KR100685826B1 - Deposition apperature and method for deposition using thereof - Google Patents

Abstract

The present invention is mounted on the substrate by a bottom-up deposition method using a deposition apparatus equipped with a plasma generating region and a heating element mounted at the upper end of the chamber and having a chuck capable of loading the substrate at the lower end thereof. The present invention relates to a deposition apparatus capable of simplifying the process by removing the inversion process of the substrate by forming a deposition film and applicable to an inline system, and a deposition method using the same.

Deposition apparatus of the present invention and a deposition method using the same chamber; A plasma generating region and a heating body located at a lower end of the chamber; And a chuck corresponding to the plasma generating region and the heating body and positioned at an upper end of the inside of the chamber and having a substrate mounted on a surface thereof, and a deposition method using the same.

Therefore, the deposition apparatus of the present invention and the deposition method using the same can prevent particles from flowing onto the substrate by using a bottom-up deposition method, and can be applied to an inline type that does not require an inversion process during substrate transfer, thereby shortening the process time. In addition, damage to the substrate can be prevented, and a high quality deposition film can be formed by using a deposition apparatus capable of simultaneously heating and plasma methods.

Plasma method, heating element method, in-line type, bottom-up deposition method

Description

Deposition Apparatus and Deposition Apparatus

1 is a cross-sectional view of a chemical vapor deposition apparatus according to the prior art.

2 is a cross-sectional view of a deposition apparatus for explaining a deposition method according to an embodiment of the present invention.

3A and 3B are cross-sectional views of a substrate on which an insulating film is formed by deposition methods according to embodiments of the present invention.

 <Description of the symbols for the main parts of the drawings>

211: shower head 212: cavity

213: first gas inlet 214: second gas inlet

215: first nozzle 216: second nozzle

218: cathode 231: chuck

232: substrate 301: first insulating film

302a, 302b: second insulating film

The present invention relates to a deposition apparatus and a deposition method using the same, and more particularly, a deposition film on a substrate by a bottom-up deposition method using a deposition apparatus capable of simultaneously mounting a substrate on the top of a chamber and simultaneously performing a plasma method and a heating method on the bottom. The present invention relates to a deposition apparatus and a deposition method using the same by simplifying the process by removing the inversion process of the substrate by forming.

Plasma atmospheres are used in various fields related to thin films such as chemical vapor deposition, etching, and surface treatment. This is because the plasma state has the advantage of increasing the efficiency of the reaction in these processes and allowing the process to be carried out under favorable conditions.

According to the purpose of using the plasma, there are various methods of forming the plasma and various plasma forming apparatuses have been developed. Recently, the use of a plasma processing apparatus using a high-density plasma that can further increase the process efficiency in the semiconductor manufacturing process, etc. is increasing. The high density plasma processing apparatus includes an ECR (Electron Cyclotron Resonance) plasma processing apparatus using microwave at a resonant frequency, a helicon plasma processing apparatus using a helicon or whistler wave, and an inductive coupling using a high temperature and low pressure plasma. And inductively coupled plasma processing apparatus.

Referring to FIG. 1, which is a cross-sectional view of an induced couple plasma chemical vapor deposition (ICP-CVD) apparatus using the inductively coupled plasma processing apparatus among chemical vapor deposition apparatuses, the insulator may be maintained and a vacuum may be maintained. The chamber 101 is provided with an antenna 102 arranged at an upper end of the chamber 101 and generating an inductively coupled plasma. At this time, the first power source 103 for supplying power to the antenna 102 is connected.

The gas inlet 105 for injecting gas 104 into the chamber 101 is located under the antenna 102. In this case, the gas injection hole 105 is generally formed as a shower head, in order to uniformly supply the gas 104 to the plasma formed by the antenna 102.

