KR100757852B1 - Led lighting apparatus, substrates cleaning apparatus using the same and cooling method for lighting apparaus - Google Patents

Abstract

An LED lighting device, a substrate cleaning apparatus using the same, and a method for cooling the same are provided to radiate effectively the heat generated from light emitting diodes by supplying a cooling gas onto a rear surface of a circuit board. A circuit board(324) is positioned in a hollow tubular housing(322), and is provided with plural light emitting diodes(325) mounted on a front surface of the circuit board. A cooling unit supplies a cooling gas onto a rear surface of the circuit board to discharge the heat generated from the light emitting diodes. The cooling unit has a gas supply member(327) connected to one side of the housing for introducing the cooling gas in the housing, and a drain member(328) connected to the other side of the housing.

Description

LED lighting apparatus, substrate cleaning apparatus and cooling method of LED lighting apparatus using same {LED LIGHTING APPARATUS, SUBSTRATES CLEANING APPARATUS USING THE SAME AND COOLING METHOD FOR LIGHTING APPARAUS}

1 is a schematic plan view showing an example of a substrate cleaning apparatus according to the present invention;

2 is a schematic side configuration diagram of a substrate cleaning apparatus according to the present invention;

3 is a schematic configuration diagram of the LED lighting fixture shown in FIGS. 1 and 2;

4 is a cross-sectional view taken along line AA ′ of FIG. 3;

5 is a schematic operation state diagram of the LED lighting fixture according to the present invention.

<Description of Symbols for Main Parts of Drawings>

100: loading / unloading unit 200: alignment unit

300: main portion 310: washing treatment portion

320: lighting fixture 322: housing

324: circuit board 325: light emitting diode

326b: second space 327: gas supply member

328: exhaust member 400: utility part

420: chemical liquid circulation unit 500: working space

TECHNICAL FIELD The present invention relates to a semiconductor manufacturing apparatus and method, and more particularly, to a substrate cleaning apparatus and method for removing contaminants remaining on a substrate surface.

In general, as semiconductor devices become dense, highly integrated, and high-performance, microcirculation of circuit patterns proceeds rapidly, and contaminants such as particles, organic contaminants, and metal contaminants remaining on the surface of the substrate have a great effect on device characteristics and production yield. Will be affected. For this reason, the cleaning process for removing various contaminants adhering to the substrate surface is very important in the semiconductor manufacturing process, and the substrate cleaning process is performed at each step before and after each unit process of semiconductor manufacturing.

The cleaning method used in the present semiconductor manufacturing process includes dry cleaning to remove contaminants on the surface of the substrate in a gas state, and wet cleaning to remove contaminants by chemical dissolution by depositing the substrate in a chemical solution. It is largely divided into).

The wet station, a cleaning device used for wet cleaning during this cleaning process, allows the transfer of substrates between the baths and the bass filled with the processing chemicals (cleaning liquid, etching liquid, etc.) with the top surface open to allow the substrate to be deposited. Has a transport robot for it. In addition, a light fixture for illuminating the inside of the cleaning processing space equipped with the baths and the transfer robot is installed, and a light emitting diode (LED) is used as a light source of the light fixture.

By the way, a light fixture using a light emitting diode (LED) has the advantage that the power consumption is reduced, but excessive heat is generated because of the large amount of current required, if it does not dissipate it efficiently, the life of the light fixture is shortened or There was a problem such as a decrease in performance.

Therefore, the present invention was created to solve the problem in view of the problems of the lighting fixtures installed in the conventional conventional wet station as described above, the object of the present invention is to provide an LED that can efficiently dissipate heat in the lighting fixtures It is to provide a lighting apparatus, a substrate cleaning device and a cooling method of the LED lighting apparatus using the same.

In order to achieve the above object, the LED lighting apparatus according to the present invention comprises a housing provided with a hollow tubular member; A circuit board partitioning the inner space of the housing in a longitudinal direction and having a plurality of light emitting diodes connected to a front surface thereof; And a cooling unit circulating the cooling gas to the rear surface of the circuit board to discharge heat generated when the light emitting diode emits light to the outside.

