal and the lead to the outside. The method of claim 1, And an end portion of the die pad is exposed to the outside. A die pad at which the semiconductor chip is to be bonded; A plurality of tie bars extending from the die pad; A heat dissipation terminal formed at an end of the tie bar to dissipate heat to the outside; And And a lead spaced radially apart from the die pad and arranged in parallel with the heat dissipation terminal.

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