KR100703552B1 - Manufacturing process of electronic paper display device by embossed stamping - Google Patents

Abstract

The present invention relates to a method for manufacturing an electronic paper display device using an embossed stamping method, comprising: forming a lower electrode on a lower substrate and forming an upper electrode under the upper substrate; Forming a plurality of barrier ribs for forming pixel spaces on the lower electrodes; Preparing a stamp having an embossed structure at intervals corresponding to the distances between the plurality of partition walls, the adhesive being provided on the embossed structure; Burying the adhesive provided on the stamp on the plurality of barrier ribs; Injecting particles for representing an image into the pixel space formed by the barrier ribs; Stacking and attaching the upper substrate on which the upper electrode is formed to the upper surface of the partition on which the adhesive is buried; and in the manufacturing method of the electronic paper display device using the embossed coating method, the adhesive is directly applied to the partition. However, because of the indirect method using a separate stamp, there is an effect that can be applied to the adhesive even on the top surface of the very small partition wall.

Electronic paper, bulkhead, embossed painting

Description

Manufacturing Process of Electronic Paper Display Device by Embossed Stamping

1 is a cross-sectional view showing a cell structure of a collision charge type electronic paper display device according to the prior art;

2 is a cross-sectional view showing a bent form of an electronic paper display device according to the prior art,

3 is a schematic cross-sectional view showing the step of bonding the substrate and the partition wall of the electronic paper display device according to the prior art,

4 and 5 are process diagrams illustrating a manufacturing step of a substrate and a partition wall of an electronic paper display device according to an embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating a stamp used in a method of manufacturing an electronic paper display device using an embossed coating method according to an embodiment of the present invention.

7a and 7b is a schematic diagram showing the step of burying the adhesive provided on the stamp on the upper surface of a plurality of partitions in one embodiment according to the present invention,

8 to 10 is a schematic diagram showing the step of bonding the substrate and the partition wall using an adhesive according to an embodiment of the present invention,

11A to 11E are process diagrams illustrating a process of manufacturing a stamp used in a method of manufacturing an electronic paper display device using an embossed coating method according to an embodiment of the present invention.

** Description of Symbols for Main Parts of Drawings **

1: lower substrate 2: lower electrode

3: lower insulation layer 4: partition wall

5: stamp 6: adhesive

7: roller 8: particle

9: upper substrate 10: substrate

11: photoresist (PR) 12: engraved

13: mold 14: embossed frame

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic paper display device using an embossed stamping method, and more particularly, to a method for bonding a substrate and a partition wall of an electronic paper using the embossed stamping method. More specifically, it has an embossed structure at an interval corresponding to the distance between the plurality of partitions, and the adhesive provided on the stamp is applied to the upper surface of the plurality of partitions by using a stamp on which the adhesive is provided. It is characterized in that it comprises a;

Due to the need for a transformation into a way of communicating and sharing information that corresponds to the information society that requires a new paradigm today, the development of electronic paper technology, which has the advantage of being able to bend as a flexible display, is entering the commercial development stage. . Electronic paper display is a flexible display device that can display characters or images by millions of beads scattered between flexible substrates such as thin plastics, which can be reproduced and used millions of times. It is expected to replace the existing print media.

In addition to the electrophoretic phenomenon, the technical approach for implementing the flexible display device includes a liquid crystal, an organic EL, a reflective film reflective display, an electrophoresis, a twist ball, and a mechanical reflective display. At present, the most attention is the display display device using the electrophoresis phenomenon. It is based on electrophoresis, which applies electromagnetic fields to conductive materials to make it moveable. It distributes conductive particles between thin flexible substrates and then collides the particles by changing the polarity of the electromagnetic field. The data is represented by a change in the arrangement of the charged particles in the direction of the arrow.

The cell structure of the collision charged electronic paper display device is shown in FIG. 1 and briefly described as follows. As shown, the structure includes upper and lower substrates 70 and 10 formed of plastic or glass, and upper and lower electrodes formed of transparent electrode ITO to apply a driving voltage of the device on the upper and lower substrates. 80 and 20, upper and lower insulating layers 90 and 30 selectively coated on the upper and lower electrodes, a partition wall 40 separating the cell and the cell, and a white tablet formed between the two electrodes. It consists of the positive charged particle 50 and the black negative charged particle 60. In addition, although the upper and lower insulating layers 90 and 30 are omitted, there is no problem in driving, but it is preferable that the upper and lower insulating layers 90 and 30 are selected to reduce the movement of the charged particles attached to the electrode.

