KR100733809B1 - Cooling part, substrate, and electronic equipment - Google Patents

Abstract

A cooling component for cooling an electronic component mounted on a substrate, a sheet metal member having thermal conductivity, which has a substantially U-shaped cross section, and includes a pair of mounting plates parallel to each other and a connecting plate connecting the pair of mounting plates. And a cooling fan attached to one attachment plate of the heat radiation member, wherein the other attachment plate of the heat radiation member is attached to the substrate in contact with the electronic component mounted on the substrate. It is configured to be.

Description

Cooling Components, Boards & Electronics {COOLING PART, SUBSTRATE, AND ELECTRONIC EQUIPMENT}

The present invention relates to cooling components, substrates and electronics.

Conventionally, various structures have been proposed for cooling a heat generating electronic component such as a CPU or the like.

For example, the portable computer 1 shown in FIG. 18 includes a box-shaped housing 10 made of synthetic resin, a Tape Carrier Pakage 11 which is a CPU housed inside the housing 10 and generates heat during operation; It is provided in the housing 10 and has a heat sink 12 for dissipating heat transferred from the TCP 11.

The heat sink 12 has a heat dissipation part 13 exposed to the outside of the housing 10. In Fig. 18, reference numeral 10a denotes an upper housing, 10b denotes a lower housing, and 13a denotes an electric fan (see Patent Document 1, for example).

The portable computer 1 can exhaust the heat of the circuit elements to the outside of the housing 10 efficiently and can cope with the miniaturization of the housing 10 without difficulty.

In addition, the personal computer 2 shown in FIG. 19 includes a main printed circuit board 18 on which semiconductor packages 16 and 17 as heating components are mounted, and a cooling unit 19 for cooling the heating components. This is arranged.

The cooling unit 19 has a heat sink 20 disposed to face the heat generating component and the main printed circuit board 18, and a cooling fan 21 attached to the heat sink 20.

The cooling fan 21 passes air around the heat generating component and the heat sink to suck air in the apparatus main body, and exhausts the air to the outside of the apparatus main body through the exhaust port 22. The cooling fan 21 is arrange | positioned in the state which the exhaust port 22 is in direct communication with the exhaust hole 23 formed in the apparatus main body (for example, refer patent document 2).

Such a small electronic device can efficiently cool the heat-generating component and can reduce noise.

In addition, in the information processing apparatus 3 shown in FIG. 20, a tubular heat dissipation duct 25 made of a material having high thermal conductivity is disposed inside the apparatus, and both ends of the cabinet 26 are connected to each other through a packing 27 or the like. It is in close contact with the inlet port 26a and the exhaust port 26b.

The heat dissipation duct 25 is disposed inside the apparatus in contact with the heat generating component 28, and the heat radiation of the external air is realized in the heat dissipation duct 25 using the fan motor 29 or the like, thereby realizing heat dissipation of these components. In addition, it is possible to block the outside air, thereby improving waterproofing and dustproofing (see Patent Document 3, for example).

Since the information processing apparatus 3 can cool the heat generating parts 28 inside the apparatus while improving dustproofness and waterproofness, the information processing apparatus 3 is applied to an information processing apparatus with a lot of opportunities for use outdoors.

In addition, the electronic device 4 shown in FIG. 21 includes a cooling unit 30. The cooling unit 30 is configured such that heat is transferred to the heat sink 34 by the heat absorbing plate 32 and the heat pipe 33, and the heat sink 34 is heated by this heat transfer.

The heated heat sink 34 is forcedly cooled by the blowing by the cooling fan 35 inclined by its fan support 34a, and the air warmed by this forced cooling is almost horizontal by the exhaust passage 34e. It is guided in the direction, and is exhausted out of the housing from the exhaust port provided in the housing.

This exhaustion prevents local heating of the portion located above the CPU attached to the heat absorbing plate 32, and as a result prevents the discomfort of the operator's fingertips (see Patent Document 4, for example). .

Patent Document 1: Japanese Patent Application Laid-Open No. 10-11174

Patent Document 2: Japanese Patent Application Laid-Open No. 2001-14067

Patent Document 3: Japanese Patent Application Laid-Open No. 11-194859

Patent Document 4: Japanese Patent Application Laid-Open No. 2000-227822

However, the conventional portable computer 1 shown in FIG. 18 is in a position where the TCP 11 and the heat sink 12 are spaced apart, and a CPU with a large amount of heat generated in a current notebook personal computer is used. There was a risk that the CPU could not be cooled sufficiently.

