JP6948889B2 - Board holding device - Google Patents

Description

The present invention relates to a substrate holding device, and more particularly to a substrate holding device used in a substrate processing device that supplies a processing liquid to a substrate.

Conventionally, a substrate processing apparatus has been proposed in which a processing liquid such as a chemical solution for etching is supplied to this substrate while rotating a substrate such as a semiconductor substrate on a horizontal plane. This substrate processing apparatus can perform processing based on the processing liquid on the substrate. The treatment includes, for example, a substrate cleaning treatment, an etching treatment, a rinsing treatment, and the like.

This substrate processing apparatus includes a substrate holding portion that holds the substrate in a horizontal plane, a rotating mechanism that rotates the substrate holding portion, and a processing liquid supply unit that supplies the processing liquid to the substrate.

The substrate holding portion includes a chuck base and a plurality of pins. The chuck base has a plate-like shape facing the back surface of the substrate, and a plurality of pins penetrate the chuck base in the vertical direction and project toward the substrate. The plurality of pins include a chuck pin and an elevating pin. Chuck pins and elevating pins are arranged alternately along the periphery of the substrate. The chuck pins can hold the peripheral edge of the substrate at each position. The elevating pin can be elevated in the vertical direction, and by raising the elevating pin, the peripheral edge of the substrate can be supported and the substrate can be lifted. With the elevating pin raised, an external board transfer robot can take out the board from the elevating pin or place it on the elevating pin.

The rotation mechanism rotates the substrate holding portion in order to rotate the substrate in a horizontal plane. The treatment liquid supply unit supplies the treatment liquid to the surface of the substrate.

Patent Document 1 is disclosed as a technique related to the present invention.

Japanese Patent No. 3824510

However, in the conventional substrate processing apparatus, the processing liquid may enter the gap between the chuck base and the pin during the supply of the processing liquid to the substrate. Since the pin penetrates the chuck base in the vertical direction, the processing liquid can flow out to the lower side (directly below) of the chuck base. Since a mechanism for rotating the chuck base or a mechanism for driving the pin is arranged below the chuck base, it is not preferable that the processing liquid flows out below the chuck base.

Therefore, an object of the present invention is to provide a substrate holding device capable of reducing the processing liquid flowing downward through the through hole through which the pin penetrates.

In order to solve the above problems, the first aspect of the substrate holding device according to the present invention is the substrate holding device used for the substrate processing device that supplies the processing liquid to the substrate, and the upper surface facing the back surface of the substrate is formed. A base member having a plurality of pin through holes extending in the vertical direction and opening on the upper surface thereof, and the base member penetrating the base member in the vertical direction through the plurality of pin through holes. and a plurality of pins contacting the substrate to protrude from the upper surface, wherein the side surface of the base member, said plurality of drainage ports, each communicating with a plurality of pin hole is formed, the plurality of pins Inside the through holes, a plurality of first sealing members provided in the gaps between the plurality of pins and the base member are further provided, and the plurality of pin through holes and the plurality of drainage ports are provided. When a plurality of holes communicating with each other are referred to as a plurality of drainage holes, the plurality of first seal members are a plurality of first connection ports for connecting the plurality of pin through holes and the plurality of drainage holes. The plurality of pins are located on the lower side with respect to each of the above, and include an elevating pin that elevates and descends along the vertical direction, and elevates and elevates the hole through which the elevating pin penetrates among the plurality of pin through holes. When the first seal member provided inside the elevating pin through hole is called an elevating seal member among the plurality of first seal members, the side surface of the base member is called a pin through hole. An exhaust port communicating with the through hole for the elevating pin is formed below the elevating seal member.

A second aspect of the substrate holding device according to the present invention is the substrate holding device according to the first aspect, which is provided in a gap between the elevating pin and the base member inside the through hole for the elevating pin. When the hole that further includes the second sealing member and communicates the exhaust port and the elevating pin through hole is called an exhaust hole, the second sealing member is for the exhaust hole and the elevating pin. It is located below the second connection port with the through hole.

A third aspect of the substrate holding device according to the present invention is the substrate holding device according to the first or second aspect, wherein the plurality of drainage ports are provided with respect to one of the plurality of pin through holes. Only one is formed.

A fourth aspect of the substrate holding device according to the present invention is the substrate holding device according to any one of the first to third aspects, wherein the plurality of drainage ports and the plurality of pin through holes are provided. When a plurality of holes communicating with each other are referred to as a plurality of drainage holes, the plurality of drainage holes expand as they approach the side surface of the substrate member.

A fifth aspect of the substrate holding device according to the present invention is the substrate holding device according to the fourth aspect, wherein the substrate member is predetermined around a rotation axis extending vertically through the center of the substrate. The first surface of each of the plurality of drainage holes, which rotates in the rotation direction and is opposite to the rotation direction, is the first surface opposite to the rotation direction with respect to the radial direction centered on the rotation axis. The second surface of each of the plurality of drainage holes on the rotation direction side is tilted at an angle, and is tilted toward the rotation direction side with respect to the radial direction at a second angle smaller than the first angle. There is.

A sixth aspect of the substrate holding device according to the present invention is the substrate holding device according to any one of the first to fifth aspects, in which the substrate member extends vertically through the center of the substrate. A plurality of holes that rotate around a rotation axis in a predetermined rotation direction and communicate with the plurality of drainage ports and the plurality of pin through holes are referred to as a plurality of drainage holes. Each of the holes extends from the plurality of pin through holes toward the side surface along a direction inclined from the radial direction centered on the rotation axis.

A seventh aspect of the substrate holding device according to the present invention is the substrate holding device according to any one of the first to sixth aspects, in which the substrate member extends vertically through the center of the substrate. It rotates around a rotation axis in a predetermined rotation direction, and a pair of protrusions are provided on the side surface of the base member, and the pair of protrusions raise and lower one of the plurality of drainage ports. Each is provided at a sandwiching position, and the distance between the pair of protrusions becomes narrower from the rotation direction side toward the opposite side of the rotation direction.

According to the first aspect of the substrate holding device according to the present invention, even if the treatment liquid enters the inside of the through hole for the pin from the upper surface of the base member, at least a part of the treatment liquid is discharged from the drain port of the base member. It can be discharged to the side. Therefore, it is possible to reduce the amount of the treatment liquid flowing out to the lower side (directly below) of the substrate member through the through hole for the pin.

In particular, when the substrate holding device is rotated by a predetermined rotating mechanism so that the substrate rotates in a horizontal plane, the treatment liquid inside the through hole for the pin easily receives centrifugal force and flows to the drain port side. Become. Therefore, the treatment liquid flowing downward through the through hole for the pin can be further reduced.

Further , since the first sealing member is provided inside the through hole for the pin, the processing liquid flowing out to the lower side of the base member through the through hole for the pin can be further reduced. Since the first seal member is located below the first connection port, the treatment liquid can be discharged mainly from the drainage port.

