KR100753185B1 - Manufacturing method of copper-clad aluminum conductor - Google Patents

Manufacturing method of copper-clad aluminum conductor Download PDF

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KR100753185B1
KR100753185B1 KR1020050135224A KR20050135224A KR100753185B1 KR 100753185 B1 KR100753185 B1 KR 100753185B1 KR 1020050135224 A KR1020050135224 A KR 1020050135224A KR 20050135224 A KR20050135224 A KR 20050135224A KR 100753185 B1 KR100753185 B1 KR 100753185B1
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aluminum
copper
conductor
clad
copper plate
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KR1020050135224A
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KR20070071603A (en
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신덕수
정원모
임완주
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영일특수금속 주식회사
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0036Heat treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02Temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/12Copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/24Aluminium

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  • Thermal Sciences (AREA)
  • Coating With Molten Metal (AREA)

Abstract

본 발명은 동 피복 알루미늄 도체의 제조방법에 관한 것으로, 그 목적은 일반적인 동부스바 및 동선의 전기적 특성을 나타내면서, 저렴한 생산비와 가벼운 중량을 가진, 중심부는 알루미늄으로 구성하고 알루미늄의 둘레는 동이 둘러싸고 있는 형상을 가진 도체의 제조방법을 제공하는 데 있다.The present invention relates to a method for manufacturing a copper-clad aluminum conductor, the purpose of which is to show the general electrical characteristics of the eastern wire and copper wire, having a low production cost and light weight, the center is composed of aluminum and the circumference of aluminum is surrounded by copper It is to provide a method of manufacturing a conductor having a.

본 발명의 구성은 동판의 내면을 세척하고, 알루미늄봉은 표면을 세척 후 피막처리하는 동판 세척 및 알루미늄 표면처리단계와; 이후 동판 또는 동파이프에에 알루미늄봉을 용접하거나 끼워 동과 알루미늄을 밀착시키는 인발단계와; 이후 인발된 동과 알루미늄을 열처리하여 알루미늄 표면의 피막층을 동쪽 계면으로 확산 접합시켜 접합면을 치밀하게 하는 열처리 단계와; 이 후 목표치수까지 냉간인발하는 단계로 이루어져 알루미늄과 동이 매우 치밀하게 접합된 동피복알루미늄 도체를 제조하는 방법을 특징으로 한다.The composition of the present invention is to wash the inner surface of the copper plate, the aluminum rod is a copper plate washing and aluminum surface treatment step of washing the surface after coating; After the drawing step of welding or sandwiching the aluminum rod on the copper plate or copper pipe to closely contact the copper and aluminum; A heat treatment step of heat-treating the drawn copper and aluminum to diffusely bond the coating layer on the surface of the aluminum to the east interface to make the bonding surface dense; After the cold drawing to the target dimension it is characterized by a method of manufacturing a copper-clad aluminum conductor bonded aluminum and copper very tightly.

동선, 동부스바, Zn,피막층, 인발, 압출 Copper wire, Eastern sub, Zn, coating layer, drawing, extrusion

Description

동 피복 알루미늄 도체의 제조방법{Manufacturing method of copper-clad aluminum conductor}Manufacturing method of copper-clad aluminum conductor

도 1은 기존 동부스바 사시도,1 is a perspective view of an existing Eastern sub bar,

도 2a는 본원 발명의 한 실시예의 제조단계를 보인 공정도,Figure 2a is a process diagram showing the manufacturing step of one embodiment of the present invention,

도 2b는 본원 발명의 또 다른 실시예의 제조단계를 보인 공정도,Figure 2b is a process diagram showing the manufacturing step of another embodiment of the present invention,

도 3a는 본원 발명의 한 실시예에 따른 동피복알루미늄 도체의 사시도,Figure 3a is a perspective view of a copper clad aluminum conductor according to an embodiment of the present invention,

도 3b는 본원 발명의 또 다른 실시에에 따른 동피복알루미늄 도체의 사시도,Figure 3b is a perspective view of a copper clad aluminum conductor according to another embodiment of the present invention,

도 4는 본원 발명에 따른 동피복알루미늄 도체의 단면도,4 is a sectional view of a copper clad aluminum conductor according to the present invention;

도 5는 본 발명에 따라 제조된 동피복알루미늄 도체의 구리피복율에 의한 도전율 도표,5 is a conductivity diagram according to the copper coating rate of the copper clad aluminum conductor prepared according to the present invention,

도 6은 본 발명에 따라 제조된 동피복알루미늄 도체의 단위중량당 길이비교 그래프이다.Figure 6 is a graph of the length comparison per unit weight of the copper-clad aluminum conductor prepared according to the present invention.

