KR100685295B1 - Method for repairing signal transmission line for liquid crystal display device - Google Patents

Abstract

The present invention relates to a liquid crystal display device, which forms a terminal wiring for transmitting a gate signal to a gate PCB through a source PCB on a lower substrate, and is formed at an outer portion of the terminal wiring without belonging to a bonding region with an upper substrate. By forming repair pads on both sides of the terminal wiring having a high possibility of disconnection, the terminal wiring can be repaired by separately connecting the repair wiring to the repair pad even if the terminal wiring is disconnected, thereby manufacturing a liquid crystal display device. In doing so, it is possible to obtain a high production yield with a huge material cost reduction effect.

Description

Repairing signal transmission line for liquid crystal display device             

1 is a plan view of a general liquid crystal display device;

2 is a partial cross-sectional view of a liquid crystal display showing an example of a method of mounting a driving circuit;

3 is a schematic plan view of a liquid crystal display device;

4 is a schematic plan view of a conventional liquid crystal display device;

FIG. 5 is a partial plan view according to the related art in which A of FIG. 4 is enlarged.

6 is a partial plan view according to the present invention showing an enlarged view of FIG.

FIG. 7 is a cross-sectional view taken along the line II-II of FIG. 6.

<Brief description of the main parts of the drawing>

173: lower substrate 175: upper substrate

185: Terminal Wiring 187: Repair Pad

189 contact hole 191 repair wiring

The present invention relates to a liquid crystal display (LCD), and in particular, a gate printed circuit board (Gate printed) from a source printed circuit board (hereinafter referred to as a "source PCB") connected to the liquid crystal panel of the liquid crystal display device. circuit board (hereinafter referred to as a "gate PCB") relates to a repair method of a terminal wiring, which is a signal transmission wiring for transmitting a gate signal.

1 is a view schematically showing a general color liquid crystal display device.

As shown in the drawing, a general liquid crystal display 11 includes a color filter 7 including a black matrix 6, an upper substrate 5 on which a transparent common electrode 18 is formed, and a pixel region P. ) And a pixel electrode 17 formed on the pixel region, and a lower substrate 22 having a switching element T and array wiring formed therebetween, and the liquid crystal 14 between the upper substrate 5 and the lower substrate 22. Is filled.

The lower substrate 22 is also referred to as an array substrate, and the thin film transistor T, which is a switching element, is positioned in a matrix type, and the gate wiring 13 and the data wiring 15 passing through the plurality of thin film transistors cross each other. Is formed.

In this case, the pixel P area is an area defined by the gate line 13 and the data line 15 crossing each other, and a transparent pixel electrode 17 is formed on the pixel area.

The pixel electrode 17 uses a transparent conductive metal having a relatively high light transmittance, such as indium-tin-oxide (ITO).

In the above-described configuration, the thin film transistor includes a gate electrode to which a scan signal is input, a source electrode to which an image signal is input, and a drain electrode spaced apart from the predetermined distance and connected to the pixel electrode.

The semiconductor device may further include a semiconductor layer positioned between the source electrode and the drain electrode and serving as a channel through which charge flows.

In general, the semiconductor layer may be formed by depositing amorphous silicon, or may be formed of polysilicon by heat treatment or laser treatment of the deposited amorphous silicon.

In general, among the two cases, liquid crystal displays that are mass-produced form a thin film transistor using the amorphous silicon as a semiconductor layer.

A method of mounting a module of a liquid crystal display device is closely related to the material of the semiconductor layer. When a thin film transistor is formed using the amorphous silicon, a method of separately mounting a driving IC for driving the gate wiring and the data wiring is performed. Use

This is because the amorphous silicon is slower in operation speed than polysilicon, and thus is not suitable for driving devices requiring fast operation characteristics.

The driving device may be mounted on the liquid crystal panel in various ways, and examples thereof include a chip on board (COB), a chip on class (COG), and a tape carrier package (TCP).

Among the three cases, a tape carrier package (TCP) is widely used in an active element type liquid crystal display panel, and this is a package for mounting a driving IC chip on a polymer film.

The TCP is attached to the liquid crystal panel and the PCB using a tape automatic bonding (TAB) method.

