KR100744102B1 - Vacuum chucks for a spin coaters - Google Patents

Vacuum chucks for a spin coaters Download PDF

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Publication number
KR100744102B1
KR100744102B1 KR1020060033370A KR20060033370A KR100744102B1 KR 100744102 B1 KR100744102 B1 KR 100744102B1 KR 1020060033370 A KR1020060033370 A KR 1020060033370A KR 20060033370 A KR20060033370 A KR 20060033370A KR 100744102 B1 KR100744102 B1 KR 100744102B1
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South Korea
Prior art keywords
vacuum
vacuum suction
plate
auxiliary
wafer
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KR1020060033370A
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Korean (ko)
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이우선
고필주
김남훈
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조선대학교산학협력단
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A vacuum chuck for a spin coater is provided to suck a wafer by distributing vacuum and deposit various sizes of waves by using one vacuum chuck. A plate-type vacuum suction plate(20) is provided on a rotary plate(10) which is fixed to a shaft of a vacuum chuck. The vacuum suction plate has at least one vacuum port(22) at its center portion, and a pair of auxiliary vacuum suction ports(24) penetrating the plate. A vacuum adjusting plate(30) is installed in the rotary plate to open/close an auxiliary suction port(24) of the vacuum suction plate. The vacuum adjusting plate has an opening surface(32), a first closing surface and a second closing surface(36).

Description

스핀코터용 진공척{VACUUM CHUCKS FOR A SPIN COATERS}Vacuum chuck for spin coater {VACUUM CHUCKS FOR A SPIN COATERS}

도1은 본 발명에 의한 스핀코터용 진공척의 회전판을 보인 상태도,1 is a state diagram showing a rotating plate of a vacuum chuck for a spin coater according to the present invention;

도2는 본 발명에 의한 회전판의 단면도,2 is a cross-sectional view of the rotating plate according to the present invention;

도3a 내지 도3c는 본 발명에 의한 진공조절판의 동작에 따른 보조 진공흡입구의 개폐상태를 보인 상태도,Figure 3a to 3c is a state diagram showing the opening and closing state of the auxiliary vacuum inlet according to the operation of the vacuum control plate according to the present invention,

도4a는 종래의 스핀코터용 진공척의 회전판을 보인 상태도,Figure 4a is a state diagram showing a rotating plate of a vacuum chuck for a conventional spin coater,

도4b는 종래의 회전판을 보인 단면도.Figure 4b is a cross-sectional view showing a conventional rotating plate.

< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>

10: 회전판 11: 웨이퍼지지구10: rotating plate 11: wafer support

20: 진공흡입판 22: 진공흡입구20: vacuum suction plate 22: vacuum suction port

24: 보조 진공흡입구 30: 진공조절판24: auxiliary vacuum inlet 30: vacuum control plate

32: 개방면 34: 제1폐쇄면32: open face 34: first closed face

36: 제2폐쇄면36: second closing surface

본 발명은 스핀코터용 진공척에 관한 것으로, 보다 상세하게는 진공을 분산 시켜 흡착시킬 수 있을 뿐만 아니라 다양한 크기의 웨이퍼를 흡착시킨 후 증착시킬 수 있어 하나의 진공척으로 모든 크기의 웨이퍼를 증착시킬 수 있는 스핀코터용 진공척에 관한 것이다.The present invention relates to a vacuum chuck for a spin coater, and more particularly, it can not only disperse and adsorb the vacuum, but also adsorb and deposit wafers of various sizes to deposit wafers of all sizes with one vacuum chuck. And a vacuum chuck for a spin coater.

일반적으로 스핀코터에 장착되는 진공척은 도4a 및 도4b에 도시된 바와 같이, 중앙부분에 진공흡입구(120)가 형성된 회전판(100)으로 이루어지되, 상기 회전판(100)의 가장자리에 웨이퍼를 파지하기 위한 웨이퍼지지구(110)가 구비되며, 상기 회전판(100)에는 상기 진공흡입구(120)에 연결되게 진공라인(130)이 구비된다.In general, the vacuum chuck mounted on the spin coater is composed of a rotating plate 100 having a vacuum suction hole 120 formed at a central portion thereof, as shown in FIGS. 4A and 4B, and holding a wafer at an edge of the rotating plate 100. The wafer support 110 for the purpose is provided, the rotary plate 100 is provided with a vacuum line 130 to be connected to the vacuum suction port 120.