본 발명은 동 피복 알루미늄 도체의 제조방법에 관한 것으로, 자세하게는 각종 전기 및 전자 제품에 사용되는 동 와이어(wire)를 가격이 저렴하고, 가벼우면서도 전기도전율이 우수한 동피복알루미늄 도체의 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a copper clad aluminum conductor, and more particularly, to a method for manufacturing a copper clad aluminum conductor having a low cost, light weight, and excellent electrical conductivity for copper wire used in various electrical and electronic products. will be.

일반적으로 동 와이어(wire)는 배전반, 중전기, 변압기 등에서 대전류 송전을 위하여 구성되는 부스바 및 전기, 전자, 건축 등에서 케이블티비(CATV) 및 전화기(Telephone)용 와이어(wire), 건축용 와이어(wire), 산업용 와이어(wire), 전자부품(Electronic components), 트랜지스터(Transistors), 레지스터(Resistors), 커패시터(Capasitors) 등의 리드 와이어(Lead wire) 그리고 안테나 케이블(Antenna cable), 배터리 케이블(Battery cables), 동축케이블, 전선, 스프링, 정밀전선 등에 사용된다.In general, copper wires are busbars that are configured for high current transmission in switchboards, heavy electric appliances, transformers, etc., and wires for CATV, telephone, and construction wires in electrical, electronic, and construction. Lead wires such as industrial wires, electronic components, transistors, resistors, capacitors, antenna cables, battery cables It is used for coaxial cable, electric wire, spring and precision wire.

이러한 목적에 사용되는 종래 동부스바 및 동선이 도 1에 도시되어 있는데, 기존의 동부스바 및 동선은 구리의 우수한 도전율을 이용하여 그동안 배전반, 중전기, 변압기와 동축케이블, 안테나선, 전선에 사용되어 왔으나, 동으로만 이루어져 있기 때문에 높은 가격과 무거운 중량 때문에 설치 공사가 어렵고, 공사기간도 길어 경제성이 좋지 않았다는 문제점이 있다.The conventional eastern wire and copper wire used for this purpose is shown in FIG. Due to the high price and heavy weight, the installation work is difficult, and the construction period is also long, so the economic efficiency is not good.

이러한 문제점을 해결하고자 미국, 일본, 영국, 독일 등의 선진국에서는 이러한 단점이 있는 동부스바를 대체하여 경제적이고 특성이 우수한 소재를 개발하기 위하여 부단한 노력을 기울여왔다. In order to solve these problems, developed countries such as the United States, Japan, the United Kingdom, and Germany have made constant efforts to develop materials that are economical and have excellent properties instead of the eastern subva.

상기와 같은 문제점을 해결하기 위한 본 발명의 목적은 일반적인 동부스바 및 동선의 전기적 특성을 나타내면서, 저렴한 생산비와 가벼운 중량을 가진, 중심부는 알루미늄으로 구성하고 알루미늄의 둘레는 동이 둘러싸고 있는 형상을 가진 도체의 제조방법을 제공하는 데 있다.An object of the present invention for solving the above problems is to show the electrical characteristics of the general eastern wire and copper wire, having a low production cost and light weight, the center of the conductor consisting of aluminum and the circumference of the aluminum has a shape of copper It is to provide a manufacturing method.

상기한 바와 같은 목적을 달성하고 종래의 결점을 제거하기 위하여 과제를 수행하는 본 발명은 중심부를 알루미늄 재질을 사용하고 알루미늄 둘레를 동 재질이 둘러싸는 형상으로 동피복체를 형성하여 제조된 동피복알루미늄 도체를 그 특징으로 한다.The present invention to achieve the object as described above and to remove the drawbacks of the prior art is the copper-clad aluminum prepared by forming a copper clad body in the shape of the aluminum material around the center of the copper material surrounding the aluminum The conductor is characterized by that.

상기 동피복알루미늄 도체의 알루미늄 계면과 동 계면은 접합되어 이루어진다. The aluminum interface and the copper interface of the copper-clad aluminum conductor are joined.

또한 상기 알루미늄은 산화성이 매우 크고 알루미늄산화물은 강고하여 동과 확산 접합을 어렵게 하기 때문에 Zn으로 표면처리를 실시하여 알루미늄의 산화층을 제거하고 동과 접합이 잘 이루어지도록 하였다.In addition, since the aluminum is very oxidative and the aluminum oxide is strong to make copper and diffusion bonding difficult, surface treatment is performed with Zn to remove the oxide layer of aluminum and to bond with copper.

