KR100737226B1 - Apparatus for wafer transfer - Google Patents

Abstract

A wafer transfer apparatus is provided to reduce a process time by treating simultaneously three or more wafers and transferring the wafer to a loadlock module in a predetermined process at a process module. A wafer transfer apparatus(100) includes an EFEM(Equipment Front End Module)(110) with a first robot(111) for transferring a plurality of wafers, a loadlock module(120) having a common loader with a plurality of slots capable of loading stably the wafers transferred by the first robot, a plurality of transfer modules, and a plurality of process modules. The plurality of transfer modules(130) includes a second robot, respectively. The second robot is used for transferring at least one out of the wafers loaded on the slots of the common loader. The plurality of process modules(140) includes a shaft, respectively. The shaft is used for loading stably the wafer transferred by the second robot of the transfer module.

Description

Wafer Transfer Device {Apparatus for wafer transfer}

1 illustrates an embodiment of a wafer transfer apparatus according to the present invention.

2 and 3 are a side view and a plan view showing an embodiment of the first robot of the EFEM.

4 is a front view illustrating an embodiment of a common loader of a load lock module.

5 is a plan view of the common loader shown in FIG.

6 is a plan view illustrating another embodiment of a common loader of a load lock module.

7 schematically illustrates a second robot embodiment of the transfer module.

8 schematically illustrates another embodiment of a second robot of the transfer module.

9 schematically illustrates one embodiment of a shaft of a process module.

FIG. 10 shows a modified example of the wafer transfer apparatus shown in FIG. 1.

11 illustrates that the transfer module and the process module are configured as twin modules.

12 and 13 briefly illustrate a process of transferring a wafer in the wafer transfer apparatus 100 shown in FIG. 1.

14 to 16 show other embodiments of the wafer transfer apparatus according to the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a wafer transfer apparatus for transferring wafers between an equipment front end module (EFEM) and a plurality of process modules.

The conventional wafer transfer apparatus is composed of an equipment front end module (EFEM), a loadlock module and a plurality of process modules to transfer a plurality of wafers.

Here, the EFEM is equipped with two large base transport robots so that the two large base transport robots can transfer wafers to or from the load lock module at the same time or at a time difference, and the load lock module can transfer two wafers at a time. A vacuum robot is provided to transfer wafers between the process module and the EFEM. In the conventional wafer transfer apparatus, up to six process modules (or three twin modules) each capable of processing one wafer are provided, and six wafers are transferred by simultaneously transferring two wafers from the load lock module. It can handle. This is described in detail in Korean Patent Publication No. 10-1998-0042482 (wafer processing apparatus and method) published August 17, 1998, the description thereof will be omitted.

However, in the above conventional wafer transfer apparatus, even if six wafers are processed in each process module, substantially two wafers are transferred simultaneously in the load lock module, and only two wafers can be processed simultaneously. As a result, 4 to 6 wafers cannot be processed at the same time.

The technical problem to be achieved by the present invention is to provide a wafer transfer apparatus capable of processing three or more wafers at substantially the same time, the transfer of the wafer in the load lock module, etc., even during the process in the process module.

Wafer transfer apparatus according to the present invention for achieving the above technical problem is a front end module (EFEM), a load-lock module (Load-lock Module), a plurality of transfer modules (Transfer Module) and a plurality of process modules (Process Module) It is made.

The EFEM has a first robot provided with a plurality of slots in the hand for transferring a plurality of wafers. The load lock module includes a common loader provided with a plurality of slots in which a plurality of wafers transported by the first robot of the EFEM is mounted. Each of the transfer modules has a second robot for transferring at least one of a plurality of wafers seated in a plurality of slots of the common loader. Each of the process modules has a shaft on which a wafer transferred by a second robot of the transfer module is seated.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 illustrates an embodiment of a wafer transfer apparatus according to the present invention.

Referring to FIG. 1, the wafer transfer apparatus 100 according to the present invention includes an equipment front end module (EFEM) 110, a load lock module 120, a plurality of transfer modules 130, and a plurality of transfer modules 130. A process module 140 is provided.

The EFEM 110 includes a first robot 111 provided with a plurality of slots in the hand to transfer a plurality of wafers.