상기 진공라인(130)은 특정 크기 즉, 4인치, 6인치, 8인치 등의 웨이퍼 흡착을 위해 각각의 인치에 맞도록 구비된다.The vacuum line 130 is provided to fit each inch for the suction of a wafer of a specific size, that is, 4 inches, 6 inches, 8 inches, and the like.

상기의 진공척에 웨이퍼를 파지시켜 포토레지스트나 유기 폴리머의 졸, 겔상의 물질을 도포할 경우에는 먼저, 흡착하고자 하는 웨이퍼의 인치에 맞는 회전판(100)에 웨이퍼를 파지시켜 진공 흡착시킨 후 고속으로 회전시키고, 회전되는 상태로 웨이퍼 상에 액상의 포토레지스트나 유기 폴리머를 붓게 되면 웨이퍼상에 진공척의 원심력으로 얇은 막을 증착시키게 되는 것이다.When the wafer is held on the vacuum chuck to apply a sol or gel material of photoresist or organic polymer, first, the wafer is held on the rotating plate 100 corresponding to the inch of the wafer to be adsorbed and vacuum-adsorbed. By rotating and pouring a liquid photoresist or organic polymer onto the wafer, a thin film is deposited on the wafer by centrifugal force of a vacuum chuck.

그러나, 기존 스핀코터의 진공척은 웨이퍼의 흡착시 진공이 중앙에 집중됨에 따라 웨이퍼의 가장자리 부위의 변형 및 안전사고를 발생시키기 되는 요인이 되고, 4인치, 6인치, 8인치 등 고정된 크기의 웨이퍼만을 흡착시킨 후 증착시킬 수 밖에 없어 그 사용이 한정되어 있을 뿐만 아니라 고정된 크기의 웨이퍼를 증착시키는 경우 각각의 웨이퍼에 맞는 진공라인이 구비된 회전판을 사용하여야 하는 단점이 있으며, 이 경우 각각의 인치에 맞는 회전판을 별도로 제작함으로써 제작비용의 증가 를 가져오는 요인이 되고 있으며, 작은 크기의 소자나 칩에 사용하는 경우에는 각각의 소자나 칩의 크기에 따라 웨이퍼를 커팅하여 사용하여야 함으로써 증착된 물질에 의해 오염이 되는 단점이 있다.However, the vacuum chuck of the existing spin coater is a factor that causes deformation and safety accidents at the edges of the wafer as the vacuum is concentrated in the center of the wafer, and fixed sizes such as 4 inches, 6 inches, 8 inches, etc. It is not only limited to its use because it can only be deposited after adsorption of the wafer, and in the case of depositing a fixed size wafer, there is a disadvantage in that a rotating plate having a vacuum line suitable for each wafer must be used. The separate manufacturing of the rotating plate for the inch is a factor that increases the manufacturing cost, and in the case of using a small size device or chip, the material deposited by cutting the wafer according to the size of each device or chip There is a disadvantage that is contaminated by.

본 발명은 상기한 문제점을 해결하기 위하여 창안된 것으로, 본 발명의 목적은 진공을 분산시켜 흡착시킴과 아울러 다양한 크기의 웨이퍼를 흡착시킨 후 증착시킬 수 있어 하나의 회전판이 구비된 진공척으로도 모든 크기의 웨이퍼를 증착시킬 수 있어 경제성과 생산성을 향상시킬 수 있으며, 향상된 고정력으로 웨이퍼를 증착시킬 수 있어 제품의 내구성과 신뢰성을 향상시킬 수 있는 스핀코터용 진공척을 제공하는 데 있다.The present invention was devised to solve the above problems, and an object of the present invention is to disperse and adsorb a vacuum, and to adsorb and deposit wafers of various sizes, so that even a vacuum chuck with one rotating plate is provided. It is to provide a vacuum chuck for a spin coater that can deposit wafers of a size to improve economics and productivity, and to deposit wafers with improved fixing force to improve the durability and reliability of the product.