At the lower end of the chamber 101, a chuck 107 for heating, cooling, or fixing a workpiece to be processed by the ICP-CVD apparatus, that is, a substrate 106, is positioned to supply power to the chuck 107. The second power source 108 is connected. In this case, the second power source 108 may be used as a power source for heating the chuck 107 or a power source for allowing the chuck 107 to function as an electrode.

The side wall of the chamber 101 is attached with a door 109 for transferring the substrate 106 into or out of the chamber 101, and a vacuum pump 110 for exhausting air or gas from the chamber 101. There is attached an exhaust port 111 including).

However, the above-described chemical vapor deposition apparatus does not completely decompose the source gas by depositing the insulating film using only the plasma method, so that the use efficiency of the source gas is not good, and the formed insulating film contains a large amount of hydrogen. Not only is it difficult to obtain, but there is a problem in that the process of inverting the substrate should be added when the substrate is transferred downward, as in the organic electroluminescent device manufacturing process by using a top-down deposition method.

Accordingly, the present invention is to solve the above-mentioned disadvantages and problems of the prior art, by using a bottom-up deposition method, the plasma method and the heating method at the same time the relatively high energy required for decomposition gas plasma method It is an object of the present invention to provide a deposition method in which a gas is decomposed using a heating element method, and a gas having relatively low energy required for decomposition is decomposed using a heating element method to form a high quality deposition film on a substrate.

The object of the present invention is a chamber; A plasma generating region and a heating body located at a lower end of the chamber; And a chuck corresponding to the plasma generating region and the heating body and positioned at an upper end inside the chamber and having a substrate mounted on a surface thereof.

In addition, the plasma generating region of the present invention includes a first gas inlet and a second gas inlet; A cavity inside the shower head connected to the first gas inlet; A plurality of first nozzles connected to the cavity and positioned on a surface of the shower head corresponding to the chuck; And a cavity of the shower head connected to the second gas inlet and including a plurality of second nozzles positioned on the surface of the shower head corresponding to the chuck.

In addition, the object of the present invention comprises the steps of loading the substrate in a chamber having a plasma generating region and the heating element with the deposition surface directed downward; Supplying a first gas and a second gas to the chamber; The first gas passing through the plasma generating region and the heating body to form a first radical, and the second gas passing through the heating body to form a second radical; And the first radical and the second radical react to form a deposition film on the substrate.

Details of the above object and technical configuration of the present invention and the effects thereof according to the present invention will be more clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention. In the drawings, the length, thickness, etc. of layers and regions may be exaggerated for convenience. Like numbers refer to like elements throughout.

2 is a cross-sectional view of a chemical vapor deposition apparatus for explaining a deposition method according to an embodiment of the present invention.

In this case, the chemical vapor deposition apparatus is a device capable of performing the plasma method and the heating method at the same time.

2, in the chemical vapor deposition apparatus of the present invention, a shower head 211, a heating body 221, and a chuck 231 are positioned in a chamber 201 and a predetermined region inside the chamber 201. At this time, the chamber 201 seals the internal space with respect to the external environment. An exhaust port 203 including a vacuum pump 202 that maintains the degree of vacuum inside the chamber 201 is positioned in connection with the chamber 201.

In this case, the shower head 211 and the heating element 221 is located at the lower end of the chamber 201, the chuck 231 is to correspond to the shower head 211 and the heating element 221, the chamber It is located at the upper end of the 201. An apparatus for forming deposits, such as shower head 211 and heating element 221, as above, is located below an object for depositing the deposit, such as substrate 232 (substrate is positioned on the chuck). The deposition method is to move the deposit from the bottom to the upper direction is called a bottom-up deposition method.

At this time, in the bottom-up deposition method, since the deposit proceeds in the reverse direction of the acceleration direction of gravity, a material having a large mass (that is, particles, etc.) is difficult to deposit on the substrate 232, and thus, the deposition film deposited on the substrate 232 includes particles and Since the same foreign matter is not deposited, the quality of the deposited film is excellent.