Further, when the elevating pin is lowered from the raised state, the gas above the upper surface of the substrate member may be drawn into the through hole for the elevating pin as the elevating pin descends. Since the gas above the upper surface of the substrate member contains a volatile component of the treatment liquid or a treatment liquid finely scattered by the supply of the treatment liquid to the substrate, this gas (treatment liquid atmosphere) flows out to the lower side of the base member. It is not preferable to do so.

By the way, during the ascending / descending of the elevating pin, the elevating pin may rub against the first sealing member, so that a gap may be formed between the first sealing member and the elevating pin.

The treatment liquid atmosphere drawn from the upper surface of the base member into the through hole for the elevating pin is mainly discharged from the drain port to the side of the base member, but if the treatment liquid atmosphere is being raised and lowered by the elevating pin. Even if it passes through the generated gap between the elevating pin and the first seal member, at least a part of the treatment liquid atmosphere can be discharged from the exhaust port to the side of the base member.

Therefore, it is possible to reduce the atmosphere of the processing liquid flowing out to the lower side of the substrate member through the through hole for the elevating pin.

According to the second aspect of the substrate holding device according to the present invention, since the second sealing member is provided, the atmosphere of the processing liquid flowing out to the lower side of the substrate member through the through hole for the elevating pin is further increased. Can be reduced. Since the second seal member is located below the second connection port, the treatment liquid atmosphere that has flowed out below the first seal member can be mainly discharged from the exhaust port.

According to the third aspect of the substrate holding device according to the present invention, the treatment liquid can be easily discharged from the liquid drain port. The reason is described below.

For comparison, consider a structure in which multiple drainage ports are formed for one pin through hole. In this structure, an air flow can be formed from one drainage port to another drainage port through the pin through hole. When an air flow flowing from a certain drainage port to the through hole for the pin is formed, it is difficult for the treatment liquid to be discharged from the drainage port. This is because an air flow is formed in the direction opposite to the flow of the treatment liquid toward the drain port.

According to the third aspect, the formation of the air flow can be avoided, and the treatment liquid can be appropriately discharged from the drain port.

According to the fourth aspect of the substrate holding device according to the present invention, the treatment liquid easily flows toward the drain port.

According to the fifth aspect of the substrate holding device according to the present invention, as the substrate member rotates, the gas in the vicinity of the side surface of the substrate member flows in the direction opposite to the rotation direction with respect to the side surface. Although this gas collides with the first surface of the drainage hole, since this first surface is inclined to the side opposite to the rotation direction, the gas goes toward the drainage port along the first surface of the drainage hole. Easy to flow. In other words, it is difficult for the gas to flow inside the drainage hole toward the pin through hole.

Further, the second surface of the drainage hole is inclined toward the rotation direction at a second angle smaller than the first angle. Therefore, the gas is less likely to flow toward the pin through hole along the second surface of the drainage hole than when the second angle is large.

As described above, it is difficult for the gas to flow inside the drainage hole toward the pin through hole. Therefore, the gas does not easily obstruct the flow of the treatment liquid.

According to the sixth aspect of the substrate holding device according to the present invention, it contributes to the discharge of the treatment liquid.

According to the seventh aspect of the substrate holding device according to the present invention, it is possible to improve the flow velocity of the gas flowing between the pair of protrusions along the side surface of the substrate member during the rotation of the substrate member. As a result, the treatment liquid is attracted to the negative pressure generated by the air flow, and is easily discharged from the liquid drain port of the substrate member.

It is a figure which shows typically an example of the structure of the substrate processing apparatus. It is a top view which shows typically an example of the structure of the substrate holding apparatus. It is a perspective view which shows an example of the structure of the base member schematicly. It is sectional drawing which shows typically an example of a part of the structure of the substrate holding apparatus. It is sectional drawing which shows typically an example of a part of the structure of the substrate holding apparatus. It is sectional drawing which shows typically an example of a part of the structure of the substrate holding apparatus. It is sectional drawing which shows typically an example of a part of the structure of the substrate holding apparatus which concerns on a comparative example. It is a top view which shows typically an example of a part of the structure of the substrate holding apparatus. It is a top view which shows typically an example of a part of the structure of the substrate holding apparatus. It is a top view which shows typically an example of a part of the structure of the substrate holding apparatus. It is a top view which shows typically an example of a part of the structure of the substrate holding apparatus which concerns on a comparative example. It is a top view which shows typically an example of a part of the structure of the substrate holding apparatus. It is a perspective view which shows typically an example of a part of the structure of the substrate holding apparatus.

Hereinafter, embodiments will be described in detail with reference to the drawings. Also, for the purpose of easy understanding, the dimensions and number of each part are exaggerated or simplified as necessary. In the drawings, parts having the same configuration and function are designated by the same reference numerals, and duplicate description will be omitted in the following description.

<Board processing equipment>
FIG. 1 is a diagram schematically showing an example of the configuration of the substrate processing apparatus 100. The substrate processing apparatus 100 is an apparatus that performs processing on the substrate W. The substrate W is, for example, a semiconductor substrate, which is a plate-shaped substrate having a circular shape in a plan view. However, the substrate W is not limited to this, and may be, for example, a substrate for a display panel such as a liquid crystal display, and may be a plate-shaped substrate having a rectangular shape in a plan view.

In the example of FIG. 1, the substrate processing device 100 includes a substrate holding device 1, a processing liquid supply unit 40, a cup 60, a housing 70, and a control unit 80.

The housing 70 forms a processing chamber for processing the substrate W. The housing 70 may also be called a chamber. The housing 70 is formed with a carry-in / out port (not shown) for carrying in / out the substrate W. Further, the housing 70 is provided with a shutter (not shown) for switching the opening and closing of the carry-in / out port.

A board transfer robot (not shown) is provided outside the board processing device 100, and the board transfer robot transfers the board W to and from the board processing device 100. Specifically, the board transfer robot carries in the board W from the outside to the inside of the housing 70 through the carry-in / out port with the shutter open, or carries out the board W from the inside of the housing 70 to the outside. Or

The board holding device 1 is provided inside the housing 70 and holds the board W horizontally. The configuration of the substrate holding device 1 will be described in detail later.

Inside the housing 70, a rotation mechanism 13 for rotating the substrate holding device 1 is provided. The rotation mechanism 13 has, for example, a motor, and is provided below the substrate holding device 1. The rotation mechanism 13 rotates the substrate holding device 1 with an axis extending in the vertical direction passing through the center of the substrate W as a rotation axis. As a result, the substrate W held by the substrate holding device 1 rotates in the horizontal plane about the rotation axis. The structure including the substrate holding device 1 and the rotating mechanism 13 can also be called a spin chuck.

The treatment liquid supply unit 40 supplies the treatment liquid to the surface of the substrate W. Thereby, the treatment based on the treatment liquid can be performed on the surface of the substrate W. The treatment solution is not particularly limited, and includes various chemical solutions and rinse solutions (cleaning solutions).