상기의 목적을 달성하기 위한 본 발명의 구성은, 웨이퍼를 흡착시켜 얇은 막을 증착시키도록 회전되는 스핀코터용 진공척에 있어서, 상기 진공척의 축에 고정된 회전판 상에 십자형으로 구비되되, 중앙부에 하나의 진공흡입구가 구비되고 상기 진공흡입구를 기준으로 상,하,좌,우에 일정 간격으로 관통된 한쌍의 보조 진공흡입구가 구비된 판상의 진공흡입판과; 상기 진공흡입판의 보조 진공흡입구를 개폐하도록 상기 회전판의 내부에 구비되는 진공조절판을 포함하여 구성된 것을 특징으로 한다.The configuration of the present invention for achieving the above object, in the vacuum chuck for a spin coater is rotated to adsorb a wafer to deposit a thin film, provided in a cross shape on a rotating plate fixed to the axis of the vacuum chuck, one in the center A vacuum suction plate having a plate-shaped vacuum suction plate provided with a pair of auxiliary vacuum suction holes penetrated at predetermined intervals on the basis of the vacuum suction hole; And a vacuum control plate provided inside the rotating plate to open and close the auxiliary vacuum suction port of the vacuum suction plate.

여기서, 상기 진공조절판은 상기 보조 진공흡입구를 순차적으로 개폐시키도록 4방향으로 개방면과 제1폐쇄면과 제2폐쇄면이 형성되고, 상기 개방면에 상기 진 공흡입판이 위치되는 경우 상기 보조 진공흡입구가 모두 개방되고, 상기 제1폐쇄면에 상기 진공흡입판이 위치되는 경우 상기 보조 진공흡입구 중 상기 진공흡입구에 근접된 보조 진공흡입구 만이 개방되며, 상기 제2폐쇄면에 상기 진공흡입판이 위치되는 경우 상기 보조 진공흡입구가 모두 폐쇄되도록 이루어진 것이 바람직하다.Here, the vacuum control plate is formed with an opening surface, a first closing surface and a second closing surface in four directions to sequentially open and close the auxiliary vacuum suction port, the auxiliary vacuum when the vacuum suction plate is located on the opening surface When the suction ports are all open and the vacuum suction plate is positioned on the first closing surface, only the auxiliary vacuum suction hole close to the vacuum suction opening of the auxiliary vacuum suction openings is opened, and when the vacuum suction plate is positioned on the second closing surface. Preferably, the auxiliary vacuum suction ports are all closed.

이하, 첨부된 도면을 참조하여 본 발명의 스핀코터용 진공척을 상세히 설명한다.Hereinafter, a vacuum chuck for a spin coater of the present invention will be described in detail with reference to the accompanying drawings.

도1은 본 발명에 의한 스핀코터용 진공척의 회전판을 보인 상태도이고, 도2는 본 발명에 의한 회전판의 단면도이며, 도3a 내지 도3c는 본 발명에 의한 진공조절판의 동작에 따른 보조 진공흡입구의 개폐상태를 보인 상태도이다.1 is a state diagram showing the rotating plate of the vacuum chuck for spin coater according to the present invention, Figure 2 is a cross-sectional view of the rotating plate according to the present invention, Figures 3a to 3c is an auxiliary vacuum suction port according to the operation of the vacuum control plate according to the present invention It is a state diagram showing the opening and closing state.

상기 도면에 도시된 바와 같이, 본 발명의 바람직한 실시예에 의한 스핀코터용 진공척은 웨이퍼를 흡착시켜 얇은 막을 증착시키도록 모터에 축결합되어 회전되는 회전판(10)과, 상기 회전판(10) 상에 십자형으로 구비되는 진공흡입판(20) 및 상기 회전판(10)의 내부에 구비되는 진공조절판(30)으로 구성된다.As shown in the figure, the vacuum coating chuck for a spin coater according to a preferred embodiment of the present invention is a rotary plate 10 is rotated axially coupled to the motor to adsorb a wafer to deposit a thin film, and on the rotary plate 10 It consists of a vacuum suction plate 20 provided in the cross shape and the vacuum control plate 30 provided inside the rotating plate 10.