At this time, the organic film is generally deposited by a vapor deposition method, such a vapor deposition method is a bottom-up deposition method is mainly used to vaporize the vapor deposition of a solid or liquid source in the gas phase. For the same reason, the vapor deposition apparatus for forming an organic layer during the manufacturing process of the organic electroluminescent device deposits an organic layer by using a bottom-up deposition method, but the conventional vapor deposition apparatus connected with the vapor deposition apparatus is deposited by a top-down deposition method. By using, the process of inverting the substrate is necessary when transferring the substrate from the vapor deposition apparatus to the chemical vapor deposition apparatus or from the chemical vapor deposition apparatus to the vapor deposition apparatus, the present invention in place of the chemical vapor deposition apparatus In the case of using the vapor deposition apparatus, the inversion of the substrate is unnecessary.

In this case, the shower head 211 includes a cavity 212, a first gas injection hole 213, and a second gas injection hole 214, which are plasma generation regions. In addition, the first gas inlet 213 is positioned on one surface of the shower head 211, and the first nozzle 215 connected to the cavity 212 and the second gas inlet 214 are connected to the other surface. Two nozzles 216 are positioned. In this case, an electrode 218 connected to an external first power source 217 is positioned on one surface of the cavity 212. In addition, the cavity 212 is formed inside the shower head 211, so that the plasma generated inside the cavity 212 is isolated by the shower head 211, so that the plasma affects another area. It will not go crazy.

In addition, the heating element 221 is connected to an external second power source 222.

In addition, the chuck 231 may mount the substrate 232 on a surface thereof. In addition, a cooling line 233 is formed inside the chuck 231 to cool the substrate 232. The cooling line 233 maintains the temperature of the substrate 232 at 100 ° C. or lower. To make it possible.

In this case, the shower head 211 includes a first gas inlet 213 and a second gas inlet 214 for injecting gas from the outside, and the first gas inlet 213 is relatively necessary for decomposition. A gas inlet for injecting a high energy first gas and a second gas inlet 214 is a gas inlet for injecting a second gas having a relatively low energy required for decomposition.

In this case, the "energy required for decomposition" refers to the gas injected into the chemical vapor deposition apparatus is supplied in a molecular state combined with several atoms, the energy required to decompose or ionize such gas in the molecular state. For example, in the case of silane (SiH ₄ ) gas, one silicon atom and four hydrogen atoms are combined, and the energy for decomposing hydrogen in the silane gas may be referred to as 'energy required for decomposition'.

In this case, when the injected gases are ammonia (NH ₃ ) gas and silane gas, the first gas is ammonia gas because the energy required for decomposition is higher than that of the second gas, and the second gas is Since the energy required for decomposition is lower than that of the first gas, the silane gas is used. That is, the type of the first gas and the second gas is determined according to what kind of gas the first gas and the second gas are. The energy required for the decomposition is relatively compared with the first gas and the second gas. The high gas becomes the first gas, and the gas with relatively low energy required for decomposition becomes the second gas.

In this case, the first gas injected into the first gas injection hole 213 is injected into the cavity 212 which is a plasma generation region, and the cavity 212 has an electrode 218 mounted on the surface of the cavity inside Since the plasma is generated by the power supplied from the first power source 217, the injected first gas is partially decomposed by the plasma.

The first gas is injected into the chamber 201 through the plurality of first nozzles 215 provided on the surface of the shower head 211 corresponding to the chuck 231.

The first gas injected from the first nozzle 215 passes through the heating element 221 positioned between the shower head 211 and the chuck 231 and is not decomposed by the plasma. Decomposes almost completely by the heating element 221 to form a first radical. At this time, the heating body 221 is a filament made of tungsten, and generates heat of 1000 ° C. (preferably 1500 ° C.) or more by a power source applied from an external second power source 222, and the heat 1 gas is decomposed.

