KR100702881B1 - Epoxy resin composition and semiconductor devices - Google Patents

Abstract

The present invention provides an epoxy resin composition which is excellent in moldability and flame retardancy, has a low water absorption and excellent solder resistance.

In other words, the present invention relates to an epoxy resin having a carbon atom-derived ratio of aromatics relative to all carbon atoms in the epoxy resin of 70% or more, and an aromatic-derived carbon atom content of all carbon atoms in the (B) phenol resin. Epoxy comprising an inorganic filler having a phenolic hydroxyl group equivalent of 140 to 300, (C) curing accelerator, and (D) addition amount W (% by weight) in all epoxy resin compositions of 88 ≤ W ≤ 94. The resin composition WHEREIN: The combustion start temperature in TG curve analysis in the air atmosphere of the hardened epoxy resin composition is 280 degreeC or more, or the residual ratio (A; weight%) of hardened | cured material in TG curve analysis is ,

W + [0.1 × (100-W)] ≤ A

Provided is an epoxy resin composition for semiconductor sealing.

Description

Epoxy resin composition and semiconductor device {EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICES}

1 is a schematic diagram showing the relationship between the TG curve and the pyrolysis start temperature.

The present invention relates to an epoxy resin composition for semiconductor encapsulation excellent in low water absorption and solder resistance, and a semiconductor device using the same.

In order to protect a semiconductor device from mechanical and chemical action, an epoxy resin composition (hereinafter referred to as a resin composition) has been developed and produced conventionally. The items required for this resin composition are changed depending on the kind of semiconductor element, the kind of semiconductor device to be sealed, the environment used, and the like.

Due to the increase in surface-mount semiconductor devices, low-absorption resin compositions are required, and a large number of resin compositions have been proposed.

In addition, due to the current environmental problems, there is a strong demand for resin compositions that do not use halogen-based compounds and antimony oxide. In response to these demands, resin compositions which do not use halogenated compounds and various flame retardants other than antimony oxide and even those flame retardants have been proposed. However, as resin compositions for sealing, good moldability, water absorption rate, solder resistance, and the like are completely satisfied. Satisfaction is not yet proposed.

The present invention provides an epoxy resin composition for semiconductor sealing excellent in moldability, flame retardancy, low water absorption, and solder resistance, and a semiconductor device using the same.

The present invention relates to an epoxy resin having a carbon atom-derived content of aromatics relative to all carbon atoms in an epoxy resin of 70% or more, and an aromatic-derived carbon atom content of all carbon atoms in a phenol resin being 70% or more. Epoxy comprising a phenolic resin having a phenolic hydroxyl equivalent of 140 to 300, (C) a curing accelerator, and (D) an inorganic filler having an addition amount (W;% by weight) of 88 ≤ W ≤ 94 in the whole epoxy resin composition. The resin composition relates to an epoxy resin composition for semiconductor encapsulation, wherein a combustion initiation temperature in a TG thermogravimetric analysis in an air atmosphere of the cured epoxy resin composition is 280 ° C or more. The present invention also relates to an epoxy resin having an aromatic carbon atom content of at least 70% of all carbon atoms in (A) an epoxy resin, and (B) an aromatic carbon atom content of at least 70% of all carbon atoms in a phenol resin. Epoxy resin composition comprising a phenolic resin having a phenolic hydroxyl group equivalent of 140 to 300, (C) a curing accelerator, and (D) an inorganic filler having an addition amount (W;% by weight) in the epoxy resin composition of 88 ≤ W ≤ 94 The residual ratio (A; wt%) of the cured product in the TG curve analysis in the air atmosphere of the cured epoxy resin composition is

W + [0.1 × (100-W)] ≤ A                         

It is related with the epoxy resin composition for semiconductor sealing. As a more preferable aspect, an epoxy resin is an epoxy resin represented by General formula (1), or an epoxy resin represented by General formula (2),

[General Formula (1)]

(R ₁ to R ₄ may be the same or different as a hydrogen atom, a phenyl group or a methyl group.

[General Formula (2)]

(R ₁ to R ₈ may be the same or different as a hydrogen atom, a methyl group or a tert-butyl group)

The epoxy resin composition which is a phenol resin represented by General formula (3), the phenol resin represented by General formula (4), or resin which polycondenses petroleum heavy oil, formaldehyde polycondensate, and phenols is provided by this invention.