The processing liquid supply unit 40 includes a nozzle 41, a pipe 42, and an on-off valve 43. The nozzle 41 is arranged inside the housing 70 in a posture in which the discharge port 41a faces downward. The nozzle 41 is located above the substrate W held by the substrate holding device 1, and discharges the treatment liquid from the discharge port 41a to supply the treatment liquid to the surface of the substrate W. One end of the pipe 42 is connected to the nozzle 41, and the other end is connected to the processing liquid supply source 44. The on-off valve 43 is provided in the middle of the pipe 42. When the on-off valve 43 is opened, the processing liquid from the processing liquid supply source 44 flows inside the pipe 42 and is discharged from the discharge port 41a of the nozzle 41. Further, when the on-off valve 43 is closed, the discharge of the processing liquid from the discharge port 41a of the nozzle 41 is stopped.

The cup 60 has a substantially cylindrical shape (for example, a cylindrical shape), and is provided inside the housing 70 so as to surround the substrate holding device 1. The cup 60 has a side surface portion extending along the vertical direction and an eaves portion inclined inward from the upper end of the side surface portion toward the upper side. The treatment liquid (including the chemical liquid and pure water) scattered from the peripheral edge of the substrate W collides with the inner peripheral surface of the cup 60 and falls due to gravity. A collection port 71 for collecting the treatment liquid is formed on the lower surface of the housing 70 inside the cup 60, and the treatment liquid flows to the outside through the collection port 71.

The control unit 80 controls the entire substrate processing device 100. Specifically, the control unit 80 controls the rotation mechanism 13 and the on-off valve 43. Further, the control unit 80 can control the shutter provided in the housing 70.

The control unit 80 is an electronic circuit device, and may include, for example, a data processing device and a storage medium. The data processing device may be, for example, an arithmetic processing device such as a CPU (Central Processor Unit). The storage unit may have a non-temporary storage medium (for example, ROM (Read Only Memory) or hard disk) and a temporary storage medium (for example, RAM (Random Access Memory)). The non-temporary storage medium may store, for example, a program that defines the processing executed by the control unit 80. When the processing device executes this program, the control unit 80 can execute the processing specified in the program. Of course, a part or all of the processing executed by the control unit 80 may be executed by the hardware.

The control unit 80 opens the on-off valve 43 in a state where the rotation mechanism 13 is controlled to rotate the substrate holding device 1 and the substrate W held by the substrate holding device 1. As a result, the processing liquid discharged from the discharge port 41a of the nozzle 41 lands on the surface of the substrate W, receives centrifugal force, spreads on the surface of the substrate W, and is scattered from the peripheral edge of the substrate W to the cup 60. ..

By supplying the treatment liquid to the entire surface of the substrate W in this way, the treatment based on the treatment liquid is performed on the substrate W. For example, when the treatment solution is a chemical solution for etching, the surface of the substrate W on which the resist pattern is formed is appropriately etched. Further, for example, when the treatment solution is a chemical solution for removing a resist, the resist pattern is removed from the surface of the substrate W on which the resist pattern is formed.

<Board holding device>
FIG. 2 is a plan view schematically showing an example of the configuration of the substrate holding device 1, and FIG. 3 is a perspective view schematically showing an example of the configuration of the substrate member 10 of the substrate holding device 1. FIG. FIG. 6 is a cross-sectional view showing an example of the configuration of the peripheral portion of the substrate holding device 1.

The substrate holding device 1 includes a substrate member 10 and a plurality of pins 20. The base member 10 has an upper surface 10a. The substrate member 10 is arranged inside the housing 70 in a posture in which the upper surface 10a thereof is substantially parallel to the horizontal plane. The upper surface 10a of the substrate member 10 faces the back surface of the substrate W. A plurality of pin through holes 12 are formed in the substrate member 10. The plurality of pin through holes 12 penetrate the base member 10 along the vertical direction and open on the upper surface 10a. In the example of FIG. 3, the substrate member 10 is schematically shown in a cylindrical shape. The through holes 12 for each pin extend along the vertical direction, and both ends thereof are opened on the upper surface 10a and the lower surface of the base member 10, respectively. Although the base member 10 is schematically shown in a cylindrical shape in the example of FIG. 3, even if the base member 10 has an upper surface portion 101 and a side surface portion 102 with reference to FIGS. 4 to 6. good. The upper surface portion 101 has, for example, a substantially disk-like shape, and the side surface portion 102 extends downward from the peripheral edge thereof. The side surface portion 102 is provided over the entire circumference. The upper surface 10a is the upper surface of the upper surface portion 101.

In the example of FIG. 2, the plurality of pin through holes 12 are arranged at intervals along the peripheral edge of the substrate W in a plan view. In FIG. 2, the substrate W is shown by a virtual line. Here, since the substrate W has a circular shape in a plan view, the plurality of pin through holes 12 are arranged at intervals along the circle. The plurality of pin through holes 12 are formed at positions at substantially equal intervals in the circumferential direction with respect to the substrate W. In the following, the circumferential direction and the radial direction of the substrate W are simply referred to as the circumferential direction and the radial direction, respectively. Further, the radial outer side and the radial inner side referred to below mean the radial outer side and the inner side of the substrate W, respectively. It can be said that the circumferential direction and the radial direction are the circumferential direction and the radial direction with respect to the rotation axis of the substrate W, respectively.

Each of the plurality of pins 20 penetrates the plurality of pin through holes 12, and a part of each pin 20 projects upward from the upper surface 10a so that the pin 20 can come into contact with the substrate W. In the examples of FIGS. 2 and 4 to 6, the pin 20 has a columnar main body 32 and a protrusion 34 protruding upward from the upper end of the main body 32. The pin through hole 12 has a columnar shape, its cross section in a plan view is slightly larger than the cross section of the main body 32 of the pin 20, and the main body 32 of the pin 20 penetrates the pin through hole 12. doing.

The plurality of pins 20 are classified into a rotating pin 20A and an elevating pin 20B. In the example of FIG. 2, eight pins 20 are provided, and the eight pins 20 are classified into four rotating pins 20A and four elevating pins 20B. In the example of FIG. 2, the rotating pin 20A and the elevating pin 20B are alternately arranged along the circumferential direction. Therefore, here, the four rotating pins 20A are arranged at substantially equal intervals along the circumferential direction, and the four elevating pins 20B are arranged at substantially equal intervals along the circumferential direction. In the following, among the pin through holes 12, the pin through holes penetrated by the rotating pin 20A are also referred to as the rotating pin through holes 12A, and among the pin through holes 12, the pin through holes penetrated by the elevating pin 20B are also referred to. The hole is also referred to as a through hole 12B for an elevating pin.