Wafer transfer between the EFEM 110 and the load lock module 120 is performed at atmospheric pressure, and wafer transfer between the load lock 120 module and the transfer module 130 and between the transfer module 130 and the process module 140. Wafer transfer takes place in a vacuum. Here, the load lock module 120 repeats the vacuum state and the atmospheric pressure state. To this end, the EFEM 110 includes a pumping device (not shown) for bringing the load lock module 120 into a vacuum state and a standby state.

2 and 3 are a side view and a plan view showing an embodiment of the first robot 111 of the EFEM.

2 and 3, the first robot 111 is in the form of a multi-joint robot, the main body 210, the main axis of rotation 220 to move up and down, a plurality of arms (230a, 230b) capable of independent rotation And a hand 240 coupled to the arm 230b at the end of the plurality of arms 230a and 230b and provided with a plurality of slots 250 having different heights. Each of the plurality of slots 250 is loaded with a wafer. The first robot 111 can be straightened and rotated by a plurality of arms 230a and 230b which can be independently rotated by the plurality of links 260a, 260b and 260c, respectively.

The EFEM 110 is equipped with at least one wafer storage means 112 for storing a plurality of wafers. The first robot 111 loads some of the wafers of the plurality of wafers in the wafer storage means 112 at one time and transfers them to the load lock module 120. In addition, the first robot 111, on the contrary, loads the wafers from the load lock module 120 at once and transfers them to the wafer storage means 112.

For example, the wafer storage means 112 may store 25 wafers, and if there are four slots 250 provided in the hand 240 of the first robot 111, the first robot 111 may be used at a time. Four wafers can be transferred. In this case, the first robot 111 loads the first four wafers into the slot 250 and transfers them to the load lock module 120, and then the main shaft 220 rises or falls in the vertical direction. Each wafer is loaded into the slot 250.

In the above example, when the first robot 111 transfers four wafers at once, 24 wafers are transferred through six loadings, and the remaining one wafer is transferred through the last one loading. . In this case, in the case of six loadings in which the first robot 111 transfers four wafers at once, the four slots 250 provided in the first robot 111 do not need separate control.

However, in the case of loading for transporting the last one wafer, the wafer is loaded only in one of four slots 250 provided in the first robot 111. In this case, no wafer is loaded into the remaining three slots. In this case, when the remaining three slots proceed to the wafer storage means 112, collision between the remaining three slots 250 and the wafer storage means 112 may occur. There are two ways to avoid this.

First, in one method, the number of wafers that can be stored in the wafer storage means 112 is a multiple of the plurality of slots 250 provided in the first robot 111. In the case of the above example, 24 wafers are stored in the wafer storage means 112 that can hold 25 wafers, and the space for storing one wafer is left empty or three wafers are stored in the wafer storage means 112. There are methods such as providing more space for storing wafers to store 28 wafers, storing 25 wafers, and leaving the remaining space empty.

As another method, there is a method of controlling the plurality of slots 250 mounted on the hand 240 of the first robot 111. In the above example, one of the four slots enters the wafer containment means 112 to load the wafer from the wafer containment means 112, and the remaining three slots are provided with a motor (not shown) in the main body 210. Rotate in one direction so as not to collide with the wafer containment means 112. At this time, the four slots 250 are connected to a separate motor for each slot for control, all slots can be independently controlled. In addition, the slots to be controlled at the same time can be connected to one motor so that these slots are controlled at the same time and the remaining slots can be controlled independently. As a result, at least one slot among the plurality of slots 250 mounted on the hand 240 provided in the first robot 111 may be independently controlled.

The load lock module 120 includes a common loader 121 provided with a plurality of slots in which a plurality of wafers transferred by the first robot 111 are seated.

4 and 5 are a front view and a plan view showing an embodiment of the common loader 121 of the load lock module 120.

The common loader 400 illustrated in FIGS. 4 and 5 has a main body 401, a plurality of slots 410 having different heights on which the wafer can be horizontally positioned, and a side of the plurality of slots 410. The support part 420 and the lower support part 430 which support the some slot 410 and the side support part 420 from the lower part are comprised.