In addition, since the personal computer 2 shown in FIG. 19 needs to cut off a part of the main printed circuit board 18 on which the cooling fan 21 is installed, the mounting area of the main printed circuit board 18 is reduced. There was problem to let.

Since the information processing apparatus 3 shown in FIG. 20 cools the heat generating parts 28 by air passing through the heat dissipation duct 25, there is a problem that the cooling efficiency is poor.

In addition, the electronic device 4 shown in FIG. 21 enables cooling while reducing the installation height by using the axial cooling fan 35 which is inexpensive. However, since the CPU and the cooling fan 35 are mounted on the same surface of the substrate, there is a problem that the mounting area of the substrate is reduced.

This invention is made | formed in view of such a problem, and makes it a subject to provide the cooling component, board | substrate, and electronic device which can fully cool a heat generating electronic component, without reducing the mounting area of a board | substrate.

MEANS TO SOLVE THE PROBLEM This invention employ | adopted the following means in order to solve the said subject.

That is, the present invention relates to a cooling component for cooling an electronic component mounted on a substrate, wherein a sheet metal member having a thermal conductivity is formed in a substantially U-shape, and has a pair of attachment plates and a pair of attachments parallel to each other. A heat dissipation member having a connection plate for connecting a plate, and a cooling fan attached to one attachment plate of the heat dissipation member, and the other attachment plate of the heat dissipation member contacts the electronic component mounted on the substrate. It can be attached to the said board | substrate in one state.

According to the present invention, heat generated in the electronic component is transferred to the attachment plate on which the cooling fan is mounted via one attachment plate and the connecting plate of the heat dissipation member, and is cooled by the cooling fan.

Here, the cooling fan may be mounted on an outer surface of the attachment plate, and an opening communicating with the intake port of the cooling fan may be provided in the attachment plate to which the cooling fan is attached.

In this case, air in the gap between the substrate and the mounting plates on which the cooling fan is mounted is further drawn into the cooling fan through the opening. Accordingly, outside air flows into the gap.

And the board | substrate side surface of an electronic component is cooled by the air which flowed into this clearance gap. That is, since the electronic component is cooled on both sides, the electronic component can be sufficiently cooled.

Moreover, the said pair of mounting plates can be mutually matched and arrange | positioned. In this case, since the air introduced into the gap from the outside by the suction of the cooling fan contacts the portion where the electronic component of the substrate is mounted, the cooling effect of the electronic component is increased.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate on which at least one surface is mounted an electronic component, wherein a sheet metal member having thermal conductivity is formed in a substantially U-shaped cross section, and a pair of mounting plates and a pair of mounting plates that are substantially parallel to each other And a heat dissipation member having a connecting plate for connecting, and a cooling fan attached to one attachment plate of the heat dissipation member, wherein the pair of attachment plates are disposed to sandwich the substrate, and the other side of the heat dissipation member. Is attached to the electronic component, the connecting plate is located outside the substrate area, and the cooling fan attached to the one mounting plate is positioned on a surface different from the surface on which the electronic component is mounted. It is.

Here, a gap may be provided between the mounting plate on which the cooling fan is mounted and the substrate.

An electronic component can be mounted in the gap. In this case, the installation density of a board | substrate becomes high.

The pair of mounting plates of the heat dissipation member may be matched to each other, and the cooling fan may be disposed at a position facing the electronic component.

In this case, since the air sucked into the gap by the cooling fan directly contacts the mounting portion of the electronic component, the cooling effect of the electronic component is improved.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device having a substrate on which at least one surface is mounted an electronic component, wherein the sheet metal member has a thermal conductivity and is formed almost in a shape of a cross, and a pair of attachment plates and a pair of plates substantially parallel to each other A heat dissipation member having a connection plate connecting the pair of attachment plates, and a cooling fan attached to one attachment plate of the heat dissipation member, wherein the pair of attachment plates are disposed to sandwich the substrate therebetween, The attachment plate on the other side of the heat dissipation member contacts the electronic component, the connection plate is located outside the region of the substrate, and the cooling fan attached to the one attachment plate is different from the surface on which the electronic component is mounted. It is configured to be located on the surface.

Here, a gap may be provided between the mounting plate on which the cooling fan is mounted and the substrate.

In addition, an electronic component can be mounted in the gap.

In addition, the pair of mounting plates of the heat dissipation member may be aligned with each other, and the cooling fan may be disposed at a position facing the electronic component.

In addition, each component described above can be combined with each other, unless the meaning of this invention deviates.

1 is a perspective view of a cooling component of the present invention.

2 is a perspective view showing a heat dissipation member of the present invention.