This technology is widely used in products that require light and small package, such as LCD and portable phones.

2 is a cross-sectional view showing a general tapered carrier package structure.

As shown in the drawing, the tapered carrier package structure mounts the driving IC 37 on the polymer film 39, and the upper substrate 33 and the lower substrate 31 are bonded to the polymer film on which the driving IC chip is mounted. It is produced by attaching an anisotropic conductive film (ACF) 38 across the lower substrate and the PCB of the liquid crystal panel.

A tape carrier package having such a configuration drives a panel by applying signals from one side or both sides of a source wiring (not shown) of the array substrate and one side or both sides of a gate wiring (not shown).

3 is a schematic plan view of a liquid crystal display device in which a driving IC is mounted using a general TCP method.

The liquid crystal display device includes a lower substrate 53 including a data wiring (not shown) formed in a vertical direction and a gate wiring (not shown) formed in a horizontal direction, a liquid crystal panel 54 having an upper substrate 55 attached thereto, A source TCP 57 mounted on one side of a data line and mounted with a source driver IC chip connected to the data line to apply a signal to the data line; and located on one side of the gate line and connected to the gate line. And a gate TCP 59 mounted with a gate driving IC chip for transmitting a scan signal to the wiring.

In addition, it includes a source PCB (61) which is connected to the source TCP (57), a medium means for transmitting an external control signal, and a gate PCB (63) connected to the gate TCP (59).

At this time, the external circuit for controlling the gate driving IC flows to the gate PCB 63 through the source PCB 61, at this time, by using a flexible printed circuit (hereinafter referred to as "FPC") The gate driving signal flowing through the source PCB is transferred to the gate PCB.

That is, through the FPC 65, signals such as V _com , V _gh , V _gl , V _cc , G _sp , G _sc , _{Co e} , Gnd, etc., flow from the source PCB through the gate PCB.

In this case, as described above, the gate control signal is transmitted by using a separate component called the FPC 65, thereby increasing the material cost in manufacturing the liquid crystal display, and the FPC 65 is connected to the gate PCB and the source. In the process of connecting to the PCB, a defect in the liquid crystal module occurs due to a poor soldering, and there is a problem in signal flow.

Therefore, in order to solve such a problem, a method of directly manufacturing a terminal wiring for a signal transmission on a substrate was used.

4 is a plan view illustrating a liquid crystal display device.

As shown, a terminal wiring 85 is formed on the lower substrate 73 to transmit signals from the source PCB 81 side to the gate PCB 83 side.                         

At this time, the conductive metal for forming the terminal wiring 85 may be any conductive metal having a resistance of 10 µm / cm or less.

FIG. 5 is an enlarged view illustrating A of FIG. 4.

As shown, the terminal wiring 85 is formed at any one corner of the lower substrate 73, and can be formed simultaneously with the process of forming the gate pad B and the data pad C when fabricating the array substrate. have.

That is, the first to eighth dummy data pads and the first to eighth dummy gate pads are connected to the terminal wiring 85 to transmit a gate signal through the terminal wiring.

After the formation of the lower substrate 73 including the terminal wiring 85, the bonding with the upper substrate 75 using the adhesive is made.

Since the lower substrate 73 is manufactured to a size capable of making a plurality of liquid crystal panels having an arbitrary size, after the bonding with the upper substrate 75 is finished, the lower substrate 73 is separated into a plurality of liquid crystal panels by a predetermined means. Then, the process of cutting the upper substrate of the separated liquid crystal panel.

In this case, when the region of the lower substrate 73 that is bonded to the upper substrate 75 is called a first region, and the region that is not bonded to the upper substrate is called a second region, the upper substrate is connected to the first region. The boundary of the second area is cut off.

In this case, the first terminal wiring 85a configured at the outermost side of the upper substrate among the terminal wirings may be affected by the physical impact of the cutting means by the step of the terminal wiring 85a in the above-described cutting process of the upper substrate. do.

This shock causes a problem that the first terminal wiring 85a is frequently disconnected.

Since such disconnection defects cannot be repaired, it is necessary to dispose of the liquid crystal panel after all processes are completed.