[General Formula (3)]

(n is an average of 1 or more)

[General Formula (4)]

(R ¹ is a hydrogen atom or a methyl group, n is an integer of 1 or more as an average value)

Moreover, this invention provides the semiconductor device characterized by sealing a semiconductor element using these compositions.

The epoxy resin used in the present invention has a carbon atom content of 70% or more derived from aromatic to all carbon atoms in the epoxy resin. As the amount of carbon atoms derived from aromatics increases, the flame retardancy of the resin composition using this epoxy resin improves. Since this epoxy resin is excellent in flame retardancy, when it is used together with various phenol resins as a hardening | curing agent mentioned later, it has high flame retardance also in the resin composition of this invention which does not contain flame retardants, such as a halogen type compound and antimony oxide, 0 level can be maintained. Moreover, since the reactivity with phenol resin is also favorable, the resin composition of this invention is excellent in moldability and mechanical strength.

The carbon atom derived from the aromatic used in the present invention includes carbon atoms constituting aromatic rings such as benzene, naphthalene, anthracene and pyrene, and carbon atoms directly bonded to the carbon atoms of these aromatic rings. The reason why the carbon atoms directly bonded to the aromatic ring are included in the aromatic carbon atoms is that the carbon-carbon bond energy directly bonded to the aromatic ring is not directly bonded to the aromatic ring. It is because it is assumed that it is larger and difficult to pyrolyze.

The carbon atom content of aromatic origin was computed from the chemical structure of epoxy resin. For example, in the case of toluene, since the methyl group is directly bonded to the aromatic ring, it is included in the aromatic thixo atom, and the content rate of the aromatic carbon atom is 100%. However, in the case of kmen, since the number of carbon atoms constituting the aromatic ring is 6, the non-aromatic carbon atom directly bonded to the aromatic ring and the carbon atom not directly bonded to the aromatic ring are 2, The carbon atom content is calculated as (6 + 1) / (6 + 1 + 2) × 100 = 78 (%).

The epoxy resin used in the present invention is not particularly limited as long as it is an epoxy resin that satisfies the above conditions. Among the biphenyl type epoxy resins represented by the general formula (1), (3,3 ', 5,5') is particularly preferred. -Tetramethyl-4,4'-biphenol diglycidyl ether, diphenyl-4,4'-biphenol diglycidyl ether, or stilbene type epoxy resin represented by General formula (2), and other ortho Cresol novolak-type diglycidyl ether, triphenol methane-type diglycidyl ether, bisphenol A type epoxy resin, bisphenol F type epoxy resin, etc. are mentioned.

In addition, epoxy resins having an aromatic derived carbon atom content of 70% or more can be used in combination with other epoxy resins. As a compounding quantity of the epoxy resin whose content rate of aromatic-derived carbon atom in the case of using together is 70% or more, 70 weight% or more in all the epoxy resins is preferable. If it is less than 70 weight%, flame retardance will fall. Although it does not specifically limit as an epoxy resin which can be used together, A dicyclopentadiene modified phenol type epoxy resin is used suitably.

Melting point, softening point, melting viscosity, ionic impurity amount and the like as properties of the epoxy resin used in the present invention are not particularly limited, but the lower the ionic impurity amount is, the better the reliability is.

The phenol resin used in the present invention has an aromatic-derived carbon atom content of 70% or more with respect to all carbon atoms in the phenol resin and a phenolic hydroxyl group equivalent of 140 to 300. The calculation of the number of carbon atoms derived from aromatics is handled in the same manner as in the case of the epoxy resin.

If the phenolic hydroxyl group equivalent is less than 140, the functional group density per unit volume (the number of moles of phenolic hydroxyl group per unit volume) is high, and it has been found that flame retardance falls. Epoxy groups and phenolic hydroxyl groups are easy to thermally decompose, and flammable gases are generated during thermal decomposition, so that the flame retardancy is remarkably decreased when the number of moles of these functional groups increases. It is judged that reducing the number of moles of the functional group, that is, reducing the functional group density is an effective means for improving the flame retardancy. Moreover, when phenolic hydroxyl group equivalent exceeds 300, functional group density will fall too much and since reactivity is low, sclerosis | hardenability will fall and moldability will deteriorate.