이하 본 발명의 실시 예인 구성과 그 작용을 첨부도면에 연계시켜 상세히 설 명하면 다음과 같다.Hereinafter, the configuration and the operation of the embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 2a는 본원 발명의 한 실시예의 제조단계를 보인 공정도인데, 이를 참조하여 본원 발명 동피복알루미늄 도체의 제조방법을 설명하면 다음과 같다.Figure 2a is a process chart showing a manufacturing step of an embodiment of the present invention, with reference to this description of the manufacturing method of the copper-clad aluminum conductor of the present invention.

도체인 동판과, 알루미늄봉재로 순알루미늄 빌렛을 준비하여 환봉상 및 부스바 형태로 압출 후, 동판 및 동관의 표면을 깨끗이 세척하고, 산화성이 큰 알루미늄봉은 알루미늄 표면을 세척 후 알루미늄과 동의 접착력을 높이기 위해서 진케이트(Zincate)처리를 실시하여 알루미늄 표면에 Zn피막을 생성시키는 동판 세척 및 알루미늄 표면처리단계와;Pure aluminum billet is prepared with copper plate and conductor bar of conductor, and extruded into round bar shape and busbar shape, and the surface of copper plate and copper tube is cleaned cleanly. A copper plate washing and aluminum surface treatment step of performing a Zincate treatment to produce a Zn film on the aluminum surface;

이후 동판 위에 알루미늄봉을 위치한 후, 다이스 앞쪽에서 알루미늄봉을 동판으로 감싼 다음 동판의 양끝부분을 불활성가스 텅스텐 아크용접(TIG), 레이저용접, 고주파 유도가열용접 중에서 선택된 하나의 방법으로 용접한 후 비드(Bead)를 바이트(Bite)로 절삭 제거하여 연결한 후 단면감소율 30%~60% 정도로 다이스를 통과시켜 동과 알루미늄을 밀착시키는 용접 및 인발단계와;After placing the aluminum rod on the copper plate, wrap the aluminum rod with the copper plate in front of the die, and then weld both ends of the copper plate by one of the following methods selected from inert gas tungsten arc welding (TIG), laser welding, and high frequency induction heating welding. A welding and drawing step of cutting (Bead) by cutting the bit into a bite and then connecting the aluminum and copper by passing the die at a section reduction rate of about 30% to 60%;

이후 무산화 분위기 전기로에서 420℃~540℃범위에서 열처리하여 알루미늄 표면의 Zn피막층을 동쪽 계면으로 확산 접합시켜 Zn피막의 효과로 알루미늄과 동의 접합면이 매우 치밀하게 하는 열처리 단계와;A heat treatment step of heat-treating the oxidized atmosphere in an electric furnace at 420 ° C. to 540 ° C. to diffuse-bond the Zn film layer on the surface of the aluminum to the east interface to make the bonding surface of aluminum and copper very dense by the effect of the Zn film;

이후 목표치수까지 냉간인발을 실시하여 알루미늄과 동이 매우 치밀하게 접합된 동피복알루미늄 도체를 제조하는 냉간인발단계로 이루어진다.After cold drawing to the target dimension is made of a cold drawing step for producing a copper clad aluminum conductor bonded aluminum and copper very tightly.

상기 진케이트(Zincate) 처리라 함은 ZnO+NaOH 용액을 가열한 후 알루미늄을 담그면 알루미늄 표면에 있는 Al2O3 산화피막이 제거되고 Zn가 표면에 씌워지는 것을 말한다.The Zincate treatment refers to the removal of Al 2 O 3 oxide film on the surface of aluminum and Zn coating on the surface when the aluminum is immersed after heating the ZnO + NaOH solution.

상기 냉간 인발시의 압출압력은 130~170kg/cm2 이다.The extrusion pressure during the cold drawing is 130 ~ 170kg / cm 2 .

상기 동판 세척 및 알루미늄 표면처리단계는 동판의 내면은 트리클로로에틸렌[trichloroethylene]으로 탈지처리 후 H2SO4(황산)5% 수용액에 상온에서 10~30분 침적하여 구리산화물을 제거하여) 세척하고, 산화성이 큰 알루미늄봉은 알루미늄 표면을 NaOH(가성소다) 10%~20%수용액에서 80~100℃로 5~20분 처리하여 수세한다.이와 같은 조건으로 수세처리하는 이유는 이러한 수치를 가지는 조건에서 수세 효과가 가장 좋기 때문이다.In the copper plate washing and aluminum surface treatment step, the inner surface of the copper plate was degreased with trichloroethylene, and then washed by dipping 10-30 minutes at room temperature in a 5% aqueous solution of H 2 SO 4 (sulfuric acid) to remove copper oxide). In the case of aluminum rods with high oxidizing properties, the surface of aluminum is washed with 10 ~ 20% aqueous solution of NaOH (caustic soda) at 80 ~ 100 ℃ for 5 ~ 20 minutes. This is because the washing effect is the best.