In the LED lighting device according to the present invention having the configuration as described above, the cooling unit is connected to one side of the housing and the gas supply member for injecting cooling gas into the housing; And an exhaust member connected to the other side of the housing and discharging the cooling gas distributed in the housing to the outside.

In order to achieve the above object, the substrate cleaning apparatus according to the present invention includes: a substrate cleaning apparatus comprising: a cleaning processing unit for cleaning a substrate by sequentially loading / unloading the substrate into processing tanks filled with a chemical liquid; A lighting device installed inside the cleaning processing unit and irradiating light to the inner space thereof, wherein the lighting device comprises: a housing formed of a hollow tube member; A circuit board partitioning the inner space of the housing in a longitudinal direction and having a plurality of light emitting diodes connected to a front surface thereof; And a cooling unit circulating the cooling gas to the rear surface of the circuit board to discharge heat generated when the light emitting diode emits light to the outside.

In the substrate cleaning apparatus according to the present invention having the configuration as described above, the cooling unit is connected to one side of the housing and a gas supply member for injecting a cooling gas into the housing; And an exhaust member connected to the other side of the housing and discharging the cooling gas distributed in the housing to the outside.

In order to achieve the above object, a method of cooling an LED lighting device according to the present invention includes a method of cooling an LED lighting device having a plurality of light emitting diodes embedded therein, the cooling gas being directed to a rear surface of a circuit board to which the light emitting diodes are connected. It is characterized in that by discharging the heat generated when the light emitting diodes emit light to the outside of the LED lighting fixture.

Hereinafter, an LED lighting apparatus, a substrate cleaning apparatus, and a cooling method of the LED lighting apparatus using the same will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible, even if shown on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

(Example)

1 is a schematic plan view showing an example of a substrate cleaning apparatus according to the present invention, Figure 2 is a schematic side view of a substrate cleaning apparatus according to the present invention.

1 and 2, the substrate cleaning apparatus 10 according to the present embodiment includes a loading / unloading unit 100 in which a substrate carrier (not shown) is loaded or unloaded, and an alignment unit in which substrates are aligned. And a utility part 400 having a main part 300 through which substrates are cleaned, and a control panel (Power & Controller Box) for circulating chemicals for substrate cleaning and controlling equipment.

In the loading / unloading unit 100, a substrate carrier (not shown) in which a plurality of substrates are accommodated is loaded / unloaded, and the loading / unloading unit 100 is transported to a carrier carried to a cleaning process or to a next process. It will have a conventional configuration and function including a stocker in which carriers to be stored are stored in a standby state.

The alignment unit 200 aligns the substrates to match the cleaning process, and the aligned substrates are transferred to the main unit 300 for cleaning.

As shown in FIG. 2, the main part 300 includes cleaning processing parts 310 and 310 ′ disposed in a multilayer structure of an upper layer and a lower layer. Each of the cleaning treatment units 310 and 310 'is provided with a plurality of treatment tanks 312 and 312' filled with the chemical liquid, and transfer robots 314 and 314 'for transferring the substrate to the respective treatment tanks 312 and 312'. And, one side of the cleaning processing unit 310 is provided with a lighting device 320 for irradiating light to brighten the inner space.

The utility unit 400 is divided into upper and lower parts. In the upper part, a control panel (410) for controlling the overall equipment is installed, and in the lower part, the chemical liquid circulation units (420, 430) for cleaning the substrate in the respective treatment tanks (312, 312 ') are treated in the treatment tanks (312, 312'). It is installed to correspond to each. Each of the chemical liquid circulation units 420 and 430 may be detachably installed in the lower space of the utility unit 400. In addition, a work space 500 may be provided between the main part 300 and the utility part 400 to facilitate the maintenance work of the substrate cleaning apparatus 10.

3 is a schematic configuration diagram of the LED lighting apparatus illustrated in FIGS. 1 and 2, and FIG. 4 is a cross-sectional view taken along line AA ′ of FIG. 3.