As a phenol resin used for this invention, the phenol resin represented by General formula (3), the naphthol aralkyl resin represented by General formula (4), the modified phenol resin which condensed petroleum heavy oil, formaldehyde polymerization condensate, and phenols (Japan JP-A-7-252339 and JP-A 9-216927) and the like, and phenol aralkyl resins can also be used. The melting point, softening point, melting viscosity, ionic impurities, and the like, which are characteristics of the phenol resin of the present invention, are not particularly limited. However, the smaller the amount of ionic impurities, the better the reliability.

The phenol resin having an aromatic-derived carbon atom content of 70% or more used in the present invention can be used in combination with other phenol resins. As a compounding quantity of the phenol resin whose aromatic-derived carbon atom content in the case of using together is 70% or more, 70 weight% or more in all the phenol resins is preferable, and when it is less than 70 weight%, flame retardance falls. Although it does not specifically limit as a phenol resin which can be used together, Dicyclopentadiene modified phenol resin, a phenol novolak resin, etc. are preferable.

The equivalence ratio of the epoxy group number of the prior epoxy resin and the phenolic hydroxyl group number of the all phenol resin used in the present invention is preferably 0.5 to 2, more preferably 0.7 to 1.5. If it is out of the range of 0.5-2, since moisture resistance, sclerosis | hardenability, etc. fall, it is unpreferable.

The curing accelerator used in the present invention is not particularly limited as long as it promotes the reaction between the epoxy group and the phenolic hydroxyl group. For example, 1,8-diazabicyclo (5,4,0) undecene-7, triphenylphosphine And tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetrabenzoic acid borate, tetraphenylphosphonium tetranaphthoic acid borate, and the like, and these may be used alone or in combination.

There is no restriction on the kind of inorganic filler used in the present invention, and those generally used for sealing materials can be used. For example, fused crushed silica powder, fused spherical silica powder, crystalline silica powder, secondary agglomerated silica powder, alumina, titanium white, aluminum hydroxide, tar, cray, glass fiber and the like can be mentioned. Do. The shape is preferably a spherical shape without limitation, and the filling amount can be increased by mixing a different particle size.

The compounding ratio of the epoxy resin composition of this invention is 5-10 weight% of epoxy resins, 5-10% of phenol resin hardeners, 0.05-2 weight% of hardening accelerators, and 88-94 weight% of inorganic fillers with respect to an epoxy resin composition. . If the compounding ratio of the epoxy resin is less than 5% by weight, curing will be insufficient, and if it exceeds 10% by weight, moldability will be poor. If the blending ratio of the phenol resin is less than 5% by weight, the curing will be insufficient, and if it exceeds 10% by weight, there will be a problem that an uncured product remains. If the blending ratio of the curing accelerator is less than 0.05% by weight, a long time is required until curing, and if the content of the curing accelerator exceeds 2% by weight, the curing proceeds rapidly and a satisfactory cured product cannot be obtained.

As for the inorganic filler used for this invention, it is necessary that the addition amount (W; weight%) in all resin composition is 88 <= W <= 94. More preferably, it is 88-92 weight%. When there are many inorganic fillers, the absorption rate is reduced, and the inorganic filler which does not burn takes heat energy when exposed to fire, and improves the flame retardancy of the hardened | cured material of a resin composition. Moreover, it is effective for expressing favorable moldability (release property) by improving the elasticity modulus of the hardened | cured material of a resin composition. If the amount of inorganic filler is less than 88% by weight, it is easy to burn in the flame retardant test, and because of high water absorption, a resin composition having low solder resistance is obtained. When the amount of the inorganic filler exceeds 94% by weight, the fluidity is markedly lowered and molding cannot be performed.

The resin composition of the present invention can maintain the V-0 of the flame retardancy level of UL-94 without mixing a halogen-based compound such as brominated epoxy resin or antimony trioxide such as antimony trioxide as the flame retardant. The resin composition which does not add a flame retardant is preferable from a viewpoint of environmental considerations or the reliability improvement of semiconductor devices, such as high temperature storage property. In the case of blending a conventional flame retardant, there is a possibility that remarkable deterioration of high temperature storage characteristics is caused, resulting in deterioration of the performance of the semiconductor device. According to the present invention, it is found that sufficient flame retardance cannot be obtained if the carbon number derived from the aromatic ring is high even without the flame retardant.