상기 동판 세척 및 알루미늄 표면처리단계에서 Zn으로 피막처리 공정을 거치는 이유는 알루미늄 산화층이 존재하게 되면 알루미늄과 동이 접합이 잘 되지 않을 뿐만 아니라 기계적 특성 및 도전율 등이 크게 저하되기 때문에 알루미늄 산화층은 제거하여 주고 동과의 접합력을 좋게 하기 위해 Zn피막처리를 실시한다.
구체적으로, 알루미늄 표면처리단계는 ZnO+NaOH 수용액을 80~100℃ 가열한 후 알루미늄을 담그면 알루미늄 표면에 있는 Al2O3 산화피막이 제거되고 Zn가 표면에 씌워지는 진케이트(Zincate) 처리하여 Zn 피막처리하는 단계이다.
여기서 ZnO+NaOH 수용액을 사용한 이유는 보통 진케이트 처리방법에 사용되는 수용액은 여러가지가 있지만 그 중에서 본 발명에 가장 좋은 진케이트 처리 효과를 나타낸 수용액은 ZnO+NaOH 수용액이기 때문이다. 즉, 이 수용액을 사용시 알루미늄에 피막되는 품질이 가장 좋았다. 또한 80~100℃로 한정한 이유는 이 온도 구간에서 가장 좋은 진케이트 처리 결과를 나타냈기 때문이다. 이 구간을 벗어난 온도 구간에서는 진케이트 처리 효율이 떨어지는 문제점이 발생하였다.
The reason why the film is treated with Zn in the copper plate cleaning and aluminum surface treatment step is that when the aluminum oxide layer is present, aluminum and copper are not easily bonded, and the aluminum oxide layer is removed because mechanical properties and conductivity are greatly reduced. Zn coating is performed to improve the bonding strength with copper.
Specifically, in the aluminum surface treatment step, the ZnO + NaOH aqueous solution is heated to 80 to 100 ° C., after which aluminum is immersed, the Al 2 O 3 oxide film on the aluminum surface is removed and a Zn coating is performed on a Zn coating on the surface. Processing step.
The reason why the aqueous solution of ZnO + NaOH is used here is that there are many aqueous solutions used in the ginate treatment method, but among them, the aqueous solution exhibiting the best ginate treatment effect in the present invention is an aqueous solution of ZnO + NaOH. In other words, the quality of the coating on aluminum was the best when using this aqueous solution. The reason for limiting the temperature to 80-100 ° C. is that it showed the best ginate treatment result in this temperature range. In the temperature section outside this section, there was a problem in that the jinkate treatment efficiency was inferior.

상기 열처리 온도를 420℃ ~ 540℃로 한정한 이유는 420℃ 이하로 열처리시 접합강도가 나쁘고 540℃ 이상으로 열처리시 구리와 알루미늄의 확산층이 성장하여 도전율과 기계적 성질을 나쁘게 하기에 수치 한정하였다.The reason for limiting the heat treatment temperature to 420 ° C. to 540 ° C. was limited to 420 ° C. or lower, so that the bonding strength was poor, and the diffusion layer of copper and aluminum grew during heat treatment above 540 ° C. to deteriorate the conductivity and mechanical properties.

상기 동판의 두께는 용도에 따라 동판의 두께를 달리하여 피복률 10%, 20%, 30% 중에서 선택되는 규격의 제품을 제조할 수 있다. 이와 같이 피복률 수치를 선택하여 제조하는 이유는 피복률이 10% 보다 작을 경우는 피복이 벗겨지는 문제점이 있고, 30% 보다 클 경우는 무게 증가로 인해 경량화가 어렵다는 문제점과, 또한 동판을 이용 조관작업시 두꺼운 두께로 인해 가공결함이 발생하여 품질 좋은 관을 제조키 어렵다는 문제점이 있기 때문이다.
상기 용접 및 인발단계에서 단면감소율을 30%~60% 정도로 다이스를 통과시켜 동과 알루미늄을 밀착시키도록 그 수치를 한정한 이유는 30% 보다 작으면 원하는 단면 직경을 위해서 여러번 작업해야 하는 문제점과 알루미늄과 동 재질간의 접합력이 저하된다는 문제점이 있기 때문이다. 또한 60% 보다 크면 가공경화로 재료의 뜯김현상이나 절단현상이 일어나기 때문이다.
The thickness of the copper plate may be manufactured by varying the thickness of the copper plate according to the use, the product of the standard selected from 10%, 20%, 30% coverage. The reason for selecting and manufacturing the coverage ratio is that the coating is peeled off when the coverage is less than 10%, and it is difficult to reduce the weight due to the weight increase when the coverage is less than 10%, and also the copper tube is used. This is because there is a problem that it is difficult to manufacture a quality pipe due to processing defects due to the thick thickness during operation.
In the welding and drawing step, the numerical value is limited so that copper and aluminum can be brought into close contact with the die by passing the die at a rate of 30% to 60%. This is because there is a problem that the bonding force between the copper materials is lowered. If it is larger than 60%, it may cause tearing or cutting of the material due to work hardening.

