KR100760369B1 - Apparatus for at least two wire coating without one-sided control - Google Patents

Abstract

An apparatus for coating at least two wires without eccentricity control is provided to reduce time and costs and to improve productivity by inserting a plurality of wire-guides into a die and a holder. An apparatus(100) for coating at least two wires without eccentricity control includes a holder(120), a wire guide(130), and a die(110). The holder(120) includes a plurality of wire guide holes formed along the length direction so that the wire guide(130) can be mounted, and a resin supplying path(121) formed along the length direction from both sides of the rear surface on the basis of the plurality of wire guide holes and having a wider supply path at the front surface. The wire guide(130) has a wire hole inside and is tapered outside to make a wire path through the holder(120). The die(110) has a die groove formed at the rear surface and having narrower width at the central part, and a plurality of wire through-holes formed along the length direction at the front surface to be connected with the narrow part of the dir groove to make the plurality of wires, having passed through the wire guide(130), and the resin, having passed through the widened part of the resin supplying path(121), pass together. The resin supplying path(121) of the holder(120) supplies resin through a gap between the wire through-hole and the wire guide(130) via the die groove. The supplied resin is coated around the plurality of wires exposed in the gap.

Description

Apparatus for at least two wire coating without one-sided control}

1 is a perspective view showing a conventional coating device,

2 is a perspective view of a coating apparatus showing an embodiment of the present invention,

3 is a cross-sectional view taken along line III-III of the coating apparatus shown in FIG. 2;

4 is a cross-sectional view taken along line IV-IV of the coating apparatus shown in FIG. 2;

5 is a perspective view of the die shown in FIG.

6 is a cross-sectional view taken along VI-VI of the die shown in FIG. 5;

7 is a perspective view of the holder shown in FIG.

8 is a cross-sectional view taken along line VIII-VIII of the holder shown in FIG. 6;

9 is a perspective view of the wire guide shown in FIG.

10 is a cross-sectional view taken along the line VIII-VIII of the wire guide shown in FIG. 9.

<Description of the symbols for the main parts of the drawings>

100 ... coater 110 ... die

111 Wire passing hole 112 Die groove

120 holder 121 resin supply path

122 ... Wire Guide Hole 130 ... Wire Guide

131 ... Wirehole

The present invention relates to two or more lines of wire coating apparatus which does not require eccentric adjustment, and more particularly, to a head portion of a coating apparatus capable of covering a plurality of wires at the same time.

In general, the wire is a thin, thin shape such as a thread, a copper wire, an iron wire, and may be simply used, but it is preferable to coat the wire for application in more fields.

The coating apparatus for coating the wires described above includes an extruder having a cylinder for extruding synthetic resin, a crosshead for shaping the appearance of the wire with molten synthetic resin flowing from the extruder, and a wire drawn out of the crosshead. It is provided with a cooling unit for solidifying while.

Specifically, the crosshead is an extrusion head in which the traveling direction of the cylinder is perpendicular to the direction in which the synthetic resin is extruded.

1 is a cross-sectional view showing a crosshead of a conventional coating apparatus.

Referring to the drawings, the conventional crosshead 10 has a front needle 15 having a vacuum hole 16 connected to a vacuum pump and a carrier 11 having a cavity 11a communicating with the vacuum hole 16. And a guide 12 coupled to the carrier 11, a body 13 on which the carrier 11 and the guide 12 are mounted, and the body 13 spaced apart from the guide 12 by a predetermined distance. Die 14 supported at the end of the &lt; RTI ID = 0.0 &gt;

The body 13 has an injection hole 18 into which the synthetic resin melted in the extruder is injected, and forms an exterior of the crosshead 10. In addition, the carrier 12 is mounted and fixed at the center thereof, and the die 14 is supported at a portion where the synthetic resin is discharged.

The front needle 15 has the vacuum hole 16 is formed on one side, the vacuum hole 16 is connected to the pipe of the vacuum pump to the vacuum state inside the carrier 11 during the extrusion process of the wire Form.

The front needle 15 fixes the carrier 11 to the body 13 to be coupled.

The carrier 11 has a cylindrical shape 11a formed at the center thereof, and the cavity 11a is connected to the vacuum hole 16 so as to adsorb the synthetic resin introduced into the crosshead 10 so as to have an eccentricity. Prevent degradation.