In the electronic paper display device having the above structure, when sufficient voltage is applied to the upper electrode 80 and the lower electrode 20, charged particles 50 and 60 charged according to the applied electrode polarity are attracted to each electrode. . For example, when-voltage is applied to the upper electrode 80 and + voltage is applied to the lower electrode 20, the white charged particles 50 positively charged by the coulomb force move toward the upper substrate 70. The charged black charged particles 60 move toward the lower substrate 10. Since the white charged particles 50 are located on the upper substrate 70 side, the white charged particles 50 appear to be white when viewed from the outside. On the contrary, when + voltage is applied to the upper electrode 80 and-voltage is applied to the lower electrode 20, the negatively charged black charged particles 60 move toward the upper substrate 70, and the positively charged white charged particles ( 50 is moved toward the lower substrate 10 to be displayed in black. Therefore, after applying a voltage so that all the cells appear white at first, only the desired cell is applied with the opposite voltage so that the cells appear black.

In the collision charge type electronic paper display device according to the related art, the charged particles 50 and 60 are vertically connected to the opposing substrates 10 and 70 to prevent movement of the charged particles 50 and 60 in the parallel direction of the substrates 10 and 70. The barrier rib 40 is formed, and the display unit of the display apparatus is implemented by a plurality of display cells divided by the barrier rib 40.

The partition wall 40 separates the pixel from the pixel, and serves to maintain a constant gap between the upper plate and the lower plate. In addition, in the flexible display device, the partition wall 40 stacked between the upper and lower plates not only has to serve as a support for maintaining a constant space between the upper and lower plates, but particularly in a flexible device that is flexibly bent. Even if the partition 40 is to be bonded to the top plate and the lower plate without falling.

Otherwise, when the shape of the display device is deformed and bent, as shown in FIG. 2, the partition 40 is frequently lifted apart from the upper substrate 70 and the lower substrate 10. This results in a decrease in the overall quality of the display device. Therefore, particularly in the flexible display device that needs to be flexibly bent, the partition 40 should be attached to the upper and lower plates well.

If the upper plate, the lower plate and the partition 40 are separated from each other due to the warp, or any portion (particularly, the middle portion) is lifted up, the charged particles 50 and 60 disposed in each pixel space are different from each other. Moving to space results in unstable image quality and pixel drop, resulting in serious defects in the product's own defects.

Therefore, in recent years, the ultraviolet (UV) curable adhesive 100 is used to prevent the partition 40 from falling off from the upper plate and the lower plate and to prevent the charged particles from moving to other pixel spaces. As shown in FIG. 3, the UV-curable adhesive agent 100 is applied to the upper surface of the partition 40 formed on the lower substrate 10, the upper substrate 70 is laminated, and UV light is emitted from the upper substrate 70. By mirroring, the partition 40 and the upper substrate 70 are bonded to each other by the UV curable adhesive 100.

The UV-curable adhesive agent 100 used herein is an adhesive in which the photoreaction initiator in the liquid adhesive starts to react and is solidified into a solid adhesive within a short time when ultraviolet light by an ultraviolet lamp is irradiated onto the adhesive. That is, before ultraviolet light is irradiated, it is an adhesive in a liquid form, and when such a liquid adhesive is used, it is important to apply it to the upper surface of the partition wall accurately.

However, until now, such a liquid UV curable adhesive 100 has been applied to the upper surface of the partition wall 40 by a roller or a transfer method. In this case, the adhesive is applied to the upper surface of the partition wall 40 having a narrow area. There is a technical problem that it is quite difficult to apply correctly in a sufficient amount. In addition, in the case of the roller, the liquid adhesive may flow not only to the upper surface of the partition 40 but also to the side surface of the partition 40 to cause defective products. In addition, in the case of using the UV-curable adhesive 100, ultraviolet rays must be irradiated, and when the ultraviolet rays are irradiated onto the upper substrate, the particles in the pixel space receive heat by ultraviolet rays, thereby causing the particles to be damaged.

For this reason, in the method of manufacturing an electronic paper display device, the adhesion between the upper and lower substrates and the barrier ribs is not easily dropped, and the barrier ribs and the substrate can be easily bonded through the upper surface of the barrier ribs having a small area without damaging the particles. There is an urgent need for a way to do this.

The present invention has been made to solve the above problems, to provide a new method for bonding the substrate and the partition wall of the electronic paper using the embossed coating method in the manufacturing method of the electronic paper display device. In particular, according to the present invention, the adhesive is provided on the stamp by using a stamp having a relief structure at an interval corresponding to the distance between the plurality of partition walls, the adhesive is provided on the relief structure of the plurality of Disclosure of Invention It is an object of the present invention to provide a method for manufacturing an electronic paper display device using an embossed coating method comprising the step of burying an upper surface of a partition wall.