도 3a는 본원 발명에 따른 동피복알루미늄 도체의 사시도인데, 상기와 같은 단계를 거쳐 형성된 동선 및 동부스바를 보이고 있는데, 중심부는 알루미늄으로 구성하고 알루미늄의 둘레를 동이 둘러싸는 형상임을 알 수 있다. Figure 3a is a perspective view of a copper-clad aluminum conductor according to the present invention, showing the copper wire and the eastern bar formed through the above steps, it can be seen that the central portion is composed of aluminum and the copper surrounding the aluminum.

또한 이와 같이 알루미늄을 도체인 동으로 둘러싸기 위해 일측면에서 용접으로 접합한 것임을 도시하고 있다.In addition, in order to surround the aluminum in the copper, which is a conductor in this way, it is shown that the welded from one side.

도 2b는 본원 발명의 또 다른 실시예의 제조단계를 보인 공정도, 도 3b는 본원 발명의 또 다른 실시에에 따른 동피복알루미늄 도체의 사시도인데, 도 2a와 도 3a와 유사한 변형실시예로 서로 다른점은 동판 대신에 동파이프를 사용한 것이고, 이로 인해 알루미늄을 감싸고 그 일측면을 용접할 필요없이 직접 끼우면 되는 것으로 나머지 공정은 동일하다.Figure 2b is a process diagram showing a manufacturing step of another embodiment of the present invention, Figure 3b is a perspective view of a copper-clad aluminum conductor according to another embodiment of the present invention, a different modified embodiment similar to Figures 2a and 3a The point is that copper pipes are used instead of copper plates, and thus, aluminum is wrapped and directly inserted without welding one side thereof. The rest of the process is the same.

즉, 구체적 공정을 살펴보면 도체인 동파이프와, 알루미늄봉재로 순알루미늄 빌렛을 준비하여 압출 후 냉간인발하는 단계와; 이후 동파이프의 내면을 세척하고, 알루미늄봉은 표면을 세척 후 피막처리하는 동파이프 세척 및 알루미늄 표면처리단계와; 이후 동파이프에 알루미늄봉을 끼운 후, 다이스로 통과시켜 동과 알루미늄을 밀착시키는 알루미늄 끼움 및 인발단계와; 이후 인발된 동과 알루미늄을 열처리하여 알루미늄 표면의 피막층을 동쪽 계면으로 확산 접합시켜 접합면을 치밀하게 하는 열처리 단계와; 이 후 목표치수까지 냉간인발하는 단계로 이루어진다.That is, looking at the specific process step of preparing a pure aluminum billet with a copper pipe and an aluminum rod as a conductor and cold drawing after extrusion; Thereafter, the inner surface of the copper pipe is washed, and the aluminum rod is washed with copper and the surface is coated with copper pipe and aluminum surface treatment step; After inserting the aluminum rod in the copper pipe, the aluminum fitting and drawing step of adhering copper and aluminum by passing through a die; A heat treatment step of heat-treating the drawn copper and aluminum to diffusely bond the coating layer on the surface of the aluminum to the east interface to make the bonding surface dense; After this, cold drawing is made up to a target dimension.

도 4는 본원 발명에 따른 동피복알루미늄 도체의 단면도를 도시하고 있는데데, 외곽 둘레를 이루는 동판과 중심을 이루는 알루미늄봉 사이에 Zn층으로 피막 처리된 것임을 알 수 있다. Figure 4 shows a cross-sectional view of the copper-clad aluminum conductor according to the present invention, it can be seen that the film is coated with a Zn layer between the copper plate forming the outer periphery and the aluminum bar forming the center.

이하 본 발명의 바람직한 실시예이다.Hereinafter is a preferred embodiment of the present invention.