상기 회전판(10)은 일정 직경을 갖는 원판형상으로 내부에 상기 진공조절판(30)이 구비되게 공간이 형성된다.The rotating plate 10 is formed in a disk shape having a predetermined diameter so that the space is provided with the vacuum control plate 30 therein.

여기서, 본 발명의 주요부 구성인 상기 진공흡입판(20)은 중앙부에 하나의 진공흡입구(22)가 관통되게 구비되고, 가장자리에 웨이퍼의 파지시 지지하기 위한 웨이퍼지지구(11)가 구비되며, 상기 진공흡입구(22)를 기준으로 상,하,좌,우에 일 정 간격으로 한쌍의 보조 진공흡입구(24)가 더 구비되되, 상기 보조 진공흡입구(24)는 2㎝ 간격으로 구비된 것이 바람직하다. Here, the vacuum suction plate 20, which is the main part of the present invention, is provided with a single vacuum suction port 22 penetrating through the center portion thereof, and a wafer support 11 for supporting the wafer at the edge thereof. On the basis of the vacuum suction port 22, a pair of auxiliary vacuum suction ports 24 are further provided at regular intervals on the upper, lower, left and right sides, and the auxiliary vacuum suction ports 24 are preferably provided at 2 cm intervals. .

또한, 상기 회전판(10)의 내부에 보조 진공흡입구(24)를 개폐하도록 진공조절판(30)이 구비된다.In addition, a vacuum control plate 30 is provided to open and close the auxiliary vacuum suction port 24 in the rotating plate 10.

따라서, 8인치 웨이퍼의 흡착시에는 종래의 중앙에서의 진공보다 흡착성을 높여 안정성을 보다 향상시킬 수 있게 되며, 8인치 이하의 웨이퍼는 상기 진공흡입구(24)에 의해 웨이퍼의 중앙부의 진공은 유지한 상태로 상기 진공조절판(30)에 의한 보조 진공흡입구(24)의 조절로 다양한 크기를 갖는 웨이퍼의 진공을 잡을 수 있게 된다.Therefore, when the 8-inch wafer is adsorbed, the adsorption property can be improved more than the conventional vacuum in the center, and stability can be further improved. The wafer of 8 inches or less is maintained by the vacuum suction opening 24 to maintain the vacuum at the center of the wafer. By controlling the auxiliary vacuum suction port 24 by the vacuum control plate 30 in a state, it is possible to catch the vacuum of the wafer having various sizes.

상기 보조 진공흡입구(24)를 개폐시키는 진공조절판(30)은 상기 보조 진공흡입구(24)를 순차적으로 개폐시키도록 4방향으로 개방면(32)과 제1폐쇄면(34)과 제2폐쇄면(36)으로 형성된다.The vacuum control plate 30 which opens and closes the auxiliary vacuum suction port 24 has an open surface 32, a first closing surface 34, and a second closing surface in four directions to sequentially open and close the auxiliary vacuum suction opening 24. It is formed of 36.

상기 개방면(32)에 상기 진공흡입판(20)이 위치되는 경우에는 도3a와 같이 상기 보조 진공흡입구(24)가 모두 개방되고, 상기 제1폐쇄면(34)에 상기 진공흡입판(20)이 위치되는 경우에는 도3b와 같이 상기 보조 진공흡입구(24) 중 상기 진공흡입구(22)에 근접된 보조 진공흡입구(24) 만이 개방되며, 상기 제2폐쇄면(36)에 상기 진공흡입판(20)이 위치되는 경우에는 도3c와 같이 상기 보조 진공흡입구(24)가 모두 폐쇄되어 진다.When the vacuum suction plate 20 is positioned on the open surface 32, all of the auxiliary vacuum suction ports 24 are opened as shown in FIG. 3A, and the vacuum suction plate 20 is opened on the first closing surface 34. ) Is positioned, only the auxiliary vacuum suction opening 24 adjacent to the vacuum suction opening 22 of the auxiliary vacuum suction opening 24 is opened as shown in FIG. 3B, and the vacuum suction plate is formed on the second closing surface 36. When the position 20 is located, all of the auxiliary vacuum suction ports 24 are closed as shown in FIG. 3C.