3 is a cross-sectional view taken along the line A-A of FIG.

4 is a view from the arrow B direction of FIG.

Figure 5 is a bottom view showing a cooling fan of the present invention.

Figure 6 is a perspective view of the cooling fan of the present invention.

7 is an exploded perspective view showing a cooling component of the present invention.

8 is a perspective view of the cooling component of the present invention seen from the cooling fan side;

9 is a plan view showing a substrate of the present invention.

10 is a cross-sectional view taken along the line C-C in FIG.

Fig. 11 is a cross-sectional view showing the heat radiation rubber between the CPU and the heat radiation member of the present invention.

12 is a view from the arrow D in FIG. 10; FIG.

Figure 13 is an exploded perspective view of the main board of the present invention.

Fig. 14 is a perspective view showing a notebook personal computer of the present invention.

Fig. 15 is an exploded perspective view showing the notebook personal computer of the present invention.

16 is an exploded perspective view showing a conventional notebook personal computer.

17 is a cross-sectional view showing a state in which a CPU and a cooling fan of a conventional notebook personal computer are connected by heat pipes;

18 is a cross-sectional view showing a conventional example.

19 is an exploded perspective view showing another conventional example.

20 is a cross-sectional view showing another conventional example.

21 is a sectional view showing another conventional example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 shows a cooling part 5 according to the invention. This cooling component 5 is a cooling component for cooling the CPU 67 (refer to FIG. 10) which is an electronic component mounted on a board | substrate.

The cooling component 5 includes a heat dissipation member 51 formed of a sheet metal member having thermal conductivity and a cooling fan 52.

As illustrated in FIG. 2, the heat dissipation member 51 includes a pair of first and second mounting plates 53 and 54 parallel to each other, and a pair of first and second mounting plates 53 and 54. And a connecting plate 55 for connecting the two, which are integrally molded.

These first and second attachment plates 53 and 54 and the connecting plate 55 are formed in a substantially U-shaped cross section as shown in FIG. In addition, the 1st and 2nd attachment plates 53 and 54 are mutually arrange | positioned.

As shown in FIG. 4, the first attachment plate 53 is formed to be substantially the same as or slightly larger than the attachment surface of the cooling fan 52 (see FIG. 1). The tip of the first mounting plate 53 is formed in an arc shape.

The first mounting plate 53 is provided with an arc-shaped inlet port 56 communicating with the first suction port 85 (see FIG. 6) of the cooling fan 52. These intake openings 56 have the same center.

In addition, the first attachment plate 53 is provided with a hole 57 for attaching the cooling fan 52.

As shown in FIG. 2, the second attachment plate 54 is formed to be substantially the same as or slightly larger than the outer surface of the CPU 67 (see FIG. 10).

In addition, the second attachment plate 54 is provided with a hole 58 and a cutout 76 through which screws for mounting to the substrate 66 (see FIG. 9) are passed. In addition, in FIG. 2, the code | symbol 59 is a hole which let a driver pass when assembling the cooling fan 52 in the 1st mounting plate 53. As shown in FIG.

As illustrated in FIG. 5, the cooling fan 52 includes a case 60 having a semicircular shape and a straight side opposite to the case 60, a motor 61 attached to the case 60, and a motor 61 attached to the motor 61. An impeller 62 is provided.

The case 60 is formed relatively thin as shown in FIG. One side of the case 60 is open to the front, and an intake port 85 is provided. Further, an arc-shaped inlet port 56 (see FIG. 8) is formed on the surface opposite to the inlet port 85 of the case 60.

In addition, an exhaust port 63 is provided at the straight end of the case 60. The attachment screw hole 64 is provided in the outer peripheral part of the case 60.

The center of the motor 61 is disposed at the center of the arc of the inlet port 56. The impeller 62 is attached to the central axis of the motor 61. This impeller 62 rotates above the inlet port 56.

When the impeller 62 rotates, air is sucked into the casing 60 from the intake ports 85 and 56 on both sides thereof, and is discharged from the exhaust port 63.

When attaching the cooling fan 52 to the heat dissipation member 51, as shown in FIG. 7, the inlet port 85 of the side on which the cooling fan 52 is opened has an outer surface 53a of the first mounting plate 53. The exhaust port 63 is directed toward the connecting plate 55 side.

Then, the case 60 of the cooling fan 52 is brought into contact with the outer surface 53a of the first attaching plate 53, and the case 60 is fixed to the first attaching plate 53 by using the screw 65. do.