(실시예1)Example 1

도체인 동판(규격 폭 200mm×길이4,000mm)을 피복률 10%, 20%, 30% 되게 각각 두께 1.0mm, 2.25mm, 3.75mm를 준비하고, 알루미늄봉재(직경38mm)를 만들기 위해 순알루미늄 빌렛(규격 직경200mm×길이500mm)을 준비하여 130kg/cm2 의 압출압력으로 압출하고, Conductor copper plate (standard width 200mm x length 4,000mm) is prepared with thickness 1.0mm, 2.25mm, and 3.75mm to cover 10%, 20%, and 30% respectively, and pure aluminum billet to make aluminum bar (38mm in diameter). (Standard diameter 200mm × length 500mm) are prepared and extruded at an extrusion pressure of 130 kg / cm 2 ,

이후 동판의 표면을 깨끗이 트리클로로에틸렌[trichloroethylene]으로 탈지처리후 H2SO4(황산)5%수용액에 상온에서 10분 침적하여 구리산화물을 제거하여) 세척하고, 산화성이 큰 알루미늄봉은 알루미늄 표면을 NaOH(가성소다) 10%~20%수용액에서 80℃로 5분 처리하여 수세하고, 세척 후 알루미늄과 동의 접착력을 높이기 위해서 ZnO+NaOH 수용액을 80℃ 가열한 후 알루미늄을 담가 알루미늄 표면에 있는 Al2O3 산화피막이 제거되고 Zn가 표면에 씌워지는 Zincate 처리방법을 이용하여 Zn피막처리하고, After degreasing the surface of the copper plate with trichloroethylene, the solution is washed by dipping copper oxide by dipping for 10 minutes at room temperature in a 5% aqueous solution of H 2 SO 4 (sulfuric acid). NaOH (caustic soda) 10 minutes to 20% aqueous solution at 80 ℃ to wash the water, after washing ZnO + NaOH aqueous solution heated to 80 ℃ to increase the adhesive strength of aluminum and aluminum after immersed aluminum Al 2 on the aluminum surface Zn coating by using Zincate treatment method where O 3 oxide film is removed and Zn is coated on the surface.

이후 동판 위에 알루미늄봉을 위치한 후, 다이스 앞쪽에서 알루미늄봉을 동판으로 감싼 다음 동판의 양끝부분을 TIG(Tungsten insert gas weld) 용접하여 연결한 후 다이스로 통과시켜 인발하고,After placing the aluminum rod on the copper plate, wrap the aluminum rod with the copper plate in front of the die, and then connect the both ends of the copper plate by TIG (Tungsten insert gas weld) welding, and then pulled out through the die,

이후 420℃에서 열처리후 목표치수까지 냉간인발 및 신선(선재 및 봉재 직경1.0mm~직경 수십mm, 부스바 두께 2mm * 폭 50mm~ 두께 30mm * 폭 300mm 정도로 매우 다양한 규격의 제품 제조)을 실시하여 알루미늄과 동이 매우 치밀하게 접합된 동피복알루미늄 도체를 제조하였다.After the heat treatment at 420 ℃, cold drawing and drawing (wire and bar diameter 1.0mm ~ diameter of several tens of mm, busbar thickness 2mm * width 50mm ~ thickness 30mm * width 300mm) are manufactured to aluminum to the target dimension. Copper-clad aluminum conductors were fabricated in which copper and copper were very tightly bonded.

(실시예 2)(Example 2)

도체인 동파이프를 피복률 10%인 동피복알루미늄 도체를 만들기 위해 직경 40mm와 두께 1mm, 20%인 동피복알루미늄 도체를 만들기 위해 직경 42.5mm와 두께 2.25mm, 30%인 동피복알루미늄 도체를 만들기 위해 직경 45.5mm와 두께 3.75mm를 준비하고, 알루미늄봉재(직경38mm)를 만들기 위해 순알루미늄 빌렛(규격 직경200×길이500mm)을 준비하여 열간압출하고,To make copper-clad aluminum conductors of 40% in diameter and 1mm thick and 20% copper-clad aluminum conductors to make copper-clad aluminum conductors with 10% coverage, copper-clad aluminum conductors of 42.5mm in diameter and 2.25mm and 30% thick. 45.5mm in diameter and 3.75mm in thickness, prepare a pure aluminum billet (diameter 200 × length 500mm) to make aluminum bar (38mm in diameter), and hot-extrude