Therefore, there is a problem of reducing the production yield of the product with the waste of material costs.

In order to solve the problems as described above, an object of the present invention is to provide a method for repairing the disconnected terminal wiring by further forming a predetermined means.

According to an aspect of the present invention, there is provided an LCD device including: an upper substrate; A plurality of gate wirings, a plurality of data wirings intersecting the plurality of gate wirings, a first region bonded to each other with the upper substrate and the liquid crystal layer interposed therebetween, and a second region positioned outside the first region. A lower substrate; A plurality of data pads positioned on one side of the second region of the lower substrate and connected to the plurality of data wires; A plurality of gate pads positioned on the other side of the second region adjacent to the one side of the lower substrate and connected to the plurality of gate lines; A plurality of terminal wirings connecting the plurality of data pads to the plurality of gate pads and passing through the first region and the second region of the lower substrate; When repair is formed in the second region extending from the data pad and the gate pad respectively connected by the outermost terminal wirings and disconnection is found in the outermost terminal wirings, the repair wirings are connected and repaired, respectively. A first repair pad and a second repair pad for; A gate PCB transferring signals to the plurality of gate pads, respectively; And a data PCB for transmitting signals to the plurality of data pads, respectively.

The plurality of terminal wirings may be at least eight.

The resistance of the plurality of terminal wirings is characterized in that less than 10㎛ / ㎝.

The first repair pad and the second repair pad may extend from the outermost terminal wiring to the outer side of the lower substrate, respectively.

The first repair pad and the second repair pad may be exposed.

The first repair pad and the second repair pad may be exposed by a protective layer formed on the first repair pad and the second repair pad, respectively, having a first contact hole and a second contact hole. .

A method of manufacturing an array substrate for a liquid crystal display device according to the present invention includes the steps of preparing a lower substrate; Forming a plurality of gate wirings on the lower substrate and a plurality of gate pads connected to the plurality of gate wirings on one surface of the lower substrate; Forming a plurality of data pads intersecting the plurality of gate lines and a plurality of data pads connected to the plurality of data lines on the other side adjacent to one side of the lower substrate; Forming a plurality of terminal wirings connecting the plurality of gate pads and the plurality of data pads; When the wires are formed on the lower substrate by extending from the data pads and the gate pads respectively connected by the outermost terminal wirings, and disconnection is found in the outermost terminal wirings, the repair wirings are connected and repaired, respectively. Forming a first repair pad and a second repair pad for use; And forming a passivation layer having a first contact hole and a second contact hole on the first repair pad and the second repair pad, respectively.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

6 is a plan view showing a part of an array substrate for a liquid crystal display device according to the present invention.

As shown, the lower substrate 173 is composed of a first region which is bonded to the upper substrate and a second region which is not bonded to the upper substrate and is positioned outside the first region, and formed on the lower substrate 173. A repair pad 187 is connected to a first terminal wiring 185a configured at the outermost side of the upper substrate of the terminal wiring 185 and passes through a second area that is not bonded to the upper substrate. To form.

That is, a repair pad 187 having a predetermined area connected to each side of the lower substrate 173 that is bent at right angles in parallel to the corner portion of the lower substrate 173 is formed, and a contact hole 189 is formed on the repair pad 187. When the terminal wiring 185a is disconnected, a repair wiring 191 is connected through a contact hole 189 formed at an upper portion of each repair pad 187.

The repair pad 187 and the contact hole 189 may be formed in various ways, which will be briefly described below.

As described above, the gate wiring (not shown), the gate electrode (not shown), and the gate pad 201 are first formed on the lower substrate.

The data pad C is formed on the other side not parallel to one side of the substrate 173 on which the gate pad B is formed.

In this case, in addition to the gate wirings connected to the respective gate pads B, terminal wirings 185 connected to the data pads and the gate pads are formed.

Unlike the gate wiring formed in one direction in a left / right direction of the lower substrate 173, the terminal wiring 185 is configured to be close to a corner portion of the lower substrate 173, and the terminal wiring 185a is formed. The first and second repair pads 187 having predetermined areas are formed to extend in a position close to the gate pad and the data pad, respectively.                     