According to the present invention, it is to reduce the defect rate by the outflow of the liquid type UV curable adhesive as in the prior art, and to reduce the damage of the particles by the heat source. In addition, the adhesive is not applied directly to the partition wall, but by an indirect method using a separate mold, so as to precisely apply the adhesive to the top surface of the very small partition wall by adjusting the size of the embossed structure of the stamp.

The present invention for achieving the above object relates to a method of bonding the substrate and the partition wall of the electronic paper using the embossed coating method, and more particularly to form a lower electrode on the lower substrate and the upper electrode under the upper substrate step; Forming a plurality of barrier ribs for forming pixel spaces on the lower electrodes; Preparing a stamp having an embossed structure at intervals corresponding to the distances between the plurality of partition walls, the adhesive being provided on the embossed structure; Burying the adhesive provided on the stamp on the plurality of barrier ribs; Injecting particles for representing an image into the pixel space formed by the barrier ribs; Stacking and bonding the upper substrate on which the upper electrode is formed to the upper surface of the barrier rib on which the adhesive is buried; and a method of manufacturing an electronic paper display device using an embossed coating method.

Here, the step of burying the adhesive provided on the stamp on the upper surface of the plurality of partition walls is to contact the plurality of partition walls formed on the adhesive and the lower substrate of the stamp, and then rub the stamp with a roller to the adhesive to the plurality of partition walls It may be characterized by being buried on the upper surface. In addition, after the adhesive of the stamp and the plurality of partitions formed on the lower substrate abut, it is also possible to rub the lower substrate with a roller to bury the adhesive on the upper surface of the plurality of partitions.

Another aspect of the invention relates to a method of making the stamp. In the present invention characterized by bonding the substrate and the partition wall using the embossed coating method, the stamp to be an embossed coating substrate as an indirect printing means for this step of producing a mold (mold) in which a negative pattern is formed on one side ; Injecting and curing a mold material on the mold to produce an embossed mold; It is preferred that the embossed mold with the mold to release the step of producing an embossed frame having an embossed structure;

Here, after the step of manufacturing the embossed frame having the embossed structure, it may further comprise the step of providing an adhesive on the embossed structure. The method may further include coating a release agent on the surface of the relief frame between manufacturing the relief frame having the relief structure and providing the adhesive, and activation of the relief surface by plasma treatment. In addition, a method of introducing a hydrophilic group is also a method of manufacturing an electronic paper display device using a preferred relief coating method.

In the method of manufacturing the stamp, the manufacturing of the mold on which the engraved pattern is formed may include applying a photoresist on a substrate; The photoresist may be exposed to light using a photomask to develop a pattern of an intaglio shape, and the substrate may be a silicon substrate or a transparent glass substrate.

In addition, in the present invention described above, another preferred embodiment of the present invention is that the stamp, which is an indirect coating substrate, contains polydimethylsiloxane (PDMS) as a main component. Further, the thickness of the stamp may be in the range of 0.1cm to 1cm, the thickness of the relief structure of the stamp is preferably in the range of 1㎛ to 500㎛, the width length of the relief structure of the stamp is in the range of 0.5㎛ to 500㎛ It is more preferable to be inside.

The present invention as described above is to bond the substrate and the partition wall using an embossed coating method, and when the voltage is applied to the electrode formed on the substrate to prevent the charging particles for image representation to move to another cell, the lower electrode according to the present invention A lower insulating layer may be formed on the upper insulating layer, and an upper insulating layer may be formed below the upper electrode, and the particles used in the present invention may be used for all particles used to represent an image in the technical field to which the present invention belongs. It is possible, but preferably a method of manufacturing an electronic paper display device using the embossed coating method, characterized in that the chargeable or charged dry particles.

Hereinafter, one preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. The invention can be better understood by the following examples, which are intended for the purpose of illustration of the invention and are not intended to limit the scope of protection defined by the appended claims.

4 and 5 are process diagrams illustrating a manufacturing step of a substrate and a partition of an electronic paper display device according to an embodiment of the present invention, wherein reference numeral 1 is a lower substrate, 2 is a lower electrode, and 3 is a lower insulating layer. , 4 means bulkhead.

First, according to the manufacturing method of the electronic paper display device using the embossed coating method according to the present invention, forming a lower electrode 2 on the lower substrate 1, and forming an upper electrode (not shown) below the upper substrate Go through. In the present invention, forming the upper electrode on the upper substrate is the same as the method of forming the lower electrode 2 on the lower substrate 1, and thus, the method of forming the lower electrode 2 on the lower substrate 1 will be described. Instead of the description of the upper substrate and the upper electrode.