As shown in FIG. 4, the substrate holding device 1 includes a rotating mechanism 2A. The rotation mechanism 2A rotates the rotation pin 20A with the central axis of the main body 32 of the rotation pin 20A as the rotation axis. The rotating mechanism 2A has, for example, a motor. The rotating mechanism 2A is provided below the rotating pin 20A, and at least a part of the rotating mechanism 2A faces the rotating pin 20A in the vertical direction. Further, in the example of FIG. 4, the rotation mechanism 2A is arranged radially inside the side surface portion 102 of the base member 10, and faces the side surface portion 102 in the radial direction.

The protrusion 34 of the rotation pin 20A is provided at a position deviated from the central axis of the main body 32 in a plan view (see also FIG. 2), and the protrusion 34 is centered by the rotation of the rotation pin 20A. It moves along an arc centered on the axis. The rotation mechanism 2A rotates the rotation pin 20A so that the protrusion 34 is in contact with the side surface of the substrate W (FIG. 2) and the protrusion 34 is separated from the side surface of the substrate W. You can switch. The substrate W is held by the substrate holding device 1 by abutting the protrusions 34 of the plurality of (four in this case) rotating pins 20A on the side surfaces of the substrate W. Further, when all the protrusions 34 of the rotating pins 20A are separated from the side surface of the substrate W, the holding of the substrate W is released. In order to hold the substrate W, three or more rotating pins 20A may be provided.

As shown in FIGS. 5 and 6, the substrate holding device 1 includes an elevating mechanism 2B. The elevating mechanism 2B reciprocates the elevating pin 20B along the vertical direction. The elevating mechanism 2B has, for example, an air cylinder or a uniaxial stage. The elevating mechanism 2B is provided below the elevating pin 20B, and at least a part of the elevating mechanism 2B may face the elevating pin 20B in the vertical direction. Further, in the examples of FIGS. 5 and 6, the elevating mechanism 2B is arranged radially inside the side surface portion 102 of the base member 10 and faces the side surface portion 102 in the radial direction.

Further, a connecting member 103 for connecting a plurality of (here, four) lifting pins 20B may be provided. The connecting member 103 has, for example, a plate shape, and is arranged in a posture in which the thickness direction thereof is along the vertical direction. The connecting member 103 is located below the upper surface portion 101. As a result, the plurality of elevating pins 20B can be easily interlocked. More specifically, for example, a single elevating mechanism 2B can elevate and elevate a plurality of elevating pins 20B at the same time by the same degree. The connecting member 103 may not be provided. In this case, a plurality of elevating mechanisms 2B may be provided corresponding to the plurality of elevating pins 20B.

Next, the operation of the pin 20 at the time of delivery of the substrate W will be described. First, the elevating mechanism 2B raises a plurality of elevating pins 20B. Here, four elevating pins 20B arranged at substantially equal intervals in the circumferential direction rise (see also FIG. 6). At this time, the height positions of the upper ends of the plurality of elevating pins 20B are almost the same. Next, the external board transfer robot moves the hand on which the board W is placed to the upper side of the board holding device 1, and subsequently moves the hand to the lower side. In the process of moving the hand downward, the substrate W is placed on the upper end of the elevating pin 20B, and the hand moves downward as it is. In this state, the upper end portions of the main body portions 32 of the plurality of elevating pins 20B support the peripheral edge of the substrate W. It is sufficient that three or more elevating pins 20B are provided for supporting the substrate W.

The protrusion 34 of the elevating pin 20B faces the side surface of the substrate W, and can function as a positioning member for determining the horizontal position of the substrate W. Further, since the height positions of the upper ends of the plurality of elevating pins 20B are almost the same, the substrate W is supported horizontally.

Then, the substrate transfer robot pulls out the hand from between the substrate W and the upper surface 10a of the substrate member 10. Next, the elevating mechanism 2B lowers a plurality of elevating pins 20B in order to lower the substrate W in a horizontal posture. Thereby, the distance between the substrate W and the upper surface 10a of the substrate member 10 can be reduced. The elevating mechanism 2B stops the elevating pin 20B at a position where the substrate W faces the protrusion 34 of the rotating pin 20A. At this time, the side surface of the substrate W faces the protrusion 34 of the rotating pin 20A at a distance.

In this state, the rotation mechanism 2A rotates the rotation pin 20A to bring the protrusion 34 into contact with the side surface of the substrate W. As a result, the substrate W is horizontally held by the substrate holding device 1. The elevating mechanism 2B may further lower the elevating pin 20B.

With reference to FIGS. 2 and 3, a plurality of drainage ports 14a communicating with the plurality of pin through holes 12 are formed on the side surface 10b of the base member 10. The side surface 10b is a surface extending downward from the peripheral edge of the upper surface 10a, and is located radially outside the plurality of pin through holes 12. The side surface 10b has a circular shape having a diameter larger than that of the substrate W in a plan view. In the example of FIG. 2, eight drainage ports 14a communicating with the eight pin through holes 12 are formed on the side surface 10b of the base member 10. These plurality of drainage ports 14a are separated from each other in the circumferential direction.

Hereinafter, the hole communicating the drainage port 14a and the through hole 12 for the pin is also referred to as the drainage hole 14. The drainage port 14a, which is one end of the drainage hole 14, opens on the side surface 10b of the base member 10, and the other end communicates with the corresponding pin through hole 12. Hereinafter, the other end of the drainage hole 14 is also referred to as a connection port 14b. The connection port 14b is a connection port for connecting the drainage hole 14 and the pin through hole 12, and is formed on the radial outer portion of the surface forming the pin through hole 12. That is, the drainage holes 14 are connected at the radial outer portion of the pin through holes 12. The drainage hole 14 extends radially outward from the connection port 14b and reaches the drainage port 14a. In the example of FIG. 2, since the drainage hole 14 extends along the radial direction, the drainage port 14a is formed at a position facing the connection port 14b belonging to the same drainage hole 14 in the radial direction. Further, in the example of FIG. 3, the drainage hole 14 has a cylindrical shape. Therefore, the drainage port 14a and the connection port 14b have a circular shape when viewed along the radial direction.

In the examples of FIGS. 4 to 6, the substrate holding device 1 is provided with a sealing member 50. The sealing member 50 is provided inside the pin through hole 12. Since eight pin through holes 12 are formed here, eight sealing members 50 are provided. The sealing member 50 is formed of, for example, an elastic material. More specifically, the sealing member 50 is an O-ring and is made of an elastic resin such as rubber. The sealing member 50 is provided in an annular gap between the pin 20 and the base member 10 inside the corresponding pin through hole 12. The sealing member 50 is provided below the connection port 14b between the corresponding pin through hole 12 and the drainage hole 14. The sealing member 50 ideally seals the pin through hole 12.

Hereinafter, the sealing member 50 provided inside the elevating pin through hole 12B is also referred to as an elevating seal member 50B.