Next, an insulating layer is formed on the entire surface of the lower substrate 173 on which the gate wiring including the terminal wiring 185 is formed, and then a semiconductor layer (not shown) is formed on the gate electrode.

A data line (not shown) connected to the data pad C on the substrate on which the semiconductor layer is formed, and a source electrode protruding from the data line (not shown) to the upper portion of the semiconductor layer (not shown). ) And a drain electrode (not shown) spaced apart from each other by a predetermined interval.

Next, a protective layer is formed by depositing an insulating material on the entire surface of the substrate on which the source and drain electrodes are formed.

Next, the protective layer is patterned to form a contact hole on the gate pad, and at the same time, the contact hole 189 may be formed on the first and second repair pad 187.

In this manner, the terminal wiring 185 including the repair pad 187 may be formed.

If, after completion of the liquid crystal panel, a disconnection defect of the terminal wiring 185a is found during the inspection process, the repair wiring (through the contact holes 189 formed on the repair pad 187 as shown in the drawing) 191).

The repair wiring 191 may be connected by welding using lead or by using an adhesive means such as an anisotropic conductive film (ACF).

FIG. 7 is a cross-sectional view taken along the line II-II of FIG. 6.

As illustrated, the insulating layer (the structure in which the gate insulating layer and the protective layer are stacked) 205 stacked on the repair pad 187 is partially etched to form a contact hole 189, and the contact hole ( When wire bonding the repair wiring to the upper part of the repair pad 187 through a predetermined means through 189, a signal flowing through the disconnected terminal wiring flows through the repair wiring 191, thereby providing a perfect repair. It is possible.

Therefore, since the disconnection defect of the terminal wiring can be easily repaired, there is no need to discard the liquid crystal panel, thereby reducing enormous material costs, and also improving the production yield of the product.

Claims (6)

An upper substrate; A plurality of gate wirings, a plurality of data wirings intersecting the plurality of gate wirings, a first region bonded to each other with the upper substrate and the liquid crystal layer interposed therebetween, and a second region positioned outside the first region. A lower substrate; A plurality of data pads positioned on one side of the second region of the lower substrate and connected to the plurality of data wires; A plurality of gate pads positioned on the other side of the second region adjacent to the one side of the lower substrate and connected to the plurality of gate lines; A plurality of terminal wirings connecting the plurality of data pads to the plurality of gate pads and passing through the first region and the second region of the lower substrate; When repair is formed in the second region extending from the data pad and the gate pad respectively connected by the outermost terminal wirings and disconnection is found in the outermost terminal wirings, the repair wirings are connected and repaired, respectively. A first repair pad and a second repair pad for; A gate PCB transferring signals to the plurality of gate pads, respectively; A data PCB transferring signals to the plurality of data pads, respectively; Liquid crystal display comprising a. The method of claim 1, And at least eight terminal wires. The method of claim 1, And the first repair pad and the second repair pad extend from the outermost terminal wiring to the outside of the lower substrate, respectively. The method of claim 1, The liquid crystal display device wherein the first repair pad and the second repair pad are exposed. The method of claim 4, wherein And the first repair pad and the second repair pad are exposed by a protective layer formed on the first repair pad and the second repair pad, respectively, having a first contact hole and a second contact hole. Preparing a lower substrate; Forming a plurality of gate wirings on the lower substrate and a plurality of gate pads connected to the plurality of gate wirings on one surface of the lower substrate; Forming a plurality of data pads intersecting the plurality of gate lines and a plurality of data pads connected to the plurality of data lines on the other side adjacent to one side of the lower substrate; Forming a plurality of terminal wirings connecting the plurality of gate pads and the plurality of data pads; When the wires are formed on the lower substrate by extending from the data pads and the gate pads respectively connected by the outermost terminal wirings, and disconnection is found in the outermost terminal wirings, the repair wirings are connected and repaired, respectively. Forming a first repair pad and a second repair pad for use; Forming a passivation layer having a first contact hole and a second contact hole on the first repair pad and the second repair pad, respectively; Array substrate manufacturing method for a liquid crystal display device comprising a.

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