Since the resin composition of the present invention is flame retardant by increasing the number of aromatic rings in the molecule, it is difficult to thermally decompose in air. The cured product of the resin composition of the present invention has a feature that the onset of pyrolysis in the TG curve analysis (Thermogravimetric analysis) shown in FIG. 1 is 280 ° C or higher. If the thermal decomposition start temperature is 280 ℃ or more, it is very effective for improving flame retardancy.

The pyrolysis start temperature was ground to 5 to 10 mg before and after grinding the cured resin composition (after curing at 175 ° C for 4 hours using a TG / DTA220 manufactured by Seiko Electronics Co., Ltd.). Weigh accurately) is measured in an air atmosphere under conditions of a temperature increase rate of 20 deg. C / min and a flow rate of air of 200 ml / min. As shown in Fig. 2, the temperature at which the thermal decomposition starts suddenly at the time of the temperature rise becomes the thermal decomposition starting temperature. If the thermal decomposition start temperature is higher than 280 ° C, the flame retardancy in the UL-94 test is also good. On the other hand, if pyrolysis start temperature is less than 280 degreeC, flame retardance will fall.

In addition, in the resin composition whose addition amount (W;% by weight) of the inorganic filler contained in the whole resin composition is 88 ≦ W ≦ 94, curing after 500 ° C. and one hour after TG curve analysis in the air atmosphere of the cured resin composition The residual ratio A (% by weight) of water is

W + [0.1 × (100-W)] ≤ A

It is also effective for improving flame retardancy. When the carbon atom content rate derived from an aromatic is high, it takes time until it burns completely, and the carbide of a resin component remains after burning at 500 degreeC for 1 hour. If the value of the residual ratio (A) of the cured product is less than W + [0.1 × (100-W)], the combustion proceeds quickly, and thus the flame retardancy is low.

Remaining rate (A) of the hardened | cured material in this invention uses the Seiko Electronics Co., Ltd. product TG / DTA220, and fine-pulverizes the hardened | cured material after hardening after cured at 175 degreeC for 4 hours, and a sample The weight of the sample is accurately weighed before and after 5 to 10 mg) in the air atmosphere, and the temperature is raised to 500 ° C. at a temperature increase rate of 20 ° C./min, air flow rate 200 ml / min, and a temperature increase rate of 20 ° C./min, and then maintained at 500 ° C. for 1 hour. It measures on the conditions to make, and the residual amount of the hardened | cured material after that is calculated | required, dividing the residual amount by a sample, and displaying%.

The resin composition of the present invention is, in addition to the components (A) to (D), silane coupling agents such as γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, and carbon black, if necessary. Various additives such as low stress components such as colorants, silicone oils and silicone rubbers, natural waxes, synthetic waxes, polyethylene waxes, polyethylene oxide waxes, higher fatty acids and release agents such as metal salts or paraffins, and antioxidants. In particular, the silicone oil of the additive is very effective in reducing the voids.

The resin composition of this invention is obtained by mixing (A)-(D) component and other additives at normal temperature using a mixer, kneading with kneading machines, such as a roll and an extruder, and grinding after cooling.

In order to seal a semiconductor element using the resin composition of the present invention and to manufacture a semiconductor device, conventional molding methods such as transfer molding, compression molding, injection molding and the like are used. What is necessary is just to harden molding.

Although the Example of this invention is shown below, this invention is not limited to these. The compounding unit is weight parts.

Example 1

0.5 parts by weight of an epoxy resin containing formula (E-1) as a main component (73% of carbon atom content based on aromatics)

Formula E-1

0.5 parts by weight of phenolic resin of formula (H-1) (aromatic derived carbon atom content is 100%)

Formula H-1

0.2 part by weight of 1,8-diazabicyclo (5,4,0) undecene-7 (hereinafter referred to as DBU)

Molten spherical silica (average particle size 15 ㎛) 89 parts by weight

0.3 parts by weight of epoxy silane coupling agent

Carbon Black 0.2 part by weight

Carnava wax 0.3 parts by weight

The mixture was mixed at room temperature using a mixer, kneaded at 100 ° C. using a biaxial roll, and cooled and pulverized to obtain a resin composition. The obtained resin composition was evaluated by the following method. The results are shown in Table 1.

Assessment Methods

· Pyrolysis start temperature: According to the above measuring method.

Residual rate of the hardened | cured material of a resin composition: By the said measuring method.