As shown in FIG. 4, a transparent lower electrode 2 and a lower insulating layer 3 are sequentially formed on the lower substrate 1. Since the basic electrode structure of the electronic paper display device according to the present invention is a matrix structure, the lower electrode 2 has a shape as shown in the right side of FIG. Preferably, the transparent lower electrode 2 is ITO, and there is no problem in driving even if the lower insulating layer 3 applied thereon is omitted. Is preferably applied since it can be difficult to preserve the image for a long time without applying new power.

Next, a plurality of barrier ribs 4 are formed on the lower electrode 2 to form the pixel space. That is, as shown in FIG. 5, a plurality of partition walls 4 are formed on the lower electrode 2 and the lower insulating layer 3 formed on the lower substrate 1. In FIG. 5, the partition wall 4 is formed on the lower insulating layer 3, but in the present invention, the lower insulating layer 3 may be omitted, as described above. 2) it is also possible to form a barrier rib 4 for forming a pixel space directly on.

Since the partition 4 is simply used to distinguish cell units, the material may be variously applied to a polymer, an inorganic material, and the like. In the present invention, as a method for constructing the partition 4, a photolithography method using a photoresist, a method using a photosensitive polymer, a laminating method using a pre-made material, and the like are preferable. In the case of adhering (4), a method such as ultraviolet adhesive and ultraviolet irradiation may be applied on the preformed bottom plate. The partition 4 according to the present invention has a lattice structure as shown in the perspective view on the right side of FIG. 5.

Subsequently, a step of preparing a stamp 5 having an embossed structure at an interval corresponding to the distance between the plurality of partition walls and having an adhesive 6 provided on the embossed structure is performed. The stamp 5 has an embossed structure as shown in FIG. 6 and is provided with an adhesive 6. 6 is a cross-sectional view showing a stamp (5) used in the manufacturing method of the electronic paper display device using the embossed coating method in one embodiment according to the present invention.

In general, a "stamp" is a structure for stamping, which is one of metal processing methods, and is also called a forging. In addition, stamping here is a processing method which inserts a raw material between the upper and lower molds with an unevenness | corrugation, and makes an unevenness | corrugation in the plane of a raw material by applying a pressure by an impact. Sculptured molds are called forging molds, which are formed by pressing materials into them to form complex shaped products. For example, it is used for hardening, processing of a medal, manufacture of a small machine, and an electrical component, In the present invention, the stamp 5 is slightly different from that used in such a stepping method.

That is, the stamp 5 according to the present invention may be manufactured by the stamping method described above, but may be prepared by any method known to those skilled in the art. For example, it is possible to use a roller or a transfer method such as conventionally applying a liquid UV curable adhesive directly to the upper surface of the partition wall. It is also possible to have an adhesive on the relief structure. In particular, the present invention preferably prepares a mold to be used for applying the adhesive to a substrate or partition by stamping the stamp 5 on an adhesive, such as a mold for applying ink to a stamp or stamp. . In other words, as shown in FIG. 6, the stamp 5 has an embossed structure formed on the substrate, and thus precisely includes an adhesive 6 that can be accurately attached to the upper surface of the partition wall. That is, in the present invention, the stamp 5 for accurately applying the adhesive 6 on the upper surface of the partition wall may be referred to as a frame for stamping or stamping like a painting or a stamp.

In the present invention, the stamp 5 is used as an embossed coating substrate for performing the embossed coating method. That is, instead of applying the adhesive 6 directly on the partition wall, the adhesive 6 is attached by a separate indirect coating substrate in an indirect manner. By applying the adhesive 6 indirectly using the embossed coating in this way, it is possible to prevent the adhesive from adhering or flowing down the sides of the partition by a more accurate and clean method than the conventional method of applying the adhesive directly to the partition by a roller. It is.

The embossed coating method used in the present invention is similar to the embossed printing method, by a convex printing or embossed printing method, and is a method in which ink is imprinted on paper by embossed letters. This is one of the indirect printing methods for inking or painting the original paper, using a separate rubber blanket or substrate. There are two methods for transferring the ink from the plate to paper: direct printing, which transfers the ink directly to the paper, and indirect printing, which transfers the ink to a rubber blanket or substrate. Compared to this, indirect printing is a method of transferring an ink image to a rubber blanket once from a plate surface and printing it again on paper, whereas ordinary printing is directly printed on paper on a plate surface. The former is called direct printing and the latter is called indirect printing.

That is, in the present invention, in bonding the substrate and the partition wall by using an adhesive, the present invention is not based on a direct printing method in which the adhesive is directly applied to the partition wall or the substrate and bonded to the partition wall. By the mold (stamp in this invention) of this invention, an adhesive is affixed to the said mold, and the adhesive is apply | coated to a board | substrate or a partition, and it moves again by the embossed coating method which adheres.