The number of slots 410 provided in the common loader 400 may be equal to the number of slots 250 provided in the first robot. However, in this case, there may be a problem that wafer transfer from the EFEM 110 to the plurality of process modules 140 and wafer transfer from the plurality of process modules 140 to the EFEM 110 may not occur at the same time. Therefore, the number of slots 410 provided in the common loader 400 is preferably twice the number of slots 250 provided in the first robot 111. Here, some of the plurality of slots 410 provided in the common loader 121 are slots for seating the wafer transferred from the EFEM 110, and other parts seat the wafer transferred from the transfer module 130. Slots for

For example, if four slots are provided in the first robot 111, eight slots may be provided in the common loader 400. In this case, the lower four slots are slots in which each of the four wafers transferred from the first robot 111 is seated, and the upper four slots are slots in which each of the four wafers transferred from the transfer module 130 is seated. Can be.

The lower support part 430 of the common loader 121 may be movable vertically by a first motor (not shown) for driving a common loader provided in the main body 401. In the above example, the height when the wafers are seated in the lower four slots of the common loader 400 from the first robot 111 and the wafers seated in the upper four slots of the common loader 400 are the first robots. 111 may be the same height when loaded. In this case, if the lower support portion 430 of the common loader 400 is properly moved in the vertical direction, wafer transfer between the common loader 400 and the first robot 111 is freed without the movement of the first robot 111. .

In addition, the lower support part 430 of the common loader 400 may be rotatable by a second motor (not shown) for driving the common loader provided inside the main body 401. Due to the presence of the side support part 420 supporting the plurality of slots 410 from the side, when the common loader 400 is fixed without rotation, the wafer is freely transferred in the direction in which the side support part 420 exists. Can't be.

In particular, when the wafer is freely transferred between the EFEM 110 and the load lock module 120, there are no obstacles in the path driven by the first robot 111. In this case, the side support part 420 of the common loader 400 is positioned in a path driven by at least one of the plurality of second robots 131 in the load lock module 120 and the transfer module 130 so that the second robot 131 May interfere with driving of at least one of them. Therefore, in this case, when the lower support part 430 of the common loader 400 rotates, the above problem can be solved.

6 is a plan view showing another embodiment of a common loader.

4 and 5, a plurality of slots 410 are formed in only one direction based on the side support part 420, whereas the common loader 400 shown in FIG. 6 has a side surface. A plurality of slots 410 are formed in both directions with respect to the support part 420. Assuming the same number of slots 410, the common loader 400 shown in Figure 4 has the disadvantage that the vertical size is larger than the common loader 500 shown in Figure 5, while the advantage that the horizontal size is smaller have.

Each of the plurality of transfer modules 130 includes a second robot 131 for transferring at least one of a plurality of wafers seated in a plurality of slots of the common loader 121.

Each of the second robots 131 is provided with at least one arm 510 for transferring the wafer between the load lock module 120 and the process module 130 by rotation.

When one arm is provided in each of the second robots 131, an arm provided in one second robot 131 is one of a plurality of slots provided in the common loader 121 of the load lock module 120. The wafer seated in one predetermined slot is loaded to transfer the wafer to the predetermined process module 140 through rotation, and the arm again loads the wafer from the process module 140, thereby rotating the plurality of slots. The wafer is seated in one of the other predetermined slots.

When each of the second robots 131 is provided with two arms, one arm provided in one second robot 131 is provided in the common loader 121 of the load lock module 120. By loading the wafer seated in one of the slots, the wafer is transferred to the predetermined process module 140 through rotation, and the other arm loads the wafer from the process module 140, thereby rotating the wafer. The wafer is seated in one of the other predetermined slots. In this case, one of the two arms can only perform loading into the process module and the other arm can only perform unloading from the process module.

Here, each of the second robots 131 transfers the wafer between the load lock module 120 and the process module 140. Specifically, the wafer is transferred between the common loader 121 of the load lock module 120 and the shaft (910 of FIG. 9) of the process module 140 to be described later. In this case, each of the second robots 131 may transfer wafers over time, but each of the second robots 131 may be simultaneously loaded from the common loader 121 of the load lock module 120 in order to maximize process efficiency. It is most preferable to transfer the wafers to the process module 140, and simultaneously transfer the wafers from the respective process modules 140 to the common loader 121.

7 illustrates an embodiment of a second robot 131 provided in the transfer module 130.

The second robot 700 illustrated in FIG. 7 includes a first rotation shaft 701, a first arm 710, and a second arm 720.