이후 동파이프의 내면을 깨끗이 트리클로로에틸렌(Trichloroethylene)로 탈지처리후 황산(H2SO4) 5% 수용액 상온에서 10분 침적하여 구리산화물을 제거하고, 산화성이 큰 알루미늄봉은 알루미늄 표면을 세척 후 알루미늄과 동의 접착력을 높이기 위해서 ZnO+NaOH 수용액을 100℃ 가열한 후 알루미늄을 담그면 알루미늄 표면에 있는 Al2O3 산화피막이 제거되고 Zn가 표면에 씌워지는 Zincate처리로 Zn피막처리 하고, 이후 동파이프 위에 알루미늄봉을 끼운 후, 다이스로 통과시켜 인발하고, 이후 420℃에서 열처리 후 목표치수까지 냉간인발을 실시하여 알루미늄과 동이 매우 치밀하게 접합된 동피막알루미늄 도체를 제조하였다.After degreasing the inner surface of the copper pipe with trichloroethylene, the copper oxide is removed by dipping 10 minutes at room temperature in a 5% aqueous solution of sulfuric acid (H 2 SO 4 ) to remove copper oxide. In order to increase the adhesion of copper, ZnO + NaOH aqueous solution is heated to 100 ℃ and aluminum is immersed to remove Al 2 O 3 oxide film on the aluminum surface and Zn coating by zincate treatment on which Zn is coated on the surface, and then aluminum on copper pipe After inserting the rod, it was drawn by passing through a die, and then cold drawn to a target dimension after heat treatment at 420 ° C. to prepare a copper-clad aluminum conductor in which aluminum and copper were very closely bonded.

도 5와 6에는 상기와 같이 본 발명에 따라 제조된 동피복알루미늄 도체의 구리피복율에 의한 도전율 및 단위중량당 길이비교 그래프가 도시되어 있는데, 도시된 바와 같이 순동으로 되었을 때와 피복되었을 때의 도전율이 심각한 결함이 있을 정도의 도전율 차이가 나지 않음을 알수 있고, 이에 비해 단위중량당 길이는 현저하게 길어졌음을 알 수 있어 본원 발명에 의한 제조비 저감효과가 큼을 알 수 있다.5 and 6 are graphs of the conductivity and length comparison per unit weight by copper coating rate of the copper-clad aluminum conductors prepared according to the present invention as described above, as shown in FIG. It can be seen that the electrical conductivity does not differ by the degree of serious defects. On the other hand, it can be seen that the length per unit weight is remarkably long, so that the effect of reducing the manufacturing cost according to the present invention is large.

본 발명은 상술한 특정의 바람직한 실시 예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형실시가 가능한 것은 물론이고, 그와 같은 변경은 청구범위 기재의 범위 내에 있게 된다. The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.

상기와 같은 본 발명 동피복알루미늄 도체는 중심체로 쓰이는 알루미늄봉과 동피복체가 하나가 되어 도체를 형성하므로 기존의 동부스바 및 동선을 대체할 수 있으면서도, 동보다 훨씬 저렴한 알루미늄을 쓰게 됨으로써 생산비를 저감할 수 있다는 효과와, 단위 길이당 중량 또한 기존의 동부스바 및 동선에 비해서 50%이상의 중량감소를 가져와 경량화가 가능하다는 효과와, 용도에 따라 동판 또는 동파이프의 두께를 달리하여 피복률 10%, 20%, 30% 등의 다양한 규격의 제품을 제조할 수 있다는 장점을 가진 유용한 발명으로 산업상 그 이용이 크게 기대되는 발명인 것이다.The copper-clad aluminum conductor of the present invention as described above can be replaced with the copper rod and the aluminum bar used as the center body to form a conductor, so that it is possible to replace the existing eastern sub bar and copper wire, and by using much cheaper aluminum than copper, the production cost can be reduced. In addition, the weight per unit length is reduced by more than 50% compared to the existing eastern bar and copper wire, which makes it possible to reduce the weight and the coating rate is 10% and 20% by varying the thickness of the copper plate or copper pipe according to the use. It is a useful invention having the advantage of being able to manufacture products of various specifications such as 30%, and is an invention which is expected to be greatly used in the industry.

Claims (8)

