KR100695553B1 - 리소그래피 장치 및 디바이스 제조방법 - Google Patents

리소그래피 장치 및 디바이스 제조방법 Download PDF

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Publication number
KR100695553B1
KR100695553B1 KR1020050054233A KR20050054233A KR100695553B1 KR 100695553 B1 KR100695553 B1 KR 100695553B1 KR 1020050054233 A KR1020050054233 A KR 1020050054233A KR 20050054233 A KR20050054233 A KR 20050054233A KR 100695553 B1 KR100695553 B1 KR 100695553B1
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South Korea
Prior art keywords
gas
substrate
patterning device
purge
support structure
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Expired - Fee Related
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KR1020050054233A
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English (en)
Korean (ko)
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KR20060048484A (ko
Inventor
요에리 로프
요한네스 카타리누스 후베르투스 물켄스
예뢴 요한네스 소피아 마리아 메르텐스
데르 네트 안토니우스 요한네스 반
데르 함 로날드 반
니콜라스 라르망
마르첼 베커스
Original Assignee
에이에스엠엘 네델란즈 비.브이.
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Publication of KR20060048484A publication Critical patent/KR20060048484A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020050054233A 2004-06-23 2005-06-23 리소그래피 장치 및 디바이스 제조방법 Expired - Fee Related KR100695553B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/873,650 2004-06-23
US10/873,650 US7057702B2 (en) 2004-06-23 2004-06-23 Lithographic apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
KR20060048484A KR20060048484A (ko) 2006-05-18
KR100695553B1 true KR100695553B1 (ko) 2007-03-14

Family

ID=34938361

Family Applications (1)

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KR1020050054233A Expired - Fee Related KR100695553B1 (ko) 2004-06-23 2005-06-23 리소그래피 장치 및 디바이스 제조방법

Country Status (7)

Country Link
US (1) US7057702B2 (https=)
EP (1) EP1610183A3 (https=)
JP (2) JP2006013502A (https=)
KR (1) KR100695553B1 (https=)
CN (2) CN1713075B (https=)
SG (2) SG118391A1 (https=)
TW (1) TWI277837B (https=)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7372541B2 (en) 2002-11-12 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100585476B1 (ko) 2002-11-12 2006-06-07 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조방법
WO2004090634A2 (en) 2003-04-10 2004-10-21 Nikon Corporation Environmental system including vaccum scavange for an immersion lithography apparatus
KR101177330B1 (ko) 2003-04-10 2012-08-30 가부시키가이샤 니콘 액침 리소그래피 장치
KR101159564B1 (ko) 2003-04-11 2012-06-25 가부시키가이샤 니콘 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침액체를 유지하는 장치 및 방법
TWI347741B (en) * 2003-05-30 2011-08-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
TWI515770B (zh) 2003-06-19 2016-01-01 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
EP3376523A1 (en) * 2004-01-05 2018-09-19 Nikon Corporation Exposure apparatus, exposure method, and device producing method
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
KR101851511B1 (ko) 2004-03-25 2018-04-23 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7486381B2 (en) * 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7522261B2 (en) * 2004-09-24 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119876B2 (en) * 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7583357B2 (en) * 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20070132976A1 (en) * 2005-03-31 2007-06-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7170583B2 (en) * 2005-06-29 2007-01-30 Asml Netherlands B.V. Lithographic apparatus immersion damage control
US7432513B2 (en) * 2005-10-21 2008-10-07 Asml Netherlands B.V. Gas shower, lithographic apparatus and use of a gas shower
US8125610B2 (en) 2005-12-02 2012-02-28 ASML Metherlands B.V. Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus
US7728952B2 (en) * 2007-01-25 2010-06-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for closing plate take-over in immersion lithography
US8817226B2 (en) * 2007-02-15 2014-08-26 Asml Holding N.V. Systems and methods for insitu lens cleaning using ozone in immersion lithography
US8654305B2 (en) * 2007-02-15 2014-02-18 Asml Holding N.V. Systems and methods for insitu lens cleaning in immersion lithography
NL1035908A1 (nl) 2007-09-25 2009-03-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP2009094145A (ja) * 2007-10-04 2009-04-30 Canon Inc 露光装置、露光方法およびデバイス製造方法
NL2005586A (en) * 2009-12-02 2011-06-06 Asml Netherlands Bv Lithographic apparatus and sealing device for a lithographic apparatus.
EP2381310B1 (en) 2010-04-22 2015-05-06 ASML Netherlands BV Fluid handling structure and lithographic apparatus
US9341942B2 (en) * 2010-08-24 2016-05-17 Nikon Research Corporation Of America Vacuum chamber assembly for supporting a workpiece
NL2008199A (en) 2011-02-28 2012-08-29 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2008695A (en) * 2011-05-25 2012-11-27 Asml Netherlands Bv Lithographic apparatus comprising substrate table.
WO2013075878A1 (en) * 2011-11-22 2013-05-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
NL2010916A (en) 2012-07-06 2014-01-07 Asml Netherlands Bv A lithographic apparatus.
US9568828B2 (en) * 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
JP6537194B2 (ja) * 2014-07-04 2019-07-03 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及びリソグラフィ装置を用いてデバイスを製造する方法
US11397385B2 (en) 2016-06-17 2022-07-26 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and a method of forming a particle shield
CN107783283B (zh) * 2016-08-30 2020-01-24 上海微电子装备（集团）股份有限公司 镜片防污染装置及方法
CN109283797B (zh) * 2017-07-21 2021-04-30 上海微电子装备（集团）股份有限公司 物镜保护装置、物镜系统以及光刻设备
EP3620858B1 (en) * 2018-09-10 2023-11-01 Canon Kabushiki Kaisha Exposure apparatus and method of manufacturing article
KR102894806B1 (ko) * 2019-04-26 2025-12-04 에이에스엠엘 홀딩 엔.브이. 리소그래피 장치 및 조명 균일성 보정 시스템
EP4018262B1 (en) 2019-08-20 2023-06-21 ASML Netherlands B.V. Substrate holder and lithographic apparatus
EP3918421B1 (en) * 2019-12-26 2024-05-15 Nanjing ZongAn Semiconductor Equipment Ltd Tool architecture for wafer geometry measurement in semiconductor industry
EP3919978A1 (en) * 2020-06-05 2021-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and a method of forming a particle shield
US11740564B2 (en) * 2020-06-18 2023-08-29 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus and method using the same
CN113262956B (zh) * 2021-07-21 2021-10-15 四川洪芯微科技有限公司 一种半导体晶圆表面处理装置
DE102023204744A1 (de) * 2023-05-22 2024-05-16 Carl Zeiss Smt Gmbh Optisches system und projektionsbelichtungsanlage