Spiral flow: The molding temperature was measured at 175 degreeC using the metal mold | die based on EMMI-I-66.

Flame retardant: A 1.6 mm thick molded article was prepared and subjected to a combustion test in accordance with UL-94.                     

· High temperature storage characteristics: 16 pDIP mounted with a simulated device is molded and post-cured, and then treated at 185 ° C. for 1000 hours. The resistance value between the wirings after the treatment is measured, and a package having a resistance value of 20% or more is made defective. 15 Indicates the number of defective packages in the package.

Solder resistance: 80 pQFP (package size 14 x 20 x 2.7 mm, chip size 9 mm x 9 mm) at a molding temperature of 175 deg. C, pressure of 70 kg / cm &lt; 2 &gt; and a curing time of 2 minutes using a low pressure transfer molding machine. After molding and post-curing at 175 ° C. for 8 hours, the six packages were absorbed at 85 ° C. and 85% relative humidity for 168 hours, and then subjected to IR reflow treatment at 235 ° C. to clock the package. Observation was made with a flaw detector. When n packages have clocked, n / 6 is displayed.

Examples 2-6

It mix | blended according to the prescription of Table 1, the resin composition was obtained by the method similar to Example 1, and it evaluated by the method similar to Example 1. The results are shown in Table 1.

Comparative Examples 1 to 6

It mix | blended according to the prescription of Table 2, the resin composition was obtained by the method similar to Example 1, and it evaluated by the method similar to Example 1. The results are shown in Table 2.

Epoxy resins used in Examples 2 to 5 or Comparative Examples 4 to 6, structural formulas of formula (E-2) and formula (E-3), phenol resins, formula (H-2) and formulas (H-4) to formula The structural formula of (H-6) and description of a phenol resin (H-3) are shown below.

In addition, the carbon atom content of the aromatic origin of formula (E-2) is 72%, the carbon atom content of the aromatic origin of (E-3) is 42%, and the carbon atom content of the aromatic origin of formula (H-2) is 100%, Aromatic derived carbon atom content of formula (H-4) is 100%, Phenolic hydroxyl group equivalent of Formula (H-5) is 98, Aromatic derived carbon atom content is 100%, Formula (H-6) Aromatic derived carbon atom content of 50%, phenol resin (H-3) is a polycondensation of petroleum heavy oil, formaldehyde polycondensate and phenol in the presence of acid catalyst, softening point 82 ℃, hydroxyl equivalent 145, ICI viscosity / It is 2.2 poise at 150 degreeC and the carbon atom content of aromatic origin is about 95%.

[Formula a]

[Expression b]

(a) / (b) = 2/1 melt mixture .... (E-2)

Formula E-3

Formula H-2

Formula H-4

[Formula H-5]

Formula H-6

Example One 2 3 4 5 6 Epoxy Resin (E-1) 5.0 4.8 5.0 5.3 3.2 Epoxy Resin (E-2) 5.0 Curing agent (H-1) 5.0 3.2 Hardener (H-2) 5.2 5.0 Hardener (H-3) 5.0 Hardener (H-4) 4.8 DBU 0.2 0.2 Triphenylphosphine 0.2 0.2 0.2 0.1 Molten spherical silica 89 89 89 89 89 93 Epoxysilane Coupling Agent 0.3 0.3 0.3 0.3 0.3 0.2 Carbon black 0.2 0.2 0.2 0.2 0.2 0.2 Carnava wax 0.3 0.3 0.3 0.3 0.3 0.2 Combustion start temperature (℃ 0 330 320 333 321 317 311 Remaining amount after treatment at 500 ° C for 1 hour (%) 92.0 91.4 93.5 92.0 93.2 95.1 Spiral Flow (cm) 101 88 89 83 110 42 Flame retardant (1.6 mm) V-0 V-0 V-0 V-0 V-0 V-0 High Temperature Storage Characteristics O / 15 O / 15 O / 15 O / 15 O / 15 O / 15 Solder resistance O / 6 O / 6 O / 6 O / 6 O / 6 O / 6