따라서, 종래의 4인치, 6인치, 8인치 등을 포함한 모든 크기의 웨이퍼를 진공 흡착하여 웨이퍼에 졸, 겔상의 박막을 증착할 수 있는 것이다.Therefore, by vacuum adsorption of wafers of all sizes, including conventional 4 inches, 6 inches, 8 inches, etc., it is possible to deposit a sol, gel-like thin film on the wafer.

상기와 같이 구성된 본 발명의 작용 및 효과를 진공조절판의 동작에 의거하여 살펴보기로 한다.The operation and effects of the present invention configured as described above will be described based on the operation of the vacuum control plate.

도3a에 도시된 바와 같이, 진공조절판(30)이 상기 진공흡입판(20)의 보조 진공흡입구(24)를 모두 개방한 상태에서는 8인치 웨이퍼를 진공 흡착시킨 후 회전시키면서 졸, 겔의 물질을 증착시키면 되고, 도3b에 도시된 바와 같이, 진공조절판(30)이 상기 보조 진공흡입구(24) 중 바깥쪽에 구비된 보조 진공흡입구(24)를 폐쇄시킨 상태에서는 6인치 또는 4인치 웨이퍼를 진공 흡착시킨 후 회전시키면서 증착시키면 되며, 도3c에 도시된 바와 같이, 진공조절판(30)이 상기 보조 진공흡입구(24)를 모두 폐쇄시킨 상태에서는 4인치 이하의 크기를 갖는 웨이퍼를 진공 흡착시킨 후 회전시키면서 증착시키면 된다.As shown in FIG. 3A, in the state in which the vacuum control plate 30 has opened all the auxiliary vacuum suction ports 24 of the vacuum suction plate 20, the 8-inch wafer is vacuum-adsorbed and rotated while sol and gel materials are rotated. As shown in FIG. 3B, the vacuum control plate 30 vacuum-adsorbs a 6-inch or 4-inch wafer in a state in which the auxiliary vacuum suction opening 24 provided at the outside of the auxiliary vacuum suction opening 24 is closed. 3C, the vacuum control plate 30 is vacuum-adsorbed and rotates a wafer having a size of 4 inches or less in a state in which the vacuum control plate 30 closes all of the auxiliary vacuum suction openings 24. What is necessary is to deposit.

따라서, 각각의 웨이퍼를 진공 흡착하기 위한 회전판을 구비하지 않고도 하나의 스핀코터 진공척에 구비된 회전판으로 웨이퍼의 크기에 상관없이 모든 크기의 웨이퍼를 진공 흡착시킨 후 증착할 수 있어 제작비용의 절감 등 경제성을 향상시킬 수 있게 된다.Therefore, it is possible to deposit all wafers of any size regardless of the size of the wafer with the rotating plate provided in one spin coater vacuum chuck without having to have a rotating plate for vacuum adsorption of each wafer. Economics can be improved.

상술한 바와 같이 본 발명에 따르면, 진공을 분산시켜 흡착시킬 수 있을 뿐만 아니라 다양한 크기의 웨이퍼를 흡착시킨 후 증착시킬 수 있어 하나의 진공척으로 모든 크기의 웨이퍼에 증착시킬 수 있어 경제성과 생산성을 향상시킬 수 있으며, 증착시 향상된 고정력으로 제품의 내구성과 신뢰성을 향상시킬 수 있는 장점이 있다.As described above, according to the present invention, not only the vacuum can be dispersed and adsorbed, but also the wafers of various sizes can be adsorbed and deposited, so that they can be deposited on wafers of all sizes with one vacuum chuck, thereby improving economic efficiency and productivity. It can be, and there is an advantage to improve the durability and reliability of the product with improved fixing force during deposition.