In the example of FIG. 3, an exhaust port 16a communicating with the through hole 12B for the elevating pin is further formed on the side surface 10b of the base member 10. Here, since the four elevating pin through holes 12B are formed, the four exhaust ports 16a are formed on the side surface 10b of the base member 10. These exhaust ports 16a are separated from each other in the circumferential direction. Hereinafter, the hole that communicates the exhaust port 16a and the through hole 12B for the elevating pin is also referred to as the exhaust hole 16. The exhaust hole 16 is formed below the drain hole 14 communicating with the same elevating pin through hole 12B. Therefore, the exhaust port 16a is formed below the drainage port 14a communicating with the same elevating pin through hole 12B.

The exhaust port 16a, which is one end of the exhaust hole 16, opens on the side surface 10b of the base member 10, and the other end communicates with the corresponding through hole 12B for the elevating pin. Hereinafter, the other end of the exhaust hole 16 is also referred to as a connection port 16b. The connection port 16b is a connection port for connecting the exhaust hole 16 and the through hole 12B for the elevating pin, and is formed, for example, on the outer portion in the radial direction of the surface forming the through hole 12B for the elevating pin. That is, the exhaust hole 16 is connected at the radial outer portion of the elevating pin through hole 12B. The connection port 16b is formed below the elevating seal member 50B provided in the same elevating pin through hole 12B (see also FIG. 5). That is, the exhaust port 16a communicates with the elevating pin through hole 12B below the elevating seal member 50B.

The exhaust hole 16 extends radially outward from the connection port 16b and reaches the exhaust port 16a. The exhaust holes 16 extend, for example, along the radial direction. Therefore, the exhaust port 16a is formed at a position facing the connection port 16b belonging to the same exhaust hole 16 in the radial direction. Further, in the example of FIG. 3, the exhaust hole 16 has a cylindrical shape. Therefore, the exhaust port 16a and the connection port 16b have a circular shape when viewed along the radial direction.

In the examples of FIGS. 5 and 6, the substrate holding device 1 is provided with a sealing member 52. The sealing member 52 is provided inside the through hole 12B for the elevating pin. Here, since the four elevating pin through holes 12B are formed, the four sealing members 52 are provided. The sealing member 52 is formed of, for example, an elastic material. More specifically, the sealing member 52 is, for example, an O-ring and is formed of an elastic resin such as rubber. The sealing member 52 is provided in an annular gap between the elevating pin 20B and the base member 10 inside the corresponding elevating pin through hole 12B. Further, the sealing member 52 is provided below the connection port 16b between the corresponding elevating pin through hole 12B and the exhaust hole 16. The sealing member 52 ideally seals the elevating pin through hole 12B.

Further, the sealing member 52 is provided below the reference position described below. In explaining this reference position, the elevating and lowering of the elevating pin 20B will be described. When the elevating pin 20B is raised, the elevating pin 20B projects upward from the upper surface 10a of the base member 10 with a relatively large amount of protrusion (see also FIG. 6). The lower limit position of the portion 322 where the elevating pin 20B is exposed on the upper side of the base member 10 in this state is called the lower limit position H1. This lower limit position H1 descends as the elevating pin 20B descends (see also FIG. 5). The reference position is the lower limit position H1 in a state where the elevating pin 20B is lowered. That is, the sealing member 52 is provided below the portion 322 of the elevating pin 20B that can project toward the substrate W side.

In the example of FIG. 5, the elevating seal member 50B is provided above the lower limit position H1 (the reference position) in the state where the elevating pin 20B is lowered. Therefore, the drainage hole 14 communicating with the elevating pin through hole 12B is also formed above the reference position.

<Supply of processing liquid to the substrate>
Next, the flow of the processing liquid when supplying the processing liquid to the substrate W will be described. The processing liquid is discharged to the surface of the substrate W from the discharge port 41a of the nozzle 41 in a state where the substrate holding device 1 holding the substrate W is rotated by the rotation mechanism 13. This treatment liquid receives centrifugal force on the surface of the substrate W and spreads, and is scattered from the peripheral edge of the substrate W. As illustrated in FIG. 2, since a part of the pin through hole 12 of the substrate member 10 is located radially outside the peripheral edge of the substrate W, the processing liquid scattered from the peripheral edge of the substrate W penetrates the pin. It can enter the inside of the hole 12. That is, the treatment liquid can enter the gap between the pin 20 and the base member 10 in the pin through hole 12.

In the substrate processing apparatus 100 of FIG. 1, the processing liquid supply unit 40 supplies the processing liquid to the front surface of the substrate W, but the processing liquid supply unit that supplies the processing liquid to the back surface of the substrate W is supplied to the substrate processing apparatus 100. It may be provided. Even in this case, the processing liquid is supplied in a state where the substrate W is rotated. The treatment liquid supplied to the back surface of the substrate W receives centrifugal force and scatters radially outward from the peripheral edge of the substrate W. Even in this case, the treatment liquid can enter the inside of the pin through hole 12.

However, the base member 10 is formed with a drainage hole 14 extending radially outward from the pin through hole 12 and opening on the side surface 10b. Then, the treatment liquid that has entered the inside of the through hole 12 for the pin receives centrifugal force and flows outward in the radial direction, so that the treatment liquid flows outward in the radial direction from the through hole 12 for the pin to the inside of the drainage hole 14. It is easy to flow, and it is easy to be discharged from the drainage port 14a to the side (cup 60 side) of the base member 10. Therefore, it is possible to reduce the amount of processing liquid flowing below the upper surface portion 101 of the substrate member 10 through the pin through hole 12. Therefore, it is possible to prevent the processing liquid from flowing out to the rotation mechanism 2A or the elevating mechanism 2B located below the pin through hole 12.

Further, as illustrated in FIGS. 4 to 6, when the substrate holding device 1 is provided with the sealing member 50, the processing liquid that has entered the inside of the pin through hole 12 is dammed by the sealing member 50. Therefore, the processing liquid flowing below the sealing member 50 can be further reduced. Ideally, the processing liquid flowing below the sealing member 50 can be eliminated. According to this, the rotation mechanism 2A and the elevating mechanism 2B can be protected from the processing liquid.

In this way, the treatment liquid does not easily flow out to the lower side of the base member 10 (specifically, the upper surface portion 101) through the pin through hole 12, so that the space below the upper surface portion 101 of the base member 10 (specifically, the upper surface portion 101). For example, the space between the upper surface portion 101 and the connecting member 103) is unlikely to have a processing liquid atmosphere. The treatment liquid atmosphere referred to here refers to a gas containing a volatile component of the treatment liquid, a gas containing finely scattered treatment liquid, and the like.

The treatment liquid dammed by the sealing member 50 flows inside the drainage hole 14 and is discharged from the drainage port 14a to the side of the base member 10. Therefore, it is possible to prevent the treatment liquid from accumulating inside the pin through hole 12.

<Delivery of board>
When the substrate W is passed between the substrate holding device 1 and the substrate transfer robot, the elevating pin 20B is raised (see also FIG. 6). By the subsequent lowering of the elevating pin 20B, the gas (treatment liquid atmosphere) above the upper surface 10a of the base member 10 can be drawn into the inside of the elevating pin through hole 12B. However, since the base member 10 is formed with the drainage hole 14, at least a part of the treatment liquid atmosphere can be discharged from the drainage hole 14. Further, when the sealing member 50 is provided, the amount of the processing liquid atmosphere discharged from the drainage port 14a can be improved. In this case, the treatment liquid atmosphere is mainly discharged from the drain port 14a.