In the present invention, the substrate and the partition wall of the electronic paper are bonded to each other by using the embossed coating method. That is, as a glass substrate having an embossed structure formed at an interval corresponding to the distance between the plurality of partitions, preferably within an area within the width of the partition wall, by using a stamp 5 provided with an adhesive 6 on the embossed structure, The adhesive is to be buried in the partition wall formed on the flexible substrate. After that, the flexible electronic paper device is completed by aligning and bonding with another flexible substrate again. The advantage of this method using the embossed coating method is that it is possible to form a very small pattern of adhesive and also to reuse the photo-mask used in the formation of the mold, which is an embossed coated substrate.

In addition, the embossed coating method is an indirect printing method that can be applied to metals and glass that were impossible by the direct printing method. Since the indirect printing method uses a separate rubber blanket or a substrate, the indirect printing method is clearly printed on rough surfaces, and the printing resistance is high. It is stronger than direct printing.

Subsequently, the adhesive 6 provided in the stamp 5 is buried on the upper surface of the plurality of partition walls 4. This is illustrated in detail in FIGS. 7A and 7B, which is a schematic diagram illustrating the step of burying the adhesive 6 provided in the stamp 5 on the upper surface of the plurality of partitions 4 as an embodiment according to the present invention.

In the present invention, the step of burying the adhesive 6 provided on the stamp 5 on the upper surface of the plurality of partition walls 4 may be carried out in two preferred embodiments. That is, as shown in FIG. 7A, after the adhesive 6 of the stamp 5 and a plurality of partition walls formed on the lower substrate are brought into contact with each other, the adhesive 6 is rubbed with the roller 7. It is also possible to bury the plurality of partition walls, and as shown in FIG. 7B, the lower substrate 1 is rubbed with a roller 7 so that the adhesive 6 buryes the plurality of partition walls. You may.

Both embodiments are preferred in that the adhesive 6 is accurately and precisely buried in the partition formed on the partition 4 or the lower substrate 1, and from the stamp 5 having the adhesive 6, Considering the ease with which the adhesive 6 is buried or the rigidity of the partition wall by the roller 7, the first method shown in FIG. 7A provides a plurality of formations on the adhesive 6 and the lower substrate of the stamp 5. It is more preferable that the partitions are brought into contact with each other, and then the stamp 5 is rubbed with a roller 7 so that the adhesive is applied to the plurality of partition walls.

As such, when the adhesive 6 is buried on the upper surface of the partition wall using the stamp 5 and the roller 7 provided with the adhesive 6 described above, the adhesive according to the present invention is previously matched with the gap between the partition walls. Since it is provided in the mold in position, only the adhesive on the embossed structure of the stamp 5 can be accurately buried in the substrate.

Subsequently, as shown in FIG. 8, particles 8 for displaying an image are injected into the pixel space formed by the partition wall 4. Particles 8 are for image representation, and two kinds of charged particles having different colors and charging characteristics may be mixed and injected, respectively. The particles 8 may be charged with charged or non-chargeable particles. The kind of the particles 8 is not particularly limited, and any particles used for image expression in the art may be used. That is, not only a solid but also particles of an electrolyte solution, a suspension, a sol, a gel, a capsule, and a twist ball may be included. Preferably, it is preferable to inject dry particles 8 having no viscous properties such as liquids, suspensions and the like. That is, after the uncharged particles 8 are injected, dry collision-charged particles having a charged type to form charged particles by applying a voltage to the upper and lower electrodes to collide the particles 8 with each other to be charged according to a collision ( 8) is preferred.

As the method of injecting the particles 8, a general method of injecting charged particles into an electronic paper display device may be used in the art. For example, particles can be injected into a cell in which a pixel space is formed by an injection method by a spray coating method, an injection method by an electrostatic coating method, or the like.

Finally, after the particles are injected, the upper substrate 9 on which the pre-fabricated upper electrode (not shown) is formed, as shown in FIG. 9, is laminated on the upper surface of the partition wall 4 on which the adhesive 6 is attached and bonded. Go through the steps. 9 is a schematic diagram showing the step of laminating the substrate and the partition wall 4 using the adhesive 6 in one embodiment according to the present invention, Figure 10 is a schematic diagram showing the step of bonding them.

The stacking and bonding method is such that the upper substrate 9 on which the upper electrode (not shown) is formed and the lower substrate 1 on which the partition wall 4 on which the adhesive 6 is buried are formed to face each other. Lower electrodes (not shown) are stacked in a vertical direction. The upper electrode and the lower electrode serve as a scan electrode and a data electrode to adjust the voltage of each cell.