Comparative example One 2 3 4 5 6 Epoxy Resin (E-1) 9.5 2.2 4.0 6.4 5.0 Epoxy Resin (E-3) 5.2 Curing agent (H-1) 9.0 2.1 4.0 4.8 Hardener (H-5) 3.6 Hardener (H-6) 5.0 Bisphenol A Brominated Epoxy Resin 1.0 Antimony trioxide 1.0 DBU 0.2 0.2 0.2 0.2 0.2 Triphenylphosphine 0.1 Molten spherical silica 80 95 89 89 89 89 Epoxysilane Coupling Agent 0.5 0.2 0.3 0.3 0.3 0.3 Carbon black 0.5 0.2 0.2 0.2 0.2 0.2 Carnava wax 0.3 0.2 0.3 0.3 0.3 0.3 Combustion start temperature (℃ 0 314 Inability to mold 310 289 268 264 Remaining amount after treatment at 500 ° C for 1 hour (%) 83.2 - 90.3 90.0 91.0 89.7 Spiral Flow (cm) 104 Inability to mold 103 89 91 77 Flame retardant (1.6 mm) V-1 Inability to mold V-0 Burned down V-1 Burned down High Temperature Storage Characteristics O / 15 Inability to mold 15/15 O / 15 O / 15 O / 15 Solder resistance 6/6 Inability to mold O / 6 3/6 1/6 2/6

As is clear from Table 1, the epoxy resin composition for semiconductor encapsulation of the present invention is excellent in moldability and flame retardancy, has low water absorption, and the semiconductor device sealed therewith is excellent in solder resistance.

Claims (5)

(A) Epoxy resins containing at least 70% of carbon atoms derived from aromatics to all carbon atoms in epoxy resins; (B) Aromatic derived carbon atoms containing at least 70% of all carbon atoms in phenolic resins and phenolic hydroxyl group equivalents. In the epoxy resin composition containing the inorganic filler which is 140-300 phenol resin, (C) hardening accelerator, and (D) all the epoxy resin composition (W; weight%) of addition amount (W; weight%), 88 <= W <= 94 Initiation temperature of the epoxy resin composition in the TG curve analysis (Thermogravimetric analysis) in the air atmosphere is characterized in that more than 280 ℃, The epoxy resin is an epoxy resin represented by the general formula (1) or an epoxy resin represented by the general formula (2): [General Formula (1)]

(R ₁ to R ₄ may be the same or different as a hydrogen atom, a phenyl group or a methyl group) [General Formula (2)]

(R ₁ to R ₈ are a hydrogen atom, a methyl group, or a tert-butyl group, which may be the same or different); Epoxy resin composition for semiconductor encapsulation whose said phenol resin is resin which polycondensed the phenol resin represented by General formula (3), the phenol resin represented by General formula (4), or petroleum heavy oil, formaldehyde polycondensate, and phenols: [General Formula (3)]

(n is an average of 1 or more, m is 1 or 2) [General Formula (4)]

(R ¹ is a hydrogen atom or a methyl group, n is an integer of 1 or more in average value). (A) Epoxy resins containing 70% or more of aromatic carbon atoms relative to all carbon atoms in epoxy resins; (B) Aromatic derived carbon atoms containing 70% or more of all carbon atoms in phenolic resins and phenolic hydroxyl group equivalents. In the epoxy resin composition which contains the inorganic filler which is 140-300 phenol resin, (C) hardening accelerator, and (D) epoxy resin composition before (D) addition amount (W; weight%) of 88 <= W <= 94, The residual ratio (A;% by weight) of the cured product in the TG curve analysis in the air atmosphere of the epoxy resin composition is W + [0.1 × (100-W)] ≤ A Characterized by The epoxy resin is an epoxy resin represented by the general formula (1) or an epoxy resin represented by the general formula (2): [General Formula (1)]

(R ₁ to R ₄ may be the same or different as a hydrogen atom, a phenyl group or a methyl group) [General Formula (2)]

(R ₁ to R ₈ are a hydrogen atom, a methyl group, or a tert-butyl group, which may be the same or different); Epoxy resin composition for semiconductor encapsulation whose said phenol resin is resin which polycondensed the phenol resin represented by General formula (3), the phenol resin represented by General formula (4), or petroleum heavy oil, formaldehyde polycondensate, and phenols: [General Formula (3)]

(n is an average of 1 or more, m is 1 or 2) [General Formula (4)]

(R ¹ is a hydrogen atom or a methyl group, n is an integer of 1 or more in average value). delete delete A semiconductor device formed by sealing a semiconductor element using the epoxy resin composition for semiconductor encapsulation according to claim 1.

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