By the way, during the descent of the elevating pin 20B, the sealing member 50 may rub against the side surface of the elevating pin 20B and a part thereof may be elastically deformed. At this time, a slight gap may be formed between the sealing member 50 and the elevating pin 20B. Therefore, the processing liquid atmosphere can pass through the gap while the elevating pin 20B is descending. Therefore, the processing liquid atmosphere may slightly flow out below the sealing member 50 while the elevating pin 20B is descending.

However, at least a part of the processing liquid atmosphere that has flowed out to the lower side of the sealing member 50 is discharged from the exhaust port 16a to the side of the base member 10. Further, when the sealing member 52 is provided, the amount of the processing liquid atmosphere discharged from the exhaust port 16a can be improved. In other words, it is possible to further prevent the treatment liquid atmosphere from flowing out below the sealing member 52. Therefore, the atmosphere of the processing liquid flowing out below the upper surface portion 101 of the substrate member 10 can be further reduced. In this case, the treatment liquid atmosphere that has flowed out below the sealing member 50 is mainly discharged from the exhaust port 16a.

Further, in the state where the elevating pin 20B is raised (FIG. 6), the portion 322 of the elevating pin 20B is exposed in the processing liquid atmosphere above the upper surface 10a of the base member 10. Therefore, the treatment liquid or its volatile components may adhere to the side surface of the portion 322. Hereinafter, the deposit derived from this treatment liquid is referred to as a treatment liquid deposit.

In the state where the elevating pin 20B is lowered (FIG. 5), a part of the part 322 of the elevating pin 20B is located below the sealing member 50, so that the treatment liquid adhering to the part is the elevating pin 20B. It can pass through the gap between the sealing member 50 and the elevating pin 20B generated during the descent of the. Therefore, in the state where the elevating pin 20B is lowered, the treatment liquid deposits may be present below the sealing member 50.

However, this treatment liquid deposit is on the upper side of the sealing member 52. This is because the sealing member 52 is provided below the lower limit position H1 of the portion 322 of the elevating pin 20B. Then, when the elevating pin 20B is stationary, the sealing members 50 and 52 can further seal the gap. Therefore, the treatment liquid deposits on the lower side of the sealing member 50 are dammed up by the sealing member 52. Therefore, it is suppressed that the treatment liquid deposits flow downward from this. Therefore, it is possible to prevent the treatment liquid deposits from flowing out below the upper surface portion 101 of the substrate member 10.

This treatment liquid deposit receives a force radially outward due to the rotation of the substrate W when the treatment liquid is supplied to the substrate W. Therefore, the treatment liquid deposits can be discharged from the drain port 14a and the exhaust port 16a to the side of the base member 10. Therefore, it is possible to prevent the accumulation of the treatment liquid deposits inside the elevating pin through hole 12B.

As described above, it is possible to suppress the outflow of the treatment liquid deposits or the treatment liquid atmosphere below the upper surface portion 101 of the base member 10 due to the lowering of the elevating pin 20B. Therefore, the rotating mechanism 2A or the elevating mechanism 2B can be protected from the processing liquid (or the processing liquid atmosphere). In other words, the space below the upper surface portion 101 of the substrate member 10 is unlikely to have a processing liquid atmosphere.

On the contrary, when the elevating pin 20B rises, the gas below the upper surface portion 101 of the base member 10 may be drawn into the elevating pin through hole 12B as the elevating pin 20B rises. In particular, when the connecting member 103 is provided, the connecting member 103 causes a part of the gas between the upper surface portion 101 and the connecting member 103 to be removed by raising the elevating pin 20B, and a gap in the elevating pin through hole 12B. Push out to.

However, the gas below the upper surface portion 101 of the substrate member 10 is unlikely to have a treatment liquid atmosphere. Therefore, even if the gas flows out to the upper side of the upper surface portion 101 of the substrate member 10 due to the rise of the elevating pin 20B, the concentration of the treatment liquid atmosphere above the upper surface portion 101 is unlikely to increase. ..

<Number of drainage ports>
It is desirable that the pin through hole 12 and the drainage port 14a are provided one-to-one. In other words, it is desirable that only one drain port 14a is provided for one pin through hole 12. For comparison, consider the case where a plurality of drainage ports 14a are formed for one pin through hole 12. FIG. 7 is a cross-sectional view schematically illustrating a part of the configuration of the substrate holding device 1'according to the comparative example. A first drainage port 14a and a second drainage port 14a communicating with one pin through hole 12 are formed on the side surface 10b of the base member 10 of the substrate holding device 1'. The first drainage port 14a and the second drainage port 14a communicate with the pin through hole 12 above the sealing member 50. The first drainage port 14a and the second drainage port 14a are arranged at intervals in the vertical direction. Here, the hole that communicates the first drainage port 14a and the through hole 12 for the pin is called the first drainage hole 14, and the hole that communicates the second drainage port 14a and the through hole 12 for the pin is the second drainage hole. It is called a hole 14.

In this structure, for example, there is a possibility that an air flow flowing from the first drainage port 14a to the second drainage port 14a via the first drainage hole 14, the pin through hole 12, and the second drainage hole 14 may occur. be. When such an air flow is generated, it becomes difficult for the treatment liquid to flow inside the first drainage hole 14 toward the first drainage port 14a. This is because the air flow flows inside the first drainage hole 14 in the direction opposite to the flow direction of the treatment liquid. That is, the first drainage port 14a and the first drainage hole 14 are difficult to fully exert their functions and do not make much sense. Moreover, providing a plurality of holes may lead to an increase in manufacturing cost.

On the other hand, as in the substrate holding device 1, when only one drainage port 14a is formed for one pin through hole 12, that is, one for one pin through hole 12. When the drainage hole 14 is formed, such an air flow does not occur. Therefore, the treatment liquid easily flows through the drain hole 14 toward the drain port 14a.

The same applies to the exhaust port 16a. That is, it is desirable that the through hole 12B for the elevating pin and the exhaust port 16a are provided one-to-one. More specifically, it is desirable that one exhaust hole 16 communicating with one elevating pin through hole 12B is formed between the sealing members 50 and 52.

<Shape of drainage hole 1>
FIG. 8 is a plan view schematically showing an example of a partial configuration of the substrate holding device 1A. In FIG. 8, the corresponding portion of one pin through hole 12 in the substrate holding device 1A is enlarged and shown. The relevant part is appropriately shown in the drawings to be referred to later.