In addition, the second gas injected into the second gas inlet is not injected into the cavity 212, and the chamber is provided with the second nozzle 216 provided on the surface of the shower head 211 corresponding to the chuck 231. Directly injected into the 201, the injected second gas passes through the heating body 221 and is decomposed to become the second radical.

Therefore, the first gas injected into the first gas inlet 213 passes through the cavity 212, which is a plasma generating region, is decomposed, a predetermined amount is injected into the first nozzle, and is injected into the chamber 201, and then heated. Decomposed once more while passing through the sieve 221 to form a first radical, the second gas injected into the second gas inlet 214 is injected directly into the chamber 201 through the second nozzle 216 The injected second gas is decomposed by the heating element 221 to form a second radical, and the first radical and the second radical react to form a predetermined thin film on the substrate 232. In this case, the thin film may be formed of various materials, and the first gas and the second gas may be appropriately selected to form not only an insulating film but also a conductive film. Is ammonia gas and silane gas, respectively, may deposit a silicon nitride film on the substrate 232. have. At this time, when the first gas and the second gas are ammonia gas and silane gas, respectively, the ammonia gas and the silane contain hydrogen, so that it is difficult to completely decompose with a general chemical vapor deposition apparatus (in particular, energy required for decomposition High ammonia gas), and hydrogen is contained in the formed silicon nitride film. The silicon nitride film containing hydrogen must minimize the content of hydrogen in the silicon nitride film because the hydrogen combines with oxygen to generate water and adversely affect other devices to be protected by the silicon nitride film. At this time, in the present invention, by decomposing two times the high energy ammonia gas required for decomposition, nitrogen and hydrogen can be almost completely decomposed, thereby minimizing the hydrogen content in the silicon nitride film.

In this case, the first nozzle 215 may be disposed on the surface of the shower head 211 at a uniform interval, and if necessary, the first nozzle 215 for uniformity of the insulating film deposited on the substrate 232. You can adjust the interval. The second nozzle 216 may also be arranged uniformly as in the first nozzle 215, or may be non-uniformly formed as necessary. In this case, the first nozzle 215 and the second nozzle 216 are preferably arranged uniformly so that the first gas and the second gas are uniformly mixed.

Hereinafter, embodiments of a process of forming a deposit on a substrate using the plasma method and the heating method deposition method of the present invention.

<Example 1>

As described with reference to FIG. 2, the substrate 232 is loaded with the deposition surface facing downward on the chuck of the hybrid chemical vapor deposition apparatus of the present invention having a shower head and a heating body.

Subsequently, the gas inside the chamber 201 is evacuated using the vacuum pump 202 so that the vacuum degree is 5 × 10 ⁻⁶ torr or less. It is preferable to keep the temperature of the chamber wall at a temperature of 120 ° C. or higher, because when the temperature of the chamber is low, there are problems such as depositing on the chamber wall rather than depositing on the substrate.

Subsequently, after inert gas is injected into the first gas injection hole 213, power is applied to the electrode 218 to generate plasma in the cavity 212. At this time, the inert gas is a gas for generating a plasma, helium (He), neon (Ne) or argon (Ar) may be used. At this time, the flow rate of the inert gas is 1 to 1000sccm. In addition, the plasma is generated by the RF power of 100 to 3000W supplied from the first power source 211.

Subsequently, electric power is applied to the heating body 221 so that the heating body 221 is at a temperature of 1500 ° C or higher.

Subsequently, ammonia gas or / and nitrogen (N ₂ ) gas, which is a first gas having a relatively high energy required for decomposition, is injected through the first gas inlet 213. At this time, the flow rate of the ammonia gas is preferably 1 to 500sccm, the flow rate of nitrogen is preferably 1 to 1000sccm. At this time, the first gas injected into the first gas injection hole 213 is injected into the cavity 212 of the shower head 211 in which the plasma is formed and is primarily decomposed. The first gas decomposed by the plasma is injected into the chamber 201 through the first nozzle 215 to pass through the heating body 221, and the heating body 221 heated to 1500 ° C. or more. By secondary decomposition it forms a first radical.