Accordingly, as shown in FIG. 8, the inlets 56 and 85 of the cooling fan 52 are opened substantially parallel to the first mounting plate 53, and the exhaust port 63 is opened to the first mounting plate 53. It is opened at a right angle with.

9 shows the main board 6 using the cooling component 5. The main board 6 has a CPU 67 mounted on one side of the substrate 66. On this CPU 67, the second mounting plate 54 of the cooling component 5 is attached. In Fig. 9, reference numerals 68 to 72 denote electronic components, and 99 denote PC card connectors.

The cooling component 5 is attached so that the CPU 67 and the board | substrate 66 may be interposed between the 1st attachment plate 53 and the 2nd attachment plate 54 as shown in FIG. The gap d is provided between the first mounting plate 53 and the substrate 66.

A heat dissipation rubber 87 is sandwiched between the CPU 67 and the second mounting plate 54 as shown in FIG. The gap between the CPU 67 and the second mounting plate 54 is filled by the heat dissipation rubber 87, and air can be prevented from being interposed between the CPU 67 and the second mounting plate 54. . As a result, heat of the CPU 67 is efficiently transferred to the second attachment plate 54.

In addition, a filler such as grease or silicon can be filled between the CPU 67 and the second mounting plate 54 instead of the heat dissipation rubber 87.

As shown in FIG. 12, the cooling fan 52 has an exhaust port 63 disposed near the end edge 66a of the substrate 66. Thus, the air discharged from the exhaust port 63 of the cooling fan 52 is discharged to the outside of the substrate 66.

As shown in FIG. 10, a bay drive 73 is mounted on the cooling fan 52 side of the substrate 66. Here, the height of the cooling fan 52 with respect to the board | substrate 66 is made into H1, and the height of the bay drive 73 with respect to the board | substrate 66 is made into H2. The height H1 of the cooling fan 52 is equal to or less than the height H2 of the bay drive 73.

That is, even if the cooling fan 52 is arranged on the opposite side of the CPU 67, the height H1 of the cooling fan 52 is absorbed by the height H2 of the bay drive 73. Therefore, the main board 6 does not increase in size due to the attachment of the cooling component 5.

Moreover, the electronic component 75 mounted in the board | substrate 66 is arrange | positioned in the clearance gap d between the board | substrate 66 and the 1st mounting plate 53 of the cooling component 5. As shown in FIG. Therefore, compared with the case where the cooling fan 52 is directly attached to the board | substrate 66, the installation density of the board | substrate 66 becomes high.

When attaching the cooling component 5 to the substrate 66, the second mounting plate 54 of the cooling component 5 is brought into contact with the upper surface 67a of the CPU 67 as shown in FIG. . Next, the hole 58 and the cutout portion 76 of the second mounting plate 54 are fitted to the screw portion 77 provided in the vicinity of the corner portion of the CPU 67. Then, the screw 88 is screwed into the threaded portion 77 through the hole 58 and the cutout 76.

FIG. 14 shows a notebook type personal computer 7 which is an electronic device using the main board 6. This notebook computer 7 has a main body 81 and an LCD (liquid crystal display) 82. The main body 81 is provided with a keyboard 83.

The main body 81 has a lower cover 84 as shown in FIG. The main board 6 and the bay drive 73 are housed in the lower cover 84. The heat sink 86 is provided on the main board 6.

As described above, in the present invention, the second mounting plate 54 of the heat dissipation member 51 is almost entirely in contact with the CPU 67. Part of the heat generated by the CPU 67 is transferred to the first mounting plate 53 to which the cooling fan 52 is attached through the second mounting plate 54 and the connecting plate 55 of the heat dissipation member 51. It is cooled by the cooling fan 52.

On the other hand, part of the heat generated by the CPU 67 is transferred to the substrate 66. Here, in the gap d between the substrate 66 and the first mounting plate 53, air at normal temperature is sucked from the outside by the cooling fan 52.

The air comes into contact with the portion where the CPU 67 of the substrate 66 is mounted, and then the air intake port 56 provided on the first mounting plate 53, the intake port 85 of the cooling fan 52, and the case 60. It discharges from the exhaust port 63 through the space inside. At this time, the substrate 66 is cooled by the air introduced into the gap d from the outside.

That is, in the present invention, since both sides of the CPU 67 are cooled by the cooling fan 52, the large CPU 67 having a large heat generation amount can be sufficiently cooled.

In addition, since the pair of first and second mounting plates 53 and 54 of the cooling component 5 are disposed at substantially matched positions with each other, the cooling fan 52 sucks into the gap d from the outside. The made air comes into contact with the portion where the CPU 67 of the substrate 66 is mounted. Therefore, the CPU 67 can be cooled reliably.