The substrate holding device 1A is different from the substrate holding device 1 in that the shape of the drainage hole 14 is different. The drainage hole 14 of the substrate holding device 1A expands from the corresponding pin through hole 12 toward the outer side in the radial direction. In other words, the drainage hole 14 expands as it approaches the side surface 10b of the substrate member 10. Therefore, the cross section of the drainage port 14a (the cross section seen along the radial direction) is larger than the cross section of the connection port 14b. In the example of FIG. 8, the width of the drainage hole 14 (width along the circumferential direction) widens toward the outside in the radial direction. Therefore, the width of the drainage port 14a is wider than the width of the connection port 14b.

The specific shape of the drainage hole 14 illustrated in FIG. 8 will be described in relation to the rotation direction DR of the substrate holding device 1A. The rotation direction DR of the substrate holding device 1A is the rotation direction when the substrate holding device 1A is rotated by the rotation mechanism 13. It can be said that the rotation direction DR is the rotation direction of the base member 10. Hereinafter, the downstream side of the rotation direction DR is referred to as the rotation direction DR side, and the upstream side of the rotation direction DR is referred to as the opposite side of the rotation direction DR.

In the example of FIG. 8, the surface 141 of the drainage hole 14 on the opposite side of the rotation direction DR is inclined to the opposite side of the rotation direction DR. In order to explain more specifically, a line LR connecting the center of the pin through hole 12 and the center of the substrate W in a plan view is introduced. The surface 141 of the drainage hole 14 is inclined so as to move away from the line LR toward the opposite side of the rotation direction DR toward the outer side in the radial direction.

The surface 142 of the drainage hole 14 on the rotation direction DR side is inclined toward the rotation direction DR side. More specifically, the surface 142 of the drainage hole 14 is inclined so as to move away from the line LR toward the DR side in the rotational direction toward the outer side in the radial direction.

The width of the drainage hole 14 along the vertical direction may be the same width, or may be widened toward the outer side in the radial direction. For example, the drainage hole 14 may expand in a conical shape toward the outer side in the radial direction.

According to the substrate holding device 1A, the processing liquid can flow along the wider path inside the drainage hole 14 as it approaches the drainage port 14a. Therefore, the treatment liquid is more likely to flow to the drainage port 14a than when the drainage hole 14 is narrowed at the drainage port 14a. Therefore, the treatment liquid is easily discharged from the drain port 14a. That is, since the outlet (drainage port 14a) is wider than the inlet (connection port 14b), the treatment liquid is easily discharged from the outlet.

<Shape of drainage hole 2>
FIG. 9 is a plan view schematically showing an example of a partial configuration of the substrate holding device 1B. The substrate holding device 1B differs from the substrate holding device 1A in that the shape of the drainage hole 14 is formed.

As illustrated in FIG. 9, the drainage hole 14 expands asymmetrically with respect to the radial direction (specifically, the line LR) toward the outer side in the radial direction in a plan view. In the example of FIG. 9, the surface 141 of the drainage hole 14 is inclined at an angle θ1 to the opposite side of the rotation direction DR with respect to the line LR, and the surface 142 of the drainage hole 14 is on the rotation direction DR side with respect to the line LR. It is tilted at an angle θ2, and the angle θ2 is smaller than the angle θ1. That is, the drainage hole 14 is wider on the opposite side of the rotation direction DR toward the outer side in the radial direction.

Even with such a shape, the drainage hole 14 expands as it approaches the drainage port 14a, so that the treatment liquid is easily discharged from the drainage port 14a as in the drainage hole 14 of FIG.

By the way, in the state where the base member 10 rotates along the rotation direction DR, the gas in the vicinity of the side surface 10b of the base member 10 relatively flows along the side surface 10b on the side opposite to the rotation direction DR. FIG. 10 is a plan view schematically showing an example of a part of the configuration of the substrate holding device 1B, and the flow of this gas is schematically shown by a thick arrow.

This gas collides with the surface 141 of the drainage hole 14 on the opposite side of the rotation direction DR during the rotation of the substrate holding device 1B. However, since the surface 141 of the drainage hole 14 is inclined so as to move away from the line LR as it approaches the outside in the radial direction, the gas is radially outside (the drainage port 14a side) along the surface 141 of the drainage hole 14. Easy to flow to. Conversely, it is difficult for the gas to flow to the connection port 14b along the surface 141 of the drainage hole 14. If the gas flows through the inside of the drainage hole 14 toward the connection port 14b, the direction of the air flow is opposite to the flow of the treatment liquid inside the drainage hole 14, and the flow of the treatment liquid is obstructed. In the substrate holding device 1B, since such an air flow is unlikely to occur, the processing liquid is likely to be discharged from the drain port 14a.

Further, in the above example, the angle θ2 is smaller than the angle θ1. As a result, it is possible to further suppress the gas from flowing inside the drainage hole 14 toward the connection port 14b. The details will be described below.

First, for comparison, consider the case where the angle θ2 is large. FIG. 11 is a plan view schematically showing an example of a part of the configuration of the substrate holding device 1 ″ according to the comparative example. Also in FIG. 11, the gas flow is schematically shown by a thick arrow. In the substrate holding device 1 ″, the angle θ2 is larger than the angle θ1. According to this shape, the gas in the vicinity of the side surface 10b of the base member 10 on the rotation direction DR side of the drainage port 14a is connected along the surface 142 of the drainage hole 14 during the rotation of the substrate holding device 1 ″. Easy to flow toward the mouth 14b. This is because the surface 142 of the drainage hole 14 has a relatively large obtuse angle with the side surface 10b of the base member 10, and the gas flows along the side surface 10b and the gas flows along the surface 142 of the drainage hole 14. This is because the difference between the directions is small. Therefore, the gas easily flows from the side surface 10b to the connection port 14b along the surface 142 of the drainage hole 14. When the gas flows inside the drainage hole 14 toward the connection port 14b, it is difficult for the treatment liquid to flow inside the drainage hole 14 toward the drainage port 14a. This is because the flow of the air flow inside the drain hole 14 and the flow of the treatment liquid are opposite to each other.

On the other hand, in the substrate holding device 1B, the angle θ2 is smaller than the angle θ1. Therefore, it is possible to prevent the gas from flowing toward the connection port 14b along the surface 142 of the drainage hole 14. Therefore, the treatment liquid easily flows through the inside of the drainage hole 14 toward the drainage port 14a, and is easily discharged from the drainage port 14a.

<Shape of drainage hole 3>
FIG. 12 is a plan view schematically showing an example of a partial configuration of the substrate holding device 1C. The substrate holding device 1C is different from the substrate holding device 1 in that the shape of the drainage hole 14 is different.

The drainage hole 14 has a substantially equal width in a plan view and extends in a direction inclined from the radial direction. The extending direction of the drainage hole 14 may be inclined in either direction with respect to the radial direction in a plan view, but in the example of FIG. 11, the drainage hole 14 is radially from the corresponding pin through hole 12. It extends in a direction that inclines to the opposite side of the rotation direction DR toward the outside. That is, the drainage port 14a is located on the opposite side of the rotation direction DR from the connection port 14b belonging to the same drainage hole 14. The angle formed by the extending direction and the radial direction of the drainage hole 14 can be set to be smaller than, for example, 45 degrees.