동판을 알루미늄과 밀착시켜 동 피복 알루미늄 도체를 제조하는 방법에 있어서,In a method of manufacturing a copper clad aluminum conductor by bringing the copper plate into close contact with aluminum, 동판의 표면을 세척하고, 알루미늄 표면을 가성소다 수용액으로 세척 후, ZnO+NaOH 수용액을 80~100℃ 가열한 후 알루미늄을 담가 알루미늄 표면에 있는 Al2O3 산화피막이 제거되고 Zn가 표면에 씌워지는 진케이트(Zincate) 피막처리하여 동판 세척 및 알루미늄 표면처리단계와;After washing the surface of the copper plate and the aluminum surface with an aqueous solution of caustic soda, heating the ZnO + NaOH aqueous solution at 80 ~ 100 ℃, immersing aluminum to remove the Al 2 O 3 oxide film on the aluminum surface, and Zn is covered on the surface. Zincate coating and copper plate washing and aluminum surface treatment step; 이후 동판 위에 알루미늄을 위치한 후, 다이스 앞쪽에서 알루미늄을 동판으로 감싼 다음 동판의 양끝부분을 불활성가스 텅스텐 아크용접(TIG), 레이저용접, 고주파 유도가열용접 중에서 선택된 하나의 방법으로 용접한 후 비드(Bead)를 바이트(Bite)로 절삭 제거하여 연결한 후 단면감소율 30%~60% 정도로 다이스를 통과시켜 동과 알루미늄을 밀착시키는 용접 및 인발단계와;After placing the aluminum on the copper plate, the aluminum is wrapped in the copper plate in front of the die, and both ends of the copper plate are welded by one of the following methods selected from inert gas tungsten arc welding (TIG), laser welding, and high frequency induction heating welding. Welding and drawing step of cutting and removing the wire with a bite and connecting copper and aluminum by passing the die through a die having a section reduction rate of about 30% to 60%; 이후 인발된 동과 알루미늄을 열처리하여 알루미늄 표면의 피막층을 동쪽 계면으로 확산 접합시켜 접합면을 치밀하게 하기 위해 무산화분위기 전기로에서 420℃ ~ 540℃로 열처리하는 단계와;Heat-treating the extracted copper and aluminum to heat-bond the film layer on the surface of the aluminum to the east interface to heat-treat at 420 ° C. to 540 ° C. in an oxidizing atmosphere-free electric furnace to densify the joint surface; 이후 목표치수까지 냉간인발하는 단계로 이루어져 알루미늄과 동이 매우 치밀하게 접합된 동피막알루미늄 도체를 제조하되, After the cold drawing to the target dimension to produce a copper-clad aluminum conductor in which aluminum and copper are very tightly bonded, 상기 알루미늄 둘레에 감기는 동판의 두께를 달리하여 피복률 10%, 20%, 30% 중에서 선택된 어느 하나의 피복률로 조절하여 생산하는 방법을 특징으로 하는 동 피복 알루미늄 도체의 제조방법.Method of producing a copper-clad aluminum conductor, characterized in that the production by adjusting the thickness of any one selected from 10%, 20%, 30% coverage by varying the thickness of the copper plate wound around the aluminum. 동파이프를 알루미늄과 밀착시켜 동 피복 알루미늄 도체를 제조하는 방법에 있어서,In the method of manufacturing a copper clad aluminum conductor by bringing a copper pipe into close contact with aluminum, 동파이프의 표면을 세척하고, 알루미늄 표면을 가성소다 수용액으로 세척 후, ZnO+NaOH 수용액을 80~100℃ 가열한 후 알루미늄을 담가 알루미늄 표면에 있는 Al2O3 산화피막이 제거되고 Zn가 표면에 씌워지는 진케이트(Zincate) 피막처리하여 동판 세척 및 알루미늄 표면처리단계와;After washing the surface of copper pipe and washing the aluminum surface with aqueous solution of caustic soda, heating ZnO + NaOH aqueous solution at 80 ~ 100 ℃, immersing aluminum to remove Al 2 O 3 oxide film on aluminum surface and cover Zn on the surface. Zincate coating and copper plate washing and aluminum surface treatment step; 이후 동파이프에 알루미늄을 끼운 후, 다이스로 통과시켜 동과 알루미늄을 밀착시키는 알루미늄 끼움 및 인발단계와;After inserting aluminum into the copper pipe, the aluminum fitting and drawing step to pass the copper and aluminum in close contact with the die; 이후 인발된 동과 알루미늄을 열처리하여 알루미늄 표면의 피막층을 동쪽 계면으로 확산 접합시켜 접합면을 치밀하게 하기 위해 무산화분위기 전기로에서 420℃ ~ 540℃로 열처리하는 단계와;Heat-treating the extracted copper and aluminum to heat-bond the film layer on the surface of the aluminum to the east interface to heat-treat at 420 ° C. to 540 ° C. in an oxidizing atmosphere-free electric furnace to densify the joint surface; 이 후 목표치수까지 냉간인발하는 단계로 이루어져 알루미늄과 동이 매우 치밀하게 접합된 동피막알루미늄 도체를 제조하되,After the cold drawing to the target dimension to produce a copper-clad aluminum conductor bonded aluminum and copper very closely, 상기 알루미늄 둘레에 끼워지는 동파이프의 두께를 달리하여 피복률 10%, 20%, 30% 중에서 선택된 어느 하나의 피복률로 조절하여 생산하는 것을 특징으로 하는 동 피복 알루미늄 도체의 제조방법.Method of producing a copper-clad aluminum conductor, characterized in that for producing by adjusting the thickness of any one selected from 10%, 20%, 30% coverage by varying the thickness of the copper pipe fitted around the aluminum. 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete 삭제delete
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