Claims (2)

웨이퍼를 흡착시켜 얇은 막을 증착시키도록 회전되는 스핀코터용 진공척에 있어서,In a vacuum coater for a spin coater rotated to adsorb a wafer to deposit a thin film, 상기 진공척의 축에 고정된 회전판(10)상에 십자형으로 구비되되, 중앙부에 하나의 진공흡입구(22)가 구비되고 상기 진공흡입구(22)를 기준으로 상,하,좌,우에 일정 간격으로 관통된 한쌍의 보조 진공흡입구(24)가 구비된 판상의 진공흡입판(20)과;It is provided in a cross shape on the rotating plate 10 fixed to the shaft of the vacuum chuck, one vacuum suction port 22 is provided in the center and penetrates at regular intervals on the upper, lower, left, and right sides of the vacuum suction port 22. A plate-shaped vacuum suction plate 20 provided with a pair of auxiliary vacuum suction ports 24; 상기 진공흡입판(20)의 보조 진공흡입구(24)를 개폐하도록 상기 회전판(10)의 내부에 구비되는 진공조절판(30)을 포함하여 구성된 것을 특징으로 하는 스핀코터용 진공척.And a vacuum control plate (30) provided inside the rotating plate (10) to open and close the auxiliary vacuum suction port (24) of the vacuum suction plate (20). 제1항에 있어서,The method of claim 1, 상기 진공조절판(30)은 상기 보조 진공흡입구(24)를 순차적으로 개폐시키도록 4방향으로 개방면(32)과 제1폐쇄면(34)과 제2폐쇄면(36)이 형성되고, 상기 개방면(32)에 상기 진공흡입판(20)이 위치되는 경우 상기 보조 진공흡입구(24)가 모두 개방되고, 상기 제1폐쇄면(34)에 상기 진공흡입판(20)이 위치되는 경우 상기 보조 진공흡입구(24) 중 상기 진공흡입구(22)에 근접된 보조 진공흡입구(24) 만이 개방되며, 상기 제2폐쇄면(36)에 상기 진공흡입판(20)이 위치되는 경우 상기 보조 진공 흡입구(24)가 모두 폐쇄되도록 이루어진 것을 특징으로 하는 스핀코터용 진공척.The vacuum control plate 30 is formed with an opening surface 32, a first closing surface 34 and a second closing surface 36 in four directions to sequentially open and close the auxiliary vacuum suction opening 24, When the vacuum suction plate 20 is positioned on the side 32, all of the auxiliary vacuum suction ports 24 are opened, and when the vacuum suction plate 20 is positioned on the first closing surface 34, the auxiliary vacuum suction plate 20 is positioned. Only the auxiliary vacuum suction opening 24 adjacent to the vacuum suction opening 22 of the vacuum suction opening 24 is opened, and when the vacuum suction plate 20 is positioned on the second closing surface 36, the auxiliary vacuum suction opening ( 24) The vacuum chuck for a spin coater, characterized in that all closed.
KR1020060033370A 2006-04-12 2006-04-12 Vacuum chucks for a spin coaters KR100744102B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101046685B1 (en) * 2008-12-22 2011-07-06 한국전자통신연구원 Vacuum Chuck and Spin Coater
KR101375144B1 (en) 2013-02-22 2014-03-17 호서대학교 산학협력단 Wafer-holder apparatus for spin coater
CN107738203A (en) * 2017-10-10 2018-02-27 赛而乐电器有限公司 The adsorption locating device fixed for Polywoven Bag
KR20190105987A (en) 2018-03-07 2019-09-18 주식회사 알피에스 A vaccum chuck for wafer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990074920A (en) * 1998-03-16 1999-10-05 윤종용 Spin Chuck Of Semiconductor Device

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
KR19990074920A (en) * 1998-03-16 1999-10-05 윤종용 Spin Chuck Of Semiconductor Device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101046685B1 (en) * 2008-12-22 2011-07-06 한국전자통신연구원 Vacuum Chuck and Spin Coater
KR101375144B1 (en) 2013-02-22 2014-03-17 호서대학교 산학협력단 Wafer-holder apparatus for spin coater
CN107738203A (en) * 2017-10-10 2018-02-27 赛而乐电器有限公司 The adsorption locating device fixed for Polywoven Bag
CN107738203B (en) * 2017-10-10 2019-06-28 青岛永丰高新包装制品有限公司 The adsorption locating device fixed for Polywoven Bag
KR20190105987A (en) 2018-03-07 2019-09-18 주식회사 알피에스 A vaccum chuck for wafer

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