Slots 132 are coupled to the ends of the first arm 710 and the second arm 720, and each of the first arm 710 and the second arm 720 rotates about the first rotation shaft 701. . Each of the first arm 710 and the second arm 720 is provided with a motor (not shown), so that the two arms can be independently driven by different motors (not shown).

Since the first arm 710 and the second arm 720 may collide when the first arm 710 and the second arm 720 rotate horizontally at the same height, the first arm 710 and the first arm 710 may collide. The two arms 720 are preferably arranged at different heights on the first rotation shaft 701 so as to rotate at different heights.

One arm of the first arm 710 and the second arm 720 loads one wafer from the load lock module 120 and transfers the wafer to the predetermined process module 140, and the other arm is the predetermined process module ( The wafer may be loaded from 140 to transfer the wafer to the load lock module 120.

For example, the first arm 710 loads a wafer seated in a predetermined slot among a plurality of slots 410 provided in the common loader 400 of the load lock module 120 illustrated in FIG. 4. It rotates about one rotation shaft 701, and unloads the shaft of a predetermined process module among the plurality of process modules 140, and the second arm loads the wafer seated on the shaft of the process module and the first rotation shaft ( The load lock module 120 and the process module 140 are rotated about the 701 and unloaded to another one of a plurality of slots 410 of the common loader 400 of the load lock module 120. Wafer transfer by the second robot 700 may be performed.

FIG. 8 illustrates another embodiment of the second robot 131 of the transfer module 130. Each of the first arm and the second arm of the second robot 800 shown in FIG. 8 includes two arms. Form.

The second robot 800 illustrated in FIG. 8 includes a first rotating shaft 801, a second rotating shaft 802, a third rotating shaft 803, a first-first arm 811, and a second-first arm 821. And a second arm 812 and a second arm 822.

The first-first arm 811 and the second-first arm 821 rotate about the first rotation shaft 801. The second rotary shaft 802 is formed at the end of the first-first arm 811, and the third rotary shaft 803 is formed at the end of the second-first arm 821. Slots 132 are coupled to ends of the first and second arms 812 and the second and second arms 822, and the first and second arms 812 rotate about the second rotation shaft 802. The 2-2 arms 822 rotate about the third rotation shaft 803.

Each of the first-first arm 811, the second-first arm 821, the first-second arm 812, and the second-second arm 822 is provided with a motor (not shown). Each arm can be driven independently by the motor of.

Between 1-1 arm 811, 2-1 arm 821, 1-2 arm 812, and 2-2 arm 822 when they rotate horizontally at the same height. It is preferable that the arms rotate at different heights as a collision may occur.

1-1 Arm 811 and 1-2 Arm among 1-1 Arm 811, 1-2 Arm 812, 2-1 Arm 821 and 2-2 Arm 822 812 loads one wafer from the load lock module 120 and transfers it to the predetermined process module 140, and the 2-1nd arm 821 and the 2-2nd arm 822 are defined process module 140. By loading the wafer from) may be controlled to transfer the wafer to the load lock module 120. Of course, the opposite is also possible.

For example, the first-second arm 812 is defined among the plurality of slots 410 provided in the common loader 121 of the load lock module 120 in a state in which the first-first arm 811 is widened with the first-first arm 811. Load the wafer seated in one slot, and rotate the first-second arm 812 around the second rotation axis 802 to reduce the angle with the first-first arm 811 (the first rotation shaft ( The first-first arm 811 rotates about the 801, and the first-second arm 812 rotates about the second rotary shaft 802 to widen the angle with the first-first arm 811. In the state, the first-second arm 812 is unloaded to the shaft of the predetermined process module among the plurality of process modules to transfer the wafer by the second robot 800 from the load lock module 120 to the process module 140. Can be.

Further, the second arm 822 loads a wafer seated on a shaft of a predetermined process module among the plurality of process modules 140 in a state in which the second arm 822 widens the angle of the second arm 182, and the third rotary shaft The 2-1st arm 821 rotates about the 1st rotating shaft 801 in the state which the 2nd-2nd arm 822 rotated about 803, and reduced the angle with the 2-1st arm 821. 2-2 arm 822 is a load lock module in a state in which the 2-2nd arm 822 is rotated about the 3rd rotating shaft 803 to widen the angle with the 2-1th arm 821. Wafer by the second robot 800 from the process module 120 to the load lock module 120 by unloading the other one of the plurality of slots 410 provided in the common loader 121 of the 120 The transfer can take place.