As described above, since the adhesive 6 according to the present invention has already been provided in the relief structure at a position corresponding to the gap between the partition walls 4, only the adhesive 6 on the relief structure of the stamp 5 is correctly It could be buried on the upper surface of the partition wall, and thus the substrate and the partition wall 4 only by the adhesive 6 at the top of the partition wall 4 to be aligned and bonded among the various bonding parts existing on the upper substrate 9. This can be coalesced. In this case, when the upper substrate 9 and the partition wall 4 are bonded to each other by the adhesive 6 already attached to the upper surface of the partition wall 4, other partition walls 4 already bonded to the partition wall 4 to be bonded are bonded. Neither melts nor remains aligned. Thus, as in the case of using conventional UV ultraviolet rays, when one partition 4 is bonded, it will not affect the other partition 4 that is already bonded.

When the substrate and the partition wall of the electronic paper are bonded together using the embossed coating method according to the present invention as described above, since the UV curable adhesive is not used as in the prior art, the defect rate due to the leakage of the liquid adhesive can be prevented, Damage can also be significantly reduced. In addition, since the present invention is based on an indirect method using a separate stamp 5 rather than directly applying the adhesive 6 to the partition wall, the size of the embossed structure of the stamp 5 is adjusted so that the top of the partition wall is very small. It is possible to apply the adhesive evenly to the surface.

Another preferred embodiment of the present invention relates to a method of manufacturing a stamp 5 having an embossed structure for using the embossed coating method, as shown in Figs. 11A to 11E. 11A to 11E are process diagrams illustrating a process of manufacturing a stamp 5 used in a method of manufacturing an electronic paper display device using an embossed coating method according to an embodiment of the present invention.

In the present invention characterized by bonding the substrate and the partition wall using the embossed coating method, the stamp 5 as an embossed coating substrate as an indirect printing means for this is a mold having a pattern of the intaglio shape 12 on one side ( manufacturing a mold (13); Injecting and curing a mold material on the mold 13 to produce an embossed frame 14; Manufacturing the relief frame 14 having the relief structure by releasing the relief frame 14 from the mold 13. That is, when the embossed frame 14 is manufactured by injecting and curing a mold material into the mold 13 on which the engraved shape 12 is formed, the embossed frame 14 conforms to the distance between the plurality of partition walls 4. An embossed structure is formed at intervals, and the stamp according to the present invention can be prepared by providing an adhesive 6 on the embossed structure.

To this end, first, as shown in FIG. 11C, a mold 13 in which a pattern of the intaglio shape 12 is formed on one side of the substrate 10 must be prepared. Here, the mold 13 refers to a mold for casting and casting, and is a concept including a template used for casting or formwork. Such a mold 13 is to accurately bury the adhesive 6 on the upper surface of the partition wall 4 in the present invention. It can be said that the mold used to produce the mold 14. Such a mold 13 is made of a heat resistant material appropriate for the temperature of the injection. When it is injected into a mold and solidified to produce a product as it is, it is called an ingot or ingot when it is made of a material that produces a rod, plate, line, etc. by tapping or stretching the solidified product. It is preferable to manufacture the mold 13 in which the intaglio pattern is formed by photosensitive the glass substrate 10 made of transparent glass using a photoresist 11 and a photomask (not shown).

Another preferred embodiment of the invention relates to a method of making such a mold 13. That is, the manufacturing of the mold 13 for manufacturing the stamp 5 according to the present invention comprises the steps of applying a photoresist (11) on the substrate (10); It is preferable to fabricate the photoresist 11 by developing a pattern of the intaglio shape 12 by exposing the photoresist 11 using a photo-mask. The method of manufacturing the mold 13 in which the pattern of the intaglio shape 12 which is such a preferred embodiment of this invention is formed is as shown to FIG. 11A and 11B.

First, as shown in FIG. 11A, a substrate 10 for manufacturing the mold 13 is prepared. The substrate 10 is not particularly limited, but is preferably a silicon substrate or a transparent glass substrate. As shown in FIG. 11B, the photoresist 11 is coated on the substrate 10, the photoresist 11 is exposed using a photomask, developed with a developer, and then fired and etched. By the process, the mold 13 in which the pattern of the intaglio shape 12 as shown in FIG. 11C was formed is produced.

To this end, the photomask according to the present invention is characterized in that the pattern is formed in a shape corresponding to the intaglio shape 12, that is, the intaglio structure of the mold 13. That is, in order to bury the adhesive 6 on the upper surface of the partition 4, the intaglio structure formed at an interval corresponding to the distance between the partitions 4 should not have a pattern to allow the adhesive material to enter, the partitions (4) The pattern is formed in an area where the upper surface of the c) is not in contact with each other, that is, a region of the substrate 10 of the mold 13 in which the intaglio structure is not formed, so that the adhesive material is not injected into the portion except the intaglio structure. The advantage of using the separate mold 13 to use the embossed coating method is that it allows the formation of very small microadhesives, and it is also possible to continue to reuse the photomask used for coating the adhesive with the glass substrate, which is an embossed coating substrate. It can be effective.