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57153433A (en) * 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
US5900354A (en) * 1997-07-03 1999-05-04 Batchelder; John Samuel Method for optical inspection and lithography
AU8749798A (en) * 1997-08-29 1999-03-22 Nikon Corporation Temperature adjusting method and aligner to which this method is applied
EP1229573A4 (en) * 1999-07-16 2006-11-08 Nikon Corp EXPOSURE METHOD AND SYSTEM
WO2001084241A1 (en) * 2000-05-03 2001-11-08 Silicon Valley Group, Inc. Non-contact seal using purge gas
JP2001358056A (ja) * 2000-06-15 2001-12-26 Canon Inc 露光装置
TWI222668B (en) * 2001-12-21 2004-10-21 Nikon Corp Gas purging method and exposure system, and device production method
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
EP1420298B1 (en) 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographic apparatus
DE60335595D1 (de) * 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
EP1429188B1 (en) * 2002-11-12 2013-06-19 ASML Netherlands B.V. Lithographic projection apparatus
CN101872135B (zh) * 2002-12-10 2013-07-31 株式会社尼康 曝光设备和器件制造法
EP1503244A1 (en) * 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method

Also Published As

Publication number Publication date
TWI277837B (en) 2007-04-01
SG118391A1 (en) 2006-01-27
JP2008072139A (ja) 2008-03-27
CN101916050B (zh) 2013-11-20
US7057702B2 (en) 2006-06-06
EP1610183A2 (en) 2005-12-28
EP1610183A3 (en) 2007-10-31
JP5064979B2 (ja) 2012-10-31
CN101916050A (zh) 2010-12-15
TW200612207A (en) 2006-04-16
JP2006013502A (ja) 2006-01-12
CN1713075A (zh) 2005-12-28
CN1713075B (zh) 2010-08-04
KR20060048484A (ko) 2006-05-18
SG138618A1 (en) 2008-01-28
US20050286032A1 (en) 2005-12-29

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