Even though each arm of the second robot 131 provided in each transfer module 130 plays the same role, as shown in FIG. 10, the shape of the load lock module 120 may be modified. The length of the second robot 131 need not be the same for each 130.

Each of the plurality of process modules 140 includes a shaft on which a wafer transferred by the second robot 131 of the transfer module 130 is seated. 9 briefly illustrates one embodiment of the shaft 910 of the process module 140.

In order to transfer the wafer to the second robot 131 provided in the transfer module 130, the shaft 910 provided in the process module 140 may be moved up or down, or as shown in FIG. 9. The 910 is fixed, and instead, the loading pin set 920 may move through the shaft 910 by driving the motor 930.

In this case, the loading pin set 920 may be two stages up. In this case, the loading pin set 920 has an initial height 940a when the second robot 131 enters the process module 140 to transfer the wafer from the load lock module 120 to the process module 140. In the case where the second robot 131 enters the process module 140 to up to a predetermined loading height 940b and transfers the wafer from the process module 140 to the load lock module 120. It may be up to the height for unloading 940c from the initial height.

At this time, the loading height 940b and the unloading height 940c in one process module 140 may be defined by the arm of one arm of the second robot 131 which is responsible for transferring the wafer to the process module 140. It depends on the height and the number. In the case where one arm of one second robot 131 that is responsible for transferring wafers to one process module 140 is one arm, the loading height 940b and the unloading height 940c are the same, and It is equal to the height of the arm of one second robot 131.

On the other hand, when two arms that are independently driven are provided in one second robot 131, the loading height 940b and the unloading height 940c may be different. At this time, the loading height 940b is equal to the height of the arm for transferring the wafer to the process module 140 of the two arms, and the unloading height 940c is used to lift the wafer from the process module 140 of the two arms. It may be equal to the height of the arm for conveying.

Preferably, the loading height 940b and the unloading height 940c of each process module 140 are different. For example, when the loading heights 940b of the adjacent process modules are the same, the collision of the second robot 131 may occur, so that at least the loading heights 140b of the adjacent process modules are different from each other. Accordingly, the heights of the arms of each of the second robots 131 may be different.

The total number of second robots 131 provided in the transfer module 130 is preferably equal to the number of slots 260 provided in the first robot 111 of the EFEM 110. Similarly, the total number of shafts 141 provided in the process module 140 is also preferably equal to the number of slots 260 provided in the first robot 111 of the EFEM 110.

Each of the plurality of transfer modules 130 may be configured as an independent module as a whole, or may be configured as a twin module in which two or more modules are combined. Similarly, each of the plurality of process modules 140, like the plurality of transfer modules 130 described above, may all be configured as independent modules, and some or all of the twin modules may be combined. It can be configured as a module.

11 illustrates that the transfer module 130 and the process module 140 are configured as twin modules.

Even if each process module 140 and each transfer module 130 are configured independently, the process in each process module 140 or each transfer module 130 and the driving of the second robot 131 can be performed simultaneously. Although it can be controlled to, but when all or part of each process module 140 or each transfer module 130 is configured as a twin module (130 ', 140') has the following advantages.

For example, when two left and right process modules are configured as twin modules 140 ', the processes in the two process modules 140 may be simultaneously performed in one twin module 140'. In addition, some components, such as a motor (930 in FIG. 9) for driving the set of loading pins (920 in FIG. 9), may be used in common, and some components within each process module 140 may be cut in half. have. Similarly, when two transfer modules of the left and the right are configured as the twin modules 130 ', the transfer of the wafers by the respective second robots 131 in each transfer module 130 may be simultaneously performed. In addition, some components such as a motor for driving each arm provided in the second robot 131 may be used in common, so that some components inside each transfer module 130 may be cut in half.

12 and 13 briefly illustrate a process of transferring a wafer in the wafer transfer apparatus 100 shown in FIG. 1. 12 and 13, LM denotes a load lock module, TM denotes a transfer module, and PM denotes a process module.