Subsequently, silane gas, which is a second gas having a relatively low energy required for decomposition, is injected through the second gas injection hole 214. At this time, the flow rate of the silane gas is preferably 1 to 100 sccm. At this time, the first gas injected into the second gas inlet 214 is directly injected into the heating body 221 without passing through the cavity to be completely decomposed by the heated heating body 221 to thereby obtain the second radical. Form.

Subsequently, the first radical and the second radical react to form a deposit to deposit the deposit on the substrate 232 on the chuck 231 of the shower head 211 and the heating body 221. do.

When the deposition film is formed on the substrate by the method described in <Example 1>, as shown in FIG. 3A, the first deposition film 301 may be formed on the substrate 208.

Before or after the process of forming the first deposition film 301 on the substrate 232 by the above method, an organic film including an organic light emitting layer of the organic EL device may be formed on the substrate 232. Since the organic film is formed by the vapor deposition method, the organic film is formed by the bottom-up deposition method, and thus it is possible to load or unload the deposition apparatus of the present invention without inverting the substrate. If the deposition apparatus of the present invention is deposited by a top-down deposition method (i.e., when the substrate is mounted at the lower end of the chamber 201) like the conventional deposition apparatus, a process of inverting the substrate 232 is required. As a result, the substrate may be broken or the substrate may be damaged, which may cause a problem in yield. However, when the deposition film is formed using the deposition apparatus of the present invention, such a problem does not occur. In addition, since the substrate 232 does not need to be inverted, the substrate 232 can be transferred in-line to another device, and thus, the substrate 232 can be applied to an inline process.

<Example 2>

As described with reference to FIG. 2, the substrate 232 is loaded with the deposition surface facing downward on the chuck of the hybrid chemical vapor deposition apparatus of the present invention having a shower head and a heating body.

Subsequently, the gas inside the chamber 201 is evacuated using the vacuum pump 202 so that the vacuum degree is 5 × 10 ⁻⁶ torr or less. It is preferable to maintain the temperature of the chamber wall at a temperature of 120 ° C. or higher, because when the temperature of the chamber is low, there are problems such as depositing on the chamber wall rather than depositing on the substrate.

Subsequently, after inert gas is injected into the first gas injection hole 213, power is applied to the electrode 218 to generate plasma in the cavity 212. In this case, the inert gas is a gas for generating a plasma, helium, neon or argon may be used. At this time, the flow rate of the inert gas is 1 to 1000sccm.

Subsequently, the first gas and the second gas are simultaneously injected into the first gas inlet 213 to decompose the first gas and the second gas by using the plasma generated in the cavity, and then the first nozzle is removed. Through the injection into the chamber 201 to deposit a deposition film on the substrate. When the first gas and the second gas are decomposed using the plasma as described above, when the deposition film is formed on the substrate 208, as illustrated in FIG. 3B, the second insulating film 302a may be formed.

In this case, as another method of forming the second insulating layer 302a, electric power is applied to the heating element 213 so that the heating element 213 is at a temperature of 1500 ° C or higher. Subsequently, the first gas and the second gas are simultaneously injected into the second gas inlet 206 and injected into the chamber 201 through the second nozzle, so that the first gas and the second gas are heated by the heating element 213. A gas may be decomposed and reacted to deposit a deposition film on the substrate 208 to form a second insulating film 302a.

Subsequently, the first insulating film 301 is formed by the method described above in the first embodiment.

Subsequently, another second insulating film 302b is formed on the first insulating film 301 by using any of the methods of forming the second insulating film 302a. In this case, the first insulating layer 301 and the second insulating layers 302a and 302b may be deposited in various stacking orders as necessary. In other words, in the present invention, the second insulating film, the first insulating film, and the second insulating film are stacked, but the first insulating film and the second insulating film may be combined in any form.