Even with this shape, the surface 141 of the drainage hole 14 is inclined to the side opposite to the rotation direction DR toward the outer side in the radial direction. Therefore, during the rotation of the substrate holding device 1C, the gas tends to flow outward in the radial direction along the surface 141 of the drainage hole 14. Further, since the surface 142 of the drainage hole 14 has an acute angle with the side surface 10b of the base member 10, the gas is more difficult to flow to the connection port 14b along the surface 142 of the drainage hole 14. Therefore, the gas does not easily obstruct the flow of the treatment liquid inside the drain hole 14.

The various shapes of the drainage hole 14 described above can also be applied to the exhaust hole 16.

<Protrusion>
FIG. 13 is a perspective view schematically showing an example of a partial configuration of the substrate holding device 1D. The substrate holding device 1D differs from the substrate holding device 1 in that the presence or absence of the protrusion 18. The substrate holding device 1D further includes a protrusion 18.

In this substrate holding device 1D, a pair of protrusions 18 are provided for each of the drainage ports 14a. That is, a pair of protrusions 18 are provided for one drainage port 14a. The pair of protrusions 18 are provided on the side surface 10b of the base member 10, and project outward from the side surface 10b in the radial direction. The pair of protrusions 18 are provided at positions where the drainage port 14a is sandwiched between the upper and lower parts. Specifically, one of the pair of protrusions 18 is provided above the drainage port 14a, and the other is provided below the drainage port 14a. Therefore, the drainage port 14a is located between the pair of protrusions 18.

The protrusion 18 extends along a substantially circumferential direction. In the example of FIG. 13, the width of the protrusion 18 (width along the circumferential direction) is wider than the width of the drainage port 14a (width along the circumferential direction), and the drainage port is viewed along the vertical direction. 14a is located between both ends of the protrusion 18 in the circumferential direction. That is, in the example of FIG. 13, when viewed in the vertical direction, the drainage port 14a does not protrude outward from both ends of the protrusion 18.

The distance between the facing surfaces of the pair of protrusions 18 (that is, the distance between the pair of protrusions 18) becomes narrower from the rotation direction DR of the substrate holding device 1D toward the opposite side.

According to this, it is possible to improve the flow velocity of the gas flowing between the pair of protrusions 18 along the side surface 10b of the substrate member 10 during the rotation of the substrate holding device 1D. As a result, the treatment liquid is attracted to the negative pressure generated by the air flow, and is easily discharged from the liquid drain port 14a of the base member 10.

The same applies to the exhaust port 16a. That is, a pair of protrusions 18 may be provided for each of the exhaust ports 16a.

As described above, the substrate holding device has been described in detail, but the above description is an example in all aspects, and the disclosure is not limited thereto. Further, the various modifications described above can be applied in combination as long as they do not contradict each other. And it is understood that a large number of modifications not illustrated can be assumed without departing from the scope of this disclosure. The various aspects described above can be combined with each other.

1,1A to 1D, 1', 1 ″ Board holding device 10 Base member 10a Top surface 10b Side surface 12 pin through hole 12B Lifting pin through hole 14 Drainage hole 14a Drainage port 14b Connection port 16 Exhaust hole 16a Exhaust port 16b Connection port 18 Protrusion 20 pin 20B Lifting pin 50 1st seal member (seal member)
50B Lifting seal member 52 Second seal member (seal member)
141 First side (face)
142 Second side (face)
DR rotation direction W board

Claims (7)

A substrate holding device used in a substrate processing apparatus that supplies a processing liquid to a substrate.
A substrate member having an upper surface facing the back surface of the substrate and having a plurality of pin through holes extending in the vertical direction and opening on the upper surface.
It is provided with a plurality of pins that vertically penetrate the substrate member through the plurality of pin through holes, project from the upper surface, and abut the substrate.
A plurality of drainage ports communicating with the plurality of pin through holes are formed on the side surface of the substrate member .
Inside the plurality of pin through holes, a plurality of first sealing members provided in a gap between the plurality of pins and the substrate member are further provided.
A plurality of holes communicating the plurality of pin through holes and the plurality of drainage ports are referred to as a plurality of drainage holes.
The plurality of first seal members are located below each of the plurality of first connection ports connecting the plurality of pin through holes and the plurality of drainage holes.
The plurality of pins include a lifting pin that moves up and down along the vertical direction.
Of the plurality of through holes for the pins, the hole through which the elevating pin penetrates is called a through hole for the elevating pin, and among the plurality of first seal members, the hole for the first seal provided inside the through hole for the elevating pin. When a member is called an elevating seal member,
A substrate holding device in which an exhaust port communicating with a through hole for an elevating pin is formed on the side surface of the substrate member below the elevating seal member. The substrate holding device according to claim 1.
A second sealing member provided in the gap between the elevating pin and the base member is further provided inside the elevating pin through hole.
The hole that connects the exhaust port and the through hole for the elevating pin is called an exhaust hole.
The second seal member is a substrate holding device located below the second connection port between the exhaust hole and the elevating pin through hole. The substrate holding device according to claim 1 or 2.
A substrate holding device in which only one of the plurality of drainage ports is formed for one of the plurality of through holes for pins. The substrate holding device according to any one of claims 1 to 3.
A plurality of holes communicating the plurality of drainage ports and the plurality of pin through holes are referred to as a plurality of drainage holes.
A substrate holding device in which the plurality of drain holes expand as they approach the side surface of the substrate member. The substrate holding device according to claim 4.
The substrate member rotates in a predetermined rotational direction around a rotation axis extending vertically through the center of the substrate.
The first surface of each of the plurality of drainage holes on the side opposite to the rotation direction is inclined at a first angle to the side opposite to the rotation direction with respect to the radial direction centered on the rotation axis.
A substrate holding device in which a second surface of each of the plurality of drainage holes on the rotation direction side is inclined toward the rotation direction side with respect to the radial direction at a second angle smaller than the first angle. The substrate holding device according to any one of claims 1 to 5.
The substrate member rotates in a predetermined rotational direction around a rotation axis extending vertically through the center of the substrate.
A plurality of holes communicating the plurality of drainage ports and the plurality of pin through holes are referred to as a plurality of drainage holes.
A substrate holding device in which the plurality of drainage holes extend from the plurality of pin through holes toward the side surface in a direction inclined from a radial direction centered on the rotation axis. The substrate holding device according to any one of claims 1 to 6.
The substrate member rotates in a predetermined rotational direction around a rotation axis extending vertically through the center of the substrate.
A pair of protrusions are provided on the side surface of the substrate member.
The pair of protrusions are provided at positions that sandwich one of the plurality of drainage ports at the top and bottom, and the distance between the pair of protrusions is from the rotation direction side to the opposite side to the rotation direction. A board holding device that narrows toward you.

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