The carrier 11 forms an extrusion path in the body 13.

The guide 12 is a conical structure joined to the front end surface of the carrier 11, and has a cylindrical guide tip 17 at the conical end.

The guide 12 forms an extrusion path gradually spaced apart from the die 14 by a predetermined distance, and the high-pressure drawn synthetic resin is introduced from the inlet 18 of the body 13 around the guide tip 17. Is coated on the wire.

The die 14 is a conical structure supported on the outlet side of the body 13, spaced apart from the guide 12 by a predetermined distance, extrusion of the funnel structure with the outer diameter gradually reduced with the guide 12 Form a furnace.

However, the crosshead 10 having the carrier 11 of the conventional cavity 11a structure does not reach the suction force of the vacuum pump to the extrusion path formed between the guide 12 and the body 13, and thus There is a problem that the thickness of the synthetic resin coated around the wire becomes uneven.

In addition, the crosshead of the coating apparatus as described above can cover only one wire, there is a disadvantage that takes a long time when a large amount of wire coating is required.

The present invention has been made to solve the above problems, and provides an apparatus for covering two or more wire rods without the need for eccentric adjustment, the structure of which is improved to enable coating of a uniform thickness around a plurality of wires without eccentric adjustment. Its purpose is to.

Other objects and advantages of the invention will be described below and will be appreciated by the embodiments of the invention. In addition, the objects and advantages of the invention may be realized by the means and combinations indicated in the claims.

In order to achieve the above object, the wire covering device of two or more lines which does not need to adjust the eccentricity of the present invention is formed with a plurality of tapered shape wire guide holes in the longitudinal direction so that the wire guides are seated, and the front part at both sides of the rear side. Holders formed with resin feed in the longitudinal direction to; A wire hole formed therein so that a wire passes through the holder, and an outer portion of the wire guide having a tapered shape; And a die in which a plurality of wire through holes are formed in the longitudinal direction so that the plurality of wires passing through the wire guide and the resin passing through the resin supply path of the holder pass together.

Here, the resin supply path of the holder supplies the resin to the spaced gap between the wire passing hole and the wire guide, the supplied resin is preferably coated around a plurality of wires exposed to the gap.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only one of the most preferred embodiments of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

FIG. 2 is a perspective view of a coating apparatus showing an embodiment of the present invention, FIG. 3 is a sectional view taken along line III-III of the coating apparatus shown in FIG. 2, and FIG. 4 is a IV-IV of the coating apparatus shown in FIG. According to the cross-sectional view.

Referring to the drawings, the coating apparatus 100 according to the present invention includes a die 110, a holder 120 and a wire guide 130.

The die 110 and the holder 120 have a substantially rectangular shape to insert a plurality of wire guides 130 in the longitudinal direction.

The die 110 and the holder 120 are coupled back and forth in approximately the same size, the wire guide 130 is a structure that is inserted into the die 110 and the holder 120.

The plurality of wire guides 130 are positioned at a predetermined distance apart so that the wires penetrating the wire guides 130 may be coated with the same pressure and thickness.

FIG. 5 is a perspective view of the die shown in FIG. 2, and FIG. 6 is a cross-sectional view taken along VI-VI of the die shown in FIG. 5.

Here, the same reference numerals as those shown in FIG. 2 denote the same members having the same configuration and function, and thus repeated descriptions thereof will be omitted.

Referring to the drawings, the die 110 is formed in a substantially rectangular rectangular groove 112 in the rear.

The die groove 112 is narrower in width toward the center portion of the die 110.

One surface of the die groove 112 positioned at the center portion of the die 110 communicates with the wire through hole 111.

The wire through hole 111 is formed at the center of the die 110 to the front surface of the die 110, and a plurality of wires are formed in the longitudinal direction of the die 110 spaced apart by a predetermined distance.

FIG. 7 is a perspective view illustrating the holder illustrated in FIG. 2, and FIG. 8 is a cross-sectional view taken along the line VIII-VIII of the holder illustrated in FIG. 7.

Here, the same reference numerals as those shown in FIG. 2 denote the same members having the same configuration and function, and thus repeated descriptions thereof will be omitted.