Subsequently, after fabricating the mold 13 in which the pattern of the intaglio 12 is formed by the above-described method, as shown in FIG. 11D, a mold material is injected and cured on the mold 13 to form an embossed frame 14. 11), the embossed mold 14 is released from the mold as shown in FIG. 11E to complete the embossed mold 14, ie, the stamp 5, having an embossed structure. That is, by preparing an embossed frame 14 having an embossed structure, a stamp 5 having an embossed structure capable of providing the adhesive 6 on the embossed structure is prepared. Since the embossed structure in the present invention is to bury the adhesive on the upper surface of the partition 4, it is preferable that the relief structure is formed at an interval corresponding to the distance between the plurality of partitions (4), preferably such a relief structure size It is preferable that is smaller than the width of the partition 4, the width length of the relief structure is more preferably formed in the range size within the width of the partition (4).

For example, the thickness B + C of the stamp 5 having the relief structure according to the present invention thus prepared may be in the range of 0.1 cm to 1 cm, as shown in FIG. The relief structure thickness C is preferably in the range of 1 μm to 500 μm, and the width length A of the relief structure of the stamp 5 is more preferably in the range of 0.5 μm to 500 μm.

In addition, by providing the adhesive 6 on the relief structure of the relief frame 14 according to the present invention formed as described above, it is also possible to produce a stamp 5 having an relief structure with the adhesive 6. That is, the present invention further includes the step of providing an adhesive 6 on the relief structure after the step of manufacturing the relief frame 14 having the relief structure, the electronic paper display device using the relief coating method It is also possible to manufacture a method.

In the present invention, the method of forming the stamp 5 having an embossed structure may include all etching methods well known in the art to which the present invention pertains, in addition to the method of photosensitive etching using a photomask, illustratively May form an embossed structure on the substrate by a dry or wet etching method or a sending process.

Another feature of the present invention is that the stamp 5 thus prepared is preferably composed of polydimethylsiloxane (PDMS) as a main component. That is, to inject and cure the mold material on the mold 13 to produce an embossed frame 14, and to release the embossed frame 14 with the mold 13 to produce a stamp 5 having an embossed structure In the above, the template material is based on PDMS.

To this end, PDMS is injected into the mold 13 in which the pattern of the intaglio shape 12 is formed as a mold material, and all the bubbles are removed from the PDMS by vacuum, and then left in the oven for several hours to solidify. The PDMS is a silicone-based polymer material having excellent elasticity and is a representative material that is most used for manufacturing microchips among polymer materials. PDMS is chemically very stable, does not react with other materials in contact with each other, has a very uniform structure, and has excellent optical properties. The mechanical strength of the micropattern is also excellent, so that the stamp can be used stably for several months when the stamp is made using PDMS.

In addition, in order to prevent swelling or whitening of the PDMS mold, it is also preferable to activate the surface of the PDMS stamp by plasma treatment and introduce a hydrophilic group. To this end, the present invention provides a step of activating the surface of the relief frame 14 by introducing a hydrophilic group between the step of manufacturing the relief frame 14 having the relief structure and providing the adhesive 6. Also possible is a method of manufacturing an electronic paper display device using the relief coating method further comprising a. As such, when the surface is treated with plasma under oxygen conditions, the surface of the PDMS is oxidized. By using this property, self-assembled monolayers can be made by bonding PDMS or chemical reactions on the surface.

In addition, in addition to plasma treatment of the surface of the PDMS, the present invention may further include the step of coating a release agent on the surface of the embossed frame 14, and such a release agent is preferably C ₄ F ₈ . The coating agent C ₄ F ₈ is chemically very stable and does not react with other materials to form an interface in PDMS during coating.

In the above description, it should be understood that those skilled in the present invention can only make modifications and changes to the present invention without changing the gist of the present invention as merely illustrative of a preferred embodiment of the present invention.

According to the present invention as described above, forming a lower electrode on the lower substrate and forming an upper electrode below the upper substrate; Forming a plurality of barrier ribs for forming pixel spaces on the lower electrodes; Preparing a stamp having an embossed structure at intervals corresponding to the distances between the plurality of partition walls, the adhesive being provided on the embossed structure; Burying the adhesive provided on the stamp on the plurality of barrier ribs; Injecting particles for representing an image into the pixel space formed by the barrier ribs; Stacking and attaching the upper substrate on which the upper electrode is formed to the upper surface of the barrier rib on which the adhesive is buried; and providing a method of manufacturing an electronic paper display device using an embossed coating method.