Referring to FIG. 12, four wafers of ①, ②, ③, and ④ are transferred from the EFEM 110 to the load lock module 120 at a time. Wafer ① in the load lock module 120 is transferred to the first process module 140-1 through the transfer module 130-1, and wafer ② is transferred through the transfer module 130-2. The wafer No. 3 is transferred to the process module 140-2, the wafer ③ is transferred to the process module 140-3 through the third transfer module 130-3, and the wafer ④ is transferred to the fourth transfer module ( 130-4) to the number 4 process module 140-4 at the same time.

Referring to FIG. 13, four wafers ⑤, ⑥, ⑦, and ⑧ are loaded from the EFEM 110 to the load lock module 120 at a time during the process of wafers ①, ②, ③, and ④ in each process module. Transferred. In the load lock module 120, wafer ⑤ waits for the first transfer module 130-1, wafer ⑥ waits for the second transfer module 130-2, and wafer ⑦ transfers three. The module 130-3 waits, and the wafer ⑧ waits for the fourth transfer module 130-4.

Thereafter, the wafers 1, 2, 3, and 4 of the process modules 140-1, 2, 3, and 4 are loaded through the transfer modules 130-1, 2, 3, and 4, respectively. Is transferred to the EFEM 110 from the load lock module 120 again. At the same time or sequentially, wafers ⑤, ⑥, ⑦, and ⑧ waiting in the transfer modules 130-1, 2, 3, and 4 are transferred to the process modules 140-1, 2, 3, and 4, respectively. . This can be accomplished by the second robot 131 provided in each transfer module 130-1, 2, 3, and 4 having two arms each capable of independent driving.

In the above description, four process modules have been mainly described. However, another embodiment of the wafer transfer apparatus according to the present invention may include five process modules 140 or six process modules 140 as illustrated in FIGS. 14 to 16. It is also applicable. Of course, more space is possible if the space allows. In the case of FIG. 16, three twin modules 130 ′ and 140 ′ are used instead of six process modules 140 and six transfer modules 130.

In FIG. 14 to FIG. 16, the first robot 111, the common loader 121, and the second robot 131 are omitted for convenience of description, but once the number of the process modules 140 is determined, The number of slots, the number of slots of the common loader 121 and the number of second robots can be easily determined. For example, when the first robot 111 is applied to the wafer transfer apparatus illustrated in FIG. 14, since there are five process modules 140, the number of slots of the first robot 111 is five, and the common loader ( The number of slots 121 may be ten and the number of second robots 131 may be five. When the first robot 111 is applied to the wafer transfer apparatus shown in FIG. 15 or 16, since there are six process modules 140, the number of slots of the first robot 111 is six, and the common loader ( The number of slots 121 may be twelve, and the number of second robots 131 may be six.

The technical spirit of the present invention has been described above with reference to the accompanying drawings. However, the present invention has been described by way of example only, and is not intended to limit the present invention. In addition, it is apparent that any person having ordinary knowledge in the technical field to which the present invention belongs may make various modifications and imitations without departing from the scope of the technical idea of the present invention.

As described above, the wafer transfer apparatus according to the present invention has an advantage of simultaneously processing 4 to 6 wafers.

In addition, in the wafer transfer apparatus according to the present invention, the wafers may be transferred to the load module or waited on the transfer module by the second robot provided in the transfer module, thereby shortening the overall process time. There is an advantage to this.

Claims (24)