Referring to the drawings, the holder 120 is a substantially rectangular shape corresponding to the die 110, and is coupled to the rear surface of the die 110.

Resin supply paths 121 are formed on both sides of the rear surface of the holder 120 in the longitudinal direction.

The supply path of the resin 121 extends toward the front of the holder 120.

The resin supply passage 121 serves to supply resin to the die groove 112 when the die 110 and the holder 120 are coupled to each other.

Meanwhile, a wire guide hole 122 is formed on the rear surface of the holder 120 to seat and support the wire guide 130 inserted into the die groove 112.

The diameter of the wire guide hole 122 is preferably a size to which the wire guide 130 can be inserted and fixed.

FIG. 9 is a perspective view illustrating the wire guide illustrated in FIG. 2, and FIG. 10 is a cross-sectional view taken along line VII-VII of the wire guide illustrated in FIG. 9.

Here, the same reference numerals as those shown in FIG. 2 denote the same members having the same configuration and function, and thus repeated descriptions thereof will be omitted.

Referring to the drawings, the wire guide 130 has a wire hole 131 formed therein so that the wide can pass through.

The diameter of the wire hole 131 becomes narrower toward the front surface of the wire guide 130.

Herein, the diameter of the wire hole 131 may be a diameter enough to allow the wire to pass therethrough, and the diameter of the wire hole 131 may be a diameter that does not cause eccentricity of the wire.

In addition, the diameter of the wire hole 131 may be variously adopted according to the thickness of the wire, and accordingly, sizes of the wire guide 130, the die 110, and the holder 120 may be variously adjusted. .

The front portion of the wire guide 130 is tapered so that the wire guide 130 can be inserted into the die groove 112 formed in the die 110.

In addition, the rear portion of the wire guide 130 is preferably tapered in the same shape as the wire guide hole 122 to be fitted to the wire guide hole 122 formed in the holder 120.

The wire guide 130 is coupled to the die 110 in a state where the rear portion of the wire guide 130 is inserted into the wire guide hole 122 of the holder 120.

The wire guide 130 inserted into the wire guide hole 122 of the holder 120 is spaced a predetermined distance from one surface of the die groove 112, the front portion of which is located at the center of the die 110.

With the above structure, the wire inserted into the wire guide 130 is exposed to a gap spaced a predetermined distance from one surface of the die groove 112 until entering the wire through hole 111.

Here, the gap spaced apart from the one surface of the die groove 112 and the wire through hole 111 by a predetermined distance is in communication with the resin supply passage 121, the die groove along the resin supply passage 121 The resin supplied to 112 is provided.

Resin supplied from the resin supply path 121 is supplied to the entire circumference of the exposed wire to cover the wire, the wire is completed is the wire of the die 110 through the wire through hole 111 Will come out.

As mentioned above, although this invention was demonstrated by the limited embodiment and drawing, this invention is not limited by this, The person of ordinary skill in the art to which this invention belongs, Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

As described above, according to the wire coating apparatus of two or more lines which does not require eccentric adjustment of the present invention,

First, it is possible to reduce the cost of time and increase the productivity because it is possible to simultaneously cover two or more wires without eccentric adjustment by inserting a plurality of wire guides into the die and the holder.

Second, since the resin can be supplied with the same thickness at the same pressure around the plurality of wires in the resin supply passage of the holder, it provides a high quality coated wire.

Claims (2)

A plurality of tapered shape wire guide holes formed in the longitudinal direction so that the wire guides are seated, and resin supply passages formed in both lengthwise sides of the rear side of the plurality of wire guide holes and extending in the front direction toward the front side. Holder including; A wire hole formed therein so that a wire passes through the holder, and an outer portion of the wire guide having a tapered shape; And The die groove and the die groove formed on the rear side to be narrowed toward the center portion so that the plurality of wires passing through the wire guide and the resin passing through the expanded supply passage portion of the resin supply passage formed in the holder pass together. And a die including a plurality of wire through holes formed in the longitudinal direction on the front surface thereof so as to communicate with the narrower width portion of the The resin supply passage of the holder supplies the resin to the spaced gap between the wire through hole and the wire guide via the die groove, and the supplied resin is coated around the plurality of wires exposed to the gap. Wire sheathing device of two or more lines which does not require eccentric adjustment. delete

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