When the substrate and the partition wall of the electronic paper are bonded together using the embossed coating method according to the present invention, since the UV curable adhesive is not used as in the prior art, the defect rate due to the leakage of the liquid adhesive can be prevented, and the damage of the particles due to heat is prevented. Can also be significantly reduced. In addition, since the present invention is based on an indirect method using a separate stamp rather than directly applying the adhesive to the partition wall, it is possible to precisely apply the adhesive to the top surface of the very small partition wall by adjusting the size of the embossed structure of the stamp. It has an effect.

In addition, the stamp, which is an embossed paint board, and the mask used to make it can be reused over and over again, and the adhesive on the sides of the bulkhead is more effective than applying the adhesive directly to the roller and applying it to the bulkhead. . In addition, when the main material of the stamp is PDMS, since the PDMS is non-toxic transparent and smooth, it is particularly useful in electronic paper manufacturing processes requiring frequent and repetitive work such as joining partition walls and substrates. . In addition, since plasma treatment of the PDMS surface changes the surface to be hydrophilic, there is an effect of easily working with various kinds of adhesives having glass or other components.

Claims (15)

Forming a lower electrode on the lower substrate and forming an upper electrode below the upper substrate; Forming a plurality of barrier ribs for forming pixel spaces on the lower electrodes; Preparing a stamp having an embossed structure at intervals corresponding to the distances between the plurality of partition walls, the adhesive being provided on the embossed structure; Burying the adhesive provided on the stamp on the plurality of barrier ribs; Injecting particles for representing an image into the pixel space formed by the barrier ribs; Stacking and bonding the upper substrate on which the upper electrode is formed to the upper surface of the barrier rib on which the adhesive is buried; and manufacturing an electronic paper display device using the relief coating method. The method of claim 1, wherein the embedding of the adhesive provided on the stamp on the upper surface of the plurality of partition walls is such that the adhesive of the stamp and the plurality of partition walls formed on the lower substrate abut, and then the stamp is rubbed with a roller. A method of manufacturing an electronic paper display device using an embossed coating method, characterized in that the upper surface of the plurality of partition walls. The method of claim 1, wherein the embedding of the adhesive provided on the stamp on the upper surface of the plurality of barrier ribs causes the adhesive of the stamp to contact the plurality of barrier ribs formed on the lower substrate, and then rubs the lower substrate with a roller. Method of manufacturing an electronic paper display device using the embossed coating method characterized in that the buried in the upper surface of the plurality of partition walls. The method of claim 1, wherein the stamp, Manufacturing a mold in which a negative pattern is formed on one side; Injecting and curing a mold material on the mold to produce an embossed mold; Manufacturing a relief frame having an relief structure by releasing the relief frame with the mold. The method of manufacturing an electronic paper display device using the embossed coating method of claim 4, further comprising, after preparing the embossed frame having the embossed structure, providing an adhesive on the embossed structure. The method of claim 5, further comprising coating a release agent on the surface of the relief frame between manufacturing the relief frame having the relief structure and providing the adhesive. 7. Manufacturing method of paper display element. 6. The method of claim 5, further comprising the step of preparing the embossed frame having the relief structure and providing the adhesive, by plasma treating the surface of the relief frame and introducing a hydrophilic group. Method of manufacturing an electronic paper display device using the embossed coating method. The method of claim 4, wherein the manufacturing of the mold on which the engraved pattern is formed comprises: applying a photoresist on the substrate; And developing a pattern of an intaglio shape by photosensitive the photoresist using a photomask. The method of claim 8, wherein the substrate is a silicon substrate or a transparent glass substrate. The method of manufacturing an electronic paper display device using the embossed coating method according to any one of claims 1 to 9, wherein the stamp is composed mainly of polydimethylsiloxane (PDMS). The method of manufacturing an electronic paper display device using the embossed coating method according to any one of claims 1 to 9, wherein the stamp has a thickness in the range of 0.1 cm to 1 cm. The method of manufacturing an electronic paper display device using the relief coating method according to any one of claims 1 to 9, wherein the thickness of the relief structure of the stamp is in the range of 1 µm to 500 µm. The method of manufacturing an electronic paper display device according to any one of claims 1 to 9, wherein the width length of the relief structure of the stamp is in the range of 0.5 µm to 500 µm. 10. The method of claim 1, wherein a lower insulating layer is formed on the lower electrode, and an upper insulating layer is formed below the upper electrode. . The method of manufacturing an electronic paper display device using the embossed coating method according to any one of claims 1 to 9, wherein the particles are charged or non-charged dry particles.

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