An equipment front end module (EFEM) including a first robot provided with a plurality of slots in the hand to transfer a plurality of wafers; A loadlock module having a common loader provided with a plurality of slots in which a plurality of wafers transported by the first robot are seated; A plurality of transfer modules each having a second robot for transferring at least one of a plurality of wafers seated in a plurality of slots of the common loader; And And a plurality of process modules each having a shaft on which the wafer transferred by the second robot of the transfer module is seated. The method of claim 1, wherein each of the second robot, Wafer transfer apparatus characterized in that for transferring the wafer between the load lock module and the process module at the same time. The method of claim 1, wherein the EFEM, At least one wafer storage means for storing a plurality of wafers is mounted, And the first robot loads each of a plurality of slots provided with a portion of a plurality of wafers in the wafer storage means and transfers them to the load lock module. The method of claim 1, At least one slot among the plurality of slots provided in the first robot is independently controlled. The method of claim 1, wherein the common loader, A wafer transfer device characterized by moving in a vertical direction by a first motor for driving a common loader. The method of claim 1, wherein the common loader, A wafer transfer device characterized by rotating by a second motor for driving a common loader. According to claim 1, The number of slots provided in the common loader, Wafer transfer apparatus, characterized in that more than twice the number of the plurality of slots provided in the first robot. The method of claim 5, Some of the plurality of slots provided in the common loader are slots for seating a wafer transferred from the EFEM, The other part of the plurality of slots provided in the common loader, the wafer transport apparatus, characterized in that the slots for seating the wafer to be transferred from the transfer module. The method of claim 1, wherein each of the second robot, And at least one arm for transferring a wafer between the load lock module and the process module by rotation. The method of claim 9, wherein the second robot, A first arm rotating about a first axis of rotation; And And a second arm rotating about the first rotational shaft, And the first arm and the second arm rotate at different heights. The method of claim 10, wherein each of the first arm and the second arm, Wafer transfer apparatus, characterized in that driven independently by different motors. The method of claim 11, The first arm loads a wafer seated in a predetermined one of a plurality of slots provided in the common loader of the load lock module, rotates about the first rotational shaft, and determines one process among the plurality of process modules. Unloaded into the shaft of the module, The second arm loads the wafer seated on the shaft of the predetermined one process module, rotates about the first rotational axis, and unloads the other one of the plurality of slots of the common loader of the load lock module. Wafer transfer apparatus characterized in that. The method of claim 9, wherein the second robot, A first-first arm rotating about the first rotating shaft; A 2-1 arm rotating around the first rotation shaft; A 1-2 arm rotating around a second rotational shaft formed at an end of the 1-1 arm; And And a 2-2 arm that rotates about a third rotational shaft formed at the end of the 2-1 arm, Wherein each arm rotates at a different height. The method of claim 13, wherein each of the respective arms, Wafer transfer apparatus characterized in that the drive independently connected to the different motors. The method of claim 14, wherein the second robot, Load the wafer seated in a predetermined one of a plurality of slots provided in the common loader of the load lock module in a state in which the 1-2 arm widens the angle with the 1-1 arm, The first-first arm rotates about the first rotation axis while the first-second arm rotates about the second rotation axis to reduce the angle with the first-first arm, The first and second arms are rotated around the second rotational axis to widen the angle with the first and second arms. Wafer transfer apparatus, characterized in that for unloading. The method of claim 15, wherein the second robot, Load the wafer seated on the shaft of one of the plurality of process modules in a state in which the second-2 arm widens the angle with the second-1 arm, The second arm is rotated around the first rotary shaft while the second arm is rotated about the third rotary shaft to reduce the angle with the second arm. Of the plurality of slots provided in the common loader of the load lock module in the state in which the second arm is rotated about the third rotary shaft to widen the angle with the second arm. Wafer transfer apparatus, characterized in that the unloading to another one. The method of claim 1, wherein each of the shafts provided in the process module, Wafer transfer device characterized in that the loading pin set is equipped with a two-stage up (up). The method of claim 17, wherein the loading pin set When the second robot enters the process module in order to transfer the wafer from the load lock module to the process module, up from the initial height to a predetermined loading height, And the second robot enters the process module in order to transfer the wafer from the process module to the load lock module. The wafer transfer device ups from an initial height to an unloading height. According to claim 1, wherein the number of the second robot of the transfer module, Wafer transfer apparatus, characterized in that the same as the number of the plurality of slots provided in the first robot of the EFEM. The method of claim 1, wherein the number of shafts of the process module, Wafer transfer apparatus, characterized in that the same as the number of the plurality of slots provided in the first robot. The method of claim 1, wherein the plurality of transfer modules, At least a portion of the wafer transfer device, characterized in that consisting of a twin module of the form of two adjacent transfer modules combined. The method of claim 1, wherein the plurality of process modules, At least a portion of the wafer transfer device, characterized in that consisting of a twin module of the form of two adjacent adjacent process modules combined. The method of claim 1, wherein the first robot of the EFEM, Wafer transfer device characterized in that the articulated robot that can go straight and rotate. The method of claim 1, The wafer transfer between the EFEM and the load lock module is performed at atmospheric pressure, Wafer transfer between the load lock module and the transfer module and wafer transfer between the transfer module and the process module are performed in a vacuum state.

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