3 and 4, the lighting fixture 320 includes a housing 322, a circuit board 324, and a cooling unit. The housing 322 of the lighting device 320 is provided as a hollow tube member, and both ends of the cap members 323a and 323b formed with a gas inlet (not shown) and an exhaust port (not shown) are coupled to each other. The housing 322 may be formed of a transparent material so that light emitted from the light emitting diode 325 to be described later may be efficiently transmitted. In the housing 322, a circuit board 324 having a partition shape for partitioning the inner space in the longitudinal direction is inserted. Accordingly, the internal space of the housing 322 is divided into a first space 326a formed on the front surface and a second space 326b formed on the rear surface of the housing 322. A plurality of light emitting diodes 325 are connected in a predetermined arrangement to the front surface of the circuit board 324 on the side of the first space 326a as a means for irradiating light. In addition, the second space 326b provides a movement passage of the cooling gas supplied into the housing 322 through a cooling unit to be described later.

When the light emitting diodes 325 connected to the circuit board 324 emit light, excessive heat may be generated in the housing 322, and a cooling unit for cooling the light emitting diodes 325 is connected to the housing 322. The cooling unit includes a gas supply member 327 for supplying cooling gas to the second space 326b in the housing 322, and an exhaust member 328 for discharging the cooling gas circulated through the second space 326b. Has The gas supply member 327 has a pipe connected to the gas inlet (not shown) of the cap member 323a so as to communicate with the second space 326b, and the exhaust member 328 has a cap so as to communicate with the second space 326b. It has a pipe connected to the exhaust port (not shown) of the member 323b. The piping of the gas supply member 327 is connected to a cooling gas supply source (not shown), and the piping of the exhaust member 328 is connected to a pump (not shown). Here, an inert gas such as nitrogen gas may be used as the cooling gas. With the above-described configuration, the cooling unit distributes the cooling gas to the second space 326b formed between the housing 322 and the rear surface of the circuit board 324 by driving the light emitting diode 325. The heat generated is discharged to the outside.

5 is a schematic operation state diagram of the LED lighting fixture according to the present invention.

Referring to FIG. 5, the cooling gas supplied from the gas supply source (not shown) flows into the second space 326b in the housing 322 through the pipe of the gas supply member 327. The cooling gas introduced into the second space 326b flows along the rear surface of the circuit board 324, and heat generated when the light emitting diodes 325 emit light is transferred to the cooling gas flowing along the rear surface of the circuit board 324. do. The cooling gas, to which the heat generation of the light emitting diodes 325 is transmitted, is exhausted from the second space 326b in the housing 326b through the pipe of the exhaust member 328.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

As described above, according to the present invention, heat in the lighting fixture can be dissipated efficiently.

In addition, according to the present invention, the effect of cost reduction can be obtained by extending the life of the lighting fixture and improving its performance.

Claims (5)

A housing provided with a hollow tubular member; A circuit board partitioning the inner space of the housing in a longitudinal direction and having a plurality of light emitting diodes connected to a front surface thereof; And a cooling unit circulating a cooling gas to a rear surface of the circuit board to discharge heat generated when the light emitting diode emits light to the outside. The method of claim 1, The cooling unit, A gas supply member connected to one side of the housing to inject cooling gas into the housing; And an exhaust member connected to the other side of the housing and discharging the cooling gas distributed in the housing to the outside. In the substrate cleaning apparatus, A cleaning processing unit which cleans the substrate by sequentially loading / unloading the substrate into the treatment tanks filled with the chemical liquid; Is installed inside the cleaning processing unit for illuminating the light to the inner space; including; The lighting fixture, A housing provided with a hollow tubular member; A circuit board partitioning the inner space of the housing in a longitudinal direction and having a plurality of light emitting diodes connected to a front surface thereof; And a cooling unit circulating a cooling gas to a rear surface of the circuit board to discharge heat generated when the light emitting diode emits light to the outside. The method of claim 3, wherein The cooling unit, A gas supply member connected to one side of the housing to inject cooling gas into the housing; And an exhaust member connected to the other side of the housing and discharging the cooling gas distributed in the housing to the outside. A method of cooling an LED lighting device having a plurality of light emitting diodes embedded therein, wherein the cooling gas is circulated to a rear surface of a circuit board to which the light emitting diodes are connected to heat heat generated when the light emitting diodes emit light. Cooling method of the LED lighting fixture, characterized in that the discharge.

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