In the main board 6 of the present invention, since the gap d is formed between the cooling fan 52 and the substrate 66 as described above, the other electronic components 75 in the gap d. Can be mounted. Thus, the installation density of the substrate 66 is improved.

The present invention is limited to the size of the main board 6 and is suitable for the notebook personal computer 7 or the like having the CPU 67 having a large heat generation amount.

Here, the conventional notebook personal computer 9 shown in FIG. 16 is considered. In this conventional notebook computer 9, a cooling fan 92 is attached to the lower cover 91. The board | substrate 93 is arrange | positioned above this cooling fan 92 (upper side in FIG. 16).

In Fig. 16, reference numeral 95 denotes a heat sink, 96 denotes an LCD, and 97 denotes a duct.

In this conventional notebook personal computer 9, when the CPU 94 is mounted on the upper surface 93a of the substrate 93, that is, on the opposite side of the cooling fan 92 with the substrate 93 therebetween. Review.

In this case, conventionally, as shown in Fig. 17, the CPU 94 and the cooling fan 92 are connected by the heat pipe 98. 17, the attachment blocks 98a and 98b are shown.

However, in this case, since the attachment part of the heat pipe 98 is arrange | positioned in the up-down direction, the thermal conductivity of the heat pipe 97 falls, and CPU94 cannot fully be cooled.

In contrast, in the present invention, since the CPU 67 and the cooling fan 52 arranged up and down are connected by the heat radiating member 51 formed of the sheet metal member, the thermal conductivity can be prevented from decreasing (see FIG. 10). ).

In the above-described embodiment, the case where the CPU 67 is cooled by the cooling component 5 has been described. However, the present invention can be applied to the case where the electronic components that generate heat other than the CPU are cooled.

The present invention can be used in various electronic devices such as computers.

Claims (11)

A cooling component for cooling an electronic component mounted on a substrate, A heat radiation member having a thermally conductive sheet metal member having a cross section having a 'co' shape and having a pair of mounting plates parallel to each other and a connecting plate connecting the pair of mounting plates; A cooling fan attached to one mounting plate of the heat dissipation member, The pair of attachment plates of the heat dissipation member are disposed to sandwich the electronic component mounted on both sides of the substrate, and the other attachment plate of the heat dissipation member is in contact with the electronic component mounted on the substrate. And a cooling component attached to the substrate. According to claim 1, wherein the cooling fan is mounted on the outer surface of the mounting plate, And said opening plate provided with said cooling fan is provided with an opening communicating with an intake port of said cooling fan. The cooling component according to claim 1, wherein the pair of mounting plates are arranged to match each other. As a board with electronic components mounted on both sides, A heat radiation member having a thermally conductive sheet metal member having a cross section having a 'co' shape and having a pair of mounting plates parallel to each other and a connecting plate connecting the pair of mounting plates; A cooling fan attached to one mounting plate of the heat dissipation member, The pair of attachment plates are arranged to sandwich the electronic component mounted on both sides of the substrate, The attaching plate on the other side of the heat dissipation member contacts the electronic component on one side, the connecting plate is located outside the substrate area, and the cooling fan attached to the attaching plate on the other side is on the other side of the electronic component. A substrate disposed on the substrate. The board | substrate of Claim 4 provided with the clearance gap between the said mounting plate in which the said cooling fan was mounted, and the said board | substrate. The substrate according to claim 5, wherein an electronic component is mounted in the gap. The substrate according to claim 4, wherein the pair of attachment plates of the heat dissipation member are disposed to match each other, and the cooling fan is disposed at a position facing the electronic component. An electronic device including a substrate having electronic components mounted on both sides, A heat radiation member having a thermally conductive sheet metal member having a cross section having a 'co' shape and having a pair of mounting plates parallel to each other and a connecting plate connecting the pair of mounting plates; A cooling fan attached to one mounting plate of the heat dissipation member, The pair of attachment plates are arranged to sandwich the electronic component mounted on both sides of the substrate, The other attachment plate of the heat dissipation member contacts the electronic component on one side, the connecting plate is located outside the region of the substrate, and the cooling fan attached to the one attachment plate is on the other side of the electronic component. The electronic device disposed in the. The electronic device according to claim 8, wherein a gap is provided between the attachment plate on which the cooling fan is mounted and the substrate. The electronic device of claim 9, wherein an electronic component is mounted in the gap. The electronic device of claim 8, wherein the pair of attachment plates of the heat dissipation member are disposed to match each other, and the cooling fan is disposed at a position facing the electronic component.

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