At this time, the <Example 1> and <Example 2> is not only to form a deposition film having a good quality by forming a deposition film on the substrate by the bottom-up deposition method, but also an unloading process from the deposition apparatus of the present invention to another device However, there is an advantage in that it can be naturally transferred without loading the substrate in the deposition apparatus of the present invention in another apparatus without inverting. In addition, since the substrate 232 does not need to be inverted, the substrate 232 can be transferred in-line to another device, and thus, the substrate 232 can be applied to an inline process.

At this time, the difference between <Example 1> and <Example 2> is that in <Example 1>, the decomposition of the first gas that requires relatively high energy for decomposition is completely performed in two ways: plasma decomposition and pyrolysis. Decomposition of the second gas, which requires decomposition and relatively low energy for decomposition, is performed only by pyrolysis to form only the first insulating film 301 containing little hydrogen, whereas in the case of <Example 2> Injecting both the first gas and the second gas into the first gas inlet or the second gas inlet at the same time to the first insulating film 301 formed by the first embodiment, and then decomposes by plasma or heating The difference is that the two insulating films 302a and 302b are further deposited.

The present invention has been shown and described with reference to the preferred embodiments as described above, but is not limited to the above embodiments and those skilled in the art without departing from the spirit of the present invention. Various changes and modifications will be possible.

Therefore, the deposition apparatus of the present invention and the deposition method using the same can prevent particles from flowing onto the substrate by using a bottom-up deposition method, and can be applied to an inline type that does not require an inversion process during substrate transfer, thereby shortening the process time. In addition, damage to the substrate can be prevented, and a high quality deposition film can be formed by using a deposition apparatus capable of simultaneously heating and plasma methods.

Claims (13)

chamber; A plasma generating region and a heating body located at a lower end of the chamber; And A chuck corresponding to the plasma generating region and the heating body and positioned at an upper end of the chamber and having a substrate mounted on a surface thereof; The plasma generation region, A first gas inlet and a second gas inlet; A cavity inside the shower head connected to the first gas inlet; A plurality of first nozzles connected to the cavity and positioned on a surface of the shower head corresponding to the chuck; And And a cavity of the shower head connected to the second gas inlet and including a plurality of second nozzles positioned on a surface of the shower head corresponding to the chuck. delete The method of claim 1, And the first gas inlet is a gas inlet for injecting a first gas having a higher energy required for decomposition than the second gas. The method of claim 1, And the second gas inlet is a gas inlet for injecting a second gas having a lower energy required for decomposition than the first gas. The method according to claim 3 or 4, Wherein the first gas is ammonia gas and the second gas is silane gas. The method of claim 1, Deposition apparatus, characterized in that the heating body is made of tungsten. The method of claim 1, Deposition apparatus, characterized in that the heating element is a filament. The method of claim 1, The deposition apparatus is a deposition apparatus characterized in that the deposition apparatus for forming a protective film of the organic EL device. The method of claim 8, And the protective film is a silicon nitride film. Loading a substrate in a chamber having a plasma generating region and a heating body such that a deposition surface faces downward; Supplying a first gas and a second gas to the chamber; The first gas passing through the plasma generating region and the heating body to form a first radical, and the second gas passing through the heating body to form a second radical; And Reacting the first radical and the second radical to form a deposition film on the substrate Deposition method comprising a. The method of claim 10, Before the substrate is loaded into the chamber and the first gas and the second gas respectively form a first radical and a second radical, And passing the first gas and the second gas through the plasma generation region or the heating region to form another deposition film on the substrate. The method of claim 10, After the first radical and the second radical react to form a deposition film on the substrate, And passing the first gas and the second gas through the plasma generation region or the heating region to form another deposition film on the substrate. The method according to claim 11 or 12, And the another deposition film is a deposition film containing hydrogen.

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