KR100703533B1 - 증착장치 - Google Patents
증착장치 Download PDFInfo
- Publication number
- KR100703533B1 KR100703533B1 KR1020050131492A KR20050131492A KR100703533B1 KR 100703533 B1 KR100703533 B1 KR 100703533B1 KR 1020050131492 A KR1020050131492 A KR 1020050131492A KR 20050131492 A KR20050131492 A KR 20050131492A KR 100703533 B1 KR100703533 B1 KR 100703533B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- deposition
- heat sink
- deposition apparatus
- chamber
- Prior art date
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (7)
- 챔버와,상기 챔버 내부의 하단에 마련되는 증착원과,상기 챔버 내부의 상단에 구비되는 척과,상기 척의 하측에 밀착 구비되는 히트싱크와,상기 히트싱크 하측에 밀착 구비되며, 상기 증착원과 소정간격 이격되는 기판과,상기 기판 하측에 소정패턴이 형성되어 마련된 증착 마스크를 구비하는 증착장치.
- 제1 항에 있어서, 상기 히트싱크는상기 기판과 정합되는 열전도용 기판,상기 열전도용 기판에 밀착 구비되는 열방출용 핀으로 형성되는 것을 특징으로 하는 증착장치.
- 제2 항에 있어서, 상기 열방출용 핀 상부에 열방출용 기판이 더 구비되는 것을 특징으로 하는 증착장치.
- 제2 항에 있어서, 상기 열방출용 핀은 구리로 형성되는 것을 특징으로 하는 증착장치.
- 제2 항에 있어서, 상기 열방출용 핀은 주름형상, 벌집모양 또는 톱니형상 모양으로 형성된 것을 특징으로 하는 증착장치.
- 제1 항에 있어서, 상기 히트싱크 일면에 자석이 더 구비되는 것을 특징으로 하는 증착장치.
- 제1 항에 있어서, 상기 증착 마스크는 금속으로 이루어지는 것을 특징으로 하는 증착장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050131492A KR100703533B1 (ko) | 2005-12-28 | 2005-12-28 | 증착장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050131492A KR100703533B1 (ko) | 2005-12-28 | 2005-12-28 | 증착장치 |
Publications (1)
Publication Number | Publication Date |
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KR100703533B1 true KR100703533B1 (ko) | 2007-04-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020050131492A KR100703533B1 (ko) | 2005-12-28 | 2005-12-28 | 증착장치 |
Country Status (1)
Country | Link |
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KR (1) | KR100703533B1 (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050047940A (ko) * | 2003-11-18 | 2005-05-23 | 삼성에스디아이 주식회사 | 증발원 |
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2005
- 2005-12-28 KR KR1020050131492A patent/KR100703533B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050047940A (ko) * | 2003-11-18 | 2005-05-23 | 삼성에스디아이 주식회사 | 증발원 |
Non-Patent Citations (1)
Title |
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한국공개특허공보 10